KR20130120427A - Rework system for bga - Google Patents

Abstract

The present invention relates to a rework system performing a de-soldering or a soldering work for repairing and recycling chips mounted on a printed circuit board (PCB) by heating a ball grid array (BGA), which is a kind of a surface mounting package used for an integrated circuit, and, more specifically, to a BGA rework system comprising a residue removal apparatus for automatically removing residues (remaining solder) left on the place of picked-up semiconductor chips required for implementing an automated BGA rework. The BGA rework system according to the present invention is provided to remove solder residues after lifting out the semiconductor chips from the PCB to be repaired; and comprises an absorbing body having the size corresponding to the size of the place from which the semiconductor is lifted out, and a heating member for melting the residues left on the PCB.

Description

BA REWORK SYSTEM {REWORK SYSTEM FOR BGA}

The present invention provides a de-soldering for repairing or regenerating a chip mounted on a printed circuit board by heating a ball grid array (BGA), which is a type of surface mount package used in an integrated circuit. Rework system that performs soldering work

More specifically, a BAE that requires a residue removal device to automatically remove from the PCB the residue (residual solder) left in place of the pick-up semiconductor chips necessary to implement automated BA rework. It relates to a work system.

Like Patent No. 0216820 (June 02, 1999) of Amco Technology Korea Co., Ltd. [BGA (Ball Grid Array) Semiconductor Package],

Conventional solder balls are fixed to chips or PCBs using a panel (a type of stencil or mask) perforated as a tool used in a conventional ball grid array (BGA) process during semiconductor production or chip regeneration. After seating in position, proceed with the soldering process.

In this case, the panel where the Hall element through which the solder ball passes is composed of aggregates integrated with the design circuit of the chip or PCB.

The hole element has a spherical shape and has a certain tolerance (about 110 to 120% of the diameter of the solder ball) for the passage of the sole ball (0.3 mm or 0.4 mm, gradually decreasing in size).

As a result, the solder balls are not seated in the borland (usually flux applied), which is the solder ball seating position of the chip or PCB, and is easy to be biased outward.

The contact area between the solder ball and the hole element sidewall is relatively large, and foreign matter is easily caught.

As a result of the tolerance between the solder ball and the hole element, the solder ball may not be seated in the ball land as accurately as possible, or defects may occur.

The contact area between the solder ball and the outer wall of the hole element is large, and foreign matter gets stuck on the outer wall, so that the solder ball does not pass through the hole element, causing defects, or frequent cleaning of the panel (a kind of stencil or mask) provided with the hole element. This leads to unnecessary maintenance costs.

In relation to the BA rework system, conventionally, the tool was manually operated by using a tool such as the stencil and an inspection device. Due to the problem of rework defect rate that depends on productivity decrease and proficiency, Difficult problems followed.

Accordingly, the present invention provides a BAA that requires a residue removal device for automatically removing residues (residual solder) remaining in the place of a pick-up semiconductor chip necessary for implementing an automated BA rework. It aims to provide a work system.

BA rework system according to the present invention to achieve the above object is

It is to remove solder residue after lifting the semiconductor chip from the PCB to be repaired.

Absorber having a size corresponding to the size of the semiconductor chip separation site of the PCB;

It comprises a residue removal apparatus comprising a; heating member for melting the remaining residue on the PCB.

In the BA rework system according to the present invention

The absorber is a porous heat-resistant body,

Alternatively the absorbent member is an absorbent member having a scratched contact surface,

Preferably, the tip of the heating member has a size corresponding to the absorber size.

The BA rework system according to the present invention implements an automated BA rework that requires a residue removal device to automatically remove residues (residual solder) remaining in the place of the pick-up semiconductor chip from the PCB. Can be.

1 is a schematic perspective view of a residue removal apparatus in a BA rework system according to the present invention.
2 is a perspective view of an SWD rework hot air device according to the present invention;
3 is a perspective view associated with a heating member and a heating member holder.
4 is a schematic plan view associated with a modification of the hot air gun holder;
5 is a schematic view relating to a modification of the heating member holder.
Figure 6 is a perspective view of the PCB assembly having a cross coupling structure according to the present invention.
Figure 7 is an exploded perspective view of the PCB assembly having a cross-linking structure according to the present invention.
8 is a drawing substitute photograph for a PCB assembly having a cross-linking structure according to the present invention.
9 is a perspective view of a BA rework system including a residue removing device according to the present invention.
Figure 10 is a front view of the main portion showing the omission of the housing of the transfer unit in the BA rework system including a residue removing device according to the present invention.
11 is a plan view of a BA rework system including a surface mount semiconductor needle residue removing device in accordance with the present invention.
12 is a side view of a BA rework system including a residue removing device according to the present invention.
FIG. 13 is a perspective view separately showing only the optical vision unit of the BA rework system including the residue removing device according to the present invention. FIG.
14 is a cross-sectional view schematically showing a heating process during a rework operation in a BA rework system including a residue removing device according to the present invention.
15 is an internal perspective view of a BA rework system including a residue removing device according to the present invention.
16 is a side view schematically showing an operating state of a monitor of a BA rework system including a residue removing device according to the present invention;

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings.

The present invention may be modified in various ways and may have various forms, and thus embodiments (or embodiments) will be described in detail in the text. However, this is not intended to limit the present invention to the specific form disclosed, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

In each of the drawings, the same reference numerals, in particular, the tens and ones digits, or the same digits, tens, ones, and alphabets refer to members having the same or similar functions, and unless otherwise specified, each member in the figures The member indicated by the reference numeral may be regarded as a member conforming to these standards (particularly, the first drawing group of FIGS. 1 to 5, the second drawing group of FIGS. 6 to 8, and 9 to 9). Reference numerals in the third drawing group of FIG. 16 are independent of each other).

In addition, in the drawings, the components are exaggerated in size (or thickness), in size (or thickness), in size (or thickness), or in a simplified form or simplified in view of convenience of understanding. It should not be.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, the term " comprising " or " consisting of ", or the like, refers to the presence of a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

The core of the BA rework system according to the present invention and the working sequence utilizing the same are as follows.

1. Summary of Concepts of the Invention

The present invention relates to a process for replacing defective semiconductor chips generated in semiconductor and PCB production lines, or a process for separating (or removing) various semiconductor chips from other PCBs, in particular, a residue removing apparatus that is essential for automation of a BA rework system. Present your skills.

2. Core technology

2.1.This technology removes the solder residue (lead residue) from the PCB after removing the semiconductor chip (quickly, finely and cleanly).

3.Replacement Work (Repair) Process

3.1.Bad PCB Loading

3.2.Bar Code Scan for Semiconductor Chip Recognition

3.3.Semiconductor chip heating (upper and lower heater)

3.4.Semiconductor Chip Pick-up

3.5 Solder residue removal

3.6. Chip Pick-up

3.7 Flux Dotting

3.8 Alignment of quality chip and PCB Ball Land (Pattern) to be mounted

3.9.Product Chip

3.10.Heating

3.11 Cooling

3.12.Unloading

4. Key technical details (removing solder residue)

4.1.Technology.1 (Principle removed by absorbing residue)

4.1.1.Square heating heater that can be operated up and down to melt residue

4.1.2.Automatic removal and attachment of residue removal consumables at the bottom of the heating heater (disposable consumables)

4.1.3.Supply Manufacturing Technology

4.1.3.1.Technology in which solder residue is absorbed and absorbed and removed by ultra-thin copper mesh type for solder suction (absorption) that is the size of the chip attached to the bottom of the heater.

4.1.3.2 .________________________________ Copper plate (or copper tape)

4.1.3.2.1.Mesh type consumables manufacturing technology in which the surface of the copper plate is roughened to facilitate the absorption of solder.

4.2.Technology.2 (Principle to remove residue by melting vacuum)

4.2.1.Square heating heater that can be operated up and down to melt residue

4.2.2.Exothermic heater with a small hole (about 1mm) at the bottom of the heating heater to make holes within 1mm to facilitate the suction of solder in the liquid state.

4.2.2.1 Pocket to Hold Suctioned Solder

More specifically, in the first drawing group of FIGS. 1 to 5, in particular, a heating element (observed from below), a PCB, and an absorber (observed from above), so that the concept of exploded perspective can be easily understood. As shown in Fig. 2, which is not related to the orthographic projection method for convenience, by expressing the observation direction differently), the residue removing device E constituting the core of the BA rework system according to the present invention will be described. .

The core of the residue removing apparatus (E) of the present invention is to remove the solder residue (V) after picking up the semiconductor chip (C1) from the target PCB, in particular the repair target PCB (P) (Pick-Up),

Various semiconductor chips of PCB, especially absorbent chips (bad semiconductor chips generated from semiconductors and PCB production lines) (C1), have an absorber having a size corresponding to the size of the seat where the core is mounted. It comprises a heating element for melting, in particular a heating member (40m).

In the present specification, the 'heating member', in particular, the 'iron' refers to a heating element, and is a concept including other hot air guns 20, and in particular, in the claims, a limited expression of 'heating member' or 'iron'. The protection scope of the present invention should not be construed as limiting, but should be construed to cover various heating elements.

The original PCB (Pp) to be repaired (see photo in the dashed circle on the right in FIG. 1) becomes the PCB (P) from which the semiconductor chip (C1) is removed after loading and pick-up. After this, residue removal proceeds.

First, the tip 40t (29m) of the heating member 40m or hot air gun 20m (see in FIG. 1, upper left one-dot chain circle) is the absorber size, more essentially the semiconductor chip (removal) seat size of the PCB. It is desirable to have a size corresponding to (sufficient enough to cover all of the residue area).

In the drawing, a tip having a corresponding size, which is square in accordance with the size of the semiconductor chip C1 (removal) of the PCB, is introduced, and the tip 29m of the heating member tip 40t or the hot air gun 20m is replaced with a hot air gun. In this case, the replacement method is described in detail with reference to FIG. 2), and thus, it is preferable that the replacement method can be easily transformed into a shape corresponding to various semiconductor chips and residue shapes.

In addition, it is preferable that the lifting guide or the robot arm is configured to enable other movements, including lifting and lowering of a heating element such as a heating member, for automation.

Thereafter, the absorber for removing the molten residue covers the upper surface of the PCB corresponding to the place of the semiconductor chip C1 (removal) to be in contact with the molten residue to be absorbed and removed.

The contact and absorption after PCB absorption of the absorbent body can be carried out using a jig or a robot arm mounted on the displacement guide.

If necessary, the absorber may be introduced into the heating element, that is, the heating element tip 40t or the tip 29m of the hot air gun 20m, so that the residue absorption proceeds simultaneously with the residue melting.

The displacement of the absorber can also be configured to move with the heating element.

In addition, the absorber preferably has a size corresponding to the size of the semiconductor chip (C1) (removal) of the PCB,

If the absorber is smaller than that, it is necessary to use several absorbents, which may cause inconvenience or exhaustion.

 Since the PCB surface needs to be stowed by the absorber, it may cause damage to the PCB surface due to friction, and thus cause a problem of repair failure or failure and error in the use after mounting.

If the absorber is larger than the semiconductor chip C1 (removal) seat size of the CB, it is not only wasteful, but also a mounting device including the other normal chip C2 of the original PCB (Pp) and the like It may be unnecessary or contraindicated as it may affect the solder area (breakage, etc.).

On the other hand, the absorber (Ab1) used for absorbing and removing the molten solder residue may first be a porous heat-resistant body. It is preferable that this heat resistant body is a material having excellent thermal conductivity, and the principle is similar to that of the fabric soaking water.

Specifically, the absorbent body (Ab1), which is a porous heat-resistant body, may be a woven fabric of thin (μm) copper wire (having excellent thermal conductivity characteristics), and the absorbing microcavities (h1) for absorbing molten residue are formed in the form of micropores. do.

The absorption principle of the molten solder residue of the absorber and the removal of the absorbed portion are one side of the absorber is wound on the first roll before use in consideration of the mass rework process, and one side is provided with a second roll on which the absorber is wound to absorb the residue. The absorber is located under the lifting contact rod (having the size corresponding to the semiconductor chip removal site) corresponding to the semiconductor chip C1 (removal) location of the PCB to be regenerated and removed.

When the contact pin descends, the contact rod descends in place of the semiconductor chip (C1) (removed) of the PCB, so that the molten residue is absorbed by the absorber, and the contact rod rises.

The rotation of the roll then allows the portion of the absorber to be used to move to the second roll side, again allowing the new absorber to be positioned below the contact rod.

In order to facilitate the movement of the band-type absorber wound on the first and second rolls, moving holes continuously formed, such as a photographing film, may be formed on both sides of the band-type absorber, and various structures for ensuring the movement of other band-type absorbers may be provided. Eg conveyor belt type, chain type) can be introduced.

Taking into account the continuous supply type, in particular the continuous supply band type absorber, it means that the absorber has a size corresponding to the seat size on which the semiconductor chip C1 of the PCB is mounted.

In essence, it is more accurate and essential that the size of the absorber in contact with the semiconductor chip separation sites (residues or traces) corresponding to the sites for solder residue absorption.

On the other hand, the alternative absorber Ab2 may further be an absorbent member having a scratched contact surface (see in FIG. 1, left dashed line circle). Scratch processing may use a laser or the like, may be a regular or irregular micro groove (h2) (absorbing microcavity), the introduction and removal of the thin plate absorber (Ab2) may also be configured in a variety of ways,

In view of processability, thermal conductivity, price, and ash phase, copper thin plates can be used.

Further, the absorber Ab3 may be provided on the contact surface of the heating element, that is, the tip 40t (29m) of the heating member 40m or the hot air gun 20m (see in FIG. 1, upper left one-dot chain line circle),

The contact surface of this tip is fine scratched or microporous,

Regeneration through the removal of absorbed residue may be achieved by hot air discharge (in the case of hot air guns and micropores) or by removing the residue through contact with other solvents.

As shown in Figs. 2 and 3, the SMW rework hot air device A according to the present invention is largely provided with a display unit 11 and an operation unit 13, and constitutes a micom 17 that is a main body of the control unit. The main body 10 in which the processor chip is built, the hot air gun 20 in which the electric heater 923 is embedded, the cradle 30 for this, and a heating member, in particular, the iron, to realize a complex function for improving work convenience 40, and consists of a holder 50 for the heating member.

The main body 10 is in a substantially rectangular parallelepiped shape (the present invention is not limited by the terms 'cuboid' and 'front', in particular, 'front' refers to an installation site that ensures convenience of observation and operation). Display unit 11 and operation unit 13 are arranged.

The display window on the left side of the display unit 11 is the set temperature display unit 11a and the display window on the right side is the actual temperature display unit 11b. The indication of the temperature will indicate the temperature of the hot air of the hot air gun or the heating member.

In addition, the operation unit 13 is a hot air gun (heater and fan) on / off main switch (13A) and heating member on / off main switch (13B),

Temperature control buttons 13b and 13a for raising and lowering the set temperature of the heater 23 and the heating member of the hot air gun, and the button 13c for setting the selected set temperature, and

It comprises a dial (13C) for adjusting the wind strength by adjusting the fan 21 of the hot air gun 20.

In addition, the main body 10 is provided with a port 15 for desorption of the iron 40. The plug 41 of the iron 40 can be inserted and used as necessary. .

The set temperature display unit 11a and the actual temperature display unit 11b are for comparing and displaying the set temperature and the actual temperature in relation to the hot air temperature of the hot air gun 20 or the temperature of the iron 40.

For example, the hot air gun 20 is provided with a temperature sensor S (refer to the hidden line display in FIG. 2) near the hot air discharge port 27, so that the hot air temperature measured by the temperature sensor S is connected to the cable 20a. After passing through the microcomputer 17, the microcomputer displays this on the actual temperature display unit 11b.

The operator compares or compares the desired temperature, that is, the number of the set temperature display section 11a indicating the set hot air temperature or has a difference within the error range.

The rework process can be performed to ensure the rework accuracy and reliability by checking the correct work timing.

The core of the present invention is that the fan 21 (refer to the hidden line display in FIG. 2) is built in the hot air gun 20 itself, thereby ensuring quietness, miniaturization, and compactness.

In addition, the hot air heater 20 has a heat transfer heater 23 built therein.

The hot air gun 20 which is connected to the main body 10 and the cable 20a and receives power and control signals is also coupled to the side of the main body 10 when not in use, but is connected to the left side of the main body if necessary. It can be mounted on the cradle (30) coupled to the possible combination.

The cradle 30 is coupled to the front inclined structure to improve the convenience of mounting.

In addition, the engaging groove 31 coupled to the annular locking projection 25 formed in the plastic shell forming the heat insulating housing near the hot air outlet 27 of the hot air gun 20 is formed on the inner circumferential surface of the holder 39.

The inner circumferential surface of the holder 39 is also provided with a knurling portion 31a formed at the lower portion of the engaging groove 31 so that the hot air gun is easily separated when the hot air gun is separated for use by spaced apart from the outer circumferential surface of the mounted hot air gun 20. To fall from

Furthermore, the hot air gun 20 and the holder 30 is provided with a sensor, in particular, proximity sensor (S1) (S2)

In addition to the de-soldering work using hot air, other tasks such as soldering work using heating elements, or simply placing the hot air gun down on the holder at rest, the heater can be installed when the hot air gun is mounted without turning off the main switch 13A. 23) and the fan 21 can be turned off, thereby increasing convenience and stability.

When the sensors S1 and S2 react by mounting of the hot air gun, the heater 23 and the fan 21 are turned off directly,

The sensing signal may be transmitted to the microcomputer 17 and the OFF command signal may be transmitted.

In addition, in order to cool the hot hot air outlet 27 for safety, the heater 23 is preferentially turned off in response to the sensors S1 and S2, and then the fan 21 is operated for a predetermined time to perform a cooling function. It is preferable that a subsequent OFF of the fan takes place.

Furthermore, as shown in a schematic plan view in FIG. 4, alternatively, the holder 30 and the main body 10 are connected through a swing shaft carried by a spring, so that the holder may be mounted on a cradle even after repeated hot air gun mounting operations. Shock can be absorbed to increase durability.

The concept of such a swing shaft can be implemented in various ways. In FIG. 4, the swing shaft 33 is coupled to the holder 30, and the fixed shaft 35 fitted to the swing shaft 33 is disposed on the side of the main body 10. Combined,

The springs 37 are coupled to the cutouts 33a and 35a of the two shafts 33 and 35 corresponding to each other.

When the load is applied to the cradle, the spring shaft 37 is opened when the swing shaft 33 rotates a predetermined angle to solve this problem. When the external force is released, the swing shaft 33 and the cradle 30 are restored to the initial state. .

In FIG. 2 again, the SWD rework hot air device A according to the present invention introduces a replaceable nozzle into the hot air gun discharge port so that the hot air discharge type can be adjusted so as to meet the purpose of de-soldering work. Hot air intensity and contact area size can be adjusted.

That is, the hot air outlet 27 is provided with a fastening portion (three insertion grooves and three fastening portions, respectively) consisting of an insertion groove 27a and a locking piece 27b.

The lower end outer circumferential surface of the replaceable nozzle 29 is provided with a coupling protrusion 29a that is inserted into and fixed to the engaging piece 27b via the insertion groove 27a of the continuously formed fastening portion.

In addition, a tool (T) may be used for the convenience of replacing the nozzle (29), and three fitting protrusions (T1) are provided at the end of the tool (T), and the nozzle has three tool coupling parts (29b) corresponding thereto. Is formed,

The nozzle can be easily attached to and detached from the hot air outlet 27 of the hot air gun 20 by turning the nozzle 29 using a tool.

In addition, in Figures 2 and 3, the rework hot air device (A) for the SMD according to the present invention further introduces a soldering iron 40 to improve the work convenience through the implementation of a complex function, the cable for power and control signal transmission The end of the 40a is provided with a plug 41, which can be plugged into the port 15 on the front of the main body 10 for use.

In order to secure the engagement state, the plug 41 is provided so that the fixing nut 41a is idle, and the port 15 is provided with a male screw portion 15a screwed thereto.

On the other hand, when the iron (40) is not used, a storage table 50 for the mounting thereof is introduced, and a mounting hole 51C capable of fitting the heating member in [A] and [B] of FIG. 3 is formed in the mounting member,

In particular, the mounting member is a detachable mounting member 51 has an annular groove (51A) is formed on the outer circumferential surface is fitted into the fixing groove (51B) of the storage table 50 is fixed to improve productivity and assembling,

A fixing protrusion 51a (refer to the dashed-dotted line in FIG. 3 [B] having a different direction of observation) is formed at a lower portion of the annular groove 51A of the mounting member 51 for coupling in place. A fixing groove 51b is also formed at the lower portion of the 51B.

In addition, the storage table 50 is formed with a pad 55A which can shake off solder residue attached to the tip of the iron 40, and a settlement portion 55 for preventing the pad from being separated. It is not limited to inclusion, but is a concept encompassing various soldering materials according to environmental regulations).

Furthermore, the storage table 50 is provided with a soldering waste storage portion 55A on the opposite side of the settlement portion 55, so that the storage storage of the soldering waste falling from the tip of the heating member inserted into the mounting hole 51C of the mounting member 51 It is possible.

Alternatively, the storage unit 53 of the storage table 50 may introduce a drawer-type storage unit for improving the convenience of solder residue storage and discharge processing.

More specifically, as in the schematic side cross-sectional view of FIG. 5A and the plan view of [B],

This drawer type storage part 53 comprises a drawer 53A, a stopper 53C for enabling the forced closing of the drawer, and a stopper 53D for temporarily fixing the open drawer.

The drawer 53A has four sidewalls 53b, and a lower panel 53a is coupled to the lower sidewall.

Especially for the convenience of drawing out the drawer and discharging the stored soldering scraps

The side wall 53b and the lower panel 53a are connected through the eccentric shaft 53c.

Moreover, when referring to the conceptual diagram in the dashed-dotted line circle | round | yen of the lower right of FIG.

The lower panel 53a of the drawer 53A is provided with the right side of the eccentric shaft 53c and the narrow portion 53d with the weight 53d.

When no external force is applied, the lower panel 53a is wider and heavier than the right side of the lower side of the eccentric shaft 53c.

As the weight 53d is added, the lower right panel of the eccentric shaft 53c is heavier.

The right end of the lower panel hangs at the bottom of the right wall of the drawer, and the left end of the lower panel hangs at the bottom of the left wall of the drawer.

The lower panel 53a maintains a horizontal state.

When the operator pulls out the drawer 53A and presses the lower left panel of the eccentric shaft 53c, the lower panel 53a is rotated about the eccentric shaft 53c to easily separate and discharge the stored solder debris or residue.

In addition, as shown in FIG. 5B, when the drawer 53A is withdrawn, the drawer 53A is pulled out along the rail 53B of the storage table 50 (see FIG. 5B).

The engaging groove 53b 'of the side wall 53b of the drawer 53A is caught by the stopper 53D coupled to the rail 53B.

Despite the tension of the self-closing spring (53C) connecting the drawer (53A) and the storage (50)

The open state of the drawer can be temporarily maintained.

After discharging the solder chips or debris, lightly push the drawer 53A inward.

The stopper 53B rotates about the shaft pin while deforming the torsion coil spring.

As the catching groove 53b 'of the side wall 53b of the drawer 53A leaves the stopper 53B,

The closing operation of the drawer by the automatic closing spring 53C is made.

On the other hand, in the BA rework system according to the present invention, it will be described a PC assembly (A) having a cross-linked structure that can be utilized in the rework operation.

In describing the second drawing group of FIG. 6 to FIG. 8 related to this, a rough direction reference that is not rigid for convenience is specified with reference to FIGS. 6A and 7.

In the state as shown, the upper and lower sides are distinguished, and in the description associated with other drawings, the direction is specified according to this criterion.

First, Fig. 6 [A] showing the state seen from the top and Fig. 6 [B] showing the state seen from the bottom, respectively, and an exploded perspective view of Fig. 7 respectively.

Furthermore, as can be seen in FIG. 8, which is a photograph of a sample (part) corresponding to FIGS. 6 and 7,

The PCB assembly A having the crosslinking structure according to the present invention includes a first PCB 10 and a second PCB 20 that are soldered and connected to each other.

In the drawing, the first PCB 10 is a single-side PCB, and the second PCB 20 is a double-side PCB.

Depending on the type of product and the need for miniaturization and integration and securing cost competitiveness, the combination of single-sided PCB, single-sided PCB, single-sided PCB, double-sided PCB-sided PCB, single-sided or double-sided PCB and multilayer PCB As all may be implemented, the present invention should not be construed as limiting thereby.

Various chips and elements are mounted in the first PC 10, and as shown in FIG. 7, a coupling hole 13 is formed to couple the second PC 20.

As can be seen in the lower surface photograph [B] of FIG. 8, a first circuit portion 11 made of a copper plate or the like eroded on the bottom is provided.

In addition, the second PC 20 has a fitting portion 23 formed to be fitted into the coupling hole 13, and the fitting portion 23 is interconnected between the first and second circuit portions 11 and 21. Connection 25 is provided for.

In addition, as can be seen in photograph [C] photographing each of both surfaces of the second PC 20 of FIG. 8, the second circuit part 21 formed on both surfaces is provided with a corroded copper foil or the like. .

The fitting part 23 of the second PC 20 is composed of two coupling protrusions 23a and 23b, and two coupling holes 13 of the first PC 10 are correspondingly formed.

These coupling protrusions can contribute to the improvement of assembly convenience, productivity, and convenience of management by performing a coding function for each product type by changing some or all of the number, location and size of the protrusions as necessary.

In addition, the connection portion 25 of the second PC 20 may be made of a corroded copper sheet or the like, or may be made of a known lead-free (or flexible) paste material.

As can be seen in the enlarged one-dot chain line circle in FIG. 7, each connection portion 25 has an oblique portion 25a under the main body 25A, and in particular, the oblique portion 25a has a substantially rectangular main body ( It is formed along the tail part 25b which leads to the area | region beyond 25A).

This is used when the flow soldering equipment is used to connect the first and second circuit parts 11 and 21 of the first and second PCBs 10 and 20 to secure mass productivity and quality.

In the first and second PCBs 10 and 20 cross-coupled to each other, the fitting part 23 of the second PCB 20 protruding to the lower surface of the first PCB 10, in particular, the engaging projection ( 23a, 23b) lower end of the connecting portion 25 that extends to the portion 23p (see in FIG. 6B bottom dashed circle)

By the soldering flux in the situation of conveying [the first and second PCB 10, 20 assembly]

It is to be connected to the connection end of the first circuit portion 11 formed on the bottom surface peripheral to the coupling hole 13 of the first PCB 10 accurately.

As a result, as can be seen in the enlarged one-dot chain line of the lower surface of [B] of FIG. 6 and the enlarged photograph on the right of FIG.

The connecting end of the first circuit portion 11 formed in the bottom surface peripheral to the coupling hole 13 of the first PC 10 and

Diagonal portions 25a formed along the tail portion 25b of the lower end portion of the connecting portion 25 are

It is connected precisely and precisely by the chevron-shaped solder part 30 formed by the soldering flux.

As such, the slanted portion 25a of the second PC 20 connecting portion 25 may be transferred to the soldering flux of the [first and second PCs 10 and 20 assembly] when the flow soldering equipment is used. The direction is taken into account.

Moreover, when the tail part 25b forms the diagonal part 25a in the connection part 25,

In consideration of the reality of the circuit part which increases the degree of integration by forming the gap between the wiring constituting the circuit part (particularly, the first circuit part 11) as narrow as possible.

Among the portions interconnected by the soldering flux (that is, the connecting end of the first circuit portion 11 and the oblique portion 25a of the connecting portion 25)

To make the width of the diagonal portion 25a of the connecting portion 25 as narrow as possible

The main purpose of the soldering portion 30 is to connect the connecting end portion of the first circuit portion 11 and the diagonal portion 25a of the connecting portion 25 with each other accurately and precisely.

In addition, as shown in the comparison of the lower right one-dot chain line circle of Figure 7,

Compared to the connection part 25P which formed the diagonal part which has the same section length without the tail part by the said tail part 25b,

The connecting portion 25 having the tail portion 25b of the present invention is relatively small in area.

As a result, the effect of preventing the waste of the material required can be obtained incidentally.

In the description of one embodiment of the BA rework system including the residue removing device according to the present invention shown in the third drawing group of FIGS. Referring to FIGS. 9 and 14, the direction in which gravity acts downward is determined, and the top, bottom, left and right sides are determined in the visible direction, and the front and rear surfaces are specified with the visible surface as the front.

In addition, in describing the BA rework system according to the present invention, a surface mount semiconductor chip is coupled to a printed circuit board by soldering, such as a ball grid array (BGA) semiconductor and a surface mount device (SMD) semiconductor chip. Including all types of semiconductor chip that can be utilized as a component includes not only the semiconductor chip but also all the semiconductor chip that can be directly coupled to the surface of the printed circuit board, the detailed description of the present specification for the convenience of description BGA Although a semiconductor chip is demonstrated, it is not limited to this, of course.

Although not shown in the drawing, the semiconductor chip has a chip portion on one side and solder balls (spherical soldering, etc.) for coupling with the substrate and transmitting an electrical signal on the other side are arranged in an array on an array. The solder ball size is very small and accordingly the arrangement of the mounting parts such as copper foil to which the solder balls are bonded is also very fine and the change due to heating is sensitive, so that the solder balls are grounded during heating for bonding. Substrate, such as unpaid, is likely to occur, and when the defect occurs, it is not easy to separate by the hardened solder balls, so the entire substrate must be treated as a defective product.

Therefore, the BA rework system including the residue removing device according to the present invention separates a semiconductor chip from a substrate on which the semiconductor chip is mounted, and reworks by combining another semiconductor chip to a mounting part where the semiconductor chip is separated, thereby resolving the semiconductor during substrate fabrication. The risk of defective products can be reduced by reusing the defective substrate generated during the chip mounting process.In addition, even if only some of the semiconductor chips are damaged or damaged on the board of electronic products that have been used for a long time, only the semiconductor chips can be used. This allows the electronics user to reduce the burden of additional purchase or repair costs.

To this end, the present invention includes a body 10 having a lower station 13 having a seating portion 14 on which the substrate can be seated, as shown in FIG. 9.

The main body 10 includes a display panel 12 for inputting a command signal of a rework operation and checking a work status.

The display panel 12 may include an image unit such as a monitor and an input unit such as a keyboard, or a liquid crystal display such as a touch screen that may simultaneously perform an image function and an input function.

In addition, in the drawings of the present specification, the display panel 12 is shown only a state coupled to the lower portion of the main body 10, the display panel 12 is made to be detachable from the main body 10 through a wired or wireless connection It can be in the form of a remote control.

The display panel 12 has a built-in microcomputer provided with a control unit for controlling the entire operation by receiving a user's command signal, a detailed description thereof will be described later.

Next, the present invention comprises a heating member (ie, a heating member for melting the residue left on the PCB) for separating or bonding the semiconductor chip on the substrate, and a transfer unit 30 for transferring the semiconductor chip.

The transfer unit 30 transfers the semiconductor chip during the rework operation, that is, the semiconductor chip is adsorbed and transferred during the separation process of the semiconductor chip, and the semiconductor chip is adsorbed and transferred during the bonding process of the semiconductor chip. It functions to seat the mounting part.

To this end, the transfer unit 30 includes a pick-up nozzle 31 having a pipe-shaped base 32 and a suction part 33 (see FIG. 10) embedded in the base to suck the upper surface of the semiconductor chip. And the semiconductor chip is transferred through the lifting and lowering motion.

The transfer unit further includes a housing 36 covering the base 32, the main body 10 is provided with a transfer rail 10A, and the housing 36 slides on the transfer rail 10A. It is coupled to the connection member 36A that is coupled to move up and down.

In addition, the heating member may be formed in various ways. The present invention preferably heats the upper, lower, and circumferences of the semiconductor chip and the substrate to smoothly melt the solder balls, thereby preventing the occurrence of defective products during the rework operation. .

To this end, as shown in FIG. 14, the heating member includes a first heating part 21 embedded in the base 32 to generate heat to the bottom, and built into the seating part 14 to heat up. It comprises a second heating unit 25 for generating.

The seating part 14 is formed with an opening for hot air of the second heating part.

The first heating unit 21 may be configured as a separate heater, but if instantaneous heating occurs due to the characteristics of the semiconductor chip, damage may occur to the chip unit of the semiconductor chip, thereby providing a space inside the transfer unit 30. It is preferable that the hot air is blown through.

That is, the first heating unit 21 is composed of a heater provided separately in the center of the base 32 and a blowing fan for blowing the heat of the heater toward the lower surface, that is, the upper surface of the semiconductor chip (C),

A main heater (not shown) and a main fan (not shown) may be built in the main body 10, and the main heater 10 may be configured to communicate with the first heating unit 21 through a tube (not shown).

In addition, the second heating unit 25 may also form a separate heater and a blowing fan in the lower portion of the seating unit 14, like the first heating unit 21,

It is preferable to connect the main heater, the main blower fan, and the lower communication portion of the seating portion 14 to blow hot air toward the top, that is, the lower surface of the substrate (B).

FIG. 14 is a side cross-sectional view illustrating a state in which the transfer unit is lowered, and a first temperature sensor 22 and a second temperature sensor (for sensing the temperature of the first and second heating parts 21 and 25, respectively). 26).

The first and second temperature sensors may sense the temperature of the first and second heating parts 21 and 25 to adjust the intensity of the hot air according to the temperature.

In addition, the conventional substrate (B) manufacturing operation, that is, reflow soldering (Reflow Soldering) operation in the environment having a predetermined temperature, while the substrate (B) having a semiconductor chip (C) is transferred while the bonding is performed according to the present invention The BA rework system including the residue removal device is fixed at the seating portion 14 of the device so that the work is carried out, so it is desirable to maintain an environment such as a reflow soldering operation.

To this end, the heating member of the present invention includes a third heating part 27 formed around the seating part 14 to preheat and heat the periphery of the substrate B.

The third heating unit 27 preheats the seating unit 14 before the rework operation to provide a reflow environment at room temperature than room temperature, and assists solder ball heating when the semiconductor chip C is separated or joined. Has

As shown in FIG. 11, since the third heating part 27 maintains an environmental temperature around the substrate B, the third heating part 27 is made of powder containing a tubular heater surrounding the seating part 14. Preferably, since the size of the heater powders should also vary according to the size of the substrate B, it is more preferable to be formed around the seating portion 14, that is, detachable to the lower station 13.

Subsequently, when the semiconductor chip is mounted on the substrate, the semiconductor chip must be accurately seated on the mounting portion of the substrate made of copper foil, and the like, thereby preventing the occurrence of an error in the substrate.

However, as described above, the substrate itself is a component that is embedded in an electronic product, and the size thereof is different, and the substrate is made smaller and smaller according to the tendency of light and short size of the electronic product. Solder balls are also finely arranged, and BGA semiconductor chips are very advantageous for miniaturization,

It is difficult to check and set the pattern of the copper foil formed on the mounting portion and the lead shape in which the solder balls of the semiconductor chip are arranged.

Therefore, the present invention is formed between the transfer unit 30 and the seating portion 14 so as to accurately seat the pattern of the mounting portion and the solder balls of the semiconductor chip precisely and precisely arranged so as not to cause defective products during the rework operation And an optical vision unit 40 which is drawn to the main body 10 and has an optical camera 42 for enlarging and sending the pick-up nozzle and the seat 14. In addition, the optical vision unit may be used in a residue removal process using an absorber to remove solder residues remaining on the semiconductor chip separation site of the PCB after the semiconductor chip is removed.

In addition, the present invention is to monitor the center of the monitor 60 and the substrate and the semiconductor chip interlocked with the camera 42 so that the operator can check the image transmitted by the camera 42 to adjust the position of the semiconductor chip or substrate. It comprises a position adjusting means 50 for fitting.

The camera 42 of the optical vision unit 40 has a light source and synthesizes the pattern of the lead portion and the substrate mounting portion of the semiconductor chip, which are reflected by the light of the light source, through a prism and then sends them to the monitor 60. The operator can view both images at the same time.

At this time, the camera 42 magnifies and transmits the image of the upper and lower parts from several times to several tens of times, so that the operator centers the pattern of the lead portion and the substrate mounting portion of the semiconductor chip through the monitor 60 through the position adjusting means 50. Fine adjustment is possible by adjusting.

Subsequently, as shown in FIG. 10, the position adjusting means 50 has a rotation bar 52 that is coupled to the pickup nozzle 31 of the transfer unit 30 to rotate the semiconductor chip in a horizontal direction. The first rotating part 51 is included.

9 and 12, a rotation groove for horizontally rotating the rotation bar 52 is formed at one side of the housing 36 of the transfer unit 30.

The lower station 13 has a pair of X-axis 54 and Y-axis 55 formed in directions perpendicular to each other, and includes a clamper 56 for fixing a substrate to the seating portion 14.

Further comprising as the position adjusting means 50 a second rotating portion 53 having fine adjustment movement levers 57 for allowing the clamper 56 to slide along the X axis 54 and the Y axis 55. It is done by

Hereinafter, the residue removal work process of the BA rework system according to the present invention in order to explain the configuration and function of the present invention in more detail.

First, the substrate which needs to be replaced by the semiconductor chip is fixed to the seating portion 14 through the clamper 56.

At this time, it is preferable to arrange the semiconductor chip to be separated in the center of the seating part 14. For this purpose, the seating part 14 protrudes from the center of the seating part 14 and a protrusion (not shown) that can hold the center of the substrate. It may be further provided.

Since the transfer unit 30 of the present invention is lowered toward the substrate of the seating portion 14, as shown in Figure 14, the separation process by the heating member is made.

At this time, when the heating member operates while the adsorption part 33 of the pickup nozzle 31 provided in the transfer unit 30 presses the upper surface of the defective semiconductor chip mounted on the substrate PCB, the PCB or the semiconductor according to the heating. Since deformation of a chip may occur, the transfer unit 30 is preferably raised upward by a predetermined interval in a state in which the adsorption unit contacts the defective semiconductor chip.

To this end, in the present invention, the transfer unit 30, more specifically, the pickup nozzle 31 includes an elastic member (not shown) and a vertical position sensor (not shown). From the predetermined height set by the worker, after descending at a low speed, the suction part 33 of the pick-up nozzle 31 contacts the upper surface of the semiconductor chip, and at this time, the elastic member reacts and rises again after contact, and detects the vertical position. The sensor may be spaced apart by a predetermined interval depending on the height of the upper surface of the semiconductor chip.

Thus, the pick-up nozzle not only functions as the suction part, but also has a function as a sensor for setting the falling distance of the transfer unit.

When the lowering of the transfer unit 30 is completed as described above, the microcomputer embedded in the main body 10 operates the heating member to heat to a predetermined setting temperature to melt the solder balls of the semiconductor chip, and when the melting temperature is reached, The transfer unit 30 is lowered again and the pick-up nozzle 31 converts the elastic force of the elastic member into a buffering force to relieve an impact and at the same time the adsorption through the adsorption unit 33 is made, and then the transfer unit 30 This rises and the separation process is completed.

At this time, when the heating member is separated by heating, if the hot air blown from the first heating unit 21 flows around the semiconductor chip to heat the peripheral components, damage to other components may occur.

12 and 14, the present invention further comprises a wind nozzle 35 to prevent the outflow of hot air around the adsorption portion 33 of the pickup nozzle 31.

The wind nozzle 35 has one side opening 35a in communication with the first heating unit, and a flange around the base nozzle 32 is detachable from the base 32, and the other opening 35b has a shape of the semiconductor chip. Preferably made correspondingly,

The wind nozzle 35 is preferably prepared by a plurality of different sizes of the lower opening 35b according to the size or shape of the semiconductor chip and replaced according to the semiconductor chip to perform the rework operation.

In the present invention, the process is preferably carried out after storing the separated semiconductor chip in a separate place for the automation of the rework work.

To this end, as shown in FIG. 13, the base 41 of the optical vision unit 40 is provided with an accommodating part 43 for accommodating a semiconductor chip.

The accommodating portion 43 is formed of four powders for accommodating semiconductor chips of various sizes, and spaced portions 44 are formed between the powders, and the stator 45 is inserted into the spaced portions and slidably moves. )

By shifting the positions of the stators, semiconductor chips having various sizes or shapes can be stably received.

Furthermore, the upper surface of the base block 41 of the optical vision unit 40 is preferably further provided with a guide groove 46 for adjusting the position before and after the accommodating portion 43.

The accommodating part 43 is disposed at the rear of the optical camera 42, and when the ascending of the transferring unit 30 is completed, the vision unit is a pickup nozzle of the accommodating part 43 and the transferring unit 30. 31 is advanced to the same line in the vertical direction, after which the transfer unit 30 is lowered to discharge the semiconductor chip separated in the accommodating portion (43).

When the optical vision unit 40 is received backward into the main body 10 after the separation process is completed, the remaining solder balls of the substrate are removed. At this time, the absorber having a size corresponding to the separated (or removed) semiconductor chip mounting position. Remove solder residue using.

The size of the absorber having a size 'corresponding' to the mounting position of the semiconductor chip may be larger than or equal to the mounting position from which the chip is removed depending on the working conditions, the type of PCB, the semiconductor chip, and the residue. If necessary, it means that the absorbent body smaller than the mounting site can be repeatedly contacted to absorb and remove the residue.

Such an absorber may be mounted to replace the adsorption part 33 provided in the pickup nozzle 31 of the transfer unit 30, or may be mounted and used in a separate lifting nozzle. The absorber may be an absorbent member having a porous heat-resistant body or a scratched contact surface.

Next, after semiconductor chip separation (or removal) and residue removal, a flux is applied to the PCB mounting unit to prevent damage due to bonding, and then the flocks around the mounting unit are removed.

When the operator inputs the operation again, the optical vision unit 40 advances again, and when the operator removes the semiconductor chip of the housing 43 and stores the new semiconductor chip in the housing 43, the transfer unit 30 ) Is lowered to adsorb new semiconductor chips and ascend.

Subsequently, the optical vision unit 40 retreats until the center of the camera 42 and the pickup nozzle 31 are aligned with each other in the vertical direction and then operate the optical camera 42.

As shown in FIG. 15, the monitor 60 interlocked with the camera 42 is drawn out from the main body 10 and is attached to the pick-up nozzle 31 by the operator by the lead part and the seating part of the semiconductor chip. The mounting pattern of the substrate of 14) is synthesized and shown.

In addition, the operator may check the lead unit and the mounting unit through the monitor 60, and adjust the rotation bar 52 and the moving levers to adjust the exact mounting position.

In this case, since the monitor 60 is necessary only when adjusting the position of the semiconductor chip and the substrate through the optical vision unit 40, the present invention has an entrance part 11 (see FIG. 9) in the main body 10. 60) is drawn out from the entrance, it is desirable to achieve the miniaturization of the BA rework system including the residue removal device, and to eliminate the spatial constraints according to the working environment.

The withdrawal means for withdrawing the monitor 60 may be made by pneumatic or hydraulic pressure, but when the pneumatic method is used, noise is inevitably generated, which hinders the working environment and makes it difficult to control the speed of the monitor. There is,

If the hydraulic method is used, there is a risk of an accident such as oil leakage at the site where the precision process is performed.

Accordingly, the present invention adopts an electronic motor method as the drawing means.

The electronic motor method can reduce the noise and has the advantage of very easy speed control according to the electronic control.

As described above, in the present invention, the first forward motion in which the forward motion of the optical vision unit 40 advances only to the optical camera 42 based on the same line in the vertical direction with the pickup nozzle 31 (FIG. 16). Of [B]) and the second forward motion ([C] of FIG. 16) to be advanced to the receiving portion 43,

The monitor 60 transmits an image in conjunction with the camera during the first forward movement,

It is preferable that the forward and backward movement of the optical vision unit 40 and the withdrawal movement of the monitor 60 are interlocked with each other through one power means.

The interlocking method may be achieved by using a gear coupling using one electric motor, but in order to separately control the optical vision unit 40 and the monitor 60 because the speed control of the optical vision unit 40 is required. Due to the complicated structure, manufacturing is difficult, and components for each control increase, which may hinder the purpose of increasing space utilization according to the slimming of the present invention.

In order to solve the above problems, the present invention provides a linked drawing means of the monitor 60 through the optical vision unit 40, as shown in Figs.

To this end, the optical vision unit 40 has a toothed portion 41A at both lower sides of the base 41, and the main body 10 is coupled to the toothed portion 41A to transfer the front of the optical vision unit 40. It is preferable to have an electric motor (not shown) including a gear for providing reverse power.

And, as shown in Figure 16, the present invention is the optical vision unit 40 interlocking withdrawal means,

The main body has a lifting rail (62) for lifting and lowering by sliding the coupling is coupled to the monitor (60) or the bracket (61) connected to the monitor (60),

A free sprocket 63 provided on one side of the optical vision unit 40,

A main sprocket 64 provided below the elevating rail 62 and connected to the electric motor to receive power;

Auxiliary sprocket 65 which is provided above the elevating rail 62 and

One side is connected to the free sprocket 63 and wound, and includes a timing belt 66 connected to the bracket 61 of the monitor 60 on the other side via the main sprocket 64 and the auxiliary sprocket 65; Is done.

The main sprocket 64 operates the timing belt 66 when the monitor 60 is moved up and down, that is, when the optical vision unit 40 moves forward, and the monitor 60 moves up and down together. Be sure to

At this time, the optical camera 42 and the moving distance of the first forward motion ([B] of FIG. 16) positioned on the same line in the vertical direction of the seating portion and the pickup nozzle 31,

The moving distance of the second forward motion ([C] of FIG. 16) in which the optical camera 42 has the accommodating portion 43 of the optical vision unit 40 is located on the same line is different,

Furthermore, since the moving distance of the second forward movement is longer than the moving distance of the first forward movement, the monitor 60 is drawn out of the main body 10 during the first forward movement, and the main body during the second forward movement. (10) Maintaining the state drawn out to the outside, and only when the optical vision unit 40 is retracted and stored in the main body 10 again through the entrance (11; see FIG. 9) of the main body 10 ( 10; see FIG. 15).

To this end, the interlocking extraction means rotates the main sprocket 64 in an external direction (clockwise in the drawing) during the first forward movement of the optical vision unit 40 (hereinafter, for convenience of description). The timing belt 66 drives the timing belt 66 to the outside of the main body 10, and the timing belt 66 raises and lowers the monitor 60 via the auxiliary sprocket 65.

At this time, the free sprocket 63 does not rotate and moves forward with the optical vision unit 40 while the timing belt 66 is wound.

When the optical camera 42 reaches the same line as the pickup nozzle 31, the lifting and lowering of the monitor 60 is completed. (See FIG. 16B).

Then, when the optical vision unit 40 performs the second forward motion for picking up or discharging the semiconductor chip, that is, when the accommodating part 43 has to reach the same line as the pickup nozzle 31, the transmission is performed. The motor advances the optical vision unit 40 toward the outside of the main body 10, wherein the main sprocket 64 does not rotate.

The other side of the timing belt 66 connected to the monitor 60 via the main sprocket 64 and the auxiliary sprocket 65 due to the main sprocket 64 which does not rotate is monitored while being restrained by the main sprocket 64. The elevated state of 60 is maintained,

One side of the timing belt 66 connected to the advance optical vision unit 40 does not affect the timing belt 66 linked with the monitor 60 while the portion wound around the free sprocket 63 is released.

As described above, the accommodating part 43 is capable of position adjustment, and when the accommodating part 43 is biased toward the inside of the main body 10, one side of the timing belt 66 wound around the free sprocket 63 is provided. If the winding length is insufficient, problems such as the timing belt 66 may be cut off, so that the length of one side of the timing belt 66 wound around the free sprocket 63 may be adjusted in consideration of the position adjustment length of the accommodating portion 43. It is preferable to form, and those skilled in the art will be able to sufficiently predict and reproduce.

When the second vision movement of the optical vision unit 40 is received again after completion, the electric motor retracts the optical vision unit 40, and at this time, the main sprocket 64 remains stopped. do.

Therefore, the free sprocket 63 is retracted by rewinding one side of the timing belt 66 by the retracting optical vision unit 40, and the optical camera 42 picks up the completed position of the first forward motion. The main sprocket 64 starts to reverse rotation (counterclockwise rotation in the drawing) at the time when the nozzle 31 is in the same line as the nozzle 31 and the timing belt 66 is driven in the main body 10 in the free direction. The timing belt 66 is no longer wound around the sprocket 63, and the monitor 60 connected to the other side of the timing belt 66 is supported by the timing belt 66 descending by the auxiliary sprocket 65. It is housed inside the main body 10 by its own weight.

Through the interlocking withdrawal means of the above-described monitor 60, the present invention enables the extraction of the optical vision unit 40 and the monitor 60 through one electric motor without the need for complicated mechanical structure, and furthermore, only one electric motor The speed can be controlled by electrical control to provide convenience to both the manufacturer and the user.

The other configuration omitted while explaining the above-described interlocking withdrawal means such as the control and rotation connection method of the main sprocket 64 can be easily implemented through a microcomputer and an electric motor by including a position sensing sensor in the optical vision unit 40. Those skilled in the art will be able to sufficiently predict and reproduce.

As described above, the optical vision unit 40 transmits an image to the monitor 60, and the transmission line connecting the optical vision unit 40 and the monitor 60 to the electrical wiring 67. If it is implemented by simply connecting the wires, the electrical wiring may be entangled or broken by repeated drawing out of the optical vision unit 40 and the monitor 60.

Accordingly, the present invention includes a chain portion having a wire storage portion 66A on the outer surface of the timing belt 66, that is, the other side of the coupling surface with the sprockets, and embeds the above-described electrical wiring in the storage portion 66A. In this way, the movement of the timing belt 66 can be performed, thereby protecting the electrical wiring and simplifying the structure inside the main body 10, thereby facilitating maintenance and repair of the equipment.

When the mounting position adjustment is completed through the monitor, the operator inputs a resume resume operation, and the BA rework system including the residue removing device of the present invention receives the optical vision unit 40 and the monitor and then transfers the transfer unit 30. ) Is lowered to transfer the semiconductor chip to the mounting unit, and then the heating member is operated to mount the semiconductor chip on the substrate.

In this case, the sole balls forming the lead portion of the semiconductor chip may be made of various materials. Representative materials are lead or conductive materials including lead, and lead components are considered in consideration of odor caused by lead heating and worker's health. Solder balls of a variety of materials, such as a conductive material that does not contain a.

In addition, since various kinds of solder balls have different melting speeds and melting temperatures, it is difficult for an operator to optimize a heating temperature and time through the heating member.

Accordingly, the present invention introduces an auto profile system so that a user can easily adjust the temperature and time setting of the heating member.

To this end, as shown in FIG. 14, the seating part 14 of the present invention further includes a room temperature sensor 28 formed adjacent to the semiconductor chip and capable of detecting real-time temperature change information of the semiconductor chip during a separation or bonding process. Made, including

The microcomputer embedded in the main body 10 may store the real-time temperature information collected by the sensor 28 in the storage unit during the maximum separation process of the semiconductor chip.

That is, when the semiconductor chip is first separated, the actual temperature of the semiconductor chip by the heating member is measured and stored, and the microcomputer shows the stored temperature change information to the worker through the display panel 12.

The operator readjusts the temperature and time of the heating element based on the temperature change information checked through the display panel 12 to enable the optimal heating setting according to the semiconductor chip, thereby setting it up during subsequent rework of the same type of semiconductor chip. By separating or combining the semiconductor chips at the optimum temperature without changing the conditions.

The present invention can shorten the time according to the rework operation, eliminate the defective process can reduce the cost burden of the rework operation.

The microcomputer converts the stored temperature change information into a graph over time and sends the same to the monitor 60. The microcomputer not only changes the temperature through the room temperature sensor 28 but also the first heating unit 21 and the second heating unit 25. By graphing the temperature change together and sending it out,

The operator can more easily set the optimum heating conditions.

In the above description, the concrete process of the BA rework, the robot for conveying the automation of the process, the specific configuration of the transfer device, the heating member for removing the residue or the fan and heater specifications of the hot air gun, the hot air gun and the heating member by the microcomputer, Although conventionally known techniques related to specific control flows such as a display unit and an operation unit are omitted, those skilled in the art can easily infer, infer, and reproduce them.

In the above description of the present invention with reference to the accompanying drawings has been described mainly for the SWD rework hot air apparatus having a specific shape and structure, the present invention is capable of various modifications, changes and substitutions by those skilled in the art, such modifications, changes And substitutions should be interpreted as falling within the protection scope of the present invention.

{ Description of main drawing reference numerals related to the first drawing group (i) of FIGS . 1 to 5 }
A: hot air device 10: main body
11: display unit 13: control panel
15: port 17: micom
20: hot air 21: fan
23: electric heater 25: jamming
27: hot air outlet 29: nozzle
30: holder 31: locking groove
33: swing shaft 40: heating member (iron)
41: Plug 50: Stand
51: mounting member 53: storage unit
55: settlement
{ Description of main drawing reference numerals related to the third drawing group ( iii ) of FIGS . 9 to 16 }
P: Substrate B: Semiconductor Chip
10: main body 11: entrance
12: display panel 13: lower station
14: seating part
21: first heating unit 22: the first sensor
25: second heating unit 26: second sensor
27: third heating unit 28: room temperature sensor
30: transfer unit 31: pickup nozzle
32: base 33: adsorption part
35: windproof nozzle 36: housing
40: optical vision unit 42: optical camera
43: storage
50: position adjusting means 51: first adjusting unit
52: rotation bar 53: second adjusting unit
57: moving lever
60: monitor

Claims (4)

It is to remove solder residue after lifting the semiconductor chip from the PCB to be repaired.
Absorber having a size corresponding to the size of the semiconductor chip separation site of the PCB;
A heating member for melting the remaining residue on the PCB;
BA rework system comprising a residue removal device comprising a. The method of claim 1,
The absorber is a BA rework system, characterized in that the porous heat-resistant body. The method of claim 1,
The absorber is a BA rework system, characterized in that the absorbent member having a scratched contact surface. The method according to any one of claims 1 to 3,
A BA rework system, characterized in that the tip of the heating member has a size corresponding to the absorber size.

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