TW201729928A - Laser soldering repair process, laser soldering process and laser soldering system - Google Patents

Abstract

A laser soldering repairing process, a laser soldering process, and a laser soldering system are provided. The laser soldering repairing process is performed by using laser in a repair area not having undergone a soldering process from among a soldering region on a substrate. The laser soldering repairing process includes the operation of performing a laser cleaning process by radiating a cleaning laser beam to the repair area of the substrate, the operation of providing solder balls on a cleaned repair area of the substrate, and heating the solder balls with a soldering laser beam and attaching the solder balls to the repair area.

Description

Laser welding repair process, laser welding process and laser welding system

This invention relates to a laser welding process and, in particular, to a laser welding repair process, a laser welding process therewith and a laser welding system.

Generally, in a semiconductor process, a process of bonding a semiconductor wafer using a solder on a substrate such as a printed circuit board (PCB) is performed. Such a process may include a soldering process in which the solder ball is attached to the substrate by heating the solder ball at a high temperature after printing a solder ball including a tin component at a specific position of the substrate. Such a soldering process is commonly referred to as a reflow soldering process, which is widely used in all industries. Previously, welding devices using heat have been used, but such devices have problems of large size and required welding time. Therefore, as a solution to the above problem, a welding device using a laser has recently been developed. The laser welding device can be used to condense the laser beam to a narrow area of the substrate to melt the smaller size solder balls, and the process can be performed with less than the output using heat. In addition, the high energy of the laser beam can be used to melt the solder balls in a short time.

After the laser is used for the soldering process, a soldering process may not be performed on a part of the substrate. Therefore, in order to solve the above problem, it is necessary to perform a laser solder repair process, that is, after printing a solder ball in an area of the substrate to be repaired, the process of the soldering process is performed again by using a laser. However, since the laser welding process and the laser welding process are separately performed, when the substrate is transported or stored after the first laser welding process is performed, there is a possibility that the contaminant adheres to the surface of the substrate. Therefore, if the laser welding repair process is performed in a state in which a contaminant is adhered to the substrate, there is a possibility that a contaminant acts as a combustible substance to cause a burn or explosion phenomenon when the laser beam is emitted. Sex. In order to solve the contamination problem of such a substrate, the pollutants can be removed by ultrasonic cleaning before performing the laser welding repair process, but this will increase the new process, so there is a problem that the time or cost increases. .

[Question to be solved by the invention]

In accordance with an embodiment of the present invention, a laser welding repair process, a laser welding process including the same, and a laser welding system are provided.

[Means for solving the problem]

In one aspect of the present invention, a laser solder repair process is provided for performing a repair process by using a laser for a repair region in a soldering region on a substrate that is not subjected to a soldering process, the laser solder repair process The method includes the following steps: a step of performing a laser cleaning process by irradiating a repairing region of the substrate with a cleaning laser beam; a step of providing a solder ball in the cleaned repairing region of the substrate; and irradiating the solder ball with the solder ball The laser beam is used to heat the solder ball to adhere the solder ball to the repairing region.

After the laser cleaning process is performed on the repaired region of the substrate, a step of applying a flux may be included. In addition, after the solder ball is attached to the repairing region by using the solder beam, the step of performing a water washing process on the substrate may be further included.

The cleaning laser beam and the welding laser beam described above may have the same wavelength. For example, the cleaning laser beam and the welding laser beam described above may have wavelengths in the near infrared range. As a specific example, the cleaning laser beam and the welding laser beam described above may have a wavelength of 915 nm.

The cleaning laser beam described above may have an output that is less than the welding beam described above. For example, the cleaning laser beam and the welding laser beam described above may have outputs of 2 W and 5 W, respectively.

The cleaning laser beam and the welding laser beam may be defocused and irradiated to the repairing area.

In another aspect, a laser soldering process is provided, comprising the steps of: performing a first soldering process on a soldering region on a substrate; performing a lightning on a repairing region in a soldering region on the substrate that is not performing a soldering process a step of injecting a cleaning process; and performing a second soldering process on the cleaned repair region of the substrate.

The first soldering process may include the steps of: providing a solder ball on a soldering region on the substrate; and heating the solder ball to the solder ball to heat the solder ball, thereby attaching the solder ball to the soldering region .

The laser cleaning process described above can be performed by irradiating the repaired area of the substrate with a cleaning laser beam.

The second soldering process may include the steps of: providing a solder ball on the cleaned repaired area on the substrate; and heating the solder ball by irradiating the soldering beam, thereby attaching the solder ball to the repairing The steps of the area.

After the second soldering process, the step of performing a water washing process on the substrate may be further included.

The cleaning laser beam and the welding laser beam described above may have the same wavelength. The cleaning laser beam described above may have an output that is less than the welding beam described above. The cleaning laser beam and the welding laser beam may be defocused and irradiated.

In another aspect, a laser welding system is provided, wherein a welding process is performed on a soldering region of a substrate by using a welding laser beam, and a laser is performed on a repairing region in the soldering region of the substrate that is not subjected to the soldering process. a solder repairing process, the laser soldering system comprising: a solder ball supply unit that supplies solder balls to a soldering area of the substrate; and a laser irradiation device that irradiates the solder beam to the solder ball and the cleaning laser The beam is irradiated to the repaired area of the above substrate.

The above laser welding system may further include a flux coating unit that applies a flux to a soldering region of the above substrate. Further, the above-described laser welding system may further include a washing water supply unit that supplies washing water to the substrate to perform a water washing process.

[Effect of the invention]

According to an embodiment of the present invention, a cleaning process is first performed on a repaired region of a substrate on which a soldering process is not performed using a laser, and then a soldering operation is performed on the cleaned repaired region. Thereby, foreign matter or the like which may exist in the repairing region of the substrate can be effectively removed, and as a result, a burn phenomenon or an explosion phenomenon due to contamination of foreign matter can be prevented. Moreover, by performing a cleaning process using a laser, the time or cost required for the cleaning process can be reduced. In addition, the cleaning laser beam and the welding laser beam can be generated by the same laser light source without providing an additional cleaning device, so that the laser welding system can be constructed more simply.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The examples exemplified below are not intended to limit the scope of the invention, but are provided to illustrate the invention to those skilled in the art. In the drawings, the same reference numerals are given to the same components, and the size or thickness of each component can be exaggerated for clarity of description. Further, when it is described that a specific substance layer exists on a substrate or another layer, the substance layer may exist in direct contact with the substrate or other layers, or may exist between the substance layer and the substrate or other layers. Three floors. Further, in the following examples, the substances constituting each layer are merely examples, and other materials may be used.

1A to 1D are views showing a general laser welding repairing process.

In Fig. 1A, there is shown a case where a soldering process has been performed on the substrate W. A soldering region is provided on the substrate W. The soldering region includes a bonding pad 50 to which a solder 60 is attached by a laser soldering process. That is, the solder 60 can be attached to the pad 50 located in the soldering region of the substrate W by the soldering process described above. On the other hand, there is a case where the solder 60 cannot be attached to a part of the soldering region of the substrate W by the soldering process, and such a region becomes a repair region 65 to be subjected to solder repair later.

In order to perform the solder repair process on the repair region 65 of the substrate W, first, as shown in FIG. 1B, the solder ball 61 is disposed on the repair region 65 of the substrate W, and then the solder ball L is irradiated to the solder ball 61 as shown in FIG. 1C. Heat up. Thereby, as shown in FIG. 1D, the solder 60 is attached to the pad 50 located on the repair region 65 of the substrate W.

However, in the above-described manufacturing process, when the substrate W is transported or stored before the laser soldering repair process is performed after the soldering process is performed, there is a possibility that the repaired region 65 of the substrate W is contaminated by foreign matter. As described above, when the welding repair process using the laser is performed in a state in which the foreign matter adheres to the repair region 65 of the substrate W, the contaminated substance acts as a combustible substance to cause a burn phenomenon or an explosion phenomenon. The possibility.

2A through 2E are views showing a laser welding repair process of an exemplary embodiment of the present invention.

Referring to Fig. 2A, there is shown a case where a soldering process has been performed on the substrate W. Here, the substrate W may include, for example, a printed circuit board (PCB) or the like. A soldering region is provided on the substrate W. The soldering region includes a bonding pad 50 to which the solder 60 is attached by the soldering process using a laser. Thereby, the solder 60 can be attached to the pad 50 of the substrate by a soldering process. On the other hand, the solder 60 may not be attached to a part of the soldering region of the substrate W by the soldering process, and such a region may become a repair region 65 to be repaired by soldering in a subsequent process.

Referring to FIG. 2B, a laser cleaning process is performed on the repair region 65 of the substrate W. Such a laser cleaning process can be performed by defocusing the cleaning laser beam L' to the repairing region 65 of the substrate W. Here, the cleaning laser beam L' may have, for example, a wavelength in the near infrared range. As a specific example, the cleaning laser beam and the welding laser beam may have a wavelength of approximately 915 nm. However, it is not limited to this.

Additionally, the cleaning laser beam L' may have an output that is less than the welding laser beam L to be described later. For example, the cleaning laser beam L' may have an output of approximately 2 W, but is not limited thereto. Such a cleaning laser beam L' can be defocused and irradiated to the repaired area of the substrate W. For example, the defocus distance (d2 of FIG. 7D) of the cleaning laser beam L' may be approximately 15 mm, but is not limited thereto.

As described above, when the cleaning laser beam L' having a specific wavelength and output is defocused and irradiated to the repairing region 65 of the substrate W, foreign matter or the like which may exist in the repairing region 65 can be removed.

Referring to Fig. 2C, a solder ball 61 is provided on the pad 50 of the repair region 65 of the substrate W which is cleaned by the above-described laser cleaning process. Such a solder ball 61 may include, for example, a Sn component. On the other hand, in order to prevent oxidation of the solder ball 61 which is melted by heating the welding laser beam L which will be described later, a step of applying a flux (not shown) on the pad 50 may be further performed.

Referring to Fig. 2D, the solder ball 61 provided in the repair region 65 of the substrate W is irradiated with the welding laser beam L to be heated. The solder ball 61 heated in this manner is melted and adhered to the pad 50 of the repair region 65 of the substrate W, thereby forming the solder 60. Here, the welding laser beam L for heating the solder balls 61 may have the same wavelength as the above-described cleaning laser beam L'. In particular, the welding laser beam L can have a wavelength in the near infrared range. For example, the cleaning laser beam L' may have a wavelength of approximately 915 nm, but is not limited thereto.

The welding laser beam L may have an output higher than the cleaning laser beam L'. For example, in the case where the cleaning laser beam L' has an output of approximately 2 W, the welding laser beam L may have an output of approximately 5 W, but is not necessarily limited thereto.

The welding laser beam L can be defocused and irradiated to the solder ball 61 in the same manner as the cleaning laser beam L'. Here, the defocus distance of the welding laser beam L (d1 of FIG. 7B) may be smaller than the defocusing distance of the cleaning laser beam L' (d2 of FIG. 7D). For example, when the defocusing distance d2 of the cleaning laser beam L' is approximately 15 mm, the defocusing distance d1 of the welding laser beam L may be approximately 4 mm, but is not limited thereto.

As described above, when the welding laser beam L having a specific wavelength and output is defocused and irradiated to the solder ball 61, the solder ball 61 is melted by heating, and is attached to the repairing region of the substrate W as shown in FIG. 2e. Solder 60 is formed on pad 50 of 65. On the other hand, referring to FIG. 2e, the water washing process can be further performed on the substrate W. In the water washing process, the washing water is sprayed onto the substrate W, whereby the flux or the foreign matter remaining on the substrate W can be removed by the washing water.

According to an exemplary embodiment of the present invention, a cleaning process is first performed on the repair region 65 of the substrate W on which the soldering process is not performed using a laser, and then the soldered repair region 65 is subjected to a soldering operation. Thereby, foreign matter or the like which may exist in the repair region 65 of the substrate W can be effectively removed, and as a result, a burn phenomenon or an explosion phenomenon due to contamination of foreign matter can be prevented. Moreover, by performing a cleaning process using a laser, the time or cost required for the cleaning process can be reduced. Further, as described below, the cleaning laser beam L' and the welding laser beam L can be generated by the same laser light source without providing another cleaning device, so that the laser welding system can be constructed more simply.

3A is a photograph obtained by attaching a state in which a contaminant is adhered to a pad located in a repair area of a substrate, and FIG. 3B is a case where a laser welding process is performed in a state where the repaired area is contaminated as shown in FIG. 3A. photo. 3A and 3B, when a welding operation using a laser is performed in a state where the repaired area of the substrate is contaminated, a burn phenomenon occurs.

4A is a photograph obtained in a state in which a contaminated substance is attached to a repaired region of a substrate, and FIG. 4B is a photograph obtained by performing a laser welding operation in a state where the repaired area is contaminated as shown in FIG. 4A. 4A and 4B, if the welding operation using the laser is performed in a state where the repaired area of the substrate is contaminated, the welding process is completed incompletely.

FIG. 5A is a photograph obtained in a state in which a contaminated substance is attached to a repaired region of a substrate. FIG. In addition, FIG. 5B is a photograph taken in a state in which laser cleaning is performed in accordance with an exemplary embodiment of the present invention in the state shown in FIG. 5A. Referring to FIG. 5B, the foreign matter in the repaired area of the substrate has been removed by the laser cleaning process. Fig. 5C is a photograph obtained by performing a laser welding process in a state where the repaired area of the substrate is cleaned as shown in Fig. 5B. Referring to Fig. 5C, the repair of the repaired area of the substrate has been completed completely.

Figure 6 is a perspective view of a laser welding system in accordance with another exemplary embodiment of the present invention.

Referring to FIG. 6, the laser welding system of the present embodiment performs a soldering process on the soldering region of the substrate W by using the soldering laser beam L1, and performs laser processing on the repairing region 65 in which the soldering process is not performed in the soldering region of the substrate W. Welding repair process. Here, the laser solder repair process may include a laser cleaning process for cleaning the repair region 65 of the substrate W by cleaning the laser beam L2. The substrate W may include, for example, a printed circuit board or the like, which may be stacked to a platform S that is movably disposed.

The laser welding system includes a solder ball supply unit 150 and a laser irradiation device. The solder ball supply unit 150 supplies the solder balls (61 of FIG. 7A) to the pads (50 of FIG. 7A) of the solder regions of the substrate W stacked on the stage S in the soldering process. Here, the solder ball 61 may include, for example, a Sn component. Also, the laser welding system may further include a flux coating unit 160. The flux application unit 160 may apply a flux (not shown) to the pad 50 in advance before the solder ball supply unit 150 supplies the solder balls 61 to the pad 50. Here, the flux acts to prevent oxidation of the solder ball 61 when it is melted by heating by the welding laser beam L1.

The laser irradiation device is a device that irradiates the welding laser beam L1 and the cleaning laser beam L2 to the welding region of the substrate W and the repairing region (65 of FIG. 7A) in the welding process and the laser cleaning process, respectively. To this end, the laser irradiation device may include a laser light source 110, a mirror surface 120, a focus lens 140, and a control portion 115.

The laser source 110 emits the first laser beam L1 in the welding process and the second laser beam L2 in the laser cleaning process. Here, the first laser beam L1 may be a welding laser beam for heating the solder ball 61 provided in the soldering region of the substrate W to melt the solder ball 61. In addition, the second laser beam L2 may be a cleaning laser beam for cleaning the repair region 65 of the substrate W.

The first laser beam L1 and the second laser beam L2 may have the same wavelength. For example, the first laser beam L1 and the second laser beam L2 may have wavelengths in the near-infrared region. As a specific example, the first laser beam L1 and the second laser beam L2 may have a wavelength of approximately 915 nm, but are not limited thereto. Also, the first laser beam L1 as the welding laser beam may have an output larger than the second laser beam L2 as the cleaning laser beam. For example, the first laser beam L1 and the second laser beam L2 may each have an output of approximately 5 W and 2 W. However, it is not limited to this.

The travel paths of the first laser beam L1 and the second laser beam L2 emitted from the laser light source 110 can be changed to a desired position by the mirror 120. Further, the first laser beam L1 and the second laser beam L2 reflected by the mirror surface 120 are irradiated to the welding region of the substrate W stacked on the stage S via the focus lens 140. Here, a beam expander (Beam Expanding Telescope, BET) 130 that enlarges the sizes of the first laser beam L1 and the second laser beam L2 may be further disposed on the optical path between the mirror 120 and the focus lens 140.

The first laser beam L1 and the second laser beam L2 via the focus lens 140 can be irradiated to the soldering region of the substrate W in a defocused state. Here, the defocus distance (d1 of FIG. 7B) as the first laser beam L1 of the welding laser beam may be smaller than the defocus distance of the second laser beam L2 as the cleaning laser beam (d2 of FIG. 7D). For example, the defocus distance d1 of the first laser beam L1 and the defocus distance d2 of the second laser beam L2 may be about 4 mm and 15 mm, respectively, but are not limited thereto.

The control unit 115 functions to control the laser light source 110 and the mirror surface 120. Specifically, the control unit 115 can adjust the output or the like released from the laser light source 110, and can also function to control the movement of the mirror surface 120.

On the other hand, the laser welding system may further include a washing water supply unit 170. The washing water supply unit 170 supplies the washing water to the substrate W after the completion of the welding process, whereby the water washing process for cleaning the substrate W can be performed.

Hereinafter, a process of performing a laser welding process using the laser welding system shown in FIG. 6 will be described in detail. 7A through 7H are views for explaining a laser welding process of an exemplary embodiment of the present invention. The laser welding process shown in FIGS. 7A to 7H may include a first welding process, a laser cleaning process, and a second welding process.

First, a first soldering process is performed on the soldering region of the substrate W. Here, the soldering region includes the bonding pad 50, and the solder 60 formed by melting the solder ball 61 on the bonding pad 50 by a soldering process to be described later.

Specifically, referring to FIG. 7A, the solder ball 61 is supplied to the pad 50 located in the soldering region of the substrate W by the solder ball supply unit 150 shown in FIG. 6. Here, the solder ball 61 may include, for example, a Sn component. On the other hand, before the supply of such a solder ball 61, the step of applying a flux on the pad 50 by the flux application unit 160 shown in FIG. 6 may be further included. In this case, the solder ball 61 is not supplied to a part of the pad 50 provided in the soldering region of the substrate W, and the above portion becomes a repair region 65 to be repaired in a subsequent process as described below.

Referring to Fig. 7B, the first laser beam L1 is irradiated onto the solder ball 61 provided on the pad 50 by the laser irradiation device shown in Fig. 6 to be heated, whereby the solder 60 is formed. Here, the first laser beam L1 may be emitted from the laser light source 110 as a welding laser beam, and then irradiated to the solder ball 61 via the mirror 120, the focus lens 140, and the like.

The first laser beam L1 may have a wavelength of a near-infrared region. For example, the first laser beam L1 may have a wavelength of approximately 915 nm, but is not limited thereto. Additionally, such first laser beam L1 may have an output that is higher than the second laser beam L2 that will be described below as a cleaning laser beam. For example, the first laser beam L1 may have an output of approximately 5 W, but is not limited thereto.

Such a first laser beam L1 as a welding laser beam may be irradiated to the solder ball 61 after being defocused by a specific distance d1 after passing through the focus lens 140. Here, the defocus distance d1 of the first laser beam L1 can be, for example, approximately 4 mm, but is not limited thereto.

As described above, when the first laser beam L1 as the welding laser beam is irradiated to the solder ball 61 by the laser irradiation device, the solder ball 61 is melted and adheres to the pad 50, whereby the solder 60 is formed. The first laser beam is irradiated to the solder ball 61 on the pad 50 while the first laser beam L1 is moved relative to the substrate W, thereby completing the first soldering process.

In Fig. 7C, a state in which the first welding process is completed for the welding region of the substrate W is shown. Referring to FIG. 7C, the first soldering process is not performed on a portion of the soldering region of the substrate W, so that the above portion becomes the repairing region 65 where the soldering repair process is to be performed.

The laser cleaning process can be performed after the first welding process is performed.

Specifically, referring to FIG. 7D, the second laser beam L2 is irradiated to the pad 50 located in the repairing region 65 by the laser irradiation device shown in FIG. 6, thereby cleaning the repaired region 65. Here, the second laser beam L2 may be emitted from the laser light source 110 as a cleaning laser beam, and then irradiated to the repair region 65 via the mirror 120, the focus lens 140, and the like.

The second laser beam L2 as the cleaning laser beam may have the same wavelength as the first laser beam L1. The second laser beam L2 may have a wavelength of a near-infrared region. For example, the second laser beam L2 may have a wavelength of approximately 915 nm, but is not limited thereto. The second laser beam L2 may have an output lower than the first laser beam L1 as a welding laser beam. For example, when the output of the first laser beam L1 is 5 W, the output of the second laser beam L2 may be approximately 2 W, but is not limited thereto.

The second laser beam L2 as the cleaning laser beam may be irradiated to the repairing region 65 after being defocused by a specific distance d2 after passing through the focusing lens 140. Here, the defocus distance d2 of the second laser beam L2 may be greater than the defocus distance d1 of the first laser beam L1 described above. For example, when the defocus distance d1 of the first laser beam L1 is approximately 4 mm, the defocus distance d2 of the second laser beam L2 may be approximately 15 mm. However, it is not limited thereto, and various kinds of deformations can be realized by the defocus distance d1 of the first laser beam L1 and the defocus distance d2 of the second laser beam L2.

As described above, when the second laser beam L2 as the cleaning laser beam is irradiated to the pad 50 located in the repair region 65 of the substrate W by the laser irradiation device, foreign matter adhering to the pad 50 and the like can be removed. The second laser beam L is moved relative to the substrate W, and the second laser beam L2 is irradiated to the pad 50 located in the repairing region 65, thereby completing the laser cleaning process.

After the above laser cleaning process is completed, a second soldering process is performed on the cleaned repair region 65 of the substrate W.

Specifically, referring to FIG. 7E, the solder ball 61 is supplied to the pad 50 located in the repair region 65 of the substrate W by the solder ball supply unit 150 shown in FIG. On the other hand, before the supply of such a solder ball 61, a step of applying a flux (not shown) to the pad 50 by the flux application unit 160 shown in FIG. 6 may be further included.

Referring to Fig. 7F, the first laser beam L1 is irradiated onto the solder balls 61 provided on the pad 50 of the repair region 65 by the laser irradiation device shown in Fig. 6 to be heated, whereby the solder 60 is formed. Here, the first laser beam L1 may be a welding laser beam. As described above, such first laser beam L1 may have the same wavelength as the second laser beam L2, for example, may have a wavelength of a near-infrared region. In addition, the first laser beam L1 may have an output higher than the second laser beam L2 as the cleaning laser beam.

Further, the first laser beam L1 as the welding laser beam may be irradiated to the solder ball 61 on the pad 50 of the repairing region 65 after being defocused by a specific distance d1 via the focusing lens 140. Here, as described above, the defocus distance d1 of the first laser beam L1 may be smaller than the defocus distance d2 of the second laser beam L2.

As described above, if the first laser beam L1 as the welding laser beam is irradiated to the solder ball 61 located on the pad 50 of the repairing region 65 by the laser irradiation device, the solder ball 61 is melted and adhered to the pad 50. Thereby, the solder 60 is formed. Further, while the first laser beam L1 is moved relative to the substrate W, the first laser beam is irradiated onto the solder balls 61 on the pad 50 of the repairing region 65, thereby completing the second soldering process. By this second soldering process, the solder 60 can be placed on all of the pads 50 located in the soldering regions of the substrate W.

After the second soldering process is completed, foreign matter such as a flux remains on the substrate W. Therefore, in order to remove such foreign matter, a water washing process of washing the substrate W with washing water can be further performed.

Specifically, referring to FIG. 7G, when the washing water supply unit 170 shown in FIG. 6 ejects the washing water to the substrate W that has completed the welding process, foreign matter such as flux remaining on the substrate W can be removed. A case in which such a water washing process is completed is shown in Fig. 7H.

According to the embodiment of the present invention described above, the cleaning process is first performed on the repaired area of the substrate on which the soldering process is not performed by using the laser, and then the soldering operation is performed on the cleaned repaired area. Thereby, foreign matter or the like which may exist in the repairing region of the substrate can be effectively removed, and as a result, a burn phenomenon or an explosion phenomenon due to contamination of foreign matter can be prevented. Moreover, by performing a cleaning process using a laser, the time or cost required for the cleaning process can be reduced. Further, as described below, the cleaning laser beam and the welding laser beam can be generated by the same laser light source without providing another cleaning device, so that the laser welding system can be constructed more simply.

The embodiments of the present invention have been described above, but the above-described embodiments are merely examples, and those skilled in the art should understand that various modifications and other equivalent embodiments can be implemented in accordance with the embodiments described above.

50‧‧‧ solder pads
60‧‧‧ solder
61‧‧‧ solder balls
65‧‧‧Repair area
110‧‧‧Laser light source
115‧‧‧Control Department
120‧‧‧Mirror
130‧‧‧beam expander
140‧‧‧focus lens
150‧‧‧Ball supply unit
160‧‧‧flux coating unit
170‧‧‧Washing water supply unit
D1, d2‧‧‧ distance
L, L', L1, L2‧‧‧ laser beam
S‧‧‧ platform
W‧‧‧Substrate

1A to 1D are views showing a general laser welding repairing process. 2A through 2E are views showing a laser welding repair process of an exemplary embodiment of the present invention. 3A is a photograph of a state in which a contaminant is attached to a repair area of a substrate, and FIG. 3B is a case where a burn phenomenon is generated by performing a laser welding process in the state shown in FIG. 3A. The resulting photo. 4A is a photograph obtained in a state in which a contaminated substance is attached to a repair area of a substrate, and FIG. 4B is a photograph obtained by photographing a case where welding is not completely performed by performing a laser welding process in the state shown in FIG. 4A. FIG. 5A is a photograph obtained in a state in which a contaminated substance is attached to a repaired region of a substrate. FIG. Fig. 5B is a view showing a state in which the contaminant is removed from the repaired region of the substrate by laser cleaning in accordance with an exemplary embodiment of the present invention in the state shown in Fig. 5A. Fig. 5C is a photograph obtained by photographing a case where the welding is completely performed by performing the laser welding process in the state shown in Fig. 5B. Fig. 6 is a view showing a laser welding system according to another exemplary embodiment of the present invention. 7A to 7H are views for explaining a process of performing a laser welding process using the laser welding system shown in Fig. 6.

110‧‧‧Laser light source

115‧‧‧Control Department

120‧‧‧Mirror

130‧‧‧beam expander

140‧‧‧focus lens

150‧‧‧Ball supply unit

160‧‧‧flux coating unit

170‧‧‧Washing water supply unit

S‧‧‧ platform

W‧‧‧Substrate

L1‧‧‧first laser beam

L2‧‧‧second laser beam

Claims (20)

A laser solder repair process for performing a repair process by using a laser for a repair region in a soldering region on a substrate that is not subjected to a soldering process, the laser solder repair process including: Performing a laser cleaning process by irradiating the cleaning laser beam with the repairing area; providing a solder ball on the cleaned repairing area of the substrate; and irradiating the soldering beam with the welding laser beam, thereby performing the soldering ball The solder balls are attached to the repair area by heating. The laser soldering repair process of claim 1, wherein after the laser cleaning process is performed on the repaired area of the substrate, the flux is further coated. The laser soldering repair process of claim 1, wherein after attaching the solder ball to the repairing area by using the soldering laser beam, the method further comprises performing a water washing process on the substrate. The laser welding repair process of claim 1, wherein the cleaning laser beam and the welding laser beam have the same wavelength. The laser welding repair process of claim 4, wherein the cleaning laser beam and the welding laser beam have wavelengths in the near infrared range. The laser welding repair process of claim 5, wherein the cleaning laser beam and the welding laser beam have a wavelength of 915 nm. The laser welding repair process of claim 1, wherein the cleaning laser beam has an output that is smaller than the welding laser beam. The laser welding repair process of claim 7, wherein the cleaning laser beam and the welding laser beam respectively have an output of 2 W and 5 W. The laser welding repair process of claim 1, wherein the cleaning laser beam and the welding laser beam are defocused and irradiated to the repairing area. A laser soldering process, comprising: performing a first soldering process on a soldering region on a substrate; performing a laser cleaning process on a repairing region in the soldering region on the substrate that is not performing a soldering process; and The repaired area of the cleaning performs a second welding process. The laser welding process of claim 10, wherein the first soldering process comprises: providing a solder ball on the soldering area on the substrate; and irradiating the soldering beam with the soldering beam Heating is performed whereby the solder balls are attached to the soldering region. The laser welding process of claim 11, wherein the laser cleaning process is performed by irradiating the repaired area of the substrate with a cleaning laser beam. The laser welding process of claim 12, wherein the second soldering process comprises: providing a solder ball on the cleaned repair area on the substrate; and irradiating the solder ball with a solder mine The beam is heated to adhere the solder ball to the repair area. The laser soldering process of claim 13, wherein after the second soldering process, the step of performing a water washing process on the substrate is further included. The laser welding process of claim 13, wherein the cleaning laser beam and the welding laser beam have the same wavelength. The laser welding process of claim 13, wherein the cleaning laser beam has an output that is smaller than the welding laser beam. The laser welding process of claim 13, wherein the cleaning laser beam and the welding laser beam are defocused and irradiated. A laser welding system for performing a welding process on a soldering region of a substrate by using a welding laser beam, and performing a laser welding repairing process on a repairing region in the soldering region of the substrate in which the soldering process is not performed, The laser welding system includes: a solder ball supply unit that supplies solder balls to the soldering region of the substrate; and a laser irradiation device that irradiates the solder laser beam to the solder ball and that will clean the solder The beam is irradiated to the repaired area of the substrate. The laser welding system of claim 18, further comprising a flux coating unit that applies a flux to the soldering region of the substrate. The laser welding system according to claim 18, further comprising a washing water supply unit that supplies washing water to the substrate to perform a water washing process.