KR20160129570A - Induction heating desoldering device - Google Patents

Induction heating desoldering device Download PDF

Info

Publication number
KR20160129570A
KR20160129570A KR1020150061918A KR20150061918A KR20160129570A KR 20160129570 A KR20160129570 A KR 20160129570A KR 1020150061918 A KR1020150061918 A KR 1020150061918A KR 20150061918 A KR20150061918 A KR 20150061918A KR 20160129570 A KR20160129570 A KR 20160129570A
Authority
KR
South Korea
Prior art keywords
induction heating
solder
heating coil
magnetic core
inlet
Prior art date
Application number
KR1020150061918A
Other languages
Korean (ko)
Other versions
KR101751335B1 (en
Inventor
박선순
이해룡
김영도
이동건
Original Assignee
주식회사 다원시스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 다원시스 filed Critical 주식회사 다원시스
Priority to KR1020150061918A priority Critical patent/KR101751335B1/en
Publication of KR20160129570A publication Critical patent/KR20160129570A/en
Application granted granted Critical
Publication of KR101751335B1 publication Critical patent/KR101751335B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
    • H05B6/101—Induction heating apparatus, other than furnaces, for specific applications for local heating of metal pieces
    • H05B6/103—Induction heating apparatus, other than furnaces, for specific applications for local heating of metal pieces multiple metal pieces successively being moved close to the inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/36—Coil arrangements
    • H05B6/362—Coil arrangements with flat coil conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2229/00—Details of cathode ray tubes or electron beam tubes
    • H01J2229/70—Electron beam control outside the vessel
    • H01J2229/703—Electron beam control outside the vessel by magnetic fields
    • H01J2229/7031—Cores for field producing elements, e.g. ferrite

Abstract

The present invention relates to an induction heating desoldering device capable of rapidly removing a solder molten by using a vacuum inhalation device after melting only a defective solder part by locally heating the defective solder part with induction heating without damaging a printed circuit board or an electronic component. According to the present invention, the induction heating desoldering device comprises: a high frequency power supply unit; an induction heating coil electrically connected to the high frequency power supply unit; a magnetic core having a cylinder shape including a magnetic substance to provide a magnetic flux path induced by the induction heating coil and including an inlet to inhale the molten solder and an outlet to discharge the solder inhaled from the inlet; and a vacuum suction device connected to the outlet of the magnetic core for sucking the molten solder. The induction heating coil is arranged around the outer circumference of the magnetic core. The inlet of the magnetic core to pass the magnetic flux induced by the induction heating coil through the inlet and the solder to be adjacent to the inlet. The induction heating desoldering device locally heats and melts the solder. The molten solder is sucked by the input unit and is discharged through the outlet.

Description

{Inductive heating desoldering device}

The present invention relates to an induction heating desoldering apparatus. More particularly, the present invention relates to an induction heating desoldering apparatus for locally heating and melting only a defective solder portion by induction heating without damaging a printed circuit board or an electronic component, and then rapidly removing molten solder using a vacuum suction apparatus will be.

Today, most electronic products are soldered to electrically connect and mechanically fix electronic components to a printed circuit board (PCB). A method of soldering an electronic component to a PCB by applying a solder wire to a soldering position while applying heat to the solder, and applying solder paste between the lead of the electronic component and the land of the PCB There is a method of applying heat and melting and soldering.

When the soldering is performed as described above, the lead is twisted or lifted, the solder land surface is poured or overflowed, shot occurs, the land wettability is poor on the solder fillet portion, the solder ball is generated around the fillet, , Between the land of the PCB and the lead of the electronic component due to various reasons such as low melting point on the solder joint surface, fine cracks and cracks on the land fillet portion, fillet and land peeling, foreign matter contamination, A solder failure occurs. At this time, a desoldering device is used to heat and remove the defective solder portion.

Korean Patent No. 10-1228149 discloses a lead inhaler comprising a desolder and a de-solder controller. The lead inhaler includes a de-solder having a hollow tip at its tip and sucking the melted solder, And a de-solder controller connected and controlling the operation of the de-solder. The solder has an electrothermal heater and a temperature sensor so as to be heated and maintained at an appropriate temperature for melting the solder.

In the conventional lead inhaler comprising the de-solder and the de-solder controller, the hollow tip is heated by using the electro-thermal heater, and the heated hollow tip heats the PCB and the electronic component as well as the solder portion . Accordingly, there is a problem that a PCB or an electronic component heated to a high temperature at a position close to the hollow tip while the solder portion is melted is damaged by a thermal shock. Since the damaged PCB or electronic parts can not be reused, the defect rate increases and the manufacturing cost increases.

The present invention provides a new type of induction heating desoldering apparatus capable of solving the above-described problems of the lead suction apparatus composed of a de-solder and a de-solder controller. An object of the present invention is to provide an induction heating desoldering apparatus configured to concentrate only a local region of a defective solder region to remove a magnetic field formed by an induction heating coil. It is another object of the present invention to provide an induction heating desoldering apparatus in which defective portions are reduced and productivity is increased because PCBs and electronic components are not damaged during removal of defective solder portions by induction heating.

The induction heating desoldering apparatus according to the present invention comprises a high frequency power supply unit, an induction heating coil electrically connected to the high frequency power supply unit, and a hollow member made of a magnetic material for providing a path of a magnetic flux induced by the induction heating coil. A magnetic core having a cylindrical shape and having an inlet portion and an outlet portion; and a vacuum suction device connected to the outlet portion of the magnetic core to suck the melted solder.

The induction heating coil can be formed by spirally winding the conductive wire (solenoid) or by winding the conductive plate round. An induction heating coil formed by winding a conductive material in a spiral or circular shape forms a hollow magnetic flux passage in the center portion. When a high frequency power source is applied to the induction heating coil, the center of the induction heating coil and the outside of the induction heating coil are connected by a closed curve, and a magnetic force line whose direction changes according to the frequency of the high frequency power source is formed. Further, a conductor located inside a magnetic field formed by a magnetic line of force whose direction is changed by an electromagnetic induction phenomenon is heated.

The magnetic core has an inlet for providing a path to the flux induced by the induction heating coil and at the same time sucking the melted solder to one end of the hollow, and an outlet for discharging the melted solder. The magnetic core is formed of a magnetic material and provides a path of a magnetic field induced by the induction heating coil. The magnetic core may use a ferromagnetic material, but it is preferable that the magnetic material core is not heated to a high temperature, for example, a soft magnetic material core such as a cored core formed of an oxide such as a ferrite core or a metal powder. The inlet portion of the magnetic core is configured such that magnetic flux passes through only the solder adjacent to the inlet portion to heat and melt the solder, and the melted solder passes through the outlet portion and is sucked into the vacuum suction device.

In the present invention, the magnetic core may be disposed inside the induction heating coil or adjacent to the outside of the induction heating coil. In order to arrange the magnetic core inside the induction heating coil, an induction heating coil formed by winding a wire material is used, or an induction heating coil formed by winding a plate material in a zigzag form so as to form a hollow Can be used. The hollow induction heating coil concentrates the magnetic flux to increase the magnetic flux density at the position to be desoldered, and the magnetic core inserted in the hollow enables to locally heat the defective soldering portion.

In some embodiments, the magnetic core inserted into the hollow of the induction heating coil is longer than the length of the induction heating coil so that only the defective solder portion of the electronic component connected to the PCB in the hollow of the magnetic core is heated and melted, The inlet of the magnetic core can be arranged so that it is exposed at the induction heating coil adjacent to one end of the induction heating coil.

The magnetic force lines that go out from the magnetic core to the outside through the cut section of the entrance of the magnetic core or that enter the magnetic core from the outside are formed in the magnetic core, And is curved convexly toward the center line of the curved line. Therefore, the magnetic force lines passing through the entrance of the magnetic core are linked to each other to locally heat only the defective solder portion of the electronic component connected to the PCB.

The induction heating desoldering apparatus according to the present invention includes an induction heating coil and a magnetic core to concentrate the magnetic flux for induction heating and concentrate only the local region of the defective solder region to be removed. Therefore, since the PCB or the electronic part itself located around the defective solder is not heated, the PCB or the electronic part can be prevented from being damaged by the heating. In addition, since only the defective solder part to be removed is melted, the molten solder can be sucked quickly by using the vacuum suction device, so that the defective solder can be easily removed and workability is good.

1 is a perspective view schematically showing an embodiment of an induction heating desoldering apparatus according to the present invention.
2 is a cross-sectional view showing a state where a magnetic core is inserted into the induction heating coil shown in Fig.
Fig. 3 is an enlarged cross-sectional view showing a state where only the solder portion of the electronic component connected to the printed circuit board is locally heated in Fig. 2;
4 is a perspective view schematically showing another embodiment of the induction heating desoldering apparatus according to the present invention.
5 is a perspective view schematically showing another embodiment of the induction heating desoldering apparatus according to the present invention.

Other objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments with reference to the accompanying drawings.

Hereinafter, preferred embodiments of the induction heating desoldering apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

The embodiment shown in FIG. 1 is an apparatus for de-soldering by induction heating only a defective solder region. The induction heating desoldering apparatus 100 includes a high frequency power supply unit 110, an induction heating coil 120 electrically connected to the high frequency power supply unit 110, and a magnetic core 130. The induction heating coil 120 is in the form of a solenoid formed by spirally winding a conductive wire such as copper, and a hollow magnetic flux passage is formed in the center. The magnetic core 130 is in the form of a hollow cylinder 133 made of a magnetic material for providing a path of magnetic flux induced by the induction heating coil 120 and inserted in the center of the induction heating coil 120. The other end of the magnetic core 130 is connected to a vacuum suction device 140 for sucking the melted solder.

2, when a high frequency power source is applied to the induction heating coil 120, the solenoid central portion and the outside of the induction heating coil 120 are connected by a closed curve, and a magnetic force line 160 whose direction changes according to the frequency of the high frequency power source . The magnetic force line 160 passing through the center of the induction heating coil 120 passes through the magnetic core 130 inserted in the center portion and the magnetic core 130 is made of the magnetic material so that the magnetic force lines 160 are concentrated and the magnetic flux density is increased. The magnetic core 130 includes an inlet 131 for sucking the melted solder 154 into one end of the hollow 133 and an outlet 131 for discharging the molten solder 154 sucked into the inlet 131. [ (132). The induction heating coil 120 is disposed around the outer circumferential surface of the magnetic core 130 and the entrance portion 131 of the magnetic core 130 has a magnetic flux induced by the induction heating coil 120, And the magnetic flux is linked by the defective solder 154 disposed adjacent to the inlet portion 131. [ The magnetic core 130 heats and fuses only the inlet 131 of the magnetic core 130 and the defective solder 154 adjacent to the inlet 131. [

In this embodiment, the entrance 131 of the magnetic core 130 has a simple planar shape cut at right angles to the center line of the cylindrical magnetic core 130. 3, when magnetic force lines concentrated in the magnetic core 130 are concentrated through the entrance 131 of the magnetic core 130 or into the magnetic core 130, The magnetic force lines 160 uniformly distributed in this space are curved convexly toward the center line of the magnetic core 130. Therefore, the magnetic force lines 160 passing through the hollow 133 of the entrance portion 131 of the magnetic core 130 are linked to each other so that only the defective solder 154 portion of the electronic component 52 connected to the PCB 50 is locally . At this time, the magnetic force lines 160 do not heat the lands 151 formed on the PCB 150 and the leads 153 of the electronic parts 152 and the electronic parts 152 except for the defective solder 154 for melting .

In this embodiment, the magnetic core 130 inserted in the hollow of the induction heating coil 120 is longer than the induction heating coil 120. The inlet 131 of the magnetic core 130 is also disposed adjacent to the lower end of the induction heating coil 120 and slightly exposed in the induction heating coil 120. That is, the induction heating coil 120 is not positioned near the entrance 131 of the magnetic core 130. Therefore, only the portion of the defective solder 154 adjacent to the inlet portion 131 in the hollow 133 of the magnetic core 130 is heated and melted.

Although not shown, in order to prevent the induction heating coil 120 from being overheated during soldering, the induction heating coil 120 may be formed of a metal pipe such as copper, You may. When the induction heating de-soldering apparatus 100 is used, a current flows through the induction heating coil 120 only during the de-soldering, while the current flowing through the induction heating coil 120 is blocked during the movement to the next de- Thereby preventing the induction heating coil 120 from being overheated and reducing the de-soldering energy.

Referring to FIGS. 1 and 2, the vacuum suction apparatus 140 of the present invention includes a connection pipe 141 and a vacuum pump (not shown). One end of the coupling tube 141 is connected to the outlet 132 of the magnetic core 130, and the other end is connected to the vacuum pump. When the vacuum pump is operated, vacuum pressure is generated in the hollow portion 133 of the coupling pipe 141 and the magnetic core 130, and the molten solder 154 is guided to the inlet portion 131 of the magnetic core 130, . The molten solder 154 thus sucked is moved along the connection pipe 141 through the outlet portion 132 of the magnetic core 130 and is removed. In this embodiment, although not shown, a collection box may be installed in the vacuum suction device 140 for collecting and disposing the molten solder 154.

4 is a perspective view schematically showing another embodiment of the induction heating desoldering apparatus according to the present invention. The induction heating de-soldering apparatus 200 of this embodiment differs from the induction heating de-soldering apparatus 100 shown in FIG. 1 in that the induction heating coil 220 is wound with a conductive plate material such as a copper plate so that a hollow is formed, The heating coil 220 is formed and the magnetic core 230 is disposed therein. As shown in the figure, the induction heating coil 220 is formed by winding a plate material into a circular shape in a zigzag shape and forming a hollow for inserting the magnetic core 230 at the center thereof. The lower portion of the induction heating coil 220 corresponding to the inlet portion 231 side of the magnetic core 230 is formed in a conical shape so that access to the electronic component is facilitated.

5 is a perspective view schematically showing another embodiment of the induction heating desoldering apparatus according to the present invention. 5 differs from the induction heating desoldering apparatus of the embodiment shown in FIG. 4 in that an induction heating coil 220-1 in which a hollow is formed by winding a conductive plate material in a conical shape is formed.

The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

100: induction heating desoldering device 110: high frequency power supply unit
120: induction heating coil 130: magnetic core
140: Vacuum suction device 150: PCB
152: Electronic component 154: Solder
160: magnetic field line

Claims (4)

A high frequency power supply unit,
An induction heating coil electrically connected to the high frequency power supply unit,
A hollow cylindrical shape made of a magnetic material for providing a path of magnetic flux induced by the induction heating coil and having an inlet portion for sucking the melted solder and an outlet portion for discharging the solder sucked into the inlet portion, Wow,
And a vacuum inhalation device connected to the outlet of the magnetic core for sucking the melted solder,
Wherein the induction heating coil is disposed around an outer circumferential surface of the magnetic core and the inlet portion of the magnetic core is configured so that a magnetic flux induced by the induction heating coil passes through the solder adjacent the inlet portion and the inlet portion, Wherein the solder is locally heated and melted, and the melted solder is sucked into the inlet portion and discharged through the outlet portion. The method according to claim 1,
Wherein an inlet of the magnetic core is arranged to be exposed in the induction heating coil adjacent one end of the induction heating coil. 3. The method of claim 2,
Wherein the induction heating coil is formed by spirally winding a conductive wire. 3. The method of claim 2,
Wherein the induction heating coil is formed by winding a conductive plate in a circular shape.
KR1020150061918A 2015-04-30 2015-04-30 Induction heating desoldering device KR101751335B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150061918A KR101751335B1 (en) 2015-04-30 2015-04-30 Induction heating desoldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150061918A KR101751335B1 (en) 2015-04-30 2015-04-30 Induction heating desoldering device

Publications (2)

Publication Number Publication Date
KR20160129570A true KR20160129570A (en) 2016-11-09
KR101751335B1 KR101751335B1 (en) 2017-06-28

Family

ID=57528866

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150061918A KR101751335B1 (en) 2015-04-30 2015-04-30 Induction heating desoldering device

Country Status (1)

Country Link
KR (1) KR101751335B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021111538A1 (en) * 2019-12-04 2021-06-10

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000343215A (en) * 1999-06-08 2000-12-12 Isawa Tsushin:Kk Soldering iron apparatus
JP2001298268A (en) * 2000-04-14 2001-10-26 Miyaden Co Ltd High frequency heating solder iron

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021111538A1 (en) * 2019-12-04 2021-06-10
WO2021111538A1 (en) * 2019-12-04 2021-06-10 株式会社ワンダーフューチャーコーポレーション Electronic member removal method and device therefor
CN114762466A (en) * 2019-12-04 2022-07-15 株式会社旺得未来 Method and apparatus for removing electronic component
KR20220112748A (en) * 2019-12-04 2022-08-11 가부시키가이샤 원더 퓨쳐 코포레이션 Electronic member removal method and device therefor

Also Published As

Publication number Publication date
KR101751335B1 (en) 2017-06-28

Similar Documents

Publication Publication Date Title
US6229124B1 (en) Inductive self-soldering printed circuit board
KR101644601B1 (en) Induction heating head for melting and supplying material
JP2017503657A (en) Induction heating head for melting and supplying metal materials
US4564135A (en) Chip carrier soldering tool
US4934582A (en) Method and apparatus for removing solder mounted electronic components
WO2017154242A1 (en) Solder joining device and solder joining method
JPS5817716B2 (en) Electric resistance welding equipment for manufacturing equipment for molten metal plated steel pipes
US6188052B1 (en) Matrix-inductor soldering apparatus and device
KR101751335B1 (en) Induction heating desoldering device
US3045095A (en) Printed wiring board repair apparatus
US3422247A (en) Electrically heated soldering apparatus
EP1850996B1 (en) Lead free desoldering braid
EP3166369B1 (en) Inductive heater for area array rework system and soldering handpieces
KR101659584B1 (en) Hybrid heating method and system for filler wire process
JPH02276181A (en) Heating apparatus and method of jointing
US10160053B1 (en) Cold gas blast jet for micro-electronic solder repair
JP2009160652A (en) High-frequency induction heating apparatus, and heating method using high-frequency induction coil and magnetic material
CN112453616A (en) High-frequency focusing induction welding device
JPH0846353A (en) Bonding method for component, bonding member therefor and board
SU961883A1 (en) Apparatus for unsoldering soldered connections
JP2017103278A (en) Print circuit board, electronic apparatus including the print circuit board and soldering method on the print circuit board
JP7128994B2 (en) Electronic member removal method and device
JPWO2021111538A5 (en)
CN218745382U (en) Inside and outside dual cooling formula induction welding mechanism
JPS63309379A (en) Device for removing spatter of arc welding torch

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant