TW202324575A - Film bonding module and semiconductor strip sawing and sorting equipment including the same - Google Patents

Film bonding module and semiconductor strip sawing and sorting equipment including the same Download PDF

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TW202324575A
TW202324575A TW111146442A TW111146442A TW202324575A TW 202324575 A TW202324575 A TW 202324575A TW 111146442 A TW111146442 A TW 111146442A TW 111146442 A TW111146442 A TW 111146442A TW 202324575 A TW202324575 A TW 202324575A
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release film
film
tray
module
unit
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TW111146442A
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Chinese (zh)
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金鎭洙
李在卿
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韓商细美事有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Intermediate Stations On Conveyors (AREA)

Abstract

Embodiments of the present invention provide a film combining module for combining and separating a release film to which a semiconductor package is attached to a fixture tray, and semiconductor strip sawing and sorting equipment including the same. The semiconductor strip sawing and sorting equipment according to the present invention includes: a loading unit for supplying semiconductor strips; a sawing unit for sawing the semiconductor strips supplied from the loading unit and individualizing them into a plurality of semiconductor packages; a sorting unit that inspects and classifies the semiconductor packages according to the inspection results and adheres them to the release film; and a film combining module, installed adjacent to the sorting unit, that combines the fixture tray and the release film, supplies them to the sorting unit, and separates the fixture tray and the release film collected from the sorting unit.

Description

膜結合模組以及包括其的半導體條帶切割以及分類裝備Film bonding module and semiconductor strip cutting and sorting equipment including the same

本發明係關於一種用於將離型膜和夾具托盤進行結合以及分離的膜結合模組以及包括其的半導體條帶切割以及分類裝備。The present invention relates to a film bonding module for bonding and separating a release film and a jig tray and semiconductor strip cutting and sorting equipment including the same.

半導體製造過程作為用於在晶圓上製造半導體元件的過程，例如包括曝光、蒸鍍、蝕刻、離子注入、清洗等。半導體條帶切割以及分類裝備將配置有複數個封裝體的條帶以封裝體單位進行切割而單個化，通過針對各封裝體的清洗、乾燥、檢查來區分正常或者不良狀態，從而分別分類並裝載於最終的收納容器即托盤。The semiconductor manufacturing process includes, for example, exposure, vapor deposition, etching, ion implantation, cleaning, and the like as a process for manufacturing semiconductor elements on a wafer. Semiconductor tape dicing and sorting equipment cuts and separates a tape with a plurality of packages on a package-by-package basis, and sorts and loads each package by cleaning, drying, and inspecting each package for normal or defective status. The final storage container is the tray.

另一方面，最近為了防止在電子裝置中的晶片受到外部的電磁波的影響，正在應用將阻斷電磁波的物質塗布於半導體封裝體的外觀的EMI（Electromagnetic Interference；電磁干擾）屏蔽過程。針對通過切削單個化的半導體封裝體執行EMI屏蔽過程。在EMI屏蔽處理過程中，由於需要電接觸的面（例：球面）不能沾上塗布物質，因此各半導體封裝體以附著於粘合用離型膜的狀態輸送至處理EMI屏蔽過程的設備。需要一種用於在EMI屏蔽過程之前在半導體條帶切割以及分類裝備中將各半導體封裝體附著於離型膜之後進行排出的方法。On the other hand, recently, in order to prevent chips in electronic devices from being affected by external electromagnetic waves, an EMI (Electromagnetic Interference; electromagnetic interference) shielding process in which a substance that blocks electromagnetic waves is applied to the outer surface of a semiconductor package is being used. An EMI shielding process is performed on semiconductor packages singulated by cutting. During the EMI shielding process, each semiconductor package is transported to the equipment that handles the EMI shielding process in a state of being attached to the release film for adhesion because the surface that requires electrical contact (eg spherical surface) cannot be stained with the coating substance. There is a need for a method for ejection after attaching each semiconductor package to a release film in semiconductor strip cutting and sorting equipment prior to the EMI shielding process.

本發明的實施例提供一種用於將附著半導體封裝體的離型膜與夾具托盤進行結合以及分離的膜結合模組以及包括其的半導體條帶切割以及分類裝備。Embodiments of the present invention provide a film bonding module for bonding and separating a release film attached to a semiconductor package and a jig tray, and semiconductor tape cutting and sorting equipment including the same.

本發明的解決課題不限於以上提及的解決課題，本領域技術人員可以從下面的記載明確地理解未提及的其它解決課題。The problems to be solved by the present invention are not limited to the above-mentioned problems, and those skilled in the art can clearly understand other problems not mentioned from the following description.

根據本發明的半導體條帶切割以及分類裝備包括：裝載單元，供應半導體條帶；切割單元，切割從該裝載單元供應的該半導體條帶而將該半導體條帶單個化為複數個半導體封裝體；分類單元，檢查單個化的該等半導體封裝體，並根據檢查結果將該等半導體封裝體分類而粘合於離型膜；以及膜結合模組，與該分類單元相鄰設置，並將夾具托盤和該離型膜結合而供應於該分類單元，並且分離從該分類單元回收的該夾具托盤和該離型膜。The semiconductor strip cutting and sorting equipment according to the present invention includes: a loading unit that supplies semiconductor strips; a cutting unit that cuts the semiconductor strips supplied from the loading unit to singulate the semiconductor strips into a plurality of semiconductor packages; a sorting unit, which inspects the individualized semiconductor packages, and according to the inspection result, sorts the semiconductor packages and adheres them to the release film; The release film is combined with the release film to be supplied to the sorting unit, and the jig tray and the release film recovered from the sorting unit are separated.

根據本發明的實施例，可以是，該膜結合模組收取裝載有該離型膜的料盒，從而將該離型膜結合於該夾具托盤並供應於該分類單元，該膜結合模組從該夾具托盤分離粘合有該等半導體封裝體的該離型膜而裝載於該料盒，該膜結合模組排出裝載有粘合有該等半導體封裝體的該離型膜的該料盒。According to an embodiment of the present invention, it may be that the film combination module receives the magazine loaded with the release film, so that the release film is combined with the clamp tray and supplied to the sorting unit, and the film combination module is from The jig tray separates the release film bonded with the semiconductor packages and loads the magazine, and the film combining module discharges the magazine loaded with the release film bonded with the semiconductor packages.

根據本發明的實施例，可以是，具有磁性的框架附著於該離型膜的外圍部，該框架和該夾具托盤構成為通過磁力結合。According to an embodiment of the present invention, a magnetic frame may be attached to the peripheral portion of the release film, and the frame and the jig tray may be magnetically coupled.

根據本發明的實施例，可以是，該分類單元包括：晶片拾取器，沿著第一水平方向移動，並從托盤台拾取半導體封裝體，並根據檢查結果將該等半導體封裝體附著於該離型膜；托盤輸送部，沿著與該第一水平方向垂直的第二水平方向移動，並輸送結合有該離型膜的夾具托盤；托盤拾取器，在上方拾取該夾具托盤並輸送該夾具托盤；以及托盤裝載器，保管該夾具托盤。According to an embodiment of the present invention, it may be that the sorting unit includes: a wafer picker, which moves along the first horizontal direction, and picks up semiconductor packages from the tray table, and attaches the semiconductor packages to the separator according to the inspection result. The mold film; the tray conveying part moves along the second horizontal direction perpendicular to the first horizontal direction, and conveys the fixture tray combined with the release film; the tray picker picks up the fixture tray above and transports the fixture tray ; and a pallet loader for keeping the fixture pallet.

根據本發明的實施例，可以是，該膜結合模組設置於該托盤拾取器的移動路徑。According to an embodiment of the present invention, it may be that the film bonding module is disposed on the moving path of the tray picker.

根據本發明的實施例，可以是，該托盤拾取器將與附著有該等半導體封裝體的該離型膜結合的該夾具托盤從該托盤輸送部輸送到該托盤裝載器，該托盤拾取器在該膜結合模組中將其它夾具托盤從該膜結合模組輸送到該托盤輸送部，該托盤拾取器將該夾具托盤從該托盤裝載器輸送到該膜結合模組。According to an embodiment of the present invention, it may be that the tray picker transports the jig tray combined with the release film to which the semiconductor packages are attached from the tray delivery part to the tray loader. In the film bonding module, other jig trays are transported from the film bonding module to the tray conveying part, and the tray picker transports the clip trays from the tray loader to the film bonding module.

本發明的實施例提供一種設置於半導體條帶切割以及分類裝備的分類單元，並將夾具托盤和離型膜結合而供應於該分類單元，並且分離從該分類單元回收的該夾具托盤和該離型膜的膜結合模組。該膜結合模組包括：料盒裝載器模組，被投入容納該離型膜的料盒；膜搬動模組，從該料盒取出該離型膜並將該離型膜投入到該料盒；膜升降模組，通過以吸附該離型膜的狀態進行升降而使該離型膜和該夾具托盤附著或者分離；以及輸送器模組，搬送附著有該離型膜的該夾具托盤。An embodiment of the present invention provides a sorting unit provided in semiconductor strip cutting and sorting equipment, and a jig tray and a release film are combined and supplied to the sorting unit, and the jig tray and the release film recovered from the sorting unit are separated. Membrane-bound modules of type membranes. The film combining module includes: a magazine loader module, which is put into a magazine containing the release film; a film moving module, which takes out the release film from the magazine and puts the release film into the material box; A box; a film lifting module for attaching or separating the release film from the jig tray by moving up and down while absorbing the release film; and a conveyor module for transporting the jig tray attached with the release film.

根據本發明的實施例，可以是，具有磁性的框架附著於該離型膜的外圍部，該框架和該夾具托盤構成為通過磁力結合。According to an embodiment of the present invention, a magnetic frame may be attached to the peripheral portion of the release film, and the frame and the jig tray may be magnetically coupled.

根據本發明的實施例，可以是，該料盒裝載器模組包括：料盒裝載單元，投入以及排出容納該離型膜的料盒；料盒升降單元，夾持該料盒而使該料盒上升或者下降；以及推動器單元，從該料盒推出該離型膜。According to an embodiment of the present invention, it may be that the magazine loader module includes: a magazine loading unit for inputting and discharging the magazine containing the release film; a magazine lifting unit for clamping the magazine to make the magazine The box rises or falls; and a pusher unit pushes out the release film from the magazine.

根據本發明的實施例，可以是，該膜搬動模組包括：膜導向單元，引導該離型膜的移動路徑；以及膜輸送單元，夾持該離型膜並使該離型膜沿著該移動路徑移動。According to an embodiment of the present invention, it may be that the film moving module includes: a film guide unit, which guides the moving path of the release film; and a film delivery unit, which clamps the release film and makes the release film along the The movement path moves.

根據本發明的實施例，可以是，該膜導向單元包括：一對導軌部件，構成為能夠在彼此相反方向上移動。According to an embodiment of the present invention, the film guide unit may include: a pair of rail members configured to be movable in directions opposite to each other.

根據本發明的實施例，可以是，該一對導軌部件構成為：當沿著水平方向輸送該離型膜時，該一對導軌部件在彼此接近的方向上移動而引導該離型膜的移動，當該離型膜上升或者下降時，該一對導軌部件在彼此遠離的方向上移動而避免與該離型膜的干擾。According to an embodiment of the present invention, it may be that the pair of guide rail members is configured such that when the release film is conveyed in the horizontal direction, the pair of guide rail members move in a direction approaching each other to guide the movement of the release film , when the release film rises or falls, the pair of rail members move in a direction away from each other to avoid interference with the release film.

根據本發明的實施例，可以是，該膜輸送單元從該料盒夾持該離型膜並將該離型膜沿著該導軌部件輸送到膜升降區域，並且將附著有半導體封裝體的該離型膜從該膜升降區域輸送到該料盒。According to an embodiment of the present invention, it may be that the film conveying unit clamps the release film from the magazine and transports the release film to the film lifting area along the rail member, and the attached semiconductor package The release film is transported from the film lifting area to the magazine.

根據本發明的實施例，可以是，該膜升降模組包括：升降主體，具有一定的面積並構成為在膜升降區域的下升降位置和上升降位置之間進行升降；以及複數個真空吸附單元，形成在該升降主體的上方。According to an embodiment of the present invention, it may be that the film lifting module includes: a lifting body having a certain area and configured to lift between the lower lifting position and the upper lifting position of the film lifting area; and a plurality of vacuum adsorption units , formed above the lifting body.

根據本發明的實施例，可以是，該等真空吸附單元在該升降主體中設置於與形成於該夾具托盤的複數個貫通孔相對應的位置而構成為穿過該夾具托盤的該等貫通孔。According to an embodiment of the present invention, it may be that the vacuum suction units are arranged in the lifting main body at positions corresponding to the plurality of through holes formed on the jig tray and configured to pass through the through holes of the jig tray .

根據本發明的實施例，可以是，若該離型膜位於該上升降位置，則該膜升降模組上升到該膜升降區域的該上升降位置而吸附該離型膜，並在吸附該離型膜的狀態下從該上升降位置下降到該下升降位置而使該離型膜和該夾具托盤結合。According to an embodiment of the present invention, if the release film is located at the upper lifting position, the film lifting module rises to the upper lifting position of the film lifting area to absorb the release film, and then absorb the release film. The release film is combined with the clamp tray by descending from the upper lifting position to the lower lifting position under the state of the release film.

根據本發明的實施例，可以是，若與附著有半導體封裝體的該離型膜結合的該夾具托盤位於該下升降位置，則該膜升降模組上升到該上升降位置而從該夾具托盤分離該離型膜，若該離型膜在該上升降位置定位，則該膜升降模組解除真空吸附並下降到該下升降位置。According to an embodiment of the present invention, it may be that if the clamp tray combined with the release film attached to the semiconductor package is located at the lower lift position, the film lift module rises to the upper lift position to move from the clamp tray to the upper lift position. The release film is separated, and if the release film is positioned at the upper lifting position, the film lifting module releases the vacuum adsorption and descends to the lower lifting position.

根據本發明的實施例，可以是，該輸送器模組將附著有該離型膜的該夾具托盤從膜升降區域輸送到托盤拾取區域，並將與位於該托盤拾取區域的粘合有半導體封裝體的該離型膜結合的該夾具托盤輸送到該膜升降區域。According to an embodiment of the present invention, it may be that the conveyor module transports the jig tray attached with the release film from the film lift area to the tray pick-up area, and combines with the semiconductor package bonded to the tray pick-up area. The fixture tray combined with the release film of the body is transported to the film lifting area.

根據本發明的實施例的半導體條帶切割以及分類裝備包括：裝載單元，用於供應半導體條帶；切割單元，切割從該裝載單元供應的該半導體條帶而將該半導體條帶單個化為複數個半導體封裝體；分類單元，檢查單個化的該等半導體封裝體，並根據檢查結果將該等半導體封裝體分類而粘合於離型膜；以及膜結合模組，能夠拆裝地設置於該分類單元，並將夾具托盤和該離型膜結合而供應於該分類單元，並且分離從該分類單元回收的該夾具托盤和該離型膜。Semiconductor strip cutting and sorting equipment according to an embodiment of the present invention includes: a loading unit for supplying semiconductor strips; a cutting unit for singulating the semiconductor strips into plural numbers by cutting the semiconductor strips supplied from the loading unit a semiconductor package; a sorting unit, which inspects the individualized semiconductor packages, and classifies the semiconductor packages according to the inspection results and adheres them to the release film; and a film bonding module, which is detachably arranged on the a sorting unit, and the jig tray and the release film are combined and supplied to the sorting unit, and the jig tray and the release film recovered from the sorting unit are separated.

該膜結合模組包括：料盒裝載器模組，被投入容納該離型膜的料盒；膜搬動模組，從該料盒取出該離型膜；膜升降模組，通過以吸附該離型膜的狀態進行升降而使該離型膜和該夾具托盤附著或者分離；以及輸送器模組，搬送附著有該離型膜的該夾具托盤。The film combining module includes: a box loader module, which is put into a box containing the release film; a film moving module, which takes out the release film from the box; a film lifting module, which passes through to absorb the release film. The state of the release film is raised and lowered so that the release film and the clamp tray are attached or separated; and the conveyor module transports the clamp tray attached with the release film.

根據本發明的實施例，可以是，該分類單元包括：晶片拾取器，沿著第一水平方向移動，並從托盤台拾取半導體封裝體，並根據檢查結果將該等半導體封裝體附著於該離型膜；托盤輸送部，沿著導向部件移動，並輸送結合有該離型膜的夾具托盤，該導向部件沿著與該第一水平方向垂直的第二水平方向延伸；托盤拾取器，在上方拾取該夾具托盤並輸送該夾具托盤；以及托盤裝載器，保管該夾具托盤。According to an embodiment of the present invention, it may be that the sorting unit includes: a wafer picker, which moves along the first horizontal direction, and picks up semiconductor packages from the tray table, and attaches the semiconductor packages to the separator according to the inspection result. the mold film; the tray conveying part, which moves along the guide part, and conveys the clamp tray combined with the release film, and the guide part extends along the second horizontal direction perpendicular to the first horizontal direction; the tray picker, on the top picking up the jig pallet and delivering the jig pallet; and a pallet loader storing the jig pallet.

根據本發明，通過構成為能夠將可以對離型膜和夾具托盤進行結合或者分離的膜結合模組拆裝於分類單元，從而在封裝體切割以及檢查之後且在EMI（Electromagnetic interference）屏蔽過程之前，能夠使將半導體封裝體附著於離型膜並排出離型膜的過程自動化。According to the present invention, by detaching the film bonding module capable of bonding or separating the release film and the jig tray from the sorting unit, after package cutting and inspection and before EMI (Electromagnetic interference) shielding process , it is possible to automate the process of attaching the semiconductor package to the release film and discharging the release film.

本發明的效果不限於以上提及的效果，本領域技術人員可以從下面的記載明確地理解未提及的其它效果。The effects of the present invention are not limited to the effects mentioned above, and those skilled in the art can clearly understand other effects not mentioned from the following description.

以下，參照圖式來詳細說明本發明的實施例，以使得本發明所屬技術領域中具有通常知識者可以容易地實施。本發明可以以各種不同的方式實現，不限於在此說明的實施例。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings so that those skilled in the art to which the present invention pertains can easily implement. The present invention can be implemented in various ways and is not limited to the embodiments described here.

為了清楚地說明本發明，省略了與說明無關的部分，貫穿說明書整體對相同或者類似的構成要件標注相同的符號。In order to clearly describe the present invention, parts irrelevant to the description are omitted, and the same reference numerals are attached to the same or similar constituent elements throughout the entire specification.

另外，在多個實施例中，對具有相同的構成的構成要件使用相同的符號來僅說明代表性實施例，在其餘的其它實施例中僅說明與代表性實施例不同的構成。In addition, in the plurality of embodiments, only a representative embodiment will be described by using the same symbols for constituent elements having the same configuration, and only configurations different from the representative embodiment will be described in the remaining other embodiments.

在說明書整體中，當表述某部分與其它部分“連接（或者結合）”時，其不僅是“直接連接（或者結合）”的情況，也包括將其它部件置於中間“間接連接（或者結合）”的情況。另外，當表述某部分“包括”某構成要件時，只要沒有特別相反的記載，其意指可以還包括其它構成要件而不是排除其它構成要件。Throughout the specification, when it is expressed that a certain part is "connected (or combined)" with other parts, it is not only the case of "directly connected (or combined)", but also includes "indirect connection (or combined)" with other parts interposed. "Case. In addition, when it is stated that a certain part "includes" a certain constituent element, as long as there is no particular contrary statement, it means that other constituent elements may be included rather than excluded.

只要沒有不同地定義，包括技術或者科學術語在內在此使用的所有術語具有與本發明所屬技術領域中具有通常知識者一般所理解的含義相同的含義。在通常使用的詞典中定義的術語之類的術語應解釋為具有與相關技術脈絡上具有的含義一致的含義，只要在本申請中沒有明確定義，不會理想性或過度地解釋為形式性含義。Unless defined differently, all terms used herein including technical or scientific terms have the same meanings as those generally understood by those having ordinary knowledge in the technical field to which the present invention pertains. Terms such as terms defined in commonly used dictionaries should be interpreted as having meanings consistent with the meanings they have on the relevant technical context, and as long as they are not clearly defined in this application, they will not be ideally or excessively interpreted as formal meanings .

以下，針對在半導體條帶切割以及分類裝備1中在封裝體切割以及檢查之後且在EMI（Electromagnetic interference）屏蔽過程之前可以使將半導體封裝體SP附著於離型膜400並排出離型膜400的過程自動化的膜結合模組30進行說明。In the following, in the semiconductor strip dicing and sorting equipment 1, after the package dicing and inspection and before the EMI (Electromagnetic interference) shielding process, the semiconductor package SP can be attached to the release film 400 and the release film 400 can be discharged. A membrane binding module 30 for process automation is illustrated.

首先，針對可以適用本發明的半導體條帶切割以及分類裝備1的概要構成進行說明。First, the schematic structure of the semiconductor strip cutting and sorting equipment 1 to which this invention is applicable is demonstrated.

圖1示出了可以適用本發明的半導體條帶切割以及分類裝備1的概要構成。FIG. 1 shows a schematic configuration of semiconductor strip cutting and sorting equipment 1 to which the present invention can be applied.

根據本發明的半導體條帶切割以及分類裝備1包括：裝載單元5，供應半導體條帶S；切割單元10，切割從裝載單元5供應的半導體條帶S而將半導體條帶S單個化為複數個半導體封裝體SP；分類單元20，檢查單個化的半導體封裝體SP，並根據檢查結果將半導體封裝體SP分類而粘合於離型膜400；膜結合模組30，與分類單元20相鄰設置，並將夾具托盤500和離型膜400結合而供應於分類單元20，並且分離從分類單元20回收的夾具托盤500和離型膜400。The semiconductor strip cutting and sorting equipment 1 according to the present invention includes: a loading unit 5 that supplies a semiconductor strip S; a cutting unit 10 that cuts the semiconductor strip S supplied from the loading unit 5 and singulates the semiconductor strip S into a plurality of The semiconductor package SP; the sorting unit 20, checks the individualized semiconductor packages SP, and classifies the semiconductor packages SP according to the inspection results and adheres them to the release film 400; the film bonding module 30 is arranged adjacent to the sorting unit 20 , and the clip tray 500 and the release film 400 are combined and supplied to the sorting unit 20 , and the clip tray 500 and the release film 400 recovered from the sorting unit 20 are separated.

裝載單元5收取裝載有完成成型的狀態的PCB（Printed Circuit Board；印刷電路板）之類半導體條帶S的條帶料盒MZ1，並將半導體條帶S從條帶料盒MZ1供應到切割單元10。將半導體條帶S從由料盒裝載器102夾持的條帶料盒MZ1通過推動器（未示出）供應到切割單元10。The loading unit 5 takes in a tape magazine MZ1 loaded with a semiconductor tape S such as a PCB (Printed Circuit Board) in a state where molding is completed, and supplies the semiconductor tape S from the tape magazine MZ1 to the cutting unit 10. The semiconductor tape S is supplied from the tape magazine MZ1 held by the magazine loader 102 to the cutting unit 10 through a pusher (not shown).

切割單元10執行針對半導體條帶S的切削過程，並將通過切削過程單個化的半導體封裝體SP提供到分類單元20。通過入口軌道104輸送的半導體條帶S通過條帶拾取器106被輸送到卡盤台108。條帶拾取器106可以沿著水平導向部件120移動。The cutting unit 10 performs a cutting process for the semiconductor strip S, and supplies the semiconductor packages SP singulated through the cutting process to the sorting unit 20 . The semiconductor strip S transported through the entry track 104 is transported to the chuck table 108 by the strip picker 106 . The strip picker 106 can move along the horizontal guide member 120 .

安放於卡盤台108的半導體條帶S在y方向上移動而被切削模組110切割。可以是，半導體條帶S被切削模組110切割而單個化的半導體封裝體SP通過單元拾取器112從卡盤台108輸送到緩衝台116。另一方面，半導體封裝體SP可以通過清洗單元114清洗。緩衝拾取器118可以從緩衝台116拾取半導體封裝體SP並將其輸送到翻轉台202或者輸送到托盤台204。The semiconductor strip S placed on the chuck table 108 moves in the y direction and is cut by the cutting module 110 . It may be that the semiconductor strip S is cut by the cutting module 110 and the individualized semiconductor packages SP are transported from the chuck table 108 to the buffer table 116 by the unit picker 112 . On the other hand, the semiconductor package SP may be cleaned by the cleaning unit 114 . The buffer picker 118 may pick up the semiconductor package SP from the buffer table 116 and transfer it to the flipping table 202 or to the tray table 204 .

翻轉台202可以翻轉半導體封裝體SP並將其安放到托盤台204，從而使得球面朝向上方，可以通過用於球面檢查的球體視覺檢查部208執行球面檢查。另一方面，可以省略通過翻轉台202進行的翻轉以及球面檢查。The turning stage 202 can turn over the semiconductor package SP and place it on the tray stage 204 so that the spherical surface faces upward, and the spherical surface inspection can be performed by the spherical surface inspection part 208 for spherical surface inspection. On the other hand, the inversion by the inversion table 202 and the spherical inspection can be omitted.

另一方面，托盤台204能夠沿著工作台驅動部206在y方向上移動，托盤台204在y方向上移動，同時通過標記視覺檢查部210以及球體視覺檢查部208執行針對半導體封裝體SP的檢查。標記視覺檢查部210以及球體視覺檢查部208可以設置於上門架212。晶片拾取器218可以沿著水平導向部件216移動，並從托盤台204拾取半導體封裝體SP而輸送到用於後續過程的托盤。可以通過對準視覺檢查部214執行半導體封裝體SP的對準檢查。On the other hand, the pallet table 204 can move in the y direction along the table driving part 206, and the pallet table 204 moves in the y direction, and at the same time, the marking visual inspection part 210 and the sphere visual inspection part 208 perform inspection on the semiconductor package SP. examine. The mark visual inspection unit 210 and the sphere visual inspection unit 208 may be installed on the upper door frame 212 . The wafer picker 218 can move along the horizontal guide member 216, and picks up the semiconductor package SP from the tray table 204 to be transported to a tray for a subsequent process. Alignment inspection of the semiconductor package SP may be performed by the alignment vision inspection part 214 .

晶片拾取器218可以根據針對半導體封裝體SP的檢查結果來將半導體封裝體進行分類並將其裝載於托盤。裝載有半導體封裝體SP的托盤可以在托盤輸送部220中在水平方向（-y方向）上移動而被排出到外部。正常的半導體封裝體SP可以被輸送到良品托盤保管部228，非正常的半導體封裝體SP可以被輸送到重工托盤保管部230，並可以從托盤裝載器232供應托盤。The wafer picker 218 may sort semiconductor packages SP and load them on trays according to inspection results for the semiconductor packages SP. The tray on which the semiconductor packages SP are loaded can move in the horizontal direction (−y direction) in the tray transport unit 220 and be discharged to the outside. Normal semiconductor packages SP can be transported to the good product tray storage unit 228 , abnormal semiconductor packages SP can be transported to the rework tray storage unit 230 , and the trays can be supplied from the tray loader 232 .

另一方面，在本發明的情況下，為了針對半導體封裝體SP進行EMI屏蔽過程，半導體封裝體SP不以保管在托盤的狀態從良品托盤保管部228以及重工托盤保管部230排出，而以附著於離型膜400的狀態從膜結合模組30排出。在膜結合模組30中，離型膜400以結合於夾具托盤500的狀態供應，並通過托盤拾取器226被供應到托盤輸送部220。托盤拾取器226通過第一水平導向部件222和第二水平導向部件224在第一水平方向（x方向）以及第二水平方向（y方向）上移動的同時輸送夾具托盤500。On the other hand, in the case of the present invention, in order to perform the EMI shielding process on the semiconductor package SP, the semiconductor package SP is not discharged from the good product tray storage unit 228 and the rework tray storage unit 230 in the state of being stored in a tray, but is attached. It is discharged from the film bonding module 30 in the state of the release film 400 . In the film bonding module 30 , the release film 400 is supplied in a state bonded to the jig tray 500 , and is supplied to the tray transport unit 220 by the tray picker 226 . The tray picker 226 conveys the jig tray 500 while moving in the first horizontal direction (x direction) and the second horizontal direction (y direction) by the first horizontal guide member 222 and the second horizontal guide member 224 .

根據本發明，膜結合模組30收取裝載有離型膜400的料盒MZ而將離型膜400結合於夾具托盤500並供應到分類單元20，並從夾具托盤500分離粘合有半導體封裝體SP的離型膜400並將其裝載於料盒MZ，並且可以排出裝載有粘合有半導體封裝體SP的離型膜400的料盒MZ。According to the present invention, the film bonding module 30 receives the magazine MZ loaded with the release film 400 to bond the release film 400 to the jig tray 500 and supply it to the sorting unit 20, and separates the bonded semiconductor package from the jig tray 500. The release film 400 of the SP is loaded into the magazine MZ, and the magazine MZ loaded with the release film 400 bonded with the semiconductor package SP may be discharged.

圖2A以及圖2B示出了根據本發明的離型膜400以及收納離型膜400的料盒MZ。圖2A示出了離型膜400結合於框架410的狀態，圖2B示出了離型膜400收納於料盒MZ的狀態。2A and 2B show a release film 400 according to the present invention and a magazine MZ for accommodating the release film 400 . FIG. 2A shows the state where the release film 400 is combined with the frame 410, and FIG. 2B shows the state where the release film 400 is stored in the magazine MZ.

根據本發明的實施例，可以是，具有磁性的框架410附著於離型膜400的外圍部，框架410和夾具托盤500構成為通過磁力結合。另外，離型膜400由於可以容易地變形，因此通過將框架410附著於外圍部，可以防止在離型膜400的處理過程中產生變形。附著有框架410的狀態的離型膜400可以以收納於料盒MZ的狀態被供應到膜結合模組30。According to an embodiment of the present invention, the magnetic frame 410 may be attached to the outer peripheral portion of the release film 400, and the frame 410 and the jig tray 500 may be configured to be magnetically coupled. In addition, since the release film 400 can be easily deformed, by attaching the frame 410 to the peripheral portion, deformation during handling of the release film 400 can be prevented. The release film 400 attached with the frame 410 may be supplied to the film bonding module 30 in a state stored in the magazine MZ.

圖3A以及圖3B示出了根據本發明的夾具托盤500以及附著有離型膜400的夾具托盤500。圖3A示出了沒有結合離型膜400的狀態的夾具托盤500，圖3B示出了結合有離型膜400的狀態的夾具托盤500。3A and 3B illustrate a jig tray 500 according to the present invention and the jig tray 500 with a release film 400 attached thereto. FIG. 3A shows the jig tray 500 in a state where the release film 400 is not attached, and FIG. 3B shows the jig tray 500 in a state where the release film 400 is attached.

根據本發明的實施例，夾具托盤500可以包括以一定的形狀提供的托盤主體510、從托盤主體510引入並能夠插入離型膜400的托盤槽部520。在這裡，可以在托盤槽部520形成用於對夾具托盤500和離型膜400進行結合或者分離的複數個貫通孔530。另外，為了夾具托盤500的輸送，能夠與托盤拾取器226結合的夾持部515可以形成在托盤主體510的側壁。According to an embodiment of the present invention, the jig tray 500 may include a tray body 510 provided in a certain shape, and a tray groove 520 introduced from the tray body 510 and capable of being inserted into the release film 400 . Here, a plurality of through holes 530 for coupling or separating the jig tray 500 and the release film 400 may be formed in the tray groove portion 520 . In addition, for the conveyance of the jig tray 500 , a clamping part 515 capable of being combined with the tray picker 226 may be formed on a side wall of the tray main body 510 .

圖4示出了在根據本發明的半導體條帶切割以及分類裝備1中膜結合模組30結合於分類單元20的過程。如圖4所示，膜結合模組30可以能夠拆裝地結合於半導體條帶切割以及分類裝備1。在半導體條帶切割以及分類裝備1的分類單元20的側壁可以形成能夠結合膜結合模組30的部位，膜結合模組30通過結合於相應部位，可以為了EMI屏蔽過程供應離型膜400並排出附著有半導體封裝體SP的離型膜400。FIG. 4 shows the process of combining the film binding module 30 with the sorting unit 20 in the semiconductor strip cutting and sorting equipment 1 according to the present invention. As shown in FIG. 4 , the film bonding module 30 may be detachably bonded to the semiconductor strip cutting and sorting equipment 1 . The side wall of the sorting unit 20 of the semiconductor strip cutting and sorting equipment 1 can form a part where the film bonding module 30 can be combined, and the film bonding module 30 can supply and discharge the release film 400 for the EMI shielding process by bonding to the corresponding part. The release film 400 of the semiconductor package SP is attached.

圖5示出了在根據本發明的半導體條帶切割以及分類裝備1中結合於分類單元20的膜結合模組30的概要結構。FIG. 5 shows a schematic structure of the film bonding module 30 combined with the sorting unit 20 in the semiconductor strip cutting and sorting equipment 1 according to the present invention.

如圖5所示，膜結合模組30結合於半導體條帶切割以及分類裝備1的分類單元20。As shown in FIG. 5 , the film combining module 30 is combined with the sorting unit 20 of the semiconductor strip cutting and sorting equipment 1 .

根據本發明的實施例，可以是，分類單元20包括：晶片拾取器218，沿著第一水平方向（x方向）移動，並從托盤台204拾取半導體封裝體SP，並且根據檢查結果將半導體封裝體SP附著於離型膜400；托盤輸送部220，沿著與第一水平方向（x方向）垂直的第二水平方向（y方向）移動，並輸送結合有離型膜400的夾具托盤500；托盤拾取器226，在上方拾取夾具托盤500並輸送夾具托盤500；以及托盤裝載器232，保管夾具托盤500。According to an embodiment of the present invention, it may be that the sorting unit 20 includes: a wafer picker 218, which moves along the first horizontal direction (x direction), and picks up the semiconductor package SP from the tray table 204, and separates the semiconductor package SP according to the inspection result. The body SP is attached to the release film 400; the tray conveying part 220 moves along the second horizontal direction (y direction) perpendicular to the first horizontal direction (x direction), and transports the clamp tray 500 combined with the release film 400; The pallet picker 226 picks up the jig pallet 500 above and conveys the jig pallet 500 ; and the pallet loader 232 stores the jig pallet 500 .

根據本發明的實施例，膜結合模組30可以設置於托盤拾取器226的移動路徑。According to an embodiment of the present invention, the film bonding module 30 may be disposed on the moving path of the tray picker 226 .

當為了EMI屏蔽過程而將半導體封裝體SP附著於離型膜400時，通過托盤裝載器232供應夾具托盤500，托盤拾取器226從托盤裝載器232拾取夾具托盤500之後將其供應到膜結合模組30。良品托盤保管部228以及重工托盤保管部230可以用作用於臨時保管夾具托盤500的緩衝件。When attaching the semiconductor package SP to the release film 400 for the EMI shielding process, the jig tray 500 is supplied by the tray loader 232, and the tray picker 226 picks up the jig tray 500 from the tray loader 232 and supplies it to the film bonding die. Group 30. The good product tray storage unit 228 and the rework tray storage unit 230 can be used as buffers for temporarily storing the jig tray 500 .

在膜結合模組30中，若將離型膜400結合於夾具托盤500並將其提供到分類單元20，則托盤拾取器226拾取結合有離型膜400的夾具托盤500並將其設置於托盤輸送部220。In the film combining module 30, if the release film 400 is combined with the jig tray 500 and provided to the sorting unit 20, the tray picker 226 picks up the jig tray 500 combined with the release film 400 and sets it on the tray Transport unit 220 .

托盤拾取器226可以將與附著有半導體封裝體SP的離型膜400結合的夾具托盤500從托盤輸送部220輸送到托盤裝載器232，在膜結合模組30中將其它夾具托盤500從膜結合模組30輸送到托盤輸送部220，並將夾具托盤500從托盤裝載器232輸送到膜結合模組30。The tray picker 226 can transport the jig tray 500 bonded with the release film 400 to which the semiconductor package SP is attached from the tray conveying part 220 to the tray loader 232, and the other jig tray 500 can be bonded from the film in the film bonding module 30. The module 30 is transported to the tray transport unit 220 , and the jig tray 500 is transported from the tray loader 232 to the film bonding module 30 .

複數個半導體封裝體SP通過晶片拾取器218附著於結合有離型膜400的夾具托盤500。若完成了半導體封裝體SP在離型膜400的附著，則夾具托盤500通過托盤輸送部220移動到膜結合模組30的周邊，托盤拾取器226拾取夾具托盤500並將其供應到膜結合模組30。A plurality of semiconductor packages SP are attached to the jig tray 500 bonded with the release film 400 through the die picker 218 . If the attachment of the semiconductor package SP to the release film 400 is completed, the jig tray 500 moves to the periphery of the film bonding module 30 by the tray conveying part 220, and the tray picker 226 picks up the jig tray 500 and supplies it to the film bonding mold. Group 30.

另一方面，托盤拾取器226可以通過第一水平導向部件222和第二水平導向部件224移動，可以通過升降驅動拾取並放置夾具托盤500。第二水平導向部件224可以構成為沿著第一水平導向部件222在x方向上移動。On the other hand, the tray picker 226 can be moved by the first horizontal guide part 222 and the second horizontal guide part 224, and can pick up and place the jig tray 500 by lifting drive. The second horizontal guide part 224 may be configured to move in the x direction along the first horizontal guide part 222 .

本發明的實施例提供膜結合模組30，其能夠拆裝於半導體條帶切割以及分類裝備1的分類單元20，並對夾具托盤500和離型膜400進行結合而供應於分類單元20，並且分離從分類單元20回收的夾具托盤500和離型膜400。Embodiments of the present invention provide a film bonding module 30, which can be disassembled in the semiconductor strip cutting and sorting unit 20 of the sorting equipment 1, and the clamp tray 500 and the release film 400 are combined and supplied to the sorting unit 20, and The jig tray 500 and release film 400 recovered from the sorting unit 20 are separated.

膜結合模組30可以包括被投入容納離型膜400的料盒MZ的料盒裝載器模組310、從料盒MZ取出離型膜400並將離型膜400投入到料盒MZ的膜搬動模組320、通過以吸附離型膜400的狀態進行升降而使離型膜400和夾具托盤500附著或者分離的膜升降模組330以及搬送附著有離型膜400的夾具托盤500的輸送器模組340。The film bonding module 30 can include a magazine loader module 310 that is dropped into a magazine MZ that accommodates the release film 400, a film conveyor that takes out the release film 400 from the magazine MZ and puts the release film 400 into the magazine MZ. The moving module 320 , the film lifting module 330 that attaches or separates the release film 400 and the jig tray 500 by moving up and down while absorbing the release film 400 , and the conveyor that transports the jig tray 500 with the release film 400 attached Module 340.

圖6示出了根據本發明的膜結合模組30的料盒裝載器模組310。裝載有離型膜400的料盒MZ可以通過搬送裝備（未示出）供應於料盒裝載器模組310，料盒裝載器模組310可以將所保管的料盒MZ依次提供到膜搬動模組320。Figure 6 shows a cartridge loader module 310 of a film bonding module 30 according to the present invention. The magazine MZ loaded with the release film 400 can be supplied to the magazine loader module 310 through the conveying equipment (not shown), and the magazine loader module 310 can sequentially provide the magazine MZ kept to the film handling Module 320.

根據本發明的實施例，料盒裝載器模組310包括投入以及排出容納離型膜400的料盒MZ的料盒裝載單元312、夾持料盒MZ而使其上升或者下降的料盒升降單元314以及從料盒MZ推出離型膜400的推動器單元316。According to an embodiment of the present invention, the magazine loader module 310 includes a magazine loading unit 312 for inputting and discharging the magazine MZ containing the release film 400, and a magazine lifting unit for clamping the magazine MZ to make it rise or fall. 314 and a pusher unit 316 that pushes out the release film 400 from the magazine MZ.

收納有離型膜400的料盒MZ包括設置在底板311的上方的裝載板3121以及設置於裝載板的上方的卸載板3127，輸送器3123可以通過設置結構物3125設置於裝載板3121。位於裝載板3121的上方的料盒MZ通過輸送器3123在水平方向（-x方向）上移動而被輸送到料盒升降單元314。在卸載板3127中形成有切開部3127A，該切開部3127A用於使料盒升降單元314的上夾具3145A以及下夾具3145B穿過而避免干擾。The magazine MZ containing the release film 400 includes a loading plate 3121 disposed above the bottom plate 311 and an unloading plate 3127 disposed above the loading plate, and the conveyor 3123 can be disposed on the loading plate 3121 by setting a structure 3125 . The magazine MZ located above the loading plate 3121 is transported to the magazine lifting unit 314 by the conveyor 3123 moving in the horizontal direction (−x direction). A cutout 3127A is formed in the unloading plate 3127 for passing the upper jig 3145A and the lower jig 3145B of the magazine elevating unit 314 to avoid interference.

料盒升降單元314在夾持料盒MZ之後上升，以使得離型膜400被供應到膜搬動模組320。另外，料盒升降單元314可以將裝載有附著有半導體封裝體SP的離型膜400的料盒MZ輸送到料盒裝載器模組310的卸載板3127。The magazine elevating unit 314 ascends after gripping the magazine MZ, so that the release film 400 is supplied to the film moving module 320 . In addition, the magazine lifting unit 314 may transport the magazine MZ loaded with the release film 400 attached with the semiconductor package SP to the unloading plate 3127 of the magazine loader module 310 .

料盒升降單元314包括用於升降驅動的升降驅動部3141、通過升降驅動部3141上升或者下降的手持單元3143以及結合於手持單元3143而夾持料盒MZ的上部和下部的上夾具3145A和下夾具3145B。為了夾持料盒MZ，上夾具3145A可以相對於下夾具3145B上升或者下降。另外，料盒升降單元314包括使升降驅動部3141沿著水平方向（x方向）移動的水平驅動部3147。The magazine lift unit 314 includes a lift drive part 3141 for lift drive, a hand-held unit 3143 that rises or falls through the lift drive part 3141, and an upper clamp 3145A and a lower clamp 3145A that are combined with the hand-held unit 3143 to clamp the upper and lower parts of the magazine MZ. Fixture 3145B. In order to clamp the magazine MZ, the upper jig 3145A may be raised or lowered relative to the lower jig 3145B. In addition, the magazine elevating unit 314 includes a horizontal drive unit 3147 that moves the elevating drive unit 3141 in the horizontal direction (x direction).

推動器單元316將裝載於料盒MZ的離型膜400推出到膜搬動模組320，以從料盒MZ取出離型膜400。推動器單元316包括用於升降驅動的升降驅動部3161、推出離型膜400的推動桿3165以及使推動桿3165沿著水平方向（y方向）移動的水平驅動部3163。The pusher unit 316 pushes the release film 400 loaded in the magazine MZ to the film moving module 320 to take out the release film 400 from the magazine MZ. The pusher unit 316 includes an elevating driving part 3161 for elevating driving, a pushing rod 3165 pushing out the release film 400 , and a horizontal driving part 3163 moving the pushing rod 3165 in the horizontal direction (y direction).

圖7至圖9示出了從料盒MZ投入離型膜400的過程。7 to 9 show the process of dropping the release film 400 from the magazine MZ.

裝載有離型膜400的料盒MZ通過輸送器3123朝向料盒升降單元314移動（圖7）。若通過料盒升降單元314的上夾具3145A以及下夾具3145B夾持到料盒MZ（圖8），則手持單元3143上升至膜搬動模組320的周邊高度（圖9）。然後，通過推動器單元316和膜搬動模組320從料盒MZ取出離型膜400而離型膜400被供應到膜搬動模組320。若取出了料盒MZ的所有離型膜400，接著附著有半導體封裝體SP的離型膜400被投入到料盒MZ。The magazine MZ loaded with the release film 400 is moved toward the magazine lifting unit 314 by the conveyor 3123 ( FIG. 7 ). If the magazine MZ is clamped by the upper clamp 3145A and the lower clamp 3145B of the magazine lifting unit 314 ( FIG. 8 ), the hand-held unit 3143 rises to the peripheral height of the film moving module 320 ( FIG. 9 ). Then, the release film 400 is taken out from the magazine MZ by the pusher unit 316 and the film carrying module 320 and the release film 400 is supplied to the film carrying module 320 . After all the release films 400 of the cartridge MZ are taken out, the release films 400 to which the semiconductor package SP is attached are put into the cartridge MZ.

圖10至圖13示出了將完成了附著有半導體封裝體SP的離型膜400的裝載的料盒MZ排出的過程。10 to 13 illustrate a process of discharging the cartridge MZ to which the loading of the release film 400 to which the semiconductor package SP is attached is discharged.

若離型膜400全部收納於通過上夾具3145A以及下夾具3145B夾持的料盒MZ（圖10），則料盒升降單元314的升降驅動部3141通過水平驅動部3147朝向卸載板3127移動而將料盒MZ安放於卸載板3127（圖11）。然後，可以是，為了針對下一個料盒MZ進行工作，升降驅動部3141在水平方向（-x方向）上後退（圖12），手持單元3143下降到裝載板3121周邊（圖13）。If the release film 400 is all stored in the magazine MZ ( FIG. 10 ) clamped by the upper clamp 3145A and the lower clamp 3145B, the lifting drive part 3141 of the magazine lifting unit 314 moves toward the unloading plate 3127 by the horizontal drive part 3147 to move the The magazine MZ is placed on the unloading plate 3127 (Fig. 11). Then, in order to work on the next magazine MZ, the lift drive unit 3141 may retreat in the horizontal direction (-x direction) ( FIG. 12 ), and the handheld unit 3143 may descend to the periphery of the loading plate 3121 ( FIG. 13 ).

圖14示出了根據本發明的膜結合模組30的膜搬動模組320。FIG. 14 shows the membrane handling module 320 of the membrane bonding module 30 according to the present invention.

根據本發明的實施例，膜搬動模組320包括引導離型膜400的移動路徑的膜導向單元324以及夾持離型膜400並使其沿著移動路徑移動的膜輸送單元322。According to an embodiment of the present invention, the film moving module 320 includes a film guide unit 324 that guides the moving path of the release film 400 and a film conveying unit 322 that clamps the release film 400 and moves it along the moving path.

根據本發明的實施例，膜導向單元324可以包括構成為能夠在彼此相反方向上移動的一對導軌部件3241。導軌部件3241可以通過導軌驅動單元3243沿著x方向移動。在導軌部件3241中構成有掛台3242，從而可以在下方支承離型膜400的側部並提供用於離型膜400的水平方向移動的路徑。According to an embodiment of the present invention, the film guide unit 324 may include a pair of rail members 3241 configured to be movable in opposite directions to each other. The rail part 3241 can be moved along the x direction by the rail driving unit 3243 . The hanging table 3242 is formed in the rail member 3241 so as to support the side part of the release film 400 below and provide a path for the horizontal movement of the release film 400 .

根據本發明的實施例，可以是，當沿著水平方向輸送離型膜400時，一對導軌部件3241在彼此接近的方向上移動而位於導向位置，當離型膜400上升或者下降時，一對導軌部件3241在彼此遠離的方向上移動而位於避讓位置。According to an embodiment of the present invention, it may be that when the release film 400 is conveyed along the horizontal direction, a pair of guide rail parts 3241 move in a direction approaching each other and are positioned at the guide position, and when the release film 400 rises or falls, one The pair rail members 3241 move in directions away from each other to be located at the evacuation position.

根據本發明的實施例，可以是，膜輸送單元322從料盒MZ夾持離型膜400並將其沿著導軌部件3241輸送到上升降位置H1（圖23），膜輸送單元322將附著有半導體封裝體SP的離型膜400從上升降位置H1輸送到料盒MZ。According to an embodiment of the present invention, it may be that the film delivery unit 322 clamps the release film 400 from the magazine MZ and transports it to the upper lifting position H1 ( FIG. The release film 400 of the semiconductor package SP is transported from the upper lifting position H1 to the magazine MZ.

參照圖14，膜輸送單元322包括可以夾持離型膜400的夾具3221、設置夾具3221的輸送塊3223、使輸送塊3223沿著水平方向（y方向）移動的輸送塊水平驅動部3225以及引導輸送塊3223的移動的輸送塊導向部件3227。Referring to FIG. 14 , the film conveying unit 322 includes a clamp 3221 that can clamp the release film 400, a conveying block 3223 that sets the clamp 3221, a conveying block horizontal drive portion 3225 that moves the conveying block 3223 along the horizontal direction (y direction), and a guide The transport block guide part 3227 for the movement of the transport block 3223.

圖15至圖20示出了離型膜400從料盒MZ被輸送到膜升降區域P1的過程。15 to 20 show the process in which the release film 400 is conveyed from the magazine MZ to the film lifting area P1.

首先，若料盒MZ通過料盒升降單元314位於膜搬動模組320的周邊（圖15），則離型膜400通過推動器單元316被推出到膜搬動模組320的周邊（圖16）。膜輸送單元322的夾具3221夾持離型膜400（圖17），膜輸送單元322沿著導軌部件3241使離型膜400移動到膜升降區域P1（圖18）。若離型膜400位於膜升降區域P1，並通過膜升降模組330吸附離型膜400，則膜輸送單元322的夾具3221放置離型膜400並移動到初始位置（圖19），一對導軌部件3241可以在彼此遠離的方向上移動而防止離型膜400升降時的干擾（圖20）。First, if the magazine MZ is positioned at the periphery of the film moving module 320 by the magazine lifting unit 314 (Fig. 15), the release film 400 is pushed out to the periphery of the film moving module 320 by the pusher unit 316 (Fig. 16 ). The gripper 3221 of the film conveying unit 322 clamps the release film 400 ( FIG. 17 ), and the film conveying unit 322 moves the release film 400 to the film lifting area P1 ( FIG. 18 ) along the rail member 3241 . If the release film 400 is located in the film lifting area P1, and the release film 400 is adsorbed by the film lifting module 330, the clamp 3221 of the film delivery unit 322 places the release film 400 and moves to the initial position (Figure 19), a pair of guide rails The parts 3241 can move in directions away from each other to prevent interference when the release film 400 is raised and lowered ( FIG. 20 ).

圖21以及圖22示出了根據本發明的膜結合模組30的膜升降模組330。Fig. 21 and Fig. 22 show the film lifting module 330 of the film combining module 30 according to the present invention.

根據本發明的實施例，膜升降模組330可以包括具有一定的面積並構成為在膜升降區域P1的下升降位置H2和上升降位置H1之間進行升降的升降主體332以及形成在升降主體332的上方的複數個真空吸附單元334。可以是，升降主體332構成為通過升降驅動部336上升或者下降，真空吸附單元334吸附固定離型膜400。According to an embodiment of the present invention, the film lifting module 330 may include a lifting body 332 having a certain area and configured to lift between the lower lifting position H2 and the upper lifting position H1 of the film lifting area P1, and a lifting body 332 formed on the lifting body 332. A plurality of vacuum adsorption units 334 above. It may be that the lifting body 332 is configured to be lifted or lowered by the lifting driving part 336 , and the vacuum suction unit 334 is suctioned and fixed to the release film 400 .

根據本發明的實施例，真空吸附單元334可以在升降主體332中設置於與形成於夾具托盤500的貫通孔530相對應的位置而構成為穿過夾具托盤500的貫通孔530。According to an embodiment of the present invention, the vacuum suction unit 334 may be disposed in a position corresponding to the through hole 530 formed in the jig tray 500 in the lifting body 332 to pass through the through hole 530 of the jig tray 500 .

根據本發明的實施例，可以是，若離型膜400位於膜升降區域P1，則膜升降模組330上升到膜升降區域P1的上升降位置H1而吸附離型膜400，並在吸附離型膜400的狀態下從上升降位置H1下降到下升降位置H2而使離型膜400和夾具托盤500結合。According to an embodiment of the present invention, if the release film 400 is located in the film lift area P1, the film lift module 330 rises to the upper lift position H1 of the film lift area P1 to absorb the release film 400, and then absorb the release film 400. The film 400 is lowered from the upper lift position H1 to the lower lift position H2 to combine the release film 400 and the clamp tray 500 .

圖23至圖27示出了在膜升降區域P1中將離型膜400結合於夾具托盤500的過程。23 to 27 illustrate the process of bonding the release film 400 to the jig tray 500 in the film lifting area P1.

離型膜400通過膜搬動模組320的膜輸送單元322從料盒MZ被輸送到膜升降區域P1，此時，上方離型膜400通過導軌部件3241支承而位於上升降位置H1（圖23的（a）以及（b））。然後，膜升降模組330的升降主體332上升而真空吸附單元334吸附離型膜400（圖24的（a）以及（b）），升降主體332進一步上升而使離型膜400上升到高於上升降位置H1的位置（圖25的（a）以及（b））。然後，導軌部件3241在彼此遠離的方向上移動，以使得離型膜400下降時不發生干擾，升降主體332下降而使離型膜400位於下升降位置H2（圖26的（a）以及（b））。此時，離型膜400可以結合於夾具托盤500的托盤槽部520，並通過升降主體332的進一步下降而避免夾具托盤500水平移動時的干擾（圖27的（a）以及（b））。The release film 400 is transported from the magazine MZ to the film lifting area P1 by the film delivery unit 322 of the film moving module 320. At this time, the release film 400 above is supported by the guide rail member 3241 and is positioned at the upper lifting position H1 (Fig. 23 (a) and (b)). Then, the lifting main body 332 of the film lifting module 330 rises and the vacuum suction unit 334 absorbs the release film 400 ((a) and (b) of FIG. 24 ), and the lifting main body 332 rises further to make the release film 400 rise above The position of the up-and-down position H1 ((a) and (b) of FIG. 25 ). Then, the guide rail parts 3241 move in a direction away from each other, so that no interference occurs when the release film 400 descends, and the lifting main body 332 descends so that the release film 400 is positioned at the lower lifting position H2 ((a) and (b) of FIG. 26 )). At this time, the release film 400 can be combined with the tray groove 520 of the jig tray 500 , and the interference when the jig tray 500 moves horizontally can be avoided by further descending of the lifting body 332 ( FIG. 27 ( a ) and ( b )).

圖28示出了根據本發明的膜結合模組30的輸送器模組340。Figure 28 shows the conveyor module 340 of the film bonding module 30 according to the present invention.

可以是，輸送器模組340將夾具托盤500沿著水平方向（x方向）輸送，並將結合有離型膜400的夾具托盤500從膜升降區域P1輸送到托盤拾取區域P2或者將夾具托盤500從托盤拾取區域P2輸送到膜升降區域P1。It may be that the conveyor module 340 transports the jig tray 500 along the horizontal direction (x direction), and transports the jig tray 500 combined with the release film 400 from the film lifting area P1 to the tray picking area P2 or transfers the jig tray 500 Conveying from the pallet picking area P2 to the film lifting area P1.

輸送器模組340可以包括沿著水平方向（x方向）延伸的輸送器本體342以及使夾具托盤500沿著水平方向（x方向）移動的輸送器皮帶344。The conveyor module 340 may include a conveyor body 342 extending in the horizontal direction (x direction) and a conveyor belt 344 moving the jig tray 500 in the horizontal direction (x direction).

圖29至圖30示出了夾具托盤500在膜結合模組30的輸送器模組340中從膜升降區域P1輸送到托盤拾取區域P2的過程。29 to 30 illustrate the process of conveying the jig tray 500 from the film lifting area P1 to the tray picking area P2 in the conveyor module 340 of the film bonding module 30 .

若離型膜400通過膜升降模組330位於膜升降區域P1的下升降位置H2，則離型膜400結合於夾具托盤500（圖29），結合有離型膜400的夾具托盤500通過輸送器模組340移動到托盤拾取區域P2（圖30）。然後，托盤拾取器226在拾取結合有離型膜400的夾具托盤500之後將其輸送到托盤輸送部220，以使得半導體封裝體SP被附著於離型膜400。If the release film 400 is located at the lower lifting position H2 of the film lifting area P1 through the film lifting module 330, the release film 400 is combined with the fixture tray 500 (Figure 29), and the fixture tray 500 combined with the release film 400 passes through the conveyor Module 340 moves to pallet picking area P2 (FIG. 30). Then, the tray picker 226 transports the jig tray 500 bonded with the release film 400 to the tray transfer part 220 after picking up the jig tray 500 , so that the semiconductor package SP is attached to the release film 400 .

若完成了半導體封裝體SP在離型膜400的附著，則托盤拾取器226拾取結合有離型膜400的夾具托盤500並將其輸送到托盤拾取區域P2。When the attachment of the semiconductor package SP to the release film 400 is completed, the tray picker 226 picks up the jig tray 500 combined with the release film 400 and transports it to the tray pick-up area P2.

圖31至圖32示出了在膜結合模組30的輸送器模組340中夾具托盤500輸送到膜升降區域P1的過程。夾具托盤500通過托盤拾取器226輸送到托盤拾取區域P2（圖31），夾具托盤500通過輸送器模組340從托盤拾取區域P2輸送到膜升降區域P1（圖32）。在這裡，離型膜400通過膜升降模組330從夾具托盤500分離。31 to 32 illustrate the process of conveying the jig tray 500 to the film lifting area P1 in the conveyor module 340 of the film bonding module 30 . The jig tray 500 is transported to the tray picking area P2 by the tray picker 226 ( FIG. 31 ), and the jig tray 500 is transported from the tray picking area P2 to the film lifting area P1 by the conveyor module 340 ( FIG. 32 ). Here, the release film 400 is separated from the jig tray 500 by the film lifting module 330 .

根據本發明的實施例，可以是，若結合有附著有半導體封裝體SP的離型膜400的夾具托盤500位於膜升降區域P1的下升降位置H2，則膜升降模組330上升到上升降位置H1而從夾具托盤500分離離型膜400，若在上升降位置H1通過導軌部件3241支承離型膜400，則膜升降模組330解除真空吸附並下降到下升降位置H2。According to an embodiment of the present invention, if the clamp tray 500 combined with the release film 400 attached with the semiconductor package SP is located at the lower lifting position H2 of the film lifting area P1, the film lifting module 330 rises to the upper lifting position H1 separates the release film 400 from the clamp tray 500. If the release film 400 is supported by the rail member 3241 at the upper lifting position H1, the film lifting module 330 releases the vacuum suction and descends to the lower lifting position H2.

圖33至圖37示出了在膜結合模組30的膜升降模組330中從夾具托盤500分離離型膜400的過程。夾具托盤500通過輸送器模組340位於膜升降區域P1的下升降位置H2（圖33），膜升降模組330的升降主體332上升而真空吸附單元334接觸於離型膜400的下方（圖34）。若通過真空吸附單元334吸附離型膜400，則升降主體332上升而離型膜400從夾具托盤500分離（圖35）。在這裡，離型膜400位於高於上升降位置H1的位置，一對導軌部件3241移動到彼此接近的位置，然後升降主體332下降，以使得離型膜400被安放於導軌部件3241的上方（圖36）。此時，離型膜400位於上升降位置H1。若離型膜400被安放於導軌部件3241的上方，則真空吸附單元334解除針對離型膜400的吸附，升降主體332下降（圖37）。33 to 37 illustrate the process of separating the release film 400 from the jig tray 500 in the film lifting module 330 of the film bonding module 30 . The fixture tray 500 is located at the lower lifting position H2 of the film lifting area P1 through the conveyor module 340 (Fig. 33), the lifting body 332 of the film lifting module 330 rises and the vacuum adsorption unit 334 contacts the lower part of the release film 400 (Fig. 34 ). When the release film 400 is sucked by the vacuum suction unit 334 , the elevating main body 332 rises and the release film 400 is separated from the jig tray 500 ( FIG. 35 ). Here, the release film 400 is located at a position higher than the upper lifting position H1, a pair of guide rail parts 3241 move to a position close to each other, and then the lifting main body 332 descends, so that the release film 400 is placed on the top of the guide rail parts 3241 ( Figure 36). At this time, the release film 400 is located at the upper lifting position H1. If the release film 400 is placed above the rail member 3241 , the vacuum suction unit 334 releases the suction on the release film 400 , and the lifting body 332 descends ( FIG. 37 ).

圖38至圖42示出了在膜結合模組30的膜搬動模組320中離型膜400被裝載於料盒MZ的過程。38 to 42 show a process in which the release film 400 is loaded on the magazine MZ in the film transfer module 320 of the film bonding module 30 .

若離型膜400通過膜升降模組330位於膜升降區域P1的上升降位置H1（圖38），則一對導軌部件3241移動到彼此接近的位置而在下方支承離型膜400（圖39）。然後，膜搬動模組320的夾具3221可以夾持離型膜400（圖40），並將離型膜400插入於料盒MZ（圖41、圖42）。If the release film 400 is located at the upper lifting position H1 of the film lifting area P1 by the film lifting module 330 (Figure 38), the pair of guide rail members 3241 move to a position close to each other to support the release film 400 below (Figure 39) . Then, the jig 3221 of the film transfer module 320 can clamp the release film 400 ( FIG. 40 ), and insert the release film 400 into the magazine MZ ( FIGS. 41 and 42 ).

圖43至圖44示出了裝載有離型膜400的料盒MZ被輸送到料盒裝載單元312的過程。43 to 44 show a process in which the magazine MZ loaded with the release film 400 is conveyed to the magazine loading unit 312 .

若離型膜400全部被裝載於料盒MZ的各槽，則料盒升降單元314在水平方向（x方向）上移動而使料盒MZ位於料盒裝載單元312的卸載板3127（圖43）。並且，料盒升降單元314可以後退，為了針對下一個料盒MZ進行工作，從裝載板3121收取料盒MZ（圖44）。If the release film 400 is all loaded in each groove of the magazine MZ, the magazine lifting unit 314 moves in the horizontal direction (x direction) so that the magazine MZ is located on the unloading plate 3127 of the magazine loading unit 312 ( FIG. 43 ) . In addition, the magazine elevating unit 314 can move backward, and collect the magazine MZ from the loading plate 3121 in order to work on the next magazine MZ ( FIG. 44 ).

圖45示出了本發明的另一實施例的半導體條帶切割以及分類裝備1的概要構成。FIG. 45 shows a schematic configuration of semiconductor strip cutting and sorting equipment 1 according to another embodiment of the present invention.

參照圖45，根據本發明的膜結合模組30可以構成在半導體條帶切割以及分類裝備1的內部。根據本實施例，可以是，離型膜400以結合於夾具托盤500的狀態提供到晶片拾取器218的周邊，半導體封裝體SP通過晶片拾取器218附著於離型膜400，若所有半導體封裝體SP附著於離型膜400，則離型膜400重新返回到膜結合模組30。Referring to FIG. 45 , the film bonding module 30 according to the present invention can be constructed inside the semiconductor strip cutting and sorting equipment 1 . According to this embodiment, it may be that the release film 400 is provided to the periphery of the wafer picker 218 in a state of being bonded to the jig tray 500, and the semiconductor package SP is attached to the release film 400 by the wafer picker 218. If all semiconductor packages The SP is attached to the release film 400 , and the release film 400 returns to the membrane bonding module 30 again.

離型膜400以裝載在料盒MZ的狀態提供到料盒裝載單元312，並在被料盒升降單元314夾持的狀態下通過推動器單元316從料盒裝載單元312提供到膜搬動模組320。The release film 400 is provided to the magazine loading unit 312 in the state of being loaded in the magazine MZ, and is provided to the film moving mold from the magazine loading unit 312 by the pusher unit 316 in the state held by the magazine lifting unit 314. Group 320.

根據本發明的實施例，膜搬動模組320包括引導離型膜400的移動路徑的膜導向單元324以及夾持離型膜400並使其沿著移動路徑移動的膜輸送單元322。According to an embodiment of the present invention, the film moving module 320 includes a film guide unit 324 that guides the moving path of the release film 400 and a film conveying unit 322 that clamps the release film 400 and moves it along the moving path.

根據本發明的實施例，膜導向單元324可以包括構成為能夠在彼此相反方向上移動的一對導軌部件3241。導軌部件3241可以通過導軌驅動單元3243沿著x方向移動。在導軌部件3241中構成有掛台3242，從而可以在下方支承離型膜400的側部並提供用於離型膜400的水平方向移動的路徑。According to an embodiment of the present invention, the film guide unit 324 may include a pair of rail members 3241 configured to be movable in opposite directions to each other. The rail part 3241 can be moved along the x direction by the rail driving unit 3243 . The hanging table 3242 is formed in the rail member 3241 so as to support the side part of the release film 400 below and provide a path for the horizontal movement of the release film 400 .

根據本發明的實施例，可以是，當沿著水平方向輸送離型膜400時，一對導軌部件3241在彼此接近的方向上移動而位於導向位置，當離型膜400上升或者下降時，一對導軌部件3241在彼此遠離的方向上移動而位於避讓位置。According to an embodiment of the present invention, it may be that when the release film 400 is conveyed along the horizontal direction, a pair of guide rail parts 3241 move in a direction approaching each other and are positioned at the guide position, and when the release film 400 rises or falls, one The pair rail members 3241 move in directions away from each other to be located at the evacuation position.

根據本發明的實施例，可以是，膜輸送單元322從料盒MZ夾持離型膜400並將其沿著導軌部件3241輸送到膜升降區域P3，膜輸送單元322將附著有半導體封裝體SP的離型膜400從膜升降區域P3輸送到料盒MZ。According to an embodiment of the present invention, it may be that the film conveying unit 322 clamps the release film 400 from the magazine MZ and conveys it to the film lifting area P3 along the rail member 3241, and the film conveying unit 322 will be attached with the semiconductor package SP The release film 400 is transported from the film lifting area P3 to the magazine MZ.

膜輸送單元322包括可以夾持離型膜400的夾具3221、設置夾具3221的輸送塊3223、使輸送塊3223沿著水平方向（y方向）移動的輸送塊水平驅動部3225以及引導輸送塊3223的移動的輸送塊導向部件3227。The film transport unit 322 includes a jig 3221 capable of holding the release film 400 , a transport block 3223 for setting the jig 3221 , a transport block horizontal driving part 3225 for moving the transport block 3223 in the horizontal direction (y direction), and a mechanism for guiding the transport block 3223 . Moving delivery block guide member 3227.

若料盒MZ通過料盒升降單元314位於膜搬動模組320的周邊，則離型膜400通過推動器單元316被推出到膜搬動模組320的周邊。膜輸送單元322的夾具3221夾持離型膜400，膜輸送單元322沿著導軌部件3241使離型膜400移動到膜升降區域P3。若離型膜400位於膜升降區域P3，並通過膜升降模組330吸附離型膜400，則膜輸送單元322的夾具3221放置離型膜400並移動到初始位置，一對導軌部件3241可以在彼此遠離的方向上移動而防止離型膜400升降時的干擾。If the magazine MZ is positioned at the periphery of the film moving module 320 through the magazine lifting unit 314 , the release film 400 is pushed out to the periphery of the film moving module 320 through the pusher unit 316 . The gripper 3221 of the film conveying unit 322 holds the release film 400, and the film conveying unit 322 moves the release film 400 to the film lifting area P3 along the rail member 3241. If the release film 400 is located in the film lifting area P3, and the release film 400 is adsorbed by the film lifting module 330, the clamp 3221 of the film delivery unit 322 places the release film 400 and moves to the initial position, and a pair of guide rail parts 3241 can be placed in the initial position. Move in directions away from each other to prevent interference when the release film 400 is raised and lowered.

根據本發明的實施例，可以是，若離型膜400位於膜升降區域P3，則膜升降模組330上升到膜升降區域P3的上升降位置H1而吸附離型膜400，並在吸附離型膜400的狀態下從上升降位置H1下降到下升降位置H2而結合離型膜400和夾具托盤500。According to an embodiment of the present invention, if the release film 400 is located in the film lift area P3, the film lift module 330 rises to the upper lift position H1 of the film lift area P3 to absorb the release film 400, and then absorb the release film 400. The film 400 is lowered from the upper lift position H1 to the lower lift position H2 to combine the release film 400 and the clamp tray 500 .

離型膜400通過膜搬動模組320的膜輸送單元322從料盒MZ被輸送到膜升降區域P3，此時，離型膜400被導軌部件3241支承而位於上升降位置H1。然後，膜升降模組330的升降主體332上升而真空吸附單元334吸附離型膜400，升降主體332進一步上升而使離型膜400上升到高於上升降位置H1的位置。然後，導軌部件3241在彼此遠離的方向上移動，以使得離型膜400下降時不發生干擾，升降主體332下降而使離型膜400位於下升降位置H2。此時，離型膜400可以結合於夾具托盤500的托盤槽部520，並通過升降主體332的進一步下降而避免夾具托盤500水平移動時的干擾。The release film 400 is transported from the magazine MZ to the film lifting area P3 by the film delivery unit 322 of the film moving module 320. At this time, the release film 400 is supported by the guide rail member 3241 and is located at the upper lifting position H1. Then, the lifting body 332 of the film lifting module 330 rises, the vacuum suction unit 334 absorbs the release film 400, and the lifting body 332 further rises to make the release film 400 rise to a position higher than the upper lifting position H1. Then, the rail members 3241 move in directions away from each other so that no interference occurs when the release film 400 descends, and the lifting body 332 descends so that the release film 400 is located at the lower lifting position H2. At this time, the release film 400 can be combined with the tray groove 520 of the jig tray 500 , and the interference when the jig tray 500 moves horizontally can be avoided by further descending of the lifting body 332 .

可以是，輸送器模組340將夾具托盤500沿著水平方向（x方向）輸送，並將結合有離型膜400的夾具托盤500從膜升降區域P3輸送到晶片拾取區域P4或者將夾具托盤500從晶片拾取區域P4輸送到膜升降區域P3。It may be that the conveyor module 340 transports the jig tray 500 along the horizontal direction (x direction), and transports the jig tray 500 combined with the release film 400 from the film lifting area P3 to the wafer picking area P4 or transfers the jig tray 500 to the wafer pick-up area P4. It is transported from the wafer pickup area P4 to the film lift area P3.

輸送器模組340可以包括沿著水平方向（x方向）延伸的輸送器本體342以及使夾具托盤500沿著水平方向（x方向）移動的輸送器皮帶344。The conveyor module 340 may include a conveyor body 342 extending in the horizontal direction (x direction) and a conveyor belt 344 moving the jig tray 500 in the horizontal direction (x direction).

若離型膜400通過膜升降模組330位於膜升降區域P3的下升降位置H2，則離型膜400結合於夾具托盤500，結合有離型膜400的夾具托盤500通過輸送器模組340移動到晶片拾取區域P4。然後，晶片拾取器218可以將半導體封裝體SP附著於離型膜400的上方。If the release film 400 is positioned at the lower lifting position H2 of the film lift area P3 through the film lifting module 330, the release film 400 is combined with the fixture tray 500, and the fixture tray 500 combined with the release film 400 moves through the conveyor module 340 to wafer pickup area P4. Then, the die picker 218 may attach the semiconductor package SP over the release film 400 .

若完成了半導體封裝體SP在離型膜400的附著，則結合有離型膜400的夾具托盤500通過輸送器模組340被輸送到膜升降區域P3。根據本發明的實施例，若結合有附著有半導體封裝體SP的離型膜400的夾具托盤500位於膜升降區域P3的下升降位置H2，則膜升降模組330上升到上升降位置H1而從夾具托盤500分離離型膜400，若在上升降位置H1通過導軌部件3241支承離型膜400，則膜升降模組330解除真空吸附並下降到下升降位置H2。When the attachment of the semiconductor package SP to the release film 400 is completed, the jig tray 500 combined with the release film 400 is transported to the film lifting area P3 by the conveyor module 340 . According to an embodiment of the present invention, if the clamp tray 500 combined with the release film 400 attached to the semiconductor package SP is located at the lower lifting position H2 of the film lifting area P3, the film lifting module 330 rises to the upper lifting position H1 and from The clamp tray 500 separates the release film 400, and if the release film 400 is supported by the guide rail member 3241 at the upper lifting position H1, the film lifting module 330 releases the vacuum suction and descends to the lower lifting position H2.

夾具托盤500通過輸送器模組340位於膜升降區域P3的下升降位置H2，膜升降模組330的升降主體332上升而真空吸附單元334接觸於離型膜400的下方。若通過真空吸附單元334吸附離型膜400，則升降主體332上升而離型膜400從夾具托盤500分離。在這裡，離型膜400位於高於上升降位置H1的位置，一對導軌部件3241移動到彼此接近的位置，然後升降主體332下降，以使得離型膜400被安放於導軌部件3241的上方。此時，離型膜400位於上升降位置H1。若離型膜400被安放於導軌部件3241的上方，則真空吸附單元334解除針對離型膜400的吸附，升降主體332下降。The fixture tray 500 is located at the lower lifting position H2 of the film lifting area P3 by the conveyor module 340 , the lifting body 332 of the film lifting module 330 rises and the vacuum adsorption unit 334 contacts the bottom of the release film 400 . When the release film 400 is sucked by the vacuum suction unit 334 , the elevating main body 332 rises and the release film 400 is separated from the clamp tray 500 . Here, the release film 400 is positioned higher than the upper lifting position H1, a pair of guide rail parts 3241 move to a position close to each other, and then the lifting body 332 descends, so that the release film 400 is placed on the top of the guide rail parts 3241. At this time, the release film 400 is located at the upper lifting position H1. If the release film 400 is placed above the rail member 3241 , the vacuum suction unit 334 releases the suction on the release film 400 , and the lifting body 332 descends.

若離型膜400通過膜升降模組330位於膜升降區域P3的上升降位置H1，則一對導軌部件3241移動到彼此接近的位置而在下方支承離型膜400。然後，膜搬動模組320的夾具3221可以夾持離型膜400，並將離型膜400插入於料盒MZ。If the release film 400 is located at the upper lift position H1 of the film lift area P3 by the film lifting module 330, the pair of rail members 3241 move to a position close to each other to support the release film 400 below. Then, the clamp 3221 of the film moving module 320 can clamp the release film 400 and insert the release film 400 into the magazine MZ.

若離型膜400全部被裝載於料盒MZ的各槽，則料盒升降單元314在水平方向（x方向）上移動而使料盒MZ位於料盒裝載單元312的卸載板3127。並且，料盒升降單元314可以後退，為了針對下一個料盒MZ進行工作，從裝載板3121收取料盒MZ。When all the release film 400 is loaded in each groove of the magazine MZ, the magazine lifting unit 314 moves in the horizontal direction (x direction) so that the magazine MZ is located on the unloading plate 3127 of the magazine loading unit 312 . In addition, the magazine elevating unit 314 can move backward, and collect the magazine MZ from the loading plate 3121 in order to work on the next magazine MZ.

本實施例以及本說明書中所附的圖式只不過明確表示包括在本發明中的技術構思的一部分，顯而易見的是，由本領域技術人員能夠在包括在本發明的說明書以及圖式中的技術構思的範疇內容易導出的變形例和具體實施例均包括在本發明的範疇中。This embodiment and the accompanying drawings in this specification only clearly represent a part of the technical concept included in the present invention. It is obvious that those skilled in the art can understand the technical concept included in the specification and drawings of the present invention. Modifications and specific examples that can be easily derived within the scope of the invention are included in the scope of the present invention.

因此，本發明的構思不應局限於所說明的實施例，不僅是所附的申請專利範圍，與其申請專利範圍等同或均等變形的所有構思屬於本發明構思的範疇。Therefore, the concept of the present invention should not be limited to the illustrated embodiments, not only the appended scope of patent application, but all concepts that are equal to or equally modified from the scope of the patent application belong to the scope of the concept of the present invention.

1:半導體條帶切割以及分類裝備 5:裝載單元 10:切割單元 102:料盒裝載器 104:入口軌道 106:條帶拾取器 108:卡盤台 110:切削模組 112:單元拾取器 114:清洗單元 116:緩衝台 118:緩衝拾取器 120:水平導向部件 20:分類單元 202:翻轉台 204:托盤台 206:工作台驅動部 208:球體視覺檢查部 210:標記視覺檢查部 212:上門架 214:對準視覺檢查部 216:水平導向部件 218:晶片拾取器 220:托盤輸送部 222:第一水平導向部件 224:第二水平導向部件 226:托盤拾取器 228:良品托盤保管部 230:重工托盤保管部 232:托盤裝載器 30:膜結合模組 310:料盒裝載器模組 311:底板 312:料盒裝載單元 3121:裝載板 3123:輸送器 3125:設置結構物 3127:卸載板 3127A:切開部 314:料盒升降單元 3141:升降驅動部 3143:手持單元 3145A:上夾具 3145B:下夾具 3147:水平驅動部 316:推動器單元 3161:升降驅動部 3163:水平驅動部 3165:推動桿 320:膜搬動模組 322:膜輸送單元 3221:夾具 3223:輸送塊 3225:輸送塊水平驅動部 3227:輸送塊導向部件 324:膜導向單元 3241:導軌部件 3242:掛台 3243:導軌驅動單元 330:膜升降模組 332:升降主體 334:真空吸附單元 336:升降驅動部 340:輸送器模組 342:輸送器本體 344:輸送器皮帶 400:離型膜 410:框架 500:夾具托盤 510:托盤主體 515:夾持部 520:托盤槽部 530:貫通孔 H1:上升降位置 H2:下升降位置 MZ:料盒 MZ1:條帶料盒 P1、P3:膜升降區域 P2:托盤拾取區域 P4:晶片拾取區域 S:半導體條帶 SP:半導體封裝體 1: Semiconductor strip cutting and sorting equipment 5: Loading unit 10: Cutting unit 102: Cartridge loader 104: Entry track 106: Strip picker 108: chuck table 110: Cutting module 112: Unit Picker 114: cleaning unit 116: buffer table 118: buffer picker 120: Horizontal guide parts 20: Taxa 202: Flip table 204: tray table 206:Workbench driving department 208: Sphere Visual Inspection Department 210: Mark Visual Inspection Department 212: upper door frame 214: Alignment Visual Inspection Department 216: Horizontal guide parts 218: Wafer picker 220: Pallet conveying department 222: the first horizontal guide component 224: the second horizontal guide component 226: Pallet picker 228: Good product tray storage department 230: Heavy Industry Pallet Storage Department 232: Pallet loader 30:Membrane binding module 310: Cartridge Loader Module 311: Bottom plate 312: Cartridge loading unit 3121: Loading plate 3123: Conveyor 3125: set the structure 3127:Unload board 3127A: incision part 314:Material box lifting unit 3141: Lifting drive unit 3143: handheld unit 3145A: upper fixture 3145B: lower fixture 3147: Horizontal drive unit 316:Pusher unit 3161: Lifting drive unit 3163: Horizontal drive unit 3165: push rod 320: Membrane moving module 322: Membrane delivery unit 3221: Fixture 3223: transport block 3225: Conveyor block horizontal drive unit 3227: Conveyor Block Guide Parts 324: Membrane guiding unit 3241: rail parts 3242: hanging table 3243: rail drive unit 330: Membrane lifting module 332: lifting main body 334: vacuum adsorption unit 336: Lifting drive unit 340: Conveyor Module 342: Conveyor body 344: Conveyor belt 400: release film 410: frame 500: Fixture tray 510: Tray body 515: clamping part 520: tray groove 530: through hole H1: Up and down position H2: Down lift position MZ:Material box MZ1: Tape box P1, P3: Membrane lifting area P2: Pallet picking area P4: Wafer pick-up area S: Semiconductor strip SP: semiconductor package

圖1示出了能夠適用本發明的半導體條帶切割以及分類裝備的概要構成。FIG. 1 shows a schematic configuration of semiconductor strip cutting and sorting equipment to which the present invention can be applied.

圖2A以及圖2B示出了根據本發明的離型膜以及收納離型膜的料盒。Fig. 2A and Fig. 2B show the release film and the magazine for storing the release film according to the present invention.

圖3A以及圖3B示出了根據本發明的夾具托盤以及附著有離型膜的夾具托盤。3A and 3B illustrate a jig tray and a jig tray with a release film attached thereto according to the present invention.

圖4示出了在根據本發明的半導體條帶切割以及分類裝備中膜結合模組結合於分類單元的過程。FIG. 4 shows the process of combining the film binding module with the sorting unit in the semiconductor strip cutting and sorting equipment according to the present invention.

圖5示出了在根據本發明的半導體條帶切割以及分類裝備中結合於分類單元的膜結合模組的概要結構。FIG. 5 shows a schematic structure of a film binding module combined with a sorting unit in the semiconductor strip cutting and sorting equipment according to the present invention.

圖6示出了根據本發明的膜結合模組的料盒裝載器模組。Figure 6 shows a cartridge loader module of a film bonding module according to the invention.

圖7至圖13示出了從料盒投入離型膜的過程。Figures 7 to 13 show the process of dropping the release film from the magazine.

圖14示出了根據本發明的膜結合模組的膜搬動模組。Fig. 14 shows a membrane handling module of a membrane bonding module according to the present invention.

圖15至圖20示出了將離型膜從料盒向膜升降區域輸送的過程。Figures 15 to 20 show the process of conveying the release film from the magazine to the film lifting area.

圖21以及圖22示出了根據本發明的膜結合模組的膜升降模組。Fig. 21 and Fig. 22 show the film lifting module of the film combining module according to the present invention.

圖23至圖27示出了在膜升降區域中將離型膜結合於夾具托盤的過程。Figures 23 to 27 illustrate the process of bonding the release film to the clamp tray in the film lift area.

圖28示出了根據本發明的膜結合模組的輸送器模組。Figure 28 shows a conveyor module of a film bonding module according to the present invention.

圖29至圖30示出了在膜結合模組的輸送器模組中夾具托盤被輸送到托盤拾取區域的過程。Figures 29 to 30 illustrate the process in which a pallet of jigs is conveyed to a pallet picking area in the conveyor module of the film bonding module.

圖31至圖32示出了在膜結合模組的輸送器模組中夾具托盤被輸送到膜升降區域的過程。Figures 31 to 32 illustrate the process in which the jig tray is conveyed to the film lifting area in the conveyor module of the film bonding module.

圖33至圖37示出了在膜結合模組的膜升降模組中從夾具托盤分離離型膜的過程。33 to 37 illustrate the process of separating the release film from the jig tray in the film lift module of the film bonding module.

圖38至圖42示出了在膜結合模組的膜搬動模組中離型膜被裝載於料盒的過程。38 to 42 show the process in which the release film is loaded on the magazine in the film moving module of the film bonding module.

圖43至圖44示出了裝載有離型膜的料盒被輸送到料盒裝載單元的過程。43 to 44 illustrate the process in which the magazine loaded with the release film is conveyed to the magazine loading unit.

圖45示出了根據本發明的另一實施例的包括膜結合模組的半導體條帶切割以及分類裝備。FIG. 45 illustrates a semiconductor strip cutting and sorting apparatus including a film bonding module according to another embodiment of the present invention.

1:半導體條帶切割以及分類裝備 1: Semiconductor strip cutting and sorting equipment

5:裝載單元 5: Loading unit

10:切割單元 10: Cutting unit

102:料盒裝載器 102: Cartridge loader

104:入口軌道 104: Entry track

106:條帶拾取器 106: Strip picker

108:卡盤台 108: chuck table

110:切削模組 110: Cutting module

112:單元拾取器 112: Unit Picker

114:清洗單元 114: cleaning unit

116:緩衝台 116: buffer table

118:緩衝拾取器 118: buffer picker

120:水平導向部件 120: Horizontal guide parts

20:分類單元 20: Taxa

202:翻轉台 202: Flip table

204:托盤台 204: tray table

206:工作台驅動部 206:Workbench driving department

208:球體視覺檢查部 208: Sphere Visual Inspection Department

210:標記視覺檢查部 210: Mark Visual Inspection Department

212:上門架 212: upper door frame

214:對準視覺檢查部 214: Alignment Visual Inspection Department

216:水平導向部件 216: Horizontal guide parts

218:晶片拾取器 218: Wafer picker

220:托盤輸送部 220: Pallet conveying department

222:第一水平導向部件 222: the first horizontal guide component

224:第二水平導向部件 224: the second horizontal guide component

226:托盤拾取器 226: Pallet picker

228:良品托盤保管部 228: Good product tray storage department

230:重工托盤保管部 230: Heavy Industry Pallet Storage Department

232:托盤裝載器 232: Pallet loader

30:膜結合模組 30:Membrane binding module

400:離型膜 400: release film

MZ1:條帶料盒 MZ1: Tape box

S:半導體條帶 S: Semiconductor strip

Claims (20)

一種半導體條帶切割以及分類裝備，包括： 裝載單元，供應半導體條帶； 切割單元，切割從該裝載單元供應的該半導體條帶而將該半導體條帶單個化為複數個半導體封裝體； 分類單元，檢查單個化的該等半導體封裝體，並根據檢查結果將該等半導體封裝體分類而粘合於離型膜；以及 膜結合模組，與該分類單元相鄰設置，並將夾具托盤和該離型膜結合而供應於該分類單元，並且分離從該分類單元回收的該夾具托盤和該離型膜。 A semiconductor strip cutting and sorting equipment, comprising: Loading unit, supplying semiconductor strips; a cutting unit that cuts the semiconductor strip supplied from the loading unit to singulate the semiconductor strip into a plurality of semiconductor packages; a sorting unit that inspects the individualized semiconductor packages, and classifies the semiconductor packages according to the inspection results and adheres them to the release film; and The film bonding module is provided adjacent to the sorting unit, supplies the jig tray and the release film in combination with the sorting unit, and separates the jig tray and the release film recovered from the sorting unit. 如請求項1之半導體條帶切割以及分類裝備，其中， 該膜結合模組收取裝載有該離型膜的料盒，從而將該離型膜結合於該夾具托盤並供應於該分類單元， 該膜結合模組從該夾具托盤分離粘合有該等半導體封裝體的該離型膜而裝載於該料盒， 該膜結合模組排出裝載有粘合有該等半導體封裝體的該離型膜的該料盒。 Such as the semiconductor strip cutting and sorting equipment of claim 1, wherein, The film combination module receives the magazine loaded with the release film, so that the release film is combined with the clamp tray and supplied to the sorting unit, The film bonding module is separated from the jig tray and loaded on the magazine with the release film bonded with the semiconductor packages, The film combining module discharges the magazine loaded with the release film bonded with the semiconductor packages. 如請求項1之半導體條帶切割以及分類裝備，其中， 具有磁性的框架附著於該離型膜的外圍部， 該框架和該夾具托盤構成為通過磁力結合。 Such as the semiconductor strip cutting and sorting equipment of claim 1, wherein, A magnetic frame is attached to the peripheral portion of the release film, The frame and the jig tray are configured to be magnetically coupled. 如請求項1之半導體條帶切割以及分類裝備，其中， 該分類單元包括： 晶片拾取器，沿著第一水平方向移動，並從托盤台拾取半導體封裝體，並根據檢查結果將該等半導體封裝體附著於該離型膜； 托盤輸送部，沿著與該第一水平方向垂直的第二水平方向移動，並輸送結合有該離型膜的夾具托盤； 托盤拾取器，在上方拾取該夾具托盤並輸送該夾具托盤；以及 托盤裝載器，保管該夾具托盤。 Such as the semiconductor strip cutting and sorting equipment of claim 1, wherein, This taxon includes: a wafer picker, moving along the first horizontal direction, and picking up the semiconductor packages from the tray table, and attaching the semiconductor packages to the release film according to the inspection result; The tray conveying part moves along the second horizontal direction perpendicular to the first horizontal direction, and conveys the clamp tray combined with the release film; a pallet picker that picks up the jig pallet above and delivers the jig pallet; and A pallet loader that holds the fixture pallet. 如請求項4之半導體條帶切割以及分類裝備，其中， 該膜結合模組設置於該托盤拾取器的移動路徑。 Such as the semiconductor strip cutting and sorting equipment of claim 4, wherein, The film bonding module is arranged on the moving path of the tray picker. 如請求項4之半導體條帶切割以及分類裝備，其中， 該托盤拾取器將與附著有該等半導體封裝體的該離型膜結合的該夾具托盤從該托盤輸送部輸送到該托盤裝載器， 該托盤拾取器在該膜結合模組中將其它夾具托盤從該膜結合模組輸送到該托盤輸送部， 該托盤拾取器將該夾具托盤從該托盤裝載器輸送到該膜結合模組。 Such as the semiconductor strip cutting and sorting equipment of claim 4, wherein, The tray picker transports the jig tray combined with the release film to which the semiconductor packages are attached from the tray transport section to the tray loader, the tray picker transports other jig trays from the film bonding module to the tray transport in the film bonding module, The tray picker delivers the jig tray from the tray loader to the film bonding module. 一種膜結合模組，設置於半導體條帶切割以及分類裝備的分類單元，並將夾具托盤和離型膜結合而供應於該分類單元，並且分離從該分類單元回收的該夾具托盤和該離型膜，其中， 該膜結合模組包括： 料盒裝載器模組，被投入容納該離型膜的料盒； 膜搬動模組，從該料盒取出該離型膜並將該離型膜投入到該料盒； 膜升降模組，通過以吸附該離型膜的狀態進行升降而使該離型膜和該夾具托盤附著或者分離；以及 輸送器模組，搬送附著有該離型膜的該夾具托盤。 A film bonding module, which is installed in a sorting unit of semiconductor strip cutting and sorting equipment, combines a jig tray and a release film to the sorting unit, and separates the jig tray and the release film recovered from the sorting unit film, of which The membrane binding module includes: The cartridge loader module is put into the cartridge containing the release film; The film moving module takes out the release film from the material box and puts the release film into the material box; The film lifting module is used to attach or separate the release film and the clamp tray by lifting the release film in a state of absorbing the release film; and The conveyor module transports the fixture tray attached with the release film. 如請求項7之膜結合模組，其中， 具有磁性的框架附著於該離型膜的外圍部， 該框架和該夾具托盤構成為通過磁力結合。 Such as the membrane binding module of claim item 7, wherein, A magnetic frame is attached to the peripheral portion of the release film, The frame and the jig tray are configured to be magnetically coupled. 如請求項7之膜結合模組，其中， 該料盒裝載器模組包括： 料盒裝載單元，投入以及排出容納該離型膜的料盒； 料盒升降單元，夾持該料盒而使該料盒上升或者下降；以及 推動器單元，從該料盒推出該離型膜。 Such as the membrane binding module of claim item 7, wherein, The Cartridge Loader mod includes: The magazine loading unit is used to input and discharge the magazine containing the release film; The material box lifting unit clamps the material box to make the material box rise or fall; and The pusher unit pushes out the release film from the magazine. 如請求項7之膜結合模組，其中， 該膜搬動模組包括： 膜導向單元，引導該離型膜的移動路徑；以及 膜輸送單元，夾持該離型膜並使該離型膜沿著該移動路徑移動。 Such as the membrane binding module of claim item 7, wherein, The membrane handling module includes: a film guiding unit that guides the moving path of the release film; and The film conveying unit clamps the release film and moves the release film along the moving path. 如請求項10之膜結合模組，其中， 該膜導向單元包括： 一對導軌部件，構成為能夠在彼此相反方向上移動。 Such as the film combination module of claim item 10, wherein, The membrane guide unit consists of: The pair of rail members are configured to be movable in directions opposite to each other. 如請求項11之膜結合模組，其中， 該一對導軌部件構成為： 當沿著水平方向輸送該離型膜時，該一對導軌部件在彼此接近的方向上移動而引導該離型膜的移動， 當該離型膜上升或者下降時，該一對導軌部件在彼此遠離的方向上移動而避免與該離型膜的干擾。 Such as the membrane bonding module of claim 11, wherein, The pair of rail members is constituted by: When conveying this release film along the horizontal direction, the pair of rail members moves in a direction approaching each other to guide the movement of the release film, When the release film is raised or lowered, the pair of guide rail members moves away from each other to avoid interference with the release film. 如請求項11之膜結合模組，其中， 該膜輸送單元從該料盒夾持該離型膜並將該離型膜沿著該導軌部件輸送到膜升降區域，並且將附著有半導體封裝體的該離型膜從該膜升降區域輸送到該料盒。 Such as the membrane bonding module of claim 11, wherein, The film delivery unit clamps the release film from the magazine and transports the release film to the film lift area along the rail parts, and transports the release film attached to the semiconductor package from the film lift area to the film lift area. The cartridge. 如請求項7之膜結合模組，其中， 該膜升降模組包括： 升降主體，具有一定的面積並構成為在膜升降區域的下升降位置和上升降位置之間進行升降；以及 複數個真空吸附單元，形成在該升降主體的上方。 Such as the membrane binding module of claim item 7, wherein, The film lifting module includes: the lifting body has a certain area and is configured to lift between the lower lifting position and the upper lifting position of the film lifting area; and A plurality of vacuum adsorption units are formed above the lifting body. 如請求項14之膜結合模組，其中， 該等真空吸附單元在該升降主體中設置於與形成於該夾具托盤的複數個貫通孔相對應的位置而構成為穿過該夾具托盤的該等貫通孔。 Such as the membrane bonding module of claim 14, wherein, The vacuum suction units are disposed in the lifting main body at positions corresponding to the plurality of through holes formed on the jig tray and configured to pass through the through holes of the jig tray. 如請求項14之膜結合模組，其中， 若該離型膜位於該上升降位置，則該膜升降模組上升到該膜升降區域的該上升降位置而吸附該離型膜，並在吸附該離型膜的狀態下從該上升降位置下降到該下升降位置而使該離型膜和該夾具托盤結合。 Such as the membrane bonding module of claim 14, wherein, If the release film is located at the upper lifting position, the film lifting module rises to the upper lifting position of the film lifting area to absorb the release film, and from the upper lifting position in the state of absorbing the release film Descending to the lower lifting position to combine the release film with the clamp tray. 如請求項16之膜結合模組，其中， 若與附著有半導體封裝體的該離型膜結合的該夾具托盤位於該下升降位置，則該膜升降模組上升到該上升降位置而從該夾具托盤分離該離型膜， 若該離型膜在該上升降位置定位，則該膜升降模組解除真空吸附並下降到該下升降位置。 Such as the membrane bonding module of claim 16, wherein, If the clamp tray combined with the release film attached to the semiconductor package is located at the lower lift position, the film lift module rises to the upper lift position to separate the release film from the clamp tray, If the release film is positioned at the upper lifting position, the film lifting module releases the vacuum adsorption and descends to the lower lifting position. 如請求項7之膜結合模組，其中， 該輸送器模組將附著有該離型膜的該夾具托盤從膜升降區域輸送到托盤拾取區域，並將與位於該托盤拾取區域的粘合有半導體封裝體的該離型膜結合的該夾具托盤輸送到該膜升降區域。 Such as the membrane binding module of claim item 7, wherein, The conveyor module transports the jig tray attached with the release film from the film lift area to the tray pick-up area, and combines the jig with the release film bonded with the semiconductor package located in the tray pick-up area The pallets are transported to the film lifting area. 一種半導體條帶切割以及分類裝備，包括： 裝載單元，用於供應半導體條帶； 切割單元，切割從該裝載單元供應的該半導體條帶而將該半導體條帶單個化為複數個半導體封裝體； 分類單元，檢查單個化的該等半導體封裝體，並根據檢查結果將該等半導體封裝體分類而粘合於離型膜；以及 膜結合模組，能夠拆裝地設置於該分類單元，並將夾具托盤和該離型膜結合而供應於該分類單元，並且分離從該分類單元回收的該夾具托盤和該離型膜， 該膜結合模組包括： 料盒裝載器模組，被投入容納該離型膜的料盒； 膜搬動模組，從該料盒取出該離型膜； 膜升降模組，通過以吸附該離型膜的狀態進行升降而使該離型膜和該夾具托盤附著或者分離；以及 輸送器模組，搬送附著有該離型膜的該夾具托盤。 A semiconductor strip cutting and sorting equipment, comprising: loading unit for supplying semiconductor strips; a cutting unit that cuts the semiconductor strip supplied from the loading unit to singulate the semiconductor strip into a plurality of semiconductor packages; a sorting unit that inspects the individualized semiconductor packages, and classifies the semiconductor packages according to the inspection results and adheres them to the release film; and The film bonding module is detachably installed in the sorting unit, and the jig tray and the release film are combined and supplied to the sorting unit, and the jig tray and the release film recovered from the sorting unit are separated, The membrane binding module includes: The cartridge loader module is put into the cartridge containing the release film; The film moving module takes out the release film from the magazine; The film lifting module is used to attach or separate the release film and the clamp tray by lifting the release film in a state of absorbing the release film; and The conveyor module transports the fixture tray attached with the release film. 如請求項19之半導體條帶切割以及分類裝備，其中， 該分類單元包括： 晶片拾取器，沿著第一水平方向移動，並從托盤台拾取半導體封裝體，並根據檢查結果將該等半導體封裝體附著於該離型膜； 托盤輸送部，沿著導向部件移動，並輸送結合有該離型膜的夾具托盤，該導向部件沿著與該第一水平方向垂直的第二水平方向延伸； 托盤拾取器，在上方拾取該夾具托盤並輸送該夾具托盤；以及 托盤裝載器，保管該夾具托盤。 Such as the semiconductor strip cutting and sorting equipment of claim 19, wherein, This taxon includes: a wafer picker, moving along the first horizontal direction, and picking up the semiconductor packages from the tray table, and attaching the semiconductor packages to the release film according to the inspection result; The tray conveying part moves along the guide member, and conveys the clamp tray combined with the release film, and the guide member extends along the second horizontal direction perpendicular to the first horizontal direction; a pallet picker that picks up the jig pallet above and delivers the jig pallet; and A pallet loader that holds the fixture pallet.
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