TWI808356B - Method and device for removing electronic components - Google Patents

Abstract

Provides a technique for removing electronic components from a circuit board even when the area of the metal terminal is small. The plurality of electronic components 20 are bonded to the circuit board 10 via solder 30 . The device comprises: adsorption means 60, which includes an adsorption nozzle 50 having a hollow 51, and adsorbs the electronic component 20 at the head end of the adsorption nozzle; It is conducted from the heating element 71 to the electronic component 20 and the solder 30 through the nozzle 50 . Therefore, the solder 30 melts, and the connection between the circuit side terminal 12 and the electronic component side terminal 22 is released. On the other hand, the adsorption state between the electronic component 20 and the nozzle 50 is maintained, and the electronic component 20 can be removed from the circuit substrate 10 when the nozzle 50 is kept away from the circuit substrate 10 .

Description

Method and device for removing electronic components

The invention relates to a technique for removing electronic components assembled on a substrate by means of electromagnetic induction heating.

In electronic equipment, when electronic components such as semiconductors are assembled on a circuit board, they are soldered. Soldering is performed by disposing solder between objects to be joined, and then heating and melting the solder.

A plurality of electronic components are assembled on the substrate system. In the event of an abnormality or failure, only the electronic component is removed while avoiding the influence on the normal electronic component.

For example, hot air is supplied to the electronic component to melt the solder to remove the electronic component from the substrate (for example, Patent Document 1).

However, in recent years, the miniaturization of electronic components has progressed. For example, micro LEDs with a diameter of 100 μm or less are used as monitors become more pixelated. It is difficult to apply sufficient hot air only to the small electronic component to be removed without affecting the adjacent small electronic component.

Also, the removal technology by supplying hot air can be applied to substrates made of heat-resistant resins such as polyamideimide or polyimide, but it is difficult to apply to substrates made of thermoplastic resins or non-heat-resistant materials such as paper or cloth. In addition, examples of non-heat-resistant thermoplastic resins include ABS resin, acrylic, polycarbonate, polyester, polybutylene, polyurethane, PET (polyethylene terephthalic acid), and the like.

On the other hand, as a technique of spot heating, there is electromagnetic induction heating. electromagnetic induction The electronic components assembled on the substrate should be removed by heating (for example, Patent Document 2).

Fig. 7 is a schematic diagram of the basic principle of electromagnetic induction heating. The electromagnetic induction heating device is composed of an induction coil, a power supply and a control device.

When an alternating current flows through the induction coil, magnetic lines of force that change in intensity are generated. When a conductive substance (specifically, a bonding object, generally formed of metal) is placed near it, the eddy current flows in the metal under the influence of the changing magnetic force lines. Because the metal system generally has resistance, when the current flows to the metal, Joule heat is generated, and the metal generates heat by itself. This phenomenon is called induction heating.

The calorific value Q by electromagnetic induction is expressed by the following mathematical formula. Q=(V ² /R)×t[V=applied voltage: R=resistance: t=time]

In electromagnetic induction heating, since only the metal generates heat, there is little doubt that the surrounding resin part will suffer heat damage. In addition, there is almost no thermal influence on electronic components, and there is little concern that electronic components will suffer thermal damage.

In electromagnetic induction heating, because only the metal generates heat, it can be joined in a short time with less energy. The time coefficient required for one joint is seconds to ten seconds.

In electromagnetic induction heating, if the system is in a uniform magnetic field, the predetermined Joule heat can be obtained, so the bonding accuracy is high. Also, in a uniform magnetic field, a plurality of joints can be performed simultaneously.

In electromagnetic induction heating, it is easy to control the power output and output time by means of the control device. As a result, the control of heating temperature and heating time is also easy. The desired temperature profile can be set.

The metal terminal on the circuit board side generates heat, the heat is conducted to the solder, and the solder melts. Solder is also melted at the time of removal in the same manner as at the time of bonding.

In electromagnetic induction heating, by adjusting the power output, magnetic force control is also easy. Therefore, it is possible to heat only the metal terminal on the side of the circuit board corresponding to the electronic component to be removed while avoiding the influence on the adjacent electronic component.

According to the above, when the electronic components assembled on the circuit board are removed by electromagnetic induction heating The method can cope with the miniaturization of electronic components. In addition, it can also be applied to substrates made of non-heat-resistant materials.

[Prior patent documents] [Patent Document]

Patent Document 1: Japanese Patent Laid-Open No. 2004-186491

Patent Document 2: Japanese Patent Laid-Open No. 2001-044616

As shown above, if the method of removing the electronic components assembled on the substrate by electromagnetic induction heating can cope with the miniaturization of the electronic components.

However, as the miniaturization of electronic components progresses, the area of the metal terminals that are heat generating objects also becomes narrow. In particular, when a plurality of electronic components are arranged in a predetermined area, or when the electronic component has a plurality of terminals (for example, ball grid array (BGA) or chip size package (CSP)), the area of the metal terminal becomes narrower. As a result, the resistance R becomes large, and sufficient heat generation cannot be ensured (the denominator of the theoretical mathematical formula becomes large).

According to the above-mentioned theoretical mathematical formula, by increasing the applied voltage V or increasing the application time t, the calorific value Q can be ensured.

On the other hand, when the area of the metal terminal is less than about 1 mm × 1 mm, defects such as poor heat generation are scattered depending on the type of solder, and when the area of the metal terminal is less than about 500 μm × 500 μm, the defect becomes conspicuous. In electromagnetic induction heating, although the applied voltage or the applied time can be adjusted with high precision, there is a limit to the elimination of defects even if the applied voltage or the applied time is adjusted.

However, there are several types of solder, generally used from high temperature solder (for example, SnAgCu It is solder with a melting point of about 220°C) to low-temperature solder (for example, SnBi solder with a melting point of about 140°C). This defect also occurs if low-temperature solder is used as the object of soldering.

In addition, the size of the circuit side terminal corresponding to the micro LED is about 25 μm×25 μm~50 μm×50 μm, and the method of removing only the defective micro LED has not been established. The inventors of the present invention envision the application of the removal of electronic components of such a size in the future, and there is a high possibility that this defect will become conspicuous.

The present invention is to solve the above-mentioned problems, and an object thereof is to provide a removal technique of electronic components that can cope with the narrow area of the metal terminal.

The present invention that solves the above-mentioned problems is a device that removes electronic components assembled on a circuit board by soldering from the circuit board. The device includes: adsorption means, which includes a hollow adsorption nozzle, and adsorbs the electronic component at the head end of the adsorption nozzle; heating means, which includes a heating element arranged at the lower part of the adsorption nozzle, and heats the heating element by electromagnetic induction heating; and conduction means, which conducts heat generated by the heating element to the head end of the adsorption nozzle.

The heat generated by the heating means is conducted to the electronic components and solder through the conduction means. And the solder melts. Between them, the adsorption state of the nozzle and the electronic component is maintained by means of adsorption. Even if the area of the metal terminal is narrow and the heating capacity is insufficient, the heating element will generate heat. Therefore, electronic components assembled on the circuit substrate by soldering can be removed from the circuit substrate.

In the invention, it is preferable that the heating system is larger than the terminals of the circuit board.

Therefore, even in the case where the area of the metal terminal is narrow and the amount of heat generated is insufficient, the heat generating body can reliably generate heat.

In this invention, the size of the terminals of the circuit board is preferably 500×500 μm or less. It is preferably 250 μm×250 μm or less, more preferably 100 μm×100 μm or less.

When the terminal size becomes 1mm×1mm or less, it is scattered after electromagnetic induction heating Defects such as insufficient calorific value, etc., become conspicuous when the thickness becomes 500×500 μm or less. The narrower it is, the less heat it generates. According to the present invention, the metal terminals can also be removed when the area is small.

In this invention, it is more preferable to have a ferrite core mounted on the heating element.

Therefore, the calorific value of the heating element increases, and the calorific value of the metal terminal also increases. By the synergistic effect, the solder is definitely melted.

The present invention to solve the above-mentioned problems is a method of removing an electronic component assembled on a circuit board by soldering from the circuit board. The method is: using the device; heating the heating element by the heating means; conducting the heat generated by the heating element to the head end of the adsorption nozzle by the conduction means to melt the solder; absorbing the electronic component at the head end of the adsorption nozzle by the adsorption means, and removing the electronic component assembled on the circuit substrate by soldering from the circuit substrate.

Even if the area of the metal terminal is narrow and the heating capacity is insufficient, the heating element will generate heat. Therefore, electronic components assembled on the circuit substrate by soldering can be removed from the circuit substrate.

The present invention that solves the above-mentioned problems is a device that removes electronic components assembled on a circuit board by soldering from the circuit board. The device includes: adsorption means, which includes a hollow adsorption nozzle formed of metal, and adsorbs the electronic component at the head end of the adsorption nozzle; and heating means, which heats the head end of the adsorption nozzle by electromagnetic induction heating.

Even when the area of the metal terminal is small and the heat generation is insufficient, the metal nozzle generates heat. Therefore, electronic components assembled on the circuit substrate by soldering can be removed from the circuit substrate.

The present invention that solves the above-mentioned problems is a device that removes electronic components assembled on a circuit board by soldering from the circuit board. The device includes: adsorption means, which includes a hollow adsorption nozzle formed of ferrite, and adsorbs the electronic component at the head end of the adsorption nozzle; and heating means, which includes a heating element installed at the head end of the adsorption nozzle, and heats the heating element by electromagnetic induction heating.

Even in the case where the area of the metal terminal is small and the heat generation is insufficient, the heating body will generate heat. hot. Therefore, electronic components assembled on the circuit substrate by soldering can be removed from the circuit substrate.

The present invention to solve the above-mentioned problems is a method of removing an electronic component assembled on a circuit board by soldering from the circuit board. The method is: using the device; heating the head end of the adsorption nozzle by the heating means to melt the solder; adsorbing the electronic component on the head end of the adsorption nozzle by the adsorption means, and removing the electronic component assembled on the circuit substrate by soldering from the circuit substrate.

Even if the area of the metal terminal is narrow and the heat generation is insufficient, the tip of the nozzle will generate heat. Therefore, electronic components assembled on the circuit substrate by soldering can be removed from the circuit substrate.

The present invention, which solves the above-mentioned problems, is a device for removing electronic components assembled on a circuit board by heat-melting means from the circuit board. The device includes: adsorption means, which includes a hollow adsorption nozzle, and adsorbs the electronic component at the head end of the adsorption nozzle; heating means, which includes a heating element arranged at the lower part of the adsorption nozzle, and heats the heating element by electromagnetic induction heating; and conduction means, which conducts heat generated by the heating element to the head end of the adsorption nozzle.

In addition to welding, the present invention can also be applied to the release of joints by heat-melting means. For example, the electronic components can be removed from the circuit substrate by releasing AFC (Anisotropic Conductive Film) bonding or bonding by conductive adhesive.

According to the present invention, it is possible to remove electronic components from a circuit board even in a case where the area of the metal terminal is small.

10: Circuit board

11: Wiring circuit

12: Circuit side terminal

20: Electronic components

22: Electronic component side terminal

30: Solder

50: nozzle (ceramic)

51: hollow

55: Nozzle (metal)

56: Nozzle (made of ferrite core)

60: Inhalation device

70: heating device

71: Heating body

72: Coil

73: Ferrite core

74: Heating accessories

80: Control device

[ Fig. 1 ] is an outline (perspective view) of the device of the first embodiment.

[ Fig. 2 ] is an outline (sectional view) of the device of the first embodiment.

[ Fig. 3 ] is an explanatory diagram of the operation of the first embodiment.

[ Fig. 4 ] is an explanatory diagram of the operation of the second embodiment.

[ Fig. 5 ] is an outline (sectional view) of a device according to a third embodiment.

[FIG. 6] It is the outline|summary (sectional view) of the apparatus of 4th Embodiment.

[Figure 7] is the basic principle of electromagnetic induction.

<First Embodiment Configuration>

FIG. 1 is a schematic perspective view of an apparatus according to a first embodiment, and FIG. 2 is a cross-sectional view.

The device is composed of a nozzle 50, a suction device 60, a heating device 70, and a control device 80 (refer to FIG. 3 ).

The main part (or all) of the nozzle 50 is made of a material with high heat resistance and high thermal conductivity. For example, ceramics, ruby, sapphire, diamond, etc. are mentioned. In addition, as of 2019, in ceramics, the ceramic processing accuracy with a minimum pore diameter of 10 μm can be fully realized by the present invention.

The nozzle 50 has a hollow 51 . Electronic components are adsorbed at one end of the hollow 51 , and the other end of the hollow 51 is continuous with the suction device 60 . Thereby, the nozzle 50 is adsorbable through the hollow 51 . In addition, in order to cope with minute electronic components, it is preferable that the head end of the nozzle 50 tapers gradually in a hammer shape.

At the lower part of the nozzle 50, a heating element 71 is provided so as to be wound around the nozzle 50. As shown in FIG. The heating element 71 is generally made of metal materials. As the metal material, there are gold, silver, copper, aluminum, nickel, chromium, and the like. As the method of disposing the heating element 71 with respect to the lower part of the nozzle 50, there may be exemplified a method of fitting the nozzle 50 with the cylindrical heating element 71 by vapor deposition or electroplating.

A coil 72 is arranged around the nozzle 50 . Conversely, the nozzle 50 is arranged in the inner space of the coil. The heating element 71 , the coil 72 , and the power source (see FIG. 7 ) constitute a heating device (heating means) 70 . When a current is supplied from a power source to the coil 72, a magnetic field is generated, and the heating element 71 located in the range of the magnetic field generates heat.

<First Embodiment Operation>

Fig. 3 is an explanatory diagram of the operation of the first embodiment. However, compared to FIG. 1 and FIG. 2 , the heating element 71 is provided on the nozzle trunk, and in FIG. 3 , the heating element 71 is provided on the nozzle hammer portion, which is slightly changed. In order to be closer to the solder, it is better to install the heating element 71 on the nozzle hammer, but if it is difficult to process the heating element 71 on the nozzle hammer, the heating element 71 can also be installed on the nozzle trunk. The principle of action is common.

A plurality of electronic components (for example, LEDs) 20 are assembled on the circuit board 10 . Specifically, a wiring circuit 11 (not shown) and circuit-side terminals 12 are formed on the circuit board 10 . The electronic component 20 has an electronic component side terminal 22 . The circuit-side terminal 12 and the electronic component-side terminal 22 are joined via solder 30 .

Describes the action of removing only the electronic component when one of the plurality of electronic components is abnormal or faulty, while avoiding the influence on the adjacent normal electronic components.

In this device, the inhalation device 60 and the heating device 70 are operated in conjunction with the control device 80 .

When the suction device 60 operates, a negative pressure is generated in the hollow 51 of the nozzle 50 . In this state, when the nozzle 50 is brought close to the electronic component 20 , the tip of the nozzle 50 sticks to the surface of the electronic component 20 . Here, the suction device 60, the hollow 51 of the nozzle 50, and the head end of the nozzle 50 constitute suction means.

On the other hand, when an alternating current is supplied to the coil 72 , magnetic lines of force that vary in intensity are generated. When a conductive substance (in the present invention, a metal heating element 71) is placed near it, the eddy current flows in the metal under the influence of the changing magnetic lines of force. Since the metal system generally has resistance, Joule heat is generated when a current flows to the metal, and the metal (the heating element 71 ) generates heat by itself. This phenomenon is called electromagnetic induction heating.

The heat generated by the heating device 70 is conducted from the heating element 71 to the electronic component 20 and the solder 30 through the nozzle 50 having excellent thermal conductivity. The nozzle 50 itself constitutes the conduction means.

Therefore, the solder 30 melts, and the connection between the circuit side terminal 12 and the electronic component side terminal 22 is released. On the other hand, the adsorption state of the electronic component 20 and the nozzle 50 is maintained, and the electronic component 20 can be removed from the circuit substrate 10 when the nozzle 50 is kept away from the circuit substrate 10 . Furthermore, the suction device 60 stops During operation, the adsorption state between the electronic component 20 and the nozzle 50 is released, and the electronic component 20 can be recovered.

<Remarks>

However, the subject of the present invention is that the area of the terminal 12 is narrow, and sufficient heat generation by the terminal 12 cannot be ensured. However, the terminal 12 is not completely self-heating due to electromagnetic induction heating. The heat generated at the terminal 12 is also conducted to the solder 30 . Therefore, it is preferable that the terminal 12 is also made of metal.

On the other hand, when heat generation of the terminal 12 itself is not expected at all, a conductive polymer, conductive carbon, or the like may be used. Also, the wiring is thinner than the size of the terminal 12 and is not considered because it does not contribute to electromagnetic induction heating.

In addition, the wiring and the terminal 12 are formed of a conductive material. Generally, it is a metal-based material including gold, silver, copper, aluminum, nickel, chromium, and the like. The wiring and terminals 12 are formed by common known methods (printing, etching, metal vapor deposition, electroplating, silver salt, etc.).

<Review of dimensions of the first embodiment>

The subject of the present invention is that it is impossible to ensure sufficient heat generation by the terminal 12 when the area of the terminal 12 is small. Therefore, the relationship between the dimensions is very important. Each dimension of the first embodiment will be schematically described below.

In fact, it is verified by a prototype model that when the area of the metal terminal is less than about 1mm x 1mm, defects such as poor heat generation are scattered depending on the type of solder, and when the area of the metal terminal is less than about 500μm x 500μm, the failure becomes conspicuous. In addition, the present inventors are going to examine the removal of electronic components (such as micro LEDs) whose area of the metal terminal is about 25 μm×25 μm˜50 μm×50 μm.

Therefore, the area of the metal terminal is not more than 1 mm×1 mm, preferably not more than 500 μm×500 μm, more preferably not more than 250 μm×250 μm, more preferably not more than 100 μm×100 μm.

As an example, for an electronic component having a metal terminal area of 250 μm×250 μm and having four terminals of about 1 mm×1 mm, the relationship between the dimensions will be described.

A plurality of electronic components 20 are assembled on the circuit board 10 . The spacing between electronic components is equivalent In the size of electronic components. In the above example, the interval is 1mm.

Here, when the diameter of the nozzle becomes more than 3 mm (≒ the size of the electronic component + the distance between two neighbors), there is a concern that the adjacent electronic components will be affected. Therefore, the diameter of the nozzle is preferably less than 3 mm (≒ the size of the electronic component + the distance between two neighbors). On the other hand, since heat conduction occurs through the contact between the head end of the nozzle 50 and the electronic component 20, the diameter of the nozzle is preferably about 1 mm (corresponding to the size of the electronic component) or more. The diameter of the suction hole (hollow 51 ) is preferably about 100-200 μm.

When the diameter of the nozzle is 1 mm, the length in the circumferential direction of the heating element 71 is about 3 mm. When the axial length of the heating element 71 is 2.5 mm (about 10 times the size of the metal terminal), the area of the heating element is 120 times the area of the metal terminal, and a sufficient area can be secured. That is, the heating element 71 is sufficiently larger than the metal terminal 12 .

As another example, for an electronic component having a metal terminal area of 50 μm×50 μm and four terminals of approximately 200 μm×200 μm, the relationship between the dimensions will be described.

A plurality of electronic components 20 are assembled on the circuit board 10 . The spacing between the electronic components is equivalent to the size of the electronic components. In the above example, the interval is 200 µm.

Here, when the diameter of the nozzle is more than 600 μm (≒ the size of the electronic component + the distance between two neighbors), there is a possibility that the influence on the adjacent electronic components may be caused. Therefore, the diameter of the nozzle is preferably less than 600 μm (≒ the size of the electronic component + the distance between two neighbors). On the other hand, since heat conduction occurs through the contact between the head end of the nozzle 50 and the electronic component 20, the diameter of the nozzle is preferably about 200 μm (corresponding to the size of the electronic component) or more. The diameter of the suction hole (hollow 51 ) is preferably about 20-40 μm. In addition, as of 2019, in ceramics, the ceramic processing accuracy with a minimum pore diameter of 10 μm can be fully realized by the present invention.

When the diameter of the nozzle is 300 μm, the length in the circumferential direction of the heating element 71 is about 0.9 mm. When the axial length of the heating element 71 is 1.2 mm (about 24 times the size of the metal terminal), the area of the heating element is 432 times the area of the metal terminal, and a sufficient area can be secured. That is, the heating element 71 is sufficiently larger than the metal terminal 12 .

<Effect of the first embodiment>

The electronic component 20 can be removed from the circuit board 10 even when the area of the metal terminal 12 on the circuit side is small by heating by the heat generating body 71 provided also in the adsorption nozzle 50 . At that time, there is no influence on adjacent electronic components.

<Second Embodiment>

Fig. 4 is an explanatory diagram of the operation of the second embodiment. Simultaneously, the schematic structure is also explained. The second embodiment is a modified example of the first embodiment.

That is, the ferrite core 73 is externally mounted around the nozzle 50 and the heating element 71 . Here, the heating element 71 , the coil 72 , the ferrite core 73 , and the power supply (see FIG. 7 ) constitute a heating device (heating means) 70 .

When a current is supplied from a power source to the coil 72 , a magnetic field is generated, and the magnetic field is focused along the ferrite core 73 . As a result, the amount of heat generated by the heating element 71 increases. In addition, the amount of heat generated by the metal terminal 12 also increases. With this synergistic effect, the solder 30 is surely melted.

The operation of removing the electronic component 20 from the circuit board 10 by the linkage of the suction device 60 and the heating device 70 is the same as that of the first embodiment.

<Third Embodiment>

Fig. 5 is a schematic cross-sectional view of a device according to a third embodiment. In the first and second embodiments, in order to ensure the hollow space 51 of the minute hole, ceramics with high processing precision are used for the main part of the nozzle. In contrast, in the third embodiment, the main part (or the whole) of the nozzle 55 is made of metal.

The third embodiment can be applied when the precision of metal processing on the same level as that of ceramics can be obtained, or when the minute holes like the first and second embodiments are not required.

Here, the metal nozzle 55 , the coil 72 , and the power source (see FIG. 7 ) constitute a heating device (heating means) 70 . When a current is supplied from a power source to the coil 72, a magnetic field is generated, and the metal nozzle 55 located in the range of the magnetic field generates heat. The heat generated by the nozzle 55 is conducted to the electronic component 20 and the solder 30 through the head end of the nozzle 55 . Thereby, the solder 30 is melted.

The operation of removing the electronic component 20 from the circuit board 10 by the linkage of the suction device 60 and the heating device 70 is the same as that of the first embodiment.

<Fourth Embodiment>

Fig. 6 is a schematic cross-sectional view of a device according to a fourth embodiment. It is a combination of the technical idea of the second embodiment and the technical idea of the third embodiment.

That is, the main part of the nozzle 56 is comprised by the ferrite core. At the head end of the nozzle 56, a heating accessory 74 made of metal is fitted.

The heating accessory 74 has an insertion portion and a contact portion. The insertion portion of the heating accessory 74 is inserted into the hollow 51 . The contact portion of the heat-generating accessory 74 is at the head end of the nozzle and can be in contact with the electronic components.

Here, the nozzle 56 made of a ferrite core, the coil 72 , the heating attachment 74 , and the power supply (see FIG. 7 ) constitute a heating device (heating means) 70 . When a current is supplied from a power source to the coil 72 , a magnetic field is generated, and the magnetic field is focused along the nozzle 56 made of a ferrite core. The heating attachment 74 located in the range of the magnetic field generates heat. The heat generated by the heat-generating attachment 74 is conducted to the electronic component 20 and the solder 30 . Thereby, the solder 30 is melted.

The operation of removing the electronic component 20 from the circuit board 10 by the linkage of the suction device 60 and the heating device 70 is the same as that of the first embodiment.

<other>

In addition to welding, the present invention can also be applied to the release of joints by heat-melting means. For example, the electronic components can be removed from the circuit substrate by releasing AFC (Anisotropic Conductive Film) bonding or bonding by conductive adhesive.

50: nozzle (ceramic)

71: heating element

72: Coil

Claims (8)

A device for removing an electronic component is a device for removing a plurality of electronic components assembled on a circuit substrate at an interval of less than 1 mm and assembled on a circuit substrate with a size of 500×500 μm or less by welding. The device is characterized in that it includes: an adsorption means includes a hollow adsorption nozzle with a diameter of less than 200 μm, and adsorbs the electronic component at the head end of the adsorption nozzle; a heating means includes a heating element arranged at the lower part of the adsorption nozzle and heats it by electromagnetic induction. The heating element heats and heats the terminals of the circuit substrate; and the conduction means conducts the heat generated by the heating element to the head end of the adsorption nozzle. The device for removing electronic components according to claim 1, wherein the heating system is larger than the terminals of the circuit substrate. The device for removing electronic components according to claim 1 or 2, further comprising a ferrite core mounted on the heating element. A method for removing an electronic component, characterized by: using the device according to claim 1 or 2; using the heating means to heat the heating element and the terminal of the circuit substrate; using the conduction means to conduct the heat generated by the heating element to the head end of the adsorption nozzle to melt the solder; using the adsorption means to adsorb the electronic component at the head end of the adsorption nozzle, and remove the electronic component assembled on the circuit substrate by soldering from the circuit substrate. A device for removing electronic components, which removes from a circuit board a plurality of electronic components assembled on the circuit board at an interval of 1 mm or less and is assembled by soldering to a terminal of a circuit board having a size of 500×500 μm or less, and is characterized in that it includes: suction means, which includes a suction nozzle that is hollow and formed of metal with a diameter of 200 μm or less, and the electronic component is adsorbed at the head end of the adsorption nozzle; and the heating means is to heat the head end of the adsorption nozzle and the terminal of the circuit board by means of electromagnetic induction heating. A device for removing electronic components, which removes from a circuit board a plurality of electronic components assembled on the circuit board at an interval of less than 1 mm and is assembled by soldering to a terminal of a circuit board having a size of 500×500 μm or less, and is characterized in that it includes: an adsorption means that includes a hollow suction nozzle formed of ferrite with a diameter of less than 200 μm, and adsorbs the electronic component at the head end of the adsorption nozzle; and heating means includes a heating element installed at the head end of the adsorption nozzle , and heating by electromagnetic induction to heat the heating element and heat the terminals of the circuit substrate. A method for removing an electronic component, characterized by: using the device according to claim 5 or 6; heating the head end of the adsorption nozzle and the terminal of the circuit substrate by the heating means to melt the solder; adsorbing the electronic component at the head end of the adsorption nozzle by the adsorption means, and removing the electronic component assembled on the circuit substrate by soldering from the circuit substrate. A device for removing electronic components is a device for removing a plurality of electronic components assembled on the circuit substrate at an interval of less than 1mm from a circuit substrate and is a device for assembling electronic components on a terminal of a circuit substrate with a size of 500×500 μm or less by means of thermal melting, which is characterized in that it includes: an adsorption means includes a hollow adsorption nozzle with a diameter of less than 200 μm, and the electronic component is adsorbed at the head end of the adsorption nozzle; the heating means includes a heating element arranged under the adsorption nozzle, and is electromagnetically Induction heating heats the heating element and the terminal of the circuit substrate; and conduction means conducts the heat generated by the heating element to the head end of the adsorption nozzle.

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