CN114762466A - Method and apparatus for removing electronic component - Google Patents
Method and apparatus for removing electronic component Download PDFInfo
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- CN114762466A CN114762466A CN201980102763.8A CN201980102763A CN114762466A CN 114762466 A CN114762466 A CN 114762466A CN 201980102763 A CN201980102763 A CN 201980102763A CN 114762466 A CN114762466 A CN 114762466A
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- electronic component
- heating
- nozzle
- circuit substrate
- head end
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Abstract
An electronic component removing method and an apparatus thereof, which can remove the electronic component from a circuit substrate even if the area of a metal terminal is small. A circuit board (10) is joined to a plurality of electronic components (20) via solder (30). The device comprises: an adsorption part (60) which comprises an adsorption nozzle (50) with a hollow part (51), and the head end of the adsorption nozzle adsorbs the electronic component (20); a heating unit (70) which includes a heating element (71) provided below the adsorption nozzle and heats the heating element (71) by electromagnetic induction heating; a conduction part (50) for conducting the heat generated by the heating element (71) to the tip end of the adsorption nozzle (50). Heat is conducted from the heating body (71) to the electronic component (20) and the solder (30) through the nozzle (50). The solder (30) melts, and the connection between the circuit-side terminal (12) and the electronic component-side terminal (21) is released. On the other hand, the electronic component (20) and the nozzle (50) are maintained in a suction state, and the electronic component (20) can be removed from the circuit board (10) when the nozzle (50) is separated from the circuit board (10).
Description
Technical Field
The present invention relates to a technique for removing an electronic component mounted on a substrate by electromagnetic induction heating.
Background
In an electronic device, when an electronic element such as a semiconductor is mounted on a circuit board, soldering is performed. Solder bonding is performed by placing solder between bonding objects and then heating and melting the solder.
The substrate is assembled with a plurality of electronic elements. When the electronic element is abnormal or has a fault, only the electronic element is removed, and meanwhile, the influence on the normal electronic element is avoided.
For example, hot air is supplied to the electronic component to melt the solder, and the electronic component is removed from the substrate (for example, patent document 1).
However, in recent years, electronic components tend to be miniaturized. For example, as the pixel size of a monitor increases, micro LEDs having a size of 100 μm or less are used. It is difficult to give sufficient hot air only to the small electronic components to be removed while avoiding influence on the adjacent small electronic components.
Further, although the technique of removing by supplying hot air is applicable to a substrate made of heat-resistant resin such as polyamide-imide and polyimide, it is difficult to apply the technique to a substrate made of heat-resistant material such as thermoplastic resin, paper, and cloth. Examples of the non-heat-resistant thermoplastic resin include ABS resin, acrylic, polycarbonate, polyester, polybutylene, polyurethane, PET (poly terephthalic acid), and the like.
On the other hand, as a spot heating technique, there is electromagnetic induction heating. The electronic component assembled on the substrate may also be removed by electromagnetic induction heating (for example, patent document 2).
Fig. 7 is a conceptual diagram of a basic principle regarding electromagnetic induction heating. The electromagnetic induction heating device is composed of an induction coil, a power supply and a control device.
When an alternating current flows in the induction coil, magnetic lines of force of varying intensity are generated. A conductive substance (specifically, a bonding object, which is usually formed of metal) placed in the vicinity is influenced by the changing magnetic lines of force, and an eddy current flows in the metal. Since metals generally have electrical resistance, joule heat is generated when current flows in the metal, causing the metal to generate heat by itself. This phenomenon is called induction heating.
The heat generation amount Q by electromagnetic induction is represented by the following equation: q ═ V2Where V is an applied voltage, R is a resistance, and t is time.
In electromagnetic induction heating, since only metal generates heat, the resin portion around the metal generates less heat damage. In addition, the electronic components are hardly affected by heat, and are not easily damaged by heat.
In the electromagnetic induction heating, since only the metal generates heat, the joining can be performed in a short time with a small amount of energy. The time required for one engagement is several seconds to ten seconds.
In electromagnetic induction heating, if the heating is performed in the same magnetic field, a predetermined joule heat can be obtained, and therefore, the joining accuracy is high. Further, if the magnetic fields are the same, a plurality of bonds can be formed at a time.
In electromagnetic induction heating, the amount of power output and the output time are easily controlled by a control device. As a result, the heating temperature and heating time are also easily controlled. A desired temperature profile can be set.
The metal terminals on the circuit substrate side generate heat, and the heat is transferred to the solder, thereby melting the solder. The solder is also melted at the time of removal in the same manner as at the time of bonding.
In electromagnetic induction heating, it is also easy to control the magnetic force by adjusting the power supply output. This makes it possible to heat only the metal terminals on the circuit substrate side corresponding to the electronic component to be removed, while avoiding the influence on the adjacent electronic components.
In summary, the method of removing the electronic component assembled on the circuit substrate by electromagnetic induction heating can cope with miniaturization of the electronic component. Further, the present invention can also be applied to a substrate made of a non-heat-resistant material.
Patent document 1: japanese patent laid-open publication No. 2004-186491
Patent document 2: japanese laid-open patent publication No. 2001-044616
Disclosure of Invention
As described above, the method of removing the electronic component assembled on the substrate by electromagnetic induction heating can cope with miniaturization of the electronic component.
However, when the electronic component is further miniaturized, the area of the metal terminal to be a heat generating object becomes small. In particular, in the case where a large number of electronic components are arranged in a predetermined area, or in the case where an electronic component has a large number of terminals (for example, a Ball Grid Array (BGA) or a Chip Size Package (CSP)), the area of the metal terminals is further narrowed. As a result, the resistance R becomes large, and a sufficient amount of heat generation cannot be secured (the denominator of the above theoretical formula becomes large).
According to the above theoretical formula, the heat generation amount Q can be secured by increasing the applied voltage V or increasing the applied time t.
On the other hand, it was actually verified by a trial model that when the area of the metal terminal is about 1mm × 1mm or less, defects such as heat generation failure are scattered depending on the kind of solder. When the metal terminal area is about 500 μm × 500 μm or less, defects are conspicuous. Although the applied voltage and the applied time can be adjusted with high accuracy in electromagnetic induction heating, there is a limit in eliminating defects even if the applied voltage and the applied time are adjusted.
There are various kinds of solders, and generally used are high-temperature solders (e.g., SnAgCu-based solders having a melting point of about 220 ℃) to low-temperature solders (e.g., SnBi solders having a melting point of about 140 ℃). The above-described drawbacks occur even if solder bonding is performed using low-temperature solder.
In addition, the size of the circuit-side terminal corresponding to the micro LED is about 25 μm × 25 μm to 50 μm × 50 μm, and a method of removing only the defective micro LED has not been established. The present inventors have brought the removal of electronic components of such a size into the field of view in the future, and have found that the above-described defects are highly likely to be conspicuous.
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a technique for removing an electronic component, which can be applied even when a metal terminal has a small area.
In order to solve the above-described problems, the present invention provides a removing device for removing an electronic component assembled on a circuit substrate by solder bonding from the circuit substrate, comprising: a suction unit including a suction nozzle having a hollow shape, for sucking the electronic component by a head end of the suction nozzle; a heating unit including a heating element disposed at a lower portion of the adsorption nozzle, for heating the heating element by electromagnetic induction heating; and a conduction part for conducting heat generated by the heating body to the head end of the adsorption nozzle.
The heat generated by the heating section is transmitted to the electronic component and the solder via the conduction section, and the solder melts. During this time, the suction portion maintains a suction state between the nozzle and the electronic component. Even if the area of the metal terminal is small and the amount of heat generation is insufficient, the heat generating body generates heat. Thereby, the electronic component assembled on the circuit substrate by solder bonding can be removed from the circuit substrate.
In the present invention, it is preferable that the heating element is larger than the terminal of the circuit board.
Thus, even when the area of the metal terminal is small and the amount of heat generation is insufficient, the heat generating element can generate heat reliably.
In the present invention, the terminal size of the circuit board is preferably 500X 500 μm or less, more preferably 250 μm X250 μm or less, and further more preferably 100 μm X100 μm or less.
When the terminal size is 1mm × 1mm or less, defects such as insufficient heat generation amount are scattered in the electromagnetic induction heating. When the terminal size is 500 μm × 500 μm or less, defects are conspicuous. The smaller the area is, the less sufficient the heat generation amount is. The invention can remove the metal terminal even if the area of the metal terminal is narrow.
The present invention preferably further comprises a ferrite core mounted outside the heating element.
This increases the amount of heat generated by the heating element and also increases the amount of heat generated by the metal terminal. By this multiplication effect, the solder is surely melted.
In order to solve the above-described problems, the present invention provides a removing method of removing an electronic component assembled on a circuit substrate by solder bonding from the circuit substrate. With the above-described removing device, the heating element is heated by the heating portion, the heat generated by the heating element is conducted to the tip end of the suction nozzle by the conduction portion, the solder is melted, and the electronic component is sucked by the tip end of the suction nozzle by the suction portion, thereby removing the electronic component assembled on the circuit board by solder bonding from the circuit board.
Even if the area of the metal terminal is small and the amount of heat generation is insufficient, the heat generating body generates heat. Thereby, the electronic component assembled on the circuit substrate by solder bonding can be removed from the circuit substrate.
In order to solve the above-described problems, the present invention provides a removing device for removing an electronic component assembled on a circuit substrate by solder bonding from the circuit substrate, comprising: a suction part including a suction nozzle having a hollow and formed of a metal, for sucking the electronic component by a head end of the suction nozzle; and a heating section for heating the head end of the adsorption nozzle by electromagnetic induction heating.
Even when the area of the metal terminal is small and the amount of heat generation is insufficient, the metal nozzle generates heat. Thereby, the electronic component assembled on the circuit substrate by solder bonding can be removed from the circuit substrate.
In order to solve the above-described problems, the present invention provides a removing device for removing an electronic component assembled on a circuit substrate by solder bonding from the circuit substrate, comprising: an adsorption part including an adsorption nozzle having a hollow and formed of ferrite, for adsorbing the electronic component by a head end of the adsorption nozzle; and a heating unit including a heating element attached to a tip end of the adsorption nozzle, for heating the heating element by electromagnetic induction heating.
Even if the area of the metal terminal is small and the amount of heat generation is insufficient, the heat generating body generates heat. Thereby, the electronic component assembled on the circuit substrate by solder bonding can be removed from the circuit substrate.
In order to solve the above-described problems, the present invention provides a removing method of removing an electronic component assembled on a circuit substrate by solder bonding from the circuit substrate. With the above-described removing device, the head end of the suction nozzle is heated by the heating unit to melt the solder, and the electronic component is sucked by the head end of the suction nozzle by the suction unit, thereby removing the electronic component mounted on the circuit board by solder bonding from the circuit board.
Even when the heat generation amount is insufficient due to the narrow metal terminal area, the tip end of the nozzle generates heat. Thereby, the electronic component assembled on the circuit substrate by solder bonding can be removed from the circuit substrate.
In order to solve the above-described problems, the present invention provides a removing device for removing an electronic component assembled on a circuit substrate by heat fusion from the circuit substrate, comprising: a suction unit including a suction nozzle having a hollow shape, for sucking the electronic component by a head end of the suction nozzle; a heating unit including a heating element disposed at a lower portion of the adsorption nozzle, for heating the heating element by electromagnetic induction heating; and a conduction part for conducting heat generated by the heating body to the head end of the adsorption nozzle.
The present application is applicable to releasing a weld joint, and also to releasing a joint formed by heat fusion. For example, the electronic component may be removed from the circuit substrate by releasing an AFC (anisotropic conductive film) bonding or a conductive adhesive bonding.
According to the present invention, the electronic component can be removed from the circuit board even when the area of the metal terminal is small.
Drawings
Fig. 1 is a schematic diagram (perspective view) of the apparatus of the first embodiment.
Fig. 2 is a schematic apparatus (sectional view) of the first embodiment.
Fig. 3 is an explanatory diagram of the operation of the first embodiment.
Fig. 4 is an explanatory diagram of the operation of the second embodiment.
Fig. 5 is a schematic apparatus (sectional view) of the third embodiment.
Fig. 6 is a schematic apparatus (sectional view) of the fourth embodiment.
Fig. 7 is a basic principle of electromagnetic induction.
Detailed Description
< Structure of the first embodiment >
Fig. 1 is a perspective view schematically showing the apparatus according to the first embodiment, and fig. 2 is a sectional view.
The apparatus is composed of a nozzle 50, a suction device 60, a heating device 70, and a control device 80 (see fig. 3).
The nozzle 50 is mainly (or entirely) made of a material having high heat resistance and high thermal conductivity. Examples thereof include ceramics, ruby, sapphire, and diamond. In 2019, the present invention can be sufficiently realized with a ceramic processing accuracy of a minimum pore diameter of 10 μm among ceramics.
The nozzle 50 has a hollow 51. One end of the hollow 51 absorbs the electronic components, and the other end of the hollow 51 is connected to the suction device 60. Thereby, the nozzle 50 can be sucked through the hollow 51. In order to cope with the minute electronic components, the tip of the nozzle 50 is preferably tapered in a spindle shape.
A heating element 71 is provided below the nozzle 50 so as to be wound around the nozzle 50. The heating element 71 is generally made of a metal material. As the metal material, gold, silver, copper, aluminum, nickel, chromium, and the like are available. As a method of disposing the heating element 71 below the nozzle 50, for example, the nozzle 50 may be fitted with the cylindrical heating element 71 by vapor deposition or plating.
A coil 72 is disposed on the outer periphery of the nozzle 50. Conversely, the nozzle 50 is disposed in the inner space of the coil. The heating element 71, the coil 72, and the power supply (see fig. 7) constitute a heating device (heating unit) 70. When a current is supplied from a power supply to the coil 72, a magnetic field is generated, and the heating element 71 located in the magnetic field generates heat.
< action of the first embodiment >
Fig. 3 is an explanatory diagram of the operation of the first embodiment. In fig. 3, the heating element 71 is provided in the nozzle spindle portion, which is slightly different from the heating element 71 provided in the nozzle body portion in fig. 1 and 2. Although it is preferable to provide the heating element 71 in the nozzle spindle portion in order to be closer to the solder, the heating element 71 may be provided in the nozzle body portion when the processing for providing the heating element 71 in the nozzle spindle portion is difficult. The principle of action is common.
A plurality of electronic components (for example, LEDs) 20 are mounted on the circuit board 10. Specifically, the circuit board 10 is formed with a wiring circuit 11 (not shown) and circuit-side terminals 12. The electronic component 20 has electronic component-side terminals 22. The circuit-side terminals 12 and the electronic component-side terminals 22 are joined via solder 30.
The following description is given in the case where one of the plurality of electronic components has an abnormality or a failure, only the electronic component is removed while avoiding an influence on the operation of the adjacent normal electronic component.
In the present apparatus, the suction device 60 is linked with the heating device 70 by the control device 80.
When the suction device 60 is operated, a negative pressure is generated in the hollow 51 of the nozzle 50. When the nozzle 50 is brought close to the electronic component 20 in this state, the tip end of the nozzle 50 is attracted to the surface of the electronic component 20. Here, the suction device 60, the hollow 51 of the nozzle 50, and the tip end of the nozzle 50 constitute an adsorption portion.
On the other hand, when an alternating current flows in the coil 72, magnetic lines of varying intensity are generated. The conductive substance (in this case, the metal heating element 71) placed in the vicinity is influenced by the changed magnetic lines of force, and an eddy current flows in the metal. Since a metal generally has resistance, when current flows in the metal, joule heat is generated, so that the metal (heating element 71) generates heat by itself. This phenomenon is called induction heating.
The heat generated by the heating device 70 is conducted from the heating element 71 to the electronic component 20 and the solder 30 through the nozzle 50 having excellent thermal conductivity. The nozzle 50 itself constitutes the conducting portion.
Thereby, the solder 30 melts, and the connection between the circuit-side terminals 12 and the electronic component-side terminals 21 is released. On the other hand, the electronic component 20 is maintained in a suction state with the nozzle 50, so that the electronic component 20 can be removed from the circuit substrate 10 when the nozzle 50 is separated from the circuit substrate 10. When the suction device 60 stops operating, the suction state between the electronic component 20 and the nozzle 50 is released, and the electronic component 20 can be collected.
< remarks >
The problem to be solved by the present application is that the area of the terminal 12 is small, and sufficient heat generation from the terminal 12 cannot be ensured. However, the terminal 12 does not generate heat by itself at all by electromagnetic induction heating. Heat generation in the terminal 12 is also conducted to the solder 30. Therefore, the terminal 12 is also preferably made of metal.
On the other hand, when heat generation of the terminal 12 itself is not desired at all, it may be conductive polymer, conductive carbon, or the like. The wiring is thinner than the size of the terminal 12, and does not contribute to electromagnetic induction heating, and therefore, is not considered.
The wiring and the terminal 12 are formed of a conductive material. Generally, the metal material includes gold, silver, copper, aluminum, nickel, chromium, and the like. The wiring and the terminal 12 are formed by a generally known method (printing, etching, metal evaporation, plating, silver salt, or the like).
< dimensional study of first embodiment >
The problem to be solved by the present application is that when the area of the terminal 12 is small, a sufficient amount of heat generated by the terminal 12 cannot be ensured. Therefore, the interrelationship between the dimensions is very important. Hereinafter, each dimension in the first embodiment will be schematically described.
In the case where the area of the metal terminal is about 1mm × 1mm or less, defects such as heat generation defects are scattered depending on the type of the solder. When the metal terminal area is about 500 μm × 500 μm or less, defects are conspicuous. The present inventors have investigated the removal of electronic components (e.g., micro LEDs) having metal terminal areas of about 25 μm × 25 μm to 50 μm × 50 μm in the future.
Therefore, the area of the metal terminal is 1mm × 1mm or less, preferably 500 μm × 500 μm or less, more preferably 250 μm × 250 μm or less, and still more preferably 100 μm × 100 μm or less.
The correlation between the dimensions will be described by taking as an example an electronic component of about 1mm × 1mm having a metal terminal area of 250 μm × 250 μm and 4 terminals.
A plurality of electronic components 20 are mounted on the circuit board 10. The spacing of the electronic components is comparable to the size of the electronic components. In the above example at a spacing of 1 mm.
Here, when the diameter of the nozzle is 3mm (≈ size of electronic components + two adjacent spaces) or more, there is a fear that an influence is exerted on the adjacent electronic components. Therefore, the diameter of the nozzle is preferably 3mm (≈ size of electronic components + two adjacent spaces) or less. On the other hand, since heat conduction is generated by contact between the tip of the nozzle 50 and the electronic component 20, the diameter of the nozzle is preferably about 1mm (corresponding to the size of the electronic component) or more. The diameter of the suction hole (hollow 51) is preferably about 100 to 200 μm.
When the diameter of the nozzle is 1mm, the length of the heat-generating body 71 in the circumferential direction is about 3 mm. When the length of the heating element 71 in the axial direction is 2.5mm (about 10 times the size of the metal terminal), the area of the heating element is 120 times the area of the metal terminal, and a sufficient area can be secured. That is, the heating element 71 is sufficiently larger than the metal terminal 12.
The correlation between the dimensions is explained by taking an electronic component of about 200 μm × 200 μm having a metal terminal area of 50 μm × 50 μm and 4 terminals as another example.
A plurality of electronic components 20 are mounted on the circuit board 10. The spacing of the electronic components is comparable to the size of the electronic components. In the above example at 200 μm intervals.
Here, when the diameter of the nozzle becomes 600 μm (≈ size of electronic components + two adjacent spaces) or more, there is a fear that the adjacent electronic components are affected. Therefore, the diameter of the nozzle is preferably 600 μm (≈ size of electronic components + two adjacent spaces) or less. On the other hand, since heat conduction is generated by contact between the tip of the nozzle 50 and the electronic component 20, the diameter of the nozzle is preferably about 200 μm (corresponding to the size of the electronic component) or more. The diameter of the suction hole (hollow 51) is preferably about 20 to 40 μm. In 2019, the present invention can be fully realized with a ceramic processing accuracy of 10 μm in the smallest pore diameter among the ceramics.
When the diameter of the nozzle is 300. mu.m, the length of the heat-generating body 71 in the circumferential direction is about 0.9 mm. When the length of the heating element 71 in the axial direction is 1.2mm (about 24 times the size of the metal terminal), the area of the heating element is 432 times the area of the metal terminal, and a sufficient area can be secured. That is, the heating element 71 is sufficiently larger than the metal terminal 12.
< effects of the first embodiment >
By heating with the heating element 71 provided also in the adsorption nozzle 50, the electronic component 20 can be removed from the circuit board 10 even when the area of the metal terminal 12 on the circuit side is small. In this case, the adjacent electronic components are not affected.
< second embodiment >
Fig. 4 is an explanatory diagram of the operation of the second embodiment. The outline structure is also described. The second embodiment is a modification of the first embodiment.
That is, the ferrite core 73 is externally attached around the nozzle 50 and the heating element 71. Here, the heating element 71, the coil 72, the ferrite core 73, and the power supply (see fig. 7) constitute a heating device (heating unit) 70.
When the power supply supplies current to the coil 72, a magnetic field is generated that is focused along the ferrite core 73. As a result, the amount of heat generated by the heating element 71 increases. Further, the amount of heat generation of the metal terminal 12 also increases. By this multiplication effect, the solder 30 is surely melted.
The operation of removing the electronic component 20 from the circuit substrate 10 by the interlocking of the suction device 60 and the heating device 70 is the same as that of the first embodiment.
< third embodiment >
Fig. 5 is a cross-sectional view schematically showing the apparatus of the third embodiment. In the first and second embodiments, ceramics with high processing accuracy is used in the main part of the nozzle in order to secure the hollow 51 of the minute hole. In contrast, in the third embodiment, a main portion (or the whole) of the nozzle 55 is made of metal.
The third embodiment can be applied to the case where the same level of metal working accuracy as that of ceramics can be obtained, or the case where no minute hole is required as in the first and second embodiments.
Here, the metallic nozzle 55, the coil 72, and the power supply (see fig. 7) constitute a heating device (heating unit) 70. When the power supply supplies a current to the coil 72, a magnetic field is generated, and the metal nozzle 55 located in the magnetic field generates heat. The heat generated by the nozzle 55 is conducted to the electronic component 20 and the solder 30 via the tip of the nozzle 55. Thereby, the solder 30 melts.
The operation of removing the electronic component 20 from the circuit substrate 10 by the interlocking of the suction device 60 and the heating device 70 is the same as that of the first embodiment.
< fourth embodiment >
Fig. 6 is a cross-sectional view schematically showing an apparatus according to a fourth embodiment, and combines the technical idea of the second embodiment with the technical idea of the third embodiment.
That is, the main portion of the nozzle 56 is constituted by a ferrite core. A metal heat generating fixture 74 is fitted to the tip end of the nozzle 56.
The heat generating component 74 has an insertion portion and a contact portion. The insertion portion of the heat generating attachment 74 is inserted into the hollow 51. The contact portion of the heat generating mount 74 can contact the electronic component at the head end position of the nozzle.
Here, the ferrite core nozzle 56, the coil 72, the heat generating attachment 74, and the power supply (see fig. 7) constitute a heating device (heating unit) 70. When the power supply supplies current to the coil 72, a magnetic field is generated that is focused along the ferrite core 56. The heat generating mounts 74 located in the magnetic field range generate heat. The heat generated by the heat generating component 74 is conducted to the electronic component 20 and the solder 30. Thereby, the solder 30 melts.
The operation of removing the electronic component 20 from the circuit substrate 10 by the interlocking of the suction device 60 and the heating device 70 is the same as that of the first embodiment.
< others >
The present application is applicable to releasing a weld joint, and also to releasing a joint formed by heat fusion. For example, the electronic component may be removed from the circuit substrate by releasing an AFC (anisotropic conductive film) bonding or a conductive adhesive bonding.
Description of the reference numerals
10: circuit board
11: wiring circuit
12: circuit side terminal
20: electronic component
22: electronic component side terminal
30: solder
50: nozzle (ceramic)
51: hollow cavity
55: nozzle (made of metal)
56: nozzle (ferrite core)
60: inhalation device
70: heating device
71: heating body
72: coil
73: ferrite magnetic core
74: heating installation part
80: control device
Claims (9)
1. A removing device for removing an electronic component assembled on a circuit substrate by solder bonding from the circuit substrate, comprising:
a suction unit including a suction nozzle having a hollow shape, for sucking the electronic component by a head end of the suction nozzle;
a heating unit including a heating element disposed at a lower portion of the adsorption nozzle, for heating the heating element by electromagnetic induction heating; and
and a conduction part for conducting heat generated by the heating body to the head end of the adsorption nozzle.
2. The removing device according to claim 1, wherein the heat generating body is larger than a terminal of the circuit substrate.
3. The removing device according to claim 1 or 2, wherein a terminal size of the circuit substrate is 500 x 500 μm or less.
4. A removing device according to any of claims 1 to 3, further comprising a ferrite core mounted outside the heat generating body.
5. A method for removing an electronic part is provided,
use of a removal device according to any of claims 1 to 4,
the heating element is heated by the heating unit,
the heat generated by the heating element is conducted to the head end of the adsorption nozzle through the conduction part to melt the solder,
the electronic component assembled on the circuit substrate by solder bonding is removed from the circuit substrate by sucking the electronic component by the head end of the suction nozzle through the suction portion.
6. A removing device for removing an electronic component assembled on a circuit substrate by solder bonding from the circuit substrate, comprising:
a suction part including a suction nozzle having a hollow and formed of a metal, for sucking the electronic component by a head end of the suction nozzle; and
a heating part for heating the head end of the adsorption nozzle through electromagnetic induction heating.
7. A removing device for removing an electronic component assembled on a circuit substrate by solder bonding from the circuit substrate, comprising:
an adsorption part including an adsorption nozzle having a hollow and formed of ferrite, for adsorbing the electronic component by a head end of the adsorption nozzle; and
and a heating part including a heating body installed at a tip end of the adsorption nozzle, for heating the heating body by electromagnetic induction heating.
8. A method for removing an electronic part is provided,
with the removal device according to claim 6 or 7,
the head end of the adsorption nozzle is heated by the heating part to melt the solder,
the electronic component assembled on the circuit board by solder bonding is removed from the circuit board by sucking the electronic component by the head end of the suction nozzle through the suction portion.
9. A removing device for removing an electronic component thermally fusion-assembled on a circuit substrate from the circuit substrate, comprising:
a suction unit including a suction nozzle having a hollow shape, for sucking the electronic component by a head end of the suction nozzle;
a heating unit including a heating element disposed at a lower portion of the adsorption nozzle, for heating the heating element by electromagnetic induction heating; and
and a conduction part for conducting heat generated by the heating body to the head end of the adsorption nozzle.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/047349 WO2021111538A1 (en) | 2019-12-04 | 2019-12-04 | Electronic member removal method and device therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114762466A true CN114762466A (en) | 2022-07-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980102763.8A Pending CN114762466A (en) | 2019-12-04 | 2019-12-04 | Method and apparatus for removing electronic component |
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| Country | Link |
|---|---|
| JP (1) | JP7128994B2 (en) |
| KR (1) | KR102498034B1 (en) |
| CN (1) | CN114762466A (en) |
| TW (1) | TWI808356B (en) |
| WO (1) | WO2021111538A1 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009164310A (en) * | 2007-12-28 | 2009-07-23 | Sharp Corp | Electronic parts repair equipment and electronic parts repairing method |
| KR20160129570A (en) * | 2015-04-30 | 2016-11-09 | 주식회사 다원시스 | Induction heating desoldering device |
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| KR102480461B1 (en) * | 2017-11-30 | 2022-12-21 | 쌩-고벵 글래스 프랑스 | An apparatus for soldering a terminal of window glass for a vehicle and method thereof |
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2019
- 2019-12-04 KR KR1020227013988A patent/KR102498034B1/en active IP Right Grant
- 2019-12-04 JP JP2021562245A patent/JP7128994B2/en active Active
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| JP2009164310A (en) * | 2007-12-28 | 2009-07-23 | Sharp Corp | Electronic parts repair equipment and electronic parts repairing method |
| KR20160129570A (en) * | 2015-04-30 | 2016-11-09 | 주식회사 다원시스 | Induction heating desoldering device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI808356B (en) | 2023-07-11 |
| JP7128994B2 (en) | 2022-09-01 |
| KR102498034B1 (en) | 2023-02-10 |
| TW202139806A (en) | 2021-10-16 |
| WO2021111538A1 (en) | 2021-06-10 |
| JPWO2021111538A1 (en) | 2021-06-10 |
| KR20220112748A (en) | 2022-08-11 |
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