JP2000343215A - Soldering iron apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve durability of a soldering iron and to prolong service life thereof by inhibiting oxidation of a tip part of a soldering iron part in high temperature. SOLUTION: A soldering iron apparatus consists of; a soldering iron part 10 provided with a suction passage 10a which sucks solder, a solder holding part 2 holding solder sucked from the suction passage 10a, a suction pump 4 connected with the solder holding part 2 through a passage 3 and sucks melted solder from a tip 12a of the soldering iron part 10 to the solder holding part 2 side, a passage 6, for supplying inert gas, connected with a suction passage 5 which leads from the soldering iron part 10 to the suction pump 4, and a inert gas supplying pump 7 supplying inert gas to the passage. In soldering work, oxidation in high temperature at the tip 12a is inhibited due to the inert gas supplied from the tip 12a of soldering iron part 12a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dual-purpose soldering iron device having a function for welding solder and a function for melting and sucking unnecessary solder.

[0002]

2. Description of the Related Art In recent years, as electronic devices have become smaller, the mounting density of wiring has increased. When soldering to a land on a board with a high mounting density of such wiring, for example, when solder is undesirably bridged between the lands, the bridged solder should be instantaneously sucked and removed. Is certain in the sense of eradicating defects. Therefore, in order to enable an instant transition from the soldering operation to the solder suction operation, a dual-purpose soldering iron device having a function for welding solder and a function for melting and sucking unnecessary solder is provided. It is becoming popular. As a solder iron device of this type, conventionally, for example, a solder iron portion having a tip portion that melts solder and having a suction passage through which the molten solder can be sucked from the tip portion, and suction from the suction passage Some include a solder storage section for storing the solder, and a suction pump connected to the solder storage section via the communication passage and for sucking the molten solder from the tip of the solder iron section toward the solder storage section. The soldering operation using this soldering iron device is performed by heating the soldering iron portion with a built-in heater and melting the solder at the tip of the heated soldering iron portion. In the solder suction operation, the solder iron is heated by a heater to melt the welded solder at the tip of the heated solder iron, and the melted solder is suctioned by a suction pump into the solder container through a suction passage. (For example, see Japanese Patent Publication No. 7-45103).

[0003]

Incidentally, since the soldering operation and the solder suction operation are performed at a high temperature, the tip of the solder iron portion of the solder iron device is always affected by high-temperature oxidation. For this reason, the soldering iron device has a problem in that, when used for a long time, the tip of the soldering iron portion is oxidized and fatigued, and the wettability to the solder is reduced, leading to a short life of the device. However, since the apparatus has a suction passage for suction, there is a problem that the oxidized area is increased, the surface is easily affected by oxidation, and the durability is poor. The present invention has been made in view of such a problem, and a soldering iron device capable of suppressing the tip portion of a soldering iron portion from being oxidized at a high temperature, improving durability and achieving a longer life. The purpose is to provide.

[0004]

Means for Solving the Problems The technical means of the present invention for solving such a problem is to provide a suction passage having a tip for melting the solder and capable of sucking the molten solder from the tip. A soldering iron portion provided, a solder receiving portion for receiving the solder sucked from the suction passage, and a solder receiving portion connected to the solder receiving portion via a communication passage to melt the solder from the tip of the soldering iron portion. In a soldering iron device having a suction pump for suctioning to the side, a gas supply path capable of supplying an inert gas through communication with a suction path from the solder iron portion to the suction pump is provided,
An inert gas supply pump for supplying an inert gas is connected to the gas supply path. Thus, the soldering operation can be performed while supplying the inert gas from the inert gas supply pump to the tip of the solder iron via the suction path.
The high-temperature oxidation of the tip of the solder iron is suppressed by the amount of reduced chance of contact with oxygen by the inert gas. Therefore, the tip of the solder iron can maintain the wettability to the solder for a long period of time, improve the durability, and extend the life. The solder suction operation is performed by suctioning through a suction path by a suction pump. In this case, since the suction pump and the inert gas supply pump are connected to the common suction path, there is no need to separately provide a path for supplying the inert gas and a path for suction, and the suction path By enabling one of the pump operations, the soldering work or the solder suction work becomes possible, and the operation is switched from the soldering work to the solder suction work instantaneously, and the work switching operation between the soldering work and the solder suction work is performed. Can be performed quickly.

Further, if necessary, a suction connection for enabling the suction of the suction pump and disabling the supply of the inert gas from the inert gas supply pump, and disabling the suction of the suction pump and disabling the suction. There is provided a switching means for switching to one of two connections with a gas supply connection for enabling the supply of the inert gas from the active gas supply pump. With this configuration, the solder suction operation can be performed during the suction connection, and the soldering operation can be performed during the gas supply connection. Since the switching of these connections may be performed by the switching means, the operation switching operation between the soldering operation and the solder suction operation is facilitated.

Further, if necessary, the switching means may be provided on the communication path upstream of a connection point of the gas supply path with the suction path and provided in the communication path, and an open / close switch for opening and closing the communication path. It has a configuration. If the supply pressure of the inert gas is adjusted to be lower than the suction pressure of the suction pump, switching between gas supply and solder suction can be performed simply by opening and closing the communication path with the open / close switch, making the switching operation easy. Become. In this case, since the inert gas can always be kept in the supply state, the apparatus can be simply configured without the need for an inert gas supply control mechanism, and the responsiveness of the gas supply is achieved.

[0007] If necessary, the gas supply path is connected to the communication path, and the switching means is provided at a connection point between the gas supply path and the communication path, and the gas supply path and the communication path are alternately provided. The switch has an open / close switch that opens and closes. Gas supply and solder suction can be switched simply by opening and closing the communication path with the open / close switch, and the switching operation is facilitated. In this case, since the gas supply path and the communication path are alternately opened and closed,
Switching between gas supply and solder suction is ensured.

Further, if necessary, a gun body having at least a gripper on which the solder iron portion and the solder housing portion are mounted and capable of being gripped and having a trigger is provided, and the open / close switch is interlocked with the trigger. I have. Since the soldering operation and the solder suction operation can be performed by gripping the grip portion of the gun body, the operation is facilitated. Further, since the open / close switch can be operated by the trigger operation, switching between gas supply and solder suction can be performed while holding the soldering iron device, and accordingly, the switching operability is improved. Further, if necessary, the inert gas supply pump is provided with a gas separating means for separating nitrogen gas from air. In this way, since the inert gas can be selectively separated and used by using inexhaustible air, the use cost of the soldering iron device can be reduced and the resources can be effectively used.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A soldering iron device according to an embodiment of the present invention will be described below with reference to the accompanying drawings. As shown in FIGS. 1 to 3, the basic configuration of the soldering iron device K is a soldering iron having a tip portion 12 a for melting the solder and a suction iron 10 a capable of sucking the molten solder from the tip portion 12 a. Part 1
0, a solder housing portion 2 for housing the solder sucked from the suction passage 10a, and the molten solder connected to the solder housing portion 2 via the communication passage 3 and the molten solder from the tip end 12a of the solder iron portion 10. A suction pump 4 for sucking the suction gas to the side, a gas supply path 6 which can communicate with a suction path 5 from the solder iron section 10 to the suction pump 4 and can supply an inert gas, and is connected to the gas supply path 6 and serves as an inert gas. And an inert gas supply pump 7 for supplying nitrogen gas.

The soldering iron device K has a suction connection A for enabling the suction of the suction pump 4 and disabling the supply of the inert gas from the inert gas supply pump 7.
And a switching means 8 for switching between one of two connections with a gas supply connection B for disabling the suction of the gas and making the supply of the inert gas from the inert gas supply pump 7 effective. Further, the solder iron part 10, the solder storage part 2, the communication path 3,
The suction pump 4, a part of the suction path 5, a part of the gas supply path 6, and the switching means 8 are a gun body 9 having a gripper 9 a.
It is installed in. The soldering iron device K includes a power switch 1 of the device itself. The power switch 1 controls on / off of the suction pump 4 and the inert gas supply pump 7 simultaneously.

More specifically, the solder iron unit 10
As shown in FIG. 3, the distal tip 11 and the distal tip 11
And a trowel section main body 12 which is detachably provided. The iron body 12 has a tapered ceramic tip 12a to which the tip 11 is attached and detached, and a cylindrical metal body 12b to which the tip 12a is attached.
It is composed of The end 13 of the main body 12b has a flange 13 joined to the front end surface of the front end 9b of the gun main body 9.
a, and this flange 13 a is attached to the gun body 9.
Of the gun body 9 by screwing a cap nut 14 into a male screw part 9c formed outside the tip part 9b of the gun body 9 and pressing the flange 13a with the cap nut 14. Fixed to The distal tip 11 is composed of a tubular ceramic main pipe 11a in which a suction passage 10a is formed, and a tubular metal covering body 11b provided by fitting outside the main pipe 11a. Further, a flange 11c is provided on the rear side of the distal end tip 11. On the other hand, the tip 12a of the iron
An insertion passage 12c through which the tip 11 can be inserted from the inside is provided, and a flange portion 11c of the tip is provided inside the insertion passage 12c.
Is formed.

Further, the soldering iron part 10 has a pressing member which is mounted on the iron part main body 12 and is connected to the tip part 9b of the gun body 9, and presses the tip tip 11 from the inside of the iron part body 12 to the step part 12d. 15 are provided. This pressing member 15
Is made of the same ceramic tubular body as the ceramic main pipe 11a, has a suction passage 10a formed therein, and its tip is fitted inside the insertion passage 12c of the trowel main body 12. Pressing member 15
A plurality of heaters 16 for heating the pressing member 15 and the distal end tip 11 are embedded in. The heater 16 operates with the power switch 1 turned on, and heats the tip 11.

The solder receiving section 2 is formed in a cylindrical shape made of ceramics, and the front side 2a is provided with a suction passage 10a of the solder iron section 10.
Are connected, and the rear side 2 b is connected to one end 3 a of the communication passage 3. A solder filter 2c is provided at a connection portion with the communication path 3 so that the sucked solder does not enter the communication path 3. The solder container 2 can be removed as needed, and the solder accumulated in the solder container 2 can be easily removed. The communication passage 3 is formed in a tubular shape and has one end 3.
The other end 3b for a is connected to the suction pump 4 via a switching means 8 described later.

The suction pump 4 applies a suction pressure capable of sucking the molten solder to the solder container 2 through the suction passage 10a to the tip 12a. The suction pump 4 operates with the power switch 1 turned on, and starts suction at a constant suction pressure. The gas supply path 6 is formed in a tubular shape and is connected to the suction path 5. Here, the suction path 5 means a series of paths on which the suction pressure of the suction pump 4 acts from the tip 11 to the other end 3 b of the communication path 3. In the embodiment, one end 6 a of the gas supply path 6 is connected at a connection point 3 a of the communication path 3, and the other end 6 b is connected to an inert gas supply pump 7 provided outside the gun body 9.

The inert gas supply pump 7 is provided with gas separation means 7a for separating nitrogen gas from the air.
And the nitrogen gas separated by the gas separating means 7a can be supplied to the gas supply path 6, and other air components are discharged from the discharge port 7c. The inert gas supply pump 7
It operates with the power switch 1 turned on, and starts supplying inert gas at a constant supply pressure. Here, the supply pressure of the inert gas is adjusted so that the absolute value of the pressure is smaller than the suction pressure of the suction pump 4. More specifically, when the suction pressure and the supply pressure simultaneously act on the suction path 5, the tip of the suction path 10a can suck the solder.

The switching means 8 includes a suction connection A for enabling the suction of the suction pump 4 and disabling the supply of the inert gas from the inert gas supply pump 7, and disabling the suction of the suction pump 4 and disabling the suction. It has a function of switching to one of two connections with a gas supply connection B for enabling the supply of the inert gas from the gas supply pump 7. The switching means 8 is provided in the communication path 3 on the upstream side of the connection point 3 a of the gas supply path 6 with respect to the suction path 5 (on the side of the suction pump 4), and is a normally closed opening / closing apparatus for opening and closing the communication path 3. The switch 8a is provided. The open / close switch 8a is interlocked with a trigger 9d provided in the gun body 9, and closes the communication passage 3 when the trigger 9d is not pressed, and opens the communication passage 3 when the trigger 9d is pressed.

The suction connection A is made by pressing the trigger 9d and opening the open / close switch 8a while the power switch 1 is on. Thereby, the communication passage 3 opens,
Suction pressure by suction pump 4 and inert gas supply pump 7
And supply pressure at the same time acts on the suction path 5, and a suction pressure with a large pressure acts on the tip of the suction passage 10 a. The gas supply connection B is performed by keeping the open / close switch 8a closed without pressing the trigger 9d while the power switch 1 is on. In this state, since the open / close switch 8a closes the communication path 3, only the supply pressure from the inert gas supply pump 7 acts on the suction path 5,
At the tip of the suction passage 10a, an inert gas is supplied.

Therefore, according to the soldering iron device K of this embodiment, when performing the soldering operation, the power switch 1 may be turned on and the open / close switch 8a may be kept closed. By this operation, the solder iron device K becomes the gas supply connection B, and is in a state of supplying the inert gas from the tip 12a. The supplied inert gas is supplied to the tip 12a.
This reduces the chance that the tip chip 11 and the pressing member 15 provided in the contact with oxygen come into contact with each other, thereby suppressing their oxidation at a high temperature. Therefore, the durability of the components of the soldering iron device K is improved, and the life is long. On the other hand, when performing the solder suction operation, the trigger 9 is connected to the gas supply connection B.
By pressing d, the open / close switch 8a may be opened. By this operation, the soldering iron device K becomes the suction connection A, and suction is performed at the distal end portion 12a. The soldering iron device K can immediately switch to the suction connection A by operating the trigger 9d. For example, when the solder is undesirably bridged between the lands during the soldering work, the undesired bridged solder is instantaneously removed. Thus, the electronic device can be prevented from being defective in advance.

Further, the supply pressure of the inert gas is adjusted to be lower than the suction pressure of the suction pump, and the inert gas is always supplied while the power switch 1 is turned on. The apparatus can be simply configured without the need for a control mechanism, and the responsiveness of gas supply is improved. Further, since the open / close switch 8a can be operated by operating the trigger 9d by gripping the grip portion 9a of the gun body 9 to perform the soldering operation and the solder suction operation, the operability of switching the operation can be improved. Further, since the inert gas supply pump 7 is provided with the gas separating means 7a and separates and uses nitrogen gas from air, the use cost of the soldering iron device K can be reduced.

Next, a soldering iron device according to another embodiment of the present invention will be described. As shown in FIG.
Has substantially the same configuration as the soldering iron device according to the above-described embodiment, but differs from the above in that a connection point 3a between the gas supply path 6 and the suction path 5 is provided in the solder accommodating section 2. That is, the gas supply passage 6 is formed in a tubular shape, and one end 6 a is detachably connected to the connection point 3 a on the upper part of the solder housing portion 2, and the other end 6 b is an inert gas supply pump provided outside the gun body 9. 7 is connected. The operation of the soldering iron device K is the same as that of the soldering iron device K, except that the gas supply path 6 is short-circuited and connected to the suction path 5 without passing through the solder filter 2c. Is not reduced by the solder filter 2c. This reduces the power load on the inert gas supply pump 7 and improves the supply efficiency of the inert gas.

Next, a soldering iron device according to another embodiment of the present invention will be described. As shown in FIG. 5, the soldering iron device K has substantially the same configuration as that of the soldering iron device according to the above-described embodiment, but differs from the above-described one in that the gas supply path 6 is connected to the communication path 3 and switching means is provided. 8 is provided at a connection point 3 a between the gas supply path 6 and the communication path 3. The switching means 8 is configured by an open / close switch 8a that opens and closes the gas supply path 6 and the communication path 6 alternately. The operation of the soldering iron device K is the same as that of the above-described soldering iron device K.
Since a closes the gas supply path 6 and opens the communication path 3, the suction pressure of the suction pump 4 is not reduced by the supply pressure of the inert gas supply pump 7. This reduces the power burden on the suction pump 4 and improves the suction force.

In the above embodiment, the soldering iron device K is turned on by turning the power switch 1 on.
Although the suction pump 4 and the inert gas supply pump 7 are operated, the present invention is not limited to this, and each pump can be operated as needed.

[0023]

As described above, according to the soldering iron apparatus of the present invention, a gas supply path which can supply an inert gas by communicating with a suction path from the soldering iron section to the suction pump is provided. Since the inert gas supply pump that supplies the inert gas to the path is connected, the soldering work can be performed while supplying the inert gas from the inert gas supply pump to the tip of the solder iron section via the suction path. The tip of the soldering iron is
High-temperature oxidation is suppressed by an amount corresponding to the reduced chance of contact with oxygen due to the supply of the inert gas, and durability against high-temperature oxidation can be improved.

Further, a suction connection for enabling the suction of the suction pump and disabling the supply of the inert gas from the inert gas supply pump, and a suction connection for disabling the suction of the suction pump and disabling the inert gas from the inert gas supply pump. In the case where a switching means for switching to one of two connections with a gas supply connection for enabling the supply of the active gas is provided, the switching of each connection may be performed by the switching means. The operation switching operation with the operation is facilitated.

In the case where the switching means is provided in the communication path on the upstream side of the connection point of the gas supply path with respect to the suction path and provided with an open / close switch for opening and closing the communication path,
Since the work switching between the soldering work and the solder suction work can be performed only by the opening and closing operation of the open / close switch, the work switching operation becomes easier. In the case where the gas supply path is connected to the communication path, and the switching means is provided at a connection point between the gas supply path and the communication path, and an open / close switch that opens and closes the gas supply path and the communication path alternately is provided. In addition, since the operation switching between the soldering operation and the solder suction operation can be performed only by the opening and closing operation of the open / close switch, the operation switching operation becomes easier.

When a gun body having a trigger on which a soldering iron part and a solder accommodating part are mounted and which can be gripped is provided, a soldering operation and a solder suction operation are performed by gripping the gripping part. It can be done easily. Furthermore, when the inert gas supply pump is provided with gas separation means for separating nitrogen gas from the air, since the inert gas can be selectively separated and used using inexhaustible air,
The use cost of the soldering iron device can be reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a soldering iron device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a soldering iron device according to the embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a solder iron part of the solder iron device according to the embodiment of the present invention.

FIG. 4 is a sectional view showing a soldering iron device according to another embodiment of the present invention.

FIG. 5 is a sectional view showing a soldering iron device according to another embodiment of the present invention.

[Explanation of symbols]

 K Soldering iron device A Suction connection B Gas supply connection 1 Power switch 2 Solder storage unit 3 Communication path 4 Suction pump 5 Suction path 6 Gas supply path 7 Inert gas supply pump 7a Gas separation means 8 Switching means 8a Open / close switch 9 Gun body 9a gripping part 9b tip part 9c male screw part 9d trigger 10 solder iron part 10a suction passage 11 tip tip 12 iron part main body

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kazuya Iwabuchi 71-1 Tsuno, Koyama-shi, Isawa-machi, Isawa-gun, Iwate F-term (reference) 5E319 CC55 GG20

Claims (6)

[Claims] 1. A solder iron portion having a tip portion for melting solder and having a suction passage capable of sucking the molten solder from the tip portion, and a solder containing portion for containing the solder sucked from the suction passage. And a suction pump connected to the solder receiving portion via the communication passage and sucking the molten solder from the tip end of the solder iron portion to the solder receiving portion side. A soldering iron device comprising: a gas supply path that can supply an inert gas through a suction path leading to a pump; and an inert gas supply pump that supplies an inert gas to the gas supply path. 2. A suction connection for enabling the suction of the suction pump and disabling the supply of the inert gas from the inert gas supply pump, and a suction connection for disabling the suction of the suction pump and the inert gas supply pump. 2. The soldering iron device according to claim 1, further comprising a switching unit for switching between one of two connections with a gas supply connection for enabling the supply of the inert gas from the apparatus. 3. The apparatus according to claim 1, wherein the switching means is provided with an open / close switch provided in the communication path, upstream of a connection point of the gas supply path with the suction path, and provided in the communication path to open and close the communication path. 3. The soldering iron device according to claim 2, wherein: 4. The gas supply path is connected to the communication path, and the switching means is provided at a connection point between the gas supply path and the communication path to open and close the gas supply path and the communication path alternately. 3. The apparatus according to claim 2, further comprising a switch.
The described soldering iron device. 5. A gun body having at least a gripper on which the solder iron part and the solder housing part are mounted and capable of being gripped and having a trigger, wherein the open / close switch is interlocked with the trigger. Item 5. The soldering iron device according to item 3 or 4. 6. The soldering iron device according to claim 1, wherein the inert gas supply pump includes gas separating means for separating nitrogen gas from air.