JPH09152317A - Method and apparatus for inspection of mounting component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To sharply enhance the accuracy of an inspection and the efficiency of the inspection. SOLUTION: Inside a control and processing part at a mounting-component inspection apparatus, inspection information which contains individually set inspection programs about a mounting component on a board and about a plurality of components whose performance is identical to that of the mounting component is stored as instruction information required for the inspection of the mounting component. In the inspection, the control and processing part first sets a window 26 on the image of a component 2T to be inspected, and image data inside the window 26 is binarized and processed in three ways. The size of a component body, the maker name and the type which are printed on the component body and the color of a lead part are recognized respectively. On the basis of their recognition results, to which component out of kinds of components the component 2T to be inspected corresponds is discriminated, and the inspection is executed by using an inspection program according to its discrimination result.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounted on a printed circuit board (hereinafter simply referred to as "substrate"), for example, whether or not the electronic component is present or not before soldering, and soldering after soldering. The present invention relates to a mounted component inspection method and an apparatus therefor used to inspect whether each is good or bad. In particular, the present invention relates to a plurality of components having the same performance but different shapes or mounting forms. The present invention relates to a method and an apparatus for performing a component-dependent inspection.

[0002]

2. Description of the Related Art Conventionally, a visual inspection has been performed to inspect the mounting quality of mounted components on a substrate to be inspected (collectively, the one before soldering and the one after soldering). It is being appreciated. However, in this type of visual inspection, the occurrence of inspection errors is unavoidable, the inspection results vary depending on the inspector, and the inspection processing capacity is also limited.

Therefore, in recent years, a mounted component inspection apparatus has been put into practical use which automatically inspects the mounting quality of each component on a board on which a large number of components have been mounted, using an image processing technique. This mounted component inspection apparatus is equipped with three light sources that irradiate the mounting positions of components to be inspected with three primary colors with different incident angles, a color television camera that captures a reflected light image from each light source, and this color television camera. And a control processing unit that processes the obtained color image and determines whether the mounting state of the component is good or bad.

When this mounting component inspection apparatus is used, prior to the inspection, information about what position, what component, and how the component is mounted on the substrate to be inspected,
It is necessary to teach the mounted component inspection device as teaching information for each type of board. This teaching work is generally called "teaching".

The teaching information includes, in addition to the positions and types of components mounted on the board to be inspected, color parameters for extracting an image pattern to be inspected in each inspection area, judgment criteria, and an inspection program. Etc. (hereinafter collectively referred to as “inspection information”) are included. The color parameter is a binarization threshold value provided for each hue or lightness in order to extract an image pattern of an inspection target such as a land or a component body from a captured color image, and the judgment criterion is these. The reference values of the shape, the area, and the like (hereinafter collectively referred to as “feature parameter”) of the inspection target portion obtained from the image pattern extracted by the color parameters of are shown. Further, the inspection program is a program in which a logic indicating which of the extracted characteristic parameters is to be used to determine the mounting quality of the component and the inspection procedure are programmed.

At the time of inspecting a board to be inspected, this mounting component inspection apparatus uses an image obtained by picking up an image of the board to be inspected.
Using the color parameters, for example, after extracting the image pattern of the soldered portion to calculate the characteristic parameters, and further based on the inspection program, the characteristic parameters are compared with the determination criteria, etc. To judge.

[0007]

By the way, the components mounted on the board are usually purchased from a plurality of manufacturers.
The performance and specifications are the same depending on the manufacturer and manufacturing lot, but the shape and size of the electrodes and lead terminals, the size of the part body, the shape of the soldering part, etc. will differ depending on the part.

FIG. 6 shows three parts A, B and C belonging to the same part type. In the drawing, the leads subjected to the solder plating treatment are used for the components A and B, the leads subjected to the palladium treatment are used for the component C, and the width of the main body of the component B is the components A and C. It is formed larger.

FIG. 7 shows the cross-sectional shape of each of the parts A, B, and C (shown in the upper part of the figure) and an image pattern obtained by imaging a good mounting state of each part (in the middle part of the figure). Shown),
The image pattern (shown in the lower part of the drawing) obtained by imaging the mounting failure state of each component is shown in association with each component. As is clear from this illustrated example, there is a large difference in the image pattern of each component regardless of whether the mounting state is good or bad. Therefore, even if the components belong to the same component type (see FIG. In the example of No. 7, parts A, B, C
It is necessary to prepare inspection information individually.

However, at the time of inspection, the manufacturer and manufacturing lot of the mounted components on the board to be inspected are not known, so it is difficult to perform inspection using appropriate inspection information for each component, and the inspection accuracy is high. Noticeably worse. If the manufacturer and manufacturing lot of the mounted component to be inspected are known in advance, the operator selects the inspection information according to the mounted component from the individually set inspection information. It is possible to carry out an appropriate inspection.
However, since many boards are inspected continuously during inspection, teaching information must be selected each time the manufacturer or manufacturing lot of the mounted components of the inspected board is switched during the inspection, and inspection efficiency is improved. Occurs significantly.

The present invention has been made in view of the above problem, and automatically determines which of a plurality of parts having the same performance, from the image obtained by picking up the image of the mounting part. It is an object of the present invention to significantly improve the inspection accuracy and perform an efficient inspection by performing the inspection by using the inspection information corresponding to the part.

[0012]

According to a first aspect of the present invention, there is provided a method for inspecting the mounting quality of the mounted component on the basis of an image obtained by picking up an image of the mounted component on a board, which is necessary for the inspection of the mounted component. As teaching information, individual inspection information is prepared in advance for this mounted component and a plurality of components that have the same performance as the mounted component but differ in the appearance of the component or the mounting form on the substrate. After determining which of the above-described components is the mounted component to be inspected by the image obtained by picking up the mounted component to be inspected, the inspection is performed using the inspection information according to the determination result of the teaching information. It is characterized by inspecting the mounting quality of the target mounted component.

According to a second aspect of the present invention, there is provided an apparatus for carrying out the above-described mounted component inspection method, wherein the mounted component and the mounted component have the same performance as teaching information necessary for inspecting the mounted component. Provides individual inspection information for multiple parts that differ in the appearance of the parts or the mounting form on the board.
Storage means for respectively storing, determination means for determining which of the above-mentioned mounted components is the mounted component using the input image of the mounted component to be inspected, and the storage means for the mounted component to be inspected And a determination unit for determining the mounting quality of the mounting component to be inspected using the inspection information after reading the inspection information according to the determination result by the determination unit from the teaching information stored in .

According to the third aspect of the invention, the discriminating means recognizes the size of the main body of the component from the image of the mounted component to be inspected, and uses the recognition result to determine which component is the mounted component. It is determined. Further, in the invention of claim 4, the discriminating means discriminates a printed pattern on the main body of the component from the image of the mounted component to be inspected, and discriminates which component the mounted component is based on the recognition result. doing.

According to another aspect of the present invention, there is provided a mounted component inspection apparatus, which provides individual inspection information regarding a plurality of components having the same performance but different appearances or mounting forms on a board, and the type of the component to which these components belong. First storage means for storing as the registration information according to the above, and registration information of the component type to which the mounted component on the board belongs, from the first storage means,
Inspection information generating means for generating teaching information necessary for inspection of the mounted component using the registration information, second storage means for storing teaching information generated by the inspection information generating means, and input inspection Among the teaching information stored in the second storage unit, the determining unit that determines which of the above-described components is the mounting component using the image of the mounting component that is the object, and the teaching information that is stored in the second storage unit for the mounting component that is the inspection target. From the inspection means according to the discrimination result by the discrimination means, and the discrimination means for discriminating the mounting quality of the mounted component by using the inspection information.

[0016]

[Operation] Prior to the inspection, as teaching information necessary for inspection of the mounted components on the board, the mounting components and a plurality of components having the same performance as those of the mounted components but different in appearance or mounting form on the substrate are provided. Individual inspection information of is prepared. At the time of inspection, it is determined which of the plurality of components the mounting component is based on the image of the mounting component to be inspected, and the inspection is performed using inspection information corresponding to the determination result in the teaching information. Is done. This allows
Even if the manufacturer or manufacturing lot of the mounted component differs for each board to be inspected, accurate inspection using the inspection information according to the component is performed.

In the invention of claim 3, the size of the component body is recognized from the image of the mounted component, and in the invention of claim 4, the print pattern on the component body is recognized from the image of the mounted component. The mounted component to be inspected is discriminated using the result.

According to the invention of claim 5, individual inspection information on a plurality of parts having the same performance is stored in advance as registration information related to the kind of parts to which these parts belong. Since the teaching information of the mounted component on the board is created by using the registration information of the component type to which this component belongs, all the information necessary for the inspection of the mounted component can be taught at one time.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION As an example for carrying out the inventions of claims 1 to 5, there is a mounted component inspection apparatus shown in FIG. This mounting component inspection apparatus stores, as teaching information necessary for inspecting each mounted component on the inspected board, an inspection program individually set for each component belonging to a component type including this mounted component. . At the time of inspection, the size of the main body of the component, the print characters on the main body, the color of the lead portion, etc. are extracted from the image obtained by imaging the mounted component to be inspected. After it is discriminated whether or not it is a component, the inspection using the inspection program according to the discrimination result is executed.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows the overall construction of a mounted component inspection apparatus according to an embodiment of the present invention. This mounting component inspection apparatus is obtained by imaging the inspection target substrate 1T and the characteristic parameters of the inspection region of each component 2S on the reference substrate 1S obtained by imaging the reference substrate 1S with good mounting quality. It is for inspecting the mounting quality of each component 2T by comparing with the characteristic parameters of the inspection region of each component 2T on the inspected substrate 1T. The X-axis table section 3, the Y-axis table section 4, a light projecting unit 5, an image pickup unit 6, a control processing unit 7, and the like are included as its components.

The X-axis table section 3 and the Y-axis table section 4 each include a motor (not shown) that operates based on a control signal from the control processing section 7. The X-axis table section is driven by these motors. The unit 3 moves the light projecting unit 5 and the image pickup unit 6 in the X-axis direction, and the Y-axis table unit 4 moves the conveyor 8 supporting the substrates 1S and 1T in the Y-axis direction.

The light projecting unit 5 has three annular light sources 9, 10, 11 which have different diameters and which simultaneously emit red light, green light and blue light based on a control signal from the control processing unit 7. The light sources 9, 10 and 11 are arranged so as to be centered right above the observation position and in directions corresponding to different elevation angles when viewed from the observation position.

The image pickup section 6 is a color television camera, and is positioned downward at a position directly above the observation position. As a result, the reflected light on the surface of the substrate 1S, 1T to be observed is imaged by the imaging unit 6, converted into color signals R, G, B of the three primary colors and supplied to the control processing unit 7.

The control processing section 7 includes an image input section 12, a memory 13, an image pickup controller 14, an image processing section 15, and an X section.
The Y table controller 16, the component discriminating unit 17, the discriminating unit 18, the teaching table 19, the control unit 20, the keyboard 21, the CRT display unit 22, the printer 23, the transmitting / receiving unit 24, the floppy disk device 25, and the like.

The image input unit 12 inputs the color signals R, G and B from the image pickup unit 6 and converts them into digital signals. The grayscale image data of a digital amount for each hue is stored in the memory 13. Stored in.

The image pickup controller 14 is provided with an interface for connecting the control unit 20 to the light projecting unit 5 and the image pickup unit 6, and adjusts the light amount of each of the light sources 9 to 11 of the light projecting unit 5 based on the output of the control unit 20. Control is performed or the mutual balance of the light output of each hue of the image pickup unit 6 is maintained.

The XY table controller 16 is the control unit 2
0 is provided with an interface for connecting the X-axis table unit 3 and the Y-axis table unit 4, and the drive of the X-axis table unit 3 and the Y-axis table unit 4 is controlled based on the output of the control unit 20.

The teaching table 19 includes, as inspection information, color parameters for extracting each of the above-mentioned characteristic parameters, and data for setting a window 26 described later on an image of each component (hereinafter, "set position data").
The judgment criteria, inspection program, etc. are stored for each inspected part. The inspection information is supplied to the image processing unit 15, the determination unit 17, and the like via the control unit 20 during the inspection.

The image processing section 15 is supplied with the color parameters of the above-mentioned teaching data, and is stored in the memory 13.
Red, green, and blue image data R stored in the
After the lightness and the hues of the three primary colors are extracted from G and B in pixel units, the extraction results are compared with predetermined binarization threshold values stored in the teaching table 19 to perform binarization processing. The characteristic parameter of the component is extracted and supplied to the determination unit 18 as data for inspection.

The determination unit 18 receives the inspection program and the determination standard, compares the inspection data transferred from the image processing unit 15 with the determination standard based on the inspection program, and compares the inspection substrate 1T with the inspection data. The mounting quality is determined for each component 2T, and the determination result is output to the control unit 20. The control section 20 determines whether or not the inspected substrate 1T is a non-defective product by integrating the determination results of the respective components, and the determination result is CR.
It is output to the T display unit 22 and the printer 23.

The component discriminating unit 17 is for discriminating what component is used as the inspected component 2T prior to the comparison / determination processing by the discriminating unit 18, and the discrimination result is passed through the control unit 20. Teaching table 19
Given to.

The keyboard 21 is used for operation information and the reference board 1.
Various keys necessary for inputting data on S and the substrate 1T to be inspected are provided, and the key input data is supplied to the control unit 20.

When image data, inspection results, key input data, etc. are supplied from the control unit 20, the CRT display unit 22 displays them on the display screen, and the printer 23
When the inspection result or the like is supplied from the control unit 20, this is printed out in a predetermined format.

The transmission / reception unit 24 is for transmitting / receiving data to / from a solder correction device, a host computer, etc., not shown, and transmits / receives various data such as transmission of data such as inspection results and reception of library data described later. To do. A floppy disk in which library data and the like are stored is set in the floppy disk device 25, and data is read and written via the control unit 20.

This mounted component inspection device is used for each inspected component 2
When teaching the information required for T inspection,
The color parameter, the setting position data of the window 26,
Library data is used by editing inspection information such as criteria and inspection programs. This library data is loaded into the memory 13 via the transmission / reception unit 24 and the floppy disk device 25, and is edited as appropriate using image data of the reference board, input data from the keyboard 21, and the like.

Further, this mounted component inspection apparatus can perform accurate inspection regardless of which of a plurality of components having the same performance and specifications but different appearances and mounting forms is used as the component 2T to be inspected. As described above, the inspection program is individually edited for each of a plurality of components belonging to the same component type, and the library data in which the inspection information other than the inspection program is commonly edited for each component is stored in the memory 13 in advance. .

At the time of teaching, after the mounting position of each component is taught by the image obtained by picking up the image of the reference board 1S, the library data corresponding to this component is read and the inspection information is taught, and the teaching is performed. It is stored in the table 19. At the time of inspection, after the components of the inspected component 2T are discriminated by the component discriminating unit 17, the inspection program according to the discrimination result among the inspected inspection information and the inspection information common to other components are described above. The data is read from the teaching table 19 and the inspection is executed according to the procedure described above.

FIG. 2 shows the principle of component discrimination. The set position data is, as shown in FIG.
This is for setting the window 26 so that the entire image portion of T is included, and the component discrimination unit 17 executes three types of recognition processing on the image data in the window 26. Note that all of these recognition processes are performed using the image pattern extracted by the binarization process by the image processing unit 15. The binarization threshold value in this case was also taught in advance as the color parameter. It is a thing.

The first confirmation target is the size of the component body, and the component discriminating unit 17 binarizes the image data in the inspection window 26 with a predetermined threshold value to extract the component. The size d in the width direction of the component body is measured using the image portion 27 of the body (FIG. 2 (2)).

The second object to be confirmed is the manufacturer name and model printed on the component body by silk printing.
Character recognition processing is performed on the image portion of the character extracted by the binarization threshold different from the above (existing at the position indicated by the diagonal lines in the figure), and the manufacturer and model are recognized from the recognition result (see FIG. 2). (3)).

The third confirmation target is the color of the lead portion of the component. In this case, the image processing unit 15 has a plurality of two
Various colors are extracted by performing the binarization process, and the component discrimination unit 17 recognizes the color of the lead portion by comparing with each extraction result (FIG. 2 (4)).

The recognition results obtained by the above three processes are compared with the recognition data of each component stored in advance in the memory 13 or the like to determine which component is the inspected component.

FIG. 3 shows a teaching procedure. First, in steps 1 and 2 of the same figure, the operator operates the keyboard 21 to register the name of the board to be taught, and then inputs the board size by a key, and in step 3, the reference board 1S is moved to the Y-axis table part. 4 Set it on and press the start key.

Then, in step 4, the origin of the reference board 1S and the upper right and lower left corners are imaged by the image pickup section 6, and the actual size of the reference board 1S is input according to the position of each point. 20 controls the X-axis table unit 3 and the Y-axis table unit 4 based on the input data to control the reference substrate 1S.
To the initial position.

The reference board 1S has a good mounting quality in which a predetermined component 2S is properly soldered at the component mounting position. When the reference board 1S is positioned at the initial position, In step 5, the image pickup section 6 picks up an image of the area of the reference board 1S to teach the mounting position of the component.

At the next step 6, the control unit 20 causes the CR
The T display unit 22 displays a list of component types for which library data is stored. When the operator selects a component type corresponding to the component 2S whose mounting position is taught from the displayed component type list, the control unit 20 reads the library data for this component type from the memory 13 and uses this data as the component 2S. The teaching information is stored in the teaching table 19 as teaching information. By this processing, as the teaching information about the component 2S, individual inspection programs for this component 2S and a plurality of components having the same performance as the component 2S, and color parameters and judgment criteria common to these components The inspection information can be taught at one time.

When the same procedure is repeatedly executed for all the components on the reference board 1S, the determination in step 7 becomes "YES", and the process proceeds to the correction teaching in step 8 and thereafter. This correction teaching is a process of actually performing a test inspection on a board whose mounting quality is known based on the teaching data generated in steps 5 and 6 and correcting the taught inspection data to an optimum one.

First, in step 8, the control unit 20 sets the reference substrate 1T to the initial position again, extracts image patterns in order from the first inspection target component by using the taught inspection information, and mounts each component. Determine the quality. This inspection procedure is similar to the procedure of FIG. 4 described later,
Here, the detailed description is omitted.

As a result of the above inspection, if it is determined that the mounting quality of any of the parts is poor,
When step 9 becomes "YES", the operator corrects the teaching data by changing the binarization threshold value for extracting the characteristic parameter for the part determined to be defective (step 10).

When the correction process for all the parts determined to be defective is completed, step 11 becomes "YES", and the control section 20 repeats the procedure of step 8 again. This loop is repeated until there are no parts that are determined to be defective, and the final inspection information is generated when step 9 becomes "NO". Optimal inspection information can be obtained by executing the correction teaching a plurality of times using a non-defective substrate having a good mounting quality and a defective substrate having a poor mounting quality.

FIG. 4 shows a control procedure of automatic inspection by the control processing unit 7. In steps 1 and 2 of the figure, the operator selects a board name to be inspected and performs a board inspection start operation, and in the next step 3, checks the supply of the board 1T to be inspected to the mounted component inspection apparatus. The judgment is "YES"
If so, the conveyor 8 is operated, the substrate 1T to be inspected is carried into the Y-axis table portion 4, and automatic inspection is started (steps 4 and 5).

In step 5, the control section 19 controls the X-axis table section 3 and the Y-axis table section 4 to position the field of view of the image pickup section 6 with respect to the first component 2T on the inspected substrate 1T and pick up an image. After the component discriminating unit 17 discriminates the component type of the component, an inspection program corresponding to the component type is read from the teaching table and supplied to the determining unit 18 to mount the first component 2T. Determine quality.

FIG. 5 shows an inspection procedure for the component 2T. First, in step 5-1, the control section 20
After setting the window 26 on the image of the part 2T using the setting position data, various binarization threshold values stored in the teaching table 19 are sequentially read out and given to the image processing unit 15, and the window 26 is set. The parts body, silk print characters, and lead parts are extracted inside.
The part discriminating unit 17 determines the size of the part,
The manufacturer name and model, the color of the lead portion are sequentially recognized (steps 5-2 to 5-4), and the result of each recognition process is collated with the characteristic data of each component within the component type to which the component 2T belongs to It is determined which of these parts 2T is, and the result is output to the control unit 20 (step 5-5).

At the next step 5-6, the control section 20
An inspection program corresponding to this determination result is read from the teaching table 19 and supplied to the determination unit 18. The determination unit 18 sets a predetermined inspection area on the image of the component 2T based on the supplied inspection program, extracts the characteristic parameters in the area, and uses the extracted characteristic parameters as the taught criterion. By comparing, part 2
The quality of the mounting quality of T is determined (step 5-7).

Returning to FIG. 4, such an inspection is repeatedly performed for all the components 2T on the substrate 1T to be inspected, and as a result, if there is a component in a poor mounting state, step 6
Is "NO", the defective part and the content of the defect are displayed on the display unit 20 or printed on the printer 21, and then the inspected substrate 1T is carried out from the Y-axis table unit 4 (steps 7 and 8). ). Thus, when the same inspection procedure is executed for all the inspected substrates 1T, the determination in step 9 becomes "YES", and the inspection is completed.

In the above embodiment, the teaching information necessary for the inspection of each part is obtained from the various inspection information of a plurality of parts having the same performance by using the library data in which only the inspection program is individually set. Although generated, the present invention is not limited to this, and the teaching information necessary for inspecting each component may be created using the library data in which only the judgment criterion of the inspection information is set for each component. In this case, at the time of inspection,
Similar to the above, after it is determined which of the component types the inspected component is, the color parameters common to the component types,
An inspection is executed using the inspection program and the determination criteria according to the above determination result.

For each part belonging to the same part type, library data in which all inspection information except the setting position data such as color parameters, judgment criteria, and inspection programs are individually set is prepared, and this library data is stored. The teaching information necessary for the inspection of each mounted component may be generated by using the teaching information. In this case, after the window 26 is set by using the setting position data common to each component at the time of component determination, the same component determination processing as described above is performed, but at the time of inspection, various inspections based on the result of component determination are performed. The information is read out, and a series of inspection procedures from the extraction of the characteristic parameter to the determination of the mounting quality are executed using these inspection information.

[0058]

As described above, according to the present invention, as teaching information necessary for inspecting mounted components, the mounting component and a plurality of types of components having the same performance as the mounting component but different in appearance or mounting form are respectively provided. Individual inspection information is prepared, and at the time of inspection, which component is used as the inspected component is automatically determined, and then the inspection information according to the determination result is used to determine the mounting quality of this component. Therefore, even if the manufacturer or manufacturing lot of the mounted component differs for each board to be inspected, it is possible to automatically read the inspection information according to the component and perform an accurate inspection. The accuracy and inspection efficiency can be greatly improved.

In the invention of claim 3, the size of the component body measured from the image of the mounted component is recognized, and in the invention of claim 4, the print pattern on the component body recognized from the image of the mounted component is recognized. Since the mounted component to be inspected is discriminated using the recognition result, the component can be discriminated with high accuracy.

According to the fifth aspect of the invention, individual inspection information on a plurality of components having the same performance is stored as registration information related to the component type to which these components belong, and the part to which the mounted component on the board belongs. Since the teaching information necessary to inspect this part was created using the registration information of the product type,
All the information necessary for the inspection of the mounted components can be taught at one time, and the labor and time required for teaching can be greatly reduced.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an overall configuration of a mounted component inspection device according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a method of discriminating parts.

FIG. 3 is a flowchart showing a procedure of teaching.

FIG. 4 is a flowchart showing an inspection procedure.

FIG. 5 is a flowchart showing a detailed procedure of component inspection.

FIG. 6 is an explanatory diagram showing a plurality of parts having the same specifications.

FIG. 7 is an explanatory diagram showing the cross-sectional shape of each component of FIG. 6 and the image pattern obtained when the mounting state is good or bad, in association with each other.

[Explanation of symbols]

 1T Inspected board 2T Inspected component 7 Control processing unit 17 Component determination unit 18 Determination unit 19 Teaching table 20 Control unit

Claims (5)

[Claims] 1. A method for inspecting the mounting quality of the mounted component by an image obtained by imaging the mounted component on a board, wherein the mounted component and the mounted component are used as teaching information necessary for the inspection of the mounted component. It was obtained by preparing in advance individual inspection information for multiple parts that have the same performance but different appearances or different mounting forms on the board, and image the mounted parts to be inspected on the board. Depending on the image
After determining which of the above-mentioned mounted components is an inspection target, the mounting quality of the mounted component of the inspection target is inspected using inspection information according to the determination result of the teaching information. Mounted component inspection method. 2. A device for inspecting the mounting quality of the mounted component by inputting an image obtained by picking up an image of the mounted component on a board, wherein the mounting information is used as teaching information necessary for inspecting the mounted component. A storage unit that stores individual inspection information for multiple parts that have the same performance as the parts and the mounted parts but differ in the appearance of the parts or the mounting form on the board. A discriminating unit that discriminates which of the above-mentioned mounted components using an image, and a discrimination result by the discriminating unit from the teaching information stored in the storage unit for the mounting component to be inspected. A mounting component inspection apparatus comprising: a determination unit that determines the mounting quality of the mounting component to be inspected by using the inspection information after reading the corresponding inspection information. 3. The discriminating means discriminates the size of the main body of the component from the image of the mounted component to be inspected, and discriminates which component is the mounted component based on the recognition result. Mounted component inspection device described in. 4. The determination means recognizes a print pattern on a main body of a component from an image of the mounted component to be inspected, and determines which component the mounting component is based on the recognition result. The mounted component inspection device described in 2. 5. An apparatus for inspecting the mounting quality of a mounted component by inputting an image obtained by picking up an image of a mounted component on a substrate, the appearance of the component being the same or the mounting on the substrate. First storage means for storing individual inspection information of a plurality of components having different forms as registration information relating to component types to which these components belong, and registration information of component types to which the mounted components on the board belong. An inspection information generating unit for generating instruction information necessary for inspection of the mounted component using the registration information after reading from the first storage unit; and storing instruction information generated by the inspection information generating unit. 2 storage means, determination means for determining which of the above-mentioned mounted components is the mounted component by using the input image of the mounted component to be inspected, The teaching information stored in the storage means is read out from the inspection information according to the determination result by the determination means, and the determination information is used to determine the mounting quality of the mounted component. Mounted parts inspection device.