JPH04115146A - Inspecting device for soldering and soldering inspection correction apparatus provided with same - Google Patents

Abstract

PURPOSE:To achieve an inspection of incomplete parts of a solder pattern by binary coding an image signal of the rear taken of a printed packaged substrate to compute an area ratio of a black or white pattern of a binary coded image of a portion corresponding to a soldered part. CONSTITUTION:When a printed packaged substrate 2 is placed on a transporting conveyor 1 with the rear thereof downward, the rear of the substrate 2 is taken with a camera device 6 while an image signal from the camera device 6 is binary coded with an image processor 9. Subsequently, a binary coded image is extracted with the image processor 9 at a portion corresponding to a soldered part of the substrate 2 and an area ratio of a black or white pattern in the binary coded image of the portion is compared with a reference value for judging the quality of the soldering to detect a pit point caused by incomplete soldering. In other words, when the soldering is incomplete, the pit points are displayed as black pattern to increase the black area. Thus, a larger black area leads to a judgment that the soldering is incomplete thereby enabling automation of inspection of incomplete parts of the solder pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a soldering inspection device and a soldering inspection and correction device equipped with the soldering inspection device.

2. Description of the Related Art Conventionally, soldering of printed mounting boards has been efficiently carried out by applying the back side of the printed mounting board to a dip tank containing solder.

However, as this work progresses, there may be imperfections in the soldering, so after the printed mounting board is placed in the dip bath, the imperfect holes in the solder pattern are detected by hand or with the naked eye to determine whether the soldering is good or bad. Make a judgment and fix it with someone or a soldering iron,
A soldering robot automatically corrected soldering.

SUMMARY OF THE INVENTION However, the conventional soldering method described above requires time and labor to inspect imperfections in the solder pattern, resulting in inefficiency and an obstacle to automation.

The present invention solves the above-mentioned problems, and it is possible to efficiently inspect incomplete parts of a solder pattern without requiring much time or labor, and to automate the inspection of incomplete parts of a solder pattern, as well as the inspection and correction of soldering. It is an object of the present invention to provide a soldering inspection device and a soldering inspection correction device that can perform the following steps.

Means for Solving the Problems In order to solve the above problems, the soldering inspection device of the present invention has the following features:
a board mounting table on which a printed mounting board is placed facing the back side; an imaging device for capturing an image of the back side of the printed mounting board placed on the board mounting board; a moving device that moves relative to the board; a position control device that is connected to the moving device and controls the relative position of the imaging device and the printed mounting board on the board mounting table to a preset position; Binarize the image signal from the imaging device, extract a preset range corresponding to the soldered part in the binarized image, and calculate the area ratio of the black or white pattern in the binarized image at this location. The apparatus also includes an image processing device that compares this calculated value with a reference value for determining the quality of soldering to detect holes where soldering is incomplete.

Further, the soldering inspection/correction device of the present invention includes the soldering inspection device and a soldering device for soldering incomplete soldering locations on a printed mounting board based on incomplete soldering location data from the soldering inspection device. It is equipped with a device.

Effect With the above configuration, when a printed mounting board is placed with its back side facing the board mounting table, the imaging device captures an image of the backside of the printed mounting board, and the image processing device converts the image signal from the imaging device into a binary value. be converted into Then, the image processing device extracts a binarized image of the part corresponding to the soldered part on the printed mounting board, and determines the quality of the soldering based on the area ratio of the black or white pattern in the binarized image of this part. Incomplete soldering holes are detected by comparing with the reference value. In other words, if the soldering is incomplete, the perforated part is displayed as a black pattern and the area of the black part becomes large, so if the area of the black part is large, it is determined that the soldering is incomplete.

This makes it possible to automate the inspection of imperfections in the solder pattern.

In addition, by connecting a soldering device to this soldering inspection device to solder incomplete soldering points on a printed circuit board based on incomplete soldering point data from the soldering inspection device, soldering can be inspected. and modifications can be automated, - layer efficiency is achieved;

Example Hereinafter, one embodiment of the present invention will be described based on the drawings.

In FIG. 1, reference numeral 1 denotes a pair of transport conveyors for transporting printed mounting boards 2, and along the transport line of this transport conveyor I, an inspection station 3 and a correction station 4 are provided. Also, although not shown, a dip tank is placed upstream of the inspection station 3 in the conveyance line, and soldering work is carried out there.The printer 1 to the mounting board 2 are turned over by a reversing machine so that they face the back side or upward. It is being

The inspection station 3 has an industrial television camera (as an imaging device) attached to the head of the X-Y table 5.
There are 6 or 2 cameras (hereinafter abbreviated as ITV cameras), and each ITV camera is equipped with 6 or 2 cameras.
Circline lighting 7 is attached around the camera 6. ITV attached to X-Y table 5
The cameras 6 are movable in the X-Y directions within a horizontal plane within different areas, or are overlapped with each other. Each X-Y table 5 is connected to a position control device 8, and the position control device 8 divides the X-Y table 5 into positions in advance according to the type of printed circuit board 2 on the inspection station 3. The ITV camera 6 is moved to a plurality of predetermined positions. Each I
An image processing device 9 is connected to the TV camera 6, and this image processing device 9 binarizes the image signal and converts it into a specific range (e.g., a circle with a diameter of 2 to 3 mm) at a predetermined location in each field of view (e.g., 40 mm x 40 mm). A binarized image of the area) is extracted to determine whether the soldering condition is good or bad.

The repair station 4 is equipped with two soldering robots IIA and IIB as soldering devices. Each of the soldering robots IIA and IIB has a main arm part 12 that is movable in the X-Y direction and a tip arm part 13 that is rotatable in the a direction around the vertical axis, and one soldering robot IIA has a soldering iron tip. Soldering is performed using a second-generation soldering iron 14, and the other soldering robot IIB uses a soldering iron 15 with a 6 mm tip.
Perform soldering. Soldering robot IIA, 11B
are connected to sequencers 16 and 17, respectively, and their positions are controlled.

Further, in FIG. 1, reference numeral 21 denotes an output side processing device 22 connected to the position control device 8 and the image processing device 9, and sending position data such as incomplete soldering to the correction station 4 side via a communication line etc. soldering robot IIA, IIB
The output side processing device 21 is connected to the sequencer 1617 of
The input side processing device 22 is an input side processing device that inputs data from a printing device 23 .

Next, a process of inspecting incomplete soldering parts and a process of making corrections in the above configuration will be described.

When the printed mounting board 2 is transported to the inspection station 3, the ITV camera 6 is moved to a plurality of predetermined positions on the printed mounting board 2 stopped at the inspection station 3 position. The ITV camera 6 captures images of a plurality of locations on the back surface of the printed mounting board 2, and outputs image signals to the image processing device 9. At this time, if the ITV camera 6 is set to a normal aperture, the solder may become donut-shaped and appear connected (bridge state) when an image of an incompletely soldered spot is taken, so the ITV camera 6 is set to the aperture in the open state so that no halation occurs. Take an image with the camera in its upright position. The image processing device 9 binarizes the image signal from the ITV camera 6, extracts a range (target round) corresponding to the soldering setting location in the binarized image, and calculates the area ratio of the black pattern in this range. do. Then, this area ratio is compared with a predetermined standard value, and if the area ratio is lower than the standard value, it is determined that there is a hole, that is, the soldering is incomplete, and the position data of this incomplete soldering location is output to the output side. It is output to the processing device 21. The output side processing device 21 outputs the position data and the number of incomplete soldering points to the output side processing device 22 of the correction station 4. Note that the target round is set to be slightly smaller than the soldering area to eliminate positional errors of the printed mounting board 2.

When the position data of incomplete soldering points is input to the output side processing device 22 of the correction station 4, when the corresponding printed mounting board 2 is transported to the correction station 4, the soldering robot llA11B removes the unsoldered parts. Solder is applied only to complete areas. Depending on the size of the solder pattern, one of the soldering robots IIA and IIB having two or six soldering irons 14 and 15 is selected.

In addition, to correct incomplete soldering, remove the lead wire so that the tip arm part 13 is fixed at 90° (θ1), 180° (θ1), etc.
It is rotated in the a direction in three steps: ° (θ2) and 270° (θ3). Further, the printing device 23 records the number of incomplete soldering locations.

In addition, in the above embodiment, the configuration includes two ITV cameras 6 and two soldering robots 11A and 11B.
In any case, it is not limited to this, but each one or three
It may be more than one.

Effects of the Invention As described above, according to the present invention, the area ratio of the black or white pattern at the soldering location is determined by the image processing device to detect the holey state of the solder, so that defects in the solder pattern can be detected. Inspection of complete parts can be efficiently performed without requiring much time and effort, and inspection of incomplete parts of solder patterns, as well as inspection and correction of soldering, can be automated.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a schematic configuration of a soldering inspection and correction apparatus according to an embodiment of the present invention. I...transport conveyor, 2...pudding)/mounting board,
5... X-Y table, 6... Industrial television camera (imaging device), 7... Circline illumination, 8... Position control device, 9... Image processing device, IIA, IIB.
...Soldering robot (soldering device).

Claims (2)

[Claims] 1. a board mounting table on which a printed mounting board is placed facing the back side; an imaging device for capturing an image of the back side of the printed mounting board placed on the board mounting board; a moving device that moves relative to the board; a position control device that is connected to the moving device and controls the relative position of the imaging device and the printed mounting board on the board mounting table to a preset position; Binarize the image signal from the imaging device, extract a preset range corresponding to the soldered part in the binarized image, and calculate the area ratio of the black or white pattern in the binarized image at this location. and an image processing device that compares this calculated value with a reference value for determining the quality of soldering to detect holes where soldering is incomplete. 2. A soldering inspection comprising the soldering inspection device according to claim 1 and a soldering device for soldering incomplete soldering spots on a printed mounting board based on incomplete soldering spot data from the soldering inspection device. Correction device.