TW202030040A - Laser head module of laser debonding apparatus - Google Patents

Abstract

A laser head module of a laser debonding apparatus of the present invention is a laser head module of a laser debonding apparatus for selectively melting soldering of at least one or more electronic components disposed on a substrate to debond the electronic component from the substrate, the module comprising: an annular housing; an optical lens module provided in the housing to enlarge or reduce a beam generated from a laser oscillator; a fixing bracket coupled to an outer circumferential surface of the housing; a clamp member coupled to an outer circumferential surface of the housing; a blowing means provided at one side of the clamp member for blowing air toward the electronic component on the substrate; and a sucking means provided on the other side of the clamp member so as to face the blowing means for sucking the electronic component separated from the substrate by the blowing means.

Description

Laser head module of laser stripping device

The present invention relates to a laser peeling device, and in more detail, it relates to a laser head module of a laser peeling device that can remove electronic components melted in solder joints without contaminating the substrate through laser irradiation.

In industrial laser processing, the application field with micron (μm) precision is micro laser processing, which is widely used in the semiconductor industry, display industry, printed circuit board (PCB) industry, smart phone industry, etc. In the storage chips used in all electronic devices, in order to achieve integration, performance, and ultra-high-speed communication speed, the technology is developing in the direction of minimizing the circuit line width and line width interval. However, currently only by reducing the circuit line width and The line width interval cannot achieve the required technical level, and is only at the level of stacking multiple storage chips in a vertical direction. Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) has developed a lamination technology up to 128 layers, and Samsung Electronics, SK Hynix, etc. have applied the technology up to 72 layers for mass production.

In addition, it is actively researching and developing technologies for packaging storage chips, microprocessor chips, graphics processor chips, wireless processor chips, and sensor processor chips in one assembly. A fairly high level of technology has been practically applicable.

However, in the aforementioned technology research and development process, in the ultra-high-speed/ultra-high-capacity semiconductor chip, more electrons are involved in the signal processing process. Therefore, the power consumption becomes larger, and the cooling processing technology related to heat generation is proposed. In addition, in order to realize the requirements of ultra-high-speed signal processing and ultra-high-frequency signal processing related to more signals, a technology that needs to transmit a large number of electrical signals at ultra-high speed has been proposed. In addition, the number of signal lines needs to increase, and it is impossible to process the signal port lines to the outside of the semiconductor chip in a one-dimensional lead method. It is actually suitable for the ball grid array (BGA) method of two-dimensional processing in the lower part of the semiconductor chip (called fan-in ball grid). Array (Fan-In BGA) or Fan-in Wafer-Level-Package (FIWLP)), the signal wiring rearrangement layer (Signal Layout Redistribution Layer) is a method in which a secondary micro-ball grid array layer (called Fan-Out BGA) or Fan-Out Wafer-Level-Package (Fan-Out Wafer-Level-Package ( FOWLP)) or Fan-Out Panel-Level-Package (Fan-Out Panel-Level-Package)).

Recently, in the case of semiconductor wafers, products including an epoxy-mold compound (EMC, Epoxy-Mold Compound) layer with a thickness of 200 μm or less are on the market. In order to attach the above-mentioned ultra-light and thin semiconductor wafers with a thickness of only a few hundred micrometers to the ultra-light and thin printed circuit boards, the thermal reflow oven (Thermal) which is the standard process of the conventional surface mount technology (SMT) In the mass reflow (MR) process of Reflow Oven technology, the semiconductor wafer is exposed for hundreds of seconds in an air temperature environment of 100-300°C. Therefore, due to the difference in the coefficient of thermal expansion (CTE), the wafer- Chip-Boundary Warpage, PCB-Boundary Warpage, Random-Bonding Failure by Thermal Shock and other forms of solder bonding are poor.

Therefore, in the past, in order to rework various forms of soldering defects of electronic components caused by the soldering process including the above-mentioned reasons, localized heating technology has been developed. Among them, the most active area of recent research It is the welding peeling technology by means of laser beam irradiation.

The previous peeling technology by laser beam irradiation has the advantage of non-contact. The method in which the laser is directly absorbed by the semiconductor wafer is a one-time heat absorption mechanism. Therefore, it has the advantage of no thermal shock caused by the difference in thermal expansion coefficient. Very local heating is performed within the time period, so it has various advantages such as low power consumption, minimized total heat input, minimized thermal shock, and minimized processing time.

On the other hand, the laser head module of the generally known laser welding device presses the welding object (semiconductor chip or integrated circuit (IC)) for several seconds and irradiates the laser to perform the welding. Welding is carried out with a laser in the form of a surface light source corresponding to the size of the body circuit.

For this pressurized laser head module, refer to Korean Granted Patent No. 10-1245356 (hereinafter referred to as "existing document"), which states that the semiconductor chip is sucked by vacuum and the laser in the form of a surface light source is directed toward the semiconductor A suction module for wafer irradiation and a pressure head structure including the same.

However, in the conventional pressurized laser head module as described above, the presser head and the laser irradiation part are manufactured as one module and driven. Therefore, when welding a plurality of semiconductor chips such as semiconductor tapes Next, the operation of pressing one semiconductor wafer and irradiating a laser in the form of a surface light source is repeated the same number of times as the number of semiconductor wafers.

As a result, the overall work time for soldering a plurality of semiconductor wafers increases, and with the addition of a heating head, there is a problem that the price of the overall equipment increases sharply.

On the other hand, even if the laser head module irradiated by the laser beam is applied to the peeling device instead of the above-mentioned pressurizing head method, at present, the electronic components separated by the laser by the staff using tools are removed or manually removed by hand. The use of an additional spraying device to remove, therefore, not only has the problem of the substrate being contaminated by the heated and molten soldering liquid, but also has the risk of safety accidents caused by the high heat of the laser head module.

Therefore, the present invention is intended to solve the above-mentioned problems. The object of the present invention is to provide a laser peeling device that directly removes electronic components melted by laser irradiation at its position without contamination of the substrate by means of air blowing and suction. The laser head module.

The present invention for achieving the above-mentioned object is a laser peeling device that selectively melts the soldering place of at least one electronic component arranged on a substrate to peel the electronic component from the substrate, including: a ring-shaped housing; an optical lens module, Is arranged in the housing to enlarge or reduce the light beam generated from the laser oscillator; the fixing bracket is combined with the outer peripheral surface of the housing; the clamp part is combined with the outer peripheral surface of the housing; the air supply unit is provided in one of the clamp parts The electronic component blows air from the side toward the substrate; and a suction unit is provided on the other side of the jig member so as to face the blower unit, and sucks the electronic components separated from the substrate through the blower unit.

In addition, the housing further includes a beam shaper that selectively converts the shape of the light beam generated from the laser oscillator and transmits it to the optical lens module.

In addition, the above-mentioned beam shaper converts the circular laser beam generated from the laser oscillator into a square beam.

In addition, the air blowing unit includes: a fixed plate fixedly coupled to the clamp member; a supporting frame hingedly coupled to one end of the fixed plate; and an air nozzle coupled with the supporting frame to spray air supplied from a compressor.

In addition, the suction unit includes: a fixing plate fixedly coupled to the clamp member; a supporting frame hingedly coupled to one end of the fixing plate; and a funnel member coupled to the supporting frame to suck the electronic components through the suction of the compressor.

In addition, the clamp member is integrally formed at the lower end of the fixing bracket to have a conical shape gradually narrowing downward, and is formed with a hollow center on the left and right sides of the inside of the body so as to form an air blower. The air flow path of the unit and the suction unit.

In addition, the opposite end portions of the air flow paths constituting the air blowing unit and the suction unit have a nozzle shape and a funnel shape, respectively.

In addition, an electronic component recycling bin is connected to a part of the suction path of the suction unit.

In addition, the air injection by the above-mentioned air blowing unit and the air suction by the suction unit are performed simultaneously through one compressor.

In addition, in a state where the housing, the optical lens module, and the fixing bracket are each provided in a plurality and arranged separately, at least a part of the laser beam irradiated from each of the optical lens modules is overlapped and irradiated on a predetermined area of the substrate, the fixture The components, the air blowing unit, and the suction unit are provided in one of a plurality of the aforementioned housings.

The present invention as described above has the following effect. That is, the present invention forms a double rectangular beam to irradiate the solder joints of electronic components. Therefore, compared with the case of irradiating a single-wheel beam from a conventional laser peeling device, it can be improved by 10%. The temperature deviation at the level of -20 degrees, therefore, can prevent the flexible printed circuit board (FPCB) as a thin flexible substrate from being thermally damaged, burning or melting during the peeling process.

In order to make the above and other objects, features and advantages of the present invention more comprehensible, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows.

The terms used in this specification are only used to describe specific embodiments and do not limit the present invention. Unless the difference is clearly expressed in context, singular expressions include plural expressions. In this specification, terms such as "include", "have" or "have" are used to designate the existence of the features, numbers, steps, actions, structural elements, components, or their combinations described in this specification, rather than prior Exclude the existence or additional possibility of one or more other features or numbers, steps, actions, structural elements, components or their combinations.

In this specification, unless otherwise defined, all terms used herein including technical or scientific terms have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs.

Terms that have the same meaning as defined in commonly used dictionaries should be interpreted as having meanings consistent with the meanings of the context of the related technology, unless they are clearly defined in this specification, and should not be interpreted as ideal or excessively formal meanings.

Hereinafter, attached Figure 1 is a schematic diagram of a single beam module of a laser stripping device according to an embodiment of the present invention, and Figure 2 is a diagram of a flexible printed circuit board irradiated with a single laser beam by the stripping device according to an embodiment of the present invention Like.

1, the laser stripping device of the present invention has a single laser module 310 according to an embodiment, whereby a single laser beam is irradiated onto the flexible printed circuit board. In this case, referring to FIG. 2, the laser beam irradiated by the first laser module 310 is irradiated onto the substrate in a state deformed into a square beam shape.

That is, the temperature of the defective part of the solder joint is selectively heated to the peeling temperature at which the solder joint is melted by the laser beam irradiated by the above-mentioned laser module 310, so that the electronic component is in a state that can be removed from the substrate. The spray device of the form (refer to FIGS. 5 and 6) sucks and removes defective electronic components in the solder joints described above from the substrate.

Hereinafter, the configuration and working relationship of the dual beams of the present invention will be described in detail with reference to FIGS. 3 and 4 attached and according to an embodiment.

FIG. 3 is a schematic structural diagram of a laser stripping device according to an embodiment of the invention.

3, the laser module 310 of the laser irradiation unit includes a laser oscillator 311 with a cooling device 316, a beam shaper 312, an optical lens module 313, a driving device 314, a control device 315, and a power supply unit. 317.

The above-mentioned laser oscillator 311 generates a laser beam having a predetermined range of wavelength and output power. For example, the laser oscillator can be a laser diode (LD) with a wavelength of "750nm to 1200nm" or "1400nm to 1600nm" or "1800nm to 2200nm" or "2500nm to 3200nm", rare earth doped Rare-Earth-Doped Fiber Laser or Rare-Earth-Doped Crystal Laser (Rare-Earth-Doped Crystal Laser), differently, can include a 755nm wavelength for releasing alexandrite mine The medium used for the yttrium aluminum garnet (Nd: YAG) laser with a wavelength of 1064nm or 1320nm.

The beam shaper 312 converts the spot-shaped laser generated in the laser oscillator 311 and transmitted through the optical fiber into a flat-topped area light source (Area Beam). The beam shaper 312 may include a square light pipe (Square Light Pipe), a Diffractive Optical Element (DOE), or a Micro-Lens Array (MLA).

The optical lens module 313 adjusts the size of the laser beam converted into a surface light source in the beam shaper to irradiate the electronic components mounted on the printed circuit board or the irradiation area. The optical lens module constitutes an optical instrument through the combination of a plurality of lenses.

The driving device 314 moves the distance and position of the laser module relative to the irradiation surface. The control device 315 controls the driving device 314 to adjust the beam shape, beam area, beam brightness, and beam irradiation angle when the laser beam reaches the irradiation surface. In addition to controlling the driving device 314, the control device 315 can also comprehensively control the work of each part of the laser module 310.

On the other hand, the laser output adjustment unit 370 controls the amount of power supplied from the power supply unit 317 corresponding to each laser module 310 to each laser module 310 according to a program received through the user port or a preset program. The laser output adjustment unit 370 receives the peeling state information of each component, each area, or the whole on the irradiation surface from one or more camera modules 350 and controls each power supply unit 317 accordingly. In contrast, the control information from the laser output adjustment unit 370 is transmitted to the control device 315 of each laser module 310, and a feedback signal for controlling the corresponding power supply unit 317 in each control device 315 can also be provided.

Through this function, the size and output of the laser beam can be adjusted to perform bonding between a plurality of electronic components and the substrate in the irradiation surface or to remove the bonding between a plurality of electronic components and the substrate in the irradiation surface. In particular, in the case of removing damaged electronic components from the substrate, as the area of the laser beam is minimized to the corresponding electronic component area, the laser beam can be transmitted to other electronic components adjacent to the substrate or normal The heat applied to the electronic components is minimized, and thereby, only the damaged electronic components that are the object of removal can be removed.

On the other hand, in the case of causing each laser module to emit laser beams with mutually different wavelengths, the laser irradiation section may have multiple material layers included in the electronic components (e.g., epoxy molding compound layer, The silicon layer, the solder layer) are composed of individual laser modules that each absorb wavelengths well.

Therefore, the laser peeling device of the present invention selectively raises the temperature of the electronic component and the temperature of the intermediate bonding material such as the solder (Solder) as the connection material between the printed circuit board or the electrode of the electronic component to different temperatures. Perform optimized bonding (Attaching or Bonding) or separation (Detaching or Debonding) processes.

Specifically, the epoxy plastic molding layer and the silicon layer of electronic components can be transmitted equally to make the soldering layer absorb all the energy of each laser beam, and the laser beam can also be opaque to the epoxy plastic molding layer and the electrons The surface of the component is heated to transfer the heat to the soldering part of the lower part of the electronic component.

4 is a schematic diagram of the structure of a laser optical instrument according to an embodiment of the present invention.

4 is the simplest optical instrument that can be applied to the present invention. If the laser beam released from the beam transmission optical fiber 410 passes through the convex lens 420 to align the intersections and enters the beam shaper 430, the beam shaper 430 will The laser beam is converted to a flat-top surface light source A1. The square laser beam A1 output from the beam shaper 430 is enlarged to the required size through the concave mirror 440, and the enlarged surface light source A2 is directed to the imaging surface S irradiation.

Hereinafter, the structure and working relationship of the laser head module of the present invention will be described in detail with reference to FIGS. 5 and 6. First of all, in the following content, the laser head module 600 of the present invention includes a part of the structure of the laser module described above except for the laser oscillator 311, the cooling device 316, the driving device 314, and the like.

5 is a perspective view of the appearance of a laser head module according to an embodiment of the invention.

In the attached FIG. 5, first, the laser head module 600 includes a ring-shaped housing 610, and the upper end of the housing 610 is connected to the beam transmission optical fiber 410 to direct the laser beam generated from the laser oscillator 311 to The inside of the housing 610 transfers.

Inside the housing 610 is a beam shaper 430 that converts the arc-shaped beam generated from the laser oscillator 311 into a square beam. The lower part of the beam shaper 430 is inserted and arranged to enlarge or reduce the transmission according to the application. The optical lens module 313 of the square beam of the beam shaper.

The present invention is characterized in that if the solder joints of the electronic components are melted by the laser beam irradiated from the above-mentioned laser head module 600, the structure of the spray device for removing them is integrated.

For this reason, in the present invention, as shown in the attached Figure 5, the outer peripheral surface of the housing 610 is combined with a fixing bracket 650 for fixing the housing, and the lower part of the fixing bracket is combined with a clamp member 620. On the left side of the jig member 620 is installed an air blowing unit that blows air toward the electronic components of the substrate, and on the right side of the jig member 620 is installed a suction unit for sucking in electronic components separated from the substrate by the air blowing unit.

More specifically, in the above-mentioned air supply unit, since the clamp member 620 is fixedly combined with the fixed plate 631 and the one end of the fixed plate 631 is hingedly connected to the support frame 632, the support can be adjusted arbitrarily if a worker is required. The angle of the frame. In addition, for example, the support frame 632 is coupled with the air nozzle 633 through a screw connection, and therefore, air supplied from an external compressor (not shown) can be sprayed to the electronic components of the substrate.

In addition, the above-mentioned suction unit has a structure similar to the above-mentioned air supply unit. For example, the clamp member 620 is connected to the fixing plate 641 through a screw connection. One end of the fixing plate 641 is hingedly connected to the supporting frame 642, and is mounted on the supporting frame 642. There is a funnel member 643 that sucks electronic components through the suction of an external compressor (not shown).

In this case, the air injection by the blowing unit and the air suction by the suction unit can be driven by independent compressors. For a compact device structure, it is preferable to use the same compressor (not shown) To make the blowing unit and the suction unit driven at the same time.

On the other hand, FIG. 6 is a partial cross-sectional view of a laser head module according to another embodiment of the present invention.

Hereinafter, referring to Figure 6 attached, the multiple air flow paths constituting the above-mentioned air blowing unit and the suction unit can be separately engraved and formed so as to be integrated with the inside of the main body of the jig member, instead of facing one of the above-mentioned Figure 5 As in the embodiment, the blower unit and the suction unit are mounted on the outside of the clamp member.

As an example, in this case, referring to FIG. 6, the clamp member 621 is integrally formed in a conical shape that gradually narrows downward toward the lower end of the fixing bracket 650 adhered to the outer peripheral surface of the housing.

In this case, a hollow 621a is formed in the central part of the fixture body. It can be understood that the laser beam irradiated from the laser oscillator 311 passes through the beam shaper 312 and the optical lens module 313 inside the housing. The hollow 621a is irradiated to the substrate.

In addition, air flow paths 621b and 621c for configuring the air blowing unit and the suction unit are respectively engraved on the left and right sides inside the main body of the clamp member 621 with the hollow 621a as the center.

In this case, it is more preferable that the opposing end portions of the air flow path constituting the air blowing unit and the suction unit have a nozzle shape and a funnel shape, respectively, and the air jetted through the air flow path 621b of the air blowing unit separates the electronics from the substrate. The components are then sucked and removed through the air flow path 621c of the suction unit.

On the other hand, an electronic component recycling bucket 700 in the form of a slip-net is also connected to the suction path of the suction unit, and the staff needs to take out the electronic components gathered in the electronic component recycling bucket 700 and reuse it at any time.

At the same time, for example, the laser head module of the present invention can also be composed of a dual-beam laser stripping device with two laser modules instead of a single laser module having the above-mentioned embodiment. In order to construct such a dual-beam laser peeling device, for example, after including two laser head modules each having a housing, an optical lens module, and a fixing bracket, the above-mentioned laser head molds can be divided and arranged at predetermined intervals. The morphological composition of the group. In this case, the laser beams irradiated from the respective optical lens modules provided in the above-mentioned two laser head modules are irradiated so that part of them overlaps in a predetermined area of the substrate.

As described above, in the case of driving two laser head modules, for example, in the case of allocating one laser light source to input to each laser head module, the laser output adjustment unit 370 may have a function for simultaneously adjusting the allocation. The output and phase function of each laser beam. In this case, it is possible to control the phase in such a way that the interference between the laser beams is guided to significantly improve the beam flatness, thereby further increasing energy efficiency.

On the other hand, as described above, when multiple positions are simultaneously processed, the laser output adjustment unit 370 controls each laser so that part or all of the laser beams generated from each laser head module are different. One or more of beam shape, beam area size, beam brightness, beam irradiation angle, and beam wavelength. In this case, when one laser light source is allocated for input to each laser head module, the laser output adjustment unit 370 may have a function for simultaneously adjusting the output and phase of each allocated laser beam.

Compared with a single beam, the size and output of the laser beam can be adjusted to make it easier to bond multiple electronic components on the irradiation surface to the substrate or to remove the bond between multiple electronic components on the irradiation surface and the substrate Homework. In particular, in the case of removing damaged electronic components on the substrate, as the area of the laser beam is minimized to the corresponding electronic component area, the laser beam can be transmitted to other electronic components adjacent to the substrate or normal The heat applied to the components is minimized, and thereby, only the electronic components to be removed can be removed.

On the other hand, in the above-mentioned dual laser head module peeling device structure, it is not necessary to install the spray device in all the laser head modules. For example, it can be installed in only one shell of the above-mentioned multiple laser head modules. Jet device. For this reason, it can be understood that in the case where the jig components, the blower unit, and the suction unit constituting the spray device are installed in only one of the two laser head modules, it is possible to sufficiently perform air blowing and suction The function of removing peeled electronic parts.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to those defined by the attached patent application scope.

310: The first laser module 311: Laser Oscillator 312: beam shaper 313: Optical lens module 314: Drive 315: control device 316: cooling device 317: Power Supply Department 370: Laser output adjustment department 410: beam transmission optical fiber 420: Convex mirror 430: beam shaper 440: concave mirror A1, A2: Area light source S: imaging surface 600: Laser head module 610: Shell 610: Shell 620, 621: fixture parts 621b, 621c: air flow path 621a: hollow 631: fixed plate 632: Support Frame 633: Air Nozzle 641: fixed plate 642: Support Frame 643: Funnel Parts 650: fixed bracket 700: Parts recycling bin

FIG. 1 is a schematic diagram of a single beam module of a laser stripping device according to an embodiment of the invention. 2 is an image of a flexible printed circuit board irradiated with a single laser beam by means of a peeling device according to an embodiment of the present invention. 3 is a schematic diagram of the structure of a laser stripping device according to an embodiment of the present invention. 4 is a schematic diagram of the structure of a laser optical instrument according to an embodiment of the present invention. 5 is a perspective view of the appearance of a laser head module according to an embodiment of the invention. 6 is a partial cross-sectional view of a laser head module according to another embodiment of the invention.

410: beam transmission optical fiber

600: Laser head module

610: Shell

620: fixture parts

631: fixed plate

632: Support Frame

633: Air Nozzle

641: fixed plate

642: Support Frame

643: Funnel Parts

650: fixed bracket

Claims (10)

A laser head module of a laser peeling device for peeling electronic components from a substrate, including: Annular shell The optical lens module is arranged in the housing to enlarge or reduce the light beam generated from the laser oscillator; The fixing bracket is combined with one side of the outer peripheral surface of the aforementioned housing; The clamp part is combined with the other side of the outer peripheral surface of the aforementioned housing; The air blowing unit is provided on one side of the above-mentioned clamp member to blow air toward the electronic components of the substrate; and The suction unit is provided on the other side of the jig member so as to face the air blowing unit, and sucks in the electronic components separated from the substrate through the air blowing unit. The laser head module of the laser stripping device according to claim 1, wherein the housing further includes a beam shaper which selectively converts the shape of the light beam generated from the laser oscillator and transmits it to the optical lens module . The laser head module of the laser stripping device according to claim 1, wherein the beam shaper converts a circular laser beam generated from a laser oscillator into a square beam. The laser head module of the laser stripping device according to claim 1, wherein the air supply unit includes: Fixed plate, fixedly combined with fixture parts; The supporting frame is hingedly connected to one end of the fixed plate; and The air nozzle is combined with the above-mentioned support frame to inject air supplied from the compressor. The laser head module of the laser stripping device according to claim 1, wherein the suction unit includes: Fixed plate, fixedly combined with fixture parts; The supporting frame is hingedly connected to one end of the fixed plate; and The funnel component is combined with the above-mentioned support frame to suck the electronic components through the suction of the compressor. The laser head module of the laser peeling device according to claim 1, wherein the clamp member is integrally formed at the lower end of the fixing bracket to have a conical shape gradually narrowing downward, and is formed with a hollow as the center The left and right sides of the inside of the main body are respectively engraved and slanted downward to form air flow paths for constituting the air blowing unit and the suction unit. The laser head module of the laser peeling device according to claim 6, wherein the opposite end portions of the air flow path constituting the air blowing unit and the suction unit are respectively formed in a nozzle shape and a funnel shape. The laser head module of the laser peeling device according to claim 1, wherein a part of the suction path of the suction unit is further connected with an electronic component recycling bin. The laser head module of the laser peeling device according to claim 1, wherein the air injection by the air blowing unit and the air suction by the suction unit are performed simultaneously through one compressor. The laser head module of the laser stripping device according to claim 1, wherein In a state where the housing, the optical lens module, and the fixing bracket are each provided in a plurality and arranged separately, at least a part of the laser beam irradiated from each of the optical lens modules is overlapped and irradiated on a predetermined area of the substrate, The clamp member, the air blowing unit, and the suction unit are provided in one of the multiple housings.

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