JP2017163121A5 - - Google Patents
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- JP2017163121A5 JP2017163121A5 JP2016048988A JP2016048988A JP2017163121A5 JP 2017163121 A5 JP2017163121 A5 JP 2017163121A5 JP 2016048988 A JP2016048988 A JP 2016048988A JP 2016048988 A JP2016048988 A JP 2016048988A JP 2017163121 A5 JP2017163121 A5 JP 2017163121A5
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- die
- robot
- wafer
- substrate
- tip
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- 239000000758 substrate Substances 0.000 claims 19
- 238000004519 manufacturing process Methods 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 5
- 230000032258 transport Effects 0.000 claims 1
Claims (19)
装置本体と、
ウエハを保持するウエハリングを格納するウエハカセットと、
基板を格納するマガジンと、
前記ウエハリングを固定するウエハステージと、
前記ウエハからピックアップしたダイをボンディングするために基板を載置するボンディングステージと、
多自由度多関節機構を備え、前記ウエハリングと前記基板と前記ダイとを搬送する第１ロボットと、
を備える。 Die bonding equipment
The device body;
A wafer cassette for storing a wafer ring for holding the wafer;
A magazine for storing boards,
A wafer stage for fixing the wafer ring;
A bonding stage for placing a substrate to bond a die picked up from the wafer;
A first robot having a multi-degree-of-freedom multi-joint mechanism, and transporting the wafer ring, the substrate, and the die;
Is provided.
前記第１ロボットは先端にツールが取り付けられ交換可能とされる。 The die bonding apparatus according to claim 1, wherein
The first robot is replaceable with a tool attached to the tip.
前記ツールは、前記ウエハリングを把持するウエハハンドリングツール、前記基板を載せる基板ハンドリングツールまたは前記ダイをピックアップするダイハンドリングツールである。 The die bonding apparatus according to claim 2,
The tool is a wafer handling tool for gripping the wafer ring, a substrate handling tool for placing the substrate, or a die handling tool for picking up the die.
前記ダイハンドリングツールは前記ダイをピックアップし、前記ピックアップしたダイを裏表反転する機構を備える。 The die bonding apparatus according to claim 3,
The die handling tool includes a mechanism for picking up the die and turning the picked die upside down.
前記第１ロボットは前記装置本体の天井に固定される垂直型多自由度多関節ロボットである。 The die bonding apparatus according to claim 2,
The first robot is a vertical multi-degree-of-freedom multi-joint robot fixed to the ceiling of the apparatus main body.
前記第１ロボットはその先端にビジョンカメラを備える。 The die bonding apparatus according to claim 2,
The first robot has a vision camera at its tip.
前記ウエハステージの下方に配置され、前記第１ロボットと協同して前記ダイをピックアップする第２ロボットを備える。 The die bonding apparatus according to claim 2, further comprising:
A second robot is disposed below the wafer stage and picks up the die in cooperation with the first robot.
前記第２ロボットは多自由度多関節機構を備え、その先端に前記ダイを突き上げるツールを備える。 The die bonding apparatus according to claim 7 , wherein
The second robot includes a multi-degree-of-freedom multi-joint mechanism, and includes a tool that pushes up the die at the tip.
前記ツールは交換可能である。 The die bonding apparatus according to claim 8,
The tool is replaceable.
前記第２ロボットは前記装置本体の床に固定される垂直型多自由度多関節ロボットである。 The die bonding apparatus according to claim 8,
The second robot is a vertical multi-degree-of-freedom multi-joint robot fixed to the floor of the apparatus main body.
前記ウエハカセットは前記装置本体の正面側に配置され、
前記マガジンは前記装置本体の正面側に配置され、
前記ウエハステージは前記装置本体の背面側に配置され、
前記ボンディングステージは前記ウエハカセットと前記ウエハステージとの間に配置され、
前記第１ロボットは前記ウエハ、前記基板および前記ダイを前記装置本体の前後方向に沿って搬送するよう構成される。 The die bonding apparatus according to claim 1, wherein
The wafer cassette is disposed on the front side of the apparatus main body,
The magazine is disposed on the front side of the apparatus main body,
The wafer stage is disposed on the back side of the apparatus main body,
The bonding stage is disposed between the wafer cassette and the wafer stage;
The first robot is configured to transfer the wafer, the substrate, and the die along the front-rear direction of the apparatus main body.
前記装置本体の前記前後方向の長さは該装置本体の幅よりも長い。 The die bonding apparatus according to claim 11, wherein
The length of the apparatus body in the front-rear direction is longer than the width of the apparatus body.
前記マガジンは前記ウエハカセットの上下方向に配置される。 The die bonding apparatus according to claim 1, wherein
The magazine is arranged in the vertical direction of the wafer cassette.
前記複数のツールの格納部は前記マガジンまたは前記ウエハカセットの上方に配置される。 The die bonding apparatus according to claim 1, wherein
The storage units for the plurality of tools are disposed above the magazine or the wafer cassette.
（ａ）装置本体と、ウエハに貼られたダイシングテープを保持するウエハリングを格納するウエハカセットと、基板を格納する第１マガジンおよび第２マガジンと、前記ウエハリングを固定するウエハステージと、前記ウエハからピックアップしたダイをボンディングするために基板を載置するボンディングステージと、多自由度多関節機構を備える第１ロボットと、多自由度多関節機構を備える第２ロボットと、を備えるダイボンディング装置を準備する工程と、
（ｂ）前記第１ロボットによって前記ウエハリングを前記ウエハカセットから前記ウエハステージに搬送する工程と、
（ｃ）前記第１ロボットによって前記基板を前記第１マガジンから前記ボンディングステージに搬送する工程と、
（ｄ）前記第１ロボットと前記第２ロボットと協同して前記ダイをピックアップする工程と、
（ｅ）前記第１ロボットによって前記ピックアップしたダイを搬送し、前記ボンディングステージ上の基板にボンディングする工程と、
（ｆ）前記第１ロボットによって前記ダイがボンディングされた基板を前記第２マガジンに搬送する工程と、
を備える。 The manufacturing method of the semiconductor device is as follows:
(A) an apparatus main body, and a wafer cassette for storing a wafer ring for holding a dicing tape affixed to the wafer, and a wafer stage for fixing the first magazine and the second magazine storing substrate, the wafer ring, Die bonding comprising: a bonding stage for mounting a substrate for bonding a die picked up from the wafer; a first robot having a multi-degree-of-freedom multi-joint mechanism; and a second robot having a multi-degree-of-freedom multi-joint mechanism. Preparing the device;
(B) transferring the wafer ring from the wafer cassette to the wafer stage by the first robot;
(C) transporting the substrate from the first magazine to the bonding stage by the first robot;
(D) picking up the die in cooperation with the first robot and the second robot;
(E) transporting the picked-up die by the first robot and bonding to the substrate on the bonding stage;
(F) transporting the substrate on which the die is bonded by the first robot to the second magazine;
Is provided.
前記（ｂ）工程は前記第１ロボットの先端に前記ウエハリングを把持するウエハハンドリングツールを取り付ける工程を備え、
前記（ｃ）工程は前記第１ロボットの先端の前記ウエハハンドリングツールから前記基板を載せる基板ハンドリングツールに取り替える工程を備え、
前記（ｄ）工程は前記第１ロボットの先端の前記基板ハンドリングツールから前記ダイをピックアップするダイハンドリングツールに取り替える工程を備え、
前記（ｆ）工程は前記第１ロボットの先端の前記ダイハンドリングツールから前記基板ハンドリングツールに取り替える工程を備える。 In the manufacturing method of the semiconductor device of Claim 15,
The step (b) includes a step of attaching a wafer handling tool for gripping the wafer ring to the tip of the first robot,
The step (c) includes a step of replacing the wafer handling tool at the tip of the first robot with a substrate handling tool for placing the substrate thereon,
The step (d) includes a step of replacing the substrate handling tool at the tip of the first robot with a die handling tool that picks up the die,
The step (f) includes a step of replacing the die handling tool at the tip of the first robot with the substrate handling tool.
前記（ｂ）工程は前記第１ロボットの先端のビジョンカメラで前記ウエハカセットの有無を確認する工程と、前記ビジョンカメラで前記ウエハリングの有無を確認する工程とを備え、
前記（ｃ）工程は前記第１ロボットの先端のビジョンカメラで前記第１マガジンおよび前記第２マガジンの有無を確認する工程と、前記ビジョンカメラで前記基板の有無を確認する工程とを備え、
前記（ｄ）工程は前記第１ロボットの先端の基板ハンドリングツールから前記ダイをピックアップするダイハンドリングツールに取り替える工程を備え、
前記（ｆ）工程は前記第１ロボットの先端のビジョンカメラで前記ウエハのアライメントを確認する工程と、前記ビジョンカメラで前記基板のアライメントを認識する工程とを備える。 In the manufacturing method of the semiconductor device of Claim 15,
The step (b) includes a step of confirming the presence / absence of the wafer cassette with a vision camera at the tip of the first robot, and a step of confirming the presence / absence of the wafer ring with the vision camera,
The step (c) includes a step of checking the presence or absence of the first magazine and the second magazine with a vision camera at the tip of the first robot, and a step of checking the presence or absence of the substrate with the vision camera,
The step (d) comprises the step of replacing the die handling tool for picking up the die from the board handling tool at the tip of the first robot,
The step (f) includes a step of confirming the alignment of the wafer with a vision camera at the tip of the first robot, and a step of recognizing the alignment of the substrate with the vision camera.
前記（ｄ）工程は、前記第１ロボットの先端のウエハハンドリングツールを所定の角度を設けて前記ダイに接触させ、前記第２ロボットの先端部を所定の角度を設けて前記ダイシングテープを接触させて、前記ダイをピックアップする。 In the manufacturing method of the semiconductor device of Claim 15,
In the step (d), the wafer handling tool at the tip of the first robot is brought into contact with the die at a predetermined angle, and the tip of the second robot is brought into contact with the dicing tape at a predetermined angle. And pick up the die.
前記（ｂ）工程は前記ウエハリングを前記ウエハカセットから前記ウエハステージに前記装置本体の前後方向に沿って搬送し、
前記（ｃ）工程は前記基板を前記第１マガジンから前記ボンディングステージに前記装置本体の前後方向に搬送し、
前記（ｅ）工程は前記ピックアップしたダイを前記装置の前後方向に搬送し、前記ボンディングステージ上の基板にボンディングし、
前記（ｆ）工程は前記ダイがボンディングされた基板を前記第２マガジンに前記装置本体の前後方向に搬送する。 In the manufacturing method of the semiconductor device of Claim 15,
The step (b) transports the wafer ring from the wafer cassette to the wafer stage along the front-rear direction of the apparatus body,
In the step (c), the substrate is transported from the first magazine to the bonding stage in the front-rear direction of the apparatus body,
In the step (e), the picked-up die is transported in the front-rear direction of the apparatus, bonded to the substrate on the bonding stage,
In the step (f), the substrate on which the die is bonded is conveyed to the second magazine in the front-rear direction of the apparatus main body.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016048988A JP6705668B2 (en) | 2016-03-11 | 2016-03-11 | Die bonding apparatus and semiconductor device manufacturing method |
| TW105135963A TWI615905B (en) | 2016-03-11 | 2016-11-04 | Magnetizing device and method of manufacturing semiconductor device |
| KR1020160153978A KR101835232B1 (en) | 2016-03-11 | 2016-11-18 | Die bonding device and method of manufacturing semiconductor device |
| CN202110446716.4A CN113192867B (en) | 2016-03-11 | 2016-11-18 | Chip mounting apparatus and method for manufacturing semiconductor device |
| CN201611028985.4A CN107180772B (en) | 2016-03-11 | 2016-11-18 | Chip mounting device and method for manufacturing semiconductor device |
| KR1020180022825A KR101990242B1 (en) | 2016-03-11 | 2018-02-26 | Die bonding device and method of manufacturing semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016048988A JP6705668B2 (en) | 2016-03-11 | 2016-03-11 | Die bonding apparatus and semiconductor device manufacturing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017163121A JP2017163121A (en) | 2017-09-14 |
| JP2017163121A5 true JP2017163121A5 (en) | 2019-04-11 |
| JP6705668B2 JP6705668B2 (en) | 2020-06-03 |
Family
ID=59830188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016048988A Active JP6705668B2 (en) | 2016-03-11 | 2016-03-11 | Die bonding apparatus and semiconductor device manufacturing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6705668B2 (en) |
| KR (2) | KR101835232B1 (en) |
| CN (2) | CN107180772B (en) |
| TW (1) | TWI615905B (en) |
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| JP7146352B2 (en) | 2018-12-10 | 2022-10-04 | 株式会社ディスコ | test equipment |
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