CN117976595A - Die bonding device - Google Patents

Abstract

The application relates to a die bonding device. Comprising the following steps: the frame comprises a base station and two gantry frames, wherein the two gantry frames are arranged on the base station at intervals along a first direction, each gantry frame comprises a cross beam and two upright posts, one end of each upright post is connected with the base station, and the cross beam is connected between the other ends of the two upright posts far away from the base station; the conveying mechanism is arranged on the rack and comprises a conveying belt, and the conveying belt is used for conveying the tray carrying the substrate along the first direction; the chip feeding mechanism is arranged on the base station and used for providing chips; the welding lug feeding mechanism is arranged on the base and used for providing welding lugs; the resistor feeding mechanism is arranged on the base station and is used for providing a resistor; get blowing mechanism, including carrier and getting material subassembly, carrier along with first direction vertically second direction and two crossbeams sliding connection, get material subassembly along first direction slip setting on the carrier, get material subassembly and be used for transporting chip, soldering lug and resistance. Therefore, the structure of the die bonding device can be more compact.

Description

Die bonding device

Technical Field

The application relates to the technical field of semiconductors, in particular to a die bonding device.

Background

The die bonder is used for carrying and stacking materials related to chip welding, but for the traditional die bonder, a swing arm type and a turret type are generally used as main material taking and placing modes, so that the die bonder has the defect of non-compact structure.

Disclosure of Invention

The application solves the technical problem of improving the structural compactness of the die bonding device.

A die bonding apparatus, comprising:

The frame comprises a base station and two gantry frames, wherein the two gantry frames are arranged on the base station at intervals along a first direction, each gantry frame comprises a cross beam and two upright posts, one ends of the two upright posts are connected with the base station, and the cross beams are connected between the other ends of the two upright posts far away from the base station;

the conveying mechanism is arranged on the rack and comprises a conveying belt, and the conveying belt is used for conveying the tray carrying the substrate along the first direction;

the chip feeding mechanism is arranged on the base station and used for providing chips;

the welding lug feeding mechanism is arranged on the base and used for providing welding lugs;

the resistor feeding mechanism is arranged on the base station and is used for providing a resistor;

Get blowing mechanism, including the carrier and get the material subassembly, the carrier along with first direction vertically second direction with two crossbeam sliding connection, it is in to get the material subassembly along first direction slip setting on the carrier, it is used for transporting chip, soldering lug and resistance to get the material subassembly.

In one embodiment, the conveying mechanism further comprises a jacking component and a limiting piece, wherein the limiting piece is connected with the base, and the jacking component is arranged on the base and can push the tray to be matched with the limiting piece so as to be separated from the conveying belt.

In one embodiment, the chip feeding mechanism comprises a basket assembly for carrying chips, a gripper for inputting chips in the basket assembly to the chip feeding assembly, and a chip feeding assembly for inputting chips on the chip feeding assembly to a tray.

In one embodiment, the tab feeding mechanism is configured to cut a feedstock to form a tab, and the take-out assembly is configured to input the tab on the tab feeding mechanism to a tray.

In one embodiment, the material taking assembly comprises a main body part, a material taking head and a first camera, wherein the main body part is in sliding connection with the bearing part, the material taking heads are multiple in number and are arranged on the main body part, and the first camera is arranged on the main body part and is used for shooting towards the base station.

In one embodiment, the pick-up assembly further includes a dispensing head disposed on the main body portion, the dispensing head being capable of dispensing the chip.

In one embodiment, the device further comprises a liquid supply mechanism, wherein the liquid supply mechanism is arranged on the base station and is used for coating anti-slip liquid on the surfaces of the soldering lug, the chip and the resistor.

In one embodiment, the device further comprises a second camera, wherein the second camera is arranged on the base station and is used for shooting towards the material taking assembly.

In one embodiment, the chip feeding mechanism, the soldering lug feeding mechanism and the resistor feeding mechanism are all located on the same side of the conveyor belt.

In one embodiment, at least one of the following schemes is further included:

the chip feeding mechanism and the soldering lug feeding mechanism are detachably connected with the base station, and the material taking assembly is detachably connected with the bearing piece;

The auxiliary feeding mechanism is arranged on the base station and used for providing a welding sheet which is cut and molded;

The conveying mechanism is provided with an input station, a stacking station and an output station which are arranged at intervals, the stacking station is located between the input station and the output station, a tray enters the conveying belt from the input station and leaves the conveying belt from the output station, and the tray is used for bearing chips, soldering lugs and resistors at the stacking station.

One technical effect of one embodiment of the present application is: in view of the fact that two gantry frames are arranged on the base station, two ends of the conveying belt penetrate through the space surrounded by the two gantry frames and the base station, the bearing piece is arranged on the cross beams of the two gantry frames in a sliding mode along the second direction, the chip feeding mechanism, the welding piece feeding mechanism and the resistor feeding mechanism are arranged on the base station, the material taking assembly is arranged on the bearing piece in a sliding mode along the first direction, reasonable layout of all mechanisms on the frame can be guaranteed, structural compactness of the die bonding device is improved, the material taking assembly slides with two degrees of freedom, accurate movement of the material taking assembly to a designated position in a limited space is guaranteed, and therefore the die bonding device structure is further simplified to achieve compact design.

Drawings

Fig. 1 is a schematic partial perspective view of a die bonding apparatus according to an embodiment.

Fig. 2 is a schematic perspective view of fig. 1 at another view angle.

Fig. 3 is a schematic top view of a die bonding apparatus according to an embodiment.

Fig. 4 is a schematic perspective view of a frame in the die bonding apparatus shown in fig. 3.

Fig. 5 is a schematic plan view of a conveying mechanism in the die bonding apparatus shown in fig. 3.

Fig. 6 is a schematic perspective view of a substrate placed in a tray.

Fig. 7 is a schematic perspective view of a chip feeding mechanism in the die bonding apparatus shown in fig. 3.

Fig. 8 is a schematic perspective view of a soldering lug feeding mechanism and a resistor feeding mechanism in the die bonding apparatus shown in fig. 3.

Fig. 9 is a schematic perspective view of a material taking assembly in the die bonding apparatus shown in fig. 3.

Detailed Description

In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.

In the description of the present application, it should be understood that, if any, these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., are used herein with respect to the orientation or positional relationship shown in the drawings, these terms refer to the orientation or positional relationship for convenience of description and simplicity of description only, and do not indicate or imply that the apparatus or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application.

Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.

In the present application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present application, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.

Referring to fig. 1,2 and 3, a die bonding apparatus 10 according to an embodiment of the present application includes a frame 100, a conveying mechanism 200, a chip feeding mechanism 300, a soldering lug feeding mechanism 400, a resistor feeding mechanism 500 and a pick-and-place mechanism 600. The conveying mechanism 200, the chip feeding mechanism 300, the soldering lug feeding mechanism 400, the resistor feeding mechanism 500 and the taking and placing mechanism 600 are all arranged on the frame 100, so that the frame 100 serves as a bearing carrier of the conveying mechanism 200, the chip feeding mechanism 300, the soldering lug feeding mechanism 400, the resistor feeding mechanism 500 and the taking and placing mechanism 600.

Referring to fig. 1,2 and 4, in some embodiments, the rack 100 includes a base 100 and a gantry 120, the number of the base 100 may be one, the number of the gantry 120 may be two, and the two gantry 120 may be disposed on the base 100 at intervals along the first direction. Each gantry frame 120 includes a cross beam 121 and upright posts 122, where the number of cross beams 121 may be one, the number of upright posts 122 may be two, the two upright posts 122 are disposed at intervals along the second direction, the upright posts 122 extend along the third direction, and the first direction, the second direction, and the third direction may be perpendicular to each other, for example, the first direction may be a length direction (i.e., an X-axis direction) of the base 100, the second direction may be a width direction (i.e., a Y-axis direction) of the base 100, and the third direction may be a height direction (i.e., a Z-axis direction) of the base 100. One end of upright post 122 is fixedly connected with base 100, the other end of upright post 122 keeps a certain distance with base 100, two ends of beam 121 are respectively connected with the other end of upright post 122, so that beam 121 is connected between two upright posts 122, beam 121 is also arranged at intervals with base 100 along the third direction, and therefore an interval space exists between beam 121 and base 100.

Referring to fig. 2, 5 and 6, in some embodiments, the conveying mechanism 200 includes a conveying belt 210, where the conveying belt 210 is movably disposed on the base 100, and one end of the conveying belt 210 is located in a space between two columns 122 of one gantry frame 120 and a space between the base 100 and a beam 121 of one gantry frame 120, that is, one end of the conveying belt 210 is disposed in a space enclosed by the base 100 and one gantry frame 120. The other end of the conveyor belt 210 is located in a space between the two upright posts 122 of the other gantry frame 120 and also in a space between the base 100 and the cross beam 121 of the other gantry frame 120, that is, the other end of the conveyor belt 210 is penetrated in a space surrounded by the base 100 and the other gantry frame 120. The conveyor belt 210 may move linearly in the first direction, and the conveyor belt 210 may drive the tray 21 to move linearly in the first direction when the tray 21 is carried on the conveyor belt 210.

The conveying mechanism 200 may include an infeed station 201, a stacking station 202, and an outfeed station 203, the infeed station 201 being disposed adjacent one of the doorframes 120, the outfeed station 203 being disposed adjacent the other of the doorframes 120, the stacking station 202 being located between the infeed station 201 and the outfeed station 203, it being apparent that the infeed station 201, the stacking station 202, and the outfeed station 203 are disposed at intervals along the first direction. The tray 21 carrying the substrate 22 may enter the conveyor belt 210 at the infeed station 201, i.e., the tray 21 enters the die bonder 10 at the infeed station 201, and the tray 21 carrying the substrate 22 may leave the conveyor belt 210 at the outfeed station 203, i.e., the tray 21 leaves the die bonder 10 at the outfeed station 203. When the conveyor belt 210 drives the tray 21 carrying the substrates 22 into the stacking station 202, the tray 21 may be constrained to the stacking station 202 from following the conveyor belt 210, at which time the pick and place mechanism 600 may place the tabs, chips and resistors on the substrates 22. Specifically, when the pick and place mechanism 600 stacks one of the bonding pads on the substrate 22, the pick and place mechanism 600 may re-stack the chip on the one of the bonding pads. When the pick and place mechanism 600 superimposes another tab on the substrate 22, the pick and place mechanism 600 may superimpose a resistor on the other tab. When the bonding pads, chips, and resistors are stacked, the limitation of the tray 21 is released, so that the tray 21 carrying the substrate 22, bonding pads, chips, and resistors is driven by the conveyor belt 210 to be input to the next process through the output station 203, so that the chips are soldered to the substrate 22 by the bonding pads, and the resistors are soldered to the substrate 22 by the bonding pads.

In some embodiments, the transport mechanism 200 further includes a jacking assembly disposed on the base 100 and corresponding to the stacking station 202, and a stop 220 disposed on the base 100 and corresponding to the stacking station 202. When the tray 21 carrying the substrate 22 reaches the stacking station 202 via the conveyor belt 210, the lift assembly may drive the tray 21 away from the conveyor belt 210 in a third direction such that the tray 21 is completely disengaged from the conveyor belt 210 to prevent the conveyor belt 210 from driving the tray 21 in the first direction. After the tray 21 is completely separated from the conveyor belt 210, the tray 21 and the limiting member 220 can be mutually matched, so that the limiting member 220 plays a role in limiting and fixing the tray 21, and the limiting member 220 can fix the tray 21 at the stacking station 202, so that the tray 21 is prevented from moving along the conveyor belt 210 along the first direction, and the chip, the soldering tab and the resistor are placed on the substrate 22 by the taking and placing mechanism 600. After the chips, the soldering tabs and the resistors are placed, the jacking assembly can be enabled to drive the tray 21 to separate from the limiting piece 220 and move along the third direction to be close to the conveying belt 210, and when the tray 21 contacts with the conveying belt 210, the jacking assembly is separated from the tray 21, so that the conveying belt 210 drives the tray 21 carrying the substrates 22, the soldering tabs, the chips and the resistors to be input to the next process through the output station 203.

Referring to fig. 1, 2, 7, and 8, in some embodiments, the chip feed mechanism 300 includes a basket assembly 310, a gripper 320, and a chip feed assembly 330, the basket assembly 310 being configured to carry chips, the gripper 320 being configured to input chips from the basket assembly 310 to the chip feed assembly 330. The pick and place mechanism 600 is used to input chips on the chip supply assembly 330 to the tray 21. The tab feeding mechanism 400 is used for feeding tabs, specifically, a strip-shaped tape is input to the tab feeding mechanism 400, and the tab feeding mechanism 400 cuts the tape according to the specific size of the required tab, thereby cutting the tape into the tab of the required size. The pick and place mechanism 600 is used to input the solder tabs on the tab feeding mechanism 400 to the tray 21.

Referring to fig. 2 and 3, in some embodiments, the die bonding apparatus 10 may further include an auxiliary feeding mechanism 710, where the auxiliary feeding mechanism 710 is disposed on the base 110, the auxiliary feeding mechanism 710 and the tab feeding mechanism 400 may be located on the same side of the conveyor belt 210, the auxiliary feeding mechanism 710 is used for providing the cut and formed tab, and the pick-and-place mechanism 600 may directly pick the formed tab from the auxiliary feeding mechanism 710 to input to the tray 21.

Referring to fig. 1,2 and 9, in some embodiments, the pick-and-place mechanism 600 includes a carrier 610 and a pick-and-place assembly 620, where the carrier 610 is elongated, the carrier 610 may extend a certain length along a first direction, and two ends of the carrier 610 are slidably disposed on two cross beams 121 of two door frames 120, so that the carrier 610 can slide reciprocally along a second direction relative to the cross beams 121. For example, a sliding rail may be disposed on the cross beam 121, and a sliding groove may be disposed on the carrier 610, so that the sliding connection relationship between the carrier 610 and the cross beam 121 may be realized through the cooperation of the sliding rail and the sliding groove. The take out assembly 620 includes a main body 621, a take out head 622, and a first camera 623. The main body 621 is slidably connected to the carrier 610, so that the main body 621 can slide reciprocally along the first direction relative to the carrier 610, the material pick-up head 622 is disposed on the main body 621, and the material pick-up head 622 can grasp the chip, the resistor and the soldering lug in a vacuum adsorption and/or magnetic adsorption manner to realize transfer. The number of the pick heads 622 may be plural, for example, when a plurality of chips, soldering tabs or resistors are required to be input into the tray 21, the plurality of pick heads 622 may be used to suck the chips, soldering tabs or resistors, thereby improving the working efficiency. Since the carrier 610 can slide in the second direction relative to the base 100, the main body 621 can slide in the first direction relative to the carrier 610, the pick-up head 622 and the entire pick-up assembly 620 can slide in the first and second directions relative to the base 100, such that the pick-up assembly 620 has two degrees of freedom of sliding, thereby ensuring that the pick-up assembly 620 can accurately move to a designated position.

The first camera 623 is disposed on the main body portion 621, and the first camera 623 is for photographing toward the base 100, and in colloquial, the first camera 623 photographs downward. When the pick-up assembly 620 transfers the chips, the pick-up assembly 620 may be moved to above the chips by sliding the carrier 610 and the main body 621, and photographed by the first camera 623 to form a visual alignment, and then the pick-up head 622 sucks the chips. When the material taking assembly 620 transfers the solder mask, the material taking assembly 620 may be moved to above the solder mask by sliding the carrier 610 and the main body 621, and photographed by the first camera 623 to form a visual alignment, and then the material taking head 622 is made to suck the solder mask. When the material taking assembly 620 transfers the resistor, the material taking assembly 620 can move to the upper side of the resistor by sliding the carrier 610 and the main body 621, and the first camera 623 shoots to form a visual positioning, and then the material taking head 622 sucks the resistor.

Referring to fig. 3, in some embodiments, the die bonding apparatus 10 may further include a second camera 720, where the second camera 720 is disposed on the base 100, and the second camera 720 is configured to shoot toward the material taking component 620, and in general, the second camera 720 shoots upward. The pick-up assembly 620 picks up the chip to be stacked on the bonding pad, but the pick-up assembly 620 is made to pick up the chip to pass over the second camera 720, so that the second camera 720 performs angle recognition on the chip, and the chip is ensured to be stacked on the bonding pad in an accurate posture. The pick-up assembly 620 picks up the resistor to be stacked on the soldering lug, but the pick-up assembly 620 is made to pick up the resistor to pass over the second camera 720, so that the second camera 720 performs angle recognition on the resistor to ensure that the resistor is stacked on the soldering lug in an accurate posture.

Of course, after the chips are stacked on the bonding pads, the first camera 623 may be moved over the chips to take a picture, and calculated by an algorithm to check a deviation between an actual stacking position of the chips and a target position, thereby judging whether the chips are stacked successfully. When the chip stacking is not successful, the chips may be sucked up by the pick-up assembly 620 to be stacked again. After the resistor is stacked on the tab, the first camera 623 may be moved over the resistor to take a picture, and calculated by an algorithm to check a deviation between an actual stacking position of the resistor and a target position, thereby judging whether the resistor is stacked successfully. When the resistor is not stacked successfully, the resistor may be sucked up by the pick-up assembly 620 to be stacked again.

Referring to fig. 9, in some embodiments, the pick-up assembly 620 further includes a dispensing head 624, the dispensing head 624 being disposed on the main body 621, the dispensing head 624 being capable of dispensing chips. Specifically, in the case that the chip is relatively smooth, in order to prevent the chip from sliding relative to the soldering lug, before the chip is stacked on the soldering lug, dispensing can be performed on the surface of the chip stacked on the soldering lug by the dispensing head 624, so that the chip can be fixed on the soldering lug by dispensing, and the chip can be effectively prevented from sliding relative to the soldering lug and the substrate 22 in the process that the conveying belt 210 drives the tray 21 to move. Of course, in other embodiments, for example, before the resistor is stacked on the soldering lug, the dispensing head 624 may perform dispensing on the surface of the resistor stacked, so that the resistor is fixed on the soldering lug by way of dispensing, and the resistor is effectively prevented from sliding relative to the soldering lug and the substrate 22 during the process of driving the tray 21 to move by the conveying belt 210. For another example, before the soldering lug is stacked on the substrate 22, the dispensing head 624 may be used to dispense glue on the surface on which the soldering lug is stacked, so that the soldering lug is fixed on the substrate 22 by dispensing glue, and the soldering lug can be effectively prevented from sliding relative to the substrate 22 during the process of driving the tray 21 by the conveyor belt 210.

Referring to fig. 3, in some embodiments, the die bonding apparatus 10 may further include a liquid supply mechanism 730, where the liquid supply mechanism 730 is disposed on the base 100, and the liquid supply mechanism 730 may provide an anti-slip liquid such as alcohol. For example, the pick-up assembly 620 may be caused to move the chip over the liquid supply 730 prior to stacking the chip on the bonding pad, the liquid supply 730 may apply alcohol to the stacking surface of the chip and bonding pad, and the chip may be effectively prevented from sliding relative to the bonding pad by the adhesive force generated by the alcohol when the chip is stacked on the bonding pad. For another example, prior to stacking the resistor on the soldering lug, the take-out assembly 620 may be caused to move the resistor over the liquid supply mechanism 730. The liquid supply mechanism 730 may coat the stacking surface of the resistor and soldering lug with alcohol, and when the resistor is stacked on the soldering lug, the sliding of the resistor relative to the soldering lug may be effectively prevented by the adhesion force generated by the alcohol. For another example, the pick-up assembly 620 may be configured to move the tab over the liquid supply 730 before the tab is stacked on the substrate 22, the liquid supply 730 may apply alcohol to the stacked surface of the tab and the substrate 22, and the tab may be effectively prevented from sliding relative to the substrate 22 by the adhesive force generated by the alcohol when the tab is stacked on the substrate 22.

In some embodiments, the chip feed mechanism 300, the tab feed mechanism 400, and the resistive feed mechanism 500 are all on the same side of the conveyor belt 210. Thus, the chip feeding mechanism 300, the soldering lug feeding mechanism 400 and the resistor feeding mechanism 500 can be reasonably arranged, so that the structural compactness of the die bonding device 10 is improved. The chip feeding mechanism 300 and the soldering lug feeding mechanism 400 can be detachably connected with respect to the base 100, and when the size of a chip is changed, the chip feeding mechanism 300 can be replaced in a detachable manner, so that chips with different sizes can be supplied through the matched chip feeding mechanism 300. Likewise, in the case of a change in the size of the chip, the size of the solder tab is changed, and thus the solder tab feeding mechanism 400 can be replaced in a detachable manner, so that solder tabs of different sizes can be supplied through the matched solder tab feeding mechanism 400. Of course, the resistor feeding mechanism 500 may be detachably connected to the base 100, so that the convenience of maintenance of the resistor feeding mechanism 500 can be improved. The material taking assembly 620 may also be detachably connected to the carrier 610, and when the chip is not stacked with the soldering lug at normal temperature, but needs to be stacked with the soldering lug at a certain pressure and temperature, the material taking assembly 620 may be replaced in a detachable manner, so that the material taking assembly 620 may heat and pressurize the chip, so that the chip is stacked with the soldering lug under the condition of pressure and temperature. Therefore, through reasonable collocation of the chip feeding mechanism 300, the soldering lug feeding mechanism 400 and the material taking assembly 620, the universality of the die bonding device 10 can be improved, and the die bonding device 10 can meet the working requirements under different application scenes to the greatest extent.

In view of the two gantry frames 120 disposed on the base 100, two ends of the conveyor belt 210 pass through the two gantry frames 120 and the space surrounded by the base 100, the carrier 610 is slidably disposed on the cross beams 121 of the two gantry frames 120, the material taking component 620 is slidably disposed on the carrier 610, and the chip feeding mechanism 300, the soldering lug feeding mechanism 400 and the resistor feeding mechanism 500 are all located on the same side of the conveyor belt 210. Therefore, the compactness of the die bonding device 10 can be improved, and the material taking assembly 620 has two degrees of freedom sliding, so that the material taking assembly 620 can accurately move to a designated position in a limited space, and the structure of the die bonding device 10 is further simplified to realize compact design.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.

Claims (10)

1. A die bonding apparatus, comprising:

The frame comprises a base station and two gantry frames, wherein the two gantry frames are arranged on the base station at intervals along a first direction, each gantry frame comprises a cross beam and two upright posts, one ends of the two upright posts are connected with the base station, and the cross beams are connected between the other ends of the two upright posts far away from the base station;

the conveying mechanism is arranged on the rack and comprises a conveying belt, and the conveying belt is used for conveying the tray carrying the substrate along the first direction;

the chip feeding mechanism is arranged on the base station and used for providing chips;

the welding lug feeding mechanism is arranged on the base and used for providing welding lugs;

the resistor feeding mechanism is arranged on the base station and is used for providing a resistor;

Get blowing mechanism, including the carrier and get the material subassembly, the carrier along with first direction vertically second direction with two crossbeam sliding connection, it is in to get the material subassembly along first direction slip setting on the carrier, it is used for transporting chip, soldering lug and resistance to get the material subassembly.

2. The die bonding apparatus according to claim 1, wherein the conveying mechanism further comprises a lifting assembly and a limiting member, the limiting member is connected with the base, and the lifting assembly is arranged on the base and can push the tray to be matched with the limiting member so as to be separated from the conveying belt.

3. The die bonding apparatus of claim 1, wherein the die feeding mechanism comprises a basket assembly for carrying the die, a gripper for inputting the die in the basket assembly to the die feeding assembly, and a die feeding assembly for inputting the die on the die feeding assembly to a tray.

4. The die bonding apparatus of claim 1, wherein the tab feeding mechanism is configured to cut a feedstock to form a tab, and the take-out assembly is configured to input the tab on the tab feeding mechanism to a tray.

5. The die bonding apparatus according to claim 1, wherein the pick-up assembly comprises a main body portion, pick-up heads and a first camera, the main body portion is slidably connected with the carrier, the pick-up heads are plural in number and disposed on the main body portion, and the first camera is disposed on the main body portion and is used for shooting toward the base station.

6. The die bonding apparatus of claim 5, wherein the pick-up assembly further comprises a dispensing head disposed on the body portion, the dispensing head being operable to dispense a die.

7. The die bonding apparatus of claim 1, further comprising a liquid supply mechanism disposed on the base, the liquid supply mechanism for applying an anti-slip liquid to surfaces of the bonding pads, chips and resistors.

8. The die bonding apparatus of claim 1, further comprising a second camera disposed on the base, the second camera configured to capture images toward the take out assembly.

9. The die bonding apparatus of claim 1, wherein the chip feeding mechanism, the tab feeding mechanism, and the resistive feeding mechanism are all located on the same side of the conveyor belt.

10. The die bonding apparatus of claim 1, further comprising at least one of:

the chip feeding mechanism and the soldering lug feeding mechanism are detachably connected with the base station, and the material taking assembly is detachably connected with the bearing piece;

The auxiliary feeding mechanism is arranged on the base station and used for providing a welding sheet which is cut and molded;

The conveying mechanism is provided with an input station, a stacking station and an output station which are arranged at intervals, the stacking station is located between the input station and the output station, a tray enters the conveying belt from the input station and leaves the conveying belt from the output station, and the tray is used for bearing chips, soldering lugs and resistors at the stacking station.