KR102458131B1 - Die bonding apparatus and method of manufacturing semiconductor device - Google Patents

Abstract

An object of the present invention is to provide a die bonding apparatus capable of further downsizing the mechanism in the push-up unit.
The die bonding apparatus has a plurality of blocks in contact with the dicing tape, and includes a push-up unit for pushing up a die from below the dicing tape, a collet for adsorbing the die, and a control unit configured to control the push-up unit. be prepared The push-up unit includes a plurality of drive shafts independently operated corresponding to the plurality of blocks, and a plurality of motors corresponding to the plurality of drive shafts, and the control unit measures the peel force of the die by measuring a torque value for each motor. configured to measure.

Description

DIE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

The present disclosure relates to a die bonding apparatus, and is applicable to, for example, a die bonder having a function of measuring a wafer peel force.

In general, in a die bonder that mounts a semiconductor chip called a die on the surface of a wiring board or a lead frame (hereinafter, generically referred to as a board), for example, a die using a suction nozzle such as a collet is used. The operation (operation) of bonding by conveying the substrate onto the substrate, applying a pressing force, and heating the bonding material is performed repeatedly.

Among the die bonding steps by a die bonding apparatus such as a die bonder, there is a peeling step of peeling a divided die from a semiconductor wafer (hereinafter referred to as a wafer). In a peeling process, die is pushed up by the pushing unit from the back surface of a dicing tape, it peels one by one from the dicing tape hold|maintained by the die supply part, and it conveys on a board|substrate using adsorption nozzles, such as a collet.

In order to correct the tension at the time of pickup of the central and peripheral portions of the wafer in the wafer ring, a load cell provided between the block body and the upper and lower mechanism is used to measure the load (reaction force from the dicing tape) at the time of pushing up. It is proposed to make the amount of push-up variable so that the load of ' may become constant (patent document 1).

Japanese Patent Laid-Open No. 2012-199456

However, as disclosed in Patent Document 1, if a load cell is provided in the push-up unit, the mechanism becomes large.

It is an object of the present disclosure to provide a die bonding apparatus capable of further miniaturizing a mechanism in a push-up unit.

A brief outline of representative ones of the present disclosure is as follows.

That is, the die bonding apparatus has a plurality of blocks in contact with the dicing tape, and is configured to control a push-up unit that pushes the die up from below the dicing tape, a collet that sucks the die, and the push-up unit A control unit is provided. The push-up unit includes a plurality of drive shafts independently operated corresponding to the plurality of blocks, and a plurality of motors corresponding to the plurality of drive shafts, and the control unit measures the load torque at the time of pushing up for each of the motors, thereby measuring the die. is configured to measure the peel force of

According to the said die bonding apparatus, the mechanism in a push-up unit can be further downsized.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows the structure of the semiconductor manufacturing apparatus of embodiment.
Fig. 2 is a sectional view of the main part of the push-up unit in a state spaced apart from the dicing tape.
Fig. 3 is a diagram showing an example of an RMS push-up sequence.
FIG. 4 is a diagram for explaining an example of the first time chart recipe of the sequence of FIG. 3 .
Fig. 5 is a block diagram showing the motor and operation controller of the push-up unit.
6 is a diagram for explaining the concept of offline machine learning of peel force and peel state.
It is a figure explaining the concept of calculating|requiring the peeling state by machine learning.
It is a figure explaining a peeling state.
It is a figure explaining the method of calculating a push-up condition from the peeling state calculated|required by the machine learning model.
It is the conceptual diagram which looked at the die bonder in an Example from above.
It is a figure explaining the operation|movement of a pickup head and a bonding head, when it sees from the arrow A direction in FIG.
12 is a view showing an external perspective view of the die supply unit of FIG. 10 .
Fig. 13 is a schematic cross-sectional view showing a main part of the die supply section of Fig. 10;
Fig. 14 is an external perspective view of the push-up unit of Fig. 11;
FIG. 15 is a top view of a portion of the first unit of FIG. 14 ;
FIG. 16 is a top view of a portion of the second unit of FIG. 14 ;
FIG. 17 is a top view of a part of the third unit of FIG. 14 ;
Fig. 18 is a longitudinal sectional view of the push-up unit of Fig. 14;
Fig. 19 is a longitudinal sectional view of the push-up unit of Fig. 14;
FIG. 20 is a diagram illustrating the configuration of the push-up unit of FIG. 11 and a collet part of the pickup head.
Fig. 21 is a block diagram showing a motor and a motor control device of the push-up unit of Fig. 11;
22 is a flowchart illustrating a pickup operation of the die bonder of FIG. 10 .
23 is a flowchart illustrating a method of manufacturing a semiconductor device using the die bonder of FIG. 10 .

EMBODIMENT OF THE INVENTION Hereinafter, embodiment and an Example are demonstrated using drawings. However, in the following description, the same code|symbol is attached|subjected to the same component, and repeated description may be abbreviate|omitted. In addition, in order to make the description clearer, the drawings may be schematically expressed about the width, thickness, shape, etc. of each part compared to the actual aspect, but this is only an example and does not limit the interpretation of the present disclosure .

<Embodiment>

First, the semiconductor manufacturing apparatus in embodiment is demonstrated using FIG. 1. FIG. BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows the structure of the semiconductor manufacturing apparatus in embodiment.

The semiconductor manufacturing apparatus 100 in embodiment is equipped with the control part which has the main controller 81a, the operation controller 81b, the monitor 83a, the touch panel 83b, and the buzzer 83g. The semiconductor manufacturing apparatus 100 is further provided with the XY table 86a controlled by the operation controller 81b, the Z drive part 86b, and the push-up unit TU. The semiconductor manufacturing apparatus 100 further includes a head (bonding head or pickup head) BH that moves up and down by the Z driving unit 86b and a collet CLT provided at the tip of the head BH. The semiconductor manufacturing apparatus 100 includes a sensor 87a for detecting the position of the push-up unit TU, a sensor 87b for detecting pressure and flow rate, and a sensor 87c for detecting the gas flow rate of the collet CLT. provide more The push-up unit TU has a function of vacuum adsorbing the dicing tape and a function of blowing air to the dicing tape.

Next, a push-up unit TU having a plurality of stages of the push-up block will be described with reference to FIG. 2 . Fig. 2 is a sectional view of the main part of the push-up unit in a state spaced apart from the dicing tape.

The push-up unit TU has a block portion BLK having blocks BLK1 to BLK4, and a dome plate DP having a plurality of suction holes (not shown) for sucking the dicing tape DT. The four blocks BLK1 to BLK4 can move up and down independently by the needles NDL4 to NDL1. The needles NDL4 to NDL1 are driven by motors M1 to M4, which will be described later. The planar shape of the concentric square blocks BLK1 to BLK4 is configured to match the shape of the die D.

For example, the pushing unit TU simultaneously pushes up the blocks BLK1 to BLK4, and then also pushes up the blocks BLK2 to BLK4 at the same time, and then further pushes up the blocks BLK3 and BLK4 at the same time, and then further , Block BLK4 is pushed up to form a pyramid, or blocks BLK1 to BLK4 are pushed up simultaneously and then lowered in order of block BLK1, block BLK2, and block BLK3. The latter is referred to as RMS (Reverse Multi Step) in the present disclosure.

The operation of the RMS will be described with reference to FIGS. 3 and 4 . Fig. 3 is a cross-sectional view showing an example of an RMS push-up sequence, Fig. 3 (a) is a view showing a first state, Fig. 3 (b) is a view showing a second state, Fig. 3 ( c) is a diagram illustrating a third state, and FIG. 3(d) is a diagram illustrating a fourth state. Fig. 4 is a view for explaining an example of a first time chart recipe of the sequence of Fig. 3, Fig. 4 (a) is a view showing an example of block operation timing of the sequence of Fig. 3, Fig. 4 (b) FIG. 4A is a diagram showing an example of a time chart recipe corresponding to the block operation timing of FIG. 4A .

The pick-up operation starts from the part where the target die D on the dicing tape DT is positioned by the push-up unit TU and the collet CLT. When positioning is completed, the dicing tape DT is adsorbed to the upper surface of the push-up unit TU by vacuuming with a suction hole and a gap (not shown) of the push-up unit TU. At this time, the upper surfaces of the blocks BLK1 to BLK4 are at the same height (initial position) as the upper surface of the dome plate DP. In that state, a vacuum is supplied from the vacuum supply source, and the collet CLT descends and lands while evacuating toward the device surface of the die D.

Thereafter, as shown in FIG. 3A , the blocks BLK1 to BLK4 simultaneously rise to a predetermined height h1 at a constant speed s1 to become the first state State1. Here, if the time for which blocks BLK1 to BLK4 reach h1 is t1 as shown in Fig. 4A, t1 = h1/s1. After that, it waits for a predetermined time t2. The die D rises while being sandwiched between the collet CLT and the blocks BLK1 to BLK4, but the periphery of the dicing tape DT is vacuum-adsorbed by the dome plate DP, which is the periphery of the push-up unit TU, Tension is generated in the periphery of the die D, and as a result, peeling of the dicing tape DT is started in the periphery of the die D.

Subsequently, as shown in FIG. 3B , the block BLK1 descends at a constant speed s2 to a predetermined height (-h2) below the upper surface of the dome plate DP, and enters the second state (State2). becomes Here, if the time for which the block BLK1 reaches a predetermined height (-h2) is t3 as shown in Fig. 4A, t3 = (h1+h2)/s2. When the block BLK1 goes down from the upper surface of the dome plate DP, the support of the dicing tape DT disappears, and peeling of the dicing tape DT proceeds by the tension of the dicing tape DT.

Subsequently, as shown in FIG. 3(c), the block BLK2 descends at a constant speed s2 to a predetermined height (-h2) below the upper surface of the dome plate DP, and enters the third state (State3). becomes Here, if the time for which the block BLK2 reaches a predetermined height (-h2) is t4 as shown in Fig. 4(a), t4 = (h1+h2)/s2. When the block BLK2 goes lower than the upper surface of the dome plate DP, the support of the dicing tape DT disappears, and the peeling of the dicing tape DT further proceeds by the tension of the dicing tape DT.

Subsequently, as shown in Fig. 3(d), the block BLK3 descends at a constant speed s2 to a predetermined height (-h2) below the upper surface of the dome plate DP, and enters the fourth state (State4). becomes Here, if the time for which the block BLK3 reaches a predetermined height (-h2) is t5 as shown in Fig. 4A, t5 = (h1+h2)/s2. When the block BLK3 descends lower than the upper surface of the dome plate DP, the support of the dicing tape DT disappears, and peeling of the dicing tape DT further proceeds by the tension of the dicing tape DT.

After that, the collet CLT is pulled upward. Further, as shown in Fig. 4(a), after a predetermined time t6 from the fourth state, blocks BLK1 to BLK3 rise at a constant speed s3, and block BLK4 descends at a constant speed s4 to their initial position. is returned to Here, if the time for the blocks BLK1 to BLK3 to reach the initial position is t8, t8 = h2/s3, and if the time for the blocks BLK4 to reach the initial position is t9, then t9 = h1/s4. Thereby, the operation|work which peels the die|dye D from the dicing tape DT is completed.

Next, a setting method and control of the operation of the RMS will be described with reference to FIG. 4 .

As shown in Fig. 4(b), the operation of each block BLK1, BLK2, BLK3, BLK4 of the push-up unit TU, for each block and for each step, the time of the step, the speed of rising or falling of the block, the block Based on the time chart recipe in which the height (position) is set, the main controller 81a and the operation controller 81b respectively drive the blocks BLK1, BLK2, BLK3, BLK4 through the needles NDL4, NDL3, NDL2, and NDL1. Motor M1 to M4.

A plurality of time chart recipes with different setting items are prepared, and the user selects one time chart recipe from the plurality of time chart recipes by means of a graphical user interface (GUI), and inputs a set value to the selected time chart recipe item. do. Alternatively, the user transmits the time chart recipe to which preset values are inputted from an external device to a semiconductor manufacturing apparatus such as a die bonder, or an external storage device (eg, magnetic tape, magnetic tape, flexible disk, or hard disk, etc.). disk, an optical disk such as a CD or DVD, a magneto-optical disk such as an MO, and a semiconductor memory such as a USB memory or a memory card) in a semiconductor manufacturing apparatus. In addition, the main controller 81a rewrites the time chart recipe in real time based on the state detected by the sensors 87a, 87b, and 87c or the wafer peel force obtained from the torque amount to be described later, and instructs the operation controller 81b to It is possible to change the push-up action.

Next, measurement of the peeling force of a wafer is demonstrated using FIG. Fig. 5 is a block diagram showing the motor and operation controller of the push-up unit.

Motors M1 to M4 of the push-up unit TU include, for example, an AC servo motor or an α-step pulse motor (a stepping motor of hybrid control that normally performs open-loop control and performs closed-loop control during overload). use. The motors M1 to M4 each include an encoder (rotation detector) Ma for detecting the rotation angular velocity and a current sensor Mb for obtaining the motor current.

First, as shown in FIG. 2 , the operation controller 81b pushes the push-up unit TU away from the dicing tape DT (no-load state) according to the sequence at the time of the push-up operation. Blocks BLK1 to BLK4 of the unit TU are operated by motors M1 to M4.

And in the no-load state, for each rotation angle of the motors M1 to M4 detected by the encoder Ma provided in the motors M1 to M4, the current detected by the current sensor Mb (based on the load received by the motors M1 to M4 motor current), the no-load torque value is measured by the operation controller 81b.

Next, the operation controller 81b moves the push-up unit TU in the upward direction, contacts the dicing tape DT, and sets it as a state (loaded-load state) as shown in FIG. The operation controller 81b operates the blocks BLK1 to BLK4 of the push-up unit TU by the motors M1 to M4 according to the sequence at the time of the push-up operation.

And in the load state, for each rotation angle of the motors M1 to M4 detected by the encoder Ma provided in the motors M1 to M4, the current detected by the current sensor Mb (based on the load received by the motors M1 to M4) from the motor current), the load torque value is measured by the operation controller 81b.

Next, the operation controller 81b subtracts the no-load torque value from the loaded torque value in the loaded torque value and no-load torque value for each angle of the motors M1 to M4 in the sequence at the time of the push-up operation, The torque value in the push-up operation sequence is calculated.

In this way, when calculating the torque value in the push-up operation sequence, the block BLK1 included in the push-up unit TU included in the loaded torque value and the no-load torque value by using the no-load torque value that is an actual measured value. It is possible to eliminate errors due to the reaction force of the push-up tool such as a spring pushing down the BLK4, the influence from the winding structure of the motors M1 to M4, and the mechanism friction force in the push-up unit TU. Thereby, the torque value in a push-up operation sequence can be calculated correctly. This torque value is the load applied to the wafer (dicing tape DT), and the peeling load (peel force) at the time of wafer peeling can be measured.

Next, an example of accumulating the measured peel force and the like, obtaining the push-up condition by machine learning, and performing automatic setting will be described with reference to FIGS. 6 to 7 . 6 is a diagram for explaining the concept of offline machine learning of peel force and peel state. Fig. 6 (a) is a diagram schematically showing a block of the push-up unit and a die affixed to a dicing tape, and Fig. 6 (b) is a diagram schematically showing an imaging of the back surface of the die, Fig. 6(c) is a view showing the time transition of the peeling load, Fig. 6(d) is an image obtained by capturing the back surface of the die through the dicing tape, and Fig. 6(e) is the peeling load and peeling It is a figure which shows the accumulation|storage of data of a state typically. In Fig. 6(d), the white portion in the die D is the peeling portion PL peeled from the dicing tape DT, and the hatched portion is the non-peelable portion not peeled from the dicing tape DT ( NPL). It is a figure explaining the concept of calculating|requiring the peeling state by machine learning.

Off-line, the die D affixed to the dicing tape DT is pushed up by the block part BLK of the pushing unit shown to Fig.6 (a). At that time, in each of the first to fourth states shown in FIGS. 3A to 3D, the peel force of the die D by the torque value as shown in FIG. 6A and , the die D is imaged from below the dicing tape 16 by an imaging device as shown in Fig. 6(b), and the die D as shown in Fig. 6(d) is peeled off measure the state. As shown in Fig. 6(e), the measured peeling force of the die D and the peeling state of the die D are measured under the pushing-up conditions (push-up height, push-up speed, pick-up timer, etc.) , along with parameters such as die size and die thickness, are accumulated in the database DB as a data set. A machine learning model is generated by modeling the peel force of the die and the peeling state of the die corresponding to these operating conditions by machine learning.

Next, as shown in FIG. 7, operating condition parameters such as peel force of the die, push-up conditions (push-up height, push-up speed, pick-up timer, etc.), die size, and die thickness are applied to the machine learning model as shown in FIG. By giving, it is possible to obtain the peeling state of the die.

An optimal parameter calculation method will be described with reference to FIGS. 8 and 9 . Fig. 8 is a diagram for explaining a peeling state, Fig. 8 (a) is a diagram showing a peeling state that has not been sufficiently peeled, and Fig. 8 (b) is a diagram showing a peeling state having sufficiently peeled. to be. In Fig. 8, the white portion in the block is the portion where the die is peeled off from the dicing tape, and the hatched portion is the portion where the die is not peeled off from the dicing tape. It is a figure explaining the method of calculating a push-up condition from the peeling state calculated|required by the machine learning model.

In the die peeling state calculated|required from the peeling force of a die|dye, if the peeling part PL is expanded to the extent of the external shape of a push-up block, it is judged that it peels enough. Here, the push-up block external shape in FIG. 8 means the outer edge of block BLK2. In Fig. 8(a), the peeling of the die hardly reaches the end of the outer side of the block BLK2 and thus is not sufficiently peeled, but in Fig. 8(b), the peeling of the die reaches all of the outer end of the block BLK2, sufficiently peeled off. In the peeling state as shown in Fig. 8(b), it is considered that the stress on the die will be minimized even if the pushing operation of the next stage block is shifted.

In each block, the total time taken for pickup is the shortest from the combination of possible push-up conditions (elevation height, push-up speed, pick-up timer, etc.) in which the amount of peeling at each step is sufficiently peeled (to the extent of the block outline described above). This combination is obtained, and the optimum pushing condition for the variety is obtained from the peel force of the die. For example, as shown in FIG. 9, the peeling result in the combination of a push-up height and a push-up speed is calculated|required. In STEP1 shown to Fig.9 (a), let the combination of height "300" and speed "1" be a pickup condition. In STEP2 shown in FIG.9(b), let the combination of height "300" and speed "3" be a push-up condition. In STEP3 shown in FIG.9(c), let the combination of height "200" and speed "3" be a push-up condition. In STEP4 shown in FIG.9(d), let the combination of height "100" and speed "5" be a push-up condition. Here, in the peeling result shown in FIG. 9, "x" has shown that it has not peeled enough, and "circle" has shown that it has peeled enough.

For example, as shown in FIG. 9 , all the peeling states in combinations conceivable within the upper limit from the lower limit of the parameters of the push-up conditions are obtained, and the combination with the shortest pickup time is considered as round robin. It is calculated by an evolutionary algorithm such as a genetic algorithm. Thereby, it is possible to automatically calculate parameters, such as a push-up condition, by trial and error based on the operator's experience, and it is also possible to automate the setting for a recipe.

According to embodiment, one or more effects shown below are acquired.

(a) The control unit calculates the load torque at the time of pushing up from the current value required for the operation specified for each motor. That is, since the torque applied to the block is measured by measuring the torque in the motor itself, a sensor such as a load cell is not required, and the mechanism in the push-up unit can be simplified.

(b) Since the torque can be measured for each motor M1 to M4, it becomes possible to independently measure the load applied to each block BLK1 to BLK4.

(c) Since the load can be measured for each block, it becomes possible to measure the peeling force at the time of pushing up each block.

(d) It becomes possible to detect abnormality of a pick-up operation|movement by performing peeling force measurement for every peeling of a die|dye, and comparing it with peeling of the die|dye which measured and memorize|stored beforehand. Thereby, a control part notifies an operator of replacement|exchange of the dome or collet of a push-up unit, and when it has a self-preservation function, such as automatic exchange of the dome or collet of a push-up unit, it becomes possible to perform self-preservation.

(e) By measuring the peeling force for each peeling of the die and setting a time chart recipe based on the measured peeling force, it becomes possible to feed back to the motor control to always perform the same peeling operation.

(f) By carrying out peel force measurement for each wafer to be picked up, it becomes possible to detect abnormality (dicing defect, tape deterioration, etc.) of a previous process.

(g) By measuring the peel force, accumulating data, obtaining the push-up conditions by machine learning, and automatically setting the time chart recipe, it becomes possible to automatically teach the push-up conditions.

Example

It is a top view which shows the outline of the die bonder in an Example. It is a figure explaining the operation|movement of a pickup head and a bonding head, when it sees from the arrow A direction in FIG.

The die bonder 10 is largely divided into a die supply unit 1 for supplying a die D mounted on a substrate S, a pickup unit 2 , an intermediate stage unit 3 , and a bonding unit 4 . and a transfer unit 5 , a substrate supply unit 6 , a substrate discharging unit 7 , and a control unit 8 for monitoring and controlling the operation of each unit. The Y-axis direction is the front-back direction of the die bonder 10, and the X-axis direction is the left-right direction. The die supply section 1 is disposed in front of the die bonder 10 , and the bonding section 4 is disposed inside. Here, a product area (hereinafter, referred to as a package area P) that becomes one or a plurality of final packages is printed on the substrate S.

First, the die supply unit 1 supplies the die D to be mounted in the package area P of the substrate S. The die supply unit 1 includes a wafer holder 12 for holding the wafer 11 , and a pushing-up unit 13 indicated by a dotted line for pushing up the die D from the wafer 11 . The die supply unit 1 is moved in the XY-axis direction by driving means (not shown), and the die D to be picked up is moved to the position of the push-up unit 13 .

The pickup part 2 includes a pickup head 21 that picks up the die D, a Y drive part 23 of the pickup head that moves the pickup head 21 in the Y-axis direction, and the collet 22 is raised and lowered, It has each drive part (not shown) which rotates and moves in an X-axis direction. The pick-up head 21 has a collet 22 (refer also to FIG. 11) which adsorb|sucks and holds the pushed-up die D at the front end, picks up the die D from the die supply part 1, and an intermediate stage (31) is loaded. The pick-up head 21 has each drive part (not shown) which moves the collet 22 in raising/lowering, rotation, and an X-axis direction.

The intermediate stage unit 3 has an intermediate stage 31 on which the die D is temporarily mounted, and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31 .

The bonding part 4 picks up the die D from the intermediate stage 31 and bonds it on the package area P of the board|substrate S being conveyed, or the package area P of the board|substrate S already. ) in the form of stacking on the bonded die. The bonding unit 4 includes a bonding head 41 provided with a collet 42 (refer also to FIG. 11 ) for adsorbing and holding the die D at the tip, similarly to the pickup head 21, and the bonding head 41. has a Y drive unit 43 for moving in the Y-axis direction, and a substrate recognition camera 44 for recognizing a bonding position by imaging a position recognition mark (not shown) in the package area P of the substrate S. .

With this configuration, the bonding head 41 corrects the pickup position and posture based on the imaging data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, and the substrate recognition camera ( 44), the die D is bonded to the substrate based on the imaging data.

The conveyance part 5 has the board|substrate conveyance claw 51 which hold|grips and conveys the board|substrate S, and the conveyance lane 52 to which the board|substrate S moves. The board|substrate S moves by driving the nut (not shown) of the board|substrate conveyance claw 51 provided in the conveyance lane 52 with the ball screw (not shown) provided along the conveyance lane 52. As shown in FIG. With this configuration, the substrate S moves from the substrate supply unit 6 along the conveyance lane 52 to the bonding position, and after bonding, moves to the substrate discharging unit 7 , and the substrate S is transferred to the substrate discharging unit 7 . (S) is transmitted.

Next, the structure of the die supply part 1 is demonstrated using FIG. 12 and FIG. 13. FIG. 12 is a view showing an external perspective view of the die supply unit of FIG. 10 . Fig. 13 is a schematic cross-sectional view showing a main part of the die supply section of Fig. 10;

The die supply unit 1 includes a wafer holder 12 that moves in the horizontal direction (XY axis direction), and a push-up unit 13 that moves in the vertical direction. The wafer holder 12 includes an expand ring 15 for holding the wafer ring 14 and a dicing tape 16 held by the wafer ring 14 and to which a plurality of dies D are adhered. It has a support ring 17 for horizontal positioning. The push-up unit 13 is disposed on the inside of the support ring 17 .

The die supply unit 1 lowers the expand ring 15 holding the wafer ring 14 when the die D is pushed up. As a result, the dicing tape 16 held by the wafer ring 14 is stretched, the distance between the dies D is enlarged, and the dies D are moved from below the dies D by the push-up unit 13 . ) is pushed up, and the pick-up property of the die (D) is improved. In addition, the adhesive for adhering the die to the substrate changes from liquid to film, and a film-form adhesive material called a die attach film (DAF) 18 is affixed between the wafer 11 and the dicing tape 16 . . In the wafer 11 having the die attach film 18 , dicing is performed on the wafer 11 and the die attach film 18 . Therefore, in the peeling process, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16 . In addition, below, the presence of the die attach film 18 is ignored, and a peeling process is demonstrated.

Next, the push-up unit 13 is demonstrated using FIGS. 14-19. Fig. 14 is an external perspective view of the push-up unit according to the embodiment. FIG. 15 is a top view of a portion of the first unit of FIG. 14 ; FIG. 16 is a top view of a portion of the second unit of FIG. 14 ; FIG. 17 is a top view of a portion of a third unit of FIG. 14 ; Fig. 17 is a longitudinal sectional view of the push-up unit of Fig. 14; Fig. 19 is a longitudinal sectional view of the push-up unit of Fig. 14;

The push-up unit 13 includes a first unit 13a, a second unit 13b to which the first unit 13a is mounted, and a third unit 13c to which the second unit 13b is mounted. do. The second unit 13b and the third unit 13c are common parts irrespective of the kind, and the first unit 13a is a replaceable part for each kind.

The first unit 13a has a block portion 13a1 having blocks A1 to A4, a dome plate 13a2 having a plurality of suction holes, a suction hole 13a3, and a dome suction suction hole 13a4, , converts the vertical motion of the concentric circular blocks B1 to B4 of the second unit 13b into the vertical motion of the four concentric square blocks A1 to A4. Here, blocks A1 to A4 correspond to blocks BLK1 to BLK4 of the embodiment. The four blocks A1 to A4 can move up and down independently. The planar shape of the concentric square blocks A1 to A4 is configured to match the shape of the die D. When the die size is large, the number of concentric square blocks is greater than four. This is made possible by the plurality of output units of the third unit and the concentric circular blocks of the second unit moving up and down (not moving up and down) independently of each other. The push-up speed and push-up amount of the four blocks A1 to A4 can be programmably set.

The second unit 13b has cylindrical blocks B1 to B6 and an outer periphery 13b2, and six blocks of concentric circles for vertical motion of the output units C1 to C6 disposed on the circumference of the first unit 13a. Converts to vertical movement of B1 to B6. Six blocks B1 to B6 can independently move up and down. Here, since the first unit 13a has only four blocks A1 to A4, blocks B5 and B6 are not used.

The third unit 13c has a central portion 13c0 and six peripheral portions 13c1 to 13c6. The central part 13c0 has six output parts C1 to C6 which are arranged at equal intervals on the circumference of the upper surface and move up and down independently. The peripheral parts 13c1 to 13c6 can drive the output parts C1 to C6 independently of each other, respectively. The peripheral portions 13c1 to 13c6 are provided with motors M1 to M6, respectively, and the central portion 13c0 is provided with a plunger mechanism P1 to P6 for converting the rotation of the motor into a vertical movement by a cam or a link. The plunger mechanisms P1 to P6 impart vertical movement to the output sections C1 to C6. Also, the motors M2 and M5 and the plunger mechanisms P2 and P5 are not shown. Here, since the first unit 13a has only four blocks A1 to A4, the peripheral portions 13c5 and 13c6 are not used. Accordingly, the motors M5 and M6, the plunger mechanisms P5 and P6, and the outputs C5 and C6 are not used. The plunger mechanisms P1 to P4 correspond to the needles NDL4 to NDL1 of the embodiment.

Next, the relationship between a push-up unit and a collet is demonstrated using FIG. Fig. 20 is a diagram showing the configuration of a collet part of the push-up unit and the pickup head according to the embodiment.

As shown in Fig. 20, the collet part 20 includes a collet 22, a collet holder 25 for holding the collet 22, and a suction hole ( 22v, 25v). The adsorption surface for adsorbing the die of the collet 22 is approximately the same size as the die D.

The first unit 13a has a dome plate 13a2 on its upper surface periphery. The dome plate 13a2 has a plurality of suction holes HL and cavities CV, and sucks from the suction holes 13a3 , the die Dd around the die D picked up by the collet 22 . It is sucked through the dicing tape 16 . In Fig. 16, only one row of suction holes HL is shown around the block portion 13a1, but a plurality of rows are provided in order to stably hold the die Dd that is not a pickup target. Suctioned from the suction hole 13a4 of the dome suction through the gaps A1v, A2v, A3v between each block of the concentric square blocks A1 to A4 and the cavity in the dome of the first unit 13a, and picked up by the collet 22 The die D is sucked through the dicing tape 16 . Suction from the suction hole 13a3 and suction from the suction hole 13a4 can be performed independently.

The push-up unit 13 of this embodiment is applicable to various dies by changing the shape and number of blocks of the first unit. For example, when the number of blocks is 6, the die size is 20 mm on one side. Applicable to dies of square or smaller size. By increasing the number of output sections of the third unit, the number of concentric circular blocks of the second unit, and the number of concentric square blocks of the first unit, it is also applicable to a die having a die size larger than a square having a side of 20 mm.

Next, the control part 8 is demonstrated using FIG. Fig. 21 is a block diagram showing a schematic configuration of a control system of the die bonder of Fig. 10; The control system 80 includes a control unit 8 , a driving unit 86 , a signal unit 87 , and an optical system 88 . The control unit 8 is largely divided into a control/arithmetic unit 81 mainly composed of a CPU (Central Processor Unit), a storage unit 82, an input/output unit 83, a bus line 84, It has a power supply (85). The control/arithmetic device 81 and the storage device 82 correspond to the main controller 81a of the embodiment, and the motor control device 83e corresponds to the operation controller 81b of the embodiment. The storage device 82 is a main storage device 82a composed of RAM storing a processing program and the like, and an auxiliary storage device composed of an HDD, an SSD, etc. which store control data and image data necessary for control. (82b). The input/output device 83 includes a monitor 83a for displaying device status and information, a touch panel 83b for inputting instructions from an operator, a mouse 83c for operating the monitor, and an optical system 88 . It has an image introducing device 83d for introducing image data. In addition, the input/output device 83 includes a motor control device 83e that controls a driving unit 86 such as an XY table (not shown) of the die supply unit 1 or a ZY driving shaft of the bonding head table, and various sensor signals and illumination. An I/O signal control device 83f for introducing or controlling a signal from a signal unit 87 such as a switch or the like is provided. The optical system 88 includes a wafer recognition camera 24 , a stage recognition camera 32 , and a substrate recognition camera 44 . The control/arithmetic device 81 introduces and calculates necessary data via the bus line 84, and sends information to the control of the pickup head 21 and the like, the monitor 83a, and the like.

The control unit 8 stores image data captured by the wafer recognition camera 24 , the stage recognition camera 32 , and the substrate recognition camera 44 via the image introduction device 83d in the storage device 82 . Positioning of the package area P of the die D and the substrate S using the control/arithmetic device 81 by software programmed based on the saved image data, and the die D and the substrate S S) surface inspection is performed. Based on the positions of the package area P of the die D and the substrate S calculated by the control/arithmetic unit 81, the driving unit 86 is moved through the motor control unit 83e by software. By this process, the position of the die on the wafer is determined, and the drive unit of the pickup unit 2 and the bonding unit 4 is operated to bond the die D onto the package area P of the substrate S. The wafer recognition camera 24, the stage recognition camera 32, and the substrate recognition camera 44 used are grayscale, color, etc., and quantify the light intensity.

Next, the pick-up operation by the push-up unit 13 by the structure mentioned above is demonstrated using FIG. It is a flowchart which shows the processing flow of a pick-up operation.

First, the control unit 8 measures the no-load torque value and the loaded torque value described above in advance, and stores the measured no-load torque value and the corrected torque value (or the measured loaded torque value) in a memory in the control unit 8, etc. Save it to your memory device.

(Step PS1: Adsorption of dicing tape)

The control unit 8 moves the wafer holder 12 so that the die D to be picked up is located directly above the push-up unit 13 , and the upper surface of the third unit is in contact with the back surface of the dicing tape 16 . The push-up unit 13 is moved. At this time, as shown in FIG. 11 , the control unit 8 causes each of the blocks A1 to A4 of the block portion 13a1 to form the same plane as the surface of the dome plate 13a2 , and the suction hole of the dome plate 13a2 . The dicing tape 16 is adsorbed by the gaps A1v, A2v, and A3v between (HL) and the blocks.

(Step PS2: collet lowering/die adsorption)

The control unit 8 lowers the collet unit 20, positions it on the die D to be picked up, and sucks the die D by the suction holes 22v and 25v.

(Step PS3: Block/Collet Rise)

The control part 8 raises the block of the block part 13a1 sequentially from the outside, and performs a peeling operation|movement. For example, the control part 8 drives the plunger mechanism P4 with the motor M4, raises only the outermost block A4 by several tens of micrometers - several hundred micrometers, and then lowers it and stops it. Ascent and descent rates are not constant. As a result, in the periphery of block A4, the raised part in which the dicing tape 16 protruded is formed, and a minute space, ie, peeling origin, arises between the dicing tape 16 and the die attach film 18. . By this space, the anchor effect, ie, the stress applied to the die D, is greatly reduced, and the subsequent peeling operation can be reliably performed. Next, the control part 8 drives the plunger mechanism P3 by the motor M3, and raises only the outer block A3 higher than the block A4 secondly, and stops it. Next, the control part 8 drives the plunger mechanism P2 by the motor M2, 3rdly raises only the outer block A2 higher than the block A3, and stops it. Finally, the control part 8 drives the plunger mechanism P1 with the motor M1, raises only the innermost block A1 higher than the block A2, and stops it. At the time of this peeling operation, the control part 8 measures a load torque value for every block, and measures a torque value (peel force of a wafer) from the measured load torque value and a pre-recorded no-load torque value. Further, the control unit 8 compares the measured torque value (peel force of the wafer) with a previously recorded torque value (peel force of the wafer) to determine whether there is an abnormality. The torque value measurement and abnormality determination are performed only for the die initially picked up for each wafer.

(Step PS4: Raise the collet)

The control unit 8 raises the collet. In the last state of step PS3, the contact area of the dicing tape 16 and the die D becomes an area that can be peeled by raising the collet, and the die D is peeled by raising the collet 22. can

(Step PS5: Block Lowering/Suction Release)

The control unit 8 causes each of the blocks A1 to A4 of the block portion 13a1 to form the same plane as the surface of the dome plate 13a2, and the suction hole HL of the dome plate 13a2 and the gap A1v between the blocks. , A2v, and A3v stop adsorption|suction of the dicing tape 16. The control unit 8 moves the pushing unit 13 so that the upper surface of the first unit is spaced apart from the rear surface of the dicing tape 16 .

The control unit 8 repeats steps PS1 to PS5 to pick up a non-defective die of the wafer 11 .

Next, the manufacturing method of the semiconductor device using the die bonder which concerns on Example is demonstrated using FIG. 23 is a flowchart illustrating a method of manufacturing a semiconductor device using the die bonder of FIG. 10 .

(Step BS11: wafer/substrate loading process)

The wafer ring 14 holding the dicing tape 16 to which the die D divided from the wafer 11 is affixed is stored in a wafer cassette (not shown), and loaded into the die bonder 10 . The control unit 8 supplies the wafer ring 14 from the wafer cassette filled with the wafer ring 14 to the die supply unit 1 . Moreover, the board|substrate S is prepared and it carries in the die bonder 10. The control part 8 attaches the board|substrate S to the board|substrate conveyance claw 51 in the board|substrate supply part 6 .

(Step BS12: Pickup process)

The control unit 8 peels the die D as described above, and picks up the peeled die D from the wafer 11 . In this way, the die D peeled from the dicing tape 16 together with the die attach film 18 is adsorbed and held by the collet 22, and is conveyed to the next process (step BS13). And when the collet 22 which conveyed the die D to the next process returns to the die supply part 1, according to the above-mentioned procedure, the next die D is peeled from the dicing tape 16, and thereafter, the same Dies D are peeled off one by one from the dicing tape 16 according to the procedure of

(Step BS13: bonding process)

The control unit 8 stacks the picked-up die on the die mounted or already bonded on the substrate S. The control unit 8 loads the die D picked up from the wafer 11 on the intermediate stage 31 , and again picks up the die D from the intermediate stage 31 with the bonding head 41 , and has been conveyed. Bonding to the substrate (S).

(Step BS14: Substrate unloading process)

The control part 8 takes out the board|substrate S to which the die|dye D was bonded from the board|substrate conveyance claw 51 in the board|substrate carrying-out part 7. As shown in FIG. The substrate S is taken out from the die bonder 10 .

As described above, the die D is mounted on the substrate S through the die attach film 18 and carried out from the die bonder. Thereafter, in the wire bonding process, it is electrically connected to the electrode of the substrate S through the Au wire. Subsequently, the substrate S on which the die D is mounted is loaded into the die bonder, and the second die D is formed on the die D mounted on the substrate S through the die attach film 18. After being laminated and taken out from the die bonder, it is electrically connected to the electrode of the substrate S through the Au wire in the wire bonding process. After peeling from the dicing tape 16 by the above-mentioned method, the 2nd die D is conveyed to a pellet installation process, and is laminated|stacked on the die D. After the above process is repeated a predetermined number of times, the substrate S is transferred to the molding process, and the plurality of dies D and the Au wires are sealed with a mold resin (not shown) to complete the laminate package.

As mentioned above, although the invention made|formed by this inventor was specifically demonstrated based on embodiment and an Example, this invention is not limited to the said embodiment and Example, It goes without saying that various modifications are possible.

For example, although multi-axis push-up was described as an example in the embodiment, single-axis push-up may be used.

In addition, although it has been described that the plurality of blocks of the first unit are concentric quadrilaterals, concentric circles or concentric ellipses may be used, and quadrangular blocks may be arranged in parallel and configured.

In addition, although an example of pushing up the die with a block has been described in the embodiment, the die may be pushed up with a pin.

Incidentally, although the pick-up object die and the peripheral die are sucked/released at the same timing in the embodiment, the pick-up object die and the peripheral die may be sucked/released at the respective timings. Thereby, more reliable peeling can be performed.

In addition, although the blocks of each stage are pushed up sequentially in the embodiment, since each stage is independent and each operation is possible, the operation in both directions of pushing up/down may be mixed.

Incidentally, although an example has been described in which the torque value measurement and abnormality determination are performed only for the die to be initially picked up for each wafer, it may be performed for each die to be picked up. Thereby, an abnormality due to the influence of dicing in which the die is separated from the wafer can also be confirmed.

In addition, although the example in which the die attach film is used is described in the Example, it is not necessary to use a die attach film by providing the preform part which apply|coats an adhesive agent to a board|substrate.

Further, in the embodiment, a die bonder that picks up a die from the die supply unit with a pickup head, loads it on an intermediate stage, and bonds the die mounted on the intermediate stage to a substrate with a bonding head, has been described, but it is not limited thereto, It is applicable to a semiconductor manufacturing apparatus which picks up a die from a die supply part.

For example, it is also applicable to a die bonder that does not have an intermediate stage and a pickup head, and bonds the die of the die supply unit to the substrate with the bonding head.

Further, it is applicable to a flip chip bonder that has no intermediate stage, picks up the die from the die supply unit, rotates the die pickup head upward to transfer the die to the bonding head, and bonds to the substrate with the bonding head.

Further, it is applicable to a die sorter that does not have an intermediate stage and a bonding head, and loads the die picked up from the die supply unit to the pickup head on a tray or the like.

8: control
10: die bonder (die bonding device)
11: Wafer
13: push-up unit
16: dicing tape
22: collet
D: die
M1 to M4: motor

Claims (18)

a pushing unit having a plurality of blocks in contact with the dicing tape and pushing up a die from below the dicing tape;
a collet adsorbing the die;
a control unit configured to control the push-up unit
to provide
The push-up unit includes a plurality of drive shafts independently operated corresponding to the plurality of blocks, and a plurality of motors corresponding to the plurality of drive shafts,
and the control unit is configured to measure the peel force of the die by measuring a torque value for each motor. According to claim 1,
The motor is an AC servo motor,
The motor of the push-up unit further includes an encoder for detecting the rotation angular speed of the motor, and a current sensor for obtaining a current of the motor,
The control unit operates the plurality of blocks by the motor according to a sequence at the time of a push-up operation in a no-load state in which the push-up unit is separated from the dicing tape, and the motor detected by the encoder and calculating a no-load torque value in the operation of the plurality of blocks based on the current detected by the current sensor for each rotation angle of . 3. The method of claim 2,
The control unit operates the plurality of blocks by the motor in accordance with a sequence at the time of the push-up operation in a loaded state in which the push-up unit is brought into contact with the dicing tape, and is detected by the encoder. For each rotation angle of the motor, based on the current detected by the current sensor, calculating the load torque value in the operation of the plurality of blocks,
and measure the torque value based on the loaded torque value and the no-load torque value. 4. The method according to any one of claims 1 to 3,
The control unit is configured to determine whether there is an abnormality by comparing the measured torque value with a previously recorded torque value. 4. The method of claim 3,
The control unit is configured to measure the peeling force by subtracting the previously measured no-load torque value from the loaded torque value. According to claim 1,
Further comprising an imaging device for imaging the die through the dicing tape,
The control unit is
Offline, the peel force of the die by the torque value measured by pushing up the die by the block, and the peeling state of the die measured by imaging the back surface of the pushed up die by the imaging device offline, Accumulated in a database as a data set together with parameters including push-up conditions at the time of measurement, die size and die thickness,
generating a machine learning model by modeling the peel force, the peel state, and the parameters by machine learning;
The machine learning model is given parameters including the peel force of the die, the pushing condition, the die size and the die thickness to obtain the peeling state of the die;
The die bonding apparatus which is comprised so that a push-up condition may be computed based on the said acquired peeling state. 7. The method of claim 6,
The push-up condition is a method or an evolutionary algorithm that obtains the peeling state in all combinations conceivable within the upper limit from the parameter lower limit of the push-up condition, and examines the combination with the shortest pick-up time in round robin. A die bonding apparatus, configured to calculate by 8. The method of claim 7,
The push-up condition is a push-up height and a push-up speed of the block, die bonding device. According to claim 1,
The control unit is configured to change the pushing-up condition of the block based on the measured torque value. 10. The method of claim 9,
The push-up condition is a push-up speed and a push-up height of the block, a die bonding device. According to claim 1,
The die bonding apparatus further comprising a pickup head to which the collet is mounted. 12. The method of claim 11,
an intermediate stage for loading the die picked up by the pickup head;
A bonding head for bonding a die loaded on the intermediate stage onto a substrate or a die that has already been bonded
Further comprising a, die bonding device. (a) a pushing unit having a plurality of blocks in contact with the dicing tape and pushing up a die from below the dicing tape, a collet for adsorbing the die, and a control unit configured to control the pushing unit; wherein the push-up unit holds the dicing tape in a die bonding apparatus including a plurality of drive shafts independently operated corresponding to the plurality of blocks, and a plurality of motors corresponding to the plurality of drive shafts A process of carrying in the supporting wafer ring;
(b) step of pushing up the die with the push-up unit and picking up the die with the collet
to provide
In the step (b), the peel force of the die is measured by measuring a torque for each motor. 14. The method of claim 13,
In the step (b), it is determined whether there is an abnormality by comparing the measured torque value with a previously recorded torque value. 15. The method of claim 14,
In the step (b), a torque measurement value in a state in which the block is not in contact with the dicing tape, measured in advance, is subtracted from the torque measurement value in a state in which the block is in contact with the dicing tape. The manufacturing method of the semiconductor device which measures the said peeling force by doing. 14. The method of claim 13,
In the step (b), the conditions for pushing up the block are changed based on the measured torque value. 14. The method of claim 13,
(c) bonding the die onto a substrate or an already bonded die. 17. The method of claim 16,
The step (b) further includes a step of loading the picked-up die on an intermediate stage,
The method of manufacturing a semiconductor device, wherein the step (c) further includes a step of picking up the die from the intermediate stage.

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