KR102683187B1 - Laser debonding apparatus - Google Patents

Abstract

The laser debonding device of the present invention is a laser debonding device that debonds electronic components on a substrate by irradiating a laser beam from a laser head module, and is provided around the laser head module to selectively raise and lower the electronic components. Grinding means for debonding the component and grinding the upper surface of the remaining solder to flatten it to a certain height; and a suction unit provided adjacent to one side of the grinding unit to suction chips generated from the remaining solder while the grinding unit grinds the upper surface of the remaining solder.

Description

Laser debonding apparatus {Laser debonding apparatus}

The present invention relates to a laser debonding device. More specifically, the present invention relates to a laser debonding device, and more specifically, after debonding electronic components whose soldering has been melted by laser irradiation, the remaining solder is removed using a micro end mill to prevent a height difference between the remaining solders on both sides where the normal LED will be bonded. It relates to a laser debonding device that prevents normal LEDs from tilting to one side or bonding defects between LEDs and solder by precisely grinding the upper surface and then bonding it.

Micro laser processing is an application field with micron (㎛) level precision in industrial laser processing, and is widely used in the semiconductor industry, display industry, printed circuit board (PCB) industry, and smartphone industry. Memory chips used in all electronic devices have developed technology to reduce circuit spacing to a minimum in order to achieve integration, performance, and ultra-high-speed communication speeds, but now the required level of technology is achieved simply by reducing circuit line width and line width spacing. It was difficult to do, so memory chips were stacked vertically. Lamination technology for up to 128 layers has already been developed by TSMC, and technology for stacking up to 72 layers is being applied to mass production at Samsung Electronics, SK Hynix, etc.

In addition, intensive research and development is being conducted on technologies to mount memory chips, microprocessor chips, graphics processor chips, wireless processor chips, sensor processor chips, etc. in one package, and a significant level of technology is already being applied in practice.

However, in the development process of the technology mentioned above, more and more electrons must participate in the signal processing process inside the ultra-high-speed/ultra-high-capacity semiconductor chip, which increases power consumption and raises the issue of cooling treatment for heat generation. In addition, in order to achieve the requirements of ultra-high-speed signal processing and ultra-high-frequency signal processing for more signals, a technical issue was raised that a large amount of electrical signals must be transmitted at ultra-high speed. In addition, because the number of signal lines must increase, the signal interface lines outside the semiconductor chip can no longer be processed using a one-dimensional lead line method, but a ball grid array (BGA) method (Fan-In BGA) that is processed two-dimensionally from the bottom of the semiconductor chip. (or Fan-in Wafer-Level-Package (FIWLP)), and a signal layout redistribution layer is placed under the ultra-fine BGA layer at the bottom of the chip, and a second fine BGA layer is installed below it. The method (called Fan-Out BGA or Fan-Out Wafer-Level-Package (FOWLP) or Fan-Out Panel-Level-Package) is being applied in practice.

Recently, in the case of semiconductor chips, products with a thickness of 200㎛ or less, including an EMC (Epoxy-Mold Compound) layer, are emerging. In order to attach micron-level ultra-thin semiconductor chips with a thickness of only a few hundred microns to an ultra-thin PCB, mass reflow (thermal reflow oven) technology, which is a standard process for existing surface mount technology (SMT), is used. When applying the MR) process, the semiconductor chip is exposed to an air temperature environment of 100 to 300 degrees Celsius for hundreds of seconds, causing chip-boundary warpage and PCB damage due to differences in the coefficient of thermal expansion (CTE). -Various types of soldering bonding adhesion failures may occur, such as PCB-Boundary Warpage and Random-Bonding Failure by Thermal Shock.

Accordingly, localized heating technology has been developed to rework various types of soldering defects in electronic components that occur during the soldering process, including the above-mentioned causes. Among these, it is the field that has been most actively researched recently. This is a soldering debonding technology using laser beam irradiation.

Conventional debonding technology using laser beam irradiation has the advantage of being non-contact and the method of directly absorbing laser light into the semiconductor chip is the primary heat absorption mechanism, so there is no thermal shock due to differences in thermal expansion coefficient, and very localized heating is possible. Since it is performed only for the time absolutely necessary, it has several advantages such as low power consumption, minimized total heat input, minimized thermal shock, and minimized process time.

Meanwhile, recently, ultra-small LEDs (light emitting diodes) with sizes ranging from tens to hundreds of μm are being used as light sources for various displays due to their various advantages such as miniaturization, weight reduction, and low power consumption.

Among the ultra-small LEDs, in the case of micro LEDs with a chip size of 5 μm to 100 μm, a pixel for an LED display displays an image by tightly arranging a number of micro LED chips horizontally and vertically and then connecting the power supply to emit light directly. It is being used as.

On the other hand, in the case of mini LEDs with a chip size of 100 μm to 200 μm, the chip size is relatively larger than the micro LED, and the backlight unit (Backlight unit) displays the image of the LCD display mainly by back emission rather than the direct light emitting pixels of the LED display. ) is being increasingly used.

In addition, when defective pixels are found in the inspection process after bonding these ultra-small LEDs to the substrate, only the defective LEDs are accurately removed by irradiating a laser beam to the ultra-small LEDs at the location of the defective pixels, and the area where the ultra-small LEDs were removed is By bonding and replacing normal LEDs, a rework process is performed to remove defective pixels and replace them with normal LEDs.

However, in the case of the ultra-small LED, the size is very small, less than a few hundred microns, so after removing the ultra-small LED for the defective pixel, the shape of the remaining solder electrically connecting the removed LED was very irregular.

In this case, even if only a very slight difference in height occurs between the two terminals of the normal LED that is bonded after being placed on the remaining solder in the rework process, not only does tilting to one side occur during soldering of the normal LED that is bonded, but also it causes damage to the solder. Due to bonding failure, there was a problem of serious soldering defects that prevented power from being supplied to the terminals of normal LEDs.

Accordingly, the present invention was invented to solve the above problems, and the present invention is to debond electronic components whose soldering has been melted by laser irradiation, and to prevent a height difference between the remaining solders on both sides to which the normal LED is to be bonded. The purpose is to provide a laser debonding device that prevents normal LEDs from tilting to one side or bonding defects between LEDs and solder by precisely grinding the upper surface of the remaining solder with an end mill and then bonding it.

The present invention for achieving the above object is a laser debonding device that debonds electronic components on a substrate by irradiating a laser beam from a laser head module, and is provided around the laser head module to selectively move up and down. A grinding means that debonds the electronic component as it descends and grinds the upper surface of the remaining solder to flatten it to a certain height; and a suction unit provided adjacent to one side of the grinding unit to suction chips generated from the remaining solder while the grinding unit grinds the upper surface of the remaining solder.

Additionally, according to one embodiment, a blowing unit is further provided on the other side of the grinding means to blow air toward the remaining solder while the grinding means grinds the upper surface of the remaining solder.

Additionally, according to one embodiment, a 3D profile sensor for measuring the shape and height of remaining solder is further provided on one side of the grinding means.

Also, according to one embodiment, the grinding means includes: a bracket; a motor coupled to one side of the bracket; An end mill detachably coupled to the bottom of the motor; A lifting and lowering unit for moving the motor and end mill up and down; and a collet chuck unit for selectively coupling the end mill to the rotating shaft of the motor.

In addition, according to one embodiment, an end bracket is provided around the end mill of the bracket and rotatably disposed with the end mill inserted through a hollow of the end bracket, and at least one suction unit is around the end bracket. Alternatively, the blowing units are connected respectively.

Additionally, according to one embodiment, air suction of the suction unit and air injection of the blowing unit are simultaneously performed by one compressor.

Additionally, according to one embodiment, the 3D profile sensor measures the shape and height of a specific residual solder before and after grinding the specific residual solder after debonding of an electronic product, and then measures the shape and height of the specific residual solder. It is characterized by comparing the shape and height of specific residual solder.

Additionally, according to one embodiment, the 3D profile sensor measures the shape and height of the specific residual solder before and after grinding two or more specific residual solders after debonding of the electronic product, and then It is characterized by comparing the shape and height of the specific residual solder above.

As described above, the present invention debonds electronic components whose soldering has been melted by laser irradiation, and then precisely grinds the upper surface of the remaining solder with a micro end mill to prevent a height difference between the remaining solders on both sides where the normal LED will be bonded. Post-bonding has the effect of preventing normal LEDs from tilting to one side or bonding defects between the LED and solder.

1 is a conceptual diagram of a single beam module of a laser debonding device according to an embodiment of the present invention.
Figure 2 is an image of an FPCB substrate to which a single laser beam is irradiated by a debonding device according to an embodiment of the present invention.
3 is a conceptual diagram of the configuration of a laser debonding device according to an embodiment of the present invention.
4 is a conceptual diagram of the configuration of a laser optical system according to an embodiment of the present invention.
Figure 5 is a perspective view showing the entire grinding means according to an embodiment of the present invention.
Figure 6 is an enlarged view of the main part 'A' of Figure 5
Figure 7 is an exploded perspective view of part 'B' of Figure 6
8 is a photographic image of residual solder, (a) a planar photographic image of residual solder before grinding according to the present invention, and (b) a planar photographic image of residual solder after grinding according to the present invention.
Figure 9 is a schematic diagram showing the debonding and rework process of electronic components to which the present invention is applied according to one embodiment.

The terms used in this specification are merely used to describe specific embodiments and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as “include” or “have” or “equipped” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in this specification. It should be understood that this does not preclude the existence or addition of other features, numbers, steps, operations, components, parts, or combinations thereof.

Unless otherwise defined herein, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the technical field to which the present invention pertains.

Terms defined in commonly used dictionaries should be interpreted as having meanings consistent with the meanings they have in the context of the related technology, and unless clearly defined in this specification, should not be interpreted in an idealized or overly formal sense. It shouldn't be.

Hereinafter, the attached Figure 1 is a conceptual diagram of a single beam module of a laser debonding device according to an embodiment of the present invention, and Figure 2 is an FPCB to which a single laser beam is irradiated by the debonding device according to an embodiment of the present invention. This is an image of the substrate.

Referring to FIG. 1, the laser debonding device of the present invention includes a single laser module 310 according to one embodiment, and thus radiates a single laser beam onto the FPCB substrate. At this time, referring to FIG. 2, the laser beam irradiated by the first laser module 310 is irradiated on the substrate in a transformed state of a square beam shape.

That is, the laser beam irradiated by the laser module 310 selectively heats the temperature of the soldering defects to the debonding temperature where soldering melts, so that the electronic components can be removed from the board, and then a certain type of ejector is used. The soldering device (not shown) suctions and removes the melted defective electronic components from the board.

Hereinafter, with reference to the attached FIGS. 3 and 4, the dual beam configuration and operational relationship according to the present invention will be described in detail according to an embodiment.

Figure 3 is a conceptual diagram of a laser debonding device according to an embodiment of the present invention.

In FIG. 3, the laser module 310 of the laser irradiation unit includes a laser oscillator 311 each equipped with a cooling device 316, a beam shaper 312, an optical lens module 313, a driving device 314, and a control device. It consists of (315) and a power supply unit (317).

The laser oscillator 310 generates a laser beam with a wavelength and output power in a predetermined range. The laser oscillator is, for example, a diode laser (Laser Diode (LD)) or a rare earth medium fiber laser (Rare-Earth- It may be a Doped Fiber Laser or a Rare-Earth-Doped Crystal Laser, and alternatively, a medium for emitting alexandrite laser light with a wavelength of 755 nm, or Nd YAG (Nd) with a wavelength of 1064 nm or 1320 nm. :YAG) may be implemented including a medium for emitting laser light.

The beam shaper 312 converts the spot-shaped laser generated from the laser oscillator 310 and transmitted through the optical fiber into an area beam with a flat top. The beam shaper 312 may be implemented including a square light pipe, a diffractive optical element (DOE), or a micro-lens array (MLA).

The optical lens module 313 adjusts the shape and size of the laser beam converted into a surface light source form by the beam shaper to irradiate it to the electronic component or irradiation area mounted on the PCB board. An optical lens module constitutes an optical system through the combination of multiple lenses.

The driving device 314 moves the distance and position of the laser module with respect to the irradiation surface, and the control device 315 controls the driving device 314 to determine the beam shape and beam area size when the laser beam reaches the irradiation surface. , adjust the beam sharpness and beam irradiation angle. The control device 315 can also comprehensively control the operation of each part of the laser module 310 in addition to the driving device 314.

Meanwhile, the laser output adjustment unit 370 controls the amount of power supplied to the laser module 310 from the power supply unit 317 corresponding to the laser module 310 according to a program received through a user interface or a preset program. The laser output adjusting unit 370 receives information on the debonding status of each part, area, or overall on the irradiated surface from one or more camera modules 350 and controls the power supply unit 317 based on this information. In contrast, control information from the laser output adjustment unit 370 is transmitted to the control device 315 of the laser module 310, and a feedback signal for controlling the corresponding power supply unit 317 from the control device 315. It is also possible to provide .

Through this function, it is possible to perform bonding or remove bonding between electronic components and the substrate within the irradiated surface by adjusting the laser beam size and output. In particular, when removing damaged electronic components from a board, the area of the laser beam is minimized to the area of the relevant electronic component, thereby minimizing the application of heat by the laser beam to other adjacent electronic components or normal electronic components present on the board. Accordingly, it is possible to remove only the damaged electronic components that are subject to removal.

Meanwhile, when multiple laser modules are configured to emit laser beams with different wavelengths, the laser irradiation unit is well absorbed by multiple material layers (e.g., EMC layer, silicon layer, solder layer) included in the electronic component. It can be composed of individual laser modules with a wavelength of

Accordingly, the laser debonding device according to the present invention selectively increases the temperature of the electronic component and the temperature of the intermediate bonding material such as solder, which is a connecting material between the printed circuit board or the electrode of the electronic component, to achieve optimized bonding (Attaching or Bonding or detaching or debonding processes can be performed.

Specifically, the laser beam passes through both the EMC mold layer and the silicon layer of the electronic component so that all the energy of each laser beam is absorbed into the solder layer, or the laser beam heats the surface of the electronic component without passing through the EMC mold layer, causing the lower part of the electronic component to be absorbed. Heat can also be conducted through the bonding part of .

Figure 4 is a conceptual diagram of the configuration of a laser optical system according to an embodiment of the present invention.

4 is an optical system with the simplest structure applicable to the present invention. When the laser beam emitted from the beam transmission optical fiber 410 is focused and aligned through the convex lens 420 and enters the beam shaper 430, the beam shaper ( In 430), the spot-shaped laser beam is converted into a flat-top shaped surface light source (A1), and the square laser beam (A1) output from the beam shaper 430 is directed to the desired area through the concave lens 440. It is irradiated to the imaging surface (S) by the surface light source (A2), which is enlarged in size and enlarged.

Hereinafter, the configuration and operational relationship of the laser debonding device according to the present invention will be examined in detail with reference to the attached FIGS. 5 and 6.

Figure 5 is a perspective view showing the entire grinding means according to an embodiment of the present invention, Figure 6 is an enlarged view of the main part of part 'A' of Figure 5, Figure 7 is an exploded perspective view of part 'B' of Figure 6, and Figure 8 is a photographic image of residual solder, (a) is a planar photographic image of residual solder before grinding according to the present invention, and (b) is a planar photographic image of residual solder after grinding according to the present invention.

First, the laser debonding device of the present invention uses a grinding means of the present invention ( 700) is provided.

The grinding means 700 is selectively raised and lowered up and down by the raising and lowering unit 750, and the laser head modules 310 and 410 (see FIGS. 1 to 4) debond electronic components (e.g., ultra-small LEDs). Afterwards, the upper surface of the remaining solder (S) is precisely ground with a micro end mill (740) to flatten it to a certain height required for rework of electronic components. Therefore, by flattening the remaining solder (S) using the device of the present invention, the electronic component being reworked (laser bonded) is prevented from tilting to one side or bonding defects between the remaining solder (S) and terminals of the electronic component are prevented.

More specifically, referring to FIGS. 5 to 7, the grinding means 700 includes a bracket 710, a motor 720 coupled to one side of the bracket 710, and a detachable bottom of the motor 720. A micro end mill 740 that is coupled to the motor, a lifting and lowering unit 750 for moving the motor 740 and the micro end mill 740 up and down, and a motor 720 that connects the micro end mill 740 to the motor 720. It is configured to include a collet chuck unit 730 for selective coupling to a rotation axis (not shown).

The collet chuck unit 730 is a type of chuck mechanism used to fix a workpiece by opening or closing the mouth of the collet chuck 731, which has a structure with a slit in the main body. Referring to FIG. 7, it has a round bar shape. A wedge-shaped collet chuck 731 is inserted into the hollow of the collet chuck body 730, and at this time, a micro end mill 740 is selectively inserted into and fixed to the center of the slit of the collet chuck 731.

Subsequently, the collet chuck 731 including the micro end mill 740 is inserted into the hollow of the collet chuck body 730, so that the collet chuck 731 is retracted and tightened. At this time, the micro end mill 740 inserted into the slit of the collet chuck 731 is pressed between the slits of the collet chuck 731 as the collet chuck 731 retracts, and accordingly, the collet chuck 731 ) The micro end mill 740 is fixed between the slits so that it does not fall out. In this state, the top of the collet chuck body 730 is coupled to the rotation axis of the motor 720, so as the motor 720 rotates, the collet chuck body 730 and the collet chuck are coupled to the rotation axis of the motor 720. (731) and micro end mill (740) are also rotated together.

Meanwhile, when it is desired to replace the micro end mill 740 with another one, the collet chuck 731 is removed from the collet chuck body 730 in the reverse order of the above-described process, and the collet chuck 731 is fixed between the slits of the collet chuck 731. The pressure on the micro end mill 740 is released, the micro end mill 740 is replaced with another one, and the collet chuck 731 is inserted into the collet chuck body 730 again.

In addition, an end bracket 830 is provided around the micro end mill 740 located at the bottom of the bracket 710, and the micro end mill is formed through the through hole 830a (see FIG. 6) of the end bracket 830. (740) is inserted and rotatably disposed in a penetrating state. At this time, at least one suction unit 810 or blowing unit 820 is connected and disposed around the end bracket 830.

According to one embodiment shown in FIG. 6, two suction units 810 are disposed, one each on the left and right sides of the end bracket 830, and one blowing unit 820 is disposed in front of the end bracket 830. It can be.

At this time, the suction unit 810 connected to both sides of the end bracket 830 is a cutting chip generated from the remaining solder (S) while the grinding means 700 grinds the upper surface of the remaining solder (S). Inhale the chip. For example, the suction unit 810 and the blowing unit 820 may be an air piping structure in which an air fitting and a pipe are connected as shown in the drawing.

Meanwhile, the blowing unit 820 connected to the other side of the end bracket 830 blows air toward the remaining solder (S) while the micro end mill 740 grinds and flattens the upper surface of the remaining solder (S). Spray.

In addition, in the present invention, even when the suction unit 810 is provided alone, cutting chips can be sucked and removed, but when a blowing unit 820 is further provided in addition to the suction unit 810, the blowing unit ( As 820 strongly sprays air onto the upper surface of the remaining solder S, the cutting chip cut by the micro end mill 740 can be moved more quickly toward the suction unit 810. That is, the blowing unit 820 can double the suction power of the cutting chips and the air flow rate of the suction unit 810.

Meanwhile, although not shown in the drawing, according to one embodiment, the air suction of the suction unit 810 and the air injection of the blowing unit 820 may be performed by air compressors (not shown) connected to each other, which is simpler. It can be performed simultaneously by one compressor.

In addition, a 3D profile sensor 900 is provided on one side of the grinding means 700 to measure the shape and height of the remaining solder (S), which is an object for grinding and flattening.

For example, the 3D profile sensor 900 may be a laser displacement sensor using an optical cutting method, and radiates line-shaped laser light to the surface of the target object and receives changes in the reflected light with CMOS to determine the height of the object to be measured without contact. , measure profile data (cross-sectional shape) such as step, width, etc. Additionally, continuously measured profile data can be image-processed to obtain the 3D shape of the target object.

Therefore, the present invention is provided with the 3D profile sensor 900 to precisely measure profile data such as the position, height, or flatness of the remaining solder (S), which is an object for grinding and flattening, and to determine the micro end based on the profile data. The grinding process is performed by controlling the mill 740.

In one embodiment, the 3D profile sensor 900 determines the shape and form of a specific residual solder (S) before and after grinding the specific residual solder (S) after debonding of an electronic product. After measuring each height, the shape and height of the specific residual solder (S) are compared to each other to raise and lower the micro end mill 740 so that the upper surface of any specific residual solder (S) has a specific height and flatness. Distance and cutting precision can be controlled.

Meanwhile, in another embodiment, the 3D profile sensor 900 is configured to detect the specific residual solder (S1, S2, see Figure 9a, b) before and after grinding two or more specific residual solders (S1, S2, see Figure 9a, b) after debonding of the electronic product. After measuring the shape and height of each of the remaining solders (S1, S2), the shapes and heights of the two or more specific residual solders (S1, S2) are compared to each other, so that the upper surfaces of the two or more specific residual solders (S1, S2) are the same. Alternatively, the cutting precision of the micro end mill 740 can be controlled to have an approximate height and flatness.

Figure 9 is a schematic diagram showing the debonding and rework process of electronic components to which the present invention is applied according to one embodiment.

First, referring to FIG. 9A, a laser beam is irradiated from the laser head module (310, 410, see FIGS. 1 to 4) of the present invention to melt the solder of the ultra-small LED determined to be a defective pixel, thereby removing the ultra-small LED. At this time, the shape and height of the remaining solder (S) from which the ultra-small LED is removed are formed very irregularly. (See photo image in Figure 8a)

In this state, when an ultra-small LED is seated and bonded on the upper surface of the residual solder (S), which is irregular in shape and height, the LED is bonded in a tilted state due to the shape and height difference of the residual solder, or the terminal of the LED and the solder are bonded. Bonding defects may occur between livers.

In order to solve this problem, referring to FIG. 9B, the upper surface of the remaining solder S, which has an irregular shape and height, is ground and flattened to have a constant shape and height using the grinding means 700 of the present invention.

Before performing grinding, the 3D profile sensor 900 measures profile data such as the position, shape, and height of the remaining solder (S), which is the object of grinding and flattening. (pre-inspection)

In addition, the grinding process rotates the micro end mill 740 of the grinding means 700 at high speed to smoothly cut and flatten the upper surface of the remaining solder S, and at this time, the upper surface of the remaining solder S is smoothed and flattened. By driving the provided suction unit 810 and blowing unit 820, cutting chips of residual solder cut by the micro end mill 740 are sucked and removed through the suction unit 810.

After grinding is performed, the 3D profile sensor 900 again measures profile data such as the shape and height of the remaining solder (S). (post-inspection)

Through this, the measured profile data before and after the grinding is compared to check whether the cutting by the micro end mill 740 has reached the desired flatness and height.

Continuing, referring to FIG. 9C, solder paste (P) is doted on the upper surface of the remaining solder (S), which has been flattened through inspection by the 3D profile sensor 900, for laser bonding of a replacement LED. do. At this time, since the upper surface of the remaining solder (S) is in a smooth state where planarization has been completed, the surface of the solder paste (P) dotted on the upper surface of the remaining solder (S) forms a convex spherical shape as shown in FIG. 9C due to surface tension.

Thereafter, referring to FIG. 9D, a replacement ultra-small LED is mounted on the solder paste (P) of the remaining solder (S) for which the flattening has been completed, and then bonded by irradiating a laser beam so that the LED is leveled without being tilted to one side or having bonding defects. It is bonded normally, and finally, the rework process of the ultra-small LED is completed.

Therefore, in the present invention, after debonding the electronic component whose soldering has been melted by laser irradiation, the upper surface of the remaining solder is precisely ground with a micro end mill to prevent a height difference between the remaining solder on both sides where the replacement ultra-small LED will be bonded. By bonding the LED, it is possible to obtain the effect of resolving the replacement LED's tilt to one side or the bonding defect between the LED and the solder.

In addition, the present invention is not limited to just one embodiment described above, and the same effect can be created even when changing the detailed configuration, number, and arrangement structure of the device, so those skilled in the art will understand the present invention. It is stated that addition, deletion, and modification of various configurations are possible within the scope of the technical idea.

310, 410: Laser head module 700: Grinding means
710: Bracket 720: Motor
730: Collet Chuck Body 731: Collet Chuck
740: Micro end mill 750: Raising and lowering unit
810: Suction unit 820: Blowing unit
830: End bracket 900: 3D profile sensor
S, S1, S2: Residual solder P: Solder paste

Claims (8)

In a laser debonding device that debonds electronic components on a substrate by irradiating a laser beam from a laser head module,
Grinding means provided around the laser head module to selectively move up and down to debond electronic components and grind the upper surface of the remaining solder to flatten it to a certain height; and
A suction unit provided adjacent to one side of the grinding means to suction chips generated from the remaining solder while the grinding means grinds the upper surface of the remaining solder,
The grinding means is,
Brackets;
a motor coupled to one side of the bracket;
An end mill detachably coupled to the bottom of the motor;
A lifting and lowering unit for moving the motor and end mill up and down; and
Including a collet chuck unit for selectively coupling the end mill to the rotating shaft of the motor.
Laser debonding device. According to claim 1,
A blowing unit is further provided on the other side of the grinding means to blow air toward the remaining solder while the grinding means grinds the upper surface of the remaining solder.
Laser debonding device. According to claim 1,
A 3D profile sensor is further provided on one side of the grinding means to measure the shape and height of remaining solder.
Laser debonding device. delete According to claim 1,
An end bracket is provided around the end mill of the bracket and rotatably disposed with the end mill inserted through a hollow of the end bracket, and at least one suction unit or blowing unit is connected to the circumference of the end bracket. Characterized by,
Laser debonding device. According to claim 2,
Air intake of the suction unit and air injection of the blowing unit are performed simultaneously by one compressor.
Laser debonding device. According to claim 3,
The 3D profile sensor measures the shape and height of the specific residual solder before and after grinding the specific residual solder after debonding of the electronic product, and then determines the shape and height of the specific residual solder. Characterized by comparing with each other,
Laser debonding device. According to claim 3,
The 3D profile sensor measures the shape and height of the specific residual solder before and after grinding the two or more specific residual solders after debonding of the electronic product, and then determines the shape and height of the two or more specific residual solders. Characterized by mutual comparison of heights,
Laser debonding device.

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