JP6124969B2 - Die bonder and bonding method - Google Patents

Description

  The present invention relates to a die bonder and a bonding method, and more particularly to a die bonder and a bonding method capable of processing a wafer having a plurality of grades without removing the wafer.

A part of the process of assembling a package by mounting a die (semiconductor chip) (hereinafter simply referred to as a die) on a substrate such as a wiring board or a lead frame, and a step of dividing the die from a semiconductor wafer (hereinafter simply referred to as a wafer) In addition, there is a bonding process of the divided dies on the substrate.
The die on the wafer to be picked up is discriminated into a plurality of grades based on the electrical characteristics and stored in the memory of the control device. Mounting such dies having a plurality of grades on a substrate is performed by using different die bonders for each grade, so that replacement takes time and productivity is lowered. Further, when the wafer once picked up is removed from the die bonder, the dies whose sheet tension has been loosened come into contact with each other, and there is a risk that the yield will be reduced.

  There exists patent document 1 as a technique which solves this subject. In the technique disclosed in Patent Document 1, a plurality of lanes for conveying a lead frame are provided, and a plurality of grades are bonded to each lane with a bonding head.

Japanese Patent Application Laid-Open No. 07-193093

  However, a need exists for various die bonders to process wafers having multiple grades without removing the wafer. The first is a die bonder having a single transfer lane and a single bonding head, and the second is a die bonder having a plurality of transfer lanes and a plurality of bonding heads in order to improve recent productivity.

  Patent Document 1 does not recognize the above needs, and of course does not disclose a specific solution.

  Accordingly, a first object of the present invention is to provide a die bonder or bonding method capable of performing a wafer grade process having a plurality of dies without removing the wafer in a die bonder having a single transfer lane and a single bonding head. Is to provide.

  A second object of the present invention is to provide a die bonder or bonding method capable of processing a grade of a wafer having a plurality of grade dies without removing the wafer in a die bonder having a plurality of transfer lanes and a plurality of bonding heads. That is.

In order to achieve the above object, the present invention has at least the following features.
The present invention creates a classification die classification map in which dies having different electrical characteristics of a wafer are classified into a plurality of grades, picks up the dies from the wafer, and selects the dies picked up by a bonding head as a substrate or already Bonding on the bonded dies, and transporting the classification substrate bonded to the classification die by the transport lane to the bonding area for bonding in units of the classification substrate, the single transport lane and the single A die bonder or bonding method having a bonding head, or having a plurality of the transport lanes and a plurality of the bonding heads, wherein the classification control is performed to bond the classification die to the corresponding classification substrate based on the classification map. Is the first feature.

  The second feature of the present invention is that classification control is performed to bond the classification die to the corresponding classification substrate based on the classification map.

Further, the die bonder has a single transfer lane and a single bonding head, and the classification control supplies at least one classification substrate of the plurality of the classification substrates from one end of the transfer lane, and the bonding After that, the third feature is to return to the one end side and carry it out.
Further, according to the present invention, the die bonder has a plurality of transport lanes and a plurality of bondings, and the classification control supplies different classification substrates from both ends to at least one of the plurality of transport lanes. The fourth feature is that the different classification substrates are returned to the supplied side.

Further, in the present invention, the plurality of the plurality of grades is 3, and the classification control step includes the classification of bonding the most frequently classified dies in the most frequently transported lane that transports the most frequently classified dies having the largest number of bonds. A fifth feature is that two substrate transfer pallets on which a plurality of substrates are placed are transferred in series and transferred from one end of the transfer lane to the other end.
In the present invention, the plurality of grades may have four or four classification dies, or the wafer may have two types of dies and four classification dies each having two grades. , Supplying the corresponding four classification substrates of the four classification dies separately from the four ends of the two conveyance lanes to the conveyance lane, and returning the four classification substrates to the respective supplied sides. It is characterized by.

Further, in the present invention, the plurality of transport lanes and the plurality of bondings are both 2, and the classification control means is configured such that the most transport lane for transporting the most classification die having the largest number of bonding is the most classification A seventh feature is that two substrate transport pallets on which a plurality of classification substrates for bonding dies are placed are transported in series and transported from one end to the other end of the most frequent transport lane.
In addition, according to an eighth aspect of the present invention, the classification control includes bonding the most classified die having the largest number of bonding and then bonding the other classified die.

Furthermore, the present invention is characterized in that the classification control step picks up from the classification die that is easy to pick up or at a predetermined time or a predetermined number so that a predetermined ratio of each classification is obtained.
Further, according to the present invention, when the classification control is bonded to all the classification substrates of the substrate conveyance pallet near the other end side of the two substrate conveyance pallets conveyed in series, the classification control is performed on the one end side. A tenth feature is that the near substrate transport pallet is moved to the position of the substrate transport pallet close to the other end side.

  Therefore, according to the present invention, in a die bonder having a single transfer lane and a single bonding head, it is possible to provide a die bonder or bonding method capable of performing a wafer grade process having a plurality of grade dies without removing the wafer.

  Further, according to the present invention, it is possible to provide a die bonder or bonding method capable of performing a wafer grade process having a plurality of grade dies without removing the wafer in a die bonder having a plurality of transfer lanes and a plurality of bonding heads.

It is a schematic top view of the die bonder which is Embodiment 1 of the present invention. It is a figure explaining schematic structure and operation | movement of the die bonder seen from the arrow A of FIG. It is a figure which shows the structure and operation | movement of 1st Example 1 of the classification control means which are the characteristics of Embodiment 1 of this invention. It is a figure which shows the processing flow of the classification control means in Example 1 shown in FIG. It is a figure which shows the structure and operation | movement of 2nd Example 2 of the classification control means which are the characteristics of Embodiment 1 of this invention. It is a figure which shows the processing flow of the classification control means in Example 2 shown in FIG. It is a schematic top view of the die bonder which is Embodiment 2 of this invention. It is the figure which showed the processing flow of the classification | category control means in the mixed mounting method with a complicated flow. The configuration and operation of the fourth example 4 of the classification control means that is a feature of the second embodiment of the present invention will be described. The configuration and operation of the fifth example 5 of the classification control means that is a feature of the second embodiment of the present invention will be described.

Embodiments of the present invention will be described below with reference to the drawings.
(Embodiment 1)
FIG. 1 is a schematic top view of a die bonder 10 according to a first embodiment of the present invention. FIG. 2 is a diagram for explaining the schematic configuration and operation of the die bonder viewed from the arrow A in FIG.
The die bonder 10 is a die bonder having a single transport lane and a single bonding head. The die bonder 10 is roughly divided into a die supply unit 1 that supplies a die D to be mounted on the substrate P, a pickup unit 2 that picks up a die from the die supply unit 1, and a picked-up die D is placed once in the middle. The alignment unit 3, the bonding unit 4 that picks up the die D of the alignment unit and bonds it onto the substrate P or the already bonded die D, the transport unit 5 that transports the substrate P to the mounting position, and the transport unit 5 There are substrate supply / unloading units 6 and 7 for supplying and receiving the mounted substrate P, and a control unit 8 for monitoring and controlling the operation of each unit.

  First, the die supply unit 1 includes a wafer holding table 12 that holds a wafer 11 having a plurality of grades of die D, and a push-up unit 13 indicated by a dotted line that pushes up the die D from the wafer 11. The die supply unit 1 is moved in the XY direction by a driving unit (not shown), and the die D to be picked up is moved to the position of the push-up unit 13.

  The pickup unit 2 includes a collet 22 (see also FIG. 2) that sucks and holds the die D pushed up by the push-up unit 13 at the tip, and picks up the die D and places it on the alignment unit 3; A pickup head Y drive unit 23 for moving the pickup head 21 in the Y direction. The pickup is performed based on a classification map indicating the grades of dies having different electrical characteristics of the wafer 11. The classification map is stored in the control unit 8 in advance. The pickup head 21 has driving units (not shown) that move the collet 22 up and down, rotate, and move in the X direction.

  The alignment unit 3 includes an alignment stage 31 on which the die D is temporarily placed, and a stage recognition camera 32 for recognizing the die D on the alignment stage 31.

  The bonding unit 4 has the same structure as the pickup head, picks up the die D from the alignment stage 31, bonds it to the substrate P that has been conveyed, and attaches the die D attached to the tip of the bonding head 41. The collet 42 to be held, the Y drive unit 43 that moves the bonding head 41 in the Y direction, and the position recognition mark (not shown) of the substrate P that has been conveyed are imaged to recognize the bonding position of the die D to be bonded. A substrate recognition camera 44.

  With such a configuration, the bonding head 41 corrects the pickup position / orientation based on the imaging data of the stage recognition camera 32, picks up the die D from the alignment stage 31, and the substrate based on the imaging data of the substrate recognition camera 44. Bond die D to P.

  The transport unit 5 has a single transport lane 51 provided with two transport chutes on a substrate transport pallet 9 on which one or a plurality of substrates P (15 in FIG. 1) are placed. For example, the substrate transport pallet 9 is moved by a transport belt (not shown) provided on the two transport chutes.

  With such a configuration, the substrate transport pallet 9 is loaded with the substrate P at the substrate supply / unloading units 6 and 7, moves to the bonding position along the transport short, and moves to the post-bonding substrate supply / unloading units 6 and 7. Give the return board P.

In the first embodiment described above, the alignment stage 31 is provided in order to shorten the moving distance of the bonding head 41 and shorten the processing time. However, the die D is picked up from the wafer directly by the bonding head 41 without providing the alignment stage 31. It is good also as composition to do.
In the following description, an area where the bonding head bonds the die D is referred to as a bonding stage BS. When there are a plurality of bonding stages, they are represented as BS1, BS2,. The grade of the die D is referred to as a category 1 die D1, a category 2 die D2,..., And the corresponding substrates are represented as a category 1 substrate P1, a category 2 substrate P2,. Further, a substrate on which the die is not mounted is indicated by a suffix m, and a substrate on which the die is mounted is indicated by a suffix g. Furthermore, when a die or a substrate is collectively referred to, they are simply represented as D and P, respectively.

  In general, the number of high-quality non-defective products is the largest, and the number drops rapidly as the grade goes down. In the following description, the high-grade non-defective products are represented as classification 1 die D1, classification 2 die D2,. Furthermore, although there are defective products on the wafer, it is excluded from the grade.

  A feature of the first embodiment is that a die D is picked up from a wafer 11 having two grades of a classification 1 die D1 and a classification 2 die D2 in accordance with a classification map, and a classification 1 substrate of a grade corresponding to the classification of the die in the transport lane 51 P1 and the classification 2 substrate P2 are supplied, and the die D is bonded to the transported substrate P. At that time, at least one of the classification dies D (classification substrate P) is returned to the supply side to carry out the grade processing. It has a classification control means or a classification control step.

  As a result, first, in a die bonder having a single transfer lane and a single bonding head, a wafer having a plurality of grade dies can be graded without removing the wafer. Second, since the bonded substrates P can be sorted by classification without being mixed, the substrates P can be reliably supplied in grade units.

(Example 1)
FIG. 3 is a diagram showing the configuration and operation of the first example 1 of the classification control means that is a feature of the first embodiment of the present invention. Further, in FIG. 3, only the minimum configuration is indicated to avoid complexity.

  In the first embodiment, the classification 1 substrate D1 and the classification 2D2 are bonded to the classification 1 substrate P1 and the classification 2 substrate P2 from the wafer 11 having two grades, and the classification 1 substrate P1 indicated by the solid line is indicated by an arrow indicated by the solid line. Are supplied from the substrate supply / unloading unit 6 and unloaded to the substrate supply / unloading unit 7, and the classified substrate P <b> 2 indicated by the broken line is supplied from the substrate supply / unloading unit 6 as indicated by the broken line and is returned to the substrate supply / unloading unit 6 again. It is an example. In FIG. 3, the black square on the substrate indicates the die D mounted on the substrate. In general, the class 1 die D1 has a higher grade and a larger number than the class 2 die D2. For example, the classification 1 die D1 is about 90%, and the classification 2 die D2 is about 10%.

FIG. 4 is a diagram showing a processing flow of the classification control means in the embodiment 1 shown in FIG.
First, among the classified substrates P, the substrate transport pallet 9 loaded with a plurality (15 in FIG. 3) of the unmounted classified 1 substrates P1m of the classified 1 substrate P1 indicated by the solid line is supplied from the substrate supply / unload section 6 to the transport lane 51. (Step 1).

  Next, the substrate transfer pallet 9 is moved to the bonding stage BS, and the number of the category 1 dies D1 is mounted by the number of the category 1 substrates P1 on the substrate transfer pallet 9 (step 2). For mounting, the position of the wafer 11 is controlled based on the classification map stored in the control unit 8, and the pickup head 21 picks up the classification 1 die D 1 and places it on the alignment stage 31. Thereafter, the bonding stage 41 picks up the category 1 die D1 on the alignment stage 31 and bonds it to the unmounted category 1 substrate P1m. This operation is performed for the number of classification 1 substrates P1 on the substrate transport pallet 9. FIG. 3 shows that the bonding head 41 is bonded to the first unmounted class 1 substrate P1m, and the pickup head 21 is mounted on the bonding stage 41 for the next class 1 die D1 to be bonded.

  Next, the substrate carrying pallet 9 on which the category 1 substrate P1g on which the category 1 die D1 is mounted is carried out to the substrate supply / unloading unit 7 (step 3). The processing from step 1 to step 3 is repeated until there is no more category 1 die D1 on the wafer 11 (step 4). When there is no more class 1 die D1 to be processed, the process goes to class 2 die D2.

  In the processing of the classification 2 die D2, first, the same processing as the processing steps 1 and 2 of the classification 1 die D1 is performed, such as supplying an unmounted classification substrate P2m indicated by a broken line from the substrate supply / unloading unit 6 (step 5, Step 6). Next, unlike the processing of the category 1 die D1, the substrate transport pallet 9 loaded with the category 2 substrate P2g on which the category 2 die D2 is mounted is returned to the substrate supply / unloading unit 6 (step 7). The processing from step 5 to step 7 is repeated until there is no more category 2 die D2 on the wafer 11 (step 4).

  Next, it is determined whether a predetermined number of dies have been mounted (step 9). If not mounted, the wafer is replaced with a new wafer for the first time (step 10), and steps 1 to 9 are repeated. If it is implemented, the process is terminated.

(Example 2)
FIG. 5 is a diagram showing the configuration and operation of the second example 2 of the classification control means that is a feature of the first embodiment of the present invention. Also, in FIG. 5, as in FIG. 3, only the minimum configuration is indicated to avoid complication.

  The difference of the second embodiment from the first embodiment is that, in the first embodiment, the classification 1 substrate P1 is supplied from the substrate supply / unloading section 6 and unloaded to the substrate supply / unload section 7, but in the second embodiment, it is indicated by a solid line arrow. As described above, the classification 1 substrate P <b> 1 is supplied from the substrate supply / unloading unit 7 and returned to the substrate supply / unloading unit 7. That is, in the second embodiment, the classification 1 substrate P1 and the classification 2 substrate P2 are supplied from different substrate supply / unloading units, and returned to the same substrate supply / unloading unit to which the substrates P are supplied.

  FIG. 6 is a diagram showing a processing flow of the classification control means in the second embodiment shown in FIG. The processing flow of FIG. 6 differs from the processing flow of FIG. 4 only in step 1 for supplying the classification 1 substrate P1. The other points are the same.

  In the second embodiment, since the board supply / unloading unit is divided for each grade, the possibility of mixing mounted boards is lower than that in the first embodiment.

  Further, in the first and second embodiments, in order to prevent mixed substrates from being mixed, serial processing is performed in which processing of classification 2 is performed after all processing of classification 1 is completed, but this point is improved. For example, it is not always necessary to perform serial processing.

  Moreover, in Embodiment 1 demonstrated above, the example which has two grades was demonstrated. However, even if the wafer has three grades, for example, after the classification 2 die D2 is mounted, the classification process can be performed by similarly mounting the classification 3 die D3. The same is true for grades of 4 or higher.

(Embodiment 2)
FIG. 7 is a schematic top view of a die bonder 10A that is Embodiment 2 of the present invention. The die bonder 10A is a die bonder having a plurality (2 in the second embodiment) of conveyance lanes and a plurality (2 in the second embodiment) of bonding heads. The difference between the die bonder 10A and the die bonder 10 is as follows. First, the transport unit 5 has two transport lanes 51 and 52. Secondly, it has two mounting parts 20A and 20B formed by the pickup part 2, the alignment part 3, and the bonding part 4. The reference numerals of the mounting portions 20A and 20B are indicated by the reference numerals having the same configuration or function of the die bonder 10 and the subscripts A and B indicating the respective systems. That is, the die bonder 10A is a die bonder having a plurality of transport lanes 51 and 52 and a plurality of bonding heads 41A and 41B. Since the operations of the bonding head, the pickup head, etc. constituting the mounting portions 20A and 20B of the second embodiment are the same as those of the first embodiment, the following description will be given in order to simplify the description unless there is a problem. For example, the expression of mounting by the mounting unit is used.

  Thirdly, the pickup heads 21A and 21B pick up the die D from the wafer 11, move in the X direction, and move the die D to the alignment stages 31A and 31B provided at the intersections of the tracks with the bonding heads 41A and 41B. It is a point to place.

  Reference numerals 91, 92, and 93 are substrate transport pallets, and BS1, BS2, and BS3 are bonding stages.

  In the second embodiment described above, as in the first embodiment, the alignment stages 31A and 31B are provided in order to shorten the moving distance of the bonding heads 41A and 41B and shorten the processing time. Alternatively, the die D may be picked up directly from the wafer by the bonding head 41 without providing the above.

  A feature of the second embodiment is that it has a classification control unit or a classification control step that can efficiently operate two systems of the mounting unit in one of the two transport lanes.

As a result, in a die bonder having two transfer lanes and two bonding heads, wafer grade processing can be efficiently performed without removing the wafer.
Second, as described in the first embodiment, in at least one of the two transport lanes, at least one of the classification dies D (classification substrate P) is returned to the supply side and transported, or the classification control means or the classification Having a control step.

  As a result, in a die bonder having two transfer lanes and two bonding heads, the wafer has 2 to 4 grades (classifications), or the wafer has two types of dies and each has two grades (classifications). Even if it has it, it can be graded.

Example 3
The configuration and operation of the third example 3 of the classification control means, which is a feature of the second embodiment of the present invention, will be described with reference to FIG. As in the first and second embodiments, the third embodiment is an example in which a grade process can be performed when the wafer 11 has two grades in two transfer lanes.

  For this purpose, the third embodiment includes a classification control unit that can efficiently operate two systems of the mounting unit in one of the two transport lanes.

  In the third embodiment, as indicated by the black arrows in FIG. 7, the classification 1 substrate P1 is transported in the transport lane 51 and the classification 2 substrate is transported in the transport lane 52 from the substrate supply / unload section 6 through the bonding stages BS1 to BS3. Transport to part 7. In this case, classification 1 and classification are managed for each transportation lane in order to avoid mixing. In the third embodiment, the dies D are alternately picked up from the wafer 11 in order to always operate the mounting parts A and B and increase the operating rate. Further, in the third embodiment, the mounting unit 20B mounts the classification 1 die D1 on the bonding stage BS3, and the mounting unit 20A mounts the same number that the mounting unit 20B mounts on the bonding stage BS1 on the classification 1 die D1. And mounting the classification 2 die D2 at the bonding stage BS2 at a predetermined rate.

  The predetermined ratio is inevitably determined by the ratio of the classification 2 die D2. For example, if the ratio of the classification 2 die D2 is 10%, the mounting unit 20B processes 50% of 90% of the processing of the classification 1 die D1, and the mounting unit 20A performs 40% of the processing 90% of the classification 1 die D1. % And 10% of the processing of the classification 2 die D2.

  Thus, the operation rate can be improved and the grade process can be performed efficiently by the classification control means for picking up dies alternately between the mounting part 20A and the mounting part 20A.

There are three methods for the mounting unit 20A to perform processing at a predetermined rate.
The first method is a separate mounting method in which the classification 1 die D1 is mounted from the beginning until the classification 1 die D1 disappears, and then the classification 2 die D2 is mounted as described in the first and second embodiments. In this method, the mounting unit 20A first mounts the classification 1 die D1 at the bonding stage B1, and after processing the classification 1 die D1 by a predetermined ratio, mounts the classification 2 die D2 at the bonding stage B2. On the other hand, in the mounting unit 20B, the classification 1 die D2 is always processed at the bonding stage B3.

  The second method is a mixed mounting method in which the mounting unit 20A always processes from a die that is easy to pick up. The mounting ratio of the class 2 die D2 to the class 1D1 varies with time, but eventually falls to a predetermined ratio. In the second method, since the mounting units 20A and 20B process the same number, the mounting unit 20B that processes only the classification 1 die D1 performs the processing in the substrate transport pallet 93 on the substrate transport pallet 91 of the mounting unit 20A. It can be done faster than processing. At this time, if the mounting unit 20B waits for the processing on the substrate transport pallet 91 of the mounting unit 20A to be completed, the operating rate decreases. In order to increase the overall availability by picking up alternately, the substrate transfer pallet 91 that has not been processed for all the classification 1 substrates P1 existing in the bonding stage BS1 is moved to the bonding stage BS3, and a new substrate transfer pallet A carry-up method of supplying 91 to the bonding stage BS1 is adopted.

  However, if the ratio of the category 2 die D2 is small and it is not very effective to move the substrate transport pallet 91 after the processing of the substrate transport pallet 93 at the bonding stage BS3 is completed, the mounting unit 20B is put on standby. May be.

  The third method is a ratio holding method in which the above ratio is held for a predetermined time or a predetermined number. Also in this case, the carry method shown in the mixed mounting method can be adopted.

  On the other hand, in any method, regardless of the transport lane 52, the transport lane 52 can be used to process the substrate transport pallet 92 as soon as processing of all the classification 2 substrates on the substrate transport pallet 92 is completed by the processing of the mounting unit 20A. The unprocessed substrate transfer pallet 92 is unloaded to the substrate transfer supply / unloading unit 7 and supplied to the bonding stage BS2.

  The separate mounting method has an advantage that the classification of the product, that is, the grade management is easy because the probability that the mounted boards are mixed is low. On the other hand, the mixed mounting method has an advantage of shortening the processing time because the die pick-up process can be efficiently performed. Further, the ratio holding method has an advantage that the classification 1 substrate and the classification 2 substrate can be processed at a stable ratio.

  FIG. 8 is a diagram showing a processing flow of the classification control means in the mixed mounting method having a complicated flow.

  First, the unmounted class 1 substrate P1m of the class 1 die D1 indicated by the solid line from the substrate supply / unload unit 6 is attached to the bonding stages BS1 and BS3, and the unmounted class 2 substrate P2m of the class 2 die D2 indicated by the broken line is bonded to the bonding stage BS (Step 1). Next, based on the classification map of the dies D on the wafer, the dies D are picked up alternately from the wafer 11 by the mounting parts 20A and 20B (step 2). The mounting unit 20A determines whether the picked-up die is a classification 1 die or a classification 2 die (step 3), and mounts it on the bonding stage BS1 or BS2 based on the determination result (steps 4 and 5). On the other hand, the mounting unit 20B unconditionally mounts the classification 1 die D1 at the bonding stage BS3 (step 6).

  Next, it is determined whether or not the classification 1 die D1 is mounted on all the classification 2 substrates P2m mounted on the substrate transport pallet 93 present in the bonding stage BS3 (step 7). If it is mounted, the classification 2 substrate P2 of the bonding stage BS3 is unloaded to the substrate supply unloading unit 7, and the process goes to Step 13 (Step 8). If not, go to step 13.

  On the other hand, the mounting unit 20A determines whether the classification 1 die D1 has been mounted on all of the classification 1 substrates P1m of the bonding stage BS3 with a little delay (step 9). If mounted, the classification 1 substrate P1g of the bonding stage BS1 is moved to the bonding stage BS3, and a new classification 1 substrate P1m is supplied to the bonding stage BS1 (step 10). If not, go to step 13. Further, after the classification 2 die D2 is mounted, it is determined whether the classification 2 die D2 is mounted on all the classification 2 substrates P2m of the bonding stage BS2 (step 11). If it is mounted, the classification 2 substrate P2g of the bonding stage BS2 is unloaded to the substrate supply / unloading section 7, and a new classification 2 substrate P2m is supplied to the bonding stage BS2, and the process goes to step 13 (step 12). If not, go to step 13.

Next, in step 13, it is determined whether all the dies D of the wafer 1 have been mounted. If not, go to step 2. If so, it is determined whether a predetermined number of dies D have been mounted (step 14). If not, replace with a new wafer 11 and go to step 2.
If it is implemented, the process ends.

Example 4
The configuration and operation of the fourth example 4 of the classification control means, which is a feature of the second embodiment of the present invention, will be described with reference to FIG. The fourth embodiment is an example in which the wafer 11 has three grades unlike the first to third embodiments.

  For this purpose, in the fourth embodiment, in one transport lane 52 out of two transport lanes, each class of substrates P having two grades of dies D is supplied from the supply side, returned to the supply side, and transported out. It has a classification control means. In addition, the fourth embodiment also includes a classification control unit that can efficiently process the grade processing of the wafer 11 having three grades without removing the wafer 11.

  In the fourth embodiment, the classification 1 substrate P1m indicated by the solid line for mounting the classification 1 die D1 is supplied from the substrate supply / unload section 6 to the transport lane 51, and the mounting section 20A is bonded to the bonding stage by the bonding stage BS1 as in the third embodiment. The mounting unit 20B mounts the classification 1 die D1 at BS3. When the dies D are mounted on all the substrates P mounted on each substrate transport pallet 91 or 93, the classification 1 substrate P1m of the substrate transport pallet 91 or 93 is supplied as indicated by the black arrow. The substrate is delivered to a substrate supply / unload unit 7 different from the substrate supply / unload unit 6.

  On the other hand, in the transport lane 52, an unmounted class 1 substrate P2m indicated by a solid line for mounting the category 2 die D2 is supplied from the substrate supply / unloading unit 6 and indicated by a broken line for mounting the category 3 die D3 from the substrate supply / unloading unit 7. An unmounted classification 3 substrate P3m is supplied. Then, at the bonding stage BS2, the mounting unit 20A mounts the classification 2 die D2 on the unmounted class 2 substrate P2m, and at the bonding stage BS4, the mounting unit 20B mounts the classification 3 die D3 on the unmounted category 3 substrate P3m. When the dies D are mounted on all the substrates P mounted on each substrate transport pallet 92 or 94, the classification 2 substrate P2m of the substrate transport pallet 92 is supplied as shown by the white arrow. The classification 4 substrates P4m not mounted on the substrate transport pallet 94 are returned to the supply carry-out unit 6 and carried out to the supplied substrate supply carry-out unit 7 as indicated by broken line arrows.

  Also in the fourth embodiment, dies are alternately supplied to the mounting unit 20A and the mounting unit 20B. Then, the processing contents of the mounting unit 20A and the mounting unit 20B are allocated to be equal. For example, it is assumed that the ratios of classification 1, classification 2, and classification 3 are 70%, 20%, and 10%, respectively. In bonding stage BS1, classification 1 is 30% of 50%, bonding stage BS2 is 20% of classification 2, bonding stage BS3 is classification 1 in 400% of 70%, and bonding stage BS4 is 10% of classification 3. Will be implemented.

Also in the fourth embodiment, the separation mounting method, the mixed mounting method, or the ratio holding method shown in the third embodiment can be used.
When the mixed mounting method is used in the fourth embodiment, in the processing flow shown in FIG. 8, a branching flow after step 3 of the mounting unit 20A is provided in the mounting unit 20B. Further, depending on the classification 1 allocation, the substrate transfer pallet 93 of the bonding stage BS3 may not always be processed first. Therefore, in order to lower the probability, a process is selected in which the processing ratio of the bonding stage BS4 is lower than the classification ratio of the bonding stage BS2. That is, the ratio of the bonding stage BS3 in the classification 1 is set higher than the ratio of the bonding stage BS1. Alternatively, it is conceivable to control the processing rate of the mounting portion 20A so that the substrate transport pallet 93 of the bonding stage 3 can be processed first. Further, in some cases, it is also effective to adopt the ratio holding method entirely.

(Example 5)
The configuration and operation of the fifth example 5 of the classification control means, which is a feature of the second embodiment of the present invention, will be described with reference to FIG. In the fifth embodiment, unlike the first to fourth embodiments, the wafer 11 has four grades or two types of dies each have two grades.

  For this purpose, the fifth embodiment has a classification control means for returning one classification die D (classification substrate P) to the supply side and carrying it out in at least one of the two conveyance lanes. In addition, the fifth embodiment also includes a classification control unit that can efficiently perform grade processing when the wafer 11 has four grades or when two types of dies each have two grades without removing the wafer.

  The configuration of the fifth embodiment is basically the same as that of the fourth embodiment. Accordingly, FIG. 10 schematically shows different points in a simplified manner. The difference is that the processing of the bonding stage BS1 and the bonding stage BS3 is different. Accordingly, each of the classification 1 substrates P1 to P4 has been mounted as indicated by the black, white, broken line, and diagonal arrows shown in FIG. 10 so that the processing of each bonding stage BS can be performed independently. After that, return to the supplied position.

  Further, the processing contents of each bonding stage BS are arranged so that the processing ratios of the mounting parts 20A and 20B are as much as possible. For example, if each of the two types of dies has two grades and the treatment ratio of the bonding stage BS is 44%, 35%, 12%, 9% from the highest, (44%, 9%) ( 35% and 12%), and distributed to the mounting portions 20A and 20B. In this example, there is a difference of 6% between the processing amounts of the mounting units 20A and 20B. In order to solve this problem, the management of the mounting board becomes somewhat complicated, but the processing content may be changed at an intermediate point.

  According to this embodiment, in the die bonder having two transfer lanes, the grade processing can be performed when the wafer 11 has four grades or when two types of dies have two grades, respectively.

  Although two transport lanes are provided in the second embodiment described above, the same can be achieved by providing three or more transport lanes. For example, in the case of three transport lanes, the mounting unit 20A is responsible for three grades (classifications), and the mounting unit 20B is responsible for two or three grades. What is necessary is just to carry out in the same board | substrate supply carrying out part.

  Moreover, although it demonstrated as a board | substrate corresponding to a classification | category by the above description, even if a classification | category differs, the board | substrate itself may be the same.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

1: Die supply unit 10, 10A: Die bonder 11: Wafer 12: Wafer holder 13: Push-up unit 2: Pickup unit 20A, 20B: Mounting unit 21: Pickup head 22: Collet 23: Pickup Y drive unit 3: Alignment unit 31, 31A, 31B: Alignment stage 4, 4A, 4B: Bonding part 41, 41A, 41B: Bonding head 42, 42A, 42B: Collet 43: Y drive part of bonding head 5: Conveying part 6, 7: Substrate supply / unloading Unit 8: Control unit 9, 91 to 94: Substrate transport pallet 51, 52: Transport lane BS, BS1 to BS4: Bonding area D: Die D1 to D4: Classification 1 die to Classification 4 die P: Substrate P1 to P4: Classification 1 to 4 substrates Subscript m: Substrate with no die mounted For example character g: die is already mounted on board

Claims (10)

A classification map of a first classification die and a second classification die in which non-defective dies having different electrical characteristics in one wafer are classified into two grades;
A die supply unit for supplying the wafer;
First and second pickup heads for alternately picking up dies from the wafer;
First and second alignment stages on which dies picked up from the die supply unit are placed;
First and second bonding heads for bonding dies picked up from the first and second alignment stages onto a substrate or an already bonded die;
First and second transport lanes for transporting a classification substrate bonded corresponding to the first classification die and the second classification die to a bonding area for bonding in units of the classification substrate;
A first and a third bonding stage for placing a substrate transported by the first transport lane;
A second bonding stage for placing the substrate transported by the second transport lane;
Classification control means for bonding the first classification die and the second classification die to the corresponding classification substrate based on the classification map;
Have
The classification control means includes
Dies picked up by the first and second pick-up heads are placed on first and second alignment stages, respectively, and are placed on the first and second alignment stages by the first and second bonding heads, respectively. Pick up each mounted die,
Two substrate transfer pallets on which a plurality of classification substrates for bonding the first classification dies are placed in the first conveyance lane for conveying the first classification dies in which the number of bonding is larger than that of the second classification dies. transported in series, and transported from one end to the other end of the first conveying lane,
In the second transport lane for transporting the second classification die, transport a substrate transport pallet on which a plurality of classification substrates for bonding the second classification die are placed,
Bonding in the first bonding stage the first classifying die by the first bonding head, the second classification die bonding in the second bonding stage,
Die bonder for bonding the first classifying die in the third bonding stage by the second bonding head. The first and second pickup heads each move along a moving track in a first direction, and the first and second bonding heads move along a moving track in a second direction different from the first direction, respectively.
The first alignment stage is provided at an intersection of the movement track of the first pickup head in the first direction and the movement track of the first bonding head in the second direction;
2. The die bonder according to claim 1, wherein the second alignment stage is provided at an intersection of the movement track in the first direction of the first pickup head and the movement track in the second direction of the second bonding head.   The die bonder according to claim 1, wherein the classification control unit bonds the second classification die after bonding the first classification die.   The die bonder according to claim 1 or 2, wherein the classification control means picks up a predetermined ratio of each classification for a predetermined time or a predetermined number.   When the classification control means is bonded to all the classification substrates of the substrate transport pallet close to the other end side of the two substrate transport pallets transported in series, the substrate transport pallet close to the one end side is The die bonder according to claim 3, wherein the die bonder is moved to a position of the substrate transport pallet close to the other end side. Non-defective dies with different electrical characteristics in one wafer are classified into two grades, a classification map of first classification dies and second classification dies, a die supply unit for supplying the wafer, and a die from the wafer. Picked up alternately from the first and second pickup heads, the first and second alignment stages on which the die picked up from the die supply unit is placed, and the first and second alignment stages First and second bonding heads for bonding a die onto a substrate or an already bonded die, and a classification substrate bonded in correspondence with the first classification die and the second classification die in units of the classification substrate First and second transport lanes transported to the bonding area to be bonded, and the first transport lane 1st and 3rd bonding stage which mounts the conveyed board | substrate, and 2nd bonding stage which mounts the board | substrate conveyed by the said 2nd conveyance lane, Based on the said classification map A bonding method of a die bonder for bonding the first classification die and the second classification die to the corresponding classification substrate,
Dies picked up by the first and second pick-up heads are placed on first and second alignment stages, respectively, and are placed on the first and second alignment stages by the first and second bonding heads, respectively. Pick up each mounted die,
Two substrate transfer pallets on which a plurality of classification substrates for bonding the first classification dies are placed in the first conveyance lane for conveying the first classification dies in which the number of bonding is larger than that of the second classification dies. transported in series, and transported from one end to the other end of the first conveying lane,
In the second transport lane for transporting the second classification die, transport a substrate transport pallet on which a plurality of classification substrates for bonding the second classification die are placed,
Bonding in the first bonding stage the first classifying die by the first bonding head, the second classification die bonding in the second bonding stage,
Bonding method of bonding the first classifying die in the third bonding stage by the second bonding head. The first and second pickup heads each move along a moving track in a first direction, and the first and second bonding heads move along a moving track in a second direction different from the first direction, respectively.
The first alignment stage is provided at an intersection of the movement track of the first pickup head in the first direction and the movement track of the first bonding head in the second direction;
The bonding method according to claim 6, wherein the second alignment stage is provided at an intersection of the movement track in the first direction of the first pickup head and the movement track in the second direction of the second bonding head.   The bonding method according to claim 6 or 7, wherein after the first classification die is bonded, the second classification die is bonded.   The bonding method according to claim 6 or 7, wherein the pickup is performed so that a predetermined ratio of each classification is obtained in a predetermined time or a predetermined number.   The substrate transport pallet close to the one end side is close to the other end side when bonded to all the classification substrates of the substrate transport pallet close to the other end side of the substrate transport pallets transported in series with the two units. The bonding method according to claim 8, wherein the bonding method is moved to the position of the substrate transfer pallet.

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