JP2010287599A - Component mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting apparatus including one suction arm, and enhancing productivity by improving a mounting speed and accuracy in mounting positions. <P>SOLUTION: In this component mounting apparatus to mount the components in a component supply portion 500 at the prescribed position of a substrate 201, a mounting stage 200 for carrying the substrate 201 and an alignment stage 300 for obtaining the components, which are positioned and controlled on the work area in a prescribed region while having freedom in their rotation axes around the X axis, the Y axis and the Z axis, a single suction arm 800, the component supply portion 500 for supplying the component P to be mounted next to a component receiving portion 3001 loaded on the alignment stage 300, and a pattern recognition camera 700 to photograph the state of the component P to be mounted next on the alignment stage 300 are provided, and after the single suction arm 800 sucks and gets the component P to be mounted next, the component P is mounted at the prescribed position of the substrate 201 carried on the mounting stage 200. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a component mounting apparatus for mounting a component acquired from a component supply unit at a predetermined position on a substrate.

  FIG. 5 is a functional block diagram showing a configuration example of a conventional component mounting apparatus. When a component A such as a chip component arranged on a reel or a tray is mounted on the substrate 10 set to be controlled at a predetermined position, in step (A1), the component A is determined based on imaging information of the camera 20 fixedly arranged. The implementation point of is recognized.

  In step (A2), the coating agent for component A is dropped onto the mounting point position on the substrate 10 by moving the coating arm 40 disposed on the transport rail 30 and operating in the Z direction.

  In step (A3), the suction arm 50 movable in the X, Y, and Z directions takes the component A to the component supply place, moves onto the rail for transportation 30, moves to the mounting position on the substrate 10 fixed at the mounting position, The component A is mounted at a designated position programmed in advance by an operation in the Z direction.

  Regarding the mounting of the component B, the component is placed at a preprogrammed designated position on the substrate 10 by the same steps (B1), (B2), and (B3) as the mounting steps (A1), (A2), and (A3) of the component A. Implement B.

As described above, the basic method of conventional component mounting is that the tools of the coating arm 40 and the suction arm 50 are moved and controlled with respect to the substrate fixedly arranged at the mounting position to drop the coating agent and transport and mount the component. Is to execute.

"MD (motion dynamics) general catalog" July 2003 Yokogawa Electric Co., Ltd. issued

The configuration of the component mounting apparatus according to the conventional method has the following problems.
(1) Restriction of mounting speed due to enlargement of suction arm:
There has been proposed a device that is equipped with a plurality of suction arms and is mounted at a high speed by processing simultaneously. However, a mechanism (for example, a camera or a height sensor) for improving the mounting position accuracy is required, and the weight of the movable part increases, so that the drive part for moving the suction arm becomes large and the moving speed is limited. Therefore, the mounting speed is limited.

(2) Restriction of mounting position accuracy due to increased mounting component movement distance:
A mechanism for supplying reel parts, IC trays, and diced wafers has been proposed so that various types of mounted parts can be handled. However, a large amount of mounting parts must be prepared in order to continuously perform a large amount of mounting work. This increases the size of the component rack, increases the distance from the mounted part, and limits the mounting position accuracy.

(3) Installation location restrictions due to device vibration:
In order to reduce the vibration generated by the mounting machine with respect to the surrounding environment (for example, a microscope), a floor structure has been proposed in which the apparatus is robust and the vibration is not easily transmitted. As described above, with the increase in the size of the suction arm, the increase in the movement distance, and the increase in the movement speed, the vibration is further increased, so that the installation location of the apparatus is limited.

  An object of the present invention is to realize a component mounting apparatus that includes one suction arm that is fixedly arranged, and that can improve productivity by improving mounting speed and mounting position accuracy.

In order to achieve such a subject, the present invention has the following configuration.
(1) In a component mounting apparatus for mounting a component acquired from a component supply unit at a predetermined position on a board,
Mounting stage and component for mounting the substrate, which have degrees of freedom about rotation axes around the X, Y, and Z axes, are positioned on a predetermined work area, and face each other at a predetermined distance Alignment stage to obtain
A single suction arm, which is fixedly arranged above the component delivery spot formed on the work area and whose component suction arm is controlled in the Z-axis direction;
Next, the component supply unit that takes out the component to be mounted and supplies it to the component receiving unit mounted on the alignment stage at the standby position;
A pattern recognition camera, which is fixedly arranged above the alignment stage and images the state of the component to be mounted next supplied to the component receiving unit;
With
After the single suction arm picks up the next component to be mounted from the alignment stage moved to the component delivery spot position, the substrate mounted on the mounting stage moved to the component delivery spot position is predetermined. A component mounting apparatus, wherein the component to be mounted next acquired by the single suction arm is mounted at a position.

(2) Based on the pattern information of the component to be mounted next imaged by the pattern recognition camera, the correction amount of the position information with respect to the component delivery spot position and the rotation information of the component is calculated, and based on this correction amount The component mounting apparatus according to (1), wherein the position and rotation of the alignment stage to the component delivery spot are controlled.

(3) The alignment stage moves to the component delivery spot position, transfers the component to be mounted next to the single suction arm, returns to the standby position, and further transfers the component to be mounted next to the component. The component mounting apparatus according to (1), which is obtained from a supply unit.

(4) The mounting stage moves to the component delivery spot position, mounts the component to be mounted next from the single suction arm, and then returns to a predetermined initial position and stands by (1). The component mounting apparatus described in).

(5) A mounting control unit that communicates with the mounting stage, the alignment stage, a component supply control unit that controls the component supply unit, the single suction arm, and the pattern recognition camera, and controls them in a predetermined sequence. The component mounting apparatus according to any one of (1) to (4).

(6) A dispense arm controlled in the Z-axis direction by the mounting control unit is provided to drop an adhesive coating agent on a mounting position before mounting the component to be mounted next on the substrate by the single suction arm. The component mounting apparatus according to any one of (1) to (5).

(7) The component mounting apparatus according to any one of (1) to (6), wherein the mounting stage and the alignment stage are configured by a linear motor.

According to the present invention, the following effects can be expected.
(1) Avoidance of mounting speed limitation due to enlargement of suction arm:
The suction arm that becomes the largest to maintain the mounting accuracy is only one fixed to the main body, and the moving range of the suction nozzle is limited to the minimum, so that the mounting speed is improved. This is because the weight of the mounting stage can be made lighter than that of the suction arm, and the moving speed can be increased.

(2) Restriction of mounting position accuracy due to increased mounting component movement distance:
The moving distance requiring position accuracy is shorter than in the past. The component movement from the component rack to the alignment stage does not require accuracy because the position and rotation are corrected after the alignment stage is moved. This is because the positional accuracy can be increased by shortening the moving distance from the alignment stage to the mounting position.

(3) Installation location restrictions due to device vibration:
Vibration occurs when a heavy object starts and stops. Vibration can be effectively reduced by reducing the weight of the moving part and shortening the moving distance as described above.

It is a functional block diagram which shows one Example of the component mounting apparatus to which this invention is applied. It is a functional block diagram explaining operation | movement of a components supply part. It is a functional block diagram which shows the other Example of the component mounting apparatus to which this invention is applied. It is a perspective view which shows the structure of the well-known XY- (theta) stage by a linear motor. It is a functional block diagram which shows the structural example of the conventional component mounting apparatus.

  Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 1 is a functional block diagram showing an embodiment of a component mounting apparatus to which the present invention is applied. Prior to the description of the embodiment of FIG. 1, an outline of an XY-θ stage serving as a key device of the present invention will be described.

  FIG. 4 is a perspective view showing a configuration of a known XY-θ stage using a linear motor, which is disclosed in non-patent literature. On a Y base 2 that is linearly controlled by an X-axis linear motor 1 incorporating a glass scale encoder, a Y-axis linear motor 3 that also incorporates a glass scale encoder is mounted in a direction perpendicular to the X axis. .

  A rotary DD (Direct Drive) motor 5 incorporating an optical or magnetic encoder is mounted on a θ base 4 that is linearly controlled by the Y-axis linear motor 3. With such a commercially available XY-θ stage, the XY position can be controlled with an accuracy of 1 μm or less, and the rotation angle θ can be controlled with an absolute accuracy of ± 15 seconds.

  The component mounting apparatus according to the present invention is characterized by using a commercially available XY-θ stage as a key device.

  In FIG. 1, a mounting stage 200 disposed on a work area 100 in a predetermined area has degrees of freedom about rotation axes around the X, Y, and Z axes as shown in FIG. The DD motor center position is controlled on the work area 100.

  On the upper surface of the DD motor, a substrate 201 on which components are mounted is transported by a mechanism (not shown) and position-controlled. Therefore, the designated position for component mounting on the substrate 201 is controlled by the X, Y, and θ positions of the mounting stage 200.

  Further, on the work area 100, an alignment stage 300 having the same configuration is arranged opposite to the mounting stage 200 at a predetermined distance. The configuration of the alignment stage 300 is the same as that of the mounting stage 200, and a component receiving portion 301 is mounted on the upper surface of the DD motor.

  At the standby position (illustrated position) of the alignment stage 300, the component supply unit 500 takes out the component P to be mounted next on the substrate 201 from the parts feeder 400 and passes it to the component receiving unit 301. The component supply unit 500 is controlled by the component supply control unit 600 in a predetermined sequence.

  A pattern recognition camera 700 is fixedly arranged above the position where the alignment stage 300 has moved in the X-axis direction by a predetermined distance from the standby position, and images the state of the component P to be mounted next supplied to the component receiving unit 301. . The imaging information F is passed to a mounting control unit 900 described later.

  On the work area 100, a component delivery spot S virtually formed at an intermediate portion between the mounting stage 200 and the alignment stage 300 is set. A single suction arm 800 is fixedly disposed above the spot S, and the component suction arm 800a is reciprocally controlled in the Z-axis direction.

  The mounting control unit 900 that manages the entire system communicates with the mounting stage 200, the alignment stage 300, the component supply control unit 600 that controls the component supply unit 500, the pattern recognition camera 700, and the single suction arm 800, and these are predetermined. Control by sequence.

  The basic operation of sequence control will be described. First, the alignment stage 300 on which the component P to be mounted next is mounted is controlled to move to the component delivery spot S position (arrow L1). Next, the component suction arm 800a of the single suction arm 800 is reciprocated in the Z direction to acquire and acquire the component P (arrows L2, L3).

  The alignment stage 300 transfers the component P to the single suction arm 800 and then returns to the standby position shown (arrow L4). At the same time, movement control is performed by XY-θ control so that the mounting position where the mounting stage 200 is programmed becomes the spot S position immediately below the single suction arm that is picking up the components (arrow L5).

  The single suction arm 800 lowers the component suction arm 800a in the Z direction while measuring the height information of the mounting position, and moves the component suction arm 800a to the designated position of the substrate 201 mounted on the mounting stage 200 moved to the component delivery spot position S. The component P to be mounted next that has been picked up is mounted with an appropriate load (arrow L6) and returned to the standby position (arrow L7).

  The mounting stage 200 acquires the component P on the substrate 201, returns to the standby position shown in the figure (arrow L8), and ends the mounting sequence of one component. Hereinafter, the mounting control unit 900 repeatedly executes a sequence indicated by L1 to L8 according to a program, and sequentially mounts a plurality of components on the board 201.

  When the alignment stage 300 moves directly below the pattern recognition camera 700, the pattern information F of the component to be mounted next, which is imaged by the pattern recognition camera 700, is passed to the mounting control unit 900, and the position relative to the component delivery spot position P. A correction amount of information and component rotation information is calculated.

  The mounting control unit 900 corrects and controls the position and rotation of the alignment stage 300 to the component delivery spot P based on the calculated correction amount. With this correction control, the component P is attracted to the component suction arm 800a while maintaining an accurate position and posture, and thus is correctly mounted at the designated position of the substrate 201 on the mounting stage 200.

  Next, sequence control of the component supply unit 500 will be described. FIG. 2 is a functional block diagram for explaining the operation of the component supply unit. The component supply unit 500 includes functions of a Z-axis pickup arm Z1, a Z-axis reciprocating arm Z2, and a Z-axis supply arm Z3 controlled by the component supply control unit 600.

  Next, the IC wafer 502 on the XY table 501 whose position is to be controlled, the IC tray 503, or the parts feeder 400 or the IC pickup tool or the like adapted to the supply form of the chip parts shown in FIG. The alignment stage 300 moves to the position where the component P to be mounted is received, and the component P is received.

  At that time, at the receiving position, the component information (shape, product name, etc.) is confirmed by the component supply control unit 600 and notified to the mounting control unit 900. The mounting control unit 900 performs sequence control on the alignment stage 300, the single suction arm 800, and the mounting stage 200 based on the component information and the imaging information F of the pattern recognition camera 700.

  FIG. 3 is a functional block diagram showing another embodiment of the component mounting apparatus to which the present invention is applied. The characteristic part of this embodiment is a structure in which a dispensing arm 1000 that is sequence-controlled by the mounting control unit 900 is provided in addition to the components shown in FIG.

  By reciprocating the dispense arm in the Z-axis direction, the adhesive application function required before component mounting on the substrate 201 can be added with a single arm with only the Z-axis, and the increase in the number of arms is suppressed. can do.

DESCRIPTION OF SYMBOLS 100 Work area 200 Mounting stage 201 Board | substrate 300 Alignment stage 301 Component receiving part 400 Parts feeder 500 Component supply part 600 Component supply control part 700 Pattern recognition camera 800 Single suction arm 800a Component suction arm 900 Mounting control part

Claims (7)

In a component mounting apparatus for mounting a component acquired from a component supply unit at a predetermined position on a board,
Mounting stage and component for mounting the substrate, which have degrees of freedom about rotation axes around the X, Y, and Z axes, are positioned on a predetermined work area, and face each other at a predetermined distance Alignment stage to obtain
A single suction arm, which is fixedly arranged above the component delivery spot formed on the work area and whose component suction arm is controlled in the Z-axis direction;
Next, the component supply unit that takes out the component to be mounted and supplies it to the component receiving unit mounted on the alignment stage at the standby position;
A pattern recognition camera, which is fixedly arranged above the alignment stage and images the state of the component to be mounted next supplied to the component receiving unit;
With
After the single suction arm picks up the next component to be mounted from the alignment stage moved to the component delivery spot position, the substrate mounted on the mounting stage moved to the component delivery spot position is predetermined. A component mounting apparatus, wherein the component to be mounted next acquired by the single suction arm is mounted at a position.   Based on the pattern information of the component to be mounted next imaged by the pattern recognition camera, a correction amount of position information and component rotation information with respect to the component delivery spot position is calculated, and the alignment stage is calculated based on the correction amount. 2. The component mounting apparatus according to claim 1, wherein the position and rotation of the component to the component delivery spot are controlled.   The alignment stage moves to the component delivery spot position, passes the component to be mounted next to the single suction arm, returns to the standby position, and further supplies the component to be mounted next from the component supply unit. The component mounting apparatus according to claim 1, wherein the component mounting apparatus is obtained.   2. The mounting stage moves to the component delivery spot position, mounts the component to be mounted next from the single suction arm, and then returns to a predetermined initial position and waits. Component mounting equipment.   A mounting control unit that communicates with the mounting stage, the alignment stage, a component supply control unit that controls the component supply unit, the single suction arm, and the pattern recognition camera and controls them in a predetermined sequence. The component mounting apparatus according to claim 1.   A dispensing arm controlled in the Z-axis direction by the mounting control unit, which drops an adhesive coating agent on a mounting position before mounting the component to be mounted next on the substrate by the single suction arm, is provided. The component mounting apparatus according to any one of claims 1 to 5.   The component mounting apparatus according to claim 1, wherein the mounting stage and the alignment stage are configured by linear motors.