KR102029020B1 - Die bonding apparatus and method of manufacturing semiconductor device - Google Patents

Abstract

An object of the present invention is to provide a motor control apparatus and a motor control method which can shorten a settling time by suppressing vibration and a deviation with respect to the advancing direction during operation.
The die bonding apparatus includes a motor for driving a driven object to output a real position as an encoded signal, and a motor control device for controlling the motor to control the driven object to a target position and mounting the die on a substrate. The motor control apparatus includes: an abnormal waveform generator for generating an ideal command waveform of acceleration acceleration value, acceleration, acceleration, speed, and position; and reading the ideal command waveform, the target command position and acceleration differential value, and acceleration And a command waveform generator for regenerating command waveforms of speed, acceleration, speed, and position, and outputting command waveforms of regenerated speed, and a DAC for converting command waveforms of the regenerated speed into analog data.

Description

DIE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

The present disclosure relates to a die bonding apparatus, and is applicable to, for example, a die bonding apparatus having a motor control apparatus.

A part of the manufacturing process of a semiconductor device includes a step of assembling a package by mounting a semiconductor chip (hereinafter simply referred to as die) on a wiring board or lead frame (hereinafter simply referred to as a substrate). There exist a process of dividing a die from a semiconductor wafer (henceforth a wafer hereafter), and the bonding process which mounts the dividing die on a board | substrate in a part. The manufacturing apparatus used for a bonding process is die bonding apparatuses, such as a die bonder.

A die bonder is a device which bonds (mounts and bonds) a die on a board | substrate or an already bonded die using solder, gold plating, and resin as a joining material. In the die bonder which bonds a die to the surface of a board | substrate, for example, it adsorbs and picks up a die from a wafer using an adsorption nozzle called a collet, conveys it on a board | substrate, gives a pressing force, and heats a bonding material. By doing this, the operation (work) of performing bonding is repeatedly performed. The collet is installed at the tip of the bonding head. The bonding head is driven by a drive unit (servo motor) such as a ZY drive shaft, and the servo motor is controlled by a motor control device.

In servo motor control, it is necessary to smoothly decelerate and move a workpiece | work so that a mechanical shock may not be given to a workpiece | work or the unit which supports a workpiece | work.

Japanese Patent Laid-Open No. 2012-175768

Although Patent Document 1 generates ideal command waveforms of acceleration, acceleration, speed, and position, and realizes low vibration motor control with command waveforms with limited acceleration, a semiconductor manufacturing apparatus such as a die bonding device has a higher precision. Motor control is required.

An object of the present disclosure is to provide a die bonding apparatus that further suppresses vibration.

Other objects and novel features will be apparent from the description and the accompanying drawings.

Brief descriptions of representative ones of the present disclosure will be given below.

That is, the die bonding apparatus is provided with a motor which drives a driven object and outputs a real position as an encoded signal, and the motor control apparatus which controls the said motor, controls the driven object to a target position, and mounts a die on a board | substrate. The motor control apparatus includes: an abnormal waveform generator for generating an ideal command waveform of acceleration acceleration value, acceleration, acceleration, speed, and position; and reading the ideal command waveform, the target command position and acceleration differential value, and acceleration And a command waveform generator for regenerating command waveforms of speed, acceleration, speed, and position, and outputting command waveforms of regenerated speed, and a DAC for converting command waveforms of the regenerated speed into analog data.

According to the die bonding apparatus, vibration can be reduced.

1 is a schematic top view showing the configuration of a die bonder according to an embodiment.
FIG. 2 is a diagram illustrating a schematic configuration and operation of the die bonder of FIG. 1.
3 is a block diagram illustrating a schematic configuration of a control system of the die bonder of FIG. 1.
4 is a block diagram illustrating a basic principle of the motor control apparatus of FIG. 3.
FIG. 5 is a diagram for describing a command waveform generated by the first waveform generator of FIG. 4.
6 is a diagram for explaining a moving average process.
7 is a diagram for explaining a moving average process.
8 is a diagram for explaining a moving average process.
9 is a diagram for explaining a moving average process.
10 is a diagram illustrating the shape of each command waveform when the moving average time is changed.
FIG. 11 is a diagram for describing an ideal command waveform generated by the second waveform generator of the abnormal waveform generator of FIG. 4.
FIG. 12 is a block diagram illustrating a configuration of the command controller of FIG. 4 and an input / output signal to the command waveform generator.
FIG. 13 is a block diagram illustrating the configuration of a command waveform input / output unit and a command waveform regeneration processing unit of FIG. 12.
FIG. 14 is a diagram for describing an acceleration differential value addition waveform generated by the acceleration differential value addition waveform generator of FIG. 13.
FIG. 15 is a diagram showing acceleration acceleration value waveforms, acceleration waveforms, acceleration waveforms, and velocity waveforms added for compensation when the deviation amounts are 1 pulse, 2 pulses, 4 pulses, 8 pulses and 16 pulses.
It is a figure for demonstrating the acceleration acceleration derivative value upper limit lower limit confirmation processing operation in the motor control apparatus which concerns on an Example.
17 is a diagram showing a regenerated command waveform after calculation of an acceleration acceleration differential value waveform for compensation in the motor control apparatus according to the embodiment.
18 is a flowchart for explaining the procedure of the motor control method according to the embodiment.
19 is a flowchart for explaining the procedure of the motor control method according to the embodiment.
20 is a flowchart for explaining a method for manufacturing a semiconductor device using the die bonding apparatus according to the embodiment.
21 is a block diagram showing the configuration of a command waveform input / output unit and a command waveform regeneration processing unit according to Modification Example 1. FIG.

In order to suppress the vibration, the inventors of the present invention have studied a control to suppress the amount of change per unit time by using the derivative value of the acceleration as a command value in addition to the ideal command waveforms of acceleration, acceleration, speed, and position. However, in order to generate the command waveforms as described above, it is necessary to further generate five kinds of ideal command waveforms including position, velocity, acceleration, acceleration, and derivative waveforms of acceleration and acceleration. Calculation time is needed.

The die bonding apparatus which concerns on embodiment produces | generates the command waveform of acceleration, and produces | generates each command waveform of acceleration, speed, and position sequentially from the command waveform of acceleration. A command waveform of the position after the moving average is generated by the moving average method (averaging a predetermined time and taking the average while shifting the range). Each command waveform after the moving average of the sequential speed, acceleration, acceleration, and acceleration derivative values is generated from the command waveform at the position after the moving average.

By controlling the motor by using the command waveform after the moving average obtained by the above, lower vibration motor driving can be realized.

In addition, since the entire command waveform length is extended by the moving average processing of the command waveform and the operation time becomes long, it is preferable to adjust the moving average time according to the requirements of the device such as cycle time and bonding accuracy. For example, in high precision bonding, a moving average time is set large, it operates smoothly, and it drives low vibration. In high-speed bonding, high speed driving is performed by setting the moving average time small and shortening the operation time.

According to the embodiment, it is possible to suppress the vibration and the deviation with respect to the advancing direction when the motor operates at a high speed, thereby realizing the reduction of the correction time. In addition, since the motor can be operated in the ideal trajectory and the current position can be monitored at all times, it becomes easy to operate in synchronization with a plurality of axes.

EMBODIMENT OF THE INVENTION Hereinafter, an Example and a modification are demonstrated using drawing. However, in the following description, the same code | symbol is attached | subjected to the same component, and description of repetition may be abbreviate | omitted. In addition, although drawing may be typically represented with respect to the width | variety, thickness, shape, etc. of each part compared with an actual form, in order to make description clearer, it is an example to the last and does not limit the interpretation of this invention. .

EXAMPLE

1 is a top view showing an outline of a die bonder according to an embodiment. FIG. 2 is a view for explaining the operation of the pickup head and the bonding head when viewed from the arrow A direction in FIG. 1.

The die bonder 10 is largely divided into a die supply unit 1, a pickup unit 2, an intermediate stage unit 3, a bonding unit 4, a transfer unit 5, and a substrate supply unit 6. The board | substrate carrying out part 7 and the control part 8 which monitor and control the operation | movement of each part are provided. The Y-axis direction is the front-rear direction of the die bonder 10, and the X-axis direction is the left-right direction. The die supply part 1 is arrange | positioned at the front side of the die bonder 10, and the bonding part 4 is arrange | positioned at the inner side.

First, the die supply part 1 supplies the die D mounted on the board | substrate P. As shown in FIG. The die supply part 1 has the wafer holder 12 which hold | maintains the wafer 11, and the pushing-up unit 13 shown by the dotted line which pushes the die | dye D from the wafer 11. As shown in FIG. The die supply part 1 moves to XY direction by the drive means which is not shown in figure, and moves the die | dye D which picks up to the position of the raising unit 13.

The pickup section 2 lifts, rotates, and rotates the pickup head 21 for picking up the die D, the Y driving section 23 of the pickup head for moving the pickup head 21 in the Y direction, and the collet 22. Each drive part which is not shown to move to an X direction is provided. The pickup head 21 has a collet 22 (see also FIG. 2) for adsorbing and holding the pushed up die D at the tip, picks up the die D from the die supply 1, and the intermediate stage 31. )). The pickup head 21 has each drive part which is not shown in the figure which raises, rotates, and moves X direction the collet 22. As shown in FIG.

The intermediate stage part 3 has an intermediate stage 31 which temporarily loads the die D, and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31.

The bonding part 4 picks up the die D from the intermediate stage 31 and bonds it on the board | substrate P which is conveyed, or bonds in the form which is laminated | stacked on the die already bonded on the board | substrate P. FIG. do. The bonding section 4, like the pickup head 21, has a bonding head 41 having a collet 42 (see FIG. 2) for adsorbing and holding the die D at its tip, and the bonding head 41 Y. The Y driving unit 43 moving in the direction, the Z driving unit (not shown) for raising and lowering (moving in the Z direction) the bonding head 41, and the position recognition mark (not shown) of the substrate P. And a substrate recognition camera 44 for recognizing the bonding position.

With such a configuration, the bonding head 41 corrects the pickup position and posture based on the imaging data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, and the substrate recognition camera ( The die D is bonded to the substrate P based on the imaging data of 44.

The conveyance part 5 is equipped with the board | substrate conveyance pallet 51 which loaded one or several board | substrate P (4 sheets in FIG. 1), and the pallet rail 52 which the board | substrate conveyance pallet 51 moves. And the 1st, 2nd conveyance part of the same structure provided in parallel. The board | substrate conveyance pallet 51 moves by driving the not-shown nut provided in the board | substrate conveyance pallet 51 with the ball screw which is not shown provided along the pallet rail 52. FIG.

By this structure, the board | substrate conveyance pallet 51 loads the board | substrate P in the board | substrate supply part 6, moves to the bonding position along the pallet rail 52, and after bonding, to the board | substrate carrying out part 7 is carried out. It moves and delivers the board | substrate P to the board | substrate carrying part 7. The 1st, 2nd conveyance part is driven independently from each other, and the other board | substrate conveyance pallet 51 is a board | substrate P, while bonding the die | dye D to the board | substrate P mounted in one board | substrate conveyance pallet 51. FIG. ) Is returned to the board | substrate supply part 6, and preparation, such as loading a new board | substrate P, is prepared.

The control system will be described with reference to FIG. 3. 3 is a block diagram illustrating a schematic configuration of a control system of the die bonder of FIG. 1. The control system 80 includes a control unit 8, a driving unit 86, a signal unit 87, and an optical system 88. The control unit 8 is largely divided into a control and a computing device 81 mainly composed of a CPU (Central Processor Unit), a storage device 82, an input / output device 83, a bus line 84, and a power supply unit. Has 85. The storage device 82 includes a main memory device 82a, which is composed of a RAM that stores processing programs, and an auxiliary storage device 82b, which is composed of an HDD that stores control data, image data, and the like necessary for control. Have The input / output device 83 includes a monitor 83a for displaying device status and information, a touch panel 83b for inputting an operator's instruction, a mouse 83c for operating the monitor, and an image from the optical system 88. It has an image introduction apparatus 83d which introduces data. In addition, the input / output device 83 controls the motor control device 83e that controls the driving unit 86 such as the XY table (not shown) of the die supply unit 1, the Y driving unit 43 of the bonding head table, the Z-axis driving unit, or the like. And an I / O signal control device 83f for introducing or controlling signals from signal sections 87 such as switches such as various sensor signals and lighting devices. The optical system 88 includes a wafer recognition camera 24, a stage recognition camera 32, and a substrate recognition camera 44. The control and computing device 81 introduces and calculates necessary data via the bus line 84 and sends information to the control of the pickup head 21 and the like, the monitor 83a and the like.

4 is a block diagram illustrating a basic principle of the motor control apparatus of FIG. 3. The motor control device 83e includes a motion controller 210 and a servo amplifier 220 to control the servo motor 130. The motion controller 210 includes an abnormal waveform generator 211 that performs an ideal command waveform generation process, a command waveform generator 212, and a digital to analog converter (DAC) 213. The servo amplifier 220 includes a speed loop control unit 221. The abnormal waveform generator 211 includes a first waveform generator 214, a moving average processor 215 and a second waveform generator 216 that perform moving average processing.

As shown in FIG. 4, in the motor control device 83e, the motion controller 210 and the servo amplifier 220 are closed loop controlled. Therefore, speed control is performed by the speed loop control unit 221 of the servo amplifier 220 using the current command position, the real position obtained from the servo motor 130, and the real speed. However, the speed loop control unit 221 controls the speed by regenerating the command waveform while the motion controller 210 obtains the actual speed and the actual position from the servo motor 130 and limits the acceleration acceleration derivative value and the acceleration speed. Doing. The abnormal waveform generator 211 and the command waveform generator 212 include, for example, a CPU (Central Processing Unit) and a memory for storing a program executed by the CPU.

For example, in FIG. 4, the target position, target speed, target acceleration, target acceleration and moving average time are given to the motion controller 210. The command waveform generation unit 212 is sequentially inputted as an encoder signal through the servo amplifier 220 or directly from the servo motor 130 as the encoder signal.

The first waveform generating unit 214 of the abnormal waveform generating unit 211 of the motion controller 210 receives the command (a) from the target values of the acceleration, acceleration, velocity, and position input from the control / operation device 81. Acceleration waveform (first command waveform of acceleration), (b) command acceleration waveform (first command waveform of acceleration), (c) command speed waveform (first command waveform of speed), (d) command position waveform ( The first command waveform of the position) is generated, respectively, and (d) The command position waveform is output to the moving average processor 215.

The moving average processing unit 215 performs a moving average processing of the command position waveform output from the first waveform generating unit 214, and (d ') the second waveform generating unit for the command position waveform (command waveform at an ideal position) after the moving average. Output to (216).

The second waveform generating unit 216 is a command speed waveform (ideal command speed waveform) after a moving average (c ') and a command acceleration waveform after a moving average (ideal acceleration) from a command waveform at (d') an ideal position. Command waveform), (a ') command acceleration waveform after moving average (ideal acceleration command waveform), and (e') command acceleration differential value waveform after ideal moving average (command waveform of ideal acceleration differential value) A command waveform generator 212 is generated and output to the command waveform generator 212. The term "ideal" is used in the sense of restricting the acceleration differentiation value, suppressing the vibration of the controlled object, and controlling the controlled object smoothly at a predetermined processing time.

The command waveform generation unit 212 includes an output signal waveform (current command position obtained from the command waveform of the ideal position) output from the second waveform generation unit 216 and an encoder signal (real position) input from the servo motor 130. On the basis of), the future command velocity waveform is sequentially regenerated and output to the DAC 213 sequentially while limiting the acceleration differential value. For example, the command waveform generation unit 212 performs (1) command waveform input / output processing, (2) encoder signal count processing, and (3) command waveform reproduction processing.

The DAC 213 converts the input digital command value into a speed command value of an analog signal and outputs it to the speed loop control unit 221 of the servo amplifier 220. In addition, the encoder signal is accumulated by using the position deviation amount as a pulse at an encoder signal counter (Fig. 13 to be described later).

The speed loop control unit 221 of the servo amplifier 220 controls the rotation speed of the servo motor 130 according to the speed command value input from the motion controller 210 and the encoder signal input from the servo motor 130. .

The servo motor 130 rotates at the rotational speed according to the control of the rotational speed input from the speed loop control unit 221 of the servo amplifier 220, and the speed of the servo amplifier 220 using the actual position and the actual speed as an encoder signal. Outputs to the command waveform generator 212 of the loop controller 221 and the motion controller 210.

In addition, in the embodiment of Fig. 4, the actual position of the driven body such as the bonding head is calculated from the count value (the number of rotations and the rotation angle) of the servo motor 130, and the actual speed is calculated based on the calculated actual position. have. However, a position detecting device that directly detects the position of the driven member may be provided so that the position detected by the position detecting device is a real position.

The abnormal waveform generator and the command waveform generator will be described in detail below. As described above, the abnormal waveform generator 211 is configured from the target acceleration acceleration Jobj, the target acceleration Aobj, the target velocity Vobj, and the target position Pobj, which are amplitude values of acceleration, acceleration, velocity, and position. Generate an ideal command waveform. The command waveform generation unit 212 performs command output processing and command waveform regeneration processing. At this time, the command waveform regeneration process is performed by adding the acceleration acceleration derivative value addition waveform to which the deviation amount is added to the command waveform (for example, the command waveform of the acceleration acceleration value).

First, the abnormal waveform generating unit will be described with reference to FIG. 5. FIG. 5 is a diagram for describing a command waveform generated by the first waveform generator of FIG. 4. 5A is a command acceleration waveform, FIG. 5B is a command acceleration waveform generated from the command acceleration waveform, FIG. 5C is a command acceleration waveform generated from the command acceleration waveform, and FIG. (d) is a command position generated from the command acceleration waveform. The command position is the position of the moving destination of the driven body. In addition, the horizontal axis is time.

The first waveform generator 214 generates the command acceleration waveform JDR from the target acceleration acceleration Jobj. A command acceleration waveform ADR is generated from the integration of the target acceleration Aobj and the command acceleration waveform JDR. The command speed waveform VDR is generated from the integration of the target speed Vobj and the command acceleration waveform ADR. The command position waveform PDR is generated from the integration of the target position Pobj and the command speed waveform VDR.

In Fig. 5A, n is the number of command output periods for outputting a command waveform of one pulse, and is a multiple of eight. As shown in FIG. 5, the motor driving the to-be-moved body is gradually accelerated in the first period T1 from the start of movement, at a constant speed in the period T2 in the center portion, and gradually in the period T3 approaching the final moving position. Acceleration is controlled to decelerate and stop.

In the present embodiment, the multiplier is 8, but the acceleration command value changes to a positive value, negative value, negative value, positive value when the target position is positive direction, or the acceleration command value when the target position is positive direction. The waveform may be changed to this positive value, negative value, or positive value. This is because, in the case where the target moving distance is short, the section in which the acceleration command value is zero disappears. Thus, n may be a multiple of 4, unless the part in which the acceleration becomes zero is formed in the acceleration waveform.

Next, prior to the description of the moving average processing unit, the procedure for obtaining the command speed waveform after the moving average with respect to the moving average method will be described using FIGS. 6 to 9 as an example. 6 to 9 are diagrams for explaining a procedure for obtaining a moving average of the command speed waveform.

The average of the m commands within the specified time period of the command waveform is the command value, n shifts are made, the average of the next m commands is set to the command value, and the n shift is made again, and the average of the next m commands is set to the command value. do. This is done for the entire command waveform, and the averaged command values are linked together to produce the final command waveform. 6 to 9 show examples of m = 8 and n = 1. As shown in Fig. 6, the eight command speeds VR1 of the command speed waveform before the moving average are averaged, and the speed command value VA1 after the moving average is calculated. Subsequently, as shown in FIG. 7, the eight command speeds VR2 of the command speed waveform before the moving average are averaged by one shift, and the speed command value VA2 after the moving average is calculated. Subsequently, as shown in FIG. 8, 8 command speeds VR3 of the command speed waveform before a moving average are shifted | shifted and averaged, and the speed command value VA3 after a moving average is computed. This is done in the entire command speed waveform VR, and the averaged speed command values are connected to each other to generate the final command speed waveform VA.

The relationship between the moving average time and the command waveform shape will be described with reference to FIG. 10. 10 is a diagram illustrating the shape of each command waveform when the moving average time is changed.

Since the entire command waveform length is extended by the moving average processing of the command waveforms, and the operation time becomes longer, the longer the specified time (moving average time) becomes (the larger m), the longer the operation time becomes.

As the moving average time increases, each command waveform becomes dull. On the other hand, when the moving average time is 0 seconds, since the acceleration differential value is infinity, it is not shown and the acceleration differential waveform cannot be obtained. The moving average time can be set according to the bonding accuracy or the cycle time required for the die bonder, for example.

The moving average processing unit 215 takes the command position waveform (command waveform of the position) generated by the first waveform generating unit 214 as described above with a moving average method (determining a predetermined time and taking an average while shifting the range). The moving average processing is performed to generate a command position waveform (command waveform of an ideal position) after the moving average.

Next, the second waveform generating unit will be described with reference to FIG. 11. 11 is a diagram for describing a command waveform generated by the second waveform generator. The second waveform generator 216 differentiates the command position waveform after the moving average (command waveform PD at the ideal position) generated by the moving average processing unit 215, thereby generating the command velocity waveform after the moving average (command waveform at the ideal speed). (VD)]. By differentiating the command velocity waveform VD, a command acceleration waveform (command waveform AD of ideal acceleration) after the moving average is generated. By differentiating the command acceleration waveform AD, a command acceleration waveform (ideal acceleration command waveform JD of ideal acceleration) after the moving average is generated. By differentiating the command acceleration waveform JD, an acceleration acceleration differential value waveform (a command waveform ΔJD of an ideal acceleration differential value) after the moving average is generated.

In Fig. 11E, n is the number of command output periods for outputting a command waveform of one pulse, and is a multiple of 16. As shown in FIG. 11, the motor which drives a to-be-moved body accelerates gradually in the initial period T1 from the start of a movement, at a constant speed in the period T2 of a center part, and gradually in the period T3 approaching a final moving position. Acceleration derivative is controlled to decelerate and stop.

In the present embodiment, a multiple of 16 is used. However, when the target position is in the forward direction, the command value of the acceleration differential value is changed into a positive value, negative value, negative value, positive value, negative value, positive value, positive value, negative value and negative value. When the waveform or the target position is in the forward direction, it may be a waveform in which the command value of the acceleration differential value is changed into a positive value, negative value, positive value, negative value, positive value, and negative value. This is because, in the case where the target moving distance is short, the section in which the command value of the acceleration differential value is 0 disappears. Thus, n may be made a multiple of 8, unless a part in which the acceleration differential value is zero is formed in the acceleration differential value waveform.

Next, the command waveform generation unit will be described with reference to FIGS. 12 to 17. 12 is a block diagram illustrating a configuration of a command waveform generator of FIG. 4 and an input / output signal to the command waveform generator. FIG. 13 is a control block diagram of a command waveform input / output unit and a command waveform regeneration processor of FIG. 12. It is a figure for demonstrating the acceleration differential value addition waveform. FIG. 15 is a diagram showing acceleration acceleration value waveforms, acceleration waveforms, acceleration waveforms, and velocity waveforms added for compensation when the deviation amounts are 1 pulse, 2 pulses, 4 pulses, 8 pulses and 16 pulses. It is a figure for demonstrating the acceleration upper limit lower limit confirmation processing operation. Fig. 17 is a diagram showing an example of a regenerated command waveform after calculation of an acceleration acceleration differential value waveform for compensation. The horizontal axis represents time and the vertical axis represents pulse height, respectively.

As shown in FIG. 12, the command waveform generator 212 includes a command waveform input / output unit 410, a command waveform regeneration processor 420, and an encoder signal counter 430.

Subsequently, in FIG. 13, the second waveform generation unit 216 of the motion controller 210 includes the command acceleration differential value waveform ΔJD, the command acceleration waveform JD, the command acceleration waveform AD, and the command speed waveform. The pulses of the VD and the command position waveform PD are outputted to the command waveform input / output unit 410 of the command waveform generator 212.

The command waveform input / output unit 410 further includes command acceleration differential value waveforms ΔJD ′ ₁ to ΔJD ′ _n , command acceleration waveforms JD ′ ₁ to JD ′ _n , which are regenerated at a previous command output timing. Of the command waveforms regenerated at the previous command output timing, the command acceleration waveforms AD ' ₀ to AD' _n , the command speed waveforms VD ' ₀ to VD' _n , and the command position waveform PD from one time before the command output cycle. ' ₀ to PD' _n ) are stored. The command waveform input / output unit 410 is provided to the subtractor 421 and the adders 423 to 427 of the command waveform regeneration processing unit 420 of the command waveform generation unit 212 to the target command position PD ' ₀ and the previous timing, respectively. Command acceleration waveforms (ΔJD ' ₁ to ΔJD' _n ), command acceleration waveforms (JD ' ₁ to JD' _n ), and command acceleration waveforms (AD ' ₀ to 1) before the command output cycle regenerated at AD ' _{n -1} ), command speed waveforms VD' ₀ to VD ' _{n -1} from one command output period ago and command position waveforms PD' ₀ to PD ' _n- from one command output period ago ₁ )

At this time, the encoder signal counter 430 of the command waveform generating unit 212 acquires the current actual position PA ₀ from the encoder count value of the servo motor 130, and the subtractor 421. Output to.

The subtractor 421 subtracts the current actual position PA ₀ from the current target command position PD ' ₀ , calculates a deviation Perr, and outputs it to the acceleration derivative value addition waveform generator 422.

As shown in Fig. 14, the acceleration differential value addition waveform generation unit 422 has a deviation amount Perr in the future with n commands within the sampling interval TS, that is, the command output period TC. Generate an acceleration differential value waveform ΔC ₁ to ΔC _n . In Fig. 14, K is pulse width, ΔJC is pulse height, n (natural number) is the number of instructions in the sampling interval TS, and x (natural number) is the instruction position of n number of instructions (pulse number (1≤x)). ≤ n)].

For example, the acceleration differential value waveforms ΔC ₁ to ΔC _n are generated in the following procedures (1) to (3). In addition, in the following, the position deviation target compensation amount is P (use Perr as P as it is), the command output period is TC, the deviation amount compensation target time is TN, and the deviation amount compensation target command output period is n times, and the acceleration is The width of the derivative waveform is K and the magnitude of the acceleration derivative value addition waveform is ΔJC.

{Step (1)}

First, the width K of the acceleration differential value waveform is calculated as follows.

From TN> (TC × n), n is a multiple of 16 to fix the shape of the acceleration differential value addition waveform.

That is, TN> (TC × 16 × K), and the width K of the acceleration derivative value waveform is

Let K <(TN / (TC × 16)).

{Procedure (2)}

Next, the magnitude (ΔJC) of the acceleration differential value addition waveform is calculated from the following equation.

ΔJC = (1/16) × (P / K ³ × TC ³ )

{Step (3)}

Next, the acceleration differential value addition waveforms ΔC ₁ to ΔC _n are generated.

The acceleration acceleration derivative value addition waveforms ΔC ₁ to ΔC _n for compensating for the deviation amount are as follows. Here, x means the x-th waveform of 1 to n.

ΔC _x = ΔJC when x / K ≦ 1

ΔC _x = 0 when x / K≤2

ΔC _x = −ΔJC when x / K ≦ 3

ΔC _x = 0 when x / K ≦ 4

ΔC _x = −ΔJC when x / K ≦ 5

ΔC _x = 0 when x / K ≦ 6

ΔC _x = ΔJC when x / K ≦ 7

ΔC _x = 0 when x / K ≦ 8

ΔC _x = −ΔJC when x / K ≦ 9

ΔC _x = 0 when x / K ≦ 10

ΔC _x = ΔJC when x / K ≦ 11

ΔC _x = 0 when x / K≤12

ΔC _x = −ΔJC when x / K ≦ 13

ΔC _x = 0 when x / K ≦ 14

ΔC _x = −ΔJC when x / K ≦ 15

ΔC _x = 0 when x / K ≦ 16

For example, when K = 1, the acceleration differential value addition waveforms ΔC ₁ to ΔC _n are as follows.

ΔC ₁ to ΔC _n = {ΔJC, 0, -ΔJC, 0, -ΔJC, 0, ΔJC, 0, -ΔJC, 0, ΔJC, 0, ΔJC, 0, -ΔJC, 0}

That is, ΔC ₁ = ΔJC, ΔC ₂ = 0, ΔC ₃ = -ΔJC, ΔC ₄ = 0, ΔC ₅ = -ΔJC, ΔC ₆ = 0, ΔC ₇ ΔJC, ΔC ₈ = 0, ΔC ₉ ΔΔC a _{ΔC 10 = 0, ΔC 11 =} ΔJC, ΔC 12 = 0, ΔC 13 = ΔJC, ΔC 14 = 0, ΔC 15 = -ΔJC, ΔC 16 = 0.

As shown in Fig. 15, the larger the deviation amount P, the larger the height ΔJC of the acceleration differential value waveform for compensating the deviation P.

In FIG. 13, the acceleration differential value addition waveform generation unit 422 outputs the acceleration differential value addition waveforms ΔC ₁ to ΔC _n to the adder 423. The adder 423 adds the acceleration acceleration value addition waveforms ΔC ₁ to ΔC _n and the command acceleration acceleration value waveforms ΔJD ' ₁ to ΔJD' _n generated at the previous command output timing, and the command output period n All command acceleration differential value waveforms JD " ₁ to JD" _n of the batch are regenerated and output to the acceleration differential value limiting unit 428 and the adder 424.

For example, the output of the adder 423 is _{ΔJD "1 = ΔJD '1 +} ΔC 1, ΔJD" 2 = ΔJD' 2 + ΔC 2, ΔJD "3 = ΔJD '3 + ΔC 3, to, ΔJD" _n = ΔJD' _n + ΔC _n .

The adder 424 adds the regenerated command acceleration differential value waveforms ΔJD ″ ₁ to ΔJD ″ _n and the command acceleration waveforms JD ′ ₁ to JD ′ _n generated at the previous command output timing, and outputs a command. All command acceleration waveforms JD " ₁ to JD" _{n for a} period n times are regenerated and output to the acceleration differential value limiting unit 428 and the adder 425.

For example, the output of the adder 424 _{JD "1 = JD '1 +} ΔJD' 1, JD" 2 = JD '2 + ΔJD' 2, JD "3 = JD '3 + ΔJD' 3, to, JD" _n = It is the JD _'n + ΔJD' _n.

The adder 425 is a command acceleration waveform AD ' ₀ to AD' _{n - 1} from the regenerated command acceleration waveforms JD " ₁ to JD" _n and one time before the command output period generated at the previous command output timing. ) Are added, and all command acceleration waveforms AD " ₁ to AD" _{n for the} command output period n times are regenerated and output to the adder 426 and the acceleration derivative value limiting unit 428.

For example, the output of the adder 425 is AD " ₁ = AD ' ₀ + JD" ₁ , AD " ₂ = AD' ₁ + JD" ₂ , AD " ₃ = AD ' ₂ + JD" ₃ , to AD " _n = AD ' _(n-1) + JD " _n .

The adder 426 includes the regenerated command acceleration waveforms AD ″ ₁ to AD ″ _n and the command speed waveforms VD ' ₀ to VD' _{n - 1} from one previous command output cycle generated at the previous command output timing. Is added, and all command acceleration waveforms VD " ₁ to VD" _{n for} n command output cycles are reproduced and output to the adder 427 and the acceleration differential value limiting unit 428.

For example, the output of the adder 426 is _{VD "1 = VD '0 +} AD" 1, VD "2 = VD' 1 + AD" 2, VD "3 = VD '2 + AD" 3, to, VD _"n = VD ' _(n-1) + AD " _n .

The adder 427 includes the regenerated command speed waveforms VD " ₁ to VD" _n and the command position waveforms PD ' ₀ to PD' _n-1 from one previous command output period generated at the previous command output timing. Is added, and all command position waveforms PD " ₁ to PD" _{n for a} command output period n times are regenerated and output to the acceleration differential value limiting unit 428.

For example, the output of the adder 427 is PD " ₁ = PD ' ₀ + VD" ₁ , PD " ₂ = PD' ₁ + VD" ₂ , PD " ₃ = PD ' ₂ + VD" ₃ , to PD " _n = PD ' _(n-1) + VD " _n .

In addition, the command waveform regeneration processing unit 420 checks whether each command waveform obtained by the adders 423 to 427 is within a range.

The acceleration differential value limiting unit 428 checks using FIG. 16 whether the regenerated command acceleration differential value waveforms ΔJD ″ ₁ to ΔJD ″ _n did not exceed the upper limit (or lower limit). In FIG. 16, the upper limit of acceleration differential value (DELTA) Jmax and the lower limit of acceleration differential value (-ΔJmax) are predetermined.

In FIG. 16, the adder 423 adds the acceleration acceleration differential value addition waveform in the broken line source 701 to the command acceleration differential value waveforms ΔJD ' ₁ to ΔJD' _n generated at the previous command output timing. have. That is, the addition waveform pulses ΔC ₁ , ΔC ₂ , ΔC ₃ , ΔC ₄ , ΔC ₅ , ΔC ₆ , ΔC ₇ and ΔC ₈ are added to the acceleration differential value waveform represented by the thick line (command acceleration differential value). Waveform ΔJD ″ ₁ to ΔJD ″ _n ]. If correction is made at the timing of the previous correction, and correction is made again, there is a possibility that the pulse waveform may fall below the acceleration acceleration derivative lower limit value (-ΔJmax).

In this case, the acceleration derivative value limiting unit 428 has the pulse waveforms ΔC ₁ , ΔC ₂ , ΔC ₃ , ΔC ₄ , ΔC ₅ , ΔC ₆ , ΔC ₇ and ΔC ₈ at the present time with the upper limit ΔJmax. It detects whether it is between the lower limits (-ΔJmax) (OK) or not (NG), determines whether it is OK or NG, and branches the output. For example, at the current time, it is detected whether the waveform ΔC ₂ is less than the upper limit ΔJmax (ΔJD ″ ₁ to ΔJD ″ _n <ΔJmax). If not, the NG information is outputted to the command waveform recovery unit 42C. If it is OK, it is detected whether or not the waveform ΔC ₂ at the present time exceeds the lower limit ΔJmax (−ΔJmax <ΔJD ″ ₁ to ΔJD ″ _n ). If not, the NG information is outputted to the command waveform recovery unit 42C. If OK is also OK, the command acceleration differential value waveforms ΔJD ″ ₁ to ΔJD ″ _n , the command acceleration waveforms JD ″ ₁ to JD ″ _n , and the command acceleration waveforms AD ″ ₁ to the acceleration acceleration limiting unit 429. AD ″ _n ), command velocity waveforms VD ″ ₁ to VD ″ _n and command position waveforms PD ″ ₁ to PD ″ _n are outputted.

13, the acceleration limiting unit 429 detects whether the acceleration waveform at the current time is less than the upper limit Jmax, similarly to the acceleration differential value limiting unit 428 (JD " ₁ to ₁₎ . JD " _n <Jmax). If NO, the NG information is output to the command waveform recovery unit 42C. If OK is also present, it is detected whether or not the waveform at the current time exceeds the lower limit Jmax (-Jmax &_lt; JD " ₁ to JD " _n ). If not, the NG information is outputted to the command waveform recovery unit 42C. If OK is also OK, the command acceleration differential derivative waveforms ΔJD ″ ₁ to ΔJD ″ _n , the command acceleration waveforms JD ″ ₁ to JD ″ _n , and the command acceleration waveforms AD ″ ₁ to AD are applied to the acceleration limiting unit 42A. " _n ), command speed waveforms VD" ₁ to VD " _n ) and command position waveforms PD" ₁ to PD " _n ) are output.

In FIG. 13, the acceleration limiting unit 42A detects whether the acceleration waveform at the present time is less than the upper limit Amax, similarly to the acceleration differential value limiting unit 428 (AD ″ ₁ to AD). " _n <Amax). If not, the NG information is outputted to the command waveform recovery unit 42C. If it is OK, it is detected whether or not the waveform at the current time is more than the lower limit Amax (-Amax &_lt; AD &quot; ₁ to AD " _n ). If not, the NG information is outputted to the command waveform recovery unit 42C. If OK, the command acceleration acceleration derivative waveforms ΔJD ″ ₁ to ΔJD ″ _n , the command acceleration waveforms JD ″ ₁ to JD ″ _n , and the command acceleration waveforms AD ″ ₁ to AD are supplied to the speed limiter 42B. " _n ), command speed waveforms VD" ₁ to VD " _n ) and command position waveforms PD" ₁ to PD " _n ) are output.

13, the speed limiting section 42B detects whether or not the speed waveform at the present time is less than the upper limit Vmax, similarly to the acceleration acceleration differential value limiting section 428 (VD " ₁ to VD"). _n <Vmax). If not, the NG information is outputted to the command waveform recovery unit 42C. If it is OK, it is detected whether or not the waveform at the current time exceeds the lower limit Vmax (-Vmax &_lt; VD " ₁ to VD " _n ). If not, the NG information is outputted to the command waveform recovery unit 42C. If OK, the command waveform input / output unit 410 sends the command acceleration differential value waveforms ΔJD ″ ₁ to ΔJD ″ _n , the command acceleration waveforms JD ″ ₁ to JD ″ _n , and the command acceleration waveforms AD ″ ₁ to ˜. AD ″ _n ), command velocity waveforms VD ″ ₁ to VD ″ _n and command position waveforms PD ″ ₁ to PD ″ _n are outputted.

The command waveform reconstructing unit 42C has inputted NG information from any of the acceleration differential value limiting unit 428, the acceleration limiting unit 429, the acceleration limiting unit 42A, or the speed limiting unit 42B. In this case, the command waveform at the time of the previous command output is restored, and the correction of the total deviation amount is delayed until the next command output (upper and lower limit confirmation processing). That is, the command waveform at the time of restoring the previous command output is output to the command waveform input / output unit 410.

Subsequently, in FIG. 13, ΔJD ″ ₁ to ΔJD ″ _n , JD ″ ₁ to JD ″ _n , AD ″ ₁ to AD ″ _n , VD ″ ₁ to VD ″ _n, and PD ″ ₁ to PD of the regenerated command waveform. " _n is saved as a new command waveform.

Speed of Command Waveforms Command values VD ″ ₁ to VD ″ _n are sequentially output from the command waveform input / output unit 410 to the DAC 213 as shown in FIG. 12, and the DAC 213 is the speed of analog conversion in sequence. The command value is output to the servo amplifier 220.

In Fig. 12, the DAC 213 converts the input speed command value VD " ₁ into an analog value and outputs it to the servo amplifier 220. The servo amplifier 220 according to the input analog data, the servo motor ( 130 is rotated and outputted to the command waveform generation unit 212 using the rotational position (and rotational speed) of the servo motor 130 as an encoder signal.

The encoder signal output from the servo motor 130 is input to the encoder signal counter 430 of the command waveform generator 212.

The encoder signal counter 430 outputs the count value PA ₀ counted in a predetermined cycle to the command waveform regeneration processor 420.

In the command waveform regeneration processor 420, the subtractor 421 inputs the count value PA ₀ output from the encoder signal counter 430 to the subtraction input terminal.

The servo amplifier 220 controls the servo motor 130 according to the input speed command value VD ″ ₁ .

17 shows how all the command waveforms are regenerated. The thin solid line is the waveform before compensation, respectively, and the servo motor 130 is controlled by the waveform shown by the bold solid line during the period in which the acceleration acceleration differential value waveform for compensation is added to the command acceleration differential value from the present time.

As a result, when the servo motor 130 rotates and the motor rotates at high speed, the servo motor 130 rotates, and the vibration and the deviation in the advancing direction of the driven body can be suppressed to shorten the settling time. In addition, since the motor can be operated in the ideal trajectory and the current position can be monitored at all times, it becomes easy to operate in synchronization with a plurality of axes.

In addition, in FIG. 17, it appears that the real position waveform has shifted from the front of the present time. This represents a deviation (position deviation) up to the current time with respect to the waveform of the command. In practice, since the correction is continuously performed at very short command output periods, there is no significant deviation as shown in FIG. In FIG. 17, the actual position of the present time is set to a position slightly shifted from the command waveform in order to emphasize the state in which the position is corrected.

Next, the motor control method will be described with reference to FIGS. 18 and 19. 18 and 19 are flowcharts for explaining a procedure of an example of the operation of the motor control method. 18 and 19, the command acceleration differential waveform JD ", the command acceleration waveform JD", the command acceleration waveform AD ", the command speed waveform VD", and the command position at the command output period timing. The procedure for creating the waveform PD "will be described.

In step S601, the current actual position PA ₀ is obtained from the encoder count value.

In step S602, the deviation amount Perr is calculated from the actual position PA ₀ and the current command position PD ' ₀ .

In step S603, the acceleration acceleration derivative value addition waveforms DELTA C ₁ to DELTA C _n are generated in the command output period n times in which the deviation amount Perr becomes "0" in the future.

In step S604, the acceleration acceleration value addition waveforms ΔC ₁ to ΔC _n are added to the command acceleration differential value waveforms ΔJD ' ₁ to ΔJD' _n , and all command acceleration differential value waveforms for the command output period n times ( ΔJD ″ ₁ to ΔJD ″ _n ) are regenerated.

In step S605, the regenerated command acceleration differential value waveforms ΔJD ″ ₁ to ΔJD ″ _n are added to the command acceleration waveforms JD ' ₁ to JD' _n , and all command acceleration waveforms for the command output period n times ( JD ″ ₁ to JD ″ _n ) is regenerated.

In step S606, all of the command output period n times from the command acceleration waveforms AD ' ₀ to AD' _{n - 1} and the regenerated command acceleration waveforms JD " ₁ to JD" _n from one command output period one time ago. The command acceleration waveforms AD ″ ₁ to AD ″ _n are regenerated.

In step S607, the command speed waveforms VD " ₁ to VD" _n are regenerated in the same manner as the regeneration (step S606) of the command acceleration waveforms AD " ₁ to AD" _n .

In step S608, the command position waveform PD is operated in the same manner as the regeneration of the command acceleration waveforms AD ″ ₁ to AD ″ _n (step S606) or the regeneration of the command speed waveforms VD ″ ₁ to VD ″ _n (step S607). " ₁ to PD" _n ) is regenerated.

In step S609, it is checked whether the regenerated acceleration differential value waveforms ΔJD ″ ₁ to ΔJD ″ _n are less than the upper limit ΔJmax. If the upper limit ΔJmax is exceeded, the process proceeds to step S614, and if it is less than the upper limit, the process proceeds to step S610.

In step S610, it is checked whether the regenerated acceleration waveforms JD " ₁ to JD" _n are less than the upper limit Jmax. If the upper limit Jmax is exceeded, the process proceeds to step S614. If the upper limit Jmax is exceeded, the process proceeds to step S611.

In step S611, it is checked whether the regenerated acceleration waveforms AD " ₁ to AD" _n are less than the upper limit Amax. If the upper limit Amax is exceeded, the process proceeds to step S614. If the upper limit Amax is exceeded, the process proceeds to step S612.

In step S612, it is checked whether the regenerated velocity waveforms VD " ₁ to VD" _n are less than the upper limit Vmax. If the upper limit Vmax is exceeded, the process proceeds to step S614. If the upper limit Vmax is exceeded, the process proceeds to step S613.

In step S613, the regenerated command acceleration differential value waveforms ΔJD ″ ₁ to ΔJD ″ _n , command acceleration waveforms JD ″ ₁ to JD ″ _n , command acceleration waveforms AD ″ ₁ to AD ″ _n , and command speed The waveforms VD ″ ₁ to VD ″ _n and the command position waveforms PD ″ ₁ to PD ″ _n are stored as new command waveforms.

In step S615, the next speed command values VD " ₁ to VD" _n are outputted from the DAC 312, the processing of Figs. 17 and 18 ends, and the operation shifts to the next command output cycle timing.

In step S614, the regeneration command waveform is restored from the previous command waveform, and the process proceeds to step S615. That is, as the command acceleration differential value waveforms ΔJD ″ ₁ to ΔJD ″ _n , the previous command acceleration differential value waveforms ΔJD ′ ₁ to ΔJD ′ _n are used. As the command acceleration waveforms JD " ₁ to JD" _n , the previous command acceleration waveforms JD ' ₁ to JD' _n are used. As the command acceleration waveforms AD ″ ₁ to AD ″ _n , the previous command acceleration waveforms AD ′ ₁ to AD ′ _n are used. As the command speed waveforms VD ″ ₁ to VD ″ _n , the previous command speed waveforms VD ′ ₁ to VD ′ _n are also used. As the command position waveforms PD " ₁ to PD" _n , the previous command position waveforms PD ' ₁ to PD' _n are used.

Next, the manufacturing method of the semiconductor device using the die bonder which concerns on an Example is demonstrated using FIG. 20 is a flowchart illustrating a method of manufacturing a semiconductor device.

Step S11: The wafer ring 14 holding the dicing tape 16 with the die D divided from the wafer 11 is stored in a wafer cassette (not shown) and loaded into the die bonder 10. do. The control part 8 supplies the wafer ring 14 to the die supply part 1 from the wafer cassette in which the wafer ring 14 was filled. Moreover, the board | substrate P is prepared and carried in the die bonder 10. FIG. The control part 8 loads the board | substrate P in the board | substrate conveyance pallet 51 in the board | substrate supply part 6.

Step S12: The control unit 8 picks up the divided die from the wafer.

Step S13: The control unit 8 stacks the picked-up die on the substrate P, which is mounted or already bonded. The controller 8 loads the die D picked up from the wafer 11 into the intermediate stage 31, picks up the die D again from the intermediate stage 31 by the bonding head 41, and is transported. Bonding to on-substrate P is carried out.

Step S14: The control unit 8 takes out the substrate P on which the die D is bonded from the substrate transport pallet 51 in the substrate transport unit 7. The substrate P is taken out from the die bonder 10.

<Variation example>

Hereafter, some typical modified examples are illustrated. In the following description of the modifications, the same reference numerals as those in the above-described embodiments may be used for the parts having the same configurations and functions as those described in the above-described embodiments. As for the description of these parts, the description in the above-described embodiments can be appropriately used within the scope that does not contradict technically. In addition, all or a part of some of the above-described embodiments and a plurality of modifications may be appropriately combined in a range not technically contradictory.

(Modification 1)

21 is a block diagram showing the configuration of a command waveform input / output unit and a command waveform regeneration processing unit according to Modification Example 1. FIG.

In the above embodiment, the command waveform restoring unit 42C restores the previous command waveform, but as shown in FIG. 21, in the modification 1, the command waveform regenerating processing unit 420 outputs NG information, and the command waveform input / output unit ( The 410 may restore the last command waveform stored as the current command waveform in accordance with the NG information.

(Modification 2)

Although the rotating motor (servo motor) was demonstrated in the Example, it is applicable also to linear motors other than a rotating motor. Specifically, in FIG. 4, the servo motor 130 is replaced with a linear motor (hereinafter referred to as a motor control device according to modified example 2). The speed loop control unit 221 of the servo amplifier 220 controls the moving speed of the linear motor according to the speed command value input from the motion controller 210 and the encoder signal input from the linear motor.

The linear motor moves at the moving speed according to the control of the moving speed input from the speed loop control unit 221 of the servo amplifier 220, and uses the real position and the real speed as encoder signals to control the speed loop control unit of the servo amplifier 220 ( 221 and a command waveform generator 212 of the motion controller 210.

In the motor control apparatus according to the second modification, the actual position of the driven body is calculated from the count value of the linear motor, and the actual speed is calculated based on the calculated actual position. However, a position detection device for directly detecting the position of the driven member may be provided, and the position detected by the position detection device may be set to the actual position.

For example, in the motor control apparatus according to the modification 2, the DAC 213 converts the input speed command value VD ″ ₁ into an analog value and outputs it to the servo amplifier 220. The servo amplifier 220 Drives the linear motor in accordance with the input analog data, and outputs the linear motor to the command waveform generation unit 212 using the linear motor's moving position (and moving speed) as an encoder signal.

The encoder signal output from the linear motor is input to the encoder signal counter 430 of the command waveform generator 212.

The encoder signal counter 430 outputs the count value PA ₀ counted in a predetermined cycle to the command waveform regeneration processor 420.

In the command waveform regeneration processor 420, the subtractor 421 inputs the count value PA ₀ output from the encoder signal counter 430 to the subtraction input terminal. All command waveforms are regenerated as in FIG. 17.

As a result, when the linear motor moves, and the linear motor moves at high speed by the movement, the vibration and the deviation with respect to the advancing direction of the driven body can be suppressed, and the settling time can be shortened. In addition, since the linear motor can be operated in the ideal trajectory and the current position can be monitored at all times, it becomes easy to operate in synchronization with a plurality of axes.

In addition, it is possible to apply to the overall motor, such as a motor having an encoder counter function.

As mentioned above, although the invention made by this inventor was concretely demonstrated based on embodiment, Example, and a modification, this invention is not limited to the said embodiment, Example, and modification, Of course, it can change variously. .

For example, in the embodiment, the command waveform input / output unit outputs the speed command value to control the motor. However, the motor may be controlled by outputting the acceleration command value instead of the speed command value. As a result, not only the position control but also the load control becomes possible.

In addition, although the pick-up head and the bonding head are each provided in the Example, two or more may be sufficient, respectively. In addition, although the intermediate stage is provided in the Example, it is not necessary to have an intermediate stage. In this case, the pickup head and the bonding head may be combined.

In addition, in the embodiment, the surface of the die is bonded upward, but after picking up the die, the front and rear surfaces of the die may be reversed, and the back of the die may be bonded upward. In this case, the intermediate stage does not need to be installed. This device is called flip chip bonder.

130: servo motor
83e: Motor Control Unit
210: motion controller
211: abnormal waveform generator
212 command waveform generator
213: DAC
220: servo amplifier
221 speed loop control unit
410: command waveform input and output unit
420: command waveform regeneration processing unit
421: Subtractor
422: acceleration differential value addition waveform generation unit
423 to 427: adder
428: acceleration differential value limiting unit
429: acceleration limit
42A: acceleration limit
42B: Speed Limit
42C: command waveform recovery unit
430: Encoder Signal Counter

Claims (11)

A motor for driving the driven member to output the actual position as an encoder signal;
A motor control device for controlling the motor to control the driven object to a target position and mounting a die on a substrate;
The motor control device,
An abnormal waveform generator for generating an ideal command waveform of acceleration differential value, acceleration, acceleration, velocity, and position;
A command waveform generation unit for reading the ideal command waveform, regenerating a command waveform of a target command position and an acceleration differential value, an acceleration, an acceleration, a speed, and a position, and outputting a command waveform of the regenerated speed;
A DAC for converting the command waveform of the regenerated speed into analog data,
The abnormal waveform generator,
A first waveform generator for sequentially generating first command waveforms of acceleration, acceleration, velocity, and position from the target values of acceleration, acceleration, velocity, and position;
A moving average processing unit for generating an ideal command waveform of a position from a first command waveform of a position generated by the first waveform generating unit by a moving averaging method for determining a predetermined time and taking an average while shifting a range;
A second waveform generation unit for generating an ideal command waveform of velocity, acceleration, acceleration, and acceleration differential value by differentiating sequentially from the ideal command waveform at the position,
The command waveform generation unit,
Generate an addition waveform of an acceleration differential value based on the actual position of the encoder signal and the target command position; and generate the addition waveform of the generated acceleration differential value from the acceleration acceleration value regenerated at the previous command output timing. A command waveform regeneration processing unit which adds to the command waveforms, regenerates command waveforms with acceleration differential values, and regenerates command waveforms with acceleration, acceleration, speed, and position;
A die having an ideal command waveform of the generated position, velocity, acceleration, acceleration and acceleration derivative values, and a command waveform input / output unit for preserving the command waveforms of the regenerated acceleration derivative value, acceleration, acceleration, velocity, and position. Bonding device. The method of claim 1, wherein the command waveform generation unit,
Adding the regenerated acceleration derivative command waveform to the regenerated acceleration command waveform at the previous command output timing, and regenerating the acceleration command waveform;
Adding the regenerated acceleration command waveform to the command waveform of acceleration regenerated at the previous command output timing, regenerating the command waveform of acceleration,
Add the command waveform of the regenerated acceleration to the command waveform of the regenerated acceleration at the previous command output timing, regenerate the command waveform of the acceleration,
Add the command waveform of the regenerated speed to the command waveform of the regenerated speed at the previous command output timing, regenerate the command waveform of the speed,
And a command waveform of the regenerated speed is added to the command waveform of the regenerated position at the previous command output timing, and regenerating the command waveform of the position. 3. The die bonding of claim 2, wherein the command waveform regeneration processing unit has an acceleration acceleration differential value addition waveform generation unit for generating an addition waveform of the acceleration differential value from a deviation amount that is a difference between a real position and the target command position by the encoder signal. Device. The method of claim 3, wherein the command waveform regeneration processing unit further has an acceleration differential value limiting unit,
The acceleration differential value limiting unit outputs NG information to the command waveform input / output unit when the regenerated acceleration derivative value is greater than a predetermined acceleration differential value upper limit value or less than the acceleration acceleration derivative value lower limit value.
When the NG information is input to the command waveform input / output unit,
Restoring the command waveforms of acceleration, derivative, acceleration, acceleration, velocity, and position regenerated at the previous command output timing,
The reconstructed acceleration derivative, acceleration, acceleration, velocity and position command waveforms are regenerated acceleration derivatives, acceleration, acceleration, velocity and position command waveforms, and the regenerated speed command waveform is the DAC. Die-bonding device to output to. The method of claim 3, wherein the command waveform regeneration processing unit,
An acceleration differential value limiting unit for outputting NG information when the command waveform of the regenerated acceleration differential value is above a predetermined acceleration differential value upper limit value or below an acceleration acceleration derivative value lower limit value;
When the NG information is input, a command waveform restoring unit for restoring the command waveforms of the acceleration differential value, acceleration, acceleration, speed, and position regenerated at the previous command output timing, and outputting the command waveforms to the command waveform input / output unit. Equipped,
The command waveform input / output unit may be a command waveform of a regenerated acceleration differential value, acceleration, acceleration, speed, and position, and the command waveform of the restored acceleration acceleration value, acceleration, acceleration, speed, and position may be used. A die bonding device for outputting a command waveform to the DAC. 6. The command waveform generating apparatus according to any one of claims 1 to 5, wherein the command waveform generating unit stores the command waveform of the regenerated acceleration derivative value, acceleration, acceleration, velocity, and position as the regenerated command waveform at the previous command output timing. Die bonding device. The die bonding apparatus of claim 1, wherein the motor is a servo motor. The die bonding apparatus of claim 1, wherein the driven member is at least one of a bonding head and a pickup head. (a) preparing a die bonding apparatus according to any one of claims 1 to 5,
(b) bringing in a wafer ring holding a dicing tape with a die attached thereto;
(c) preparing and loading a substrate;
(d) picking up the die;
(e) A method of manufacturing a semiconductor device, comprising the step of bonding the picked up die onto the substrate or a die already bonded. The method according to claim 9, wherein the step (d) picks up a die on the dicing tape by a bonding head which is the driven member,
In the step (e), the die picked up by the bonding head bonds the die on the substrate or the die already bonded. The method of claim 9, wherein the step (d),
(d1) a step of picking up a die on the dicing tape by a pickup head which is the driven member;
(d2) has a step of loading the die picked up by the pickup head into an intermediate stage,
The above (e) step,
(e1) a step of picking up the die mounted on the intermediate stage by the driven head bonding head,
(e2) A method of manufacturing a semiconductor device, comprising the step of loading a die picked up by the bonding head onto the substrate.

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