CN211072148U

CN211072148U - Reflow device of heating reflow equipment

Info

Publication number: CN211072148U
Application number: CN201922007432.6U
Authority: CN
Inventors: 吴有荣; 胡淑柚
Original assignee: Samoan Shangjieying Global Co ltd
Current assignee: Samoan Shangjieying Global Co ltd
Priority date: 2019-01-03
Filing date: 2019-11-20
Publication date: 2020-07-24
Anticipated expiration: 2029-11-20
Also published as: TWM577591U

Abstract

The utility model relates to a reflow soldering device of heating reflow soldering equipment, the space of reflow soldering has, this reflow soldering device contains the heating light source, the light shield, the several trompil has, this light shield receives the illumination that comes from this heating light source and makes this heating light source shine to this reflow soldering space in via this trompil of several and form the several and shine the district, move and carry the mechanism, the mechanism of carrying has, this bearing part holds and treats the reflow soldering article and move through this reflow soldering space along moving the route, this upper surface of treating the reflow soldering article is preset the several and is treated the reflow soldering position, should treat that the several of reflow soldering article should treat that the reflow soldering position corresponds this zone time of shining of several respectively, this bearing part stops to remove the predetermined time, continue to remove through this reflow soldering space after that.

Description

Reflow device of heating reflow equipment

Technical Field

The utility model relates to a reflow soldering device of heating reflow soldering equipment especially relates to a reflow soldering device who carries out the reflow soldering under quiescent condition.

Background

Nowadays, electronic products are coming out of date, various mobile devices or wearable devices replacing traditional computers are coming out like bamboo shoots in the spring after rain, and in order to meet the miniaturization requirements of these electronic products, manufacturers continuously develop chips with smaller size and more powerful functions so as to establish a more perfect intelligent living environment. Most of these mobile devices or wearable devices employ Surface Mount Technology (SMT) to bond the chip to the substrate, and therefore, a reflow operation is required to solder the chip to the substrate, so that the reflow is an important process in the SMT.

Generally, a heating reflow device sequentially sends objects to be reflowed to the heating reflow device through a conveyor belt, and the objects are preheated, equalized in temperature, reflowed, cooled and the like. The preheating treatment is mainly used for volatilizing the solvent in the solder ball. The primary purpose of the soak process is to activate the flux to remove oxides and evaporate excess water. The main purpose of the reflow process is to completely melt the solder balls between the chip and the contact pads. The cooling treatment is mainly used for fixing the melted solder balls.

Due to the limited space within mobile devices or wearable devices, engineers often use dense layouts for substrate design, which complicates routing and allows the distance between contact pads on the substrate to be very close. When the substrate of such electronic product is reflowed, the problem of bridging between adjacent solder balls is easily caused by vibration during the reflow process. In addition, the temperature of the reflow apparatus is not easy to control, which often causes the chip to tilt due to the delayed melting of the solder ball, and the chip must be heated for a long time to reach the temperature (about 217 ℃) at which the solder ball is completely dissolved during the reflow process, so that the substrate may be bent or deformed during the heating process, thereby causing the substrate failure.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a reflow device of heating reflow equipment promptly can avoid the problem of the adjacent tin ball bridging that causes because of vibrations among the reflow process to concentrate the heating effectively, in order to improve the yield of reflow process.

The utility model provides a reflow device of a heating reflow device for solving the problems of the prior art, the reflow soldering apparatus has a reflow soldering space, the reflow soldering device includes a heating light source disposed in a manner of irradiating toward the inside of the reflow soldering space, a mask having a plurality of openings, the mask is irradiated by the heating light source to irradiate the heating light source to the reflow space through the plurality of openings to form a plurality of irradiation areas, the transferring mechanism is provided with a bearing part, the supporting part is used for supporting the object to be reflowed and moving through the reflow space along the transfer path, a plurality of parts to be reflowed are preset on the upper surface of the object to be reflowed, when the parts to be reflowed of the object to be reflowed correspond to the irradiation regions, the supporting part stops moving for a predetermined time and then continues moving through the reflow space.

In an embodiment of the present invention, a reflow device of a heating reflow apparatus is provided, wherein the area of the irradiation region is not larger than the area of the portion to be reflowed.

In an embodiment of the present invention, a reflow device of a heating reflow device is provided, wherein the mask is detachably installed between the heating light source and the transfer mechanism.

In an embodiment of the present invention, a reflow device of a heating reflow device is provided, wherein the transfer mechanism is a conveyor belt.

In an embodiment of the present invention, a reflow device of a heating reflow device is provided, wherein the heating light source is a halogen lamp.

In an embodiment of the present invention, a reflow device of a heating reflow apparatus is provided, wherein the object to be reflowed is provided with a substrate of chips or a plurality of chips stacked on each other.

Through the technical means of the utility model, can let the overall arrangement of miniaturization and complication when carrying out the reflow soldering, the problem of bridging (bridge) can not appear in adjacent tin ball. In addition, through the design of the irradiation area, the part to be reflowed is heated in a centralized manner, so that the time of a reflow process can be shortened, and the production capacity of heating reflow equipment is greatly improved.

Drawings

The present invention will be further described with reference to the following embodiments and accompanying drawings.

Fig. 1 is a schematic view showing an appearance of a heating reflow apparatus according to an embodiment of the present invention.

Fig. 2 is a schematic view showing a reflow device of a heating reflow apparatus according to an embodiment of the present invention.

Fig. 3 is a schematic diagram showing a chip welded on a substrate of a reflow device of a heating reflow apparatus according to an embodiment of the present invention.

Fig. 4 is a schematic diagram showing chip butt welding of the reflow device of the heating reflow apparatus according to an embodiment of the present invention.

Reference numerals

100 reflow soldering device

1 heating light source

2 light shield

21 open pore

3 transfer device

31 bearing part

L irradiation zone

K transfer path

W article to be reflowed

W1 chip

W2 solder ball

W3 substrate

R heating reflow equipment

R3 reflow space

Detailed Description

The following describes an embodiment of the present invention with reference to fig. 1 to 4. The description is not intended to limit the embodiments of the present invention, but is one example of the embodiments of the present invention.

As shown in fig. 1 to 3, an embodiment of the present invention provides a reflow device 100 of a heating reflow device R, wherein the heating reflow device R has a reflow space R3, the reflow device 100 includes a heating light source 1 disposed in a manner of irradiating toward the reflow space R3, a mask 2 having a plurality of openings 21, the mask 2 being irradiated by the heating light source 1 so that the heating light source 1 irradiates into the reflow space R3 through the plurality of openings 21 to form a plurality of irradiation regions L, a transfer mechanism 3 having a holding part 31, the holding part 31 holding an object W to be reflowed and moving through the reflow space R3 along a transfer path K, a plurality of portions to be reflowed are preset on an upper surface of the object W to be reflowed, when the plurality of portions to be reflowed of the object W to be reflowed respectively correspond to the plurality of irradiation regions L, the holding part 31 stops moving for a predetermined time, then continues to move through the reflow space R633, the space R631 is provided with a plurality of objects to be reflowed and a preheating space R634, a preheating space R364, a preheating space R634, a preheating space R8, a preheating space R364, a preheating space R634, a preheating space R364, and a preheating device 364, a preheating space R364.

As shown in fig. 2, in the present embodiment, the reflow apparatus 100 includes a heating light source 1, a mask 2 and a transfer mechanism 3 in a reflow space R3, the number of the openings 21 of the mask 2 is determined according to the welding requirement of the object W to be reflowed, and may be a plurality of small openings or a single large opening, and the light filtered by the mask 2 forms an irradiation region L on the supporting portion 31 of the transfer mechanism 3. the reflow apparatus 100 of the present invention further includes a thermometer (not shown) disposed in the reflow space R3 for wirelessly detecting the temperature of the irradiation region L and transmitting the temperature back to the heating reflow device R through a transmission line as a reference data for determining the reflow state.

As shown in FIG. 3, the object W to be reflowed, which is placed on the placing part 31, is transferred into the reflow space R3 along the transfer path K by the transfer mechanism 3. As shown in FIG. 3, the transfer mechanism 3 has a controller (not shown) capable of controlling the action of the transfer mechanism 3 according to the pre-inputted data of the opening 21 of the mask 2, so that the part to be reflowed in the object W to be reflowed is accurately aligned to the position of the irradiation region L, and the required retention time is calculated according to the temperature of the irradiation region L returned by the thermometer, thereby the object W to be reflowed is reflowed in a stationary state.

As shown in fig. 4, the solder ball W2 between the chip W1 and the chip W1 stacked on the supporting portion 31 is transferred to the reflow space R3 along the transfer path K by the transfer mechanism 3. in this case, the transfer mechanism 3 has a controller (not shown) capable of controlling the movement of the transfer mechanism 3 according to the data of the opening 21 of the mask 2 inputted in advance so that the solder ball W2 between the chip W1 and the chip W1 stacked on the supporting portion 31 is accurately corresponded to the position of the irradiation region L, and the required retention time is calculated according to the temperature of the irradiation region L returned by the thermometer, thereby the solder ball W2 between the chip W1 and the chip stacked on the supporting portion 31 is reflowed in a stationary state, and the solder ball W2 is uniformly melted without causing the problem of chip tilting, and the solder ball W2 is heated in a stationary state, thereby effectively avoiding the situation that the adjacent solder balls are bonded, and the solder balls W2 are transferred along the transfer path R1 of the supporting portion K after the chip W2 is transferred.

According to the reflow device 100 of the heating reflow apparatus of the embodiment of the present invention, wherein the area of the irradiation region L is not larger than the area of the to-be-reflowed portion, fig. 3 shows the reflow of the chip W1 and the solder ball W2 on the substrate W3, because the chip W1 and the area outside the solder ball W2 on the substrate W3 may cause warpage or deformation of the substrate W3 once contacting the high heat of the irradiation region L, the optical projection angle of the opening 21 of the mask 2 has been calculated, and the irradiation region L can be prevented from diffusing outward.

According to the reflow device 100 of the heating reflow equipment of the present invention, the mask 2 is detachably installed between the heating light source 1 and the transfer mechanism 3. The utility model discloses a reflow space R3 rear of heating reflow equipment R is provided with the light shield and takes out the mouth of trading (not shown in the figure), is convenient for change different types of light shield 2 and corresponds the overall arrangement of waiting to reflow article W.

According to the utility model discloses a reflow soldering device 100 of heating reflow soldering equipment of an embodiment, wherein should move and carry mechanism 3 for the conveyer belt, make waiting to reflow soldering article W to see through the conveyer belt and remove in reflow soldering space R3, nevertheless the utility model discloses be not limited to this, should move and carry mechanism 3 and also can use the microscope carrier that removes with ball screw's mode to move and carry waiting to reflow soldering article W to make the position correspondence of illumination area L and waiting to reflow soldering position more accurate.

According to the utility model discloses a reflow soldering device 100 of heating reflow soldering equipment of an embodiment, wherein this heating light source 1 is the halogen lamp for provide stable heat energy. However, the present invention is not limited thereto, and other types of light sources may be used for heating as long as the solder ball W2 can reach the melting temperature.

According to the utility model discloses a reflow soldering device 100 of heating reflow soldering equipment of an embodiment, wherein should treat that reflow soldering article W is provided with the base plate W3 (refer to fig. 3) of chip W1 or the several chip W1 (refer to fig. 4) of superpose each other the utility model discloses a reflow soldering device 100 is applicable in multiple reflow soldering article W of treating, sees through irradiation zone L and the static design in the heating, can steadily aim at specific region intensification, therefore no matter be the welding of chip W1 and chip W1, or chip W1 welds to base plate W3, can both reach good heating efficiency.

Compare in traditional heating reflow equipment, still continuously remove at the in-process of reflow and wait to reflow the article, the utility model discloses a reflow device 100 of heating reflow equipment R can make and wait to reflow article W and be in the state of complete rest and reflow, can make tin ball W2 be difficult for receiving the influence of vibrations and take place the problem of aversion or bridging short circuit, in addition, through the design of irradiation zone L, make the high temperature of heating light source 1 can not contact the region outside waiting to reflow position, and then avoid base plate W3 to be too of a specified duration because of the heat time, produce warpage or deformation.

The foregoing description and description are only illustrative of the preferred embodiments of the present invention, and other modifications may occur to those skilled in the art from the foregoing description and it is intended that all such modifications be included within the spirit and scope of the present invention.

Claims

1. A reflow apparatus of a heating reflow device, the heating reflow device having a reflow space, the reflow apparatus comprising:

a heating light source disposed so as to irradiate the reflow space;

a mask having a plurality of openings, wherein the mask is irradiated by the heating light source to irradiate the heating light source into the reflow space through the plurality of openings to form a plurality of irradiation regions;

the transfer mechanism is provided with a bearing part, the bearing part bears the object to be reflowed and moves through the reflow space along a transfer path, a plurality of parts to be reflowed are preset on the upper surface of the object to be reflowed, and the bearing part stops moving for a preset time and then moves through the reflow space after the parts to be reflowed of the object to be reflowed respectively correspond to the plurality of irradiation areas.

2. A reflow apparatus of a heated reflow device according to claim 1, wherein the area of the irradiation region is not larger than the area of the portion to be reflowed.

3. A reflow apparatus of a heating reflow device according to claim 1, wherein the mask is detachably mounted between the heating light source and the transfer mechanism.

4. A reflow apparatus of a heating reflow device according to claim 1, wherein the transfer mechanism is a conveyor belt.

5. A reflow apparatus of a heating reflow device according to claim 1, wherein the heating light source is a halogen lamp.

6. A reflow device of a heating reflow apparatus according to claim 1, wherein the object to be reflowed is a substrate provided with chips or a plurality of chips stacked on each other.