KR20170064756A - Magazine transferring module and die bonding apparatus having the same - Google Patents

Magazine transferring module and die bonding apparatus having the same Download PDF

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Publication number
KR20170064756A
KR20170064756A KR1020150170612A KR20150170612A KR20170064756A KR 20170064756 A KR20170064756 A KR 20170064756A KR 1020150170612 A KR1020150170612 A KR 1020150170612A KR 20150170612 A KR20150170612 A KR 20150170612A KR 20170064756 A KR20170064756 A KR 20170064756A
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KR
South Korea
Prior art keywords
magazine
cleaning
unit
transfer
shielding
Prior art date
Application number
KR1020150170612A
Other languages
Korean (ko)
Inventor
김재용
이재경
채홍기
Original Assignee
세메스 주식회사
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Priority to KR1020150170612A priority Critical patent/KR20170064756A/en
Publication of KR20170064756A publication Critical patent/KR20170064756A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Abstract

Disclosed is a magazine transfer module for transferring a magazine on which a plurality of substrates are loaded. The magazine transfer module may include a transfer unit for transferring the magazine and a cleaning unit for cleaning the substrates. The cleaning unit is coupled to the transfer unit and cleans the magazine loaded on the transfer unit. The cleaning unit includes a shielding portion for shielding the cleaning space in which the magazine is cleaned, a fluid spraying portion for spraying a cleaning gas to remove foreign substances in the magazine, and a vacuum suction portion for vacuuming the foreign substances separated by the cleaning gas . Accordingly, since the magazine transfer module can clean a plurality of substrates housed in the magazine at once, the cleaning time of the substrates can be shortened compared with the conventional one.

Description

[0001] Magazine transfer module and die bonding apparatus having the same [0002]

Embodiments of the present invention relate to a magazine transfer module and a die bonding apparatus having the same. And more particularly, to a magazine transfer module for transferring a magazine on which a substrate such as a lead frame, a printed circuit board or the like is loaded in a bonding process for semiconductor devices, and a die bonding apparatus having the same.

Generally, semiconductor devices, such as integrated circuit devices, can be formed by repeatedly performing a series of semiconductor processes on a semiconductor wafer. The semiconductor devices thus formed can be individualized through a dicing process and can be bonded onto the substrate through a die bonding process.

The wafer having undergone the dicing process can be placed on the stage for the die bonding process. The wafer may be attached to the dicing tape and the dicing tape may be mounted to a mounting frame in the form of a substantially circular ring. The semiconductor elements can be separated from the dicing tape by the ejecting device, picked up by the semiconductor element pickup device, and then transferred onto the buffer stage. The die on the buffer stage may be picked up by a bonding apparatus and then bonded onto a substrate such as a lead frame or a printed circuit board. The substrate for bonding the dies can be stacked in a plurality of magazines, loaded on magazines, and transported to the die bonding apparatus.

The substrates loaded on the magazine can be pulled out one by one from the magazine by the pusher and provided to the die bonding apparatus. The substrate drawn out from the magazine can be loaded on the unloading magazine after the dies are bonded and transported to the outside.

The die bonding apparatus may include an air blower for removing foreign substances on the substrate, and the air blower may remove foreign matter by spraying a cleaning gas such as air or an inert gas before bonding the dies to the substrate. The air blower may be disposed on the upper side of the substrate, and may include an air jet opening for jetting the cleaning gas toward the substrate and a suction port for sucking the foreign matter separated from the substrate.

However, since the foreign object removal using the air blower is performed on a substrate basis, the process time is increased. In addition, since both the air injection port and the suction port are formed on the surface facing the substrate in the air blower, foreign matter separated from the substrate or die by the cleaning gas can not be sucked into the suction port and is liable to float. Foreign matter which is not sucked into the suction port floats and can be mounted on the members constituting the substrate or the die bonding apparatus again, so that the cleaning efficiency is lowered.

Japanese Patent Application Laid-Open No. 2015-146349 (Aug. 13, 2015)

SUMMARY OF THE INVENTION It is an object of the present invention to provide a magazine transfer module capable of cleaning substrates in a state of being loaded on a magazine in the process of transferring a magazine on which a plurality of substrates are loaded, and a die bonding apparatus having the magazine transfer module.

According to embodiments of the present invention for achieving the above object, a magazine transfer module includes a transfer unit that receives a magazine on which a plurality of substrates are loaded and transfers the magazine, and a transfer unit that is coupled to the transfer unit, And a cleaning unit for cleaning the magazine. Specifically, the cleaning unit may include: a shielding portion for shielding a cleaning space in which the magazine is cleaned, the shielding portion being coupled to the conveyance unit, the magazine being disposed outside the magazine in the cleaning space, And a vacuum cleaner which is arranged to face the fluid ejecting part with the magazine interposed therebetween and separates the foreign matter separated from the magazine or the substrates by the cleaning gas, And a vacuum suction unit for suctioning by using the vacuum suction unit.

According to embodiments of the present invention, the shielding portion may include an upper shielding block facing the upper surface of the magazine, and a lower shielding block disposed to face the side surfaces of the magazine, And a plurality of side shield blocks movable in the direction of the arrow. Further, the upper shielding block may be integrally provided with one of the plurality of side shielding blocks, and the fluid injecting unit and the vacuum suction unit may be coupled to the two side shielding blocks facing each other among the side shielding blocks, .

According to embodiments of the present invention, the transfer unit may be constituted by a conveyor belt. The shielding portion may have a box shape and may include doors facing each other in the advancing direction of the conveyor belt to / from the magazine.

According to embodiments of the present invention, the fluid ejecting portion and the vacuum suction portion may be disposed to face opposite side walls for opening and closing the substrates at the magazine. Further, the doors may be disposed in a direction perpendicular to a direction in which the fluid ejecting unit and the vacuum suction unit are disposed.

According to embodiments of the present invention for achieving the above object, a die bonding apparatus includes a die bonding module for performing a die bonding process on a substrate, and a plurality of die bonding modules for transferring the substrate to the die bonding module. And a magazine transfer module for transferring the magazine on which the substrate is loaded. Specifically, the magazine transfer module may include a plurality of transfer units for receiving the magazine and transferring the magazines, and a cleaning unit coupled to any one of the transfer units to clean the magazine. The cleaning unit may further include a shielding portion for shielding a cleaning space in which the magazine is cleaned, the shielding portion being coupled to the conveyance unit, for shielding a cleaning space in the cleaning space, the magazine being disposed outside the magazine in order to remove foreign substances in the magazine, And a cleaning unit for cleaning the foreign matter separated from the magazine or the substrates by the cleaning gas by using a vacuum pressure, the cleaning unit being configured to face the fluid ejecting unit with the magazine interposed therebetween in the cleaning space, And a vacuum suction unit for sucking the liquid.

According to embodiments of the present invention, the transfer units may include a magazine load port in which the magazine is loaded and vertically movable, and a magazine load port located at one side of the magazine load port, And a magazine transferring unit for transferring the magenta transferring unit. Here, the magazine load port and the first, second, and third conveyance units may be configured as a conveyor belt. The cleaning unit may be coupled to one of the magazine load port and the magazine transfer unit.

According to embodiments of the present invention, the cleaning unit may be coupled to the magazine load port. The shielding portion may include an upper shielding block facing the upper surface of the magazine and a plurality of side portions disposed to face the side surfaces of the magazine and separated from each other to be movable in the horizontal direction, A shielding block may be provided. Here, the upper shielding block may be provided integrally with one of the plurality of side shielding blocks, and the fluid injecting unit and the vacuum suction unit may be coupled to two opposing side shielding blocks of the side shielding blocks, .

According to embodiments of the present invention, the magazine transfer portion may include first, second, and third transfer portions that are sequentially disposed in parallel with each other and transfer the magazine from the magazine load port to the die bonding module have. The cleaning unit may be coupled to the second conveyance unit.

According to embodiments of the present invention, the shielding portion may have a box shape, and may have doors facing each other in the traveling direction of the conveyor belt for the entrance and exit of the magazine. Further, the fluid ejecting portion and the vacuum suction portion may be disposed to face opposite side walls for opening and closing the substrates in the magazine, and the doors may be arranged in a direction perpendicular to the direction in which the fluid ejecting portion and the vacuum suction portion are disposed, As shown in FIG.

According to embodiments of the present invention as described above, since the magazine transfer module includes the cleaning unit, it is possible to clean the substrates before withdrawing the substrates from the magazine, and to clean the plurality of substrates housed in the magazine at once , It is possible to shorten the cleaning time of the substrates compared to the related art.

In addition, since the fluid ejecting portion and the vacuum suction portion are arranged to face each other, the foreign substances separated by the cleaning gas can be prevented from being reattached to the substrate or the magazine again, and the cleaning efficiency can be improved.

Further, the cleaning unit cleans the substrates and the magazine in a state in which the cleaning space in which the substrates are cleaned is cleaned, so that foreign substances separated from the substrate or the magazine by the cleaning gas can be prevented from adhering to other members in the facility. Furthermore, since not only the substrates but also the magazine can be cleaned together, it is possible to improve the cleaning efficiency and to prevent contamination in the facility.

In addition, since the magazine transfer module cleans the substrate in the magazine transfer module before the substrate is taken out, foreign matter of the substrate can be prevented from adhering to the die bonding module.

1 is a schematic plan view illustrating a die bonding apparatus according to an embodiment of the present invention.
2 is a schematic partial side view for explaining the magazine transfer module shown in Fig.
3 is a schematic partial perspective view for explaining the arrangement relationship between the support portion of the magazine load port and the cleaning unit shown in Fig.
Fig. 4 is a schematic longitudinal sectional view for explaining the cleaning unit shown in Fig. 2. Fig.
5 is a schematic plan view illustrating a die bonding apparatus according to another embodiment of the present invention.
FIG. 6 is a schematic partial side view for explaining the magazine transfer module shown in FIG. 5; FIG.
7 is a schematic vertical sectional view for explaining the arrangement relationship of the second transfer section and the cleaning unit shown in Fig.
8 is a schematic vertical sectional view for explaining the cleaning unit shown in Fig.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

In the embodiments of the present invention, when one element is described as being placed on or connected to another element, the element may be disposed or connected directly to the other element, . Alternatively, if one element is described as being placed directly on another element or connected, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used in the embodiments of the present invention is used for the purpose of describing specific embodiments only, and is not intended to be limiting of the present invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the regions described in the drawings, but include deviations in the shapes, and the elements described in the drawings are entirely schematic and their shapes Is not intended to describe the exact shape of the elements and is not intended to limit the scope of the invention.

1 is a schematic plan view illustrating a die bonding apparatus according to an embodiment of the present invention.

Referring to FIG. 1, a die bonding apparatus 500A according to an embodiment of the present invention can be used to perform a die bonding process for a wafer 10 divided into a plurality of dies. The die bonding apparatus 500A includes a magazine transfer module 100A for transferring a magazine on which a plurality of substrates 20 are loaded, a substrate transfer module 100A for transferring a substrate 20 drawn from the magazine transfer module 100A, A die bonding module 300 for picking up dies 12 from the wafer 10 and bonding the substrates 12 to the substrate 20, And a substrate unloading module 400 for loading.

The magazine transfer module 100A can transfer the magazines 30 containing the substrates 20 to the substrate transfer module 200 side and transfer the substrates 20 stored in the magazines 30 To the substrate transfer module 200. Here, the magazine 30 conveyed by the magazine transfer module 100A can receive the substrates 20 to which the dies 12 are not bonded. Particularly, the magazine transfer module 100A may include a cleaning unit 110 capable of cleaning the inside of the magazine 30, thereby cleaning the substrates 20 stored in the magazine 30. A detailed description of the configuration of the magazine transfer module 100A will be given in FIGS. 2 to 4 described later.

The magazine transfer module 100A may take out the substrate 20 stored in the magazine 30 and provide the same to the substrate transfer module 200. [ The substrate transfer module 200 includes a rail 210 for transferring a substrate 20 drawn from the magazine 30, a gripper 220 for gripping the substrate 30, And an unloading pusher 230 for pulling the bonded substrate 20 into the substrate unloading module 400.

The rail 210 is disposed between the magazine transfer module 100A and the substrate unloading module 400 and the magazine transfer module 100A is mounted on one side of the rail 210, Is disposed on the other side of the rail 210. The substrate 20 drawn out from the magazine 30 may be partially positioned on the rail 210.

The substrate 20 may be moved along the rail 210 by the gripper 220. The gripper 220 can grip the substrate 20 and move along the rail 210. In an embodiment of the present invention, the substrate transfer module 200 may include a plurality of grippers 220, and a plurality of grippers 220 may be disposed along the rails 210.

The substrate 20 may be moved to the bonding area BA by the gripper 220 and the die 12 may be moved by the die bonding module 200 in the bonding area BA to the substrate 20). The gripper 220 can release the holding of the substrate 20 after the substrate 20 to which the dies 12 are bonded is transferred to the substrate unloading module 400 side.

The substrate 20 to which the dies 12 are bonded may be received in the unloading magazine 40 by the unloading pusher 230. The unloading pusher 230 may be located inside the rail 210 and adjacent to the substrate unloading module 400. The unloading magazine 40 is disposed in the substrate unloading module 400 and the unloading pusher 230 pushes the substrate 20 toward the unloading magazine 40 to move the substrate 20 The unloading magazine 40 can be loaded.

The die bonding module 300 picks up the die 12 from the wafer 10 and bonds it to the substrate 20 on the rail 210. The die bonding module 300 includes a dicing tape (not shown) to which the wafer 10 divided by the plurality of dies 12 is attached, a wafer ring 310 to which the dicing tape is attached, Up unit 320 for picking up the die 12 from the substrate 20 and attaching it to the substrate 20.

The pick-up unit 320 moves the die 12 picked up from the wafer 10 to the die 20 on the substrate 20 located in the bonding area BA after moving the bonding area BA, ).

The die bonding module 300 may include a cassette load port 330 and a wafer transfer unit 340. The cassette load port 330 may be loaded with a cassette 50 containing a plurality of wafers 10 and the wafer transfer unit 340 may transfer the wafer W from the cassette 50 to the pick- (10).

The substrate 20 having been die-bonded by the die bonding module 300 can be transferred to the substrate unloading module 400 by the substrate transfer module 200 as described above.

The substrate unloading module 400 includes an unloading robot 410 for handling the unloading magazine 40, an unloading magazine transferring unit 420 for transferring the unloading magazine 40, And a magazine unloading port 430 for discharging the magazine unloading port 40 to the outside.

The unloading robot 410 is movable in the vertical and horizontal directions, and can grip the unloading magazine 40. The unloading magazine 40 can receive the substrate 20, which is pushed by the unloading pusher 230 while being held by the unloading robot 410. The unloading robot 410 may transfer the unloading magazine 40 to the unloading magazine transferring unit 420 and the unloading magazine transferring unit 420 may transfer the unloading magazine 40 to the magazine To the loading port 430. The unloading magazine 40 loaded in the magazine unloading port 430 is connected to an overhead hoist transfer system (OHT), an overhead shuttle system (OHS), an automatic guided vehicle system (AGV) Rail Guided Vehicle system).

Hereinafter, the magazine transfer module 100A will be described in detail with reference to the drawings.

FIG. 2 is a schematic partial side view for explaining the magazine transfer module shown in FIG. 1, FIG. 3 is a schematic partial perspective view for explaining the arrangement relationship between the support portion of the magazine load port and the cleaning unit shown in FIG. 2, Fig. 4 is a schematic longitudinal sectional view for explaining the cleaning unit shown in Fig. 2. Fig.

1 and 2, the magazine transfer module 100A includes a cleaning unit 110 for cleaning the magazine 30, a plurality of transfer units 120, 130 for transferring the magazine 30, A loading robot 140 for handling the magazine 30, and a loading pusher 150 for loading the substrate 20.

More specifically, the cleaning unit 110 sprays a cleaning gas onto the magazines 30 mounted on the transfer units 120 and 130 to transfer the magazines 30 and the substrates 30 housed in the magazines 30 20 can be cleaned. A detailed description of the configuration of the cleaning unit 110 will be described later.

The transfer units 120 and 130 may include a magazine load port 120 on which the magazine 30 is loaded by the automated unmanned automated teller machine and a magazine load port 120 on the magazine load port 120, And a magazine transfer unit 130 for transferring the magenta transfer unit 200 to the transfer module 200.

The magazine load port 120 includes a support portion 122 on which the magazine 30 is mounted and a vertical drive portion 124 coupled to a lower portion of the support portion 122 to vertically move the support portion 122 .

The magazine transfer part 130 may be disposed on one side of the magazine load port 120. The magazine transfer unit 130 may transfer the magazine 30 from the magazine load port 120 to the loading robot 140.

In an embodiment of the present invention, the support portion 122 and the magazine transfer portion 130 may be configured as conveyor belts, respectively.

The loading robot 140 may be disposed on one side of the magazine transfer unit 130. The loading robot 140 is movable in the horizontal and vertical directions and can grip the magazine 30 transferred by the magazine transfer unit 130. [

The substrates 20 held in the magazine 30 held by the loading robot 140 can be taken out by the loading pusher 150. The loading pusher 150 may pull out the substrate 20 by pushing one of the substrates 20 in the magazine 30 toward the rail 210.

Meanwhile, the cleaning unit 110 may be combined with one of the plurality of the transfer units 120, 130. In one embodiment of the present invention, the cleaning unit 110 may be coupled to the magazine load port 120.

2 to 4, the cleaning unit 110 may include a shielding portion 111, a fluid ejecting portion 112, and a vacuum suction portion 113.

The shielding portion 111 may have a substantially box shape and may be detachably coupled to the support portion 122 of the magazine load port 120. The cleaning space CLS, in which the magazine 30 is cleaned, . The cleaning space CLS may be defined by the shielding portion 111 and the support portion 122 as a space in which the magazine 30 is loaded on the support portion 122 of the magazine lot port 120 have.

The shielding part 111 includes an upper shielding block 111a disposed to face the upper surface of the magazine 30 and a plurality of side shielding blocks 111b, 111c, 111d, and 111e.

The side shield blocks 111b, 111c, 111d, and 111e may be disposed to face the side surfaces of the magazine 30 and may be separated from each other to be movable in the horizontal direction.

In an embodiment of the present invention, the upper shielding block 111a may be integrated with one of the side shielding blocks 111b, 111c, 111d, and 111e. Although not illustrated in detail in the drawing, a block 111e adjacent to the magazine transfer part 130 among the side shield blocks 111b, 111c, 111d, and 111e may be formed in the magazine 30 on the support part 122, And may be vertically movable so as to be easily moved to the magazine transfer unit 130.

The cleaning unit 110 may further include horizontal drivers 114 for horizontally moving the side shield blocks 111b, 111c, 111d, and 111e. The horizontal drive units 114 may be disposed below the support unit 122 of the magazine load port 120 and may be coupled to the magazine load port 120. The horizontal driving units 114 may move the side shield blocks 111b, 111c, 111d, and 111e in the horizontal direction by engaging with the side shield blocks 111b, 111c, 111d, and 111e. The magazine 30 may be mounted on the magazine load port 120 or the magazine load port 120 may be coupled to the magazine load port 120. [ 111c, 111d, 111e are horizontally moved by the horizontal driving portions 114 when the side shield blocks 111b, 111c, 111d, 111e are transferred from the magazine transfer portion 130 to the magazine transfer portion 130, And 111e can be separated from each other to secure the entrance and exit of the magazine 30.

The shield 111 may be coupled to the fluid ejection unit 112 and the vacuum suction unit 113. The fluid injecting unit 112 is disposed in the cleaning space CLS and injects the cleaning gas CG toward the magazine 30 to form the magazines 30 and the substrates 20 in the magazine 30 The foreign substance 60 is removed. Here, as the cleaning gas CG, air or an inert gas may be used.

The vacuum suction unit 113 may be disposed in the cleaning space CLS and may be disposed to face the fluid ejecting unit 112 with the magazine 30 interposed therebetween. The vacuum suction unit 113 sucks the foreign substances 60 separated from the magazines 30 or the substrates 20 by the cleaning gas CG using vacuum pressure and discharges the foreign substances 60 to the outside.

4, the fluid injecting section 112 and the vacuum suction section 113 are connected to each other in such a manner that the openings for opening and closing the substrates 20 in the magazine 30, But may be disposed facing the sidewalls of the magazine 30 except for the open both sidewalls.

In addition, in one embodiment of the present invention, the fluid injecting unit 112 and the vacuum suction unit 113 may be formed of two side shielding blocks facing each other among the side shielding blocks 111b, 111c, 111d, 111b and 111c, respectively.

The fluid injecting unit 112 includes a gas flow path 111b through which the cleaning gas CG flows and a plurality of gas injection ports 112b for injecting the cleaning gas CG into the magazine 30, ).

The gas passage 111a is connected to the gas supply line 115 and the cleaning gas CG can be introduced into the gas passage 111a from the gas supply unit 116 through the gas supply line 115 .

The gas injection ports 112b communicate with the gas flow path 112a and the cleaning gas CG introduced into the gas flow path 112a flows into the cleaning space CLS through the gas injection ports 112b. . Accordingly, the magazines 30 and the foreign substances 60 on the substrates 20 can be separated from the magazines 30 and the substrates 20 by the cleaning gas CG.

The separated foreign substances 60 may be sucked into the vacuum suction unit 113 and discharged to the outside while the vacuum suction unit 113 is located on the opposite side of the fluid injection unit 112. The vacuum suction unit 113 includes a plurality of suction ports 113a for separating the foreign materials 60 suspended in the cleaning space CLS from the magazines 30 and the substrates 20, And a vacuum suction path 113b for discharging the foreign substances 60 to the outside. The vacuum suction path 113b communicates with the suction ports 113a and the foreign substances 60 are introduced from the suction ports 113a and the foreign substances 60 introduced into the vacuum suction path 113b May be discharged through the vacuum line 117 to the outside. The vacuum line 117 may be connected to a dust filter 118 and a vacuum pneumatic pressure providing unit 119 for providing a vacuum pressure and the foreign substances 60 introduced into the vacuum line 117 may be connected to the dust filter 118). ≪ / RTI >

As described above, since the magazine transfer module 100A includes the cleaning unit 110, the plurality of substrates 20 stored in the magazine 30 can be cleaned at once, 20 can be shortened.

Since the fluid injecting unit 112 and the vacuum sucking unit 113 are disposed to face each other, the foreign substances 60 separated by the cleaning gas CG are returned to the substrate 20 or the magazine 30 from being reattached.

Since the cleaning of the substrates 20 is performed while the cleaning space CLS is closed, foreign substances 60 separated by the cleaning gas CG are prevented from adhering to other members in the facility. can do. Furthermore, since the cleaning unit 110 can clean not only the substrates 20 but also the magazine 30, it is possible to improve the cleaning efficiency and prevent contamination inside the facility.

Since the magazine transfer module 100A cleans the substrates 20 and the magazine 30 before the substrate 20 is provided to the substrate transfer module 200, It can be prevented from being attached to the substrate transfer module 200 and the die bonding module 300.

FIG. 5 is a schematic plan view for explaining a die bonding apparatus according to another embodiment of the present invention, and FIG. 6 is a schematic partial side view for explaining the magazine transfer module shown in FIG.

5 and 6, a die bonding apparatus 500B according to another embodiment of the present invention includes a magazine transfer module 100B, a substrate transfer module 200, a die bonding module 300, (400).

In an embodiment of the present invention, the substrate transfer module 200, the die bonding module 300 and the substrate unloading module 400 are the same as the components of the die bonding apparatus 500A shown in FIG. 1 Therefore, the same reference numerals are used, and a description thereof will be omitted.

The magazine transfer module 100B can transfer the magazines 30 containing the substrates 20 to the substrate transfer module 200 and transfer the substrates 20 stored in the magazines 30 To the substrate transfer module 200. Particularly, the magazine transfer module 100B includes a cleaning unit 160 capable of cleaning the inside of the magazine 30, so that the substrates 20 stored in the magazine 30 can be cleaned at a time.

More specifically, the magazine transfer module 100B includes the cleaning unit 160 for cleaning the magazine 30, a plurality of transfer units 120 and 170 for transferring the magazine 30, A loading robot 140 for handling the substrate 20, and a loading pusher 150 for loading the substrate 20.

The loading robot 140 and the loading pusher 150 of the magazine transfer module 100B are connected to the loading robot 140 and the loading robot 140 of the magazine transfer module 100A shown in FIG. Is the same as the pusher 150, so a detailed description thereof will be omitted.

The cleaning unit 160 sprays a cleaning gas onto the magazines 30 mounted on the transfer units 120 and 170 so that the magazines 30 and the substrates 20 stored in the magazines 30 It can be cleaned.

The transfer units 120 and 170 may include a magazine load port 120 on which the magazine 30 is loaded by the automated unmanned automated teller machines and a magazine load port 120 on the magazine load port 120, And a magazine transfer unit 170 for transferring the magenta transfer unit 200 to the transfer module 200.

In the embodiment of the present invention, the magazine load port 120 is the same as the magazine load port 120 shown in FIG. 2, so that a detailed description thereof will be omitted.

The magazine transfer port 170 may be disposed at one side of the magazine load port 120. The magazine transfer unit 170 may transfer the magazine 30 from the magazine load port 120 to the loading robot 140.

Specifically, the magazine transfer unit 170 may include first, second, and third transfer units 172, 174, and 176. The first to third conveyance units 172, 174, and 176 may be disposed in parallel to one side of the magazine load port 120 in sequence. That is, the first transfer unit 172 may be disposed adjacent to the magazine load port 120, the third transfer unit 176 may be disposed adjacent to the loading robot 140, The transfer unit 174 may be disposed between the first transfer unit 172 and the third transfer unit 176.

In an embodiment of the present invention, the first to third conveyance units 172, 174, and 176 may be configured as a conveyor belt. The magazine transfer unit 170 includes three transfer units 172, 174 and 176, but the number of the transfer units 172, 174 and 176 is not limited thereto.

Meanwhile, the cleaning unit 160 may be coupled to the second transfer unit 172. The cleaning unit 160 may be disposed on the upper surface of the second transfer unit 172 to clean the magazine 30 loaded on the second transfer unit 172.

FIG. 7 is a schematic vertical sectional view for explaining the arrangement relationship of the second transfer section and the cleaning unit shown in FIG. 6, and FIG. 8 is a schematic vertical sectional view for explaining the cleaning unit shown in FIG.

6 to 8, the cleaning unit 160 may include a shield 162, a fluid ejection unit 112, and a vacuum suction unit 113.

The fluid injecting unit 112 and the vacuum sucking unit 113 are the same as those of the fluid injecting unit 112 and the vacuum sucking unit 113 shown in FIG. And the detailed description thereof will be omitted.

The shielding portion 162 may have a box shape and may be disposed on the upper surface of the second transfer portion 174 to shield the cleaning space CLS in which the magazine 30 is cleaned. The cleaning space CLS may be defined by the shielding portion 162 and the second transfer portion 174 as a space in which the magazine 30 is loaded on the upper surface of the second transfer portion 174.

In an embodiment of the present invention, the shield 162 is integrally formed, unlike the shield 111 which is detachable in units of blocks shown in Fig.

As shown in FIG. 7, the shield 162 may be provided with doors 162a and 162b on the side walls facing each other for the entrance and exit of the magazine 30. The doors 162a and 162b may be disposed to face each other in the traveling direction of the conveyor belt of the second conveyance unit 174. [

The fluid injecting unit 112 and the vacuum suction unit 113 may be coupled to the shield 162. The fluid injecting unit 112 and the vacuum sucking unit 113 are disposed to face both sidewalls opened and closed for the entrance and exit of the substrates 20 in the magazine 30, And are disposed on opposite sides of each other. The doors 162a and 162b may be disposed in a direction perpendicular to the direction in which the fluid injecting unit 112 and the vacuum suction unit 113 are disposed.

The fluid injecting unit 112 injects the cleaning gas CG toward the magazine 30 in the cleaning space CLS to cause the magazine 30 and the substrates 20 in the magazine 30 It is possible to remove the foreign matter 60 that is stuck.

The vacuum suction unit 113 sucks the foreign substances 60 separated from the magazines 30 or the substrates 20 by the cleaning gas CG using vacuum pressure and discharges the foreign substances 60 to the outside.

8, the fluid injecting unit 112 and the vacuum suction unit 113 may be integrally formed with the shielding unit 162, but the shielding unit 162 And may be disposed in the cleaning space CLS.

As described above, the magazine transfer module 100B includes the cleaning unit 160, so that the plurality of substrates 20 stored in the magazine 30 can be cleaned at once, and the cleaning space CLS can be cleaned The substrates 20 and the magazine 30 can be cleaned in a sealed state. As a result, the magazine transfer module 100B can shorten the cleaning time of the substrates 20 and improve the cleaning efficiency compared to the conventional case.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

10: wafer 20: substrate
30: Magazine 60: Foreign matter
100A, 100B: magazine transfer module 110, 160: cleaning unit
111, 162: shielding portion 112: fluid ejecting portion
113: Vacuum suction part 114: Horizontal driving part
115: gas supply line 116: gas supply unit
117: Vacuum line 118: Dust filter
119: Vacuum pressure supply unit 120: Magazine load port
130, 170: magazine transfer unit 140: loading robot
150: loading pusher 200: substrate transfer module
300: die bonding module 400: substrate unloading module
500A, 500B: Die bonding device

Claims (9)

A transfer unit on which a magazine on which a plurality of substrates are loaded is placed and which transfers the magazine; And
And a cleaning unit coupled to the transfer unit for cleaning the magazine loaded on the transfer unit,
The cleaning unit includes:
A shielding unit for shielding the cleaning space in which the magazine is cleaned by being coupled with the transfer unit;
A fluid ejecting part disposed outside the magazine in the cleaning space and ejecting a cleaning gas toward the magazine to remove foreign matter in the magazine; And
And a vacuum suction part disposed to face the fluid ejecting part with the magazine interposed therebetween and sucking the foreign matter separated from the magazine or the substrates by the cleaning gas using vacuum pressure Features a magazine transfer module. The method according to claim 1,
The shielding portion
An upper shield block facing an upper surface of the magazine; And
And a plurality of side shield blocks provided so as to be able to engage with the upper shield block and disposed to face the side surfaces of the magazine and separated from each other and movable in the horizontal direction,
Wherein the upper shielding block is integrally provided with one of the plurality of side shielding blocks,
Wherein the fluid ejecting part and the vacuum suction part are respectively coupled to two opposing side shield blocks of the side shield blocks. The method according to claim 1,
Wherein the conveying unit is constituted by a conveyor belt,
Wherein the shielding portion has a box shape and has doors facing each other in the advancing direction of the conveyor belt for the entrance and exit of the magazine. The method of claim 3,
Wherein the fluid ejecting portion and the vacuum suction portion are disposed opposite to both side walls opened for entry and exit of the substrates at the magazine,
Wherein the doors are disposed in a direction perpendicular to a direction in which the fluid ejecting portion and the vacuum suction portion are arranged. A die bonding module for performing a die bonding process on the substrate; And
And a magazine transfer module for transferring a magazine on which a plurality of substrates are loaded for transferring the substrate to the die bonding module,
The magazine transfer module includes:
A plurality of conveying units for receiving the magazine and conveying the magazine; And
And a cleaning unit coupled to any one of the transport units for cleaning the magazine,
The cleaning unit includes:
A shielding unit for shielding the cleaning space in which the magazine is cleaned by being coupled with the transfer unit;
A fluid ejecting part disposed outside the magazine in the cleaning space and ejecting a cleaning gas toward the magazine to remove foreign matter in the magazine; And
And a vacuum suction part disposed to face the fluid ejecting part with the magazine interposed therebetween and sucking the foreign matter separated from the magazine or the substrates by the cleaning gas using vacuum pressure Characterized in that the die bonding apparatus is a die bonding apparatus. 6. The method of claim 5,
The conveying units,
A magazine load port in which the magazine is loaded and movable in a vertical direction; And
And a magazine transferring portion disposed at one side of the magazine load port for transferring the magazine from the magazine load port to the die bonding module,
Wherein the magazine load port and the first to third conveyance portions are each composed of a conveyor belt,
Wherein the cleaning unit is coupled to one of the magazine load port and the magazine transfer unit. The method according to claim 6,
The cleaning unit is coupled to the magazine load port,
The shielding portion
An upper shield block facing an upper surface of the magazine; And
And a plurality of side shield blocks provided to be engageable with the upper shield block and disposed to face the side surfaces of the magazine and separated from each other and movable in a horizontal direction,
Wherein the upper shielding block is integrally provided with one of the plurality of side shielding blocks,
Wherein the fluid injecting portion and the vacuum suction portion are respectively coupled to two side shielding blocks facing each other of the side shielding blocks. The method according to claim 6,
Wherein the magazine transfer portion includes first, second and third transfer portions arranged in parallel to each other in order and transferring the magazine from the magazine load port to the die bonding module,
Wherein the cleaning unit is coupled to the second transfer unit. 9. The method of claim 8,
Wherein the shielding portion has a box shape and has doors facing each other in the advancing direction of the conveyor belt for the entrance and exit of the magazine,
Wherein the fluid ejecting portion and the vacuum suction portion are disposed opposite to both side walls opened for entry and exit of the substrates at the magazine,
Wherein the doors are disposed in a direction perpendicular to a direction in which the fluid ejecting portion and the vacuum suction portion are disposed.
KR1020150170612A 2015-12-02 2015-12-02 Magazine transferring module and die bonding apparatus having the same KR20170064756A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102159553B1 (en) * 2019-05-14 2020-09-24 주식회사 에스에프에이 Transporting magazine transporting system
US11365062B2 (en) * 2018-11-30 2022-06-21 Disco Corporation Conveyance system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11365062B2 (en) * 2018-11-30 2022-06-21 Disco Corporation Conveyance system
KR102159553B1 (en) * 2019-05-14 2020-09-24 주식회사 에스에프에이 Transporting magazine transporting system

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