JP6374189B2 - Die bonder and bonding method - Google Patents

Description

  The present invention relates to a die bonder and a bonding method, and more particularly to a die bonder and a bonding method with high throughput that can reduce processing time.

  One type of semiconductor manufacturing apparatus is a die bonder that bonds a semiconductor chip (die) to a substrate such as a lead frame. In the die bonder, the die is vacuum-adsorbed by a bonding head, and the die is raised at a high speed, horizontally moved, and lowered to be mounted on a substrate.

  For example, when a die is mounted with a bonding head, the mounting accuracy is becoming stricter as the die size is reduced. Therefore, conventionally, in order to prevent the mounting accuracy of the die from being lowered due to vibration caused by the die mounting (bonding) process by the bonding head, evaluation is performed with a time margin in consideration of the damping time of the bonding head vibration, Die was mounted.

  There exists patent document 1 as such a die bonder.

JP 2002-184836 A

  However, in the prior art, since the operation such as bonding was started after waiting for a predetermined time in anticipation of the vibration attenuation time with a time margin in consideration of the vibration attenuation time, the mounting time As a result, the throughput (tact time) was reduced. This kind of evaluation is also performed when picking up a die with a bonding head or a pickup head, or when recognizing the position of a conveyed die with a camera, etc., which contributes to a decrease in throughput of the entire die bonder. It was.

  Accordingly, an object of the present invention is to provide a die bonder and a bonding method that can improve the throughput.

In order to achieve the above object, the present invention has at least the following features.
The present invention relates to a die bonder or a bonding method for picking up a die from a wafer and bonding the die to a conveyed work. The driven body is driven by a drive unit, and the vibration of the driven body is detected by a vibrometer. The processing operation by the driven body is controlled based on the vibration detection result detected by the vibrometer.

In the control according to the present invention, the processing operation of the driven body may be started when the vibration becomes a predetermined value or less.
Furthermore, the present invention provides a bonding head in which a driven body attaches a die to a workpiece, and a bonding head that has stopped immediately before the processing operation starts attaching the die to the workpiece is lowered to attach the die to the workpiece. It may be the start of the operation to perform.

Further, the present invention is a pickup head in which the driven body picks up the die from the wafer or the intermediate stage, and the pickup head that has stopped immediately before the start of the processing operation picks up the die from the wafer is lowered toward the die. It may be the start of the operation to perform.
Furthermore, the present invention is an optical system in which the driven body detects the position of the die or the workpiece, and the start of the processing operation may be the start of an operation in which the optical system images the die or the workpiece.

The present invention also detects other vibrations of other driven bodies that interfere with vibrations generated by the processing operation of the driven body, and the control means detects vibrations generated by the processing operation of the driven body and other driven bodies. The processing operation of the driven body may be started when the vibration generated by the processing operation becomes less than a predetermined value.
Furthermore, the present invention detects each vibration of the plurality of driven bodies, and learns based on the detection result of the vibration of each driven body so that the processes of the plurality of driven bodies do not interfere with each other, A time chart of each process may be created, and each process may be performed based on the time chart.

  ADVANTAGE OF THE INVENTION According to this invention, the die bonder and bonding method which can improve a throughput can be provided.

It is the conceptual diagram which looked at 1st Embodiment of the die bonder of this invention from the top. It is a figure which shows arrangement | positioning of the acceleration sensor shown with the black square of the block diagram of the bonding head in the 1st Embodiment of a die bonder, a needle, a wafer ring, and those optical systems. It is the conceptual diagram which looked at 2nd Embodiment of the die bonder of this invention from the top. FIG. 2 is a schematic configuration diagram of a control system that controls each operation, and illustrates the first embodiment as an example. It is also a figure which shows typically the condition at the time of bonding in 1st, 2nd embodiment. It is a figure which shows typically the condition when picking up a die in 1st, 2nd embodiment, and is a figure which shows the state which detects the position of the die picked up by a wafer part optical system.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a conceptual view of a first embodiment 10A of a die bonder 10 according to the present invention as viewed from above. The die bonder is roughly divided into a wafer supply unit 1, a work supply / conveyance unit 2, and a die bonding unit 3.

  The wafer supply unit 1 includes a wafer cassette lifter 11 and a pickup device 12. The wafer cassette lifter 11 has a wafer cassette (not shown) filled with wafer rings, and sequentially supplies the wafer rings to the pickup device 12. The pick-up device 12 moves the wafer ring so that the desired die can be picked up from the wafer ring.

The workpiece supply / conveyance unit 2 includes a stack loader 21, a frame feeder 22, and an unloader 23, and conveys a workpiece (substrate B such as a lead frame) in the direction of the arrow. The substrate B is carried alone or on the pallet P (see FIG. 2). The stack loader 21 supplies a work for bonding the die to the frame feeder 22. The frame feeder 22 conveys the work to the unloader 23 through two processing positions on the frame feeder 22. The unloader 23 stores the conveyed work.
The die bonding unit 3 includes a preform unit (paste application unit) 31 and a bonding head unit 32. The preform portion 31 applies a die adhesive to the workpiece, for example, a lead frame, conveyed by the frame feeder 22 with a needle 36 (see FIG. 2).

  The bonding head unit 32 picks up the die from the pickup device 12 and moves up to move the die to the bonding position on the frame feeder 22. Then, the bonding head unit 32 lowers the die at the bonding point, and bonds (mounts) the die onto the workpiece coated with the die adhesive.

The bonding head unit 32 includes a ZY drive shaft 60 that moves the bonding head 35 (see FIG. 2) up and down in the Z (height) direction and moves it in the Y direction, and an X drive shaft 70 that moves in the X direction. The ZY drive shaft 60 is in the Y direction indicated by the arrow C, that is, the Y drive shaft 55 that reciprocates the bonding head between the pickup position in the pickup device 12 and the bonding point, and the die is picked up from the wafer or bonded to the substrate B. And a Z drive shaft 50 that moves up and down. The X drive shaft 70 moves the entire ZY drive shaft 60 in the X direction, which is the direction in which the workpiece is conveyed.
Note that the θ drive shaft for rotating the die with respect to the workpiece is omitted.

  FIG. 2 is a diagram showing the configuration of the bonding head 35, the needle 36, the wafer ring 16, and their optical system 38 in this embodiment, and the arrangement of acceleration sensors which are a kind of vibrometer shown by a black square. is there. The optical system 38 includes a preform part optical system 33 for grasping the application position of the needle 36, a bonding part optical system 34 for grasping the bonding position for bonding to the substrate B on which the bonding head 35 has been conveyed, and the bonding head 35. And a wafer optical system 15 for grasping the pickup position of the die D picked up from the wafer 14. Each part optical system has an illumination device and a camera for illuminating the object. The dies D diced on the wafer 14 are fixed to a dicing tape 17 fixed to the wafer ring 16. In the following description, an acceleration sensor will be described as an example of a vibration meter, but the vibration sensor is not limited to an acceleration sensor as long as vibration can be detected.

  The acceleration sensor is bonded to a driven body such as a bonding head 35, a needle 36, a wafer ring 16, a preform optical system 33, a bonding optical system 34, a wafer optical system 15, and a frame feeder 22. It is fixed so that the vibration of the driven body can be detected with good sensitivity using adhesives, double-sided tape, bolts, etc. It is indicated by the subscript s. Each acceleration sensor has the ability to detect vibrations in the X, Y, and Z directions.

  With this configuration, while monitoring the vibration of the driven body detected by each acceleration sensor, when the vibration is attenuated to a predetermined level (value), the die D is picked up by the bonding head 35, and the die adhesive is formed by the needle 36. By instructing the start of operations such as coating and bonding of the die D to the substrate B by the bonding head 35, the bonding operation and the like can be performed more quickly. In addition to improving throughput, the effects of vibration in each process, such as die bonding, pickup, adhesive application, etc., are executed at the timing when the vibration is attenuated. Or each process can be performed reliably. In addition, it is possible to reduce vibrations and insufficient positional accuracy at the time of die bonding and adhesive application, and defective bonding state of the die and defective coating due to tilting of the bonding head 35 and the like. When monitoring the vibration detected by the acceleration sensor, the output value to be monitored differs depending on the specifications of the mounted acceleration sensor. For example, the acceleration can be measured in a range of ± 1.5 G (gravity acceleration). When an acceleration sensor that can be used is installed, when the output voltage value (threshold value) output from the acceleration sensor reaches 240 mV corresponding to an acceleration of 0.30 G, an instruction to start die bonding or the like is given. It is possible to maintain a certain bonding accuracy. Of course, by changing the threshold value in the acceleration sensor according to the required bonding accuracy, adhesive application accuracy, etc., it is possible to cope with bonding accuracy of various specifications.

  FIG. 3 is a conceptual view of the second embodiment 10B of the die bonder 10 of the present invention as viewed from above. The embodiment 10A is a die bonder in which the bonding head 35 sucks and picks up the die D from the wafer 14 and mounts the sucked die D on the substrate B.

On the other hand, in the embodiment 10B, the die D picked up by the dedicated pickup head 85 for picking up the die D from the wafer 14 is once placed on the intermediate stage 8, and the die D on which the bonding head 35 is placed on the intermediate stage 8 is placed. A die bonder that picks up and bonds the picked up die D to the substrate B. In this die bonder, the pickup head 85 is also provided with an acceleration sensor 85. Reference numeral 80 denotes a Y drive shaft of the pickup head 85. Further, the X, Z, and θ drive shafts of the bonding head 35 and the pickup head 85 are omitted.
In addition, the code | symbol in FIG. 3 has shown the same code | symbol as what has the same function as Embodiment 10A.

  In Examples 1 to 4 to be described later, all of the acceleration sensors shown in FIGS. 2 and 3 may not always be necessary. Conversely, other components such as a bond head 35s, a bond optical system 34s, and a wafer optical system are used. In addition to 15s, a frame feeder 22 that is a claw for workpiece conveyance and a bonding stage 22b for fixing the workpiece may be provided if necessary.

  FIG. 4 is a schematic configuration diagram of the control system 40 that controls the above-described operation, and illustrates the embodiment 10A as an example. The control system 40 roughly includes a control / arithmetic unit 41 mainly composed of a CPU, a storage device 42, an input / output device 43, a bus line 44, and a power supply unit 45. The storage device 42 includes a main storage device 42a configured by a RAM that stores processing programs and the like, and a storage medium such as an HDD or a non-volatile memory that stores control data, image data, and the like necessary for control. And an auxiliary storage device 42b. The input / output device 43 includes a monitor 43a for displaying device status and information, a touch panel 43b for inputting operator instructions, a mouse 43c for operating the monitor, and an image capturing device 43d for capturing image data from the optical system 38. And a motor control device 43e that controls a motor 65 such as an XY table (not shown) of the pickup device 12 and a ZY drive shaft 60, and a signal unit 66 such as an acceleration sensor signal and a switch such as a lighting device. Or it has the I / O signal control device 43f to control. For example, when the control / calculation unit 41 takes in necessary data such as a voltage value correlated with the acceleration output from the acceleration sensor via the bus line 44, for example, the output voltage output from the acceleration sensor is 800 mV. Processes and calculates the acceleration as 1G. Thereafter, the value output from the acceleration sensor having the subscript s is constantly or periodically monitored, and the output value is a threshold value corresponding to a preset output value of the acceleration sensor (for example, a voltage corresponding to an acceleration of 0.3 G). A process of outputting a signal such as starting die bonding or the like at a timing smaller than (value) is performed. Then, the bonding head 35 and the like are controlled so that the acceleration during processing operations such as die bonding and die pickup does not exceed a predetermined threshold value set in advance. This threshold value can be changed according to the accuracy required for die bonding. In parallel with or before or after the above processing, the output voltage value of the acceleration sensor having the subscript s mounted in each part on the monitor 43a or the like, or data or information obtained by converting the output voltage value into acceleration is transmitted.

Next, an application example of the acceleration sensor, which is a feature of the embodiment of the present invention, will be described.
(Example 1)
The first example is an example in which, in the embodiments 10A and 10B, the bonding head 35 is provided with an acceleration sensor 35s, so that the bonding time, that is, the throughput can be shortened. FIG. 5 is also a diagram schematically showing a situation when bonding is performed in the embodiments 10A and 10B.

  The bonding head 35 has an acceleration sensor 35s on the tip side. By providing the acceleration sensor 35s as close to the tip of the bonding head 35 as possible, vibration of the bonding head can be detected with high sensitivity. As a result, vibration attenuation can be accurately detected, the operation start timing can be accurately determined and controlled, and the die can be bonded with high accuracy after determining the vibration attenuation timing. For this purpose, the acceleration sensor is preferably small, and for example, a MEMS (Micro Electro Mechanical Systems) sensor may be used.

  The multiple lead frame Bt is conveyed to the bonding position on the bonding stage 22b by the frame feeder 22, and then the bonding position on the lead frame B (B1, B2, B3) is detected by the bonding unit optical system 34. The Based on the information on the bonding position, the bonding head 35 moves right above the bonding position by the Y drive shaft 55, the X drive shaft 70, or the θ drive shaft.

  When the bonding head 35 comes directly above the bonding position, basically, the frame feeder 22 stops, the bonding position is already detected by the bonding unit optical system 34, and the bonding head 35 can be accurately bonded. ing.

  At this time, the bonding head 35 lowers the die D adsorbed by the collet 35c by the Z drive shaft 50 to a position just before the bonding position on the lead frame B (substantially above). At this timing, the acceleration sensor 35s detects and monitors the vibration at the tip of the bonding head. When the vibration level falls within a predetermined range, for example, when it is detected and determined that the acceleration is within 0.5 G or less (output voltage 400 mV or less), the bonding head 35 immediately lowers the die D to lead the lead frame. Bonding while pressing B.

  The time until the vibration at the tip of the bonding head 35 is attenuated varies depending on the configuration of the bonding head 35 and the die size. Conventionally, for example, the vibration when the bonding head 35 stops immediately before the substrate B is at a predetermined level. When it is experimentally known that the decay time when the following is reached is about 0.80 s, these allowances of about 0.33 s are taken into account, taking into account variations in decay time, etc. Bonding was made after waiting for a preset time of about 1.13 s, which is the sum of the time.

  On the other hand, in the first embodiment, the bonding operation can be started as soon as it is detected by the acceleration sensor 35s that the vibration has been attenuated to a predetermined level. Therefore, the bonding time has an allowance, for example, an expected value of at least 0.33 s. Can be shortened. Further, experimentally, when the bonding head 35 stops just before the substrate B and the time until the vibration is attenuated to a predetermined level or less is less than about 0.80 s, that is, when the vibration is attenuated at 0.60 s, the bonding is performed. The bonding operation can be started immediately after 0.60 s has elapsed since the head 35 stopped immediately before the substrate B.

  By providing an acceleration sensor to each of the needle 36 of the embodiment 10A and the pickup head 85 (see FIG. 3) of the embodiment 10B, the intermediate stage 8 (FIG. 3), the processing time can be shortened in the same manner as the bonding process of the bonding head 35 described in the first embodiment.

(Example 2)
The second example is an example in which the bonding position optical system 34 and the acceleration sensors 34 s and 22 s provided in the frame feeder 22 can be used in Embodiments 10A and 10B to shorten the bonding position detection time.

  In FIG. 5, the multiple lead frame Bt is conveyed to a bonding position on the bonding stage 22 b by the frame feeder 22. The bonding unit optical system 34 is controlled and driven by the drive shaft 34d, and detects each bonding position where the die D is bonded while sequentially moving above the individual lead frames B. The drive shaft 34d has an X drive shaft 34x and a Y drive shaft 34y that move the bonding unit optical system 34 in the X and Y directions.

  In order to accurately detect the bonding position, particularly for the first lead frame B1, the vibration level of both the frame feeder 22 and the bonding unit optical system 34 is within a predetermined range, for example, the frame feeder 22 and the bonding unit optical system. It is important that the acceleration in each of the systems 34 is within 0.30 G or less (output voltage 240 mV or less). When either one of the vibration levels exceeds a predetermined range, the image obtained from the bonding unit optical system 34 is detected with a predetermined position error or more. For example, the image is shaken by vibration, so that the bonding position can be accurately determined. Cannot be detected.

  Therefore, as soon as the vibration levels of the bonding unit optical system 34 and the frame feeder 22 detected by the acceleration sensors 34 s and 22 s fall within a predetermined range, an image is acquired and an accurate bonding position is detected. Here, the acceleration sensors 34 s and 22 s are mounted on both the bonding unit optical system 34 and the frame feeder 22 that conveys the lead frame B that is a target (subject) to be imaged by the bonding unit optical system 34, thereby bonding. It can be detected whether the partial optical system 34 is vibrating, whether the lead frame B on the frame feeder 22 to be imaged is vibrating, and how much each vibration is. As a result, starting the bonding operation when the vibration of either the bonding unit optical system 34 or the frame feeder 22 has not yet attenuated causes deterioration in accuracy and prevents the bonding accuracy from being reduced. Can do. Conventionally, as described in the first embodiment, the margin time is set and added to the vibration attenuation times of the frame feeder 22 and the bonding unit optical system 34, so that the frame feeder 22 or the bonding unit optical system is added. The image is captured after waiting for a time defined by the longer of the sum of the vibration damping time and the margin time in each configuration of the system 34. Accordingly, when the vibration attenuation time in the frame feeder 22 is 0.9 s and the margin time is 0.4 s, and the vibration attenuation time in the bonding unit optical system 34 is 0.7 s and the margin time is 0.2 s, the frame feeder The sum of the vibration attenuation time and the allowance time in the respective configurations of the optical fiber 22 and the bonding unit optical system 34 is 1.3 s and 0.9 s, so that the frame feeder 22 takes a long time until the vibration is attenuated to a predetermined range. The image is captured after waiting for the vibration to decay.

  For the second and third lead frames B2 and B3, since the frame feeder 22 has already stopped, it is only necessary to monitor the acceleration sensor 34s of the bonding unit optical system 34. Further, contrary to the attenuation time of the frame feeder 22 and the bonding unit optical system 34 exemplified above, also in the first lead frame B1, the attenuation time of the vibration by the bonding unit optical system 34 is the attenuation time by the frame feeder 22. If it is longer than, only the acceleration sensor 34s of the bonding portion optical system 34 may be monitored.

  Accordingly, also in the second embodiment, as in the first embodiment, the bonding position by the bonding unit optical system 34 can be accurately detected, and the processing time can be shortened by an extra time as an expected value in the detection processing. In addition, by always detecting the vibration of the frame feeder 22 and the bonding unit optical system 34, it is possible to shorten the time more than the margin time while maintaining the bonding accuracy depending on the apparatus configuration, the operating environment and the operating condition. is there.

Example 3
The third example uses the acceleration sensors 15s and 16s provided in the wafer optical system 15 and the wafer ring 16 when the die D is picked up by the bonding head 35 or the pickup head 85 in the embodiments 10A and 10B. This is an example in which the pickup position detection time can be shortened.

  FIG. 6 is a diagram schematically showing a situation when the die D is picked up by the pickup head 85 in the embodiments 10A and 10B. The wafer unit optical system 15 indicates the position of the die D picked up by the pickup head 85. It is a figure which shows the state to detect. The pickup is performed by the bonding head 35 in the embodiment 10A and the pickup head 85 in the embodiment 10B, but basically the same operation. FIG. 6 shows an example of the pickup head 85 as a representative.

  The pickup device 12 includes a wafer unit 51, a push-up unit 52 that pushes up the die D of the wafer so that the collet 85c at the tip of the pickup head 85 can easily adsorb the die D, and a base 53 that fixes them. Have. The wafer unit 51 includes a wafer ring 16 that holds the wafer 14 and a rotation drive mechanism 16a that rotates the wafer ring 16 by θ on a plane parallel to a substrate such as a lead frame.

  The push-up unit 52 has a push-up mechanism (not shown) that moves up and down (moves in the Z direction) a push-up portion 54 a that pushes up the die D, and moves the piece 54 in the XY direction on the base 53. It has a Zθ drive unit 54c including a drive unit 54b, a Z drive unit that moves the piece 54 in the Z direction, and a θ rotation drive unit that rotates θ in a plane parallel to the substrate.

The pickup head 85 also includes a Z drive unit that moves in the Z direction and a θ rotation drive unit that rotates θ on a plane parallel to the substrate, similarly to the Zθ drive unit 54c. That is, the pickup head 85 and the piece 54 have three degrees of freedom in three directions of X, Y, and Z and four degrees of freedom of θ rotation, and the wafer unit 51 has the degree of freedom of θ rotation.
Further, the wafer optical system 15 has a drive shaft 15d (see FIG. 3) that moves in the X and Y directions in the same manner as the drive shaft 34d (see FIG. 5) of the bonding optical system 34.

  In such a configuration, in order for the wafer unit optical system 15 to detect the pickup position of the die Dp, first, the rotation drive device 16a rotates the wafer ring 16 and moves the die Dp to be picked up to a predetermined position. . Before and after this movement, the wafer part optical system 15 moves onto the pickup position by the drive shaft 15d, images the die Dp, and detects the accurate pickup position of the die Dp. In order to detect the pickup position of the die Dp accurately and quickly, the vibration levels (acceleration) of the wafer ring 16 and the wafer part optical system 15 are both within a predetermined range as in the second embodiment. When it falls within 70 G (output voltage value 560 mV or less / acceleration sensor detection range is ± 1.5 G), it is important to image with the wafer optical system 15. If the vibration level of either the wafer ring 16 or the wafer unit optical system 15 is not within a predetermined range, an image obtained from the wafer unit optical system 15 is detected with a predetermined position error or more.

  Thus, in the third embodiment, as in the second embodiment, when both the acceleration sensors 15s and 16s are within the predetermined vibration level range, unlike the conventional example, an image is acquired immediately. It can be detected in a short time.

  Further, even when the piece 54 moves back and forth with the rotation operation of the rotary drive device 16a, the vibration due to the movement of the piece 54 eventually becomes the vibration of the wafer ring 16, so that vibration is caused by the acceleration sensors 15s and 16s. What is necessary is just to detect and monitor. Of course, an acceleration sensor may be provided in the XY driving unit 54b of the piece 54.

  Therefore, in the third embodiment, similarly to the first embodiment, in the pickup position detection process by the wafer optical system 15, the processing time for at least a margin time can be shortened as an expected value. In addition, the pickup position can be accurately detected as in the second embodiment.

Example 4
In the fourth example, in the embodiments 10A and 10B, when the bonding head 35 or the pickup head 85 picks up the die D, the acceleration sensor 35s provided in the Zθ driving unit 54c of the bonding head 35 or the pickup head 85 and the piece 54 is used. Alternatively, the pickup processing time can be shortened by using 85s and 54s. Example 4 will also be described with reference to FIG.

  After the pickup position detection processing described in the third embodiment, the wafer unit optical system 15 moves to a position where it does not interfere with the pickup head 85, the pickup head 85 moves to the pickup position, and the die Dp at the pickup position in the Z direction. It descends to the position (height) just before (just above). When the pickup head 85 is lowered, the θ axis of the pickup head 85 is also driven in order to adjust the rotational deviation of the die Dp in the θ direction. Before and after these movements, the push-up portion 54b is raised until just before contacting the die Dp. Thereafter, the push-up portion 54b is further raised and brought into contact with the die Dp to push it up, and the die Dp is sucked and held by the collet 85c at the tip of the pickup head 85 to be picked up.

  In order to pick up the die Dp accurately and reliably by the pickup head 85, it is important that at least the vibration level of the pickup head 85 detected by the acceleration sensor 85s provided in the pickup head 85 is within a predetermined range. In particular, when the pickup head 85 and the push-up portion 54a are moved simultaneously, the pickup is performed after the vibration levels detected by the acceleration sensors 85s and 54s provided in the pickup head 85 and the Zθ drive portion 54c are both within a predetermined range. It is important to start the operation. If the vibration level of either the pickup head 85 or the push-up portion 54a is not within a predetermined range, the pickup position may be displaced, and the pickup may not be reliably performed.

  Therefore, when the pickup head 85 and the push-up portion 54a of the piece 54 are operated simultaneously, the vibration levels (acceleration) detected by the acceleration sensors 85s and 54s are both within a predetermined range, for example, an installed acceleration sensor. However, when the acceleration is within 0.50 G or less (output voltage 400 mV or less), unlike the conventional example, the lowering operation of the pickup head 85 and the pushing-up operation by the pushing-up portion 54c are immediately started to pick up the die Dp.

  That is, unlike the conventional example, when the pickup head 85 is moved forward and the push-up operation by the push-up portion 54a is performed without hindering the lowering operation to the position immediately before contacting the die Dp, and then the pickup head 85 is lowered, the acceleration sensor When the vibration level of the pickup head 85 detected by 85s falls within a predetermined range, the die Dp is picked up immediately.

  Therefore, in the fourth embodiment, similarly to the first embodiment, in the pickup process, the processing time corresponding to the margin time can be shortened as an expected value. Moreover, in the fourth embodiment, the die Dp can be reliably picked up by the pickup head 85.

(Example 5)
In the first to fourth embodiments described so far, the effects of shortening the processing time while maintaining the bonding accuracy in the independent operations such as the bonding process and the pickup process have been described. However, although each process cannot operate completely independently, for example, as shown below, another process is performed while a certain process is in operation, and vibration caused by each movement affects the entire die bonder. There may be a vibration interference state.

  The first example is a case where the substrate B is transferred by the frame feeder 22 during the process of picking up the die D from the wafer 14 in the die bonders 10A and 10B of the first and second embodiments. In that case, the vibration of the frame feeder 22 may affect the pickup processing of the second and third embodiments.

  In the second example, in the die bonder 10B according to the second embodiment, the bonding head 35 moves in the X and Y directions or the piece 54 moves in the X and Y directions during the bonding process shown in the first example. There is a case. In that case, the movement of the pickup head 85 and the piece 54 may affect the bonding process as shown in the first embodiment.

In the third example, in the die bonder 10B of the second embodiment, there is a case where the bonding head 85 moves in the X and Y directions during the pickup position detection or pickup processing shown in the third and fourth examples. In that case, the movement of the bonding head 35 may affect the pickup position detection or pickup processing shown in the third and fourth embodiments. In the above case, the acceleration sensor at the relevant location is also monitored and the processing is performed. In addition, the number of acceleration sensors to be monitored increases, and conventionally, it is necessary to increase the margin time accordingly.

  In the present invention, the greater the number of acceleration sensors mounted in the configuration related to the occurrence of vibration, the more accurate the identification of the vibration source, the prediction and monitoring of the vibration damping time, and each processing are required while maintaining the bonding accuracy. The effect of shortening time is increased.

Example 6
Further, in the example shown in the fifth embodiment, for example, the importance level of each process is set, the movement of the interfering process-related vibration source is delayed and learned so as not to overlap, the interfering process is reduced, By establishing a processing time chart as a whole, processing time can be shortened.

  In general, by monitoring all the acceleration sensors, it is possible to find a processing-related vibration source that interferes with a certain process.

  Therefore, based on the capability of each process, for example, the bonding head's moving speed, moving length, etc., it is possible to proceed with each process while searching for interfering processes without having to determine the time chart of each process in detail. A time chart for each process can be established. Initially, the processing time becomes longer, but as the processing proceeds, the processing time can be shortened as a whole, and the throughput can be improved. In addition, since the time for which the vibration is attenuated also changes due to the change of the driving situation, the processing time can be optimized according to the change of the driving situation and the throughput can be improved.

  As described above, the examples of the embodiment of the present invention have been described. However, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is described above without departing from the scope of the present invention. It encompasses various alternatives, modifications or variations.

1: Wafer supply unit 2: Workpiece supply / conveyance unit 3: Die bonding unit 10, 10A, 10B: Die bonder 12: Pickup device 14: Wafer 15: Wafer unit optical system 15s: Acceleration sensor of wafer unit optical system 16: Wafer ring 16s: Wafer ring acceleration sensor 22: Frame feeder 22s Frame feeder acceleration sensor 31: Preform part 32: Bonding head part 33: Preform optical system 33s: Reform optical system acceleration sensor 34: Bonding part optical system 34s: Bonding Optical sensor 35: Bonding head 35s: Bonding head acceleration sensor 36: Needle 36s: Needle acceleration sensor 38: Optical system 40: Control system 41: Control / arithmetic unit 42: Storage device 50: Z drive shaft 5 : Wafer unit 52: Push-up unit 54: Piece 54a: Push-up portion 54c: Zθ drive portion 54s: Zθ drive portion acceleration sensor 55; Y drive shaft 60: ZY drive shaft 80Y drive shaft 85: Pickup head 85s: Pickup head acceleration Sensor B: Substrate (lead frame) D: Die Dp: Die to be picked up

Claims (18)

A die bonder for picking up a die from a wafer and bonding the die to a work that has been conveyed,
A driven body that performs predetermined processing;
A drive unit for driving the driven body;
The driven body has a vibrometer for detecting the vibration of the driven body; and
Based on the detection result of vibration detected by the vibrometer, the control means for controlling the processing operation by the driven body,
Another vibrometer provided on another driven body that interferes with vibration generated by the processing operation of the driven body and detecting other vibration generated by the processing operation of the other driven body;
The pre-control means is configured such that when each of the vibration generated by the processing operation of the driven body and the other vibration generated by the processing operation of the other driven body is equal to or less than a predetermined value, the driven body or Starting the operation of the other driven body,
A die bonder characterized by that. The die bonder according to claim 1,
The driven body is a bonding head for mounting the die to the work,
The start of the processing operation is the start of an operation in which the bonding head stopped immediately before mounting the die on the workpiece is lowered to mount the die on the workpiece.
A die bonder characterized by that. The die bonder according to claim 1,
The driven body is a pickup head that picks up the die from a wafer;
The start of the processing operation is the start of an operation in which the pickup head stopped immediately before picking up the die from the wafer is lowered toward the die.
A die bonder characterized by that. The die bonder according to claim 1,
The driven body is a bonding head that picks up the die from an intermediate stage;
The start of the processing operation is the start of an operation in which the bonding head stopped immediately before picking up the die from the intermediate stage is lowered toward the die.
A die bonder characterized by that. The die bonder according to claim 1,
The driven body is an optical system that detects the position of the die or the workpiece,
The start of the processing operation is the start of an operation in which the optical system images the die or the workpiece.
A die bonder characterized by that. A die bonder for picking up a die from a wafer and bonding the die to a work that has been conveyed,
A driven body that performs predetermined processing;
A drive unit for driving the driven body;
The driven body has a vibrometer for detecting the vibration of the driven body; and
Based on the detection result of vibration detected by the vibrometer, the control means for controlling the processing operation by the driven body,
Each of the plurality of driven bodies has the vibrometer,
Based on the detection results of the plurality of vibrations generated by the processing operations of the plurality of driven bodies detected by the respective vibrometers, the control means is configured to prevent the plurality of vibrations from interfering with each other. Controlling the processing operation by two or more of the driven bodies;
A die bonder characterized by that. The die bonder according to claim 6,
The control means learns a pattern in which a plurality of vibrations occur so that the plurality of vibrations do not interfere with each other, creates a time chart of the processing operation of the plurality of driven bodies, and sets a plurality of times based on the time chart. Controlling the processing operation of the driven body of
A die bonder characterized by that. The die bonder according to claim 7, wherein
The control means starts the processing operation of the driven body when the vibration becomes a predetermined value or less.
A die bonder characterized by that. The die bonder according to claim 8, wherein
The driven body is a bonding head for mounting the die to the work,
The start of the processing operation is the start of an operation in which the bonding head stopped immediately before mounting the die on the workpiece is lowered to mount the die on the workpiece.
A die bonder characterized by that. A bonding method of picking up a die from a wafer and bonding the die to a conveyed work,
Driving the driven body by a driving unit, detecting vibration generated by driving the driven body , and controlling processing operation by the driven body based on the detected detection result of the vibration ;
Detecting other vibrations caused by operations of other driven bodies that interfere with vibrations caused by the processing operations of the driven bodies;
The start of the operation is performed when the vibration generated by the processing operation of the driven body and the other vibration generated by the processing operation of the other driven body are both equal to or lower than a predetermined value. Or start the operation of the other driven body,
A bonding method characterized by the above. The bonding method according to claim 10 , wherein
The driven body is a bonding head for mounting the die to the work,
The start of the processing operation is the start of an operation in which the bonding head stopped immediately before mounting the die on the workpiece is lowered to mount the die on the workpiece.
A bonding method characterized by the above. The bonding method according to claim 10 , wherein
The driven body is a pickup head that picks up the die from a wafer;
The start of the processing operation is the start of an operation in which the pickup head stopped immediately before picking up the die from the wafer is lowered toward the die.
A bonding method characterized by the above. The bonding method according to claim 10 , wherein
The driven body is a bonding head that picks up the die from an intermediate stage;
The start of the processing operation is the start of an operation in which the bonding head stopped immediately before picking up the die from the intermediate stage is lowered toward the die.
A bonding method characterized by the above. The bonding method according to claim 10 , wherein
The driven body is an optical system that detects the position of the die or the workpiece,
The start of the processing operation is the start of an operation in which the optical system images the die or the workpiece.
A bonding method characterized by the above. A bonding method of picking up a die from a wafer and bonding the die to a conveyed work ,
Driving the driven body by a driving unit, detecting vibration generated by driving the driven body, and controlling processing operation by the driven body based on the detected detection result of the vibration;
One or two or more of the vibrations generated by the processing operations of the plurality of driven bodies are detected, and based on the detection results of the plurality of vibrations, the plurality of vibrations do not interfere with each other. Controlling the processing operation by the driven body;
A bonding method characterized by the above. The bonding method according to claim 15 , wherein
The control learns a pattern in which a plurality of vibrations occur so that the plurality of vibrations do not interfere with each other, creates a time chart of the processing operation of the plurality of driven bodies, and generates a plurality of times based on the time chart. Controlling the processing operation of the driven body;
A bonding method characterized by the above. The bonding method according to claim 16, wherein
The control starts the processing operation of the driven body when the vibration becomes a predetermined value or less.
A bonding method characterized by the above. The bonding method according to claim 17,
The driven body is a bonding head for mounting the die to the work,
The start of the processing operation is the start of an operation in which the bonding head stopped immediately before mounting the die on the workpiece is lowered to mount the die on the workpiece.
A bonding method characterized by the above.

Images