TWI663828B - Sticky crystal device and manufacturing method of semiconductor device - Google Patents

Abstract

An object of the present invention is to provide a motor control device and a motor control method capable of shortening a setting time by suppressing vibration or deviation in a traveling direction during operation. The solution is: The sticky crystal device is equipped with: Motor, which drives the driven body and sets the real position as the coded signal output; and a motor control device, which controls the motor and controls the driven body to the target position, Mount the die on the substrate. The aforementioned motor control device is provided with: an ideal waveform generating section which generates ideal command waveforms of jerk differential value, jerk, acceleration, speed and position; a command waveform generating section which reads the aforementioned ideal command waveform, and then Generate the target command position, and the jerk differential value, jerk, acceleration, speed and position command waveform, and output the command waveform of the reproduced speed; and DAC, which converts the aforementioned command waveform of the reproduced speed Analogy.

Description

Sticky crystal device and manufacturing method of semiconductor device

[0001] This case relates to a die attach device, which can be applied to, for example, a die attach device provided with a motor control device.

[0002] A part of a manufacturing process of a semiconductor device includes a process of mounting a semiconductor wafer (hereinafter referred to as a die) on a wiring substrate or a lead frame (hereinafter referred to as a substrate) and combining the packaging, and a part of the process of combining packaging includes A process of dividing a die from a semiconductor wafer (hereinafter referred to as a wafer) and a bonding process of mounting the divided die on a substrate. As a manufacturing apparatus used for the bonding process, there is a die attaching device such as a die attaching machine. [0003] A die bonder is a device that uses solder, gold plating, and resin as bonding materials to bond (attach) the crystals to the substrate or the bonded crystals. In a die-bonding machine that bonds crystal grains to the surface of a substrate, for example, a suction nozzle called a chuck is used to pick up the crystal grains from a wafer, pick them up, transfer them to the substrate, apply a pressing force, and heat the bonding material. This joining operation (work) is repeated. The chuck is attached to the front end of the joint head. The joint head is driven by a drive unit (servo motor) such as a ZY drive shaft, and the servo motor is controlled by a motor control device.伺服 In servo motor control, it is necessary to smoothly accelerate and decelerate the workpiece so that it does not subject the workpiece or the unit supporting the workpiece to mechanical shock. [Prior Art Document] [Patent Document] [0004] [Patent Document 1] Japanese Patent Laid-Open No. 2012-175768

(Problems to be Solved by the Invention) [0005] Patent Document 1 is an ideal command waveform that generates jerk, acceleration, speed, and position, and realizes low-vibration motor control by limiting the command waveform of jerk. Other semiconductor manufacturing devices are required to have higher precision motor control. [0006] The object of the present invention is to provide a sticky crystal device which can further suppress vibration. Other problems and novel features can be clearly understood from the description of this specification and the drawings. (Means to Solve the Problem) [0007] The outline of the representative in this case is briefly explained as follows. That is, the crystal sticking device is provided with: a motor that drives the driven body and sets the real position as a coded signal output; and a motor control device that controls the motor, controls the driven body to the target position, and The particles are mounted on a substrate. The aforementioned motor control device is provided with: an ideal waveform generating section which generates ideal command waveforms of jerk differential value, jerk, acceleration, speed and position; a command waveform generating section which reads the aforementioned ideal command waveform, and then Generate the target command position, and the jerk differential value, jerk, acceleration, speed and position command waveform, and output the command waveform of the reproduced speed; and DAC, which converts the aforementioned command waveform of the reproduced speed Analogy. [Effects of the Invention] [0008] According to the above-mentioned sticky crystal device, vibration can be reduced.

[0010] In order to suppress vibration, not only the ideal command waveform of jerk, acceleration, speed, and position, but also the differential value of jerk as the command value, reviewed the control to suppress the amount of change per unit time. However, in order to generate the above-mentioned command waveform, it is necessary to generate a total of five types of ideal command waveforms including position, velocity, acceleration, jerk and differential waveforms with higher jerk. Since it is a complex calculation formula, it requires a huge calculation time. [0011] The sticky crystal device according to the embodiment generates a command waveform of jerk, and sequentially generates command waveforms of acceleration, velocity, and position from the command waveform of jerk. The command waveform of the generated position is generated by a moving average method (predetermining a certain period of time and averaging while shifting the range). From the command waveform of the position after moving average, each command waveform after moving average of velocity, acceleration, jerk, and acceleration differential value is sequentially generated. [0012] By controlling the motor using the command waveform obtained by the moving average obtained as described above, motor driving with lower vibration can be realized. [0013] In addition, with the moving average processing of the command waveform, the overall command waveform length is extended, and the operation time becomes longer. Therefore, it is desirable to adjust the moving average time in accordance with the required specifications of the device such as cycle time and joining accuracy. For example, in high-precision joining, the moving average time is set to be extended, and the operation is smoothly performed with low vibration driving. In high-speed engagement, the moving average time is shortened and the operating time is shortened, thereby driving at high speed. [0014] According to the embodiment, it is possible to suppress vibration or deviation in the traveling direction during high-speed operation of the motor, and to shorten the setting time. In addition, since the motor can be operated with an ideal trajectory and the current position can be constantly monitored, it is easy to synchronize a plurality of axes to operate. [0015] Hereinafter, the embodiments and modifications will be described using drawings. However, in the following description, the same components are denoted by the same reference numerals, and redundant descriptions may be omitted. In addition, in order to make the description clearer, the width, thickness, shape, and the like of each part may be schematically shown in comparison with the actual form in the drawings. However, it is only an example and does not limit the interpreter of the present invention. [Embodiment] [0016] FIG. 1 is a top view showing an outline of a die attacher of an embodiment. FIG. 2 is a diagram illustrating the operation of the pickup head and the bonding head when viewed from the direction of arrow A in FIG. 1. [0017] The die sticking machine 10 roughly distinguishes operations including the die supply section 1, the picking section 2, the intermediate stage section 3, the joint section 4, the transfer section 5, the substrate supply section 6, the substrate carry-out section 7, and the monitoring and control sections. Control section 8. The Y-axis direction is the front-back direction of the die attach machine 10, and the X-axis direction is the left-right direction. The die supply section 1 is arranged on the front side of the die attacher 10, and the bonding section 4 is arranged on the rear side. [0018] First, the crystal grain supply unit 1 supplies the crystal grains D mounted on the substrate P. The die supply unit 1 includes a wafer holding table 12 that holds a wafer 11, and an ejection unit 13 shown by a broken line in which the die D is ejected from the wafer 11. The die supply unit 1 is moved in the XY direction by a driving means (not shown), and the picked-up die D is moved to the position of the jack unit 13. [0019] The picking section 2 is a Y driving section 23 having a picking head 21 that picks up the die D, a picking head 21 that moves the picking head 21 in the Y direction, and lifting, rotating, and moving the chuck 22 in the X direction. Shown each drive section. The pick-up head 21 is a chuck 22 (see also FIG. 2) that holds and holds the jacked-up crystal grains D at the front end, picks up the crystal grains D from the crystal grain supply unit 1, and places them on the intermediate stage 31. The pick-up head 21 includes drive units (not shown) for raising, lowering, rotating, and moving the chuck 22 in the X direction. [0020] The intermediate stage unit 3 includes an intermediate stage 31 on which the die D is temporarily placed, and a stage identification camera 32 for identifying the die D on the intermediate stage 31. [0021] The bonding portion 4 picks up the die D from the intermediate platform 31, and joins it to the transferred substrate P, or joins it in a laminated form on the die that has been bonded to the substrate P. The joint portion 4 includes a joint head 41 including a chuck 42 (also referred to in FIG. 2) that holds and holds the crystal grain D on the front end in the same manner as the pickup head 21; and a Y driving portion 43 that moves the joint head 41 to Y direction; Z drive unit (not shown) for raising and lowering the bonding head 41 (moving in the Z direction); and a substrate recognition camera 44 for picking up the position identification mark (not shown) of the substrate P to recognize the bonding position . With this configuration, the bonding head 41 corrects the pickup position and posture based on the imaging data of the platform recognition camera 32, picks up the die D from the intermediate platform 31, and bonds the die D to the substrate based on the imaging data of the substrate recognition camera 44. P. [0022] The transfer unit 5 includes a substrate transfer tray 51 on which one or a plurality of substrates P (four in FIG. 1) are placed, and a tray rail 52 in which the substrate transfer tray 51 is moved, and has the same structure provided in parallel. The first and second transfer sections. The substrate transfer tray 51 is moved by driving a nut (not shown) provided on the substrate transfer tray 51 with a ball screw (not shown) provided along the tray rail 52. With this configuration, the substrate transfer tray 51 mounts the substrate P on the substrate supply unit 6 and moves to the bonding position along the tray rail 52. After the bonding, the substrate transfer tray 51 is moved to the substrate transfer unit 7 and the substrate P is transferred to the substrate transfer unit. 7. The first and second transfer units are driven independently of each other, and among the substrate P bonding die D placed on one substrate transfer tray 51, the other substrate transfer tray 51 carries the substrate P out and returns to the substrate supply unit. 6. Prepare for placing a new substrate P and the like. [0023] The control system will be described using FIG. 3. FIG. 3 is a block diagram showing a schematic configuration of a control system of the die bonder of FIG. 1. The control system 80 includes a control unit 8, a driving unit 86, a signal unit 87, and an optical system 88. The control unit 8 is roughly divided into a control unit 81 including a CPU (Central Processor Unit), a memory device 82, an input / output device 83, a bus 84, and a power supply unit 85. The memory device 82 includes a main memory device 82a constituted by a RAM such as a memory processing program, and an auxiliary memory device 82b constituted by an HDD such as control data or image data necessary for memory control. The input / output device 83 includes a monitor 83a for displaying device status or information, a touch panel 83b for inputting an operator's instruction, a mouse 83c for operating the monitor, and an image acquisition for acquiring image data from the optical system 88.入 装置 83d. The input / output device 83 is a motor control device 83e including a drive section 86 that controls an XY stage (not shown) of the die supply unit 1 or a Y drive section 43 and a Z-axis drive section of the bonding head stage, and a slave The signal unit 87 such as various sensor signals or switches such as lighting devices takes in signals or an I / O signal control device 83f to be controlled. The optical system 88 includes a wafer identification camera 24, a stage identification camera 32, and a substrate identification camera 44. The control / calculation device 81 fetches necessary data via the bus line 84 and performs calculation, and transmits the information to the control of the pickup head 21 or the like or the monitor 83a or the like. [0024] FIG. 4 is a block configuration diagram for explaining a basic principle of the motor control device of FIG. 3. The motor control device 83e includes an operation controller 210 and a servo amplifier 220, and controls the servomotor 130. The motion controller 210 includes an ideal waveform generation unit 211 that performs an ideal command waveform generation process, an instruction waveform generation unit 212, and a DAC (Digital to Analog Converter) 213. The servo amplifier 220 includes a speed loop control unit 221. The ideal waveform generating unit 211 includes a first waveform generating unit 214, a moving average processing unit 215 that performs moving average processing, and a second waveform generating unit 216. [0025] As shown in FIG. 4, the motor control device 83e is such that the motion controller 210 and the servo amplifier 220 become closed-loop control. Therefore, the speed control is performed by the speed loop control unit 221 of the servo amplifier 220 using the current commanded position and the real position and real speed obtained from the servo motor 130. However, the speed loop control unit 221 controls the speed by generating a command waveform while the motion controller 210 obtains the real speed and the real position from the servo motor 130 and limits the jerk differential value and jerk, and then generates a command waveform. The ideal waveform generation unit 211 and the instruction waveform generation unit 212 are configured by, for example, a CPU (Central Processing Unit) and a memory storing a program executed by the CPU. [0026] For example, in FIG. 4, the target position, the target speed, the target acceleration, the target jerk, and the moving average time are given to the motion controller 210. Then, the real position and the real speed in the command waveform generation unit 212 are directly input as the encoder signals through the servo amplifier 220 or the servo motor 130 one by one. [0027] The first waveform generation unit 214 of the ideal waveform generation unit 211 of the motion controller 210 generates (a) commanded acceleration from target values of jerk, acceleration, velocity, and position input from the control unit 81. Waveform (first command waveform of acceleration), (b) command acceleration waveform (first command waveform of acceleration), (c) command speed waveform (first command waveform of speed), (d) command position waveform (position of (First command waveform), and output the (d) command position waveform to the moving average processing unit 215. [0028] The moving average processing unit 215 performs moving average processing on the command position waveform output from the first waveform generating unit 214, and outputs the command position waveform (command waveform of an ideal position) after (d ') moving average to The second waveform generating section 216. [0029] The second waveform generating unit 216 sequentially generates (c ') a command speed waveform (ideal command speed waveform) after moving average from the command waveform at the ideal position (d'), and (b ') the moving average. Command acceleration waveform (ideal acceleration command waveform), (a ') command jerk waveform (ideal acceleration command waveform) after moving average, (e') command jerk differential value waveform after moving average (Command waveform of an ideal jerk differential value) is output to the command waveform generation unit 212. The so-called "ideal" is to restrict the vibration of the controlled object while limiting the jerk differential value, and smoothly control the controlled object with a predetermined processing time. [0030] The command waveform generation unit 212 is based on the output signal waveform (the current command position obtained from the ideal position command waveform) output from the second waveform generation unit 216 and the encoder signal (real position) input from the servo motor 130. ), While limiting the jerk differential value, it will generate the future command speed waveform one by one and output it to the DAC213 one by one. For example, the instruction waveform generation unit 212 performs (1) instruction waveform input / output processing, (2) encoder signal count processing, and (3) instruction waveform reproduction processing. [0031] The DAC 213 is a speed command value that converts an input digital command value into an analog signal, and outputs the speed command value to the servo amplifier 220. The encoder signal is accumulated in the encoder signal counter (refer to FIG. 13 and the like described later) using a position deviation amount as a pulse. [0032] The speed loop control unit 221 of the servo amplifier 220 controls the rotation speed of the servo motor 130 in accordance with a speed command value input from the motion controller 210 and an encoder signal input from the servo motor 130. [0033] The servo motor 130 rotates at a rotation speed corresponding to the control of the rotation speed input from the speed loop control section 221 of the servo amplifier 220, sets the real position and the real speed as encoder signals, and outputs the signals to the servo amplifier 220. The speed loop control unit 221 and the command waveform generation unit 212 of the motion controller 210. [0034] In the embodiment of FIG. 4, the real position of the driven body such as the joint head is calculated from the count value (the number of rotations and the rotation angle) of the servo motor 130, and the real speed is calculated from the calculated real position. However, a position detection device that directly detects the position of the driven body may be provided, and the position detected by the position detection device may be used as the real position. [0035] Hereinafter, the ideal waveform generation unit and the command waveform generation unit will be described in detail. As described above, the ideal waveform generating unit 211 generates ideals from the target jerk (Jobj), target acceleration (Aobj), target speed (Vobj), and target position (Pobj) of the jerk, acceleration, velocity, and position amplitude values. Command waveform. The instruction waveform generation unit 212 performs instruction output processing and instruction waveform reproduction processing. At this time, the command waveform (for example, the command waveform of the jerk differential value) is added to the jerk differential value addition waveform added with the deviation amount, and the command waveform regeneration processing is performed. [0036] First, the ideal waveform generation unit will be described using FIG. 5. FIG. 5 is a diagram for explaining a command waveform generated by a first waveform generating section of the ideal waveform generating section of FIG. 4. Figure 5 (a) is the command jerk waveform, Figure 5 (b) is the command acceleration waveform generated by the command jerk waveform, Figure 5 (c) is the command speed waveform generated by the command acceleration waveform, and Figure 5 (d) is The command position generated by the command acceleration waveform. The command position is a position where the driven body moves. The horizontal axis is time. [0037] The first waveform generating section 214 generates a commanded jerk waveform (JDR) from the target jerk (Jobj). The command acceleration waveform (ADR) is generated by integrating the target acceleration (Aobj) and the command jerk waveform (JDR). The command speed waveform (VDR) is generated by integrating the target speed (Vobj) and the command acceleration waveform (ADR). The command position waveform (PDR) is generated by integrating the target position (Pobj) and the command speed waveform (VDR). [0038] In FIG. 5 (a), n is the number of command output cycles for outputting a command waveform of one pulse, which is a multiple of eight. As shown in FIG. 5, the motor that drives the moving body is controlled by jerk: it is gradually accelerated in the initial period (T1) from the beginning of the movement, and the period (T2) in the center is a constant speed and is approaching The period (T3) of the final movement position is slowly decelerated and stopped. [0039] In this embodiment, it is set to a multiple of 8, but when the target position is in the positive direction, it can also be set to a waveform in which the jerk command value changes to a positive value, a negative value, a negative value, a positive value, or when the target When the position is in the positive direction, a waveform in which the jerk command value changes to a positive value, a negative value, or a positive value can also be set. This is because when the target moving distance is short, the zone without the jerk command value becomes 0. In this way, if the portion where the jerk becomes 0 is not provided in the jerk waveform, n is a multiple of four. [0040] Next, before the description of the moving average processing unit, a moving average method will be described using a program for obtaining a command speed waveform after moving average as an example, using FIGS. 6 to 9. 6 to 9 are diagrams of a program for obtaining a moving average of a command speed waveform. [0041] Let the average of m instructions within a specified time of the instruction waveform be the instruction value, stagger n to set the average of the next m instructions to be the instruction value, and stagger n to make the next m The average of the commands is set to the command value. This is performed on the entire command waveform, and the averaged command value is combined to generate a final command waveform. Examples of m = 8 and n = 1 are shown in Figures 6-9. As shown in FIG. 6, the eight command speeds VR1 of the command speed waveform before the moving average are averaged, and the speed command value VA1 after the moving average is calculated. Next, as shown in FIG. 7, one command is shifted to average eight command speeds VR2 of the command speed waveform before the moving average, and the speed command value VA2 after the moving average is calculated. Next, as shown in FIG. 8, one command is shifted to average eight command speeds VR3 of the command speed waveform before the moving average, and the speed command value VA3 after the moving average is calculated. This is performed over the entire command speed waveform VR, and the averaged speed command value is combined to generate the final command speed waveform VA. [0042] The relationship between the moving average time and the shape of the command waveform will be described using FIG. 10. FIG. 10 is a diagram showing the shape of each command waveform when the moving average time is changed. [0043] By moving average processing of the command waveform, the overall command waveform length is extended, and the operation time becomes longer. Therefore, the longer the specified time (moving average time) (m becomes larger), the longer the operation time. [0044] When the moving average time becomes larger, each command waveform becomes dull. On the other hand, when the moving average time is 0 seconds, the jerk differential value becomes infinitely large, so the illustration is impossible, and the jerk differential waveform cannot be obtained. The moving average time can be set, for example, according to the joining accuracy or cycle time required by the die attacher. [0045] As described above, the moving average processing unit 215 uses the moving average method (predetermines a certain time, and shifts the range while averaging) to perform moving average processing on the command position waveform (position) generated by the first waveform generation unit 214. Command waveform), and a moving average command position waveform (the ideal position command waveform) is generated. [0046] Next, the second waveform generation unit will be described with reference to FIG. 11. FIG. 11 is a diagram for explaining a command waveform generated by a second waveform generating unit. The second waveform generating unit 216 generates a moving average command speed waveform (ideal speed of the desired speed) by differentiating the moving average command position waveform (the ideal position command waveform (PD)) generated by the moving average processing unit 215. Command waveform (VD). The differential command speed waveform (VD) is used to generate a moving average command acceleration waveform (the ideal acceleration command waveform (AD)). The differential command acceleration waveform (AD) is used to generate the moving average. Command jerk waveform (ideal jerk command waveform (JD)). The differential command jerk waveform (JD) is used to generate a moving average jerk differential value waveform (ideal jerk command value waveform ( ΔJD)). [0047] In FIG. 11 (e '), n is the number of command output cycles for outputting a command waveform of 1 pulse, a multiple of 16. As shown in FIG. 11, the motor that drives the moving object is The jerk differential value control is gradually accelerated in the first period (T1) from the beginning of the movement, and gradually decelerated and stopped at a constant speed (T3) during the period near the final movement position in the central portion (T2). [0 048] In this embodiment, it is set to a multiple of 16, but when the target position is in the positive direction, the command value of the jerk differential value may be changed to a positive value, a negative value, a negative value, a positive value, a negative value, Positive, positive, and negative waveforms, or when the target position is in the positive direction, can also be set to change the command value of the jerk differential value to positive, negative, positive, negative, positive, or negative This is because when the target moving distance is short, the command value with no jerk differential value becomes the interval of 0. Thus, if the jerk differential value waveform does not set the part where the jerk differential value becomes 0, then n is also It can be set to a multiple of 8. [0049] Next, the instruction waveform generation unit will be described with reference to FIGS. 12 to 17. FIG. 12 is a block diagram showing the configuration of the instruction waveform generation unit in FIG. 4 and the input and output signals to the instruction waveform generation unit. Fig. 13 is a control block diagram of the command waveform input / output unit and the command waveform regeneration processing unit of Fig. 12. Fig. 14 is a diagram for explaining the acceleration acceleration value addition waveform. Fig. 15 shows the deviation amount of 1 pulse, 2 Pulse, 4 pulse, 8 pulse and 16 pulse each Figures of the jerk differential value waveform, jerk waveform, acceleration waveform, and velocity waveform added to the compensation. Figure 16 is a diagram for explaining the jerk upper limit lower limit confirmation processing operation. Figure 17 shows the jerk for compensation An example of a command waveform that is reproduced after the differential value waveform is calculated. The horizontal axis is time, and the vertical axis is the pulse height. [0050] As shown in FIG. 12, the command waveform generation unit 212 is provided with a command waveform input / output unit 410. The command waveform reproduction processing unit 420 and the encoder signal counter 430. [0051] Next, in FIG. 13, the second waveform generation unit 216 of the motion controller 210 is to add the command acceleration acceleration differential value waveform (ΔJD) and the command add Pulses of the acceleration waveform (JD), the command acceleration waveform (AD), the command speed waveform (VD), and the command position waveform (PD) are output to the command waveform output / input section 410 of the command waveform generating section 212. [0052] In addition, the command waveform input / output unit 410 is a command jerk differential value waveform (ΔJD ' ₁ ~ ΔJD ' _n ), Command jerk waveform (JD ' ₁ ~ JD ' _n ) Among the instruction waveforms regenerated from the previous instruction output timing, the instruction acceleration waveform (AD ' ₀ ~ AD ' _n ), Command speed waveform (VD ' ₀ ~ VD ' _n ) And command position waveform (PD ' ₀ ~ PD ' _n ). The command waveform input / output unit 410 sets the target command position (PD ' ₀ ) And the instruction jerk differential value waveform (ΔJD ' ₁ ~ ΔJD ' _n ), Command jerk waveform (JD ' ₁ ~ JD ' _n ), From the command acceleration waveform (AD ') ₀ ~ AD ' _n-1 ), From the command speed waveform (VD ' ₀ ~ VD ' _n-1 ) And the command position waveform (PD ' ₀ ~ PD ' _n-1 ) The subtractor 421 and adders 423 to 427 of the instruction waveform reproduction processing section 420 output to the instruction waveform generation section 212. [0053] At this time, the encoder signal counter 430 of the command waveform generation unit 212 obtains the current real position (PA from the encoder count value of the servo motor 130 as shown in FIG. 12). ₀ ) And output to the subtractor 421. [0054] The subtractor 421 is from the current target instruction position (PD ' ₀ ) Minus the current real position (PA ₀ ) To calculate the amount of deviation (Perr) and output it to the jerk differential value addition waveform generator 422. [0055] As shown in FIG. 14, the jerk differential value addition waveform generation unit 422 is within the sampling interval (TS), that is, the deviation (Perr) is generated by n times of instructions holding the instruction output cycle (TC). In the future, it will become a jerk differential value waveform such as "0" (ΔC ₁ ~ ΔC _n ). In FIG. 14, K is the pulse width, ΔJC is the pulse height, n (natural number) is the number of instruction times of the sampling interval (TS), and x (natural number) is the command position of the n number of instructions (pulse number (1 ≦ x ≦ n)). [0056] For example, the jerk differential value waveform (ΔC ₁ ~ ΔC _n ) Is generated in the following general procedures (1) to (3). In the following, the position deviation target compensation amount is set to P (perr is used as P as it is), the command output cycle is set to TC, the deviation compensation target time is set to TN, and the deviation compensation target command output The period is set to n times, the width of the jerk differential value waveform is set to K, and the magnitude of the jerk differential value addition waveform is set to ΔJC. [0057] {Program (1)} First, the width (K) of the jerk differential value waveform is calculated as follows. Since the shape of the jerk differential value addition waveform is fixed by TN> (TC × n), n is a multiple of 16. That is, TN> (TC × 16 × K), and the width (K) of the jerk differential value waveform is K <(TN / (TC × 16)). [0058] {Procedure (2)} Next, the magnitude (ΔJC) of the jerk differential value addition waveform is calculated from the following formula. {Procedure (3)} Second, generate the acceleration acceleration differential value addition waveform (ΔC ₁ ~ ΔC _n ). The jerk differential value addition waveform (ΔC ₁ ~ ΔC _n ) Is formed as follows. Here, x means the x-th waveform of 1 to n. When x / K ≦ 1, ΔC _x = ΔJC x / K ≦ 2, ΔC _x When = 0 x / K ≦ 3, ΔC _x = -ΔJC x / K ≦ 4, ΔC _x When = 0 x / K ≦ 5, ΔC _x = -ΔJC x / K ≦ 6, ΔC _x When = 0 x / K ≦ 7, ΔC _x = ΔJC x / K ≦ 8, ΔC _x When = 0 x / K ≦ 9, ΔC _x = -ΔJC x / K ≦ 10, ΔC _x = 0 x / K ≦ 11, ΔC _x = ΔJC x / K ≦ 12, ΔC _x = 0 x / K ≦ 13, ΔC _x = -ΔJC x / K ≦ 14, ΔC _x = 0 x / K ≦ 15, ΔC _x = -ΔJC x / K ≦ 16, ΔC _x = 0 For example, when K = 1, the jerk differential value addition waveform (ΔC ₁ ~ ΔC _n ) Is formed as follows. ΔC ₁ ~ ΔC _n = {ΔJC, 0, -ΔJC, 0, -ΔJC, 0, ΔJC, 0, -ΔJC, 0, ΔJC, 0, ΔJC, 0, -ΔJC, 0}, that is, ΔC ₁ = ΔJC, ΔC ₂ = 0, ΔC ₃ = -ΔJC, ΔC ₄ = 0, ΔC ₅ = -ΔJC, ΔC ₆ = 0, ΔC ₇ = ΔJC, ΔC ₈ = 0, ΔC ₉ = -ΔJC, ΔC ₁₀ = 0, ΔC ₁₁ = ΔJC, ΔC ₁₂ = 0, ΔC ₁₃ = ΔJC, ΔC ₁₄ = 0, ΔC ₁₅ = -ΔJC, ΔC ₁₆ = 0. [0059] As shown in FIG. 15, the larger the deviation (P), the greater the height (ΔJC) of the jerk differential value waveform to compensate for the deviation (P). [0060] Next, in FIG. 13, the jerk differential value addition waveform generation unit 422 adds the jerk differential value addition waveform (ΔC ₁ ~ ΔC _n ) Is output to the adder 423. The adder 423 is an addition acceleration acceleration differential value addition waveform (ΔC ₁ ~ ΔC _n ) And the instruction jerk differential value waveform (ΔJD 'generated from the previous instruction output timing ₁ ~ ΔJD ' _n ), And then generate all instruction jerk differential value waveforms (JD '' ₁ ~ JD '_'n ) And output to the jerk differential value limiter 428 and the adder 424. [0061] For example, the output of the adder 423 becomes ΔJD " ₁ = ΔJD ' ₁ + ΔC ₁ , ΔJD " ₂ = ΔJD ' ₂ + ΔC ₂ , ΔJD " ₃ = ΔJD ' ₃ + ΔC ₃ , ~, ΔJD " _n = ΔJD ' _n + ΔC _n . [0062] The adder 424 is an instruction jerk differential value waveform (ΔJD " ₁ ~ ΔJD " _n ) And the instruction jerk waveform (JD ' ₁ ~ JD ' _n ), And then generate all instruction jerk waveforms (JD " ₁ ~ JD " _n ) To the jerk differential value limiter 428 and the adder 425. [0063] For example, the output of adder 424 becomes JD " ₁ = JD ' ₁ + ΔJD ' ₁ , JD " ₂ = JD ' ₂ + ΔJD ' ₂ , JD " ₃ = JD ' ₃ + ΔJD ' ₃ , ~, JD " _n = JD ' _n + ΔJD ' _n . [0064] The adder 425 is an instruction jerk waveform (JD " ₁ ~ JD " _n ) And the instruction acceleration waveform (AD ') from the previous instruction output sequence from the instruction output cycle 1 part before ₀ ~ AD ' _n-1 ), And then generate all instruction acceleration waveforms (AD " ₁ ~ AD " _n ) To the adder 426 and the jerk differential value limiter 428. [0065] For example, the output of the adder 425 becomes AD " ₁ = AD ' ₀ + JD " ₁ , AD " ₂ = AD ' ₁ + JD " ₂ , AD " ₃ = AD ' ₂ + JD " ₃ , ~, AD " _n = AD ' _(n-1) + JD " _n . [0066] The adder 426 is an instruction acceleration waveform (AD " ₁ ~ AD " _n ) And the instruction speed waveform (VD ' ₀ ~ VD ' _n-1 ), Then generate all instruction acceleration waveforms (VD " ₁ ~ VD " _n ) To the adder 427 and the jerk differential value limiter 428. [0067] For example, the output of the adder 426 becomes VD " ₁ = VD ' ₀ + AD " ₁ , VD " ₂ = VD ' ₁ + AD " ₂ , VD " ₃ = VD ' ₂ + AD " ₃ , ~, VD " _n = VD ' _(n-1) + AD " _n . [0068] The adder 427 is a command speed waveform (VD " ₁ ~ VD " _n ) And the command position waveform (PD ' ₀ ~ PD ' _n-1 ) To generate all instruction position waveforms (PD " ₁ ~ PD " _n ) And output to the jerk differential value limiter 428. [0069] For example, the output of adder 427 becomes PD " ₁ = PD ' ₀ + VD " ₁ , PD " ₂ = PD ' ₁ + VD " ₂ , PD "3 = PD ' ₂ + VD " ₃ , ~, PD " _n = PD ' _(n-1) + VD " _n . [0070] In addition, the command waveform regeneration processing unit 420 confirms whether or not each of the command waveforms acquired by the adders 423 to 427 is within a range. The jerk differential value limiting unit 428 uses FIG. 16 to confirm the command jerk differential value waveform (ΔJD " ₁ ~ ΔJD " _n ) Does not exceed the upper limit (or lower limit). In FIG. 16, the upper limit of the jerk differential value (ΔJmax) and the lower limit of the jerk differential value (−ΔJmax) are predetermined. [0071] In FIG. 16, the adder 423 adds a jerk differential value addition waveform in a dotted circle 701 to a command jerk differential value waveform (ΔJD 'generated in the previous command output timing) ₁ ~ ΔJD ' _n ). That is, the waveform pulse (ΔC ₁ , ΔC ₂ , ΔC ₃ , ΔC ₄ , ΔC ₅ , ΔC ₆ , ΔC ₇ And ΔC ₈ ) Will be added to the jerk differential value waveform (command jerk differential value waveform (ΔJD " ₁ ~ ΔJD " _n )). The timing of the previous correction was corrected. If it is corrected again, the pulse waveform may be lower than the lower limit value of the jerk (-ΔJmax). [0072] In this case, the jerk differential value limiting unit 428 detects a pulse waveform (ΔC at the current time). ₁ , ΔC ₂ , ΔC ₃ , ΔC ₄ , ΔC ₅ , ΔC ₆ , ΔC ₇ And ΔC ₈ ) Yes (OK) No (NG) is between the upper limit (ΔJmax) and the lower limit (-ΔJmax), it is determined OK or NG, and the output is divergent. For example, detect whether the waveform (ΔC ₂ ) Is the upper limit (ΔJmax) (ΔJD " ₁ ~ ΔJD " _n <ΔJmax). If NO (NG), the NG information is output to the command waveform restoration unit 42C. If it is OK, the waveform (ΔC at the current time) is detected. ₂ ) Whether it exceeds the lower limit (ΔJmax) (-ΔJmax <ΔJD " ₁ ~ ΔJD " _n ). If NO (NG), the NG information is output to the command waveform restoration unit 42C. If it is OK, the command jerk differential value waveform (ΔJD " ₁ ~ ΔJD " _n ), Command jerk waveform (JD " ₁ ~ JD " _n ), Command acceleration waveform (AD " ₁ ~ AD " _n ), Command speed waveform (VD " ₁ ~ VD " _n ), And the command position waveform (PD " ₁ ~ PD " _n ) Is output to the jerk limiting unit 429. [0073] Next, in FIG. 13, the jerk limitation unit 429 detects whether the jerk waveform at the current time does not reach the upper limit (Jmax) (JD "), similarly to the jerk differential value limitation unit 428. ₁ ~ JD " _n <Jmax). If NO (NG), the NG information is output to the command waveform restoration unit 42C. If it is OK, it is detected whether the waveform at the current time exceeds the lower limit Jmax (-Jmax <JD " ₁ ~ JD " _n ). If NO (NG), the NG information is output to the command waveform restoration unit 42C. If it is OK, the command jerk differential value waveform (ΔJD " ₁ ~ ΔJD " _n ), Command jerk waveform (JD " ₁ ~ JD " _n ), Command acceleration waveform (AD " ₁ ~ AD " _n ), Command speed waveform (VD " ₁ ~ VD " _n ) And command position waveform (PD " ₁ ~ PD " _n ) Is output to the acceleration limiter 42A. [0074] Next, in FIG. 13, the acceleration limiting unit 42A detects whether the acceleration waveform at the current time is the upper limit (Amax) (AD ", similarly to the jerk differential value limiting unit 428. ₁ ~ AD " _n <Amax). If NO (NG), the NG information is output to the command waveform restoration unit 42C. If it is OK, it is detected whether the waveform at the current time exceeds the lower limit (Amax) (-Amax <AD " ₁ ~ AD " _n ). If NO (NG), the NG information is output to the command waveform restoration unit 42C. If it is OK, the command jerk differential value waveform (ΔJD " ₁ ~ ΔJD " _n ), Command jerk waveform (JD " ₁ ~ JD " _n ), Command acceleration waveform (AD " ₁ ~ AD " _n ), Command speed waveform (VD " ₁ ~ VD " _n ) And command position waveform (PD " ₁ ~ PD " _n ) Is output to the speed limiter 42B. [0075] Furthermore, in FIG. 13, the speed limiter 42B detects whether the speed waveform at the current time does not reach the upper limit (Vmax) (VD ", similarly to the jerk differential value limiter 428. ₁ ~ VD " _n <Vmax). If NO (NG), the NG information is output to the command waveform restoration unit 42C. If it is OK, it is detected whether the waveform at the current time exceeds the lower limit (Vmax) (-Vmax <VD " ₁ ~ VD " _n ). If NO (NG), the NG information is output to the command waveform restoration unit 42C. If it is OK, the command jerk differential value waveform (ΔJD " ₁ ~ ΔJD " _n ), Command jerk waveform (JD " ₁ ~ JD " _n ), Command acceleration waveform (AD " ₁ ~ AD " _n ), Command speed waveform (VD " ₁ ~ VD " _n ) And command position waveform (PD " ₁ ~ PD " _n ) Is output to the command waveform input / output unit 410. [0076] The command waveform restoration unit 42C is a command for restoring the previous command output when NG information is input from any of the jerk differential value restriction unit 428, jerk restriction unit 429, acceleration restriction unit 42A, or speed restriction unit 42B Waveform, leaving the correction of the total deviation until the next command output (confirmation processing of upper and lower limits). The command waveform at the time of the previous command output after the restoration is also output to the command waveform input / output unit 410. [0077] Thereafter, in FIG. ₁ ~ ΔJD " _n , JD " ₁ ~ JD " _n , AD " ₁ ~ AD " _n , VD " ₁ ~ VD " _n , And PD " ₁ ~ PD " _n Saved as a new command waveform. [0078] Speed command value (VD "of the command waveform ₁ ~ VD " _n As shown in FIG. 12, the command waveform input / output unit 410 sequentially outputs to the DAC 213, and the DAC 213 outputs the speed command value after the sequential analog conversion to the servo amplifier 220. [0079] In FIG. 12, DAC213 is a speed command value (VD "to be input ₁ ) Is converted to an analog value and output to the servo amplifier 220. The servo amplifier 220 rotates and drives the servo motor 130 according to the inputted analog data, sets the rotation position (and rotation speed) of the servo motor 130 as an encoder signal, and outputs it to the command waveform generation unit 212. [0080] The encoder signal output from the servo motor 130 is an encoder signal counter 430 input to the command waveform generation unit 212. [0081] The encoder signal counter 430 is a count value (PA ₀ ) Is output to the command waveform reproduction processing unit 420. [0082] In the instruction waveform reproduction processing unit 420, the subtracter 421 inputs the count value (PA ₀ ). [0083] The servo amplifier 220 is in accordance with the input speed command value (VD " ₁ ) To control the servo motor 130. [0084] FIG. 17 shows how all the command waveforms are reproduced. The thin solid lines are the waveforms before the compensation. From now on, the servo motor 130 is controlled with the waveform shown by the thick solid line between the commanded acceleration acceleration value and the acceleration acceleration differential value waveform for compensation. . [0085] As a result, the servo motor 130 rotates, and when the motor rotates at a high speed, the vibration or deviation in the traveling direction of the driven body can be suppressed, and the setting time can be shortened. In addition, since the motor can be operated with an ideal trajectory and the current position can be constantly monitored, it is possible to easily synchronize and operate a plurality of axes. [0086] In addition, in FIG. 17, the real position waveform can be seen to deviate more than before. This indicates the deviation (positional deviation) of the command waveform up to the present time. Actually, the correction is continuously performed at an interval of a very short command output period, so there is no case where a deviation significantly occurs as shown in FIG. 17. In FIG. 17, in order to emphasize the state where the expression position is corrected, the real position at the current time is formed at a position slightly deviating from the command waveform. [0087] Next, a motor control method will be described using FIGS. 18 and 19. 18 and 19 are flowcharts of a program for explaining an example of the operation of the motor control method. Creating the instruction jerk differential value waveform (JD "), the instruction jerk waveform (JD"), the instruction acceleration waveform (AD "), the instruction speed waveform (VD"), and the instruction output cycle timing according to FIGS. 18 and 19, and Program for commanding the position waveform (PD "). In step S601, the current real position (PA) is obtained from the encoder count value. ₀ ). In step S602, from the real position (PA ₀ ) And the current command position (PD ' ₀ ) Calculate the deviation (Perr). In step S603, in the command output cycle n times, a jerk differential value addition waveform (ΔC) such that a deviation amount (Perr) will become "0" in the future is generated. ₁ ~ ΔC _n ). [0088] In step S604, the jerk differential value addition waveform (ΔC ₁ ~ ΔC _n ) Added to the command jerk differential value waveform (ΔJD ' ₁ ~ ΔJD ' _n ), And then generate all instruction jerk differential value waveforms (ΔJD " ₁ ~ ΔJD " _n ). In step S605, the regenerated command jerk differential value waveform (ΔJD " ₁ ~ ΔJD " _n ) Added to the commanded jerk waveform (JD ' ₁ ~ JD ' _n ), And then generate all instruction jerk waveforms (JD " ₁ ~ JD " _n ). In step S606, a command acceleration waveform (AD ' ₀ ~ AD ' _n-1 ) And the regenerated command acceleration waveform (JD "1 ~ JD" _n ) To regenerate all instruction acceleration waveforms (AD " ₁ ~ AD " _n ). In step S607, the sum command acceleration waveform (AD " ₁ ~ AD " _n ) (Step S606) the same method to regenerate the command speed waveform (VD " ₁ ~ VD " _n ). In step S608, the acceleration waveform (AD " ₁ ~ AD " _n ) (Step S606) or command speed waveform (VD " ₁ ~ VD " _n ) (Step S607) the same method to regenerate the command position waveform (PD " ₁ ~ PD " _n ). [0089] In step S609, the regenerated jerk differential value waveform (ΔJD " ₁ ~ ΔJD " _n ) Whether the upper limit (ΔJmax) is not reached. When the upper limit (ΔJmax) is exceeded, the process is shifted to step S614, and when the upper limit is not reached, the process is shifted to step S610. In step S610, the regenerated jerk waveform (JD " ₁ ~ JD " _n ) Whether the upper limit (Jmax) is not reached. When the upper limit (Jmax) is exceeded, the process is shifted to step S614, and when the upper limit is not reached, the process is shifted to step S611. In step S611, the reproduced acceleration waveform (AD "is confirmed ₁ ~ AD " _n ) Whether the upper limit (Amax) is not reached. When the upper limit (Amax) is exceeded, the process is shifted to step S614, and when the upper limit is not reached, the process is shifted to step S612. In step S612, the reproduced velocity waveform (VD " ₁ ~ VD " _n ) Whether the upper limit (Vmax) is not reached. When the upper limit (Vmax) is exceeded, the process is shifted to step S614, and when the upper limit is not reached, the process is shifted to step S613. [0090] In step S613, the regenerated command jerk differential value waveform (ΔJD " ₁ ~ ΔJD " _n ), Command jerk waveform (JD " ₁ ~ JD " _n ), Command acceleration waveform (AD " ₁ ~ AD " _n ), Command speed waveform (VD " ₁ ~ VD " _n ) And command position waveform (PD " ₁ ~ PD " _n ) Save as a new command waveform. In step S615, the speed command value (VD " ₁ ~ VD " _n ) Output from the DAC312, ending the processing of FIGS. 17 and 18, and proceeding to the next command output cycle timing operation. [0091] In step S614, the command waveform returned before the command waveform is regenerated is restored, and the process proceeds to step S615. That is, using the previous instruction jerk differential value waveform (ΔJD ' ₁ ~ ΔJD ' _n ) As the command jerk differential value waveform (ΔJD " ₁ ~ ΔJD " _n ). Use previous instruction jerk waveform (JD ' ₁ ~ JD ' _n ) As the command jerk waveform (JD " ₁ ~ JD " _n ). In addition, the previous command acceleration waveform (AD ' ₁ ~ AD ' _n ) As the command acceleration waveform (AD " ₁ ~ AD " _n ). In addition, the previous command speed waveform (VD ' ₁ ~ VD ' _n ) As command speed waveform (VD " ₁ ~ VD " _n ). In addition, the previous command position waveform (PD ' ₁ ~ PD ' _n ) As the command position waveform (PD " ₁ ~ PD " _n ). [0092] Next, a method for manufacturing a semiconductor device using the die attacher of the embodiment will be described with reference to FIG. 20. FIG. 20 is a flowchart showing a method of manufacturing a semiconductor device. Step S11: The wafer ring 14 holding the dicing tape 16 to which the die D divided from the wafer 11 is attached is stored in a wafer cassette (not shown), and is transferred to the die attacher 10. The control unit 8 supplies the wafer ring 14 from the wafer cassette filled with the wafer ring 14 to the die supply unit 1. Then, the substrate P is prepared and carried into the die attacher 10. The control unit 8 loads the substrate P on the substrate transfer tray 51 in the substrate supply unit 6. [0093] Step S12: The control unit 8 picks up the divided dies from the wafer. Step S13: The control unit 8 mounts the picked-up dies on the substrate P or laminates the bonded dies. The control unit 8 mounts the die D picked up from the wafer 11 on the intermediate stage 31, and the bonding head 41 picks up the die D again from the intermediate stage 31 and joins the transferred substrate P. [0094] Step S14: The control unit 8 removes the substrate P to which the die D is bonded from the substrate transfer tray 51 in the substrate transfer unit 7. The substrate P is carried out from the die attacher 10. [0095] <Modifications> Hereinafter, representative modifications will be given as examples. In the following description of the modification, the same reference numerals as those of the above-mentioned embodiment may be used for portions having the same configuration and function as those described in the above-mentioned embodiment. It should be noted that the description of such a part can appropriately refer to the description of the embodiment described above within a technically inconsistent range. In addition, a part of the above-mentioned embodiment and all or a part of the plural modifications can be appropriately combined and applied within a range that is not technically contradictory. [0096] (Modification 1) FIG. 21 is a block diagram showing a configuration of a command waveform input / output unit and a command waveform regeneration processing unit according to Modification 1. In the above embodiment, the command waveform restoration unit 42C restores the previous command waveform. However, as shown in FIG. 21, in Modification 1, the command waveform regeneration processing unit 420 outputs NG information, and the command waveform output input unit 410 According to the NG information, the saved previous command waveform is restored as the current command waveform. [0097] (Modification 2) In the embodiment, a motor (servo motor) related to rotation is described. However, a linear motor other than a motor that rotates may be applied. Specifically, in FIG. 4, the servo motor 130 is replaced with a linear motor (hereinafter referred to as a motor control device according to Modification 2). The speed loop control unit 221 of the servo amplifier 220 controls the moving speed of the linear motor in accordance with a speed command value input from the motion controller 210 and an encoder signal input from the linear motor. [0098] The linear motor moves at a moving speed controlled by the moving speed input from the speed loop control section 221 of the servo amplifier 220, and sets the real position and the real speed as encoder signals to output the speed to the servo amplifier 220. The loop control unit 221 and the command waveform generation unit 212 of the motion controller 210. [0099] In the motor control device according to Modification 2, the real position of the driven body is calculated from the count value of the linear motor, and the real speed is calculated based on the calculated real position. However, a position detection device that directly detects the position of the driven body may be provided, and the position detected by the position detection device may be used as the real position. [0100] For example, in the motor control device according to Modification 2, the DAC213 is a speed command value (VD "to be input. ₁ ) Is converted to an analog value and output to the servo amplifier 220. The servo amplifier 220 drives the linear motor according to the inputted analog data, and uses the moving position (and moving speed) of the linear motor as an encoder signal to output to the command waveform generating unit 212. [0101] The encoder signal output from the linear motor is input to the encoder signal counter 430 of the command waveform generation unit 212. [0102] The encoder signal counter 430 is a count value PA to be counted in a predetermined cycle. ₀ It is output to the command waveform reproduction processing unit 420. [0103] In the instruction waveform reproduction processing unit 420, the subtractor 421 outputs the count value (PA ₀ ) To its subtraction input terminal. The manner in which all command waveforms are reproduced is the same as that shown in FIG. 17. [0104] As a result, when the linear motor moves, and when the linear motor moves at high speed, vibration or deviation in the traveling direction of the driven body can be suppressed, and the setting time can be shortened. In addition, since the linear motor can be operated with an ideal trajectory and the current position can be constantly monitored, it is easy to synchronize a plurality of axes to operate. Furthermore, the present invention is also applicable to the entire motor such as a motor having an encoder counting function. [0105] The inventions developed by the present inventors have been specifically described based on the embodiments, examples, and modifications, but the present invention is not limited to the above-mentioned embodiments, examples, and modifications, and various modifications can be implemented. For example, in the embodiment, the command waveform input / output unit outputs a speed command value to control the motor. However, instead of the speed command value, the acceleration command value can be output to control the motor. As a result, not only position control but also load control becomes possible. In the embodiment, one pickup head and one bonding head are provided, but the number is two or more. In the embodiment, the intermediate platform is provided, but the intermediate platform may not be provided. In this case, the pickup head and the bonding head may be used in combination. In the embodiment, the surfaces of the crystal grains are bonded together, but the surface of the crystal grains may be reversed after picking up the crystal grains, and the back surface of the crystal grains may be bonded together. In this case, the intermediate platform is optional. This device is called a flip chip bonder.

[0106]

130‧‧‧Servo motor

83e‧‧‧Motor control device

210‧‧‧ Motion Controller

211‧‧‧ideal waveform generator

212‧‧‧Command waveform generation unit

213‧‧‧DAC

220‧‧‧Servo amplifier

221‧‧‧Speed loop control section

410‧‧‧Command waveform input / output section

420‧‧‧Instruction waveform reproduction processing unit

421‧‧‧Subtractor

422‧‧‧Acceleration differential value addition waveform generation unit

423 ~ 427‧‧‧ Adder

428‧‧‧Jerk acceleration differential value limitation unit

429‧‧‧Jerk limiter

42A‧‧‧Acceleration limiting section

42B‧‧‧Speed limit section

42C‧‧‧Command waveform restoration unit

430‧‧‧ encoder signal counter

[0009] FIG. 1 is a schematic top view showing the configuration of a die bonder of an embodiment. FIG. 2 is a diagram illustrating a schematic configuration and operation of the die attacher of FIG. 1. FIG. 3 is a block diagram showing a schematic configuration of a control system of the die bonder of FIG. 1. FIG. 4 is a block configuration diagram for explaining a basic principle of the motor control device of FIG. 3. FIG. 5 is a diagram for explaining a command waveform generated by the first waveform generating section of the ideal waveform generating section of FIG. 4. FIG. 6 is a diagram for explaining moving average processing. FIG. 7 is a diagram for explaining moving average processing. 8 is a diagram for explaining moving average processing. FIG. 9 is a diagram for explaining moving average processing. 10 is a diagram showing the shape of each command waveform when the moving average time is changed. FIG. 11 is a diagram for explaining an ideal command waveform generated by the second waveform generating section of the ideal waveform generating section of FIG. 4. FIG. 12 is a block diagram showing the configuration of the command control unit and the input / output signals to the command waveform generation unit in FIG. 4. FIG. 13 is a block diagram showing the configuration of the command waveform input / output section and the command waveform regeneration processing section of FIG. 12. FIG. 14 is a diagram for explaining a jerk differential value addition waveform generated by the jerk differential value addition waveform generation unit of FIG. 13. FIG. 15 is a diagram showing jerk differential value waveforms, jerk waveforms, acceleration waveforms, and velocity waveforms added to the compensation when the deviation amounts are 1 pulse, 2 pulses, 4 pulses, 8 pulses, and 16 pulses. FIG. 16 is a diagram for explaining the operation of confirming the upper limit and lower limit of the jerk differential value of the motor control device according to the embodiment. FIG. 17 is a diagram showing a command waveform that is reproduced after calculation of a jerk differential value waveform for compensation of the motor control device of the embodiment. FIG. 18 is a flowchart illustrating a routine of an operation of the motor control method according to the embodiment. FIG. 19 is a flowchart illustrating a routine of an operation of the motor control method according to the embodiment. FIG. 20 is a flowchart illustrating a method of manufacturing a semiconductor device using the die attach device of the embodiment. FIG. 21 is a block diagram showing a configuration of a command waveform input / output unit and a command waveform regeneration processing unit according to the first modification.

Claims (11)

A sticky crystal device is characterized by: a motor that drives a driven body and sets the real position as an encoder signal output; a motor control device that controls the motor, controls the driven body to a target position, and The die is mounted on a substrate. The motor control device includes: an ideal waveform generating unit that generates ideal command waveforms of jerk differential value, jerk, acceleration, speed, and position; and a command waveform generating unit that reads the aforementioned The ideal command waveform, the target command position, and the jerk differential value, jerk, acceleration, velocity, and position command waveforms will be re-generated speed command waveform output; DAC, which is the previously regenerated The command waveform of speed is converted into analog data. The aforementioned ideal waveform generating unit is provided with a first waveform generating unit that integrates the target values of jerk, acceleration, velocity, and position in order to integrate the jerk, acceleration, velocity, and position. The first command waveform is generated; the moving average processing unit In the open range, the moving average method taking an average while generating an ideal command waveform for the position from the first command waveform at the position where the first waveform generation part is generated; and a second waveform generation part which is based on the position The ideal command waveform is sequentially differentiated to generate an ideal command waveform of speed, acceleration, jerk, and jerk differential value. The aforementioned command waveform generation unit is provided with a command waveform regeneration processing unit, which is based on the encoder signal according to the aforementioned encoder signal. The actual position and the target command position are used to generate the acceleration waveform of the jerk differential value, and the generated waveform of the jerk differential value is added to the command waveform of the jerk differential value regenerated in the previous command output timing. , And then generate the command waveform of the jerk differential value, and then generate the command waveform of jerk, acceleration, speed, and position; and the command waveform input / output unit, which stores the position, speed, acceleration, jerk, and jerk generated as described above The ideal command waveform of the acceleration differential value and the previously added Speed differential value, the command jerk, acceleration, velocity and position waveforms. For example, the crystal sticking device according to the first scope of the patent application, wherein the command waveform generating unit is: adding the command waveform of the regenerated jerk differential value to the command of the jerk which was regenerated in the previous command output timing. Waveform, and then generate the acceleration acceleration command waveform, add the previously generated acceleration acceleration command waveform to the acceleration instruction waveform that was regenerated in the previous command output timing, and generate the acceleration instruction waveform again. The regenerated acceleration command waveform is added to the regenerated command waveform of the previous command output timing, and the regenerated acceleration command waveform is added to the previously regenerated command waveform. The speed command waveform that is regenerated at the output timing is output, and the speed command waveform that is regenerated is added to the command waveform at the position that was regenerated at the previous command output timing. Generate a command waveform for the position. For example, the crystal sticking device of the second scope of the patent application, wherein the aforementioned command waveform regenerating processing unit has: a jerk differential value generated by a deviation amount according to a difference between the actual position of the encoder signal and the target command position. The acceleration waveform differential value of the added waveform is added to the waveform generation unit. For example, the crystal sticky device of the third scope of the application for a patent, wherein the command waveform regenerating processing section further includes a jerk differential value limiting section, and the jerk differential value limiting section is the regenerated jerk differential value. When the command waveform exceeds the predetermined upper limit value of the jerk differential value or does not reach the lower limit value of the jerk differential value, the NG information is output to the aforementioned command waveform input / output section, and the aforementioned command waveform output / input section is used when the aforementioned NG information is input. , Restore the jerk differential value, jerk, acceleration, speed, and position command waveforms that were regenerated in the previous command output timing, and use the restored jerk differential value, jerk, acceleration, speed, and position. The command waveform is a regenerated jerk differential value, jerk, acceleration, speed, and position command waveform, and the regenerated command waveform of the speed is output to the aforementioned DAC. For example, the crystal sticky device of the third scope of the patent application, wherein the aforementioned command waveform regenerating processing section further includes: a jerk differential value limiting section, which is that the command waveform of the regenerated jerk differential value exceeds a predetermined value. When the upper limit value of the jerk differential value or the lower limit value of the jerk differential value is not reached, the NG information is output; and when the NG information is input, the NG information is inputted, and it will be restored at the previous command output timing. The generated jerk differential value, jerk, acceleration, speed, and position command waveforms are restored and output to the aforementioned command waveform input / output section. The aforementioned command waveform output / input section is based on the restored jerk differential value, jerk, acceleration, and speed. The command waveform of the position is used as the regenerated jerk differential value, jerk, acceleration, speed, and position command waveform, and the regenerated command waveform of the speed is output to the aforementioned DAC. According to the crystal sticking device described in any one of claims 1 to 5, the aforementioned command waveform generation unit is a command that reproduces the jerk differential value, jerk, acceleration, speed, and position. The waveform is saved as the command waveform regenerated in the previous command output timing. For example, the crystal sticking device according to item 1 of the patent application scope, wherein the aforementioned motor is a servo motor. For example, the crystal sticking device according to the first patent application range, wherein the driven body is at least one of a bonding head and a pickup head. A method for manufacturing a semiconductor device, comprising: (a) a process for preparing a die-bonding device such as any one of items 1 to 5 of the scope of patent application; (b) a dicing tape to which a die is attached The project of moving wafer rings into; (c) the process of preparing to move into the substrate; (d) the process of picking up the dies; and (e) the process of bonding the picked up dies to the aforementioned substrate or the bonded dies engineering. For example, the method for manufacturing a semiconductor device according to item 9 of the application, wherein the (d) process is to pick up the crystal grains on the dicing tape by using the bonding head as the driven body, and the (e) process is to A bonding head is used to bond the picked-up dies to the substrate or the dies that have been bonded. For example, the method for manufacturing a semiconductor device according to item 9 of the application, wherein the (d) process includes: (d1) a process of picking up the crystal grains on the dicing tape by using the pickup head as the driven body; and (d2) a process of placing the grains picked up by the picking head on an intermediate platform, the aforementioned (e) project includes: (e1) picking up and placing the intermediate head by using the bonding head as the driven body; The process of die of the platform; and (e2) the process of placing the die picked up by the aforementioned bonding head on the aforementioned substrate.