KR20220154054A - Laser debonding apparatus - Google Patents

Abstract

A laser debonding apparatus of the present invention is a laser debonding apparatus for debonding electronic components on a board by irradiating a laser beam from a laser head module, comprising: a grinding means provided around a laser head module to selectively move up and down, debonding electronic components, and grinding an upper surface of a remaining solder to flatten the same to have a certain height; and a suction unit provided adjacent to one side of the grinding means to suck chips generated from the remaining solder while the grinding means grinds the upper surface of the remaining solder, thereby capable of preventing a normal LED from tilting to one side or poor bonding between an LED and a solder.

Description

Laser debonding apparatus {Laser debonding apparatus}

The present invention relates to a laser debonding device, and more particularly, after debonding an electronic component in which soldering has been melted by laser irradiation, a micro end mill is used to debond the remaining solder so that a height difference does not occur between the remaining solder to which a normal LED will be bonded. A laser debonding device that prevents a normal LED from tilting to one side or bonding failure between an LED and a solder by performing bonding after precisely grinding the top surface.

Micron laser processing is an application field with micron (㎛) level precision in industrial laser processing, which is widely used in the semiconductor industry, display industry, printed circuit board (PCB) industry, and smartphone industry. Memory chips used in all electronic devices developed technology to minimize circuit intervals in order to realize integration, performance, and ultra-high communication speed, but now, the required technology level is achieved only by reducing the circuit line width and line width interval. It is difficult to do, so it has reached the level of stacking memory chips in the vertical direction. Stacking technology up to 128 layers has already been developed by TSMC, and the stacking technology up to 72 layers is being applied to mass production by Samsung Electronics and SK Hynix.

In addition, technology development to mount a memory chip, microprocessor chip, graphic processor chip, wireless processor chip, sensor processor chip, etc. in one package is being intensely researched and developed, and a considerable level of technology is already being applied in practice.

However, in the process of developing the above-mentioned technology, more and more electrons have to participate in the signal processing process inside the ultra-high-speed/ultra-high-capacity semiconductor chip, so power consumption increases and cooling processing issues for heat generation have been raised. In addition, in order to achieve the requirements of ultra-high-speed signal processing and ultra-high frequency signal processing for more signals, a technical issue that a large amount of electrical signals should be transmitted at ultra-high speed has been raised. In addition, since the number of signal lines has to increase, the signal interface lines to the outside of the semiconductor chip can no longer be processed in a one-dimensional lead wire method, but in a two-dimensional manner under the semiconductor chip. or Fan-in Wafer-Level-Package (FIWLP)) and a signal layout redistribution layer under the ultra-fine BGA layer at the bottom of the chip, and a second fine BGA layer below it. method (referred to as Fan-Out BGA or Fan-Out Wafer-Level-Package (FOWLP) or Fan-Out Panel-Level-Package) method is being applied in practice.

Recently, in the case of semiconductor chips, products with a thickness of 200 μm or less, including an EMC (Epoxy-Mold Compound) layer, have appeared. In this way, in order to attach a micron-class ultra-thin semiconductor chip with a thickness of only a few hundred microns to an ultra-thin PCB, mass reflow (such as Thermal Reflow Oven) technology, which is a standard process of the existing surface mount technology (SMT) When the MR) process is applied, the semiconductor chip is exposed to an air temperature environment of 100 to 300 degrees (℃) for hundreds of seconds, resulting in chip-boundary warpage and PCB due to the difference in coefficient of thermal expansion (CTE). - Various types of soldering bonding adhesion defects such as PCB-Boundary Warpage and Random-Bonding Failure by Thermal Shock may occur.

Accordingly, in the past, localized heating technology has been developed to rework various types of soldering defects of electronic components that occur during the soldering process, including the above causes, among which the most actively researched field. is a soldering debonding technology by laser beam irradiation.

The conventional debonding technology by laser beam irradiation has the advantage of being non-contact, and since the method in which laser light is directly absorbed by the semiconductor chip is the primary heat absorption mechanism, there is no thermal shock due to the difference in thermal expansion coefficient. Since it is performed only for the necessary time, it has several advantages such as low power consumption, minimization of total heat input, minimization of thermal shock, and minimization of process time.

On the other hand, recently, due to various advantages such as miniaturization, light weight, and low power consumption, the use of subminiature light emitting diodes (LEDs) having a size of tens to hundreds of μm is expanding as a light source for various displays.

In the case of a micro LED having a chip size of 5 μm to 100 μm among the subminiature LEDs, a plurality of micro LED chips are densely arranged horizontally/vertically, and then connected to a power source to directly emit light, thereby displaying an image. Pixels for LED displays is being used as

On the other hand, in the case of a mini LED having a chip size of 100 μm to 200 μm, the chip size is relatively larger than that of the micro LED, and a backlight unit (Backlight unit) that expresses an image of an LCD display mainly by back emission rather than direct light emitting pixels of an LED display ) is increasing in use.

In addition, when a defective pixel is found in the inspection process after bonding such a subminiature LED to a substrate, a laser beam is irradiated to the subminiature LED at the location of the defective pixel to accurately remove only the corresponding defective LED, and the subminiature LED is removed from the place where the subminiature LED is removed. By bonding and replacing normal LEDs, a rework process of removing defective pixels and replacing them with normal LEDs is performed.

However, since the size of the subminiature LED is very fine, less than several hundred microns, the shape of the remaining solder electrically connecting the removed LED after removing the subminiature LED for the defective pixel was very irregular.

In this case, even if only a very slight height difference occurs between both terminals of the normal LED to be bonded after being seated in the remaining solder in the rework process, not only tilting occurs during soldering of the normal LED to be bonded, but also Due to bonding failure, there is a problem in that a serious soldering defect is caused in which power is not supplied to the terminal of a normal LED.

Therefore, the present invention was invented to solve the above problems, and the present invention is to debond the electronic component in which the soldering is melted by laser irradiation and to prevent a height difference between the remaining solder to which the normal LED will be bonded. An object of the present invention is to provide a laser debonding device in which a normal LED tilts to one side or a bonding defect between an LED and a solder is prevented by precisely grinding the upper surface of the remaining solder with an end mill and then bonding the same.

In order to achieve the above object, the present invention provides a laser debonding device for debonding an electronic component on a board by irradiating a laser beam from a laser head module, which is provided around the laser head module and selectively moves up and down. Grinding means for debonding the electronic component and flattening the upper surface of the remaining solder to have a predetermined height while descending; and a suction unit provided adjacent to one side of the grinding unit to suck chips generated from the remaining solder while the grinding unit grinds the upper surface of the remaining solder.

In addition, according to one embodiment, a blowing unit for blowing air toward the remaining solder while the grinding means grinds the upper surface of the remaining solder is further provided on the other side of the grinding means.

In addition, according to one embodiment, a 3D profile sensor for measuring the shape and height of the remaining solder is further provided on one side of the grinding means.

In addition, according to one embodiment, the grinding means, a bracket; A motor coupled to one side of the bracket; an end mill detachably coupled to the lower end of the motor; a lifting and lowering unit for vertically moving the motor and the end mill; and a collet chuck unit for selectively coupling the end mill to the rotary shaft of the motor.

In addition, according to one embodiment, an end bracket is provided around the end mill of the bracket and is rotatably disposed with the end mill inserted through a hollow of the end bracket, and at least one suction unit is provided around the end bracket. Alternatively, the blowing units are connected to each other.

In addition, according to one embodiment, air intake of the suction unit and air injection of the blowing unit are simultaneously performed by one compressor.

In addition, according to an embodiment, the 3D profile sensor measures the shape and height of any one specific residual solder before and after performing grinding for any one specific residual solder after debonding of the electronic product, respectively, and then measures the shape and height of the specific residual solder. It is characterized in that the shape and height of the specific remaining solder are mutually compared.

In addition, according to an embodiment, the 3D profile sensor measures the shape and height of two or more specific residual solders before and after grinding for two or more specific residual solders after debonding of the electronic product, respectively, and then measures the two or more specific residual solders. It is characterized in that the shape and height of the specific remaining solder are compared with each other.

As described above, the present invention, after debonding an electronic component in which soldering is melted by laser irradiation, precisely grinds the upper surface of the remaining solder with a micro end mill so that a height difference does not occur between the remaining solder to which normal LEDs will be bonded. Post-bonding has an effect of preventing a normal LED from tilting to one side or a bonding defect between the LED and the solder.

1 is a conceptual diagram of a single beam module of a laser debonding device according to an embodiment of the present invention.
2 is an image of an FPCB substrate irradiated with a single laser beam by a debonding device according to an embodiment of the present invention.
3 is a schematic configuration diagram of a laser debonding device according to an embodiment of the present invention;
4 is a conceptual diagram of the configuration of a laser optical system according to an embodiment of the present invention
Figure 5 is a perspective view showing a grinding means as a whole according to an embodiment of the present invention
Figure 6 is an enlarged view of the 'A' portion of Figure 5
7 is an exploded perspective view of 'B' part of FIG. 6
8 is a photographic image of residual solder, (a) a planar photographic image of residual solder before grinding treatment according to the present invention, (b) a plane photographic image of residual solder after grinding treatment according to the present invention
9 is a schematic diagram showing a debonding and rework process of an electronic component to which the present invention is applied according to an embodiment;

Terms used in this specification are used only to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as "comprise" or "having" to "include" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in this specification, but one or other features, numbers, steps, operations, components, parts, or combinations thereof, or any combination thereof, is not precluded from being excluded in advance.

Unless otherwise defined herein, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs.

Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in this specification, it should not be interpreted in an ideal or excessively formal meaning. Should not be.

Hereinafter, attached FIG. 1 is a conceptual diagram of a single beam module of a laser debonding device according to an embodiment of the present invention, and FIG. 2 is a FPCB to which a single laser beam is irradiated by the debonding device according to an embodiment of the present invention. It is an image of the board.

Referring to FIG. 1, the laser debonding apparatus of the present invention includes a single laser module 310 according to an embodiment, and accordingly, a single laser beam is radiated onto the FPCB substrate. At this time, referring to FIG. 2 , the laser beam irradiated by the first laser module 310 is irradiated onto the substrate in a deformed state in a square beam shape.

That is, as the laser beam irradiated by the laser module 310 selectively heats the temperature of the soldering defect part to the debonding temperature at which soldering melts, the electronic component becomes removable from the board, and then a certain type of ejector The device (not shown) sucks and removes the defective electronic component in which the soldering is melted from the board.

Hereinafter, referring to FIGS. 3 and 4, a dual beam configuration and operating relationship according to the present invention will be described in detail according to an embodiment.

3 is a conceptual diagram illustrating the configuration of a laser debonding device according to an embodiment of the present invention.

In FIG. 3, the laser module 310 of the laser emitter includes a laser oscillator 311 having a cooling device 316, a beam shaper 312, an optical lens module 313, a driving device 314, and a control device. 315 and a power supply unit 317.

The laser oscillator 310 generates a laser beam having a wavelength and output power within a predetermined range. The laser oscillator is, for example, a diode laser (Laser Diode, LD) having a wavelength of '750nm to 1200nm' or '1400nm to 1600nm' or '1800nm to 2200nm' or '2500nm to 3200nm' or a rare earth fiber laser (Rare-Earth- Doped Fiber Laser) or rare-earth medium photonic crystal laser (Rare-Earth-Doped Crystal Laser), otherwise, a medium for emitting alexandrite laser light having a wavelength of 755 nm, or Nd YAG (Nd having a wavelength of 1064 nm or 1320 nm) :YAG) may be implemented by including a medium for emitting laser light.

A beam shaper 312 converts a spot type laser generated from the laser oscillator 310 and transmitted through an optical fiber into an area beam type having a flat top. The beam shaper 312 may be implemented by including a square light pipe, a diffractive optical element (DOE), or a micro-lens array (MLA).

The optical lens module 313 adjusts the shape and size of the laser beam converted from the beam shaper to the form of a surface light source so that it is irradiated to electronic components or irradiation areas mounted on the PCB board. An optical lens module constitutes an optical system through a combination of a plurality of lenses.

The driving device 314 moves the distance and position of the laser module with respect to the irradiated surface, and the control device 315 controls the driving device 314 to obtain a beam shape and beam area size when the laser beam reaches the irradiated surface. , adjust the beam sharpness and beam irradiation angle. The control device 315 may also integrally control the operation of each part of the laser module 310 in addition to the driving device 314 .

Meanwhile, the laser power adjusting unit 370 controls the amount of power supplied to the laser module 310 from the power supply unit 317 corresponding to the laser module 310 according to a program received through a user interface or a preset program. The laser power adjusting unit 370 controls the power supply unit 317 based on receiving part-by-part, zone-by-zone, or total debonding state information on the irradiation surface from one or more camera modules 350 . Unlike this, the control information from the laser power adjusting unit 370 is transmitted to the control device 315 of the laser module 310, and the control device 315 provides a feedback signal for controlling the corresponding power supply unit 317. It is also possible to provide

Through this function, by adjusting the size and power of the laser beam, it is possible to perform bonding between the electronic components in the irradiation surface and the substrate or to remove the bonding. In particular, when a damaged electronic component is removed from a board, the area of the laser beam is minimized to the corresponding electronic component area, thereby minimizing the application of heat by the laser beam to other adjacent electronic components or normal electronic components present on the board. Accordingly, it is possible to remove only the damaged electronic component to be removed.

On the other hand, when a plurality of laser modules are configured to emit laser beams having different wavelengths, the laser irradiation unit is well absorbed by a plurality of material layers (eg, EMC layer, silicon layer, solder layer) included in the electronic component. It may be composed of individual laser modules having a wavelength of

Accordingly, the laser debonding device according to the present invention selectively and differently increases the temperature of the electronic component and the temperature of the intermediate bonding material such as solder, which is a connection material between the printed circuit board and the electrodes of the electronic component, to optimize bonding (Attaching or Bonding) or separation (Detaching or Debonding) process can be performed.

Specifically, either penetrates both the EMC mold layer and the silicon layer of the electronic component so that all energy of each laser beam is absorbed in the solder layer, or the laser beam does not penetrate the EMC mold layer and heats the surface of the electronic component to lower the electronic component Heat may be conducted to the bonding portion of the

4 is a schematic configuration diagram of a laser optical system according to an embodiment of the present invention.

4 is an optical system of the simplest structure applicable to the present invention, when the laser beam emitted from the beam transmission optical fiber 410 is focus-aligned through the convex lens 420 and incident to the beam shaper 430, the beam shaper ( In step 430, the spot type laser beam is converted into a flat-top type surface light source A1, and the square laser beam A1 output from the beam shaper 430 passes through the concave lens 440 to the desired shape. The image plane S is irradiated with the enlarged surface light source A2, which is enlarged in size.

Hereinafter, with reference to FIGS. 5 and 6 attached, the configuration and operation of the laser debonding device according to the present invention will be described in detail.

5 is a perspective view showing a grinding means as a whole according to an embodiment of the present invention, FIG. 6 is an enlarged view of the 'A' portion of FIG. 5, FIG. 7 is an exploded perspective view of the 'B' portion of FIG. 6, and FIG. Silver is a photographic image of residual solder, (a) a planar photographic image of residual solder before grinding according to the present invention, and (b) a planar photographic image of residual solder after grinding according to the present invention.

First, in the laser debonding device of the present invention, the grinding means of the present invention around the laser head module (310, 410, see Figs. 700) is provided.

The grinding means 700 is selectively moved up and down by the lifting unit 750, and the laser head modules 310 and 410 (see FIGS. 1 to 4) debond electronic components (eg, subminiature LEDs). The upper surface of the remaining solder S is precisely ground with a micro end mill 740 to flatten it to have a certain height required for rework of the electronic component. Therefore, by flattening the residual solder S using the apparatus of the present invention, an electronic component to be reworked (laser bonding) is tilted to one side or bonding failure between the residual solder S and terminals of the electronic component is prevented.

More specifically, referring to FIGS. 5 to 7 , the grinding means 700 includes a bracket 710, a motor 720 coupled to one side of the bracket 710, and a lower end of the motor 720 that can be separated. A micro end mill 740 that is tightly coupled, a lifting unit 750 for moving the motor 740 and the micro end mill 740 up and down, and the micro end mill 740 of the motor 720 It is configured to include a collet chuck unit 730 for selectively coupling to a rotating shaft (not shown).

The collet chuck unit 730 is a type of chuck mechanism used to fix a workpiece by opening or closing the mouth of the collet chuck 731 having a slit in the main body. Referring to FIG. 7, it has a round bar shape. A wedge-shaped collet chuck 731 is inserted into the hollow of the collet chuck body 730, and at this time, a micro end mill 740 is selectively inserted into and fixed to the center of the slit of the collet chuck 731.

Subsequently, as the collet chuck 731 including the micro end mill 740 is inserted into the hollow of the collet chuck body 730, the collet chuck 731 is tightened while being folded. At this time, the micro end mill 740 inserted into the slit of the collet chuck 731 is pressed between the slits of the collet chuck 731 as the collet chuck 731 is closed, and thus the collet chuck 731 The micro end mill 740 is fixed between the slits of ) so as not to fall out. In this state, since the upper end of the collet chuck body 730 is coupled to the rotating shaft of the motor 720, the collet chuck body 730 coupled to the rotating shaft of the motor 720 according to the rotation of the motor 720, the collet chuck 731 and the micro end mill 740 are also rotated together.

On the other hand, when replacing the micro end mill 740 with another one, take out the collet chuck 731 from the collet chuck body 730 in the reverse order of the above process, and the collet chuck 731 is fixed between the slits of the collet chuck 731. After the pressure of the micro end mill 740 is released, the micro end mill 740 is replaced with another one, and then the collet chuck 731 is inserted into the collet chuck body 730 again.

In addition, an end bracket 830 is provided around the micro end mill 740 located at the lower end of the bracket 710, and the end bracket 830 has a micro end mill through a through hole 830a (see FIG. 6). 740 is rotatably disposed in a fitted and penetrated state. At this time, at least one suction unit 810 or blowing unit 820 is connected and disposed around the end bracket 830 .

According to the embodiment shown in FIG. 6, two suction units 810 are disposed on the left and right sides of the end bracket 830, and one blowing unit 820 is disposed on the front of the end bracket 830 It can be.

At this time, while the grinding means 700 grinds the upper surface of the remaining solder S, the suction unit 810 connected to both sides of the end bracket 830 produces cutting chips ( chips) are inhaled. For example, the suction unit 810 and the blowing unit 820 may be an air pipe structure in which an air fitting and a pipe are connected, as shown in the drawing.

Meanwhile, the blowing unit 820 connected to the other side of the end bracket 830 blows air toward the remaining solder S while the micro end mill 740 grinds and flattens the upper surface of the remaining solder S. spray the

In addition, in the present invention, even when the suction unit 810 is provided alone, cutting chips can be sucked and removed, but when a blowing unit 820 is further provided in addition to the suction unit 810, the blowing unit ( As 820 strongly blows air to the upper surface of the remaining solder S, the cutting chips cut by the micro end mill 740 may be moved toward the suction unit 810 more quickly. That is, the suction force of the cutting chips of the suction unit 810 and the air velocity may be doubled by the blowing unit 820 .

On the other hand, although not shown in the drawings, according to an embodiment, air intake of the suction unit 810 and air injection of the blowing unit 820 may be performed by an air compressor (not shown) connected to each other, and more simply Preferably, it can be performed simultaneously by one compressor.

In addition, a 3D profile sensor 900 for measuring the shape and height of the remaining solder (S), which is an object of grinding and flattening, is provided on one side of the grinding unit 700.

The 3D profile sensor 900 may be, for example, a laser displacement sensor using an optical cutting method, and irradiates a laser beam in the form of a line to the surface of a target object and receives a change in the reflected light through CMOS to determine the height of the object to be measured without contact. , step, width, etc. profile data (cross-sectional shape) is measured. In addition, the continuously measured profile data can be image-processed to acquire the 3D shape of the target object.

Therefore, the present invention provides the 3D profile sensor 900 to precisely measure profile data such as the position, height, or flatness of the remaining solder (S), which is an object of grinding and flattening, and, based on the profile data, a micro-end Controlling the mill 740 performs the grinding process.

In one embodiment, the 3D profile sensor 900 determines the shape and shape of the specific residual solder S before and after grinding for any one specific residual solder S after debonding of the electronic product. After measuring the heights, the shape and height of the specific residual solder (S) are compared with each other so that the upper surface of any one specific residual solder (S) has a specific height and flatness. Distance and cutting degree can be controlled.

On the other hand, in another embodiment, the 3D profile sensor 900 may perform grinding before and after performing grinding on two or more specific residual solders (S1, S2, see FIGS. 9A and B) after debonding of the electronic product. After measuring the shapes and heights of the remaining solders S1 and S2, respectively, by comparing the shapes and heights of the two or more specific residual solders S1 and S2 with each other, the upper surfaces of the two or more specific residual solders S1 and S2 are identical. Alternatively, the cutting degree of the micro end mill 740 may be controlled to have an approximate height and flatness.

9 is a schematic diagram showing a debonding and rework process of an electronic component to which the present invention is applied according to an embodiment.

First, referring to FIG. 9A , the subminiature LED is removed by irradiating a laser beam from the laser head module (310, 410, see FIGS. 1 to 4) of the present invention to melt the solder of the subminiature LED determined to be a bad pixel. At this time, the shape and height of the remaining solder S from which the subminiature LED is removed are very irregular. (See Fig. 8a photo image)

In this state, when a subminiature LED is seated and bonded to the upper surface of the residual solder (S) having an irregular shape and height, the LED is bonded in a tilted state due to the shape and height difference of the residual solder, or the LED terminal and the solder Bonding failure may occur between them.

In order to solve this problem, referring to FIG. 9B , the top surface of the irregular shape and height of the remaining solder S is ground to have a constant shape and height by using the grinding means 700 of the present invention and flattened.

Prior to performing the grinding, the 3D profile sensor 900 measures profile data such as the position, shape, and height of the remaining solder (S), which is an object for grinding and flattening. (pre-inspection)

In addition, the grinding process rotates the micro end mill 740 of the grinding means 700 at high speed to smoothly cut and flatten the upper surface of the remaining solder (S). By driving the suction unit 810 and the blowing unit 820 provided, the cutting chips of the remaining solder cut by the micro end mill 740 are suctioned and removed through the suction unit 810 .

After performing the grinding, the 3D profile sensor 900 measures profile data such as the shape and height of the remaining solder S again. (post-inspection)

Through this, the measured profile data before and after the grinding is mutually compared to check whether the cutting by the micro end mill 740 has reached the desired flatness and height.

Subsequently, referring to FIG. 9C , the upper surface of the remaining solder S, which has been flattened through the inspection by the 3D profile sensor 900, is dotted with solder paste P for laser bonding of the replacement LED. do. At this time, since the upper surface of the remaining solder S is in a smooth state after completion of planarization, the surface of the solder paste P dotted on the upper surface of the remaining solder S forms a convex sphere as shown in FIG. 9C due to surface tension.

Subsequently, referring to FIG. 9D, after mounting a subminiature LED for replacement on the solder paste P of the remaining solder S after the flattening, irradiation of a laser beam is performed to bond the LED horizontally without tilting to one side or bonding failure. It is normally bonded, and finally the rework process of the subminiature LED is completed.

Therefore, in the present invention, after debonding an electronic component in which soldering is melted by laser irradiation, the upper surface of the remaining solder is precisely ground with a micro end mill so that a height difference does not occur between the remaining solder to which the subminiature LED for replacement is to be bonded. Since the LED is bonded, an effect of inclining the replacement LED to one side or solving a bonding defect between the LED and the solder may be obtained.

In addition, the present invention is not limited only by the above-described embodiment, and since the same effect can be created even when the detailed configuration or number and arrangement structure of the device is changed, those of ordinary skill in the art can use the present invention It is stated that addition, deletion, and modification of various configurations are possible within the scope of the technical idea of

310, 410: laser head module 700: grinding means
710: bracket 720: motor
730: collet chuck body 731: collet chuck
740: micro end mill 750: lifting unit
810: suction unit 820: blowing unit
830: end bracket 900: 3D profile sensor
S, S1, S2: Residual solder P: Solder paste

Claims (8)

In the laser debonding device for debonding electronic components on a board by irradiating a laser beam from a laser head module,
grinding means provided around the laser head module to selectively move up and down, debonding electronic components, and grinding the upper surface of the remaining solder to flatten it to have a certain height; and
A suction unit provided adjacent to one side of the grinding means to suck in cutting chips generated from the remaining solder while the grinding means grinds the upper surface of the remaining solder;
Laser debonding device. According to claim 1,
A blowing unit for blowing air toward the remaining solder while the grinding means grinds the upper surface of the remaining solder is further provided on the other side of the grinding means,
Laser debonding device. According to claim 1,
One side of the grinding means is further provided with a 3D profile sensor for measuring the shape and height of the remaining solder.
Laser debonding device. According to claim 1,
The grinding means,
Brackets;
A motor coupled to one side of the bracket;
an end mill detachably coupled to the lower end of the motor;
a lifting and lowering unit for vertically moving the motor and the end mill; and
A collet chuck unit for selectively coupling the end mill to the rotary shaft of the motor; including,
Laser debonding device. According to claim 4,
An end bracket is provided around the end mill of the bracket and is rotatably disposed with the end mill inserted through the hollow of the end bracket, and at least one suction unit or blowing unit is connected to the circumference of the end bracket, respectively. characterized in that,
Laser debonding device. According to claim 2,
Air intake of the suction unit and air injection of the blowing unit are performed simultaneously by one compressor,
Laser debonding device. According to claim 3,
The 3D profile sensor measures the shape and height of any one specific residual solder before and after grinding for any one specific residual solder after debonding of the electronic product, respectively, and then measures the shape and height of the specific residual solder Characterized in that the mutual comparison of
Laser debonding device. According to claim 3,
The 3D profile sensor measures the shape and height of the two or more specific residual solders before and after performing grinding for two or more specific residual solders after debonding of the electronic product, respectively, and then measures the shapes and heights of the two or more specific residual solders. Characterized in that the height is mutually compared,
Laser debonding device.

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