JPH0212848A - Inner lead bonding device - Google Patents

Abstract

PURPOSE:To obviate defects such as the mis-alignment of long film carrier tapes with IC chip due to the bending of the tapes, the defective bonding as well as the intricate process control by a method wherein the periphery of discrete film tapes is fixed by frame type film tape carriers to be used. CONSTITUTION:The title bonding device is composed of a bonding stage 7, a feeding side magazine 5a and a containing side magazine 5b which contain frame type film tape carrier 4c fixing the periphery of discrete film tapes 4, belt conveyor systems 6a, 6b conveying the discrete film tapes 4 from the inside of the feeding side magazine 5a onto an IC chip 8 and then the integrated discrete film tapes 4 and the IC chip 8 to the containing side magazine 5b, the top force 3a and the bottom force 3b making alignment of the discrete film tapes 4 with the IC chip 8 by vertically holding the tapes 4 and inserting the fixing pins into sprocket holes 4a, a bonding tool 2 and a pressurizing cylinder 1.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an inner lead bonding device,
In particular, it relates to bonding equipment in the manufacture of film carrier semiconductor devices.

[Conventional technology]

4 and 5 are a front view and a partially enlarged perspective view of a conventional inner lead bonding device, respectively, showing an IC chip 8 and a film Chiaria tape 12.
Bonding with the upper inner lead 2b is performed by the following method.

That is, a long film carrier tape 12 wound around a reel 9 is connected to a roller 10 and a positioning roller 11.
The pins of the positioning roller 11 and the sprocket
The position of the film carrier tape 12 is first determined by engaging the pole 12a. Once this positioning is done, the film carrier tape 12
can be smoothly conveyed in the direction of the arrow simply by rotating the positioning roller 11.

After the tape 12 has been positioned in this manner, the IC chip 8 and the long film carrier tape 12 are subsequently positioned relative to each other. For this, the bonding stage 7 is moved in each direction of x, y, and θ, and the position on the IC chip 8 side is adjusted so that the tip of the inner lead 2b of the tape and the electrode of the IC chip 8 are accurately overlapped. Ru.

IC chip 8 and long film carrier tape 12
When the positioning is completed, the heated bonding tool 2 is pressurized by the pressure cylinder 1 and lowered, and the I
The electrodes of the C-chip 8 and the inner leads 2b of the long film Chiaria are bonded together by thermocompression. When this thermocompression bonding is completed, the bonding tool 2 returns upward again, and the film carrier tape 12
Together with the C chip 8 , the IC chip 8 is transported by one IC chip 8 by the rotation of the positioning roller 11 and wound onto a reel 9 . This operation is then repeated to produce a film carrier semiconductor device.

[Problem to be solved by the invention]

However, since the conventional inner lead bonding apparatus described above uses a long film chiaria tape, if there is a defective product in this film tape, it is detected and the IC1 is removed without bonding. It is necessary to carefully transport each individual IC chip, and since the connected IC chips are wound onto a small diameter reel as a long tape, stress is placed on the inner leads and the tape itself, and in the worst case, the inner lead - Accidents occur where the lead breaks. Furthermore, when winding the bonded tape around the reel, a spacer tape must be inserted between the tapes to prevent the IC chips from coming into contact with each other. In addition, in order to check the connectivity between the film carrier tape and the IC chip after inner lead bonding, it is necessary to cut the tape part because it is a long film carrier tape. The only way to check is to cut out only the bonded part, so a tool for that purpose is required. In addition, the only way to check the IC chips that have been bonded and wound on the reel is to wind the reel and check from the beginning. There is the inconvenience of not being able to count them until after they have been used.

Next, regarding positioning, the positioning roller 11
They form a pair with a span of several tapes, and because the tape is positioned at a different position than the tape that is actually bonded, the bonding process is affected by the accuracy of the tape and the accuracy of the positioning roller. In this case, the positioning roller 11 has a span equivalent to several ICs, so the film carrier tape is also held in the air by that span, and the slant is difficult. Another problem arises in that the film carrier tape hangs downward due to its own weight, making it difficult to align it with the IC chip.

FIGS. 6(a) to 6(c) are step-by-step diagrams of a bonding operation performed by a conventional inner lead bonding apparatus to explain the above-mentioned problems. In other words, Fig. 6 (
When the film carrier tape 12 is hanging down as shown in a), the bonding tool 2 is pressed down and lowered.
As shown in FIG. 6(b), when the inner lead 12b is touched, the inner lead 12b will have a moment in the direction of the arrow, and when bonding is subsequently performed, the inner lead 12b will move to the second position. 6. Misalignment occurs as shown in Figure 6 (c). Furthermore, other problems include:
During bonding, if the heated bonding tool 2 touches the inner lead 12b which is at room temperature, the heat of the bonding tool 2 will escape to the inner lead part due to thermal conduction, and the conditions will not be met when performing thermocompression bonding. Sometimes it becomes weakened. When heat is transmitted to the inner lead portion in this manner, the inner lead portion may be deformed due to thermal expansion and may become misaligned with the IC chip.

In view of the above circumstances, it is an object of the present invention to provide an inner lead bonding device that solves the drawbacks such as poor positioning and bonding with an IC chip due to deflection of the long film carrier tape, and complicated process control. It is to provide.

[Means to solve the problem]

According to the present invention, the inner lead bonding apparatus includes a bonding stage having an x-y-〇 moving device for placing an IC chip on its upper surface and aligning it in an arbitrary direction of x-y-θ; Individual film tapes are housed with their peripheries fixed in frame-shaped film tape carriers, and an individual film tape delivery side magazine and individual film tapes are arranged on both sides of the bonding stage. The individual film tape is transferred from the storage side magazine and the individual film tape delivery side magazine onto the IC chip mounted by the bonding stage, and the integrated IC chip is transferred after bonding is completed. A set of belt conveying devices that transfer the piece of film tape and IC chip into the storage side magazine, and a fixing pin inserted into the sprocket hole by sandwiching the piece of film tape from above and below on a bonding stage. A pair of upper and lower molds of film tape clamp frames are used to align the individual film tape and the IC chip prior to the start of the bonding operation;
The bonding tool includes a bonding tool for thermocompressing the inner leads of the individual film tape and the electrodes of the IC chip within the upper mold of the tape clamp frame, and a pressure cylinder for pressurizing the bonding tool. Ru.

〔Example〕

The present invention will be described in detail below with reference to the drawings.

1 and 2 are a front view and a partially enlarged perspective view of an inner lead bonding apparatus showing one embodiment of the present invention, respectively. According to this embodiment, the inner lead bonding device of the present invention has an x-y-θ moving device that places the IC chip 8 on the upper surface and aligns it in any direction of x-y-θ. The bonding stage 7 and the individual film tape 4 are bonded to a frame-shaped film.
The periphery of the tape carrier 4C is fixed and stored, and the individual film tape delivery side magazine 5a and the individual film tape storage side magazine 5b are respectively arranged on both sides of the bonding stage 7. film·
IC chip 8 on which the bonding stage 7 places the individual film tape 4 from the tape delivery side magazine 5a
The belt conveying device 6-a and the integrated individual film tape 4 and I after bonding are transferred upward.
A belt conveyance bag that transfers the C chip 8 to the storage side magazine 5b? ff16b and the individual film tape 4 are sandwiched from above and below on the bonding stage 7, and a fixing pin is inserted into the sprocket hole 4a to align the individual film tape 4 and the IC chip 8 for bonding. Prior to the start of the operation, the upper mold 3a and lower mold 3b of a pair of film tape clamp frames and the individual film tape 4 are placed inside the upper mold 3a of the film tape clamp frame.
The device includes a bonding tool 2 for thermocompression bonding the inner leads 4b and electrodes of the IC chip 8, and a pressurizing cylinder 1 for pressurizing the bonding tool 2.

This inner lead bonding device operates as follows.

First, the IC chip 8 is placed on the bonding stage 7 and positioned by its x-y-〇 moving device, and its periphery is fixed in the delivery side magazine 5a with a frame-shaped film tape carrier 4C. A plurality of individual film tapes 4 are stored together. The individual pieces of film tape 4 are carried on a belt conveying device 6a, and only one of them is conveyed onto the lower die 31' of the film tape clamp frame. The position at this time is approximately the position on the IC chip 8 placed on the bonding stage 7. When the individual film tape 4 is transported in this way, the lower die 3b of the clamp frame rises, and the fixing pin 3c for positioning it is inserted into the sprocket hole 4a of the film tape 4, and the film is removed. - Correct the walnut of the tape 4, then lower the upper die 3a and fix the fixing pins 3c of the lower die 3b in the holes at the specified positions of the upper die itself, and connect the film tape 4 and the IC chip 8. The positional alignment between the two is taken.

FIGS. 3(a) to 3(c) are detailed diagrams illustrating the position W alignment method between the film tape and the IC chip of the inner lead bonding apparatus of the present invention, in which the lower die 3 of the clamp frame
The fixing pin 3C (see Fig. 3(b)) of b is inserted into the sprocket hole 4a of the individual film tape 4 [see Fig. 3(a)], and then this fixing pin 3C is lowered. The inner leads 4b of the individual film tape 4 are fixed in the holes having specified position coordinates provided in the upper die 3a of the clamp frame (see FIG. 3(c)). The alignment between the electrodes of the IC chip 8 and the electrodes of the IC chip 8 is completed.While this alignment is being performed, the clamp frame 3a.

3b is heated by a built-in heater and its temperature is rising, so this heat is transmitted to the inner lead 4b, and the inner lead 4b is preheated. Therefore, the inner lead 4b undergoes initial deformation due to heat, and the deflection of the film tape 4 is completely corrected. After the above preparations are completed, the heated bonding tool 2 is lowered under pressure by the pressurizing cylinder 1, and inner lead bonding is performed according to the usual method. At this time, the upper die 3a of the clamp frame is lowered to the height of the IC chip 8.

After the bonding is completed, tool 2 rises again and returns.
The clamp frames 3a and 3b rise to the height of the belt conveying device 6b with the film/tape 4 sandwiched therebetween, and the clamp is released. Thereafter, the belt transport device 6b enters under the film tape 4, and then the belt moves to transport it to the storage magazine 5b.

The magazines 5a and 5b can normally store at least several pieces of film tape 4, and
It is also easy to create a structure in which installation and removal can be easily performed with one touch. In addition, the film/tape 4 holder can be moved up and down, so
By raising or lowering the storage stage, the film/tape 4 can be carried out or stored in an orderly and seamless manner.

〔Effect of the invention〕

As explained in detail above, according to the present invention, the conventionally used long film carrier tape is cut into individual pieces, and only good pieces are stored in a magazine and supplied onto an IC chip. Ru. Therefore, mechanical and process problems such as transporting defective tapes and detecting defective products, which have conventionally occurred, are solved, lead time is shortened, and equipment is simplified. Further, after the bonding is completed, the film/tape is transported with its periphery fixed by a frame-shaped carrier and is stored in the magazine without being subjected to external stress, so that no defects occur during storage.

In addition, since individual pieces of film and tape are used, the bondability of each piece can be checked immediately after bonding is completed, and the order of bonding can be clearly determined based on the order in which the pieces are stored in the magazine. Since the process can be easily understood, process control can be performed accurately. Furthermore, positioning uses the sprocket holes of each piece of tape itself, and is not affected by the accuracy in the longitudinal direction unlike long tapes, so the accuracy of positional alignment between the film tape and the IC chip is improved. It is possible to significantly increase the

Furthermore, since the film tape is a discrete piece and is clamped from the periphery so that only the device hole remains, the tape's bending and warping can be corrected. Therefore, almost no positional deviation occurs during bonding. Furthermore, the inner leads are preheated via the clamp frame, and the amount of heat transmitted from the bonding tool to the inner leads is limited, which has the effect of improving bonding performance. This allows stable bonding to be performed at all times without causing deformation of the inner leads due to radiant heat from the bonding tool during bonding due to partial warming of the tape.

[Brief explanation of the drawing]

1 and 2 are a front view and a partially enlarged perspective view of an inner lead bonding device according to an embodiment of the present invention, respectively, and FIGS. 3(a) to 3(c) are Detailed diagram illustrating the position alignment method between the film tape and the IC chip of the lead bonding device,
4 and 5 are respectively a front view and an enlarged perspective view of a conventional inner lead bonding device, and FIGS. 6(a) to 6(c) are a front view and a partially enlarged perspective view of a conventional inner lead
FIG. 4 is a step-by-step diagram of a bonding operation performed by the bonding device. 1... Pressure cylinder 2... Bonding tool, 3a... Upper die of film/tape/clamp frame, 3b... Lower die of film/tape/clamp frame, 3
C...Fixing pin for positioning, 4...Individual film tape, 4a...Sprocket hole, 4b...
・Inner lead, 4c...Frame-shaped film tape carrier, 5a...Magazine for sending out individual film tape, 5b...Individual film tape storage side magazine, 6a, 6b. ... Belt conveyance device, 7...
Bonding stage, 8...IC chip.

Claims (1)

[Claims] A bonding system with an x-y-theta movement device that places an IC chip on the top surface and aligns it in any direction of x-y-theta.
A stage, an individual film tape delivery magazine and an individual film tape storage magazine, which store individual film tapes with the periphery fixed by a frame-shaped film tape carrier, and are arranged on both sides of the bonding stage. film·
The bonding stage transfers the individual film tape from the tape storage side magazine and the individual film tape delivery side magazine onto the IC chip placed on the IC chip after bonding is completed. a set of belt conveying devices for transferring the piece-like film tape and the IC chip into the storage side magazine;
A pair of film tapes are sandwiched from above and below on a bonding stage, and fixing pins are inserted into sprocket holes to align the individual film tapes and the IC chip prior to the start of the bonding operation.
an upper mold and a lower mold of a clamp frame; a bonding tool for thermocompression bonding the inner lead of the individual film tape and the electrode of an IC chip within the upper mold of the film tape clamp frame; An inner lead bonding device comprising: a pressurizing cylinder that pressurizes a tool.