JP2006273335A - Component supplying tray - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component supplying tray for supplying electronic components to a device on which the components are mounted, wherein the component supplying tray has a simple, inexpensive structure, keeps the components firmly fixed on the tray until just before the use of the tray for component supply, and allows the components to be removed from the tary easily and smoothly in use of the components. <P>SOLUTION: Component partition panels 9 are attached on the upper face of a component supplying plate 8, which is a tray body, and the electronic components 7 are stored in spaces partitioned by the partition panels 9. A thermally peeling sheet 10, which has variable adhesion for fixing the electronic components 7, is pasted on the bottom face of the tray 6, which is the upper face of the plate 8. The sheet 10 exerts less adhesion when heated. The sheet 10 is not heated to keep its pressure-senstive adhesion high until just before using the tray 6 for supplying the components 7 to the device on which the components 7 are mounted. When the tray 6 is used for component supply, the sheet 10 is heated to weaken its adhesion. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a component supply tray used for supplying electronic components to a component mounting apparatus for mounting electronic components on a circuit board.

  In the above-described component supply tray (hereinafter also simply referred to as a tray), electronic components are stored in a component storage space partitioned by a component divider, and when the components are supplied to the component mounting apparatus, the tray is transported to the component mounting apparatus. The component is sucked from the suction nozzle of the component mounting apparatus and taken out from the tray. While transporting the tray to the component mounting apparatus, it is necessary to position and fix each component so that the component does not move in each component storage space on the tray. Otherwise, particularly in an electronic component having a lead that is weak against external force, there arises a problem that the lead is deformed by the external force.

For this reason, for example, positioning is performed only at the corners of the parts (such as the corners of the four corners), and the other parts of the parts are all floating in the air. When the trays are stacked, Patent Document 1 below proposes a structure in which the bottom surface of the tray presses at least a part of the top surface of the component on the lower tray to fix the component.
Japanese Patent Application Laid-Open No. 11-333079

  In the tray structure of Patent Document 1, in order to facilitate positioning when components are set on the tray, and to ensure ease of removal when components mounted on a circuit board are removed from the tray by a component mounting apparatus. The size of the receiving part of each part of the tray needs to be larger than the external dimension of the part so as to have a backlash. In addition, when the trays are stacked, the bottom surface of the upper tray presses at least a part of the top surface of the component on the lower tray to fix the component, so that the component cannot be fixed unless the tray is stacked.

  In such a structure, especially when the trays are transported without being stacked, the components move within the range of the backlash within the tray, and impacts are applied to the components during transportation, and fine wiring is formed inside. In some cases, it may cause failure such as disconnection of wiring. Also, parts may fall from the tray and be damaged by slight vibration during transportation.

  Furthermore, in the component mounting device, when the components on the tray are attracted by the suction nozzle of the mounting head, each component has moved in the tray, and the position shifts from a predetermined component position. There is. For this reason, the center of the component cannot be accurately picked up, and the picking may be missed. In addition, there is a problem that the recognition accuracy of the posture of the sucked part is deteriorated.

  The object of the present invention is to solve such a problem, and in a component supply tray, from the mounting of electronic components to the tray by the simple and inexpensive structure until just before using the tray for supplying electronic components to the component mounting apparatus. The electronic component on the tray can be securely fixed, and the electronic component on the tray can be easily taken out without any trouble when used for supply.

The present invention for solving the above problems is as follows.
A component supply tray for supplying electronic components to a component mounting apparatus,
In order to fix the electronic component, an adhesive sheet having a variable adhesive strength is attached to the bottom of the tray, and when the electronic component is taken out from the tray, the adhesive strength of the adhesive sheet is reduced.

The present invention also provides:
A component supply tray for supplying electronic components to a component mounting apparatus,
In order to fix the electronic component, an adhesive having a variable adhesive strength is applied to the bottom of the tray, and when the electronic component is taken out from the tray, the adhesive strength of the adhesive is reduced.

  According to the structure of the tray of the present invention, from the time when the electronic component is mounted on the tray to the time when the tray is used for supplying the electronic component to the component mounting apparatus, the electronic material is placed on the tray due to the high adhesive force of the adhesive sheet or adhesive. Parts can be securely fixed. Further, when the tray is used for supplying electronic components, the electronic components on the tray can be easily taken out without any trouble by reducing the adhesive force. And the structure of the tray of this invention has the outstanding effect that it is simple and can be implemented cheaply.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 shows a configuration of a main part of a component mounting apparatus (chip mounter) using a component supply tray according to a first embodiment of the present invention.

  In FIG. 1, reference numeral 1 denotes a mounting head, which includes a plurality of suction nozzles 1 a that suck and hold electronic components (not shown) mounted on the circuit board 16, and further, although not shown in detail, the suction nozzle 1 a A mechanism for moving in the Z-axis direction (vertical direction) and a mechanism for rotating around the θ-axis (nozzle axis) are provided. The mounting head 1 is attached to the X-axis gantry 2 so that it can move in the X-axis direction. The X-axis gantry 2 is attached to the Y-axis gantry 3 so that it can move in the Y-axis direction. A recognition device 4 using a two-dimensional camera for recognizing the posture of the electronic component sucked by the suction nozzle 1a is fixed to the component mounting device. Although not shown in detail, an electronic component supply device 5 for supplying small electronic components held on a tape is provided on the front side of the component mounting device.

  Large electronic components such as LSIs are supplied from a component supply tray (hereinafter abbreviated as a tray) 6 that accommodates them. As shown in FIG. 7, a plurality of trays 6 each containing electronic components are accommodated in a component supply rack 14 that is separate from the component mounting device 17, and is transported to the component mounting device 17 by the movement of the rack 14. . Then, the tray 6 in the rack 14 is automatically or manually moved as indicated by an arrow, sequentially taken out from the rack 14, and set at a predetermined set position on the back side of the component mounting apparatus shown in FIG. A heater 11 for heating the set tray 6 is provided in the vicinity below the set position of the tray 6.

  In the above configuration, the mounting head 1 moves in the X-axis direction along the X-axis gantry 2 and moves in the Y-axis direction together with the X-axis gantry 2 by driving an X-axis motor and a Y-axis motor (not shown). Further, by driving a Z-axis motor and a θ-axis motor (not shown), each suction nozzle 1a of the mounting head 1 moves up and down and rotates around the nozzle axis.

  At the time of mounting electronic components, first, the mounting head 1 is moved onto the component supply position of the electronic component supply device 5 or onto the tray 6, and then each suction nozzle 1 a is lowered to electronic components on the supply device 5 or on the tray 6. Adsorbs and rises. Then, the mounting head 1 is moved so that each nozzle 1a moves onto the recognition device 4, and the posture of the electronic component sucked by each nozzle 1a is recognized. Thereafter, the mounting head 1 is moved so that each nozzle 1a moves on the circuit board 16 to a position where a component adsorbed by each nozzle 1a is mounted, and each nozzle 1a descends so that an electronic component is transferred to the circuit board 16. By releasing the suction at the contact position, the electronic component is mounted at the mounting position. By repeating such operations, various electronic components are sequentially mounted on the circuit board 16. When the electronic components on the tray 6 are exhausted as a result of this operation, the tray 6 is removed from the set position, and then the next single tray 6 full of electronic components is taken out from the rack 14 and is stored in the component mounting apparatus. The tray set position is used to supply parts.

  2 and 3 show the structure of the tray 6. The tray 6 has a structure in which a grid-like component partition plate 9 is attached to the upper surface of the component supply plate 8 to which the heat release sheet 10 is attached, and electronic components are stored in a space partitioned by the partition plate.

  The component supply plate 8 is a tray body on which the electronic component 7 is placed on the upper surface, and the upper surface of the component supply plate 8 is the bottom surface of the tray 6 in a state where the component partition plate 9 is attached to the tray 6.

  The component divider 9 separates the accommodation spaces of the plurality of electronic components 7 accommodated on the tray 6, is separate from the component supply plate 8, and has a heat release sheet 10 on the upper surface of the plate 8. Fixed.

  The heat-peeling sheet 10 is a pressure-sensitive adhesive sheet whose both surfaces are adhesive, and the adhesive strength of both surfaces is reduced by applying heat (infrared rays). That is, the adhesive force changes from a high state to a low state by heating. Note that once the adhesive strength is reduced by one heating, the adhesive strength cannot be recovered. Although not shown in detail, the heat-release sheet 10 is formed by forming layers of heat-release adhesive on both surfaces of a sheet substrate made of polyester resin and the like, and is attached to the upper surface of the component supply plate 8. . In a single state before being attached to the component supply plate 8, protective separator films are attached to the respective surfaces of the heat-peeling adhesive layers on both sides, and are peeled off and attached to the plate 8. Attached. The heat-peeling adhesive of the heat-peeling sheet 10 has almost no adhesive strength at a temperature of about 90 ° C., for example. If the temperature is about 90 ° C., the influence on the electronic component 7 on the tray 6 has no problem. As such a heat release sheet 10, for example, Riva Alpha (trade name) manufactured by Nitto Denko Corporation can be used.

  After such a heat release sheet 10 is attached to the upper surface of the component supply plate 8, the component partition plate 9 is attached and fixed to the heat release adhesive layer on the upper surface of the heat release sheet 10 to constitute the tray 6. . The component partition plate 9 is separated from the component supply plate 8 which is a tray body in order to facilitate the work of attaching the heat release sheet 10 to the component supply plate 8. The supply plate 8 is detachably attached.

  After the heat-peeling sheet 10 is first attached to the component supply plate 8 and before the tray 6 on which the electronic component 7 is mounted is set at the tray setting position of the component mounting apparatus and used for supplying the electronic component, the tray 6 The heat release sheet 10 is not heated, and its adhesive strength is maintained high. That is, the mounting of the electronic component 7 on the tray 6 and the transportation of the tray 6 on which the electronic component 7 is mounted to the component mounting apparatus are performed in a state where the adhesive strength of the heat release sheet 10 is high.

  When the electronic component 7 is mounted on the tray 6, each component 7 is positioned at a predetermined position in each component storage space partitioned by the component partition plate 9 on the tray 6, and then the heat release sheet 10 on the bottom surface of the tray 6. The lower surface of the body of the component 7 is affixed to the heat release sheet 10 and fixed. As described with reference to FIG. 7, the tray 6 on which the components 7 are mounted in this way is stored in the component supply rack 14, and the rack 14 is moved and transported to the component mounting apparatus 17.

  Thereafter, as described above, the trays 6 are sequentially taken out from the rack 14 one by one, set in the tray setting position shown in FIG. 1 in the component mounting apparatus 17, and used for component supply. Here, a mechanical or optical switch (not shown) is turned on according to the set of the tray 6 to turn on the heater 11, and the heater 11 is heated for a predetermined time, that is, the tray 6 is heated. Heating of the thermal release sheet 10 is started. The set temperature of heating is, for example, 95 ° C., which is slightly higher than the heat release temperature at which the adhesive strength of the heat release sheet 10 is reduced, and this set temperature is maintained for a predetermined time, for example, 5 minutes. By this heating, the heat release sheet 10 of the tray 6 is changed from the state of high adhesive strength shown in the enlarged sectional view of FIG. 4 to the state where the adhesive strength indicated by reference numeral 10 'in FIG. After this state, the electronic component mounting operation on the circuit board 16 of FIG. 1 is performed as described above. In the mounting operation, as shown in the enlarged view of FIG. 6, the electronic component 7 on the heat release sheet 10 ′ of the tray 6 is picked up and taken out by the suction nozzle 1a, but the heat release sheet 10 ′ has almost no adhesive force. Therefore, it can be easily taken out without hindrance.

  According to the present embodiment as described above, the electronic component 7 on the tray 6 is mounted on the tray 6 until just before the tray 6 is set in the component mounting apparatus and used for component supply. It is securely fixed with a high adhesive strength of 10. Therefore, there is no movement of electronic components on the tray due to vibration during transportation to the component mounting device of the tray. The occurrence of problems such as dropping is eliminated. In addition, since the tray can be transported while the parts are fixed on the tray, handling related to transport of the tray becomes easy. Further, the position of the component on the tray does not change until the component on the tray is sucked by the suction nozzle by the component mounting apparatus after the component is positioned and mounted on the tray. Therefore, the center of the component can be accurately picked up at the time of picking up the component, suction mistakes are reduced, the component recognition accuracy is improved, and the mounting accuracy of the component on the board is also improved. Moreover, the tray structure of this embodiment is simple and can be implemented at low cost.

  In this embodiment, the heat release sheet 10 of the tray 6 is heated by the heater 11 at the tray set position in the component mounting apparatus. However, the heater 11 is provided in the component supply rack 14 and one tray 6 is attached to the rack. The tray 6 may be heated in the rack 14 before being taken out from 14 and set in the component mounting apparatus 17. Further, although the heat release sheet 10 of the tray 6 is heated from below by the heater 11, it may be heated by infrared irradiation from above.

  Moreover, although the heat peeling adhesive layer was formed in both surfaces, the heat peeling adhesive layer was formed in the upper surface of the side which fixes the electronic component 7, and it affixed on the components supply plate 8 Ordinary pressure-sensitive adhesive, that is, a pressure-sensitive adhesive layer whose adhesive strength does not decrease by heating, may be formed on the lower surface. However, considering that the tray 6 is reused, it is advantageous that the heat-peeling adhesive layer is formed on both sides because it does not take time to peel off the heat-peelable sheet 10 from the tray 6 after use.

  FIGS. 8 to 10 illustrate the structure of the tray 13 according to the second embodiment, in which only one component storage space is shown among the plurality of component storage spaces partitioned by the component partition plate 9 in the tray 13. is there. The component partition plate 9 may be detachably attached to the main body separately from the main body, that is, the bottom portion of the tray 13, or may be provided integrally with the tray main body.

  The tray 13 is configured to receive a QFP (quad flat package) 12 having leads 12a projecting from side surfaces of four sides as electronic components. For this reason, a flat convex portion 13a having the same shape and dimensions as the body of the QFP 12 (may be slightly smaller) is formed at the bottom of each component storage space of the tray 13, and the periphery thereof is a concave portion 13b. ing. The thermal peeling sheet 10 is affixed on the whole upper surface of the convex part 13a. The QFP 12 is fixed in the component accommodating space as shown in FIGS. 8 and 10 by attaching the lower surface of the body to the heat-peeling sheet 10 with the position of the body aligned with the convex portion 13a. At this time, as shown in FIG. 10, the lead 12 a of the QFP 12 floats on the concave portion 13 b of the tray 13 and does not come into contact with the tray 13.

  Such a tray 13 is used in exactly the same manner as the tray 6 of the first embodiment, and is heated when it is set at the tray setting position in the component mounting apparatus. As shown in FIG. Is in a state where there is almost no adhesive force, and the QFP 12 can be easily taken out by the suction nozzle without any trouble.

  According to the tray 13 of the present embodiment as described above, the same effect as that of the tray 6 of the first embodiment can be obtained. Further, when the QFP 12 is mounted and fixed on the tray 13, the lead 12a can be fixed without contacting the tray 13, so that no external force is applied to the lead 12a, and there is a problem such as deformation of the lead 12a due to the external force. Can be prevented.

  FIG. 11 shows the tray 6 of the third embodiment. The tray 6 includes a component supply plate 8 and a component partition plate 9 which are common to the tray 6 of the first embodiment. In this embodiment, the component partition plate 9 is detachably attached to the component supply plate 8. Further, a thermal peeling adhesive 18 is applied to each bottom surface (upper surface of the component supply plate 8) of the component accommodation space partitioned by the component partition plate 9 of the tray 6. The heat release adhesive 18 is the same as that applied to both sides of the sheet substrate of the heat release sheet 10 used in Example 1, and is applied to each component storage space partitioned by a partition plate using the dispenser 15. Is done.

  In FIG. 11, an electronic component (not shown) is mounted in each component storage space of the tray 6, and the lower surface of the body of the electronic component is attached to the thermal peeling adhesive 18 to fix the electronic component. The tray 6 of the present embodiment is also used in the same manner as the tray 6 of the first embodiment. When the tray 6 is set at the tray setting position in the component mounting apparatus, the tray 6 is heated so that there is almost no adhesive force of the thermal peeling adhesive 18. The electronic component can be easily taken out by the suction nozzle without any trouble. The effect similar to that of the tray 6 of the first embodiment can be obtained by the tray 6 of the present embodiment.

  In addition, in the tray 13 of Example 2, instead of sticking the heat release sheet 10 to each upper surface of the convex portion 13a, a heat release adhesive may be applied as in this example.

  In the trays of Examples 1 and 2, instead of the heat release sheet 10, an ultraviolet release sheet that is an adhesive sheet whose adhesive strength is reduced by irradiating ultraviolet rays may be used. In this case, when the tray on which the component is mounted is set in the component mounting apparatus, the ultraviolet ray is irradiated to reduce the adhesive strength of the ultraviolet release sheet. As the ultraviolet release sheet, for example, UV tape (trade name) manufactured by Furukawa Electric Co., Ltd., Adwill (trade name) D series UV curable dicing tape manufactured by Lintec Corporation can be used. These ultraviolet release sheets are obtained by applying an ultraviolet release adhesive that reduces the adhesive strength when irradiated with ultraviolet rays to the surface of a sheet base material.

  The tray 6 of Example 3 may have a structure in which an ultraviolet peeling adhesive is applied instead of the thermal peeling adhesive 14. Further, in the trays of Examples 1 to 3, it is also conceivable to use a tray that can change (reduce) the adhesive force by means other than heating and ultraviolet irradiation instead of the heat release sheet or the heat release adhesive. .

  Of course, the types of electronic components housed in the component supply tray according to the present invention are not limited to the QFP of the second embodiment, but include SOP (small outline package) and SOJ (small outline j-leaded package). Other lead components may be used, and ball components having ball-shaped terminals such as a BGA (ball grid array) and a CSP (chip size package) may be used. Moreover, chip parts, such as a capacitor | condenser and resistance, may be sufficient, and wafer-shaped chips, such as a bare chip and a Philip chip | tip, may be sufficient.

It is a perspective view which shows the structure of the principal part of the component mounting apparatus using the component supply tray of Example 1 of this invention. It is a perspective view which shows the structure of the components supply tray of Example 1. FIG. It is a perspective view which shows the state which removed the component partition plate from the main body of the tray. It is a vertical side view of the tray. It is a vertical side view which shows the state which is heating the tray. It is a side view which shows a mode that an electronic component is adsorbed and taken out from the tray. It is explanatory drawing which shows a mode that a tray is taken out from a component supply rack, and is set to a component mounting apparatus. FIG. 6 is a perspective view showing one component housing portion of a tray according to a second embodiment. It is a perspective view which shows a mode that QFP of a component is taken out from one component accommodating part of the tray. It is a vertical side view of one component accommodation part of the tray. 6 is a perspective view showing a structure of a tray of Example 3. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mounting head 2 X-axis gantry 3 Y-axis gantry 4 Recognition apparatus 5 Electronic component supply device 6,13 Component supply tray 7 Electronic component 8 Component supply plate 9 Component partition plate 10, 10 'Thermal peeling sheet 11 Heater 12 QFP
14 Component supply rack 15 Dispenser 16 Circuit board 17 Component mounting device 18 Thermal release adhesive

Claims (4)

A component supply tray for supplying electronic components to a component mounting apparatus,
A component supply tray, wherein a pressure-sensitive adhesive sheet having a variable pressure-sensitive adhesive strength is attached to the bottom of the tray to fix the electronic component, and the pressure-sensitive adhesive strength of the pressure-sensitive adhesive sheet is reduced when the electronic component is removed from the tray. A component supply tray for supplying electronic components to a component mounting apparatus,
A component supply tray, wherein an adhesive having a variable adhesive force is applied to the bottom of the tray to fix the electronic component, and the adhesive force of the adhesive is reduced when the electronic component is taken out of the tray.   The component supply tray according to claim 1, wherein a partition plate for partitioning and storing the components is detachably attached to the adhesive sheet.   The component supply tray according to claim 2, wherein a partition plate for partitioning and storing the components is detachably attached to the bottom of the tray, and an adhesive is applied to the bottom of the tray partitioned by the partition plate.