JP2019050295A - Die bonding device and manufacturing method of semiconductor device - Google Patents

Abstract

To provide a die bonding device comprising means for detecting abnormality in a bonding head or the like.SOLUTION: A die bonding device comprises: a die supply part; a substrate supply part; a bonding part for bonding a die that is supplied from the die supply part, on a substrate that is supplied from the substrate supply part, or a die that is bonded on the substrate already; and a control part for controlling the die supply part, the substrate supply part and the bonding part. The bonding part includes: a bonding head including a collet that adsorbs the die; a driving part including a drive shaft that moves the bonding head; and a sensor capable of detecting an angular velocity and acceleration of the bonding head. The control part judges abnormality by comparing vibration displacement with a preset threshold of vibration displacement while using results that are obtained by the sensor.SELECTED DRAWING: Figure 4

Description

  The present disclosure relates to a die bonding apparatus, and is applicable to, for example, a die bonding apparatus including a gyro sensor.

  In the process of assembling a package, there is a process of mounting a semiconductor chip (hereinafter, simply referred to as a die) on a wiring substrate, lead frame or the like (hereinafter, simply referred to as a substrate) Partly, there are a process of dividing a die from a semiconductor wafer (hereinafter simply referred to as a wafer) and a bonding process of mounting the divided die on a substrate. The manufacturing apparatus used in the bonding process is a die bonding apparatus such as a die bonder.

  The die bonder is a device for bonding (mounting and bonding) a die on a substrate or an already bonded die using solder, gold plating, and a resin as a bonding material. In a die bonder for bonding a die to, for example, the surface of a substrate, the die is adsorbed and picked up from the wafer using a suction nozzle called a collet, transported onto the substrate, applied with a pressing force, and heating the bonding material. As a result, the operation (work) of bonding is performed repeatedly. The collet is attached to the tip of the bonding head. The bonding head is driven by a drive unit (servo motor) such as a ZY drive shaft, and the servo motor is controlled by a motor controller.

  In servo motor control, it is necessary to smoothly accelerate and decelerate the workpiece or the unit supporting the workpiece so as not to give a mechanical impact to move the workpiece.

JP 2012-175768 A

  In a die bonding apparatus such as a die bonder, stability of product quality produced by the apparatus is required by improving bonding accuracy and the like. On the other hand, since the die bonding apparatus operates the pickup head and the bonding head at high speed to improve the productivity, the mechanical load increase and vibration increase the risk such as apparatus failure and defective products. .

  However, under the present circumstances, there has been a problem that there is no means for accurately capturing the movement trajectory and vibration of the bonding head or the like and operating in advance while the apparatus is in operation.

An object of the present disclosure is to provide a die bonding apparatus including means for detecting an abnormality of a bonding head or the like.
Other problems and novel features will be apparent from the description of the present specification and the accompanying drawings.

The outline of typical ones of the present disclosure will be briefly described as follows.
That is, the die bonding apparatus bonds the die supply unit, the substrate supply unit, and the die supplied from the die supply unit onto the substrate supplied from the substrate supply unit or onto the die already bonded to the substrate. And a controller for controlling the die supply unit, the substrate supply unit, and the bonding unit. The bonding unit includes a bonding head including a collet for sucking the die, a driving unit including a drive shaft for moving the bonding head, and a sensor capable of detecting an angular velocity and an acceleration of the bonding head. The control unit compares the vibration displacement with a preset threshold value of vibration displacement using the result obtained by the sensor to determine an abnormality.

  According to the above-mentioned die bonding apparatus, an abnormality due to vibration can be detected.

Schematic top view which shows the structure of the die bonder which concerns on an Example Schematic diagram of the die bonder of FIG. 1 and a diagram for explaining its operation A block diagram showing a schematic configuration of a control system of the die bonder of FIG. 1 Block configuration diagram for explaining the basic principle of the motor control device of FIG. 3 A diagram for explaining detection directions of angular velocity and acceleration of a gyro sensor Diagram for explaining the installation position of the gyro sensor Diagram for explaining the vibration of the bonding head in the X-axis rotation direction Diagram for explaining the driving direction of the bonding head and the Z-axis angular velocity A diagram for explaining the angular velocity waveform and the rotation angle in the state of FIG. 8 Diagram for explaining the driving direction and Y direction acceleration of the bonding head The figure explaining the acceleration waveform in the state of FIG. 10, an acceleration command waveform, and a differential acceleration Diagram explaining differential velocity and displacement The figure explaining the synthetic | combination waveform of the vibration displacement of the X direction at the time of a Y direction drive of a bonding head, and the vibration displacement of a Y direction. A diagram for explaining an example of maximum displacement in three axial directions and maximum displacement in three axial rotational directions Diagram to explain variation in vibration displacement and threshold Flow chart for explaining a method of manufacturing a semiconductor device A diagram for explaining the acceleration waveform, velocity and position in the state of FIG. The figure explaining the attachment position of the gyro sensor concerning modification 2 A figure explaining an abnormality judging method concerning modification 3

  In the embodiment, the angular velocity and acceleration of the bonding head in operation are detected by the sensor, and the current movement locus is captured, and compared with the motor command acceleration waveform or the vibration waveform accumulated in the past operation, bonding is performed. Enables abnormal diagnosis of head operation.

  Hereinafter, examples and modifications will be described using the drawings. However, in the following description, the same components may be assigned the same reference numerals and repeated descriptions may be omitted.

  FIG. 1 is a top view schematically showing a die bonder according to an embodiment. FIG. 2 is a view for explaining the operation of the pickup head and the bonding head when viewed from the direction of arrow A in FIG.

  The die bonder 10 is roughly divided into a supply unit 1 for supplying a die D to be mounted on a substrate S on which a product area (hereinafter referred to as a package area P) to be one or a plurality of final one packages is printed. The intermediate stage unit 3, the bonding unit 4, the transport unit 5, the substrate supply unit 6, the substrate output unit 7, and the control unit 8 that monitors and controls the operation of each unit. The Y-axis direction is the front-rear direction of the die bonder 10, and the X-axis direction is the left-right direction. The die supply unit 1 is disposed on the front side of the die bonder 10, and the bonding unit 4 is disposed on the back side.

  First, the die supply unit 1 supplies a die D to be mounted on the package area P of the substrate S. The die supply unit 1 has a wafer holder 12 for holding the wafer 11 and a push-up unit 13 shown by a dotted line for pushing up the die D from the wafer 11. The die supply unit 1 is moved in the X and Y directions by drive means (not shown) to move the die D to be picked up to the position of the push-up unit 13.

  The pickup unit 2 includes a pickup head 21 for picking up the die D, a Y driving unit 23 for the pickup head for moving the pickup head 21 in the Y direction, and driving units (not shown) for moving the collet 22 up and down and rotating it in the X direction. And. The pickup head 21 has a collet 22 (see also FIG. 2) for attracting and holding the pushed up die D at its tip, picks up the die D from the die supply unit 1 and places it on the intermediate stage 31. The pickup head 21 has respective driving units (not shown) for moving the collet 22 up and down, rotating and moving in the X direction.

  The intermediate stage unit 3 has an intermediate stage 31 for temporarily mounting the die D, and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31.

The bonding unit 4 picks up the die D from the intermediate stage 31 and bonds it onto the package area P of the substrate S being transported, or stacks it on the die already bonded onto the package area P of the substrate S Bond in the form. The bonding unit 4 includes a bonding head 41 having a collet 42 (see also FIG. 2) that holds the die D by suction like the pickup head 21, a Y drive unit 43 that moves the bonding head 41 in the Y direction, and a substrate A position recognition mark (not shown) of the package area P of S is imaged, and a substrate recognition camera 44 which recognizes a bonding position is provided.
With such a configuration, the bonding head 41 corrects the pickup position and attitude based on the imaging data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, and the substrate based on the imaging data of the substrate recognition camera 44. Bond the die D to

The transport unit 5 includes a substrate transport claw 51 that grips and transports the substrate S, and a transport lane 52 in which the substrate S moves. The substrate S is moved by driving a nut (not shown) of the substrate conveyance claw 51 provided in the conveyance lane 52 with a ball screw (not shown) provided along the conveyance lane 52.
With such a configuration, the substrate S moves from the substrate supply unit 6 to the bonding position along the transport lane 52, moves to the substrate unloading unit 7 after bonding, and delivers the substrate S to the substrate unloading unit 7.

  The control unit 8 includes a memory for storing a program (software) for monitoring and controlling the operation of each unit of the die bonder 10, and a central processing unit (CPU) for executing the program stored in the memory.

  The die bonder 10 includes a wafer recognition camera 24 for recognizing the attitude of the die D on the wafer 11, a stage recognition camera 32 for recognizing the attitude of the die D mounted on the intermediate stage 31, and a mounting position on the bonding stage BS. And a substrate recognition camera 44 for recognition. It is the stage recognition camera 32 involved in picking up by the bonding head 41 and the substrate recognition camera 44 involved in bonding to the mounting position by the bonding head 41 that must be corrected for posture deviation between recognition cameras.

  The control unit 8 will be described with reference to FIG. FIG. 3 is a block diagram showing a schematic configuration of a control system. The control system 80 includes a control unit 8, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 8 roughly includes a control / arithmetic unit 81 mainly composed of a CPU (Central Processor Unit), a storage unit 82, an input / output unit 83, a bus line 84, and a power supply unit 85. The storage unit 82 is a main storage unit 82a configured by a RAM that stores processing programs and the like, and an auxiliary storage unit 82b configured by an HDD that stores control data and image data and the like necessary for control. And. The input / output device 83 is a monitor 83a for displaying device status, information, etc., a touch panel 83b for inputting an instruction of the operator, a mouse 83c for operating the monitor, and an image capturing device 83d for capturing image data from the optical system 88. And. Also, the input / output device 83 includes a motor control device 83e that controls a drive unit 86 such as an XY table (not shown) of the die supply unit 1 and a ZY drive shaft of a bonding head table, various sensor signals, lighting devices, etc. And an I / O signal control device 83f for taking in or controlling a signal from a signal unit 87 such as a switch of The optical system 88 includes a wafer recognition camera 24, a stage recognition camera 32, and a substrate recognition camera 44. The control / arithmetic unit 81 takes in necessary data via the bus line 84, calculates it, controls the pickup head 21 etc., and sends information to the monitor 83a etc.

  The control unit 8 stores the image data captured by the wafer recognition camera 24, the stage recognition camera 32 and the substrate recognition camera 44 in the storage device 82 via the image capturing device 83 d. Positioning of the package area P of the die D and the substrate S and surface inspection of the die D and the substrate S are performed using the control / arithmetic unit 81 by software programmed based on the stored image data. Based on the position of the package area P of the die D and the substrate S calculated by the control / calculation unit 81, the drive unit 86 is moved by the software via the motor control unit 83e. By this process, the die on the wafer is positioned and operated by the pickup unit 2 and the drive unit of the bonding unit 4 to bond the die D onto the package area P of the substrate S. The wafer recognition camera 24, the stage recognition camera 32, and the substrate recognition camera 44 to be used are gray scale, color, etc., and digitize the light intensity.

  FIG. 4 is a block diagram for explaining the basic principle of the motor control device of FIG. The motor controller 83 e includes a motion controller 210 and a servo amplifier 220, and controls the servo motor 230. The motion controller 210 includes an ideal waveform generation unit 211 that generates an ideal command waveform, a command waveform generation unit 212, a DAC (Digital to Analog Converter) 213, and an operation abnormality diagnosis unit 214. The servo amplifier 220 includes a velocity loop control unit 221.

  As shown in FIG. 4, in the motor control device 83e, the motion controller 210 and the servo amplifier 220 perform closed loop control. Therefore, the velocity loop control unit 221 of the servo amplifier 220 performs velocity control using the current command position and the actual position and velocity obtained from the servomotor 230. However, the velocity loop control unit 221 performs the velocity control by the motion controller 210 regenerating the command waveform while obtaining the actual velocity and the actual position from the servomotor 230 and limiting the jerk. The ideal waveform generation unit 211 and the command waveform generation unit 212 are configured by, for example, a CPU (Central Processing Unit) and a memory that stores a program executed by the CPU.

  For example, in FIG. 4, the target position, the target velocity, the target acceleration, and the target jerk are applied to the motion controller 210. Then, the actual position and the actual speed are sequentially inputted as an encoder signal to the command waveform generation unit 212 directly or directly from the servomotor 230 via the servo amplifier 220.

  The ideal waveform generation unit 211 of the motion controller 210 generates (a) command acceleration waveform (JD) and (b) command acceleration waveform from the target values of the jerk, acceleration, velocity, and position input from the control / arithmetic unit 81. (AD), (c) commanded velocity waveform (VD), (d) respectively generate a commanded position waveform (PD). The ideal waveform generation unit 211 outputs the commanded acceleration waveform (JD), the commanded acceleration waveform (AD), the commanded velocity waveform (VD), and the commanded position waveform (PD) to the commanded waveform generating unit 212, and the commanded acceleration waveform (AD). ) Is output to the operation abnormality diagnosis unit 214.

  The command waveform generation unit 212 outputs the output signal waveform (the current command position obtained from the command waveform of the ideal position) output from the ideal waveform generation unit 211 and the encoder signal (real position) input from the servomotor 230 , While limiting the jerk, the command velocity waveform in the future is sequentially regenerated and sequentially output to the DAC 213. For example, the command waveform generation unit 212 performs (1) command waveform input / output processing, (2) encoder signal count processing, and (3) command waveform reproduction processing.

  The DAC 213 converts the input digital command value into a speed command value of an analog signal, and outputs the speed command value to the speed loop control unit 221 of the servo amplifier 220. The encoder signal accumulates the positional deviation amount as a pulse by an encoder signal counter (not shown).

  The velocity loop control unit 221 of the servo amplifier 220 controls the rotational velocity of the servomotor 230 according to the velocity command value input from the motion controller 210 and the encoder signal input from the servomotor 230.

  The servo motor 230 rotates at a rotational speed according to the control of the rotational speed input from the speed loop control unit 221 of the servo amplifier 220, and uses the actual position and the actual speed as an encoder signal and the speed loop control unit 221 of the servo amplifier 220. It is output to the command waveform generation unit 212 of the motion controller 210.

  In the embodiment of FIG. 4, the actual position of the driven object such as a bonding head is calculated from the count value (rotation number and rotation angle) of the servomotor 230, and the actual speed is calculated based on the calculated actual position. doing. However, a position detection device that directly detects the position of the driven body may be provided, and the position detected by the position detection device may be set as the actual position.

  The operation abnormality diagnosis unit 214 takes in the angular velocity and the XYZ direction acceleration signal from the gyro sensor 45, compares it with the command waveform, and extracts the vibration displacement. If the operation abnormality diagnosis unit 214 detects an abnormality, the operation abnormality diagnosis unit 214 outputs an abnormality detection signal to the command waveform generation unit 212 to stop the servomotor.

  The mounting position of the gyro sensor and the method of detecting the angular velocity and acceleration will be described with reference to FIGS. FIG. 5 is a view showing the detection directions of the angular velocity and the acceleration of the gyro sensor. FIG. 6 is a view showing the mounting position of the gyro sensor. FIG. 7 is a diagram showing the vibration in the X axis rotational direction of the bonding head.

  As the gyro sensor 45, a six-axis gyro sensor capable of detecting a three-axis angular velocity and detecting a three-axis acceleration is used. As shown in FIG. 5, the detection (vibration detection) directions of the angular velocity and acceleration of the gyro sensor 45 are Ax: X-direction acceleration (G), Ay: Y-direction acceleration (G), Az: Z-direction acceleration (G), Gx: X-axis angular velocity (deg / s) Gy: Y-axis angular velocity (deg / s) Gz: Z-axis angular velocity (deg / s)

  As shown in FIG. 6, the gyro sensor 45 is located near the center O of the bonding head 41 near the intersection of the driving axes in the X, Y, and Z directions driven by the bonding head 41 (hereinafter referred to simply as the bonding head center). Installed in. For example, the intersection of the drive axes in the X, Y, and Z directions is located on the back side (back side in the drawing) of the bonding head 41, and the center O is the center of gravity of the bonding head 41. The gyro sensor 45 is installed on the front side (the front side in the drawing) of the bonding head 41. Therefore, although the gyro sensor 45 is located in front of the intersection point of the drive axes in the X, Y, and Z directions and the center O of the bonding head 41, it is said to be located at the center of the bonding head. It is possible to extract the vibration waveform of the bonding head from the difference between the acceleration waveform obtained from the gyro sensor 45 and the motor command acceleration waveform.

  Further, as shown in FIG. 7, the vibration (Gx) in the rotational direction of the bonding head 41 can be accurately captured by the gyro sensor 45.

  The procedure of the abnormality diagnosis of the bonding head will be described with reference to FIGS. FIG. 8 is a diagram showing the driving direction of the bonding head and the Z-axis angular velocity. FIG. 9 is a diagram showing an angular velocity waveform and a rotation angle in the state of FIG. 8, FIG. 9 (A) is a diagram showing an angular velocity waveform in the Z axis rotation direction, and FIG. 9 (B) is a diagram of FIG. It is a figure which shows the rotation angle waveform which integrated the waveform. FIG. 10 is a diagram showing the driving direction and Y-direction acceleration of the bonding head. FIG. 11 is a diagram showing an acceleration waveform, an acceleration command waveform and a differential acceleration in the state of FIG. 10, FIG. 11 (A) is a diagram showing an acceleration waveform in the Y direction, and FIG. 11 (B) is an acceleration in the Y direction FIG. 11 (C) is a diagram showing a command waveform, and FIG. 11 (C) is a diagram showing a differential waveform of the waveforms of FIG. 11 (A) and FIG. 11 (B). FIG. 12 is a diagram showing differential velocity and displacement, FIG. 12 (A) is a diagram showing a differential velocity waveform in the Y direction obtained by integrating the waveform of FIG. 11 (C), and FIG. It is a figure which shows the displacement waveform of the Y direction which integrated the waveform of A). FIG. 13 is a diagram showing a composite waveform of vibration displacement in the X direction and vibration displacement in the Y direction when the bonding head is driven in the Y direction. FIG. 14 is a view showing an example of the maximum displacement in three axial directions and the maximum displacement in three axial rotational directions. FIG. 15 is a diagram showing variations in vibration displacement and threshold values.

  (A1) The operation abnormality diagnosis unit 214 integrates the angular velocity signal waveform obtained from the gyro sensor 45 to obtain the vibration displacement in the rotational direction. As shown in FIG. 8, when the bonding head 41 is driven in the Y direction, the angular velocity signal in the Z axis rotational direction is measured, and the angular velocity signal waveform (Gz (deg / deg.) As shown in FIG. The angular velocity signal in the Z-axis rotational direction is integrated to calculate the Z-axis rotational angle (deg) as shown in FIG. Then, vibration displacement in the X-axis rotation direction and vibration displacement in the Y-axis rotation direction when the bonding head 41 is driven in the Y direction are obtained.

  (A2) The operation abnormality diagnosis unit 214 extracts the waveform of the vibration component of the bonding head 41 from the difference between the acceleration signal waveform acquired from the gyro sensor 45 and the commanded acceleration waveform, and obtains the vibration displacement. As shown in FIG. 10, when the bonding head 41 is driven in the Y direction, an acceleration signal in the Y direction is measured to obtain an acceleration signal waveform (Ay) in the Y direction as shown in FIG. The difference between the acceleration signal waveform (Ay) and the commanded acceleration waveform (AD) as shown in FIG. 11B is calculated, and the difference acceleration waveform (ΔAy) as shown in FIG. 11C is calculated. . The differential acceleration waveform (ΔAy) is integrated to calculate a differential velocity (ΔVy) as shown in FIG. Further, this differential velocity (ΔVy) is integrated to obtain vibration displacement (Dy) in the Y direction as shown in FIG. 12 (B). Similarly, vibration displacement in the X direction and vibration displacement in the Z direction when the bonding head 41 is driven in the Y direction are determined.

  (A3) The operation abnormality diagnosis unit 214 determines the 3-axis rotation direction from the vibration displacement in the X-axis rotation direction, the vibration displacement in the Y-axis rotation direction, and the vibration displacement in the Z-axis rotation direction (3-axis rotation direction) obtained in (a1) above. Calculate the composite waveform of vibration displacement in the 3-axis direction from the vibration displacement in the X direction, the vibration displacement in the Y direction, and the vibration displacement in the Z direction (triaxial direction) obtained in (a2) calculate. In FIG. 13, for ease of illustration, a combined waveform of X-direction vibration displacement and Y-direction vibration displacement when the bonding head 41 is driven in the Y direction is shown.

  (A4) From the composite waveform of vibration displacement in the three axial directions of the bonding head and the composite waveform of vibration displacement in the three axial rotational directions of the bonding head, the maximum displacement of the vibration displacement in three axial directions as shown in Determine the maximum displacement (RMD) of vibration displacement in (MD) and triaxial rotational directions.

  (A5) The operation abnormality diagnosis unit 214 measures (calculates) a waveform similar to the composite waveform of vibration displacement during bonding operation obtained in the above (a2) a plurality of times in advance to obtain the same maximum displacement as (a4) It accumulates and compares with the vibration displacement measured (calculated) in the above (a2) in the normal bonding process.

  (A6) The operation abnormality diagnosis unit 214 performs at least one of the maximum displacement (MD) in the direction of three axes of the combined waveform measured (calculated) in (a4) in the normal bonding process and the maximum displacement (RMD) in the direction of three axes rotation. When one exceeds the threshold set in advance as shown in FIG. 15, an abnormality detection signal is output to the command waveform generation unit 212 to stop the servomotor 230, and the operation of the bonding head 41 is abnormal. Display on the monitor 83a.

  (A7) At the time of abnormality detection, the operation abnormality diagnosis unit 214 identifies the cause of the abnormality with operation waveforms divided in the X direction, Y direction, Z direction, X axis rotation direction, Y axis rotation direction, and Z axis rotation direction.

Next, a method of manufacturing a semiconductor device using the die bonder according to the embodiment will be described with reference to FIG. FIG. 16 is a flowchart showing a method of manufacturing a semiconductor device.
Step S11: The wafer ring 14 holding the dicing tape 16 to which the die D divided from the wafer 11 is attached is stored in a wafer cassette (not shown) and carried into the die bonder 10. The controller 8 supplies the wafer ring 14 to the die supply unit 1 from the wafer cassette in which the wafer ring 14 is filled. Also, the substrate S is prepared and carried into the die bonder 10. The controller 8 attaches the substrate S to the substrate transport claw 51 by the substrate supply unit 6.

Step S12: The controller 8 picks up the divided dies from the wafer.
Step S13: The controller 8 stacks the picked up die on the substrate S or on the already bonded die. The control unit 8 places the die D picked up from the wafer 11 on the intermediate stage 31, picks up the die D again from the intermediate stage 31 by the bonding head 41, and bonds it to the transported substrate S. In parallel with step S13, abnormality diagnosis of the bonding head is performed.

  Step S14: The control unit 8 takes out the substrate S to which the die D is bonded from the substrate conveyance claw 51 at the substrate unloading unit 7. The substrate S is unloaded from the die bonder 10.

  In the embodiment, a six-axis gyro sensor is placed at the center of the bonding head. During operation of the bonding head, the vibration waveform of the bonding head rotation direction is extracted from the angular velocity obtained from the 6-axis gyro sensor, and the vibration waveform of the bonding head is extracted from the difference between the acceleration waveform obtained from the gyro sensor and the motor command acceleration waveform. Do. By comparing the displacement of the vibration calculated from the extracted vibration waveform with the displacement of the accumulated vibration measured a plurality of times in advance, it is confirmed whether or not there is a change in the vibration of the current bonding head operation. Detect abnormalities. If the displacement of the vibration measured this time exceeds the threshold given in advance, the device reports an abnormality after stopping the motor. By operating the bonding head using the above functions, it is possible to realize abnormality diagnosis of the bonding head.

  According to the embodiment, it is possible to capture the vibration of the bonding head. Further, by installing the gyro sensor in the vicinity of the center of the bonding head, it is possible to accurately capture the vibration in the rotational direction of the bonding head.

  Also, by comparing the motor command acceleration waveform of the bonding head and the vibration waveform accumulated in the past operation, the bonding head abnormality is determined by determining whether the current displacement of the vibration exceeds the threshold given in advance. Make a diagnosis. As a result, it is possible to prevent in advance device failure and defective products.

  Furthermore, vibration displacement including the rotation direction can be calculated by one sensor. Further, at the time of abnormality detection, it is also possible to identify the cause of the abnormality by dividing it into vibration displacement in each of X, Y, Z directions and X axis, Y axis, and Z axis rotational directions.

<Modification>
Hereinafter, some representative modifications will be illustrated. In the following description of the modified example, the same reference numerals as those in the above-described embodiment may be used for portions having the same configurations and functions as those described in the above-described embodiments. And about description of this part, the description in the above-mentioned example shall be suitably used in the range which is not technically contradictory. In addition, part of the above-described embodiment and all or part of the plurality of modified examples may be applied in combination as appropriate as long as there is no technical contradiction.

(Modification 1)
FIG. 17 is a diagram showing an acceleration waveform, velocity and position in the state of FIG. 10, FIG. 17 (A) is a diagram showing an acceleration waveform in the Y direction, and FIG. 17 (B) is a waveform of FIG. 17 (C) is a diagram showing a position waveform in the Y direction obtained by integrating the waveform shown in FIG. 17 (B).

  In the embodiment, the vibration displacement in the Y direction at the time of driving the bonding head 41 in the Y direction is obtained from the difference between the acceleration signal waveform acquired from the gyro sensor 45 and the commanded acceleration waveform in the above (a2). It is obtained from the difference between the movement locus of the bonding head 41 and the command position waveform.

  (B1) Similar to (a1) in the embodiment, the operation abnormality diagnosis unit 214 detects the vibration displacement in the X axis rotation direction and the vibration displacement in the Y axis rotation direction and the Z axis rotation direction when the bonding head 41 is driven in the Y direction. Ask.

  (B2) Based on the acceleration signal waveform acquired from the gyro sensor 45, the operation abnormality diagnosis unit 214 calculates the operation trajectory of the bonding head 41. As shown in FIG. 10, when the bonding head 41 is driven in the Y direction, an acceleration signal in the Y direction is measured to obtain an acceleration signal waveform (Ay) in the Y direction as shown in FIG. The acceleration signal (Ay) in the Y direction is integrated to calculate the velocity (Vy) in the Y direction as shown in FIG. Further, the velocity (Vy) in the Y direction is integrated to calculate the position (Py) in the Y direction as shown in FIG. 17C, and the motion locus in the Y direction is determined. Similarly, the movement locus in the X direction and the movement locus in the Z direction when driving the bonding head 41 in the Y direction are determined.

  (B3) The operation abnormality diagnosis unit 214 extracts the waveform of the vibration component of the bonding head 41 from the difference between the calculated movement locus and the command position waveform (PD), and the vibration displacement of the bonding head 41 in the Y direction when driving the Y direction. Ask for Similarly, vibration displacement in the X direction and vibration displacement in the Z direction when the bonding head 41 is driven in the Y direction are determined.

  The processes after (b4) are the same as the processes after (a3) of the embodiment.

  In the first modification, a six-axis gyro sensor is installed in the vicinity of the center of the bonding head near the intersection of drive axes in the X, Y, and Z directions for driving the bonding head. While the bonding head is in operation, the vibration waveform in the bonding head rotation direction is extracted from the angular velocity obtained from the 6-axis gyro sensor, and the movement locus of the bonding head is calculated based on the acceleration waveform obtained from the gyro sensor. The vibration waveform of the bonding head is extracted from the difference from the motor command position waveform. By comparing the displacement of the vibration calculated from the extracted vibration waveform with the displacement of the accumulated vibration measured a plurality of times in advance, it is confirmed whether or not there is a change in the vibration of the current bonding head operation. Detect abnormalities. If the displacement of the vibration measured this time exceeds the threshold given in advance, the device reports an abnormality after stopping the motor. By operating the bonding head using the above functions, it is possible to realize abnormality diagnosis of the bonding head.

(Modification 2)
FIG. 18 is a view showing the mounting position of the gyro sensor according to the second modification.

  In the embodiment, the case where the gyro sensor 45 is installed near the center O of the bonding head 41 close to the intersection of the driving axes in the X, Y, and Z directions driven by the bonding head 41 has been described. It can be installed at a place where the sensor can be attached between the tip of the collet 42 of the bonding head 41 and the upper end of the bonding head 41.

  As shown in FIG. 18, when the gyro sensor 45 is installed at the tip of the collet 42 of the bonding head 41 or in the vicinity of the tip of the collet 42, it becomes possible to directly capture the vibration affecting the bonding accuracy.

  In the second modification, a six-axis gyro sensor is placed near the collet tip or collet tip of the bonding head. By this, the vibration (the acceleration signal in the X direction (Ax) and the acceleration signal in the Y direction at the time of driving in the Y direction) directly affecting the bonding accuracy is directly captured, measured in advance a plurality of times, and the displacements of the stored vibrations are compared. To detect an abnormality of the device.

  (C1) As shown in FIG. 18, when the bonding head 41 is driven in the Y direction, an acceleration signal (Ax) in the X direction and an acceleration signal (Ay) in the Y direction are measured.

  (C2) The operation abnormality diagnosis unit 214 extracts the waveform of the vibration component of the bonding head 41 from the difference between the measured acceleration signal (Ay) and the commanded acceleration waveform, and obtains vibration displacement in the Y direction. Similarly, vibration displacement in the X direction when the bonding head 41 is driven in the Y direction is determined.

  (C3) The operation abnormality diagnosis unit 214 calculates a composite waveform of vibration displacement as shown in FIG. 13 from the vibration displacement of the X direction and the vibration displacement of the Y direction obtained in (c2).

  (C4) The operation abnormality diagnosis unit 214 obtains the maximum displacement (MD) of the vibration displacement in the two axial directions from the combined waveform of the vibration displacements in the two axial directions of the bonding head.

  (C5) The operation abnormality diagnosis unit 214 measures (calculates) a waveform similar to the composite waveform of the vibration displacement during the bonding operation obtained in (c4) above a plurality of times in advance and stores the same in the normal bonding process. The vibration displacement measured (calculated) in the above (c3) is compared.

  (C6) The operation abnormality diagnosis unit 214 determines the maximum displacement (MD) in the direction of two axes of the combined waveform measured (calculated) in (c4) in the normal bonding process, using a threshold set in advance as shown in FIG. If it exceeds, the abnormality detection signal is output to the command waveform generation unit 212 to stop the servomotor 230, and the monitor 83a displays that the operation of the bonding head 41 is abnormal.

  (C7) At the time of abnormality detection, the operation abnormality diagnosis unit 214 identifies the cause of the abnormality by the operation waveform divided in each of the X direction and the Y direction.

(Modification 3)
FIG. 19 is a diagram showing an abnormality determining method according to the third modification. FIG. 19 shows a composite waveform of the X-direction vibration displacement and the Y-direction vibration displacement when the bonding head 41 is driven in the Y direction, in order to facilitate the illustration.

  In the embodiment and the first and second modifications, although a single threshold value is given to the maximum displacement of the composite waveform to make an abnormality diagnosis, a locus of X-Y-direction vibration displacement and X-axis Y-axis measured in multiple times A method may be used in which it is determined that an abnormality occurs when a certain distance is separated from the locus of vibration displacement in the Z-axis rotational direction. In this method, it is not necessary to determine the maximum displacement from the composite waveform. It is as follows when this is applied to an Example. The third modification can be applied to the first and second modifications.

  (D1) The operation abnormality diagnosis unit 214 performs the same process as (a1) in the embodiment.

  (D2) The operation abnormality diagnosis unit 214 performs the same process as (a2) in the embodiment.

  (D3) The operation abnormality diagnosis unit 214 performs the same process as (a3) in the embodiment.

  (D4) The operation abnormality diagnosis unit 214 measures (calculates) a waveform similar to the composite waveform of vibration displacement during bonding operation obtained in the above (d2) a plurality of times in advance and stores it in the normal bonding process. The vibration displacement measured (calculated) in the above (d2) is compared.

  (D5) If the combined waveform measured (calculated) in (d4) in the normal bonding process exceeds the threshold set in advance as shown in FIG. The abnormality detection signal is output to stop the servomotor 230, and the monitor 83a indicates that the operation of the bonding head 41 is abnormal.

As mentioned above, although the invention made by the present inventor was concretely explained based on an embodiment, an example, and modification, the present invention is not limited to the above-mentioned embodiment, an example, and modification, and variously changed It goes without saying that it is possible.
For example, in the embodiment, the case where the bonding head is driven in the Y axis is described, but the embodiment can also be applied in the case where the bonding head is driven in the Z axis.
In the embodiment, an example in which a gyro sensor is provided in the bonding head has been described. However, the present invention is not limited to this, and a gyro sensor may be provided in the pickup head.
In addition, in the embodiment, the displacement of the vibration is determined to perform the abnormality diagnosis, but not only the displacement of the vibration but also the frequency component etc. are specified by Fourier transform and the vibration level for each frequency is compared with the past operation. You may make an abnormality diagnosis.
In addition, a gyro sensor is provided on the bonding head mount of the bond head table and pickup head table (X, Y, Z drive unit), and vibration data other than vibration data due to the operation of each head is acquired. An abnormality diagnosis may be performed using the difference of
Alternatively, vibration data of the respective heads at rest may be used as reference data. This makes it possible to analyze data only by the operation of each head, and perform abnormality diagnosis with higher accuracy.
In addition, a gyro sensor may be provided in the substrate recognition camera, the stage recognition camera, and the wafer recognition camera to diagnose whether the abnormality caused by the bonding accuracy is an operation of the head or an abnormality on the camera side.
Further, although one pickup head and one bonding head are provided in the embodiment, two or more may be provided. Moreover, although the intermediate stage is provided in the embodiment, the intermediate stage may not be provided. In this case, the pickup head and the bonding head may be combined.
Also, in the embodiment, the die is bonded with the front side up, but after picking up the die, the front and back of the die may be reversed and the die may be bonded with the back side up. In this case, the intermediate stage may not be provided. This device is called a flip chip bonder.

10: Die bonder
1: Die supply unit 11: Wafer 13: Push-up unit 2: Pickup unit 21: Pickup head 3: Intermediate stage unit 31: Intermediate stage 4: Bonding unit 41: Bonding head 8: Controller 83e: Motor controller 210: Motion Controller 211: ideal waveform generation unit 212: command waveform generation unit 213: DAC
214: operation abnormality diagnosis unit 220: servo amplifier 221: speed loop control unit 230: servo motor D: die S: substrate

Claims (14)

A die supply unit,
A substrate supply unit,
A bonding unit for bonding a die supplied from the die supply unit onto a substrate supplied from the substrate supply unit or a die already bonded to the substrate;
A control unit that controls the die supply unit, the substrate supply unit, and the bonding unit;
Have
The bonding unit is
A bonding head comprising a collet for adsorbing the die;
A drive unit provided with a drive shaft for moving the bonding head;
A sensor capable of detecting an angular velocity and an acceleration of the bonding head;
Equipped with
The said control part is a die bonding apparatus which judges abnormality by comparing the vibration displacement and the threshold value of vibration displacement preset based on the result obtained by the said sensor. In claim 1,
The sensor is installed near the center of the bonding head near the intersection of drive axes of the bonding head in the X, Y, and Z directions.
The control unit
(A) During operation of the bonding head, the vibration waveform in the rotational direction of the bonding head is extracted from the angular velocity obtained from the sensor, and
(B) extracting the vibration waveform of the bonding head from the difference between the acceleration waveform obtained from the sensor and the motor command acceleration waveform;
(C) The vibration of the current bonding head is changed by comparing the displacement of the vibration calculated from the extracted vibration waveform with the threshold set based on the displacement of the vibration measured and accumulated a plurality of times in advance Check if there is a die bonding device to determine the device abnormality. In claim 1,
The sensor is installed near the center of the bonding head near an intersection of drive axes in the X, Y, and Z directions driven by the bonding head.
The control unit
(A) During operation of the bonding head, the vibration waveform of the bonding head rotation direction is extracted from the angular velocity obtained from the sensor, and the movement trajectory of the bonding head is calculated based on the acceleration waveform obtained from the sensor ,
(B) extracting the vibration waveform of the bonding head from the difference between the movement trajectory of the bonding head and the motor command position waveform;
(C) The vibration of the current bonding head is changed by comparing the displacement of the vibration calculated from the extracted vibration waveform with the threshold set based on the displacement of the vibration measured and accumulated a plurality of times in advance Check if there is a die bonding device to determine the device abnormality. In claim 1,
The sensor is installed under the bonding head to which the collet is attached,
The control unit
(A) During operation of the bonding head, the vibration waveform of the bonding head is extracted from the difference between the acceleration waveform obtained from the sensor and the motor command acceleration waveform,
(B) The vibration of the current bonding head is changed by comparing the displacement of the vibration calculated from the extracted vibration waveform with the threshold set based on the displacement of the vibration measured and accumulated a plurality of times in advance Check if there is a die bonding device to determine the device abnormality. In claim 1,
Furthermore, it has a pickup unit,
The pickup unit is
A pickup head comprising a collet for adsorbing the die;
A drive unit provided with a drive shaft for moving the pickup head;
A second sensor capable of detecting an angular velocity and an acceleration of the pickup head;
Equipped with
The said control part is a die bonding apparatus which judges abnormality, comparing the vibration displacement and the threshold value of vibration displacement preset based on the result obtained by said 2nd sensor. In claim 2,
The sensor is
Angular velocity in X-axis rotation direction, Y-axis rotation direction and Z-axis rotation direction,
Acceleration in the X, Y and Z directions,
Measure
The control unit
(A1) The measured angular velocity signal in the X-axis rotation direction, the angular velocity signal in the Y-axis rotation direction, and the angular velocity signal in the Z-axis rotation direction are integrated to generate vibration displacement in the X-axis rotation direction and vibration displacement in the Y-axis rotation direction. Calculate the vibration displacement in the Z-axis and Z-axis rotation directions,
(B1) The waveform of the vibration component is extracted from the difference between the measured acceleration waveform in the X, Y and Z directions and the commanded acceleration waveform, and the vibration displacement in the X direction, the vibration displacement in the Y direction and the vibration displacement in the Z direction Calculate
(C1) A first composite waveform obtained by combining the calculated vibration displacement in the X axis rotation direction, the vibration displacement in the Y axis rotation direction, and the vibration displacement in the Z axis rotation direction, the calculated vibration displacement in the X direction, and the Y direction Calculate a second composite waveform combining vibration displacement and vibration displacement in the Z direction,
(C2) The first maximum displacement of the vibration displacement in the X axis rotational direction, the vibration displacement in the Y axis rotational direction and the vibration displacement in the Z axis rotational direction is calculated from the first composite waveform, and the X from the second composite waveform Calculate the second maximum displacement of vibration displacement in the direction, vibration displacement in the Y direction, and vibration displacement in the Z direction,
(C3) Based on the first maximum displacement and a threshold set based on the maximum displacement measured and accumulated a plurality of times in advance and compared with the second maximum displacement and the maximum displacement measured and accumulated a plurality of times in advance Die bonding equipment to compare with the set threshold. In claim 3,
The sensor is
Angular velocity in X-axis rotation direction, Y-axis rotation direction and Z-axis rotation direction,
Acceleration in the X, Y and Z directions,
Measure
The control unit
(A1) The measured angular velocity signal in the X-axis rotation direction, the angular velocity signal in the Y-axis rotation direction, and the angular velocity signal in the Z-axis rotation direction are integrated to generate vibration displacement in the X-axis rotation direction and vibration displacement in the Y-axis rotation direction. Calculate the vibration displacement in the Z-axis and Z-axis rotation directions,
(B1) integrating the measured acceleration waveforms in the X, Y, and Z directions to calculate motion trajectories in the X, Y, and Z directions;
(B2) The waveform of the vibration component is extracted from the difference between the calculated motion trajectory in the X, Y and Z directions and the command position waveform, and the vibration displacement in the X direction, the vibration displacement in the Y direction and the vibration displacement in the Z direction Calculate
(C1) A first composite waveform obtained by combining the calculated vibration displacement in the X axis rotation direction, the vibration displacement in the Y axis rotation direction, and the vibration displacement in the Z axis rotation direction, the calculated vibration displacement in the X direction, and the Y direction Calculate a second composite waveform combining vibration displacement and vibration displacement in the Z direction,
(C2) The first maximum displacement of the vibration displacement in the X axis rotational direction, the vibration displacement in the Y axis rotational direction and the vibration displacement in the Z axis rotational direction is calculated from the first composite waveform, and the X from the second composite waveform Calculate the second maximum displacement of vibration displacement in the direction, vibration displacement in the Y direction, and vibration displacement in the Z direction,
(C3) Based on the first maximum displacement and a threshold set based on the maximum displacement measured and accumulated a plurality of times in advance and compared with the second maximum displacement and the maximum displacement measured and accumulated a plurality of times in advance Die bonding equipment to compare with the set threshold. In claim 4,
The sensor is
Angular velocity in X-axis rotation direction, Y-axis rotation direction and Z-axis rotation direction,
Acceleration in the X, Y and Z directions,
Measure
The control unit
(B1) Extract the waveform of the vibration component from the difference between the measured acceleration waveform in the X and Y directions and the commanded acceleration waveform, and calculate the vibration displacement in the X direction and the vibration displacement in the Y direction,
(C1) calculating a combined waveform obtained by combining the calculated X-direction vibration displacement and Y-direction vibration displacement;
(C2) calculating the maximum displacement of the vibration displacement in the X direction and the vibration displacement in the Y direction from the combined waveform,
(C3) A die bonding apparatus for comparing the maximum displacement with a threshold set based on the maximum displacement measured and accumulated a plurality of times in advance. In claim 2,
The sensor is
Angular velocity in X-axis rotation direction, Y-axis rotation direction and Z-axis rotation direction,
Acceleration in the X, Y and Z directions,
Measure
The control unit
(A1) The measured angular velocity signal in the X-axis rotation direction, the angular velocity signal in the Y-axis rotation direction, and the angular velocity signal in the Z-axis rotation direction are integrated to generate vibration displacement in the X-axis rotation direction and vibration displacement in the Y-axis rotation direction. Calculate the vibration displacement in the Z-axis and Z-axis rotation directions,
(B1) The waveform of the vibration component is extracted from the difference between the measured acceleration waveform in the X, Y and Z directions and the commanded acceleration waveform, and the vibration displacement in the X direction, the vibration displacement in the Y direction and the vibration displacement in the Z direction Calculate
(C1) A first composite waveform obtained by combining the calculated vibration displacement in the X axis rotation direction, the vibration displacement in the Y axis rotation direction, and the vibration displacement in the Z axis rotation direction, the calculated vibration displacement in the X direction, and the Y direction Calculate a second composite waveform combining vibration displacement and vibration displacement in the Z direction,
(C2) Based on the first combined waveform and a threshold set based on the combined waveform measured and stored a plurality of times in advance, and compared to the second combined waveform and the combined waveform measured and stored a plurality of times in advance Die bonding equipment to compare with the set threshold. In claim 3,
The sensor is
Angular velocity in X-axis rotation direction, Y-axis rotation direction and Z-axis rotation direction,
Acceleration in the X, Y and Z directions,
Measure
The control unit
(A1) The measured angular velocity signal in the X-axis rotation direction, the angular velocity signal in the Y-axis rotation direction, and the angular velocity signal in the Z-axis rotation direction are integrated to generate vibration displacement in the X-axis rotation direction and vibration displacement in the Y-axis rotation direction. Calculate the vibration displacement in the Z-axis and Z-axis rotation directions,
(B1) integrating the measured acceleration waveforms in the X, Y, and Z directions to calculate motion trajectories in the X, Y, and Z directions;
(B2) The waveform of the vibration component is extracted from the difference between the calculated motion trajectory in the X, Y and Z directions and the command position waveform, and the vibration displacement in the X direction, the vibration displacement in the Y direction and the vibration displacement in the Z direction Calculate
(C1) A first composite waveform obtained by combining the calculated vibration displacement in the X axis rotation direction, the vibration displacement in the Y axis rotation direction, and the vibration displacement in the Z axis rotation direction, the calculated vibration displacement in the X direction, and the Y direction Calculate a second composite waveform combining vibration displacement and vibration displacement in the Z direction,
(C2) Based on the first combined waveform and a threshold set based on the combined waveform measured and stored a plurality of times in advance, and compared to the second combined waveform and the combined waveform measured and stored a plurality of times in advance Die bonding equipment to compare with the set threshold. In claim 4,
The sensor is
Angular velocity in X-axis rotation direction, Y-axis rotation direction and Z-axis rotation direction,
Acceleration in the X, Y and Z directions,
Measure
The control unit
(B1) Extract the waveform of the vibration component from the difference between the measured acceleration waveform in the X and Y directions and the commanded acceleration waveform, and calculate the vibration displacement in the X direction and the vibration displacement in the Y direction,
(C1) calculating a combined waveform obtained by combining the calculated X-direction vibration displacement and Y-direction vibration displacement;
(C2) A die bonding apparatus for comparing the composite waveform with a threshold set based on the composite waveform measured and accumulated a plurality of times in advance. (A) preparing a die bonding apparatus according to any one of claims 1 to 11;
(B) carrying in a wafer ring holder for holding a dicing tape to which a die is attached;
(C) preparing and loading a substrate;
(D) picking up the die;
(E) bonding the picked up die onto the substrate or the already bonded die;
(F) performing an abnormality diagnosis using a measurement result by the sensor;
Equipped with
The step (f) is a method of manufacturing a semiconductor device which detects the presence or absence of an abnormality in the operation of the bonding head based on the measurement result of the sensor in parallel with the step (e). In claim 12,
The step (d) picks up the die on the dicing tape with the bonding head,
The step (e) is a method of manufacturing a semiconductor device in which the die picked up by the bonding head is bonded onto the substrate or the die already bonded. In claim 12,
In the step (d),
(D1) picking up a die on the dicing tape with the pickup head;
(D2) placing a die picked up by the pickup head on an intermediate stage;
Equipped with
In the step (e),
(E1) picking up a die placed on the intermediate stage with a bonding head;
(E2) placing a die picked up by the bonding head on the substrate;
Equipped with
The step (f) is a method of manufacturing a semiconductor device that detects the presence or absence of an abnormal vibration of the operation of the pickup head based on the measurement result of the second sensor in parallel with the step (d2).

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