WO2020159338A1

WO2020159338A1 - Laser head module of laser debonding device

Info

Publication number: WO2020159338A1
Application number: PCT/KR2020/001595
Authority: WO
Inventors: 최재준; 김남성; 김병록; 유종재; 박부성
Original assignee: 레이저쎌 주식회사
Priority date: 2019-02-01
Filing date: 2020-02-03
Publication date: 2020-08-06
Also published as: TWI735149B; CN210334761U; KR20200095769A; CN111531280A; TW202030040A

Abstract

This laser head module of a laser debonding device for debonding at least one electronic component disposed on a substrate by selectively melting soldering on the electronic component is characterized by comprising: an annular housing; an optical lens module which is provided inside the housing to expand or contract a beam generated from a laser oscillator; a fixing bracket coupled to the outer circumferential surface of the housing; a clamp member coupled to the outer circumferential surface of the housing; a blowing means which is provided on one side of the clamp member and sprays air toward the electronic component on the substrate; and a suction means which is provided on the other side of the clamp member so as to face the blowing means, and suctions the electronic component separated from the substrate by the blowing means.

Description

Laser head module of laser debonding device

The present invention relates to a laser debonding apparatus, and more particularly, to a laser head module of a laser debonding apparatus capable of removing an electronic component melted by soldering without contamination of the substrate by laser irradiation.

Micro laser processing is an application field of micron (μm) precision in industrial laser processing, and is widely used in the semiconductor industry, display industry, printed circuit board (PCB) industry, and smartphone industry. Memory chips used in all electronic devices have developed technologies to reduce circuit spacing to a minimum in order to realize integration, performance, and high-speed communication speeds, and currently achieve the required level of technology simply by reducing circuit line width and line width spacing. It was difficult to stack the memory chips vertically. The stacking technology of up to 128 layers has already been developed by TSMC, and the technology of stacking up to 72 layers is being applied to mass production by Samsung Electronics and SK Hynix.

In addition, technology developments to mount a memory chip, a microprocessor chip, a graphics processor chip, a wireless processor chip, a sensor processor chip, etc. in one package are being intensively researched and developed, and considerable levels of technologies have already been put into practice.

However, in the development process of the aforementioned technology, since more and more electrons have to participate in the signal processing process inside the ultra-high-speed/ultra-high-capacity semiconductor chip, an issue of cooling processing for heat generation has been raised because power consumption is increased. In addition, a technical issue has been raised that a large amount of electrical signals must be transmitted at a very high speed in order to achieve the requirements of ultra-high-speed signal processing and ultra-high-frequency signal processing for more signals. In addition, since the signal lines have to be increased, the signal interface lines to the outside of the semiconductor chip can no longer be processed with a one-dimensional lead wire method, and the ball grid array (BGA) method (Fan-In BGA) that processes the two-dimensional layer under the semiconductor chip. Or Fan-in Wafer-Level-Package (FIWLP)) and a signal layout redistribution layer under the ultra-fine BGA layer under the chip, and a second fine BGA layer underneath. The method (called Fan-Out BGA or Fan-Out Wafer-Level-Package (FOWLP) or Fan-Out Panel-Level-Package) is being applied.

Recently, in the case of semiconductor chips, products having a thickness of 200 µm or less have appeared, including an EMC (Epoxy-Mold Compound) layer. In order to attach a micron-class ultra-thin semiconductor chip, which is only a few hundred microns in thickness, to a ultra-thin PCB, mass reflow, such as the conventional surface mount technology (SMT) standard process, Thermal Reflow Oven technology ( When applying the MR) process, the semiconductor chip is exposed to an air temperature environment of 100 to 300 degrees (℃) for hundreds of seconds, so the chip-border warpage, PCB due to the difference in coefficient of thermal expansion (CTE) -Poor adhesion of various types of soldering bonding such as PCB-Boundary Warpage and Random-Bonding Failure by Thermal Shock may occur.

Accordingly, in the related art, localized heating technology has been developed to rework soldering defects of various types of electronic components generated in the soldering process, including the above-mentioned causes, among which the most actively studied field has been recently developed. Is a soldering debonding technique by laser beam irradiation.

The conventional debonding technology by laser beam irradiation has the advantage of being non-contact, and since the method in which the laser light is directly absorbed by the semiconductor chip is the primary heat absorption mechanism, there is no advantage of thermal shock due to a difference in the coefficient of thermal expansion, and it is very local. Since it performs only the necessary time for phosphorus heating, it has various advantages such as low power consumption, minimized total heat input, minimized thermal shock, and minimized process time.

On the other hand, the laser head module of a conventionally known laser bonding device is a method of irradiating and bonding a laser while pressing a bonding object (semiconductor chip or integrated circuit IC) for several seconds, corresponding to the size of a semiconductor chip or integrated circuit (IC) Bonding is performed by irradiating a laser in the form of a surface light source.

For the pressurized laser head module, referring to Korean Patent Registration No. 10-1245356 (hereinafter referred to as'prior literature'), the surface light source laser is irradiated to the semiconductor chip while adsorbing the semiconductor chip by vacuum. The adsorption module and the pressure head configuration including the same are described.

However, the laser head module of the conventional pressurization method as described above is a pressurizing head and a laser irradiation unit are manufactured and driven as a single module, and thus, when bonding a plurality of semiconductor chips such as a semiconductor strip, while pressing one semiconductor chip, a surface light source form It is necessary to repeatedly perform the operation of irradiating the laser of the plurality of semiconductor chips.

This not only increases the overall working time for bonding a plurality of semiconductor chips, but also increases the price of the entire equipment as the heating head is additionally mounted.

On the other hand, even if the laser head module by laser beam irradiation is applied to the debonding device instead of the above-described pressurizing head method, currently, the electronic parts separated by the laser are manually removed by a worker using a tool or a separate ejector device. Since it is removed by using, there is a problem that the substrate is contaminated by the heated and molten solder liquid, and there is a risk that a worker may be injured in a high temperature of the laser head module.

Accordingly, the present invention was invented to solve the above problems, and the present invention allows the electronic components melted by laser irradiation to be removed immediately on the spot without contamination of the substrate by air blowing and suction. It is an object to provide a laser head module of the laser debonding device.

The present invention for achieving the above object, the laser debonding apparatus for debonding the electronic component from the substrate by selectively melting the soldering of at least one electronic component disposed on the substrate, the annular housing; An optical lens module provided in the housing to enlarge or reduce a beam generated from a laser oscillator; A fixing bracket coupled to the outer circumferential surface of the housing; A clamp member coupled to the outer circumferential surface of the housing; Blowing means provided on one side of the clamp member for ejecting air toward the electronic component of the substrate; It is provided on the other side of the clamp member facing the blowing means comprises a suction means for sucking the electronic component separated from the substrate by the blowing means.

In addition, a beam shaper for selectively converting the shape of the beam generated from the laser oscillator and transmitting it to the optical lens module is further provided in the housing.

In addition, the beam shaper converts a circular laser beam generated from a laser oscillator into a square beam.

In addition, the blowing means, a fixed plate fixedly coupled to the clamp member; A support frame hinged to one end of the fixing plate; And an air nozzle coupled to the support frame to inject air supplied from the compressor.

In addition, the suction means, a fixed plate fixedly coupled to the clamp member; A support frame hinged to one end of the fixing plate; And a funnel member coupled to the support frame to suck electronic components by the suction force of the compressor.

In addition, the clamp member is integrally formed to have a conical shape that gradually becomes narrower toward the bottom of the fixing bracket, and the air flow paths constituting the blowing means and the suction means on the left and right sides of the body around the hollow are respectively inclined downwardly. .

In addition, opposite ends of the air flow paths constituting the blowing means and the suction means are formed to have nozzle shapes and funnel shapes, respectively.

In addition, a part of the suction path of the suction means is further provided with an electronic part collection container.

In addition, air injection by the blowing means and air suction by the suction means are simultaneously performed by one compressor.

In addition, the housing, the optical lens module, the fixed bracket is provided with a plurality of each, and the laser beam irradiated from each of the optical lens modules is irradiated at least partially overlapped in a certain area of the substrate, and the clamp member, the blower The means and the suction means are provided in any one of the plurality of housings.

The present invention as described above, the present invention is to form a dual square beam to irradiate the soldering of the electronic components, so compared to the case of irradiating a single round beam in a conventional laser debonding device, a temperature deviation of 10 to 20 degrees Since it can be improved, it has an effect of preventing problems such as burning or melting of FPCB, which is a thin flexible substrate, during thermal debonding.

1 is a conceptual diagram of a single beam module of a laser debonding apparatus according to an embodiment of the present invention

2 is an image of an FPCB substrate to which a single laser beam is irradiated by a debonding device according to an embodiment of the present invention

3 is a conceptual diagram of a configuration of a laser debonding device according to an embodiment of the present invention

4 is a conceptual diagram of a configuration of a laser optical system according to an embodiment of the present invention

5 is an external perspective view of a laser head module according to an embodiment of the present invention

6 is a partial cross-sectional view of a laser head module according to another embodiment of the present invention

The terms used in this specification are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, the terms “include” or “have” to “have” are intended to designate the presence of features, numbers, steps, actions, components, parts, or combinations thereof described herein, but one Or other features or numbers, steps, actions, components, parts, or combinations thereof, should not be excluded in advance.

Unless otherwise defined herein, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person skilled in the art to which the present invention pertains.

Terms such as those defined in a commonly used dictionary should be interpreted as having meanings consistent with meanings in the context of related technologies, and should not be interpreted as ideal or excessively formal meanings unless explicitly defined herein. Should not.

Hereinafter, attached FIG. 1 is a conceptual diagram of a single beam module of a laser debonding apparatus according to an embodiment of the present invention, and FIG. 2 is an FPCB to which a single laser beam is irradiated by a debonding apparatus according to an embodiment of the present invention This is the image of the substrate.

Referring to FIG. 1, the laser debonding apparatus of the present invention includes a single laser module 310 according to an embodiment, thereby irradiating a single laser beam onto an FPCB substrate. 2, the laser beam irradiated by the first laser module 310 is irradiated on the substrate in a state of being deformed into a square beam shape.

That is, as the laser beam irradiated by the laser module 310 selectively heats the temperature of the soldering defective portion to a debonding temperature at which melting of the soldering occurs, the electronic component becomes removable from the substrate, and then an ejector of a certain type By means of the devices (see FIGS. 5 and 6), the defective electronic component in which the soldering is melted is sucked and removed from the substrate.

Hereinafter, a dual beam configuration and an operation relationship according to the present invention will be described in detail with reference to the attached FIGS. 3 and 4 as follows.

3 is a conceptual diagram of a configuration of a laser debonding device according to an embodiment of the present invention.

In FIG. 3, the laser module 310 of the laser irradiation unit includes a laser oscillator 311, a beam shaper 312, an optical lens module 313, a driving device 314, and a control device each having a cooling device 316. It comprises a 315 and the power supply 317.

The laser oscillator 311 generates a laser beam having a predetermined range of wavelengths and output power. The laser oscillator is, for example, a diode laser (LD) having a wavelength of '750 nm to 1200 nm' or '1400 nm to 1600 nm' or '1800 nm to 2200 nm' or '2500 nm to 3200 nm' or a rare earth medium fiber laser (Rare-Earth- It may be a Doped Fiber Laser) or a Rare-Earth-Doped Crystal Laser, or alternatively, a medium for emitting Alexandrite laser light having a wavelength of 755 nm, or an Endiyag (Nd) having a wavelength of 1064 nm or 1320 nm. :YAG) It may be embodied by including a medium for emitting laser light.

The beam shaper 312 converts a spot-shaped laser generated by the laser oscillator 311 and transmitted through an optical fiber into an area beam having a flat top. The beam shaper 312 may be implemented by including a square light pipe, a diffractive optical element (DOE), or a micro-lens array (MLA).

The optical lens module 313 adjusts the shape and size of the laser beam converted from the beam shaper to the surface light source so as to irradiate the electronic component mounted on the PCB substrate or the irradiation area. The optical lens module constitutes an optical system through a combination of a plurality of lenses.

The driving device 314 moves the distance and position of the laser module with respect to the irradiation surface, and the control device 315 controls the driving device 314 to form a beam shape and a beam area when the laser beam reaches the irradiation surface. Adjust the beam sharpness and beam irradiation angle. The control device 315 may also integrally control the operation of each part of the laser module 310 in addition to the driving device 314.

Meanwhile, the laser output adjustment unit 370 controls the amount of power supplied from the power supply unit 317 corresponding to the laser module 310 to the laser module 310 according to a program received through a user interface or a preset program. The laser output adjustment unit 370 receives the parts, regions, or the entire debonding status information on the irradiation surface from one or more camera modules 350 to control the power supply unit 317 based on the received information. Alternatively, control information from the laser output adjustment unit 370 is transmitted to the control unit 315 of the laser module 310, and a feedback signal for controlling the corresponding power supply unit 317 in the control unit 315, respectively. It is also possible to provide.

Through this function, it is possible to perform bonding between the electronic components in the irradiation surface and the substrate or to remove the bonding by adjusting the laser beam size and power. In particular, when removing the damaged electronic component on the substrate, as the area of the laser beam is minimized to the area of the corresponding electronic component, heat applied by the laser beam to other adjacent electronic components or normal electronic components existing on the substrate can be minimized. Accordingly, it is possible to remove only the damaged electronic component to be removed.

On the other hand, when configured to emit laser beams having different wavelengths for each of the plurality of laser modules, a plurality of material layers (eg, EMC layer, silicon layer, solder layer) included in the electronic component are well absorbed by the laser irradiation unit. It may be composed of individual laser modules having a wavelength.

Accordingly, the laser debonding apparatus according to the present invention selectively increases the temperature of the electronic component and the temperature of the intermediate bonding material such as solder, which is a connection material between the printed circuit board or the electronic component electrode, to optimize the bonding (Attaching or Bonding) or separation (Detaching or Debonding) process can be performed.

Specifically, all the energy of each laser beam is absorbed in the solder layer by transmitting both the EMC mold layer and the silicon layer of the electronic component, or the laser beam does not penetrate the EMC mold layer and heats the surface of the electronic component to lower the electronic component. It is also possible to conduct heat to the bonding portion of the.

4 is a configuration conceptual diagram of a laser optical system according to an embodiment of the present invention.

4 is an optical system having the simplest structure applicable to the present invention. When the laser beam emitted from the beam transmission optical fiber 410 is focused through the convex lens 420 and is incident on the beam shaper 430, the beam shaper ( 430) converts the spot-shaped laser beam into a flat-top type surface light source A1, and the square laser beam A1 output from the beam shaper 430 is desired through the concave lens 440. It is irradiated to the image forming surface S with an enlarged surface light source A2 enlarged in size.

Hereinafter, a configuration and an operation relationship of the laser head module according to the present invention will be described in detail with reference to FIGS. 5 and 6. First, the laser head module 600 of the present invention is described below in some configurations except for the laser oscillator 311, the cooling device 316, and the driving device 314 in the above-described laser module.

5 is an external perspective view of a laser head module according to an embodiment of the present invention.

5, the laser head module 600 is first provided with an annular housing 610, and a laser beam generated from a laser oscillator 311 is disposed inside the housing 610 at the top of the housing 610. The beam transmission optical fiber 410 is connected so that it can be transmitted.

A beam shaper 430 for converting the round beam generated from the laser oscillator 311 into a square beam is provided in the housing 610, and the beam shaper 430 is used to irradiate a square beam through the beam shaper. An optical lens module 313 or the like that is enlarged or reduced to fit is disposed.

The present invention is characterized in that, when the soldering of the electronic component is melted by the laser beam irradiated from the laser head module 600, the configuration of the ejector device for removing it is integrally added.

To this end, the present invention is a fixed bracket 650 for fixing the housing to the outer circumferential surface of the housing 610 and the clamp member 620 is coupled to the lower portion of the fixed bracket, as shown in Figure 5, the clamp member ( On the left side of the 620, a blowing means for ejecting air toward the electronic components of the substrate is mounted, and on the right side of the clamp member 620, suction means for sucking the electronic components separated from the substrate by the blowing means. It is configurable by being mounted.

The blowing means, more specifically, a fixed plate 631 is fixedly coupled to the clamp member 620, and a support frame 632 is hinged to one end of the fixed plate 631 so that, if an operator needs it, It is configured to be able to adjust the angle arbitrarily. In addition, an air nozzle 633 is coupled to the support frame 632 by, for example, a screw fastening method, so that air supplied from an external compressor (not shown) can be injected toward the electronic component of the substrate. do.

In addition, the suction means, has a configuration similar to the blowing means, for example, the fixing plate 641 is coupled to the clamp member 620 by a screw fastening method, the support frame 642 at one end of the fixing plate 641 The hinge is coupled, and a funnel member 643 for sucking electronic components by the suction force of an external compressor (not shown) is mounted on the support frame 642.

At this time, the air injection by the blowing means and the air suction by the suction means can be driven by separate compressors, respectively, but for the compact device configuration, the same one compressor (not shown) is used for blowing. It is desirable to design the means and the suction means to be driven simultaneously.

Meanwhile, FIG. 6 is a partial cross-sectional view of a laser head module according to another embodiment of the present invention.

Referring to Figure 6 attached below, as in the embodiment of Figure 5 described above, the blowing means and the suction means are not mounted outside the clamp member, but the air passages constituting the blowing means and the suction means are inside the body of the clamp member. It is possible to configure even if the intaglio is formed integrally with each.

At this time, for example, referring to FIG. 6, the clamp member 621 is integrally formed to have a conical shape that becomes narrower as it goes down to the lower end of the fixing bracket 650 attached to the outer circumferential surface of the housing.

At this time, a hollow 621a is formed in the center portion of the clamp body, so that the laser beam irradiated from the laser oscillator 311 passes through the beam shaper 312 inside the housing and the optical lens module 313 to form the hollow 621a. It is understandable that it is irradiated to the substrate through ).

In addition, the

air flow paths

621b and 621c constituting the blowing means and the suction means are respectively inclined downwardly on the left and right sides of the body of the clamp member 621 around the hollow 621a.

At this time, more preferably, the opposite ends of the air flow paths constituting the blowing means and the suction means are formed to have nozzle shapes and a funnel shape, respectively, and air injected through the air flow paths 621 b of the blowing means is electronic After the component is separated from the substrate, it is sucked and removed through the air passage 621c of the suction means.

On the other hand, on the suction path of the suction means, as the electronic parts collection container 700 in the form of a strainer is further connected, the operator is configured to take out and recycle the electronic parts collected in the electronic parts collection container 700 from time to time.

In addition, the laser head module according to the present invention can be configured as a dual beam laser debonding device having two laser modules, for example, rather than the single laser module of the above-described embodiment. For the configuration of the dual beam laser debonding device, for example, two laser head modules each having a housing, an optical lens module, and a fixed bracket are provided, and then each laser head module is divided and arranged at regular intervals. This is possible. At this time, the laser beam irradiated from each of the optical lens modules provided in the two laser head modules is irradiated to partially overlap in a certain area of the substrate.

When driving two laser head modules as described above, for example, when one laser light source is distributed and input to each laser head module, the function for simultaneously adjusting the output and phase of each distributed laser beam is a laser output adjustment unit. It may be provided at 370. In this case, it is possible to significantly improve the beam flatness by controlling the phase to induce offset interference between the laser beams, and accordingly, the energy efficiency is further increased.

On the other hand, when implementing the multi-position simultaneous processing mode as described above, the laser output adjustment unit 370, the beam shape, beam area size, beam of each laser beam so that some or all of the laser beam from each laser head module is different Control one or more of sharpness, beam irradiation angle, and beam wavelength. At this time, when a single laser light source is distributed and input to each laser head module, a function for simultaneously adjusting the output and phase of each distributed laser beam may be provided in the laser output adjustment unit 370.

Through this function, by adjusting the laser beam size and power, it is possible to perform the bonding or removing the bonding between the electronic components in the irradiation surface and the substrate more easily than in the case of a single beam. In particular, when removing the damaged electronic component on the substrate, as the area of the laser beam is minimized to the area of the corresponding electronic component, heat applied by the laser beam to other adjacent electronic components or normal electronic components existing on the substrate can be minimized. Accordingly, it is possible to remove only the damaged electronic component to be removed.

On the other hand, in the configuration of the debonding device of the dual laser head module as described above, it is not necessary to provide an ejecting device in all laser head modules, for example, an ejecting device may be configured only in one housing of the plurality of laser head modules. Can. To this end, even when the clamp member, the blowing means, and the suction means constituting the ejecting device are mounted on only one of the two laser head modules, it is possible to sufficiently perform the function of removing the debonded electronic components according to the blowing and precipitation. Yes, it is understandable.

In addition, the present invention is not limited only by the above-described embodiment, and it is possible to create the same effect even when changing the detailed configuration, number, and arrangement structure of the device. It is stated that various configurations can be added, deleted, and modified within the scope of the technical idea of.

600: laser head module 610: housing

620, 621: Clamp member 621b: Blowing flow path

621c: suction Euro 631, 641: fixed plate

632, 642: support frame 633: nozzle

643: Funnel member 650: Fixed bracket

Claims

A laser debonding device for debonding electronic components from a substrate,

Annular housing;

An optical lens module provided in the housing to enlarge or reduce a beam generated from a laser oscillator;

A fixing bracket coupled to one side of the outer circumferential surface of the housing;

A clamp member coupled to the other side of the outer circumferential surface of the housing;

Blowing means provided on one side of the clamp member for ejecting air toward the electronic components of the substrate; And

A suction means provided opposite to the blowing means on the other side of the clamp member to suction the electronic component separated from the substrate by the blowing means,

Laser head module of laser debonding device.
According to claim 1,

A beam shaper for selectively converting the shape of the beam generated from the laser oscillator and transmitting it to the optical lens module is further provided in the housing,

Laser head module of laser debonding device.
According to claim 1,

The beam shaper converts a circular laser beam generated from a laser oscillator into a square beam,

Laser head module of laser debonding device.
According to claim 1,

The blowing means,

A fixed plate fixedly coupled to the clamp member;

A support frame hinged to one end of the fixing plate; And

It is coupled to the support frame comprising an air nozzle for injecting air supplied from the compressor,

Laser head module of laser debonding device.
According to claim 1,

The suction means,

A fixed plate fixedly coupled to the clamp member;

A support frame hinged to one end of the fixing plate; And

It is coupled to the support frame comprising a funnel member for sucking the electronic parts by the suction force of the compressor,

Laser head module of laser debonding device.
According to claim 1,

The clamp member,

The air flow paths constituting the blowing means and the suction means on the left and right sides of the body centered on the hollow are integrally formed so as to have a conical shape that gradually becomes narrower toward the bottom of the fixing bracket.

Laser head module of laser debonding device.
The method of claim 6,

The opposite ends of the air flow paths constituting the blowing means and the suction means are formed to have a nozzle shape and a funnel shape, respectively.

Laser head module of laser debonding device.
According to claim 1,

A part of the suction path of the suction means is further provided with an electronic part collection container,

Laser head module of laser debonding device.
According to claim 1,

The air injection by the blowing means and the air suction by the suction means are simultaneously performed by one compressor,

Laser head module of laser debonding device.
According to claim 1,

Each of the housing, the optical lens module, and the fixed bracket is provided with a plurality of pieces, and the laser beams irradiated from the optical lens modules are irradiated at least partially in a predetermined area of the substrate.

The clamp member, the blowing means and the suction means are provided in any one of the plurality of housings,

Laser head module of laser debonding device.