JP2020009951A - Mounting method and mounting device of electronic component - Google Patents

Abstract

To provide a mounting method that suppresses complicated management in a process of mounting an electronic component including a terminal and a fixing portion on a substrate including a first pad and a second pad.SOLUTION: A mounting method includes the steps of: applying a first solder 302 on a first pad 102; arranging a substrate 100 and an electronic component 200 such that the first pad 102 and a terminal 202 overlap with each other via the first solder 302, and a second pad 101 and a fixing portion 201 overlap with each other; heating and melting the first solder 302 on the first pad 102 by heating means 400 to connect the first pad 102 and the terminal 202 via the first solder 302; and supplying a second solder 303 to the vicinity of the fixing portion 201 arranged so as to overlap with the second pad 101, heating the second solder 303 by the heating means 400, and connecting the second pad 101 to the fixing portion 201 via the second solder 303.SELECTED DRAWING: Figure 8

Description

  The present invention relates to an electronic component mounting method for mounting an electronic component on a substrate and a mounting apparatus for performing the method.

  2. Description of the Related Art Conventionally, in manufacturing an electronic component mounted body, paste-like solder obtained by mixing a solder powder and a flux is applied to a position corresponding to a wiring pattern on a printed wiring board. Then, after the electronic components are arranged on the printed wiring board via the solder, the electronic components are heated on the inside of the reflow furnace to melt and re-solidify (reflow) the solder, whereby the electronic components are placed on the printed wiring board. It is mounted while connected to the wiring pattern.

  However, for example, a printed wiring board using a flame-retardant resin or the like tends to have a large thermal expansion coefficient, so that the electronic component is mounted on the printed wiring board in a state where connection to the wiring pattern is insufficient. There is fear.

  On the other hand, Patent Literature 1 discloses that a terminal of an electronic component is connected to a first wiring pattern of a substrate in a reflow process using a solder paste, and a fixing portion of the electronic component is used in a soldering process using a thread solder. And the second wiring pattern of the substrate. Thereby, the terminal of the electronic component and the wiring pattern of the substrate can be reliably connected.

JP 2007-201120 A

  However, in the above-mentioned Patent Document 1, a reflow furnace is used in a reflow process for connecting with solder paste, and a soldering iron is used in a soldering process for connecting with thread solder. As described above, since different apparatuses and instruments are used in each step, there is a possibility that the management for such apparatuses and instruments becomes complicated.

  Therefore, an object of the present invention is to reduce the complexity of management in a mounting process of an electronic component.

  An electronic component mounting method according to the present invention is a method for mounting an electronic component including a terminal and a fixing portion on a substrate including a first pad and a second pad. Applying a first solder on the substrate, the substrate and the electronic component such that the first pad and the terminal overlap via the first solder, and the second pad and the fixing portion overlap. Disposing; heating the first solder on the first pad by a heating means to melt the solder; connecting the first pad and the terminal via the first solder; A second solder is supplied in the vicinity of the fixing portion arranged so as to overlap with the second pad, the second solder is heated by the heating means, and the second pad and the fixing portion are heated via the second solder. And a step of connecting .

  ADVANTAGE OF THE INVENTION According to this invention, complication of management in the mounting process of an electronic component can be suppressed.

FIG. 2 is a perspective view illustrating an electronic component mounted body in which the connector component according to the first embodiment is mounted on a printed wiring board. It is a perspective view showing the connector part concerning a 1st embodiment. It is a front view for explaining the soldering device of the electronic component mounting body concerning a 1st embodiment. FIG. 3 is a process flow chart for describing the electronic component mounting method according to the first embodiment. FIG. 3 is a perspective view showing the printed wiring board in a solder coating step according to the first embodiment. FIG. 2 is a perspective view showing a printed wiring board and a connector component in an electronic component placement step according to the first embodiment. FIG. 2 is a perspective view showing a printed wiring board and a connector component before contact with a heating tool in a soldering step according to the first embodiment. It is a figure which shows a printed wiring board and a connector component after a heating tool contact and a thread solder supply in the soldering process which concerns on 1st Embodiment, (a) is a perspective view, (b) is VIIIB of (a). Sectional drawing in line -VIIIB, (c) is a side view. FIG. 9 is a top view for explaining an electronic component mounted body in which the connector component according to the second embodiment is mounted on a printed wiring board. It is a top view which shows a printed wiring board and a connector component after the heating tool contact in the soldering process which concerns on 2nd Embodiment, and after supply of thread solder.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  In the following embodiments, as an example, a connector component as an electronic component for inputting and outputting signals is mounted on a printed wiring board as a substrate on which an external circuit of an image sensor used in an image reading device or the like is formed. The method will be described. The present invention is not limited to the substrates and electronic components described below.

[First Embodiment]
(Configuration of electronic component mounted body)
FIG. 1 is a perspective view of an electronic component mounted body 500 according to the present embodiment. The electronic component mounting body 500 includes a plate-shaped printed wiring board 100 and a connector component 200 mounted on an end of the printed wiring board 100.

  FIG. 2 is a perspective view showing the connector component 200 according to the present embodiment. The connector component 200 has an insulator 203 having a shape like an elongated rectangular parallelepiped. The insulator 203 is made of, for example, a polyamide engineering plastic.

  As shown in FIG. 2A, a plurality of external connection terminals 202 (terminals) are provided at the lower end of one side surface along the length direction of the connector component 200 so as to project in parallel with each other. . That is, a terminal row on which a plurality of external connection terminals 202 are arranged is provided on the side surface of the connector component 200. Further, a fixing bracket 201 functioning as a fixing portion is provided at a lower end portion of the side surface so as to sandwich the plurality of external connection terminals 202 so as to protrude from the side surface. That is, the fixing brackets 201 are provided outside the terminal row in the direction of the terminal row. The external connection terminal 202 and the fixing bracket 201 are made of, for example, an alloy of copper and tin, and have a surface plated with tin.

  As shown in FIG. 2B, an insertion surface 204 into which an FPC (Flexible Printed Circuit) terminal or the like is inserted is provided on the back surface of the side surface of the connector component 200 on which the external connection terminal 202 is provided. I have.

  FIG. 5 is a perspective view showing the printed wiring board 100 according to the present embodiment, and shows the printed wiring board 100 after a solder coating step described later. The printed wiring board 100 is configured by laminating a plurality of glass cloths impregnated with a thermosetting resin such as an epoxy resin, for example. On the surface of the printed wiring board 100, a first wiring pattern 101 (second pad) for fixing the mounted connector component 200 is provided. Further, on the surface of the printed wiring board 100, a plurality of second wiring patterns 102 (first pads) extending in parallel with each other and for inputting and outputting signals are provided. The first wiring pattern 101 is connected to the fixture 201 of the connector component 200, and the second wiring pattern 102 is connected to the external connection terminal 202. The first wiring pattern 101 and the second wiring pattern 102 are made of, for example, a copper thin film, and the surfaces thereof are plated with gold and nickel.

  As shown in FIG. 1, in the electronic component package 500 in which the connector component 200 is mounted on the printed wiring board 100, each of the external connection terminals 202 and each of the second wiring patterns 102 are connected via the solder 300. I have. Further, each of the fixing brackets 201 and each of the first wiring patterns 101 are connected via the solder 301. Here, the volume of the solder 301 for connecting one fixing bracket 201 and one first wiring pattern 101 is the solder 300 for connecting one external connection terminal 202 and one second wiring pattern 102. Is larger than the volume. In this embodiment, the external connection terminal 202 and the second wiring pattern 102 are reliably electrically connected, and the connector component 200 is connected to the printed wiring board 100 with high bonding strength by the connection between the fixing bracket 201 and the first wiring pattern 101. Fixed against.

(Configuration of soldering device)
FIG. 3 is a front view of a soldering device (mounting device) of the electronic component mounted body 500 according to the present embodiment. FIG. 3 shows a state before the heating tool 400 as a heating means included in the soldering device heats the connector component 200 in contact.

  The heating tool 400 has a shape that covers the fixture 201 of the connector component 200 and the external connection terminal 202. The heating tool 400 has a heat source 425 such as a cartridge heater, and is heated to about 350 to 450 ° C. via a power supply 422. Further, a thermocouple 426 is provided inside or on the surface of the heating tool 400. By controlling the output of the heat source 425 according to the measured temperature of the thermocouple 426 using the temperature controller 423 and the relay 424, the heating temperature of the heating tool 400 can be controlled. Further, the heating tool 400 is connected to the heat insulating block 403 and is connected to the actuator 420 via the rod 421. Then, the heating tool 400 is moved in the vertical direction in FIG. 3 by the actuator 420, and contacts the connector component 200 and heats it during soldering. The heating tool 400 is preferably made of a material such as molybdenum or tungsten to which solder does not easily adhere, in order to reduce the adhesion of solder.

  The thread solder feed mechanism 410 feeds the thread solder 303 wound around the thread solder reel 411 by a thread solder feed roller 412 connected to a motor (not shown). Supply from the tip. The thread solder feed mechanism 410 is fixed to the heat insulating block 403 by the thread solder feed mechanism fixing section 413, and the thread solder supply nozzle 401 is fixed to the heat insulating block 403 by the thread solder supply nozzle fixing section 404. The thread solder feed mechanism 410 and the thread solder supply nozzle 401 (supply means) are moved in the vertical direction by the actuator 420 together with the heating tool 400. That is, the thread solder feed mechanism 410 and the thread solder supply nozzle 401 are configured to be interlocked with the heating tool 400. At the time of the soldering process, the tip of the thread solder supply nozzle 401 is fixed to a position where the thread solder can be supplied in the vicinity of a location corresponding to the fixing bracket 201 of the connector component 200 of the heating tool 400.

(How to mount electronic components)
A method of manufacturing the electronic component mounted body 500 according to the embodiment, that is, a method of mounting the connector component 200 on the printed wiring board 100 (electronic component mounting method) will be described. As shown in FIG. 4, this mounting method is performed in the order of a solder application step, an electronic component placement step, and a soldering step.

  In this specification, the solder 302 applied before the electronic component arranging step and the solder 300 as the solder 302 after the soldering step are also referred to as “first solder”. Further, the solder 303 supplied after the electronic component arranging step and the solder 301 which is the solder 303 after the soldering step are also referred to as “second solder”.

<Solder coating process>
Using a printing screen and a squeegee, as shown in FIG. 5, paste-like solder 302 in which solder powder and flux are mixed is printed and applied to each second wiring pattern 102 of the printed wiring board 100. The solder may be applied by applying a paste-like solder 302 to each second wiring pattern 102 using a dispenser.

<Electronic component placement process>
As shown in FIG. 6, the connector component 200 is arranged on the printed wiring board 100 on which the paste solder 302 is applied. At this time, the connector component 200 is arranged so that the second wiring pattern 102 and the external connection terminal 202 overlap via the solder 302 and the first wiring pattern 101 and the fixing bracket 201 overlap.

<Soldering process>
As shown in FIG. 7, the printed wiring board 100 on which the connector component 200 is arranged is arranged immediately below the heating tool 400 heated to about 350 to 450 ° C. and the thread solder supply nozzle 401. 7 and 8 show a part of the soldering device such as the heating tool 400 and the thread solder supply nozzle 401.

  Then, as shown in FIGS. 8A to 8C, the heating tool 400 and the thread solder supply nozzle 401 are lowered, and the heating tool 400 is brought into contact with the external connection terminal 202 and the fixture 201 of the connector component 200. . Then, the external connection terminal 202 is pressed against the second wiring pattern 102 via the paste solder 302 and heated by the heating tool 400. Immediately below each external connection terminal 202, the paste solder 302 is heated via the external connection terminal 202, and the solder powder in the solder 302 is melted.

  Note that the heating time by the heating tool 400 may be appropriately changed according to the size of the connection portion of the external connection terminal 202 with the second wiring pattern 102, the escape of heat to the printed wiring board 100, and the like. For example, the dimension of the connection point of the external connection terminal 202 with the second wiring pattern 102 is 0.4 mm in width × 0.7 mm in length × 0.25 mm in height, and the dimension of the second wiring pattern 102 is 0.6 mm in width × length. In the case of 1.7 mm, connection is possible at a heating temperature of 400 ° C. in about 2.0 seconds.

  Further, as shown in FIGS. 8A to 8C, the heating tool 400 is brought into contact with the external connection terminal 202 and the fixing bracket 201, and near the portion where the heating tool 400 and the fixing bracket 201 are in contact with each other. On the other hand, the thread solder 303 is supplied from the thread solder supply nozzle 401. The heating tool 400 heats and melts the overlapping portion between the first wiring pattern 101 and the fixing bracket 201 and the supplied thread solder 303, and solders the first wiring pattern 101 and the fixing bracket 201.

  Note that the supply of the thread solder 303 may be started while the heating tool 400 is in contact with the fixture 201. That is, the supply of the thread solder 303 may be started while the heating tool 400 is brought into contact, or the supply of the thread solder 303 may be started after the heating tool 400 is brought into contact.

  Thereafter, when the heating tool 400 and the thread solder supply nozzle 401 are raised, the paste solder 302 solidifies, and the external connection terminals 202 of the connector component 200 and the second wiring pattern 102 of the printed wiring board 100 are interposed via the solder 300. Connected. Further, the fixture 201 of the connector component 200 and the first wiring pattern 101 of the printed wiring board 100 are connected via the solder 301 (FIG. 1).

  As described above, in the present embodiment, in the soldering process, the paste solder 302 is melted using the heating tool 400 having a heat source, and the external connection terminals 202 of the connector component 200 and the second wiring pattern of the printed wiring board 100 are melted. 102 is connected. Further, the thread solder 303 is melted using the same heating tool 400, and the fixing bracket 201 of the connector component 200 and the first wiring pattern 101 of the printed wiring board 100 are connected by soldering. That is, the electronic components are mounted using different types of solder such as the paste solder 302 and the thread solder, but the heating tool 400 used for melting these is shared. Therefore, compared to a method in which the electronic component is connected to the wiring pattern of the board through separate steps such as a reflow step and a soldering step, it is possible to suppress complicated management of devices and instruments in the mounting step. Further, it is possible to suppress an increase in space for disposing the device.

  In order to reduce the time required for mounting, it is preferable to heat and melt the thread solder 303 while heating and melting the paste solder 302 with the heating tool 400 as described above.

  In addition, as described above, the heating tool 400 is brought into contact with the external connection terminals 202 in the soldering step, and the external connection terminals 202 are pressed against the second wiring pattern 102 and heated, instead of a non-contact heating method such as a reflow step. Is preferred. Thereby, the influence of the warpage of the printed wiring board 100 due to the heating can be suppressed, and the external connection terminals 202 and the second wiring pattern 102 can be connected in a state where they are surely in contact with each other. Further, the contact surface of the heating tool 400 with the external connection terminal 202 is more preferably along the surface of the printed wiring board 100 on which the second wiring pattern 102 is provided.

  In the present embodiment, a method of mounting an electronic component (connector component 200) having a plurality of external connection terminals 202 on one side surface has been described, but an electronic component having one external connection terminal on one side surface is mounted. Is also good.

[Second embodiment]
A second embodiment will be described with reference to FIGS. This embodiment is different from the above-described embodiment in the position where the fixing bracket 201 is provided in the connector component 200, and accordingly, the shape of the heating tool 400 is also different. Note that the basic configuration of the electronic component mounted body, the configuration of the soldering device, and the mounting method of the connector component 200 according to the present embodiment are the same as those of the above-described embodiment.

  FIG. 9 is a top view for explaining an electronic component mounted body 500 in which the connector component 200 is mounted on the printed wiring board 100. A plurality of external connection terminals 202 are provided at one lower end of a pair of side surfaces along the length direction of the connector component 200 so as to project in parallel with each other. Further, the other of the pair of side surfaces along the length direction of the connector component 200 is an insertion surface into which an FPC (Flexible Printed Circuit) terminal or the like is inserted. At each lower end of a pair of side surfaces along the width direction of the connector component 200, a fixing bracket 201 functioning as a fixing portion is provided so as to protrude from the side surface.

  On the surface of the printed wiring board 100, a first wiring pattern 101 for fixing a connector component 200 to be mounted is provided, and a plurality of second wiring patterns extending in parallel with each other and for inputting and outputting signals. 102 are provided.

  As shown in FIG. 10, the heating tool 400 used in the soldering process has a U-shape so as to contact the external connection terminals 202 and the fixing bracket 201 of the connector component 200 according to the arrangement thereof. The heating tool 400 is heated by bringing it into contact with the external connection terminal 202 of the connector component 200 and the fixture 201. In addition, the thread solder 303 is supplied from the thread solder supply nozzle 401 to the vicinity of a portion of the heating tool 400 which comes into contact with the fixture 201.

  Also in this embodiment, similarly to the above-described embodiment, the external connection terminals 202 of the connector component 200 are heated using the heating tool 400, and the second connection terminals 202 of the printed wiring board 100 are melted via the molten paste solder 302. Connect to wiring pattern 102. At the same time, by using the same heating tool 400, the thread solder 303 is supplied to the vicinity of the heating tool 400 and melted, and the fixing bracket 201 of the connector component 200 is soldered to the first wiring pattern 101 of the printed wiring board 100. And connect.

  According to the present embodiment, in addition to obtaining the same effects as those of the above-described embodiment, the present invention can be applied to a change of a wiring pattern due to a wiring restriction of the printed wiring board 100 and a change of a connector component 200 according to a space of an image reading device to be mounted. Can respond. Further, a higher bonding strength can be obtained than in the above-described embodiment in which the external connection terminal 202 and the fixing bracket 201 are provided only on one side surface of the connector component 200.

100 Printed wiring board (board)
101 first wiring pattern (second pad)
102 second wiring pattern (first pad)
200 Connector parts (electronic parts)
201 Fixing bracket (fixing part)
202 External connection terminal (terminal)
300 solder (first solder)
301 solder (first solder)
302 Paste solder (first solder)
303 thread solder (second solder)
400 heating tool (heating means)

Claims (12)

A method for mounting an electronic component, comprising: mounting an electronic component including a terminal and a fixing portion on a substrate including a first pad and a second pad;
Applying a first solder on the first pad;
Arranging the board and the electronic component such that the first pad and the terminal overlap via the first solder, and the second pad and the fixing portion overlap;
Heating the first solder on the first pad by a heating means to melt the first solder, and connecting the first pad and the terminal via the first solder;
A second solder is supplied in the vicinity of the fixing portion arranged so as to overlap with the second pad, the second solder is heated by the heating means, and the second pad is fixed to the second pad via the second solder. Connecting the unit with
A method of mounting an electronic component, comprising:   The electronic component mounting method according to claim 1, wherein the second solder is heated by the heating unit while the first solder is heated by the heating unit.   3. The solder according to claim 1, wherein the first solder applied on the first pad is a paste solder, and the second solder supplied in the vicinity of the fixing portion is a thread solder. Electronic component mounting method.   4. The electronic component mounting method according to claim 1, wherein the heating unit is brought into contact with the terminal, and the first solder is heated via the terminal. 5.   5. The electronic component mounting method according to claim 4, wherein the first solder is heated while the terminal is pressed against the first pad via the first solder by the heating unit. 6.   The electronic component mounting method according to claim 4, wherein the heating unit is brought into contact with the terminal, and the supply of the second solder is started.   7. The volume of the second solder that connects the second pad and the fixed portion is larger than the volume of the first solder that connects the first pad and the terminal. 8. A method for mounting the electronic component according to claim 1.   8. The electronic component according to claim 1, wherein the electronic component includes a terminal row in which a plurality of the terminals are arranged, and a plurality of the fixing portions located outside the terminal row in a direction of the terminal row. 9. A method for mounting the electronic component according to any one of the preceding claims. A mounting apparatus for performing the electronic component mounting method according to any one of claims 1 to 8,
The heating means having a shape corresponding to the arrangement of the terminal and the fixing portion in the electronic component,
Supply means for supplying the second solder;
A mounting device.   The mounting apparatus according to claim 9, wherein the heating unit has a contact surface that contacts the terminal along a surface of the substrate on which the first pad is provided.   The mounting device according to claim 9, wherein the heating unit is configured to include molybdenum or tungsten. The mounting device according to claim 9, wherein the heating unit and the supply unit are configured to be able to interlock with each other.

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