KR20240114259A - Bonding device, bonding method and computer readable medium - Google Patents

Abstract

Provides technology for a bonding device that can mount electronic components at target locations on a board with minimal wasted time.
The bonding device 1 for bonding the electronic component D to the substrate F picks up the electronic component D from the initial position (0, 0, 0) and moves it to the target position (S _x , S) on the substrate F. _y , S _z ), a bonding tool 2 for bonding, a drive unit 5 for moving the bonding tool 2, and the coordinates (X, Y, Z) of the bonding tool 2 are determined from the first coordinates. 2 coordinates are periodically updated at predetermined time intervals, and based on the total amount of movement from the first coordinate to the second coordinate (S _x , S _y , S _z ), the bonding tool 2 is moved to the initial position (0, 0) , 0) and is provided with a control unit 4 that controls the drive unit 5 to move from the target position (S _x , S _y , S _z ).

Description

Bonding device, bonding method and computer readable medium

The present invention relates to technology of a bonding device for mounting electronic components on a board.

A bonding device uses a bonding tool such as a suction collet to pick up electronic components such as die of a semiconductor wafer and mount them on the surface of a substrate such as a lead frame. When picking up electronic components, positional misalignment may occur between the bonding tool and the electronic component.

In order to mount electronic components at target positions on a board with high precision, a bonding device has been proposed that uses a camera to capture images of the bonding tool from below, measures the amount of misalignment between the bonding tool and the electronic component, and corrects the position of the bonding tool. (For example, see Patent Document 1). This bonding device calculates the movement trace of all strokes from the initial position to the target position, and when the amount of deviation is calculated, the position is corrected by switching from the existing movement trace to the movement trace heading toward the corrected target position.

[Patent Document 1] Japanese Patent Publication No. 2012-59933

However, there are cases where it takes time to calculate the amount of misalignment from the captured image. When the amount of deviation was calculated at a time when the bonding tool was approaching the target position and decelerating, the movement trajectory did not change in time, so the bonding tool moved to the target position and stopped for now. Once it stops, there is wasted time until it moves back toward the target position after correction.

The present invention was made in view of the above problems, and its purpose is to provide technology related to a bonding device that can mount electronic components at target positions on a board while minimizing wasted time.

A bonding device according to one embodiment of the present invention is a bonding device for bonding an electronic component to a substrate, including a bonding tool that picks up the electronic component from an initial position and bonds it to a target position on the substrate, a drive unit that moves the bonding tool, and a bonding tool that moves the bonding tool. A driving unit to periodically update the coordinates of the tool from the first coordinate to the second coordinate at predetermined time intervals and move the bonding tool from the initial position to the target position based on the total amount of movement from the first coordinate to the second coordinate. It is equipped with a control unit that controls.

According to the present invention, rather than calculating the movement traces of all strokes from the initial position to the target position to move the bonding tool, the movement traces of minute movements in each cycle are repeatedly calculated and connected to each other. Since the bonding tool is moved, the target position can be changed even during deceleration, and continuous movement to the changed target position is possible. It is possible to provide technology related to a bonding device that can mount electronic components at target positions on a board with minimal wasted time.

[Figure 1] A cross-sectional view showing an example of a bonding device according to an embodiment of the present invention.
[FIG. 2] is a block diagram showing the relationship between functional components of the bonding device shown in FIG. 1.
[FIG. 3A] is a cross-sectional view showing the movement trajectory of the bonding head shown in FIG. 1 when the electronic component is not misaligned with the bonding head.
[FIG. 3B] is a cross-sectional view showing the movement trajectory of the bonding head shown in FIG. 1 when the electronic component is misaligned.
[FIG. 4] is a flowchart showing a bonding method using the bonding device shown in FIG. 1.

A preferred embodiment of the present invention will be described with reference to the accompanying drawings. Items assigned the same reference numeral in each drawing have the same or similar configuration. Hereinafter, each configuration will be described in detail with reference to FIGS. 1 to 4. Fig. 1 is a cross-sectional view showing an example of a bonding device 1 according to an embodiment of the present invention.

The bonding device 1 of one embodiment of the present invention is a die bonder that bonds an electronic component D such as a die to a substrate F such as a lead frame. Bonding the electronic component (D) to the substrate (F) means not only bonding the electronic component (D) directly to the substrate (F), but also bonding the electronic component (D) on top of other electronic components bonded to the substrate (F). ) includes stacking and bonding.

The electronic component D is not limited to a die (semiconductor element), and may be another type of electronic component such as a MEMS chip. When the electronic component D is a die, die bonding with the active surface facing upward may be used, or flip chip bonding with the active surface facing downward may be used. The substrate F is not limited to a lead frame, and may be another type of substrate such as an interposer substrate.

As shown in FIG. 1, the bonding device 1 includes a stage 3 for transporting a substrate F, a bonding tool 2 such as a suction collet mounted on a bonding head, and the bonding tool 2 from below. It is equipped with a camera 61 for imaging.

The bonding device 1 may have any configuration, including a wafer cassette lifter for supplying the electronic component D fixed to a wafer ring or the like to the bonding head, a frame stack loader for supplying the substrate F to the stage 3, and a stage ( 3) A dispenser for applying adhesive such as silver paste to the substrate (F) transported on the stage, an unloader magazine for recovering the substrate (F) on which the electronic components (D) are mounted from the stage (3), etc. You may have it.

In the following description, the conveyance direction of the stage 3 along which the substrate F flows is defined as the X-axis direction, the width direction of the stage 3 crossing the conveyance direction is defined as the Y-axis direction, and the vertical direction is defined as the Z-axis direction. In the example shown, the X-axis, Y-axis and Z-axis are orthogonal to each other. The bonding head is provided with a drive unit 5, which will be described later, and uses a bonding tool 2 to pick up the electronic component D at the initial position (0, 0, 0) from a wafer ring, etc., and remove adhesive, solder, etc. It is mounted at the target position (S _x , S _y , S _z ) of the coated substrate (F).

FIG. 2 is a block diagram showing the relationship of functional components of the bonding device 1 shown in FIG. 1. As shown in FIG. 2, the bonding device 1 includes a drive unit 5 that moves the bonding tool 2, a control unit 4 that controls the drive unit 5, a bonding tool 2, and an electronic component (D). ) and a measuring unit 6 that measures the amount of misalignment.

The control unit 4 is provided with a trajectory calculation unit 41 such as a motion controller that calculates the movement trajectory of the bonding tool 2. The control unit 4 may further include other types of control boards. In addition to the camera 61 described above, the measuring unit 6 is a vision board or the like that processes the image captured by the camera 61 to calculate the amount of misalignment between the bonding tool 2 and the electronic component D. An image processing unit 62 is further provided.

The driving unit 5 receives commands from the motors 52X, 52Y, and 52Z that move the bonding tool 2 in the ) is equipped with servo amplifiers (51X, 51Y, 51Z) that drive. The drive unit 5 may further include a motor for rotating the bonding tool 2 around a rotation axis parallel to the Z-axis, a servo amplifier for driving the motor, etc.

The trajectory calculation unit 41 periodically updates the coordinates (X, Y, Z) of the moving destination of the bonding tool 2, and the drive unit 5 moves the bonding tool 2 with the coordinates given from the trajectory calculation unit 41. One of the characteristics is that it moves sequentially. In the following description, the coordinates before update in each cycle are called "first coordinates" or "coordinates of movement source," and the coordinates after update are called "second coordinates" or "coordinates of movement destination." there is. In each cycle, the coordinates before update and the coordinates after update may be the same. In that case, the amount of movement in that cycle is zero, and the bonding tool 2 can stop in place without moving.

According to the bonding device 1 configured as above, the movement trajectory of all strokes from the initial position (0, 0, 0) to the target position (S _x , S _y , S _z ) is calculated and the bonding tool 2 is used. Instead of moving it, the movement trajectory of the micro-movement in each cycle is repeatedly calculated and connected to each other to move the bonding tool 2, so even during deceleration of the bonding tool 2, the target position (S _x , S _y , S _z ) can be changed, _{and continuous} movement _{to the} target position (S _x + Electronic components (D) can be mounted at target positions (S _x , S _y , S _z ) on the board (F) with minimal wasted time.

When the cycle of updating the coordinates (X, Y, Z) of the bonding tool (2) is sufficiently small, all strokes from the initial position (0, 0, 0) to the target position (S _x , S _y , S _z ) Compared to the case where the movement trajectory is output, the movement trajectory of the bonding tool 2 can be changed smoothly. The cycle at which the trajectory calculation unit 41 updates the coordinates is preferably within 400 μsec, and more preferably within 200 μsec, for example.

FIG. 3A is a cross-sectional view showing the movement trace of the bonding tool 2 shown in FIG. 1 when the electronic component D is not misaligned, and FIG. 3B is a cross-sectional view showing the bonding tool 2 shown in FIG. 1 ( This is a cross-sectional view showing the movement trace of the bonding tool 2 when 2) and the electronic component D are misaligned. When picking up the electronic component D, positional misalignment may occur between the bonding tool 2 and the electronic component D. When the bonding tool 2 is a suction collet, positional deviation in the Z direction is unlikely to occur, so positional deviation parallel to the XY plane occurs, as shown in FIG. 3B.

_When the trajectory calculation unit 41 receives the amount _of deviation _{( -} A correction value according to the amount of deviation (-X _dc , -Y _dc , 0) is added to each of the periodically updated second coordinates to offset (-X _dc , -Y _dc , 0). As a result, as shown in FIG. 3B, even if the movement trajectory of the bonding tool 2 changes and a positional misalignment occurs between the bonding tool 2 and the electronic component D, the electronic component D is connected to the substrate F. It can be mounted at the target location (S _x , S _y , S _z ).

In the bonding device 1 of one embodiment of the present invention, the trajectory calculation unit 41 calculates the movement trajectory of all strokes from the initial position (0, 0, 0) to the target position (S _x , S _y , S _z ). When calculating the amount of deviation _{( -} The movement trajectories of are calculated repeatedly, and they are connected to each other to move the bonding tool 2. Since addition of the correction value can be started from any of the multiple movement trajectories, continuous movement to the corrected target position (S _x +X _dc , S _y + Y _dc , S _z ) becomes possible. As shown in FIG. 3B, since the movement trajectory before and after the change continues smoothly, wasted time can be minimized.

The form in which the bonding device 1 of one embodiment of the present invention changes the movement trajectory of the bonding tool 2 is not limited to position correction between the bonding tool 2 and the electronic component D. For example, the bonding tool 2 starts moving from the initial position toward a target position with a relatively large deviation width, and while the bonding tool 2 is moving, the control unit 4 receives detailed target position information from an external device. The bonding device 1 may be used in a form that changes the movement trajectory to a target position different from the target position at the start of movement.

FIG. 4 is a flowchart showing a bonding method (steps S1 to S13) using the bonding device 1 shown in FIG. 1 as an example of a bonding method according to an embodiment of the present invention. As shown in FIG. 4, the bonding method first picks up the electronic component D from the initial position (0, 0, 0) using the bonding tool 2 (step S1).

Next, the coordinates (X, Y, Z) of the bonding tool 2 are periodically updated from the first coordinate to the second coordinate (step S2), and the driver 5 is adjusted to the updated coordinates (X, Y, Z). Move the bonding tool 2 (step S3). Steps S2 to S3 are repeated until the bonding tool 2 reaches the optical axis 61Z of the camera 61 (step S4: No).

When the bonding tool 2 reaches the optical axis 61Z of the camera 61 (step S4: Yes), the camera 61 captures an image of the electronic component D held by the bonding tool 2 ( Sequence S5). Even after imaging, the coordinates (X, Y, Z) of the bonding tool 2 are periodically updated from the first coordinates to the second coordinates (step S6), and the driver 5 is moved to the updated coordinates (X, Y, Z). Move the bonding tool 2 (step S7).

Steps S6 to S7 are repeated until the image processing unit 62 of the measurement unit 6 measures the amount of deviation (-X _dc , -Y _dc , 0) from the captured image (step S8: No). When the image processing unit 62 measures the amount of deviation (-X _dc , -Y _dc , 0) from the captured image (step S8: Yes), it contacts the control unit 4 of the measurement unit 6.

In the control unit 4 that has received the deviation amount _{( -} By adding a small correction value according to the amount of deviation (-X _dc , -Y _dc , 0) to each of the two coordinates, the coordinates (X, Y, Z) of the bonding tool 2 are slightly corrected and updated. The drive unit 5 moves the bonding tool 2 to the updated coordinates (X, Y, Z) (step S11).

Steps S9 to S11 are repeated until the bonding tool 2 reaches the target position (S _x +X _dc , S _y + Y _dc , S _z ) after correction (step 12: No). When the bonding tool _{2 reaches} the _target position (S _{x +} Mount at the target position (S _x , S _y , S _z ) (step S13).

The program of one embodiment of the present invention causes the bonding device 1 shown in FIG. 1 to execute the bonding method (steps S1 to S13) shown in FIG. 4. The program may be stored in a storage device such as a hard disk drive or flash memory of the bonding device 1, or may be stored in a removable storage medium such as an optical disk, and is stored in the bonding device 1 when the storage medium is mounted on the drive device. It may be installed on a storage device. According to this technology regarding the bonding device 1 of one embodiment of the present invention, the electronic component D is positioned at the target position (S _x , S _y , S _z ) on the substrate F with minimal wasted time. It can be installed.

The embodiments described above are intended to facilitate understanding of the present invention and are not intended to limit or interpret the present invention. Each element included in the embodiment and its arrangement, materials, conditions, shape, size, etc. are not limited to the examples and can be changed as appropriate. The components shown in another embodiment can be partially substituted or combined.

［Appendix 1］

The bonding device 1 is a bonding device that bonds the electronic component D to the substrate F, and picks up the electronic component D from the initial position (0, 0, 0) and moves it to the target position ( The _bonding tool 2 _for bonding to _S Periodically updates from the first coordinate to the second coordinate at predetermined time intervals, and moves the bonding tool 2 to the initial position based on the total amount of movement (S _x , S _y , S _z ) from the first coordinate to the second coordinate. It is provided with a control unit 4 that controls the drive unit 5 to move from (0, 0, 0) to the target position (S _x , S _y , S _z ).

According to Supplementary Note 1, the bonding tool 2 is not moved by calculating the movement trajectory of all strokes from the initial position (0, 0, 0) to the target position (S _x , S _y , S _z ), but each Since the movement trajectories of small movements in a cycle are repeatedly calculated and the bonding tool 2 is moved by connecting them to each other, the target position (S _x , S _y , S _z ) can be changed even during deceleration, and continuous _{It becomes} possible _to move to the target position (S _{x +} It is possible to provide technology regarding a bonding device 1 that can mount electronic components D at target positions S _x , S _y , and S _z on a substrate F with minimal wasted time.

［Appendix 2］

In Supplementary Note 1, it is further provided with a measuring unit 6 that measures the amount of misalignment (-X _dc , -Y _dc , 0) between the bonding tool 2 and the electronic component D, and the control unit 4 periodically measures A _{correction value} according to the _amount of deviation ( _- You may correct X _dc , -Y _dc , 0).

［Appendix 7］

The bonding method (sequences S1 to S13) involves picking up the electronic component D from the initial position (0, 0, 0) using the bonding tool 2 (sequence S1), and selecting the coordinates of the bonding tool 2 (sequence S1). Periodically updating ), measuring the amount of misalignment between the bonding tool and the electronic component from the captured image (step S8), correction values according to the amount of misalignment (-X _dc , -Y _dc , 0) for each of the periodically updated second coordinates (step S10), and controlling the drive unit 5 that moves the bonding tool 2 to obtain the total amount of movement from the first coordinate to the second coordinate (S _x +X _dc , S _y + Y _dc , S _Based on _z ), the _bonding tool 2 is moved to _{the target} position (S _{x +} , S _z ) (step S12), and mounting the electronic component D held by the bonding tool 2 at the target position (S _x , S _y , S _z ) on the substrate F (step S12). S13), includes.

［Appendix 8］

The program picks up the electronic component D from the initial position (0, 0, 0) using the bonding tool 2 (step S1), and sets the coordinates (X, Y, Z) of the bonding tool 2. Periodically updating from the first coordinate to the second coordinate (steps S2, S9, S12), taking an image of the electronic component D held in the bonding tool 2 (step S5), from the captured image, Measuring the amount of misalignment between the bonding tool and the electronic component (step S8), adding a correction value according to the amount of misalignment (-X _dc , -Y _dc , 0) to each of the periodically updated second coordinates (step S10) ), _and controlling the drive unit 5 _that moves the bonding tool 2, based on the total amount _of movement from the _first coordinate to the second coordinate (S _x + Move the _tool (2 ₎ from _the initial position (0, ₀ , 0) to the _target position (S _{x +} (step S12), mounting the electronic component D held by the bonding tool 2 at the target position (S _x , S _y , S _z ) on the substrate F (step S13), the bonding device ( Run it in 1).

According to Supplementary Note 2 and Supplementary Notes 7 and 8, the amount of misalignment (-X _dc , -Y _dc , 0) between the bonding tool 2 and the electronic component D measured using the measuring unit 6 is added. Correction can be made based on the total of the corrected correction values (X _dc , Y _dc , 0). When picking up the electronic component (D), _even if a _positional misalignment occurs between the bonding tool (2) and the electronic component ( _D ) _, the target position (S _x + Electronic components (D) can be mounted with high precision.

[Appendix 3]

In the above Supplementary Note 2, the measurement unit 6 further includes a camera 61 capable of capturing an image of the electronic component D held by the bonding tool 2, and a deviation _amount (- Y _dc , 0) may be measured.

_According to Supplementary Note 3 above, the amount of deviation ( _-

［Book 4］

In Supplementary Note 2 above, the total of the added correction values (X _dc , Y _dc , 0) may be a horizontal movement parallel to the XY plane.

When picked up using a suction collet, positional deviation in the Z direction is unlikely to occur. According to Supplementary Note 4 above, it is suitable when the bonding tool 2 is a suction collet. The bonding tool 2 is not limited to a suction collet, and may be a chuck or the like.

［Appendix 5］

In any of the above Supplementary Notes 1 to 4, the control unit 4 may calculate the second coordinates using the following equations (1) and (2).

X, Y: Coordinates

Sx, Sy: Coordinates of target location

C _x0 ∼C _x7 , C _y0 ∼C _y7 : coefficients

t _x , t _y : Elapsed time from movement start

T _x , T _y : Movement time from movement start to movement end

According to Supplementary Note 5 above, obstacles (e.g., camera 61, guide of stage 3) between the initial position (0, 0, 0) and the target position (S _x , S _y , S _z ) The bonding tool 2 can be moved while avoiding the smooth movement trajectory calculated by the 7th equation.

［Appendix 6］

In any of the above Supplementary Notes 2 to 4, the control unit 4 may calculate the second coordinates by adding the correction value using the following equations (3) and (4).

X, Y: Coordinates

Sx, Sy: Coordinates of target location

X _dc , Y _dc : Correction value to offset the amount of misalignment

C _x0 ∼C _x7 , C _y0 ∼C _y7 : coefficients

t _x , t _y : Elapsed time from movement start

T _x , T _y : Movement time from movement start to movement end

t _dx , t _dy : Elapsed time from correction start

T _dx , T _dy : Movement time from correction start to movement end

According to Supplementary Note 6 above, since the correction value added to each of the periodically updated second coordinates is calculated using the same 7th-order equation as the movement trajectory before correction, the movement trajectory in each period to which the correction value is added can be smoothly connected.

One… Bonding device, 2… Bonding tool, 3… Stage, 4… Control unit, 5… Drive part, 6… Measuring part, 41... Trajectory calculation unit, 51X, 51Y, 51Z… Servo amplifiers, 52X, 52Y, 52Z… Motor, 61… Camera, 61Z… The optical axis of the camera, 62… Image processing unit, D… Electronic components, F… Board.

Claims (8)

A bonding device for bonding electronic components to a substrate,
a bonding tool that picks up the electronic component from an initial position and bonds it to a target position on the substrate;
A driving unit that moves the bonding tool,
The coordinates of the bonding tool are periodically updated from the first coordinate to the second coordinate at predetermined time intervals, and the bonding tool is moved from the initial position based on the total amount of movement from the first coordinate to the second coordinate. A bonding device including a control unit that controls the driving unit to move to a target position. In claim 1,
Further comprising a measuring unit that measures the amount of misalignment between the bonding tool and the electronic component,
The bonding device wherein the control unit adds a correction value according to the amount of misalignment to each of the periodically updated second coordinates, and corrects the amount of misalignment based on the total of the added correction values. In claim 2,
A bonding device wherein the measuring unit further includes a camera capable of capturing an image of the electronic component held by the bonding tool, and measures the amount of deviation from the captured image. In claim 2,
A bonding device where the total of the added correction values is a horizontal movement parallel to the XY plane. In claim 1,
The bonding device wherein the control unit calculates the second coordinates using the following equations (1) and (2).

X, Y: Coordinates
Sx, Sy: Coordinates of target location
C _x0 ∼C _x7 , C _y0 ∼C _y7 : coefficients
t _x , t _y : Elapsed time from movement start
T _x , T _y : Movement time from movement start to movement end In claim 2,
The bonding device wherein the control unit calculates the second coordinates by adding the correction values using the following equations (3) and (4).

X, Y: Coordinates
Sx, Sy: Coordinates of target location
X _dc , Y _dc : Correction value to offset the amount of misalignment
C _x0 ∼C _x7 , C _y0 ∼C _y7 : coefficients
t _x , t _y : Elapsed time from movement start
T _x , T _y : Movement time from movement start to movement end
t _dx , t _dy : Elapsed time from correction start
T _dx , T _dy : Movement time from correction start to movement end Picking up electronic components from their initial position using a bonding tool;
Periodically updating the coordinates of the bonding tool from first coordinates to second coordinates,
imaging the electronic component held in the bonding tool,
Measuring the amount of misalignment between the bonding tool and the electronic component from the captured image,
Adding a correction value according to the amount of deviation to each of the periodically updated second coordinates, and
Controlling a driving unit that moves the bonding tool, moving the bonding tool from the initial position to the target position where the amount of misalignment is corrected based on the total amount of movement from the first coordinate to the second coordinate, and A bonding method including mounting the electronic component held in a tool at a target position on a substrate. Picking up electronic components from their initial position using a bonding tool;
Periodically updating the coordinates of the bonding tool from first coordinates to second coordinates,
imaging the electronic component held in the bonding tool,
Measuring the amount of misalignment between the bonding tool and the electronic component from the captured image,
Adding a correction value according to the amount of deviation to each of the periodically updated second coordinates, and
Controlling a driving unit that moves the bonding tool, moving the bonding tool from the initial position to the target position where the amount of misalignment is corrected based on the total amount of movement from the first coordinate to the second coordinate, and A computer-readable medium that records a program for causing a bonding device to mount the electronic component held in a tool at a target position on a board.