WO2017142150A1

WO2017142150A1 - Laser soldering repairing process, laser soldering process and laser soldering system

Info

Publication number: WO2017142150A1
Application number: PCT/KR2016/009771
Authority: WO
Inventors: 정대호; 정태오
Original assignee: (주)이오테크닉스
Priority date: 2016-02-15
Filing date: 2016-09-01
Publication date: 2017-08-24
Also published as: KR101935518B1; TWI664042B; KR20170095593A; TW201729928A

Abstract

Disclosed are a laser soldering repairing process, a laser soldering process and a laser soldering system. The laser soldering repairing process is a repairing process performed, by means of a laser, on a repair area on which a soldering process has not been performed of a solder area on a substrate. The laser soldering repairing process comprises the steps of: performing laser cleaning by means of radiating a cleaning laser beam on a repair area of a substrate; preparing a solder ball on the cleaned repair area of the substrate; and radiating a soldering laser beam on the solder ball and thus heating the solder ball and attaching same to the repair area.

Description

Laser soldering repair process, laser soldering process and laser soldering system

The present invention relates to laser soldering, in particular a laser soldering repair process. It relates to a laser soldering process and a laser soldering system comprising the same.

In general, in a semiconductor process, a process of bonding a semiconductor chip to a substrate such as a printed circuit board (PCB) using a solder is performed. Such a process may include a soldering process of printing a solder ball containing a tin component at a predetermined position on the substrate and then attaching the solder ball to the substrate by heating the solder ball to a high temperature. This soldering process is generally referred to as a reflow soldering process and is widely applied throughout the industry. Conventionally, a soldering apparatus using heat has been used, but this has a problem that the size is large and the soldering process takes a lot of time. Therefore, in order to solve this problem, a soldering apparatus using a laser has recently been developed. In the soldering apparatus using a laser, a laser beam may be focused on a narrow area of a substrate to melt a solder ball having a small size, and the process may be performed using less power than a method using heat. Then, the solder ball can be melted in a short time by using the high energy of the laser beam.

After the soldering process is performed using a laser, a soldering process may not be performed on a portion of the substrate. Therefore, in order to solve this problem, it is necessary to print the solder ball on the area to be repaired in the substrate and then perform the soldering process again by using the laser, that is, the laser soldering repair process. However, since the laser soldering process and the laser soldering process are performed separately from each other, when the substrate is transported or stored after the laser soldering process is first performed, contaminants may adhere to the surface of the substrate and become contaminated. Therefore, when the laser soldering repair process is performed while the contaminant is attached to the substrate, the contaminant may act as a ignition material and burn or explosion may occur when the laser beam is radiated. Ultrasonic cleaning can be used to remove contaminants prior to laser soldering repairs to solve this substrate contamination problem, but this adds to the time and cost associated with adding new processes. have.

Laser soldering repair process according to an embodiment of the present invention. It provides a laser soldering process and a laser soldering system comprising the same.

In one aspect of the invention,

In the laser soldering repair process of performing a repair process by using a laser in the repair region of the soldering region on the substrate is not performed,

Irradiating a cleaning laser beam to the repair region of the substrate to perform a laser cleaning process;

Providing a solder ball in the cleaned repair region of the substrate; And

And irradiating a soldering laser beam to the solder balls to heat the solder balls and attach them to the repair region.

A laser cleaning process may be performed on the repair region of the substrate, and then flux may be applied. The method may further include attaching the solder ball to the repair region using the soldering laser beam and then performing a water cleaning process on the substrate.

The cleaning laser beam and the soldering laser beam may have the same wavelength. The cleaning laser beam and the soldering laser beam may have wavelengths in the near infrared range, for example. As a specific example, the cleaning laser beam and the soldering laser beam may have a wavelength of 915 nm.

The cleaning laser beam may have a smaller output than the soldering laser beam. For example, the cleaning laser beam and the soldering laser beam may have outputs of 2W and 5W, respectively.

The cleaning laser beam and the soldering laser beam may be defocused and irradiated to the repair region.

In another aspect,

Performing a first soldering process on the soldering region on the substrate:

Performing a laser cleaning process on a repair region in which the soldering process is not performed among the soldering regions on the substrate; And

And performing a second soldering process on the cleaned repair region of the substrate.

The first soldering process may include providing solder balls in a soldering region on the substrate; And attaching the solder ball to the soldering area by irradiating and heating a soldering laser beam on the solder ball.

The laser cleaning process may be performed by irradiating a cleaning laser beam to the repair region of the substrate.

The second soldering process may include providing solder balls in the cleaned repair region on the substrate; And attaching the solder ball to the repair area by heating the solder ball by irradiating a soldering laser beam.

The method may further include performing a water cleaning process on the substrate after the second soldering process.

The cleaning laser beam and the soldering laser beam may have the same wavelength. The cleaning laser beam may have a smaller output than the soldering laser beam. The cleaning laser beam and the soldering laser beam may be defocused and irradiated.

In another aspect,

In the laser soldering system performing a soldering process using a soldering laser beam in the soldering region of the substrate, and performing a laser soldering repair process in the repair region of the soldering region of the substrate is not performed.

A solder ball supply unit providing solder balls to solder areas of the substrate; And

And a laser irradiation device for irradiating the solder ball to the solder ball and irradiating the cleaning laser beam to the repair region of the substrate.

The laser soldering system may further include a flux applying unit to apply flux to the soldering region of the substrate. The laser soldering system may further include a washing water supply unit supplying the washing water to the substrate to perform a water cleaning process.

According to an embodiment of the present invention, a cleaning process is first performed by using a laser on the repair region of the substrate on which the soldering process is not performed, and then soldering is performed on the repaired repair region. Accordingly, foreign matters that may be present in the repair region of the substrate may be effectively removed, and as a result, burn or explosion that may be caused by contamination of the foreign matters may be prevented. In addition, by performing the cleaning process using a laser, it is possible to reduce the time or cost required for the cleaning process. In addition, since the cleaning laser beam and the soldering laser beam can be generated from the same laser light source without providing separate cleaning equipment, the laser soldering system can be configured more simply.

1A to 1D are views illustrating a general laser soldering repair process.

2A through 2E are diagrams illustrating a laser soldering repair process according to an exemplary embodiment of the present invention.

3A is a photograph showing a contaminant adhered to a repair area of the substrate, and FIG. 3B shows a burn phenomenon caused by performing a laser soldering process in the state shown in FIG. 3A. It is a photograph.

4A is a photograph of a contaminant adhered to the repair region of the substrate, and FIG. 4B is a photograph of incomplete soldering by performing a laser soldering process in the state of FIG. 4A.

5A is a photograph showing a state in which contaminants are attached to the repair region of the substrate.

5B illustrates a state in which the contaminants are removed from the repair region of the substrate by laser cleaning in accordance with an exemplary embodiment of the present invention in the state shown in FIG. 5A.

FIG. 5C is a photograph of soldering being completely performed by performing a laser soldering process in the state shown in FIG. 5B.

6 shows a laser soldering system according to another exemplary embodiment of the present invention.

7A to 7H are views illustrating a process of performing a laser soldering process using the laser soldering system shown in FIG. 6.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention; The examples illustrated below are not intended to limit the scope of the invention, but are provided to explain the invention to those skilled in the art. Like reference numerals in the drawings refer to like elements, and the size or thickness of each element may be exaggerated for clarity. Also, when a given layer of material is described as being in a substrate or other layer, the material layer may be in direct contact with the substrate or another layer, and another third layer may be present therebetween. In addition, in the examples below, the materials forming each layer are exemplary, and other materials may be used.

1A to 1D are views illustrating a general laser soldering repair process.

FIG. 1A illustrates a soldering process performed on the substrate W. As shown in FIG. The substrate W is provided with a soldering region, and the soldering region includes a pad 50 to which solder 60 is attached thereto by a soldering process using a laser. That is, the solder 60 may be attached to the pad in the soldering region of the substrate W by this soldering process. Meanwhile, the solder 60 may not be attached to some of the soldering regions of the substrate W even by the soldering process, and the region may be the repair region 65 that requires soldering repair later.

In order to perform a soldering repair process on the repair region 65 of the substrate W, first, as shown in FIG. 1B, a solder ball 61 is provided in the repair region 65 of the substrate W, and then FIG. 1C. As shown in the figure, the solder ball 61 is irradiated with a soldering laser beam L and heated. Accordingly, the solder 60 may be attached to the pad 50 in the repair region 65 of the substrate W as shown in FIG. 1D.

However, in the above process, if the substrate W is transported or stored after the soldering process is performed and before the laser soldering repair process is performed, the repair area 65 of the substrate W may be contaminated with foreign substances. have. As described above, when the soldering repair process using the laser is performed while the material is attached to the repair region 65 of the substrate W, the contaminant acts as a ignition material and burn or explosion phenomenon occurs. It is likely to occur.

2A-2E illustrate a laser soldering repair process in accordance with an exemplary embodiment of the present invention.

Referring to FIG. 2A, the soldering process is performed on the substrate W. Referring to FIG. Here, the substrate W may include, for example, a printed circuit board (PCB). The substrate W is provided with a soldering region, and the soldering region includes a pad 50 to which the solder 60 is attached thereto by a soldering process using a laser. Accordingly, the solder 60 may be attached to the pad 50 of the substrate by the soldering process. Meanwhile, the solder 60 may not be attached to some of the soldering regions of the substrate W even by the soldering process, and this region may be the repair region 65 which requires soldering repair in a subsequent process.

Referring to FIG. 2B, a laser cleaning process is performed on the repair region 65 of the substrate W. Referring to FIG. This laser cleaning process may be performed by defocusing and irradiating the cleaning laser beam L 'onto the repair region 65 of the substrate W. FIG. Here, the cleaning laser beam L 'may have, for example, a wavelength in the near infrared range. As a specific example, the cleaning laser beam L 'may have a wavelength of approximately 915 nm. However, it is not limited thereto.

The cleaning laser beam L 'may have a smaller output than the soldering laser beam L described later. For example, the cleaning laser beam L 'may have an output of approximately 2W, but is not limited thereto. The cleaning laser beam L 'may be defocused and irradiated to the repair region of the substrate W. FIG. For example, the defocusing distance (d2 of FIG. 7D) of the cleaning laser beam L 'may be about 15 mm, but is not limited thereto.

As described above, when the cleaning laser beam L 'having a predetermined wavelength and output is defocused and irradiated to the repair region 65 of the substrate W, foreign substances that may be present in the repair region 65 may be removed. have.

Referring to FIG. 2C, solder balls 61 are provided on the pads 50 in the repair region 65 of the substrate W cleaned by the above-described laser cleaning process. The solder ball 61 may include, for example, a Sn component. Meanwhile, in order to prevent the solder balls 61 melted by being heated by the soldering laser beam L, which will be described later, are oxidized, a flux (not shown) may be further applied on the pad 50. have.

Referring to FIG. 2D, a soldering laser beam L is irradiated to the solder balls 61 provided in the repair region 65 of the substrate W to be heated. The heated solder balls 61 are melted and adhered to the pads 50 in the repair region 65 of the substrate W to form the solder 60. Here, the soldering laser beam L for heating the solder ball 61 may have the same wavelength as the above-described cleaning laser beam L '. Specifically, the soldering laser beam L may have a wavelength in the near infrared range. For example, the cleaning laser beam L 'may have a wavelength of approximately 915 nm, but is not limited thereto.

The soldering laser beam L may have a higher output than the cleaning laser beam L '. For example, when the cleaning laser beam L 'has an output of about 2W, the soldering laser beam L may have an output of about 5W, but is not necessarily limited thereto.

Like the cleaning laser beam L ', the soldering laser beam L may be defocused and irradiated onto the solder ball 61. Here, the defocusing distance (d1 of FIG. 7B) of the soldering laser beam L may be smaller than the defocusing distance (d2 of FIG. 7D) of the cleaning laser beam L ′. For example, when the defocusing distance d2 of the cleaning laser beam L 'is about 15 mm, the defocusing distance d1 of the soldering laser beam ㅣ may be about 4 mm, but is not limited thereto. Do not.

As described above, when the soldering laser beam L having a predetermined wavelength and output is defocused and irradiated to the solder ball 61, the solder ball 61 is melted by heating, and as shown in FIG. 2E, the substrate ( It is deposited on the pad 50 in the repair region 65 of W) to form the solder 60. Meanwhile, referring to FIG. 2E, a water cleaning process may be further performed on the substrate W. FIG. In the water cleaning process, by spraying the washing water onto the substrate W, the flux or the foreign matter remaining on the substrate W can be removed using the washing water.

According to an exemplary embodiment of the present invention, a cleaning process is first performed using a laser on the repair region 65 of the substrate W on which the soldering process has not been performed, and then soldering is performed on the cleaned repair region 65. Done. Accordingly, foreign matters that may be present in the repair region 65 of the substrate W may be effectively removed, and as a result, burn or explosion that may be caused by contamination of the foreign matters may be prevented. . In addition, by performing the cleaning process using a laser, it is possible to reduce the time or cost required for the cleaning process. As described below, since the cleaning laser beam L 'and the soldering laser beam L may be generated from the same laser light source without providing separate cleaning equipment, the laser soldering system may be configured more simply.

FIG. 3A is a photograph showing a contaminant adhered to a pad in the repair region of the substrate, and FIG. 3B is a photograph showing a laser soldering operation in a state where the repair region is contaminated as shown in FIG. 3A. to be. Referring to FIGS. 3A and 3B, it can be seen that a burn phenomenon may occur when a soldering operation using a laser is performed while the repair region of the substrate is contaminated.

FIG. 4A is a photograph of a contaminant attached to a repair region of a substrate, and FIG. 4B is a photograph of a laser soldering operation performed in a contaminated region of a repair region as illustrated in FIG. 4A. Referring to FIGS. 4A and 4B, when the soldering operation using the laser is performed while the repair region of the substrate is contaminated, the soldering process may be incompletely completed.

5A is a photograph showing a state in which contaminants are attached to the repair region of the substrate. 5B is a photograph of a state in which laser cleaning is performed according to an exemplary embodiment of the present invention in the state shown in FIG. 5A. Referring to FIG. 5B, it can be seen that this material has been removed from the repair region of the substrate by a laser cleaning process. FIG. 5C is a photograph of a laser soldering process performed in a state where the repair region of the substrate is cleaned as shown in FIG. 5B. Referring to FIG. 5C, it can be seen that soldering is completely completed in the repair region of the substrate.

Referring to FIG. 6, the laser soldering system according to the present exemplary embodiment performs a soldering process using a soldering laser beam L1 in the soldering region of the substrate W, and the soldering process of the soldering region of the substrate W is performed. A laser soldering repair process is performed on the repair area 65 that is not performed. The laser soldering repair process may include a laser cleaning process of cleaning the repair region 65 of the substrate using the cleaning laser beam L2. The substrate W may include, for example, a printed circuit board, and the substrate W may be mounted on a stage S provided to be movable.

The laser soldering system includes a solder ball supply unit 150 and a laser irradiation apparatus. The solder ball supply unit 150 supplies the solder balls (61 of FIG. 7A) onto a pad (50 of FIG. 7A) positioned in the soldering region of the substrate W loaded on the stage S in the soldering process. Here, the solder ball 61 may include, for example, a Sn component. In addition, the laser soldering system may further include a flux applying unit 160. The flux applying unit 160 may apply a flux (not shown) on the pad 50 before the solder ball supply unit 150 supplies the solder ball 61 on the pad 50. Here, the flux may serve to prevent the solder ball 61 from being oxidized when it is heated and melted by the soldering laser beam L1.

The laser irradiation apparatus is a device which irradiates the soldering laser beam L1 and the cleaning laser beam L2 to the soldering region and the repair region (65 of FIG. 7A) of the substrate W in the soldering process and the laser cleaning process, respectively. To this end, the laser irradiation apparatus may include a laser light source 110, a mirror 120, a focusing lens 140, and a controller 115.

The laser light source 110 emits the first laser beam L1 in the soldering process and emits the second laser beam L2 in the laser cleaning process. Here, the first laser beam L1 may be a soldering laser beam for heating and melting the solder ball 61 provided in the soldering region of the substrate W. FIG. The second laser beam L2 may be a cleaning laser beam used to clean the repair region 65 of the substrate W.

The first and second laser beams L1 and L2 may have the same wavelength. For example, the first and second laser beams L1 and L2 may have wavelengths in the near infrared region. As a specific example, the first and second laser beams L1.L2 may have a wavelength of approximately 915 nm, but are not limited thereto. In addition, the first laser beam L1, which is a soldering laser beam, may have a larger output than the second laser beam L2, which is a cleaning laser beam. For example, the first and second laser beams L1, L2 may have an output of approximately 5W and 2W, respectively, but is not limited thereto.

The traveling path of the first and second laser beams L1 and L2 emitted from the laser light source 110 may be changed to a desired position by the mirror 120. The first and second laser beams L1 and L2 reflected by the mirror 120 are irradiated to the soldering region of the substrate W mounted on the stage S via the focusing lens 140. Here, a beam expanding telescope (BET) 130 for expanding the sizes of the first and second laser beams L1 and L2 may be further provided on the optical path between the mirror 120 and the focusing lens 140. have.

The first and second laser beams L1 and L2 via the focusing lens 140 may be irradiated to the soldering region of the substrate W in a defocused state. Here, the defocusing distance (d1 of FIG. 7B) of the first laser beam L1 which is the soldering laser beam may be smaller than the defocusing distance (d2 of FIG. 7D) of the second laser beam L2 which is the cleaning laser beam. For example, the defocusing distances d1 and d2 of the first and second laser beams L1 and L2 may be about 4 mm and 15 mm, respectively, but are not limited thereto.

The controller 115 controls the laser light source 110 and the mirror 120. In detail, the controller 115 may adjust an output emitted from the laser light source 110, and may also control the movement of the mirror 120.

Meanwhile, the laser soldering system may further include a washing water supply unit 170. The washing water supply unit 170 may perform a water cleaning process of washing the substrate W by supplying the washing water onto the substrate W after the soldering process is completed.

Hereinafter, a process of performing a laser soldering process using the laser soldering system shown in FIG. 6 will be described in detail. 7A to 7H are diagrams for describing a laser soldering process according to another exemplary embodiment of the present invention. The laser soldering process illustrated in FIGS. 7A to 7H may include a first soldering process, a laser cleaning process, and a second soldering process.

First, a first soldering process is performed on the soldering region of the substrate W. Here, the soldering region includes a pad 50 to which the solder 60 formed by melting the solder ball 61 thereon is attached by a soldering process using a laser to be described later.

Specifically, referring to FIG. 7A, the solder balls 61 are supplied to the pads 50 positioned in the soldering regions of the substrate W by using the solder ball supply unit 150 illustrated in FIG. 6. Here, the solder ball 61 may include, for example, a Sn component. Meanwhile, before supplying the solder balls 61, a step of applying flux on the pads 50 may be further included by using the flux applying unit 160 illustrated in FIG. 6. In this case, some of the pads 50 provided in the soldering region of the substrate W may not be supplied with the solder balls 61, which may be repaired in the subsequent process as described later. 65).

Referring to FIG. 7B, the solder 60 is formed by irradiating and heating the first solder beam L1 on the solder ball 61 provided on the pad 50 using the laser irradiation apparatus illustrated in FIG. 6. Here, the first laser beam L1 may be emitted from the laser light source 110 as a soldering laser beam, via the mirror 120, the focusing lens 140, and then irradiated onto the solder ball 61.

The first laser beam L1 may have a wavelength in the near infrared region. For example, the first laser beam L1 may have a wavelength of approximately 915 nm, but is not limited thereto. The first laser beam L1 may have a higher output than the second laser beam L2, which is a cleaning laser beam described later. For example, the first laser beam L1 may have an output of approximately 5W, but is not limited thereto.

The first laser beam L1, which is the soldering laser beam, may be defocused by a predetermined distance d1 after the focusing lens 140 and irradiated onto the solder ball 61. Here, the defocusing distance d1 of the first laser beam L1 may be, for example, about 4 mm, but is not limited thereto.

As such, when the first laser beam L1, which is a soldering laser beam, is irradiated onto the solder balls 61 using the laser irradiation apparatus, the solder balls 61 are melted and adhered to the pad 50, thereby soldering the solder 60. Form. The first soldering process is completed by irradiating the solder balls 61 on the pads 50 while moving the first laser beam L1 with respect to the substrate W. FIG.

FIG. 7C illustrates a state in which the first soldering process is completed in the soldering region of the substrate W. As shown in FIG. Referring to FIG. 7C, some of the soldering regions of the substrate W may be the repair regions 65 requiring the soldering repair process because the first soldering process is not performed.

After the first soldering process is performed, a laser cleaning process may be performed.

Specifically, referring to FIG. 7D, the repair area 65 is cleaned by irradiating the pad 50 in the repair area 65 with the second laser beam L2 using the laser irradiation device shown in FIG. 6. . Here, the second laser beam L2 may be emitted from the laser light source 110 as a cleaning laser beam, and may be irradiated to the repair area 65 after passing through the mirror 120, the focusing lens 140, or the like.

The second laser beam L2, which is a cleaning laser beam, may have the same wavelength as the first laser beam L1. The second laser beam L2 may have a wavelength in the near infrared region. For example, the second laser beam L2 may have a wavelength of approximately 915 nm, but is not limited thereto. The second laser beam L2 may have a lower output than the first laser beam L1, which is a soldering laser beam. For example, when the output of the first laser beam L1 is 5W, the output of the second laser beam L2 may be about 2W, but is not limited thereto.

The second laser beam L2, which is a cleaning laser beam, may be defocused for a predetermined distance d2 via the focusing lens 140, and then irradiated to the repair area 65. Here, the defocusing distance d2 of the second laser beam L2 may be greater than the defocusing distance d1 of the first laser beam L1 described above. For example, when the defocusing distance d1 of the first laser beam L1 is about 4 mm, the defocusing distance d2 of the second laser beam L2 may be about 15 mm. However, the present invention is not limited thereto, and the defocusing distances d1 and d2 of the first and second laser beams L1 and L2 may be variously modified.

As described above, when the second laser beam L2, which is a cleaning laser beam, is irradiated to the pad 50 in the repair region 65 of the substrate W by using the laser irradiation device, the foreign matter attached to the pad 50, and the like. This can be removed. The laser cleaning process is completed by irradiating the pads 50 in the repair region 65 while moving the second laser beam L with respect to the substrate W. FIG.

After the above-described laser cleaning process is completed, a second soldering process is performed on the cleaned repair region 65 of the substrate W. FIG.

Specifically, referring to FIG. 7E, the solder balls 61 are supplied to the pads 50 positioned in the repair region 65 of the substrate W using the solder ball supply unit 150 illustrated in FIG. 6. do. Meanwhile, before supplying the solder balls 61, the method may further include applying flux (not shown) on the pads 50 using the flux applying unit 160 illustrated in FIG. 6.

Referring to FIG. 7F, the first laser beam L1 is irradiated to the solder ball 61 provided on the pad 50 of the repair region 65 and heated by using the laser irradiation apparatus illustrated in FIG. 6. 60). Here, the first laser beam L1 may be a soldering laser beam. The first laser beam L1 may have the same wavelength as the second laser beam L2 as described above. It may have a wavelength in the near infrared region. The first laser beam L1 may have a higher output than the second laser beam L2, which is a cleaning laser beam.

In addition, the first laser beam L1, which is a soldering laser beam, is defocused by a predetermined distance d1 after passing through the focusing lens 140 to irradiate the solder ball 61 on the pad 50 of the repair region 65. Can be. Here, the defocusing distance d1 of the first laser beam L1 may be smaller than the defocusing distance d2 of the second laser beam L2 as described above.

As such, when the first laser beam L1, which is a soldering laser beam, is irradiated to the solder balls 61 on the pads 50 of the repair region 65 using the laser irradiation apparatus, the solder balls 61 are melted to form a pad. By attaching on the 50, the solder 60 is formed. The second soldering process is completed by irradiating the solder balls 61 on the pads 50 of the repair region 65 while moving the first laser beam L1 with respect to the substrate W. FIG. Through the second soldering process, the solder 60 may be provided on all the pads 50 in the soldering region of the substrate W. FIG.

After the above-described second soldering process is completed, foreign matter such as flux may remain on the substrate W, and thus, a water cleaning process of washing the substrate W with washing water may be further performed to remove such foreign matter. .

Specifically, referring to FIG. 7G, when the washing water is sprayed onto the substrate W on which the soldering process is completed through the washing water supply unit 170 illustrated in FIG. 6, foreign substances such as flux remaining on the substrate W may be applied. It can be removed, and this water cleaning process is completed is shown in Figure 7h.

According to the embodiments of the present invention described above, the cleaning process is first performed using a laser on the repair region of the substrate on which the soldering process is not performed, and then the soldering operation is performed on the cleaned repair region. Accordingly, foreign matters that may be present in the repair region of the substrate may be effectively removed, and as a result, burn or explosion that may be caused by contamination of the foreign matters may be prevented. In addition, by performing the cleaning process using a laser, it is possible to reduce the time or cost required for the cleaning process. As described below, since the cleaning laser beam and the soldering laser beam can be generated from the same laser light source without providing separate cleaning equipment, the laser soldering system can be configured more simply.

Although embodiments of the present invention have been described above, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom.

Claims

In the laser soldering repair process of performing a repair process by using a laser in the repair region of the soldering region on the substrate is not performed,

Irradiating a cleaning laser beam to the repair region of the substrate to perform a laser cleaning process;

Providing a solder ball in the cleaned repair region of the substrate; And

And soldering the solder ball to the repair area by irradiating a soldering laser beam on the solder ball.
The method of claim 1,

And performing a laser cleaning process on the repair region of the substrate, and then applying flux.
The method of claim 1,

Attaching the solder ball to the repair region using the soldering laser beam, and then performing a water cleaning process on the substrate.
The method of claim 1,

And the cleaning laser beam and the soldering laser beam have the same wavelength.
The method of claim 4, wherein

And the cleaning laser beam and the soldering laser beam have a wavelength in the near infrared range.
The method of claim 5, wherein

And the cleaning laser beam and the soldering laser beam have a wavelength of 915 nm.
The method of claim 1,

And said cleaning laser beam has a smaller output than said soldering laser beam.
The method of claim 7, wherein

And the cleaning laser beam and the soldering laser beam have outputs of 2W and 5W, respectively.
The method of claim 1,

And the cleaning laser beam and the soldering laser beam are defocused and irradiated to the repair region.
Performing a first soldering process on the soldering region on the substrate:

Performing a laser cleaning process on a repair region in which the soldering process is not performed among the soldering regions on the substrate; And

And performing a second soldering process on the cleaned repair region of the substrate.
The method of claim 10,

The first soldering process may include providing solder balls in a soldering region on the substrate; And attaching the solder ball to the soldering area by irradiating and heating a soldering laser beam on the solder ball.
The method of claim 11,

The laser cleaning process is performed by irradiating a cleaning laser beam to the repair region of the substrate.
The method of claim 12,

The second soldering process may include providing solder balls in the cleaned repair region on the substrate; And attaching the solder ball to the repair area by irradiating and heating a soldering laser beam on the solder ball.
The method of claim 13,

And performing a water cleaning process on the substrate after the second soldering process.
The method of claim 13,

And the cleaning laser beam and the soldering laser beam have the same wavelength.
The method of claim 13,

And the cleaning laser beam has a smaller output than the soldering laser beam.
The method of claim 13,

And the cleaning laser beam and the soldering laser beam are defocused and irradiated.
In the laser soldering system performing a soldering process using a soldering laser beam in the soldering region of the substrate, and performing a laser soldering repair process in the repair region of the soldering region of the substrate is not performed.

A solder ball supply unit providing solder balls to solder areas of the substrate; And

And a laser irradiation device for irradiating the soldering laser beam to the solder ball and irradiating the cleaning laser beam to the repair region of the substrate.
The method of claim 18,

And a flux applying unit to apply flux to the soldering region of the substrate.
The method of claim 18,

And a cleaning water supply unit supplying the cleaning water to the substrate to perform a water cleaning process.