KR102581197B1 - Surface mount type semiconductor chip manual rework equipment - Google Patents

Abstract

A surface mount type semiconductor chip manual rework device is disclosed. The present invention comprises a table whose size can be changed in response to the size of a substrate to firmly fix substrates of various sizes when selectively accepting the substrates. Accordingly, it is possible to facilitate semiconductor chip rework on substrate surfaces of different sizes with a single rework equipment and also to improve the inconvenience of having to replace a rework tool when reworking semiconductor chips mounted on the surface of different substrates. The rework device includes a main body and a heating part.

Description

Surface mount type semiconductor chip manual rework equipment}

The present invention relates to rework technology for surface-mounted semiconductor chips, and more specifically, to enable fixation of substrates of various sizes and to facilitate rework of semiconductor chips mounted on the surface of a substrate. This relates to a surface-mounted semiconductor chip manual rework device.

In general, semiconductor chips with more than a few hundred pins have limitations in the old-fashioned mounting method of soldering them in rows on the back of the board, so surface-mounted semiconductor chips such as BGA (Ball Grid Array) or SMD (Surface Mount Device) are used instead. Substrate manufacturing technology is widely used.

However, when semiconductor chips are mounted on the surface of a substrate in the same manner as the BGA or SMD, defect problems such as short, reverse insertion, misinstallation (mounting in the wrong position), and non-delivery (non-mounting) occur. Alternatively, if a functional problem occurs in the semiconductor chip due to long-term use of the product, it is very advantageous to repair the board by replacing only the semiconductor chip in which the problem occurred, as it can reduce costs for the manufacturer or product user.

Accordingly, in the past, as in Patent Registration No. 10-1702104, an automatic rework device that automatically replaces only semiconductor chips with problems was disclosed.

However, the above-mentioned pre-registered patent states that with the substrate mounted on the substrate mounting table, the substrate mounting table is moved to the X-axis or Y-axis by the Not only is the size of the substrate mounted on the substrate mounting table inevitably limited, but when the substrate is placed on the substrate mounting table, it is not properly fixed, and the substrate moves when replacing a semiconductor chip on the substrate. There is a problem, and this is that errors are bound to occur when installing a new semiconductor chip on a board.

In addition, the automatic rework device of the prior art as described above is an expensive equipment and is limited by the size of the board or the mechanism attached to the board, so additional costs for manufacturing a separate jig are incurred depending on the size of the board, and the cost of manufacturing a separate jig is incurred depending on the size of the board. When reworking a semiconductor chip mounted on the surface, there is a disadvantage that automatic reworking of the semiconductor chip is possible only when the rework mechanism is replaced.

Registered Patent Publication No. 10-1702104 (announcement date 2017.02.02.)

The problem that the present invention aims to solve is to construct a table that can change size in response to the size of the substrate so that it can be firmly fixed when selectively accepting substrates of various sizes, so that substrates of different sizes can be manufactured with a single rework equipment. The purpose is to provide a surface-mounted semiconductor chip manual rework device that allows rework of semiconductor chips mounted on the surface of the device to be easily performed.

The surface-mounted semiconductor chip manual rework device, which is a means of solving the problem of the present invention, allows a board on which a semiconductor chip is surface-mounted to be manually seated by an operator, as long as it faces a pair of opposing X-axis rails. a main body portion in which a pair of Y-axis rails are respectively formed; A movable substrate table on which the substrate is mounted, which moves linearly along the X-axis rail formed at the top of the main body; A substrate fixing part that moves linearly along the Y-axis rail formed at the top of the main body and pressurizes and fixes the substrate seated on the substrate table; and a heating part formed on the bottom side of the substrate table in the main body and applying heat to separate or combine semiconductor chips surface mounted on the substrate. It includes a substrate table that moves along the It includes a bar-shaped moving block, and the substrate fixing part is a clamp structure whose length is variable according to the substrate seating surface that expands or contracts as the moving block moves and maintains an adjacent or spaced apart distance.

In addition, a plurality of fixing pins are protruded in a row on the upper surface of the moving block to hold the center of the substrate.

In addition, the substrate fixing part includes a moving frame movably coupled to the Y-axis rail; An operating lever rotatably hinged to the moving frame; A pressure rod that presses and fixes the substrate while expanding or contracting as the operation lever rotates, forming a buffer at the end; and a connecting rod that is hinged to connect the operation lever and the pressure rod and guides expansion or contraction of the pressure rod when the operation lever rotates. Including, wherein the pressing rod is a fixed rod hinged to the connecting rod; a movable rod on which the buffer part is formed by being stored in or pulled out from the fixed rod; And, a fixing part for fixing the movable rod stored in the fixed rod or pulled out from the fixed rod; It includes.

In addition, the heating unit is divided into a plurality of heating blocks to selectively apply heat to the substrate seating surface that is enlarged or reduced while maintaining adjacent or spaced apart distances as the moving block moves, and the plurality of heating blocks are They are turned on or off by control switches that are matched 1:1.

In addition, an optical camera controlled by a control unit to photograph the substrate table on which the substrate is mounted, and a monitor to display image information captured by the optical camera are formed in the main body.

In addition, the main body further includes a temperature sensor that detects a real-time temperature change of the semiconductor chip during a heating operation of the heating unit and outputs the change to the control unit.

In addition, the front of the main body further includes a control unit that allows checking the work status through the monitor while inputting a command signal for rework work.

In this way, the surface-mounted semiconductor chip manual rework device of the present invention is configured with a table whose size can be changed according to the size of the substrate to firmly fix substrates of various sizes when selectively receiving them, and through this, one rework device can be installed. Work equipment not only makes it easy to rework semiconductor chips on the surfaces of boards of different sizes, but also inconveniences the need to replace the rework equipment when reworking semiconductor chips mounted on the surfaces of different boards. The effect of improving performance can be expected.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

Figure 1 is a perspective view showing the structure of a surface-mounted semiconductor chip manual rework device according to an embodiment of the present invention.
Figure 2 is a schematic block diagram of a surface-mounted semiconductor chip manual rework device according to an embodiment of the present invention.
Figure 3 is an enlarged cross-sectional schematic diagram showing a state in which the length of the substrate fixing part is reduced in an embodiment of the present invention.
Figure 4 is an enlarged cross-sectional schematic diagram showing a state in which the length of the substrate fixing part is enlarged according to an embodiment of the present invention.
Figure 5 is a plan schematic diagram showing a state in which a substrate of a first size is seated on a first substrate seating surface formed of a single moving block according to an embodiment of the present invention.
Figure 6 is a side schematic view of Figure 5 in an embodiment of the present invention.
Figure 7 is a plan schematic diagram showing a state in which a substrate of a second size larger than the first size is seated on a second substrate seating surface formed of two moving blocks according to an embodiment of the present invention.
Figure 8 is a side schematic view of Figure 7 in an embodiment of the present invention.
Figure 9 is a plan schematic diagram showing a state in which a substrate of a third size larger than the second size is seated on a third substrate seating surface formed by three moving blocks according to an embodiment of the present invention.
Figure 10 is a side schematic view of Figure 9 in an embodiment of the present invention.
Figure 11 is a plan schematic diagram showing a state in which a substrate of a fourth size larger than the third size is seated on a fourth substrate seating surface formed by four moving blocks according to an embodiment of the present invention.
Figure 12 is a side schematic view of Figure 11 in an embodiment of the present invention.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the embodiments of the technical idea of the present invention are not limited to the embodiments disclosed below, but may be implemented in various different forms, and the present embodiments are only provided to ensure that the disclosure of the present invention is complete, and to the technology to which the present invention pertains. It is provided to fully inform those skilled in the art of the scope of the invention, and is only defined by the scope of the claims in the embodiment of the technical idea of the present invention.

The terminology used herein is for describing embodiments and is not intended to limit the invention. As used herein, singular forms also include plural forms, unless specifically stated otherwise in the context.

In this specification, terms such as “comprise” or “have” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to indicate the presence of one or more other features. It should be understood that this does not exclude in advance the possibility of the existence or addition of elements, numbers, steps, operations, components, parts, or combinations thereof.

Additionally, embodiments described in this specification will be described with reference to cross-sectional views and/or plan views, which are ideal illustrations of the present invention. Accordingly, embodiments of the present invention are not limited to the specific form shown, but also include changes in form as necessary. For example, an area shown as a right angle may be rounded or have a shape with a predetermined curvature. Accordingly, the regions illustrated in the drawings have schematic properties, and the shapes of the regions illustrated in the drawings are intended to illustrate specific shapes of regions of the device and are not intended to limit the scope of the invention.

The same reference numerals refer to the same elements throughout the specification. Accordingly, the same or similar reference signs may be described with reference to other drawings even if they are not mentioned or described in the corresponding drawings. Additionally, even if reference signs are not indicated, description may be made with reference to other drawings.

Hereinafter, embodiments of the present invention will be described with reference to the attached drawings.

Figure 1 is a perspective view showing the structure of a surface-mounted semiconductor chip manual rework device as an embodiment of the present invention, and Figure 2 is a schematic block diagram of a surface-mounted semiconductor chip manual rework device as an embodiment of the present invention. , Figure 3 is an enlarged cross-sectional schematic diagram showing a state in which the length of the substrate fixing part is reduced in an embodiment of the present invention, and Figure 4 is an enlarged cross-sectional schematic diagram showing a state in which the length of the substrate fixing part is enlarged in an embodiment of the present invention. It is shown.

Referring to the accompanying FIGS. 1 to 4, in the surface-mounted semiconductor chip manual rework device according to an embodiment of the present invention, a substrate 100 on which a semiconductor chip (not shown) is surface-mounted is manually seated by an operator. In order to be fixed, the main body 10 includes a substrate table 20, a substrate fixing unit 30, a heating unit 40, a control unit 50, and an operating unit 60, and/or an optical camera. (70), a monitor (80), and a temperature sensor (90) may be further included.

The main body 10 is formed on the upper surface so that a pair of X-axis rails 11 facing each other in the It is done.

That is, in a state where a pair of facing fixed frames 10a forming a symmetrical structure are formed on the left and right sides of the upper surface of the main body 10, the rod-type above is attached to the facing pair of fixed frames 10a. Both ends of the

The substrate table 20 moves linearly along the , 22a, 23a, and 24a), respectively, and consists of a plurality of bar-shaped moving blocks (21, 22, 23, 24).

Here, the bar-shaped moving blocks 21, 22, 23, and 24 move along the It is possible to provide a reduced substrate seating surface (S1, S2, S3, S4).

For example, a substrate 100a of a first size, a substrate 100b of a second size larger than the first size, a substrate 100c of a third size larger than the second size, and a substrate 100c of a third size larger than the third size. Semiconductor chips are surface-mounted on substrates 100d of each size, and the first size has a first substrate seating surface (S1), the second size has a second substrate seating surface (S2), and the third size has a semiconductor chip. It is assumed that a third substrate seating surface (S3) is required for , and a fourth substrate seating surface (S4) is required for the fourth size.

Therefore, when the substrate 100a of the first size is seated at the rework work position and the rework work is performed, the first size substrate 100a is seated on a single surface that provides the first substrate seating surface S1 as shown in Figures 5 and 6 attached. It can be seated on the moving block (21).

That is, only one moving block 21 is moved to the rework work position, and the other moving blocks 22, 23, and 24 are moved away from the rework work position while maintaining a distance from the rework work position.

On the other hand, when the board 100b of the second size is seated at the rework work position and the rework work is performed, two boards are used to provide a second board seating surface S2 as shown in FIGS. 7 and 8 attached thereto. The moving blocks 21 and 22 can be placed side by side and placed adjacent to each other.

That is, only the two moving blocks 21 and 22 are moved to the rework work position, and the other moving blocks 23 and 24 are moved away from the rework work position while maintaining a distance from the rework work position.

In addition, when the substrate 100c of the third size is seated at the rework work position and the rework work is performed, the third size substrate 100c is seated on three surfaces to provide a third substrate seating surface S3 as shown in Figures 9 and 10 attached. The moving blocks 21, 22, and 23 can be placed side by side and placed adjacent to each other.

That is, only the three moving blocks 21, 22, and 23 are moved to the rework work position, and the other moving blocks 24 are moved away from the rework work position while maintaining a distance from the rework work position.

In addition, when the fourth size substrate 100d is seated at the rework work position and the rework work is performed, the fourth size substrate 100d is seated on four surfaces to provide a fourth substrate seating surface S4 as shown in Figures 11 and 12 attached. The movable blocks (21, 22, 23, 24) can be placed side by side and seated on top of each other so that they are adjacent to each other.

Here, a plurality of fixing pins (21b, 22b, 23b, 24b) are provided on the upper surfaces of the moving blocks (21, 22, 23, 24) to hold the center of the substrate (100; 100a, 100b, 100c, 100d), respectively. can be formed to protrude in a row.

That is, the fixing pins (21b, 22b, 23b, 24b) are positioned at the seating position when the substrate (100; 100a, 100b, 100c, 100d) is placed on the moving block (21, 22, 23, 24). You can catch it.

The substrate fixing unit 30 moves linearly along the Y-axis rail 12 formed at the top of the main body 10, and presses and fixes the substrate 100 seated on the substrate table 20. This means that the moving blocks (21, 22, 23, 24) move and have variable length depending on the substrate seating surfaces (S1, S2, S3, S4) that are enlarged or reduced while maintaining adjacent or spaced apart intervals. It could be a clamp structure.

That is, the substrate fixing part 30 is a typical clamp structure and includes a moving frame 31 movably coupled to the Y-axis rail 12, and an operating lever rotatably hinged to the moving frame 31 ( 32), a pressure rod 33 with a buffer portion 33a formed at the end to pressurize and fix the substrate 100 while expanding or contracting according to the rotation of the operating lever 32, the operating lever 32, and It includes a connecting rod 34 that is hinged to connect the pressure rod 33 and guides the expansion or contraction of the pressure rod 33 when the operation lever 32 rotates. The buffer portion 33a is formed by a fixed rod 331 hinged to the connecting rod 34, and a single or plural fixed rod 331 received in or pulled out from the fixed rod 331. It further includes movable rods 332 and 332', and a fixing part 333 that secures the movable rods 332 and 332' stored in the fixed rod 331 or pulled out from the fixed rod 331. It can be configured.

Therefore, a moving block (100; 100a, 100b, 100c, 100d) having different sizes provides enlarged or reduced substrate seating surfaces (S1, S2, S3, S4) while maintaining adjacent or spaced apart intervals. When seated on 21, 22, 23, 24, the pressure rod 33 included in the substrate fixing portion 30 is pulled out from the fixed rod 331 due to the linear movement of the moving rods 332 and 332'. While being stored in the fixed rod 331, the length is maintained long or ?E.

For example, as shown in the attached FIGS. 5 and 6, when the substrate 100a having the first size is seated on the substrate seating surface S1 provided by one moving block 21, the substrate on the left side based on the drawing is The top 30 can be fixed by pressing the left edge of the substrate 100a through the pressure rod 33, but based on the drawing, the substrate fixing part 30 on the right side can press the substrate 100a through the pressure rod 33. It was not possible to pressurize the right edge of 100a).

Accordingly, when the movable rods 332 and 332' constituting the pressing rod 33 included in the substrate fixing unit 30 on the right side are pulled out and extended to the left in length to the maximum, the movable rods 332 and 332' ) is capable of pressing and fixing the right edge of the substrate 100a.

On the contrary, when the substrate 100d having the fourth size is seated on the substrate seating surface S4 provided by the four moving blocks 21, 22, 23, and 24 as shown in the attached FIGS. 11 and 12, based on the drawings In this way, both the left and right substrate fixing parts 30 can be fixed by pressing the left and right edges of the substrate 100d through the pressure rod 33.

In other words, each corner of the substrate 100d can be pressed and fixed even without pulling out the moving rods 332 and 332' included in the pressing rod 33.

Meanwhile, the substrate seating surfaces (S2, S3) provided by two or three moving blocks (21, 22 or 21, 22, 23) as shown in Figures 7 and 8, and Figures 9 and 10, respectively. When the second size substrate 100b or the third size substrate 100c is seated on the left side based on the drawing, the substrate fixing part 30 is pressed without pulling out the moving rods 332 and 332'. The left edge of the substrate 100b or 100c can be fixed by pressing it through the rod 33, but based on the drawing, the substrate fixing part 30 on the right side can be fixed by pressing the substrate 100b or 100c through the pressing rod 33. It was not possible to pressurize the right edge of .

Accordingly, when the pull-out length of the movable rods 332 and 332' constituting the pressure rod 33 included in the substrate fixing unit 30 on the right side is adjusted, the buffer formed on the movable rods 332 and 332' The part 33a may press and secure the right edge of the substrate 100b or 100c.

On the other hand, when each corner of the upper surface of the substrate 100 (100a, 100b, 100c, 100d) is pressurized and fixed through the substrate fixing part 30, a protrusion is formed on the moving blocks 21, 22, 23, and 24. The fixing pins (21b, 22b, 23b, 24b) press the lower surface of the substrate (100; 100a, 100b, 100c, 100d), and the substrate (100; 100a, 100b, 100c, 100d) is positioned at the rework work position. Even if heat is applied due to the heating operation of the heating unit 40, a stable fixed state can be maintained.

The heating unit 40 is formed on the bottom side of the substrate table 20 (21, 22, 23, 24) in the main body 10, and is surface mounted on the substrate 100 (100a, 100b, 100c, 100d). Heat is applied to separate or combine the semiconductor chips, which are divided into a plurality of heating blocks (41, 42, 43), and the moving blocks (21, 22, 23, 24) move to be adjacent or spaced apart. Heat is selectively applied to the substrate seating surfaces (S1, S2, S3, and S4) that expand or contract while maintaining the gap.

That is, the plurality of heating blocks 41, 42, and 43 can be selectively controlled on or off by control switches 41a, 42a, and 43a that are matched 1:1.

For example, when the substrate seating surface is reduced, only one or two heating blocks (41 and/or 42) may be turned on, and when the substrate seating surface is enlarged, all of the heating blocks (42, 42, and 43) may be turned on. This can be achieved through selective manipulation of the control switches 41a, 42a, and 43a.

Here, the control switches 41a, 42a, and 43a may be configured on the operating unit 60 formed on the front of the main body 10.

The control unit 50 not only controls the heating blocks 41, 42, and 43 according to the operation signals of the control switches 41a, 42a, and 43a, but also controls the optical camera 70 and the monitor 80. It's something you can control.

The optical camera 70 is a vision camera that is installed on the support frame 10b formed at the upper end of the main body 10 and photographs the rework work location, and the monitor 80 is the optical camera 70. It can be configured to display image information captured by , and since this corresponds to a known technology in rework equipment, detailed description thereof will be omitted below.

Meanwhile, the main body 10 may be configured with the temperature sensor 90, and the temperature sensor 90 measures the real-time temperature of the semiconductor chip during the heating operation of the heating unit 40 (41, 42, 43). After detecting the change, it is output to the control unit 50. Accordingly, the control unit 50 operates the heating unit 40; 41, 42, 43 according to the amount of temperature change detected by the temperature sensor 90. By controlling the heating operation, the temperature of the heat applied to the substrate 100 (100a, 100b, 100c, 100d) can be adjusted.

That is, the surface-mounted semiconductor chip manual rework device according to an embodiment of the present invention is divided according to the size of the substrate 100 (100a, 100b, 100c, 100d), as shown in FIGS. 1 to 12 attached. The size of the substrate (100; 100a, 100b, 100c, 100d) is adjusted by selectively moving the table (20; 21, 22, 23, 24) along the Provides a correspondingly reduced or enlarged substrate seating surface (S1 and/or S2 and/or S3 and/or S4), while reducing or enlarging the substrate seating surface (S1 and/or S2 and/or S3 and/or A pressure rod (100; 100a, 100b, 100c, 100d) that moves linearly along the fixing pins (21b, 22b, 23b, 24b) and the Y-axis rail (12) at each corner of the bottom and top surfaces of the substrate (100; 100a, 100b, 100c, 100d) seated on S4) It is stably pressurized and fixed using the buffer portion 33a of 33).

Then, the semiconductor chip surface-mounted on the substrate (100; 100a, 100b, 100c, 100d) is separated or remounted while simultaneously or selectively applying heat from the divided heating units (40; 41, 42, 43). This can be easily accomplished.

That is, in the embodiment of the present invention, semiconductor chip rework work can be easily performed on the surfaces of substrates 100 (100; 100a, 100b, 100c, 100d) having different sizes with a single rework equipment, as well as different This can improve the inconvenience of having to replace the rework mechanism (e.g. jig, etc.) when reworking the semiconductor chip mounted on the surface of the substrate 100 (100a, 100b, 100c, 100d).

In the above, the technical idea of the surface-mounted semiconductor chip manual rework device of the present invention has been described along with the accompanying drawings, but this is an exemplary description of the best embodiment of the present invention and does not limit the present invention.

Accordingly, the present invention is not limited to the specific preferred embodiments described above, and various modifications may be made by anyone skilled in the art without departing from the gist of the present invention as claimed in the claims. Of course, such changes are possible and fall within the scope of the claims.

10; body part 11; X-axis rail
12; Y-axis rail 20; board table
21, 22, 23, 24; Moving blocks 21a, 22a, 23a, 24a; rail joint
21b, 22b, 23b, 24b; fixing pin 30; board fixing part
31; moving frame 32; operating lever
33; Pressure rod 33a; shock absorber
331; fixed rod 332, 332'; moving rod
333; Fixing part 34; connecting rod
40; Heating units 41, 42, 43; Heating block
41a, 42a, 43a; control switch 50; control unit
60; control unit 70; optical camera
80; monitor 90; temperature Senser
100,100a,100b,100c,100d; Substrates S1, S2, S3, S4; Board seating surface

Claims (5)

A main body portion in which a pair of opposing A movable substrate table on which the substrate is mounted, which moves linearly along the X-axis rail formed at the top of the main body; A substrate fixing part that moves linearly along the Y-axis rail formed at the top of the main body and pressurizes and fixes the substrate seated on the substrate table; and a heating part formed on the bottom side of the substrate table in the main body and applying heat to separate or combine semiconductor chips surface mounted on the substrate. Includes,
The substrate table moves along the Contains blocks,
A surface-mounted semiconductor chip manual rework device, characterized in that the substrate fixing part is a clamp structure whose length is variable according to the substrate seating surface that expands or contracts as the moving blocks move and maintain adjacent or spaced apart intervals. According to claim 1,
A surface-mounted semiconductor chip manual rework device, characterized in that a plurality of fixing pins are protruded in a row on the upper surface of the moving block to hold the center of the substrate. According to claim 1,
The substrate fixing unit includes a moving frame movably coupled to the Y-axis rail; An operating lever rotatably hinged to the moving frame; A pressure rod that presses and fixes the substrate while expanding or contracting as the operation lever rotates, forming a buffer at the end; and a connecting rod that is hinged to connect the operation lever and the pressure rod and guides expansion or contraction of the pressure rod when the operation lever rotates. Including,
The pressure rod includes a fixed rod hinged to the connecting rod; a movable rod on which the buffer part is formed by being stored in or pulled out from the fixed rod; And, a fixing part for fixing the movable rod stored in the fixed rod or pulled out from the fixed rod; A surface-mounted semiconductor chip manual rework device comprising a. According to claim 1,
The heating unit is divided into a plurality of heating blocks to selectively apply heat to the substrate seating surface, which is enlarged or reduced while maintaining adjacent or spaced apart distances as the moving blocks move,
A surface-mounted semiconductor chip manual rework device, characterized in that the plurality of heating blocks are turned on or off by control switches that are matched 1:1. According to claim 4,
The main body portion is formed with an optical camera controlled by a control unit that photographs the substrate table on which the substrate is mounted, and a monitor that displays image information captured by the optical camera,
A surface-mounted semiconductor chip manual rework device, characterized in that the main body further includes a temperature sensor that detects real-time temperature changes of the semiconductor chip during a heating operation of the heating unit and outputs the output to the control unit.

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