KR102228434B1 - Laser reflow method of laser reflow apparatus - Google Patents

Abstract

In the laser reflow method of the laser reflow apparatus of the present invention, an electronic component is applied by pressing and pressing a bonding object in which a plurality of electronic components are disposed on a rectangular substrate with a light-transmitting pressing member and irradiating a laser beam through the pressing member. A laser reflow method of a laser reflow apparatus for bonding a substrate to a substrate, the method comprising: (a) photographing an arrangement shape of an electronic component arranged on a substrate by a vision camera before the translucent pressing member presses the bonding object; (b) determining whether the arrangement shape of the photographed electronic component is located in the center of the pressing surface of the light-transmitting pressing member; (c) adjusting the position of the light-transmitting pressing member so that the arrangement shape of the electronic component is located at the center of the pressing surface of the light-transmitting pressing member if the photographed electronic component is not located in the center of the pressing surface of the light-transmitting pressing member; (d) pressing the light-transmitting pressing member to press the bonding object and irradiating a laser beam to the bonding object through the light-transmitting pressing member; And (e) terminating the pressurization of the translucent pressing member and irradiation of the laser beam.

Description

Laser reflow method of laser reflow apparatus {Laser reflow method of laser reflow apparatus}

The present invention relates to a laser reflow method, and more particularly, to a laser reflow method of a laser reflow apparatus for bonding electronic parts by irradiating a laser in a state in which a plurality of electronic parts are pressed and pressed with a light-transmitting pressing member. .

Micro laser processing is an application field with micron (㎛) precision in industrial laser processing, and is widely used in the semiconductor industry, the display industry, the printed circuit board (PCB) industry, and the smartphone industry. Memory chips used in all electronic devices have developed a technology that minimizes the circuit spacing in order to realize the integration, performance and ultra-high communication speed, but now the required technology level is achieved simply by reducing the circuit line width and line width interval. It was difficult to do so, so it became the level of stacking memory chips in a vertical direction. The stacking technology up to 128 layers has already been developed by TSMC, and the technology of stacking up to 72 layers is being applied to mass production at Samsung Electronics and SK Hynix.

In addition, technology development to mount memory chips, microprocessor chips, graphic processor chips, wireless processor chips, and sensor processor chips in one package is being intensively researched and developed, and a considerable level of technologies are already being applied in practice.

However, in the process of development of the above-mentioned technology, since more and more electrons have to participate in the signal processing process inside the ultra-high speed/ultra-high capacity semiconductor chip, the power consumption increases, and the issue of cooling treatment for heat has been raised. In addition, a technical issue has been raised that a large amount of electrical signals must be transmitted at an ultra-high speed in order to achieve the requirements of ultra-high-speed signal processing and ultra-high-frequency signal processing for more signals. In addition, since the number of signal lines must be increased, the signal interface lines to the outside of the semiconductor chip can no longer be processed by the one-dimensional lead wire method, but the Fan-In BGA method (Fan-In BGA), which processes two-dimensionally under the semiconductor chip. Or Fan-in Wafer-Level-Package (FIWLP)), and a Signal Layout Redistribution Layer under the ultra-fine BGA layer under the chip, and a second fine BGA layer under the chip. The method (referred to as Fan-Out BGA or Fan-Out Wafer-Level-Package (FOWLP) or Fan-Out Panel-Level-Package) has been successfully applied.

Recently, in the case of semiconductor chips, products with a thickness of 200 μm or less including an EMC (Epoxy-Mold Compound) layer have appeared. In order to attach a micron-class ultra-thin semiconductor chip with a thickness of only a few hundred microns to an ultra-thin PCB, mass reflow (such as Thermal Reflow Oven) technology, a standard process for surface mount technology (SMT). MR) process exposes semiconductor chips in an air temperature environment of 100 to 300 degrees Celsius (℃) for hundreds of seconds, so chip-boundary warpage (PCB) due to differences in coefficient of thermal expansion (CTE) -Various types of soldering bonding defects such as PCB-Boundary Warpage and Random-Bonding Failure by Thermal Shock may occur.

Accordingly, looking at the configuration of a laser reflow device that has recently been in the spotlight, a laser head module presses a bonding object (semiconductor chip or integrated circuit IC) for several seconds and irradiates a laser for bonding. (IC) Bonding is performed by irradiating a laser in the form of a surface light source corresponding to the size.

For such a pressurized laser reflow device, referring to Korean Patent No. 0662820 (hereinafter referred to as'priority document 1'), the flip chip is heated by irradiating a laser on the rear surface of the flip chip. A configuration of a flip-chip heat-pressing module for compressing a chip to the carrier substrate is disclosed.

However, the conventional pressurized laser reflow apparatus disclosed in Prior Document 1 has a means for adsorbing a chip and moving it to a bonding position, and heating the back surface of the chip through a laser and simultaneously pressing the chip onto a carrier substrate. When bonding a plurality of semiconductor chips, such as a semiconductor strip, since they are separated by means of a semiconductor strip, an operation of irradiating a laser while pressing a single semiconductor chip must be repeatedly performed as many as the number of semiconductor chips, thereby increasing the working time.

Meanwhile, referring to Korean Patent Laid-Open Patent 2017-0077721 (hereinafter referred to as'priority document 2'), the laser reflow device mentioned in the patent is in the horizontal direction while the pressure head presses several flip chips at the same time. It briefly mentions that the bonding process is possible by irradiating a laser to each flip chip sequentially one by one or by irradiating a laser to several flip chips simultaneously by a single laser head.

However, according to the conventional laser reflow method of Prior Document 2 described above, since a single laser source is used, a homogenized laser beam is irradiated and defective as the laser beam is incident on a plurality of flip chips arranged on the substrate at various angles. It is expected that a lot of technical difficulties are expected to reflow a plurality of flip chips without the need.

Accordingly, in the conventional laser reflow method disclosed in Prior Document 2, the total working time was inevitably increased by sequentially pressing and reflowing a single flip chip one by one, or horizontally to the size of various substrates for a plurality of processing. Even if a single laser beam is simultaneously irradiated onto a plurality of flip chips disposed in a different manner, it is practically difficult to uniformly transfer sufficient thermal energy to each flip chip, and thus, there remains a problem in that it is still difficult to improve the bonding defect rate.

Accordingly, the present invention has been invented to solve the above problems, and the present invention sequentially controls a process of pressing a plurality of electronic components and irradiating a laser beam according to a preset condition, thereby reducing a plurality of electrons at once without bonding defects. An object of the present invention is to provide a laser reflow method of a laser reflow apparatus in which a large amount of parts can be reflowed and the defect rate is greatly improved.

The present invention for achieving the above object is to press the bonding object on which a plurality of electronic components are disposed on a rectangular substrate with a light-transmitting pressing member, and irradiating a laser beam through the pressing member to apply the electronic component to the substrate. A laser reflow method of a laser reflow apparatus for bonding to, the method comprising: a) contacting a pressing surface of the translucent pressing member in a state in which a pressing force is not applied to an object to be bonded by moving downward; b) irradiating a laser beam to a bonding object through the translucent pressing member; And c) releasing the irradiation of the laser beam and moving the translucent pressing member upward.

In addition, after the step a), further comprising the step of fixing the vertical movement of the light-transmitting pressing member.

Further, the step of applying a predetermined predetermined pressure to the light-transmitting pressing member after step a), but not fixing the vertical movement of the light-transmitting pressing member after step b).

In addition, the step of fixing the vertical movement of the light-transmitting pressing member after step a), further comprising the step of applying a predetermined predetermined pressure to the light-transmitting pressing member after step b).

In addition, the step of fixing the vertical movement of the light-transmitting pressing member after step a), but not fixing the vertical movement of the light-transmitting pressing member after step b).

In addition, in the step b), the laser beam is irradiated with overlapping laser beams from two or more laser modules.

In addition, according to an embodiment, a laser beam is simultaneously irradiated from each of the laser modules.

In addition, according to another embodiment, a laser beam is sequentially additionally irradiated from each of the laser modules. That is, a laser beam is sequentially irradiated from each of the laser modules, and another laser beam is additionally irradiated while one laser beam is irradiated.

In addition, prior to step b), the step of preheating the bonding object from the bottom is further included.

In addition, in the step of preheating the bonding object from the bottom, the surface temperature of the bonding object is maintained below 200°C.

According to the present invention as described above, since it is possible to irradiate a homogenized laser beam while pressing and pressing a plurality of electronic components, there is an effect that productivity is significantly improved by mass reflow processing.

In addition, the pressure by the translucent pressing member and the laser beam irradiation by the laser module are sequentially and precisely controlled according to the set reference values, so that the pressing force acting on a plurality of electronic parts disposed on the substrate is insufficient or overpressure is generated. There is an effect of greatly improving various bonding defects such as possible solder contact defects and overflows.

1 is an exemplary view showing the overall configuration of a laser reflow device used in the practice of the laser reflow method of the present invention.
2 is a block diagram of FIG. 1
3 is a conceptual diagram of a single laser beam module according to an embodiment of the laser reflow method of the present invention
4 is a conceptual diagram of a multi-laser beam module according to another embodiment of the laser reflow method of the present invention
5 is a block diagram of a multi-laser module according to another embodiment of the laser reflow method of the present invention
6 to 9 are configuration diagrams of a laser optical system applicable to a single or multiple laser module of the laser reflow method of the present invention
10 is a side view schematically showing a laser reflow apparatus used in the laser reflow method of the present invention
11 is a state diagram showing the operation relationship of each step of the laser reflow method of the present invention

The terms used in the present specification are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present specification, terms such as "include" or "have" to "include" are intended to designate the presence of features, numbers, steps, actions, components, parts, or a combination thereof described in the present specification. It is to be understood that the possibility of the presence or addition of other features, numbers, steps, actions, components, parts, or combinations thereof, or any further features, is not excluded in advance.

Unless otherwise defined in the specification, all terms including technical or scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs.

Terms as defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and should not be interpreted as an ideal or excessively formal meaning unless explicitly defined in the present specification. Shouldn't.

Hereinafter, a reflow apparatus according to the present invention will be described in detail with reference to FIGS. 1 and 2.

1 is an exemplary view showing the overall configuration of a laser reflow apparatus used in the laser reflow method of the present invention, and FIG. 2 is a block diagram of FIG. 1.

The laser pressurizing head module 300 of the laser reflow apparatus according to the present invention, as shown in FIGS. 1 and 2, includes a porous material having a structure capable of applying heat to the lower portion or a stage 111 having a vacuum hole. ) At least one multi-laser module (310, 320) that irradiates a surface light source type laser to the bonding object 11 that is supported and transported, and is installed independently from the laser module (310, 320), and is a surface light source. It is configured to include a light-transmitting pressurizing member 100 that transmits the type of laser, and a protective film 200 that protects the light-transmitting pressurizing member 100 from contamination.

First, the plurality of multi-laser modules 310 and 320 convert the laser generated by the laser oscillator and transmitted through the optical fiber into a surface light source to irradiate the bonding object 11. The laser modules 310 and 320 include a beam shaper that converts a spot-shaped laser into a surface light source (see FIG. 5), and a surface light source that is disposed under the beam shaper and emitted from the beam shaper is a bonding object ( A plurality of lens modules may be implemented by including an optical unit (see FIGS. 5 to 9) that are spaced apart from each other and mounted inside the barrel so as to be irradiated to the irradiation area of 11).

The laser modules 310 and 320 may rise or fall along the z-axis, move left or right along the x-axis, or move along the y-axis for alignment with the bonding object 11.

The pressure head 300 of the laser reflow apparatus according to the present invention includes a translucent pressure member 100 that presses the bonding object 11 and a laser module 310 and 320 that irradiates a surface light source type laser to the bonding object 11. ) Are formed to be separated from each other, so that the laser modules 310 and 320 are moved to a plurality of irradiation positions of the bonding object 11 while pressing the bonding object 11 with the translucent pressing member 100 and then driven. By doing so, it is possible to shorten the tact time for one bonding object 11 and speed up the bonding operation for all of the plurality of bonding objects 11.

At this time, the light-transmitting pressing member 100 is moved to a working position or a standby position by a light-transmitting pressing member conveying unit (not shown in the drawing) of a predetermined type, for example, the translucent pressing member conveying unit lowering or It can be raised or moved to the left or right and then lowered or raised.

In addition, although not shown in the drawing, the laser pressure head module 300 of the laser reflow apparatus according to the present invention uses data input from a pressure sensor (not shown) and a height sensor (not shown) to transmit a light-transmitting pressure member. It further includes a control unit (not shown) for controlling the operation of the transfer unit.

The pressure sensing sensor and the height sensor may be installed on the light-transmitting pressing member 100, the light-transmitting pressing member transfer unit, and the stage 111 supporting the bonding object. For example, the control unit may receive data from the pressure sensor and control the light-transmitting pressurizing member transfer unit so that the pressure reaches the target value, and also control the light-transmitting pressurization member transfer unit to receive data from the height sensor and reach the target height.

In addition, the support (not shown) supports the translucent pressing member transfer unit (not shown) to be movable. As an example, the support unit may be implemented as a pair of gantry extending parallel to the stage 111, and includes a configuration that supports the translucent pressing member transfer unit to be movable in the x-axis, y-axis, or z-axis. It should be interpreted as being.

The pressure head 300 of the laser reflow device according to the present invention includes at least one actuator that applies pressure to the light-transmitting pressure member 100 and at least one pressure sensor that senses the pressure applied to the light-transmitting pressure member 100, and a light-transmitting device. It may be implemented by including one or more height sensors for detecting the height of the pressing member. The pressure sensor may be implemented with at least one load cell as an example, and the height sensor may be implemented with a linear encoder.

By adjusting the pressure applied to the object to be bonded through the pressure sensor, in the case of a large area, it is possible to control so that the same pressure can be transmitted to the object to be bonded through a plurality of actuators and a plurality of pressure sensors. Through the height sensor, it provides technical data to check the height position value at the moment when the object to be bonded is bonded or to find a more accurate value of the bonding height. It performs a function that can be controlled.

In addition, the translucent pressing member 100 may be implemented as a base material that transmits the laser output from the laser modules 310 and 320. The base material of the light-transmitting pressing member 100 can be implemented with any beam-transmitting material.

The base material of the light-transmitting pressing member 100 may be implemented by any one of, for example, quartz, sapphire, fused silica glass, or diamond. However, the physical characteristics of the light-transmitting pressing member made of quartz material are different from the physical characteristics of the light-transmitting pressing member made of sapphire. For example, when irradiating a 980 nm laser, the transmittance of the translucent pressing member made of quartz material is 85% to 99%, and the temperature measured at the bonding object is 100°C. On the other hand, the transmittance of the translucent pressurizing member made of sapphire is 80% to 90%, and the temperature measured at the bonding object is 60°C.

That is, in terms of light transmittance and heat loss required for bonding, quartz shows superior performance than sapphire. However, the inventors of the present application have repeatedly tested the translucent pressurizing member 100 while developing the laser reflow device. As a result, the translucent pressurizing member 100 made of a quartz material is cracked during laser bonding. It has been found that there is a problem in that the bonding quality is defective due to the occurrence of burning on the floor or the bottom surface. It was analyzed that gases generated during laser bonding adhered to the bottom surface of the light-transmitting pressurizing member 100, and the heat source of the laser was concentrated in a portion to which fumes adhered to increase thermal stress.

In order to prevent damage and improve durability of the light-transmitting pressurizing member 100 made of a quartz material, a thin film coating layer may be formed on the bottom surface of the light-transmitting pressurizing member made of a quartz material. The thin film coating layer formed on the bottom surface of the light-transmitting pressing member 100 may be implemented as a conventional optical coating, such as dielectric coating, SiC coating, or metallic material coating.

In the laser pressurizing head module 300 of the laser reflow apparatus according to the present invention, as shown in FIG. 1, gases generated during laser bonding are transmitted to the lower portion of the translucent pressurizing member 100. ) Is implemented to further include a protective film 200 to prevent sticking to the bottom surface of the protective film 200 and a protective film transfer unit 210 for transporting the protective film 200.

The protective film transfer unit 210 may be implemented in a reel-to-reel method in which the protective film 200 wound in a roll shape is released and transferred to one side. As an example, the protective film 200 is preferably implemented with a material having excellent heat resistance with a maximum use temperature of 300 degrees Celsius or more and a continuous maximum use temperature of 260 degrees Celsius or more. For example, the protective film 200 may be implemented with a polytetrafluoroethylene resin (commonly referred to as a Teflon resin; Polytetrafluoroethylene, PTFE) or a purple alkoxy resin. Per Fluoro Alkylvinyether copolymer (PFA) is a product that improves the heat resistance of fluorinated ethylene propylene resin, and it is a highly functional resin with a continuous maximum operating temperature of 260 degrees Celsius like polytetrafluoroethylene resin.

3 is a conceptual diagram of a single laser module according to an embodiment of the laser reflow method of the present invention, Figure 4 is a conceptual diagram of a dual laser module according to another embodiment of the laser reflow method of the present invention.

Referring to FIG. 3, the present invention includes a single laser module 310 according to an embodiment, and thus a single laser beam is irradiated onto the FPCB substrate. In this case, referring to FIG. 3, the laser beam irradiated by the first laser module 310 is irradiated on the substrate in a state in which the intensity of the laser beam is transformed into a homogenized square beam shape.

Meanwhile, referring to FIG. 4, a multi-laser module according to another embodiment of the present invention includes, for example, a first laser module 310 and a second laser module 320, and is an electronic component of the bonding object 11. At the attached position, the first and second laser modules are irradiated in a superimposed state to irradiate a homogenized superimposed laser beam.

In FIG. 4, it is illustrated that the first laser beam has a square shape and the second laser beam has a circular shape, but both laser beams may have a square shape. In addition, the first laser beam and the second laser beam may be irradiated at the same time, or the second laser beam may be sequentially additionally irradiated after preheating of the bonding object 11 by the first laser beam. That is, the laser beam is sequentially irradiated from each of the laser modules, and the second laser beam is additionally irradiated while the first laser beam is irradiated to perform overlapping irradiation.

5 is a block diagram of a dual laser module according to another embodiment of the laser reflow method of the present invention.

In FIG. 5, each of the laser modules 310, 320, ... 330 is a laser oscillator 311, 321, 331, each having a cooling device (316, 326, 336), a beam shaper (312, 322, 332) , Optical lens modules 313, 323, 333, driving devices 314, 324, 334, control devices 315, 325, 335, and power supply units 317, 327, 337.

Hereinafter, the first laser module 310 of each laser module having the same configuration will be mainly described in order to avoid redundant description, except when necessary.

The laser oscillator 311 generates a laser beam having a wavelength and output power in a predetermined range. The laser oscillator is, for example, a diode laser (Laser Diode, LD) or a rare earth medium fiber laser (Rare-Earth- Doped Fiber Laser) or Rare-Earth-Doped Crystal Laser. Alternatively, a medium for emitting alexandrite laser light having a wavelength of 755 nm, or Nd Yag (Nd) having a wavelength of 1064 nm or 1320 nm. :YAG) It may be implemented including a medium for emitting laser light.

A beam shaper 312 converts a spot-shaped laser generated in a laser oscillator and transmitted through an optical fiber into an area beam having a flat top. The beam shaper 312 may be implemented by including a Square Light Pipe, a Diffractive Optical Element (DOE), or a Micro-Lens Array (MLA).

The optical lens module 313 adjusts the shape and size of a laser beam converted into a surface light source form by a beam shaper to irradiate it to an electronic component or an irradiation area mounted on a PCB substrate. The optical lens module constitutes an optical system through a combination of a plurality of lenses, and a specific configuration of such an optical system will be described later in detail with reference to FIGS. 6 to 9.

The driving device 314 moves the distance and position of the laser module with respect to the irradiation surface, and the control device 315 controls the driving device 314 to control the beam shape and the beam area size when the laser beam reaches the irradiation surface. , Adjust the beam sharpness and beam irradiation angle. The control device 315 may also integrally control the operation of each unit of the laser module 310 in addition to the driving device 314.

Meanwhile, the laser output adjustment unit 370 is supplied to each laser module from the power supply units 317, 327, 337 corresponding to each laser module 310, 320, 330 according to a program received through a user interface or a preset program. Controls the amount of power to be used. The laser output adjustment unit 370 receives information on the reflow status of each part, area, or entire reflow on the irradiation surface from one or more camera modules 350 and controls each power supply unit 317, 327, 337 based on this. In contrast, the control information from the laser output control unit 370 is transmitted to the control devices 315, 325, 335 of each laser module (310, 320, 330), and each control device (315, 325, 335) It is also possible to provide a feedback signal for controlling the corresponding power supply unit 317. In addition, unlike FIG. 6, it is possible to distribute power to each laser module through one power supply unit. In this case, the power supply unit must be controlled by the laser output adjustment unit 370.

When implementing the laser superimposition mode, the laser power adjustment unit 370 includes each laser module and the laser module so that the laser beam from each laser module 310, 320, 330 has a required beam shape, a beam area size, beam sharpness, and a beam irradiation angle. Controls the power supply units 317, 327, and 337. In addition to the case of preheating the area around the debonding target position using the first laser module 310 and additionally heating the narrower reflow target area using the second laser module 320, the preheating function or The additional heating function is appropriately distributed among the first, second, and third laser modules 310, 320, ... 330 to control each laser module to have a required temperature profile.

Meanwhile, when a single laser light source is distributed and input to each laser module, a function for simultaneously adjusting the output and phase of each distributed laser beam may be provided in the laser output adjusting unit 370. In this case, the beam flatness can be remarkably improved by controlling the phase to induce destructive interference between the respective laser beams, thereby further increasing energy efficiency.

On the other hand, in the case of implementing a multi-position simultaneous processing mode, the laser power adjustment unit 370 is used to ensure that some or all of the laser beams from each laser module are different. Controls one or more of the angle and the beam wavelength. Even at this time, in the case of distributing one laser light source and inputting it to each laser module, the laser output adjusting unit 370 may have a function for simultaneously adjusting the output and phase of each of the distributed laser beams.

Through this function, bonding between the electronic components in the irradiation surface and the substrate can be performed or the bonding can be removed by adjusting the laser beam size and output. In particular, in the case of removing damaged electronic components on the substrate, the application of heat by the laser beam to other adjacent electronic components or normal electronic components existing on the substrate can be minimized by minimizing the area of the laser beam to the corresponding electronic component area. Accordingly, it is possible to remove only the damaged electronic component to be removed.

On the other hand, in the case of emitting laser beams with different wavelengths for each of the plurality of laser modules, the laser module will absorb a plurality of material layers (e.g., EMC layer, silicon layer, solder layer) included in the electronic component. It can be composed of individual laser modules with wavelengths. Accordingly, the laser debonding device according to the present invention selectively increases the temperature of the electronic component and the temperature of the intermediate bonding material such as solder, which is a connecting material between the printed circuit board or the electrode of the electronic component, to be optimized for bonding (Attaching or Bonding) or separation (detaching or debonding) process may be performed. Specifically, by transmitting both the EMC mold layer and the silicon layer of the electronic component so that all the energy of each laser beam is absorbed by the solder layer, or the laser beam does not pass through the EMC mold layer and heats the surface of the electronic component, the lower part of the electronic component It is also possible to conduct heat to the bonding portion of the.

Meanwhile, by utilizing the above functions, after preheating the area of the electronic component to be reflowed and a certain area of the substrate including the periphery thereof by at least one first laser beam to a predetermined preheating temperature, at least one second laser beam Accordingly, the temperature of the electronic component region to be reflowed is selectively heated to the reflow temperature at which solder melting occurs.

6 to 9 are configuration diagrams of a laser optical system applicable to a single laser beam or a multi-laser module of the laser reflow method of the present invention.

6 is an optical system having the simplest structure applicable to the present invention. When the laser beam emitted from the beam transmission optical fiber 410 is focused through the convex lens 420 and incident on the beam shaper 430, the beam shaper 430 ), the spot-shaped laser beam is converted to a flat-top type surface light source (A1), and the square laser beam (A1) output from the beam shaper 430 is the desired size through the concave lens 440 The image-forming surface S is irradiated with the enlarged surface light source A2.

7 is a block diagram of a laser optical system according to another embodiment of the present invention.

The surface light source B1 from the beam shaper 430 is enlarged to a predetermined size through the concave lens 440 to become a surface light source B2 irradiated to the first imaging surface S1. When the surface light source (B2) is to be further enlarged and used, the boundary of the edge portion of the surface light source (B2) may become more unclear according to the additional expansion, so that the final irradiation surface is the second imaging surface (S2). ) In order to obtain irradiation light with a clear edge, a mask 450 is installed on the first imaging surface S1 to trim the edge.

The surface light source passing through the mask 450 is reduced (or enlarged) to a desired size while passing through the zoom lens module 460 composed of a combination of at least one convex lens and a concave lens, and the second imaging surface on which the electronic component is placed Square irradiation light B3 is formed in (S2).

8 is a block diagram of a laser optical system according to another embodiment of the present invention.

After the square surface light source C1 from the beam shaper 430 is enlarged to a predetermined size through the concave lens 440, it is enlarged (or reduced) in the x-axis direction, for example, passing through at least a pair of cylindrical lenses 470 (C2) and again passing through at least a pair of cylindrical lenses 480, it is reduced (or enlarged) in the y-axis direction, for example, and converted into a rectangular surface light source C3.

Here, the cylindrical lens is a shape obtained by cutting a cylindrical shape in the longitudinal direction, and functions to expand or reduce the laser beam according to the shape in which each lens is arranged in the vertical direction, and the lens on the surface on which the cylindrical lens is placed is x, y Depending on the shape arranged in the axial direction, the laser beam is adjusted in the x-axis or y-axis direction.

Subsequently, the surface light source C3 is enlarged (or reduced) to a desired size while passing through the zoom lens module 460 composed of a combination of at least one convex lens and a concave lens, and the second imaging surface S2 on which the electronic component is disposed. ) To form a rectangular irradiation light C4.

9 is a block diagram of a laser optical system according to another embodiment of the present invention.

It is understood that the optical system of FIG. 9 has a configuration for trimming the edge of the laser beam by applying a mask to the optical system of FIG. 8, and it is understood that a final surface light source D5 having a sharper edge can be obtained compared to the case of FIG. I will be able to.

FIG. 10 is a side view schematically showing a laser reflow device used in the laser reflow method of the present invention, and the configuration and operation of the vertical transfer unit of the laser reflow device will be described below with reference to FIG. 10.

Looking at the configuration of the vertical transfer unit according to an embodiment, a press bracket 720 installed at four corners of each of the translucent pressing member 100 and the holder unit 500, and a pressure cylinder 730 installed above the press bracket , A vertical driving unit for applying a driving force to the press bracket 720 in a vertical direction; That is, for example, it may be composed of a ball screw 750 and a motor 760, and a guide member 770 for guiding the linear motion of the press bracket 720.

Therefore, before the bonding object 11 made of the substrate and electronic parts is put under the light-transmitting pressing member 100, the light-transmitting pressing member 100 and the holder unit 500 are driven by the motor 760 of the vertical transfer unit. After being transferred upward, and after the bonding object 11 is put in, the translucent pressing member 100 and the holder unit 500 are transferred downward by driving the motor 760 again to stand by for pressurization. Thereafter, by the operation of the pressurizing cylinder 730, the light-transmitting pressurizing member 100 presses the bonding object 11 vacuum-sucked on the electrostatic chuck 940.

Meanwhile, as a heating block 942 for preheating the bonding object 11 to a predetermined temperature is installed under the electrostatic chuck 940, the bonding object 11 is seated on the electrostatic chuck 940. While being conveyed for laser reflow processing, the bonding object 11 is continuously preheated. For example, the temperature at which the bonding object 11 is preheated may be set to less than 200°C, and it is preferable to set it to a temperature such that thermal damage to the substrate or the like is not applied due to the preheating.

FIG. 11 is a state diagram showing an operation relationship for each step of the laser reflow method of the present invention. Hereinafter, various bonding modes that can be combined for each step will be described according to an embodiment.

First, the first bonding mode of the present invention is the most basic bonding mode, comprising the steps of: contacting the pressing surface 102 of the light-transmitting pressing member 100 in a state in which the pressing force is not applied to the bonding object 11 by moving downward; Irradiating a laser beam to the bonding object 11 through the translucent pressing member 100; And releasing the irradiation of the laser beam and moving the translucent pressing member 100 upward.

In this case, the step of contacting the light-transmitting pressing member 100 in a state where no pressing force is applied is connected by the motor 760 and the ball screw 750 by driving the motor 760 as described in FIG. 10. The press bracket 720 is moved downward, and the holder unit 500 and the translucent pressurizing member 100 are mounted on the press bracket 720, so that the translucent pressurizing member 100 is lowered by the driving of the motor. Is moved to.

As the next step, referring to FIG. 11B, when the light-transmitting pressing member 100 is moved downward and comes into contact with the electronic component 11b of the bonding object 11, the light-transmitting pressing member 100 is provided with a driving force to move downward. The driving of the motor 760 is stopped, and the light-transmitting pressing member 100 comes into contact with the upper surface of the electronic component 11b without applying a pressing force. At this time, since the motor is in a locked state, the height of the translucent pressing member 100 is also fixed to prevent vertical movement.

Next, referring to FIG. 11C as a next step, a multi-laser module, that is, a first laser module, provided above the translucent pressurizing member 100 in a state in which the translucent pressurizing member 100 is in contact with the upper surface of the electronic component 11b. (310) and the second laser module (320) irradiates a laser beam to the bonding object (11) through the light-transmitting pressing member (100).

At this time, the laser beam may be irradiated with overlapping to transmit the homogenized laser beam to the plurality of electronic components 11b and solder 11c, and as mentioned above, the bonding object 11 has a predetermined preheating temperature, For example, since the bonding object 11 is preheating below 200°C, the laser beam melts the solder 11c from the preheating temperature even if it does not rapidly heat the bonding object 11 to the melting temperature of the solder 11c, such as 250°C. It becomes possible to stably heat up to temperature. Accordingly, when laser reflow is started, since the pressing surface 102 of the translucent pressing member 100 is in contact with the upper surface of the solder 11c, electrons located above the solder 11c when the solder 11c is melted. The component 11b is confined so that it is not bent or lifted upwards.

Thereafter, when soldering is completed, the first bonding mode is completed by releasing the irradiation of the laser beam and moving the translucent pressing member 100 upward.

Meanwhile, embodiments of another bonding mode in which several steps are added in the first bonding mode will be described.

In the second bonding mode, as in the above-described first bonding mode, after the light-transmitting pressing member 100 comes into contact with the electronic component 11b of the bonding object 11, the pressure cylinder 730 provided above the light-transmitting pressing member 100 ) Presses the light-transmitting pressing member 100 with a predetermined pressure.

Thereafter, when the laser beam is irradiated with the light-transmitting pressing member 100 pressing the bonding object 11 as described above, the pressing force is released as the solder 11c of the bonding object 11 is melted, and at this time, the electronic component ( It is predictable that the height of 11b) is lowered by compression of the solder 11c by _{a certain height (h c, see FIG. 11A ).} In this state, when the motor 760 is unlocked, the light-transmitting pressurizing member 100 gradually moves downwards by its own weight, so that the light-transmitting pressurizing member 100 moves downward as much as the pressing force applied by the pressurizing cylinder 730. The pressing force is maintained.

Therefore, the second bonding mode is the first in that a pressing force is applied before the laser beam is irradiated, and when the laser beam is applied and the solder 11c is melted, the translucent pressing member 100 also moves downward and maintains the pressing force. There is a difference from the first bonding mode. As a result, when the solder 11c is melted, the pressing force applied to the solder 11c is kept constant, thus reducing the lifting of the electronic component 11b or poor connection of the solder 11c, and obtaining a dense soldering effect. Is expected.

In addition, in the third bonding mode, as in the first bonding mode described above, the laser beam is irradiated without applying a pressing force after the transparent pressing member 100 contacts the electronic component 11b of the bonding object 11. Same as bonding mode.

After the laser beam is irradiated, the pressing cylinder 730 is driven to apply a predetermined pressing force to the translucent pressing member 100 and the bonding object 11. At this time, the translucent pressing member 100 is in a state in which the motor 760 is locked and fixed to prevent vertical movement, and only the pressing cylinder 730 applies a pressing force. The third bonding mode is different from the first bonding mode in that a pressing force is applied after irradiation of the laser beam.

The fourth bonding mode is the same until the third bonding mode and the irradiation step of the laser beam, but differs in that the height of the translucent pressing member 100 is changed instead of applying a pressing force after irradiation of the laser beam.

Therefore, when the motor is unlocked when the laser beam is irradiated, the light-transmitting pressurizing member 100 gradually moves downward, and eventually, the electronic component 11b and the molten solder 11c are gradually pressed, which is melted by the laser beam. Bonding failure due to the application of a sudden pressing force to the solder 11c can be prevented.

As described above, the bonding modes are possible in various embodiments in that bonding defects are prevented by controlling a pressure change according to melting of the solder. Therefore, the present invention is not limited only by the above-described embodiments, and the same effect can be created even when the detailed configuration, number, and arrangement structure of the device is changed, or the detailed steps are changed and added. In the art, it is stated that various configurations can be added, deleted, and modified within the scope of the technical idea of the present invention.

11: bonding object 11a: substrate
11b: electronic component 11c: solder
100: permeable pressing member 102: pressing surface
200: protective film 210: protective film transfer unit
310: first laser module 320: second laser module
500: holder unit 730: pressurized cylinder
760: motor 940: vacuum chuck 942: heating block

Claims (10)

Laser reflow method of a laser reflow apparatus for bonding electronic components to a substrate by pressing and pressing a bonding object on which a plurality of electronic components are disposed on a rectangular substrate with a light-transmitting pressing member and irradiating a laser beam through the pressing member In,
a) contacting a bonding object in a state in which the pressing surface of the translucent pressing member moves downward and does not apply a pressing force to the bonding object;
b) irradiating a laser beam to a bonding object through the translucent pressing member; And
c) releasing the irradiation of the laser beam and moving the translucent pressing member upward,
After the step a), further comprising the step of fixing the vertical movement of the light-transmitting pressing member,
Laser reflow method of laser reflow device. delete The method of claim 1,
Applying a predetermined predetermined pressure to the translucent pressing member after step a), but not fixing the vertical movement of the translucent pressing member after step b),
Laser reflow method of laser reflow device. The method of claim 1,
Fixing the vertical movement of the light-transmitting pressing member after step a), further comprising applying a predetermined pressure to the light-transmitting pressing member after step b),
Laser reflow method of laser reflow device. The method of claim 1,
The step of fixing the vertical movement of the light-transmitting pressing member after step a), but further comprising the step of not fixing the vertical movement of the light-transmitting pressing member after step b),
Laser reflow method of laser reflow device. The method of claim 1,
In the step b), the laser beam is irradiated with overlapping laser beams from two or more laser modules,
Laser reflow method of laser reflow device. The method of claim 6,
A laser beam is simultaneously irradiated from each of the laser modules,
Laser reflow method of laser reflow device. The method of claim 6,
A laser beam is sequentially irradiated from each of the laser modules, and another laser beam is additionally irradiated in a state in which one laser beam is irradiated,
Laser reflow method of laser reflow device. The method of claim 1,
Prior to the step b), further comprising the step of preheating the bonding object from the bottom,
Laser reflow method of laser reflow device. The method of claim 9,
The step of preheating the bonding object from the bottom is to maintain the surface temperature of the bonding object below 200°C,
Laser reflow method of laser reflow device.

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