JP2008188727A - Alignment method and its apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an alignment method and its apparatus improving work efficiency and suppressing variation of quality by incorporating them into various types of processors. <P>SOLUTION: A substrate 11 to be processed and having an alignment mark 12, is mounted on each of a plurality of adsorption tables 3 arranged on a stage 2. On the basis of position data of the alignment mark 12 of the substrate 11, provided by imaging it by a camera 10 for alignment mark imaging, alignment mechanisms arranged around each adsorption table 3 are controlled. The substrate 11 is controlled in X, Y, θ directions via alignment pins 4d, 6d, 8d of movement control units 4, 6, 8, and pusher pins 5d, 7d, 9d of movement support units 5, 7, 9 composing the alignment mechanisms so as to carry out alignment. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an alignment method and apparatus, and more particularly to a method and apparatus for aligning a substrate to be processed provided with alignment marks.

  Conventionally, as a method of cutting a glass substrate used for a liquid crystal display panel or the like, for example, a cutting method (hereinafter also referred to as scribe) as shown below has been proposed. As shown in FIG. 5, a work (glass substrate) W on which alignment marks are formed is placed on tables Tx, Ty, and Tθ that are movable in the X, Y, and θ directions, respectively, and are placed at predetermined positions. The alignment mark of the workpiece W is imaged by the arranged camera 50, and the position of the alignment mark is calculated by data processing of the obtained image. The calculated position data of the alignment mark is compared with position data set in advance so as to correspond to the normal position, and based on the difference, each of the tables Tx, Ty, Tθ is changed to the X, Y, and θ directions. To move the workpiece W to a predetermined position.

  Thereafter, the workpiece W is scribed in the X direction by the cutter wheel chip 52 rotatably supported by the chip holder 51 while reciprocating the table Tx in the X direction. At that time, when the scribe direction is changed, the chip holder 51 is corrected to a position corresponding to the scribe interval, and the cutter wheel chip 52 supported by the chip holder 51 by rotating the chip holder 51 by 180 ° corresponds to the scribe direction. Directed in the direction.

When scribing in the X direction with respect to the workpiece W is completed in this way, the table Tθ is rotated by 90 °, and the workpiece W is scribed in the Y direction by the same procedure as the above-described X direction scribing, so that one workpiece W is scribed. The scribing process is completed (see, for example, Patent Document 1).
JP 2000-1119030 A

  By the way, when scribing a plurality of workpieces (glass substrates) W by the glass scribing method, a method of scribing by placing the workpieces W on the tables Tx, Ty and Tθ and the tables Tx, Ty and Tθ. A method of sequentially scribing a plurality of glass substrates placed thereon can be considered.

  In the former case, the waste of labor and time associated with the replacement work of each workpiece W reduces work efficiency, whereas in the latter case, the work efficiency is better than the former, but scribing is performed. Prior to scribing for each workpiece W, it is necessary to align the table by moving it in the X, Y, and θ directions, which causes time loss due to mechanical movement of the tables Tx, Ty, and Tθ during alignment. Will do.

  Therefore, the present invention was devised in view of the above problems, and an object of the present invention is to provide an alignment method and apparatus for improving work efficiency and suppressing quality variation by being incorporated in various processing apparatuses. It is to provide.

In order to solve the above-mentioned problem, the invention described in claim 1 of the present invention aligns the substrates to be processed placed on each of the plurality of tables arranged on the stage at regular positions. An alignment method comprising:
(1) placing a substrate to be processed on which an alignment mark is formed on each of a plurality of tables disposed on a stage;
(2) Based on a difference between position data obtained from an image obtained by imaging an alignment mark formed on the substrate to be processed with an alignment mark imaging camera and position data set in advance so as to correspond to a normal position. Adjusting the position of the substrate to be processed by controlling the alignment mechanism to reduce the difference in the position data;
(3) repeating the step (2) until the difference between the position data is within a preset range;
(4) The method includes the steps (2) and (3) for all the substrates to be processed placed on the table.

  According to the second aspect of the present invention, in the step (1) of the first aspect, the table is provided with a plurality of suction holes, and the substrate to be processed moves on the table. It is characterized by being placed freely.

  According to a third aspect of the present invention, in the second aspect of the present invention, the substrate to be processed placed on the table is the suction substrate after completion of the step (3) for each of the substrate to be processed. Air is sucked from the hole and is adsorbed and fixed on the table.

  Moreover, the invention described in claim 4 of the present invention is that, in any one of claims 1 to 3, the stage is linearly movable in a direction in which the plurality of tables are mounted, Each of the substrates to be processed is transported by the movement of the stage to a position where alignment is performed.

The invention described in claim 5 of the present invention is an alignment apparatus that aligns the substrates to be processed placed on each of a plurality of tables disposed on the stage at regular positions. ,
A stage that can move linearly;
A plurality of tables arranged in the moving direction of the stage on the stage, each for placing a substrate to be processed;
An alignment mechanism which is disposed at an opposing position of each table and moves the substrate to be processed in the X, Y, and θ directions;
A pair of alignment mark imaging cameras for imaging a pair of alignment marks formed on the substrate to be processed, disposed above the table;
With respect to the substrates to be processed placed on the respective tables, each of the pair of alignment marks formed on the substrate to be processed was imaged by each of the pair of alignment mark imaging cameras, and obtained from the captured images. The position of the substrate to be processed is adjusted by controlling the alignment mechanism based on the difference between the position data and the position data set in advance so as to correspond to the normal position, and the difference in the position data is reduced. The alignment is completed by repeating the reduction of the position data until the difference between the position data reaches a preset range.

  According to a sixth aspect of the present invention, in the fifth aspect, the table is provided with a plurality of suction holes, and the substrate to be processed is movably mounted on the table. It is characterized by that.

  The invention described in claim 7 of the present invention is that, in claim 6, the substrate to be processed placed on the table has air from the suction holes after alignment of each of the substrates to be processed is completed. It is sucked and fixed on the table by suction.

  Moreover, the invention described in claim 8 of the present invention is that, in any one of claims 5 to 7, each table is a position where the substrate to be processed placed on the table is aligned. It is conveyed by the movement of the stage.

  In the alignment apparatus of the present invention, a substrate to be processed placed on each of a plurality of stages placed on a table is aligned with a normal position on the stage.

  As a result, it is possible to increase the processing speed by incorporating the alignment apparatus of the present invention into various processing apparatuses, so that the work efficiency is improved and the uniformity of the processing can be ensured, so that the variation in quality can be reduced. This is an excellent effect.

  Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 to 4 (the same parts are given the same reference numerals). The embodiments described below are preferable specific examples of the present invention, and thus various technically preferable limitations are given. However, the scope of the present invention particularly limits the present invention in the following description. As long as there is no description of the effect, it is not restricted to these aspects.

  FIG. 1 is a perspective view showing an alignment apparatus according to this embodiment. In addition, each direction of X, Y, Z, and (theta) described in the following description respond | corresponds to the direction shown by the arrow in the figure.

  The alignment apparatus 1 has a suction table 3 fixed on a stage 2 that slides linearly in a predetermined direction (Y direction) on a floor (not shown) fixed to a floor surface or apparatus. The suction table 3 is provided with a number of suction holes (not shown).

  Then, a pair of movement control units 4 and a movement support unit 5 are disposed on the outside of the suction table 3 so as to face each other with the suction table 3 interposed therebetween. Similarly, the pair of movement control units are sandwiched between the suction table 3. 4 and two pairs of movement control unit 6 and movement support unit 7, and movement control unit 8 and movement support unit 9 are disposed at opposite positions in a direction substantially perpendicular to the direction in which movement support unit 5 and movement support unit 5 are disposed. Has been.

  Among them, in the pair of movement control unit 4 and movement support unit 5, the movement control unit 4 is provided with a guide rail 4b extending on the upper surface of the base plate 4a toward the opposite movement support unit 5 (X direction), A slider 4c that is slidably supported in the extending direction (X direction) of the guide rail 4b is disposed on the guide rail 4b. An alignment pin 4d extending in the direction of the opposed moving support unit 5 (X direction) is provided on the upper portion of the slider 4c.

  Further, an actuator 4e and a spring support 4f are provided on the upper surface of the base plate 4a. The tip of the rod 4g of the actuator 4e is in contact with the slider 4c, and the spring support 4f and the slider 4c are connected to the spring 4h. The slider 4c is biased toward the spring support 4f by the biasing force of the spring 4h.

  In the movement support unit 5, a guide rail 5 b extending in the direction of the opposite movement control unit 4 (X direction) is disposed on the upper surface of the base plate 5 a, and the guide rail 5 b extends in the extension direction (X direction). A slider 5c is slidably supported by the slider 5c. A pusher pin 5d extending in the direction of the opposite movement control unit 4 (X direction) is provided on the upper portion of the slider 5c.

  A spring support 5f is provided on the upper surface of the base plate 5a, and the spring support 5f and the slider 5c are connected by a spring 5h.

  On the other hand, in the two pairs of movement control unit 6 and movement support unit 7, and movement control unit 8 and movement support unit 9, movement control unit 6 and movement control unit 8 are opposed to the upper surfaces of base plates 6a and 8a, respectively. Guide rails 6b and 8b extending toward the moving support unit 7 and 9 (Y direction) are arranged, and the guide rails 6b and 8b are slidable in the extending direction (Y direction) of the guide rails 6b and 8b. Supported sliders 6c and 8c are arranged. Alignment pins 6d and 8d extending in the direction of the opposing movement support units 7 and 9 (Y direction) are provided on the upper portions of the sliders 6c and 8c.

  Actuators 6e and 8e and spring supports 6f and 8f are provided on the upper surfaces of the base plates 6a and 8a, respectively, and the rods 6g and 8g of the actuators 6e and 8e are in contact with the sliders 6c and 8c. At the same time, the spring supports 6f and 8f and the sliders 6c and 8c are connected by the springs 6h and 8h, and the sliders 6c and 8c are biased toward the spring supports 6f and 8f by the biasing force of the springs 6h and 8h. ing.

  In the movement support unit 7 and the movement support unit 9, guide rails 7b and 9b extending in the opposite movement control units 6 and 8 directions (Y direction) are arranged on the upper surfaces of the base plates 7a and 9a, respectively. 9b, sliders 7c, 9c supported so as to be slidable in the extending direction (Y direction) of the guide rails 7b, 9b are disposed. Pusher pins 7d and 9d extending in the direction of the opposing movement control units 6 and 8 (Y direction) are provided above the sliders 7c and 9c.

  Further, spring supports 7f and 9f are provided on the upper surfaces of the base plates 7a and 9a, and the spring supports 7f and 9f and the sliders 7c and 9c are connected by the springs 7h and 9h.

  Further, a pair of alignment mark imaging cameras 10 is disposed above the stage 2 so as to be movable in the direction (X direction) in which the movement control unit 4 and the movement support unit 5 are disposed. The pair of alignment marks 12 formed on the image 11 is imaged, and the deviation of the alignment mark 12 from a predetermined position is calculated from the image.

  Next, a method for aligning a substrate to be processed using the above-described alignment apparatus will be described in detail.

  First, the substrate 11 to be processed on which the pair of alignment marks 12 are formed is placed on the suction table 3. Then, the alignment pins 4d, 6d, and 8d provided on the sliders 4c, 6c, and 8c provided in the movement control units 4, 6, and 8, respectively, and the movement support units 5, 7, and 9 are arranged. The tip portions of pusher pins 5d, 7d, 9d provided on the provided sliders 5c, 7c, 9c abut on the end surface of the substrate 11 to be processed. At this time, the upper surface 13 of the substrate 11 to be processed is at a position higher than the upper end 14 of any of the alignment pins 4d, 6d, 8d and the pusher pins 5d, 7d, 9d (for example, a position higher by the distance d) (see FIG. 2). At this time, air is ejected from the suction holes provided in the suction table 3, and the substrate 11 to be processed is in a freely movable state on the suction table 3.

  Further, the pair of alignment mark imaging cameras 10 is moved in advance to positions corresponding to the regular positions of the pair of alignment marks 12 on the substrate 11 to be processed.

  When the alignment device 1 is started, the stage 2 is linearly slid in the Y direction, and the pair of alignment marks 12 of the first substrate 11 to be processed is captured by the camera 10 and the alignment marks obtained are obtained. When the position data of one or both of the images 12 falls within a predetermined range with respect to the normal position data, the slide of the stage 2 stops.

  Then, the highly accurate alignment with respect to the to-be-processed substrate 11 is started from this time. That is, the position data of each image of the pair of alignment marks 12 of the substrate to be processed 11 obtained by being imaged by the camera 10 and the position data set in advance so as to correspond to the respective normal positions of the alignment marks 12. Is calculated separately for the X direction and the Y direction.

  Then, the actuators 4e, 6e, 8e respectively disposed in the movement control units 46, 8 are individually controlled based on the calculated difference in the X direction and the difference in the Y direction, and the actuators 4e, 6e, 8e are individually controlled. By moving the sliders 4c, 6c, and 8c that are in contact with the rods 4g, 6g, and 8g, the position and direction of the substrate 11 to be processed are adjusted via the alignment pins 4d, 6d, and 8d provided on the sliders 4c, 6c, and 8c. Adjust to bring it closer to the normal position.

  Here, the movement directions of the alignment pins 4d, 6d, and 8d provided on the sliders 4c, 6c, and 8c disposed in the three movement control units 4, 6, and 8, respectively, and the three movement support units 5, 7 The relationship between the movement direction of the pusher pins 5d, 7d, and 9d provided on the sliders 5c, 7c, and 9c provided in the sliders 9 and 9 and the control direction of the substrate 11 to be processed will be described with reference to FIGS.

  As shown in FIG. 3A, when the actuator 4e of the movement control unit 4 is operated, the rod 4g of the actuator 4e expands and contracts in the Y direction. Then, the slider 4c in contact with the tip of the rod 4g moves in the X direction, and accordingly, the tip of the alignment pin 4d provided on the slider 4c moves in the X direction, and the end surface is the tip of the alignment pin 4d. The substrate 11 to be processed in contact with the substrate moves in the X direction. At the same time, on the moving support unit 5 side, the pusher pin 5d in contact with the end surface of the substrate 11 to be processed moves in the X direction by the movement of the substrate to be processed 11, and the slider 5c provided with the pusher pin 5d moves in the X direction.

  Similarly, as shown in FIG. 3B, when the actuators 6e and 8e of the movement control units 6 and 8 are individually operated, the rods 6g and 8g of the actuators 6e and 8e expand and contract in the Y direction. Then, the sliders 6c and 8c that are in contact with the tips of the rods 6g and 8g move in the Y direction, and accordingly, the tips of the alignment pins 6d and 8d provided on the sliders 6c and 8c move in the Y direction. The substrate 11 to be processed whose end face is in contact with the tip of the alignment pins 6d and 8d moves in the Y direction. At the same time, the pusher pins 7d and 9d that are in contact with the end face of the substrate 11 to be processed move in the Y direction by the movement of the substrate 11 to be moved, and the slider 7c on which the pusher pins 7d and 9d are provided. 9c move in the Y direction.

  Accordingly, the expansion and contraction length in the X direction of the rod 4g of the actuator 4e disposed in the movement control unit 4 is controlled, and the rods of the actuators 6e and 8e disposed in the two movement control units 6 and 8, respectively. By controlling the expansion and contraction length of 6g and 8g in the Y direction, the substrate 11 to be processed can be moved in the Y direction or rotated in the θ direction via the respective alignment pins 6d and 8d.

  Thus, the position data of the image of the alignment mark 12 obtained by being imaged by the alignment mark imaging camera 10 and the position data set in advance so as to correspond to the respective normal positions of the alignment mark 12 are calculated. By appropriately controlling the three actuators 4e, 6e, and 8e based on the difference in the X direction and the difference in the Y direction, the position of the substrate 11 to be processed can be brought close to the normal position.

  After the position adjustment of the substrate 11 to be processed is performed by the alignment mechanism described above, similarly, the imaging of the alignment mark 12 by the camera 10, the calculation of the position data, and the position correction of the substrate 11 to be processed are repeated. As close as possible to the normal position.

  The alignment process is completed when the difference between the position of each alignment mark 12 and the normal position reaches the set value range.

  When the alignment of the substrate to be processed 11 is completed, air is sucked from the suction holes provided in the suction table 3 on which the substrate to be processed 11 is placed, and the substrate to be processed 11 is sucked and fixed to the suction table 3.

  When the substrate 11 to be processed, which has been aligned through these steps, is sucked and fixed at a regular position on the suction table 3, the stage 2 is slid by a predetermined distance, and the next substrate 11 to be processed is aligned.

  By sequentially aligning the target substrate 11 through these steps, all the target substrates 11 are fixed at regular positions on the suction table 3 and the alignment operation is completed.

  When the substrate 11 to be processed is placed on the respective suction tables 3 in the first alignment step, the sliders 4c, 6c, and 8c disposed in the movement control units 4, 6, and 8 are springs 4h, 6h and 8h are biased toward the spring support 4f, 6f, and 8f, and the sliders 5c, 7c, and 9c disposed on the movement support units 5, 7, and 9 are respectively provided with springs 5h, It is biased toward the opposite movement control units 4, 6, 8 by the biasing force of 7h, 9h.

  Therefore, when the rods 4g, 6g, and 8g of the actuators 4e, 6e, and 8e arranged in the movement control units 4, 6, and 8 extend, the sliders 4c, 6c, and 8c are connected to the springs 4h, 6h, and 8h. The substrate 11 to be processed is moved in the direction of the moving support units 5, 7, 9 opposed to the urging force, and is in contact with the tips of the alignment pins 4d, 6d, 8d provided on the sliders 4c, 6c, 8c. It is moved in the direction of the opposed moving support units 5, 7, 9. Then, the pusher pins 5d, 7d, 9d on the side of the moving support units 5, 7, 9 in contact with the substrate 11 to be processed are pushed, and the sliders 5c, 7c, 9c are against the urging force of the springs 5h, 7h, 9h. It moves toward the spring supports 5f, 7f, 9f.

  On the other hand, when the rods 4g, 6g, and 8g of the actuators 4e, 6e, and 8e disposed in the movement control units 4, 6, and 8 are contracted, the sliders 4c, 6c, and 8c are the springs 4h, 6h, and 8h. The urging force moves in the direction of the spring supports 4f, 6f, 8f, and the alignment pins 4d, 6d, 8d provided on the sliders 4c, 6c, 8c also move in the direction of the spring supports 4f, 6f, 8f. At the same time, the movement support units 5, 7, 9 side sliders 5c, 7c, 9c move in the direction of the opposed movement control units 4, 6, 8 by the biasing force of the springs 5h, 7h, 9h, and the sliders 5c, 7c, Pusher pins 5d, 7d, 9d provided on 9c also move in the direction of the opposed movement control units 4, 6, 8. At this time, the substrate 11 to be processed, which is in contact with the tip portions of the pusher pins 5d, 7d, 9d, moves in the direction of the movement control units 4, 6, 8 by the movement of the pusher pins 5d, 7d, 9d.

  Therefore, the springs 4h, 6h, and 8h on the movement control units 4, 6, and 8 side are not necessarily required from the alignment mechanism.

  The flow of the alignment process includes two substrates 11 to be processed, two suction tables 3 each having the substrate 11 to be processed, a stage 2 to which the two suction tables 3 are fixed, and an alignment mark imaging camera 10. 4 shows FIG.

  First, the substrate 11 to be processed is placed on each of the suction tables 3 fixed on the stage 2 as shown in FIG. When the alignment device is started, the stage 2 is slid as shown in (b), and the first substrate 11 to be processed is aligned under the camera 10. When the alignment of the first substrate to be processed 11 is completed, the table 2 slides again as shown in (c), and the next substrate to be processed 11 is aligned under the camera 10. Then, as shown in (d), each of the two substrates to be processed 11 is fixed to a normal position on the stage 2 via the suction table 3, and the alignment operation is completed.

  The above-described alignment apparatus that aligns each of the plurality of substrates to be processed on the normal position on the suction table fixed to the stage can be effectively used by being incorporated in various processing apparatuses. For example, when incorporated in a scribing device for cutting a substrate to be processed, all the substrates to be processed on the suction table fixed on the stage are aligned and fixed at regular positions. A scribe line can be continuously formed on a plurality of substrates to be processed by a relative linear motion between the cutter and the stage.

  As a result, the scribe speed is increased and the working efficiency is improved, leading to a reduction in manufacturing cost. In addition, since a uniform scribe line can be formed on a plurality of substrates to be processed, it is possible to suppress variations in quality among the substrates to be processed that have been cut and sized after scribing. In addition, the same effect can be obtained when incorporated in a scribing apparatus using laser light.

  As described above, the alignment apparatus of the present invention can be incorporated into various processing apparatuses to speed up the processing and the like, thereby improving the working efficiency and ensuring the uniformity of the processing, thereby reducing the quality variation. It produces excellent effects such as being able to.

It is a perspective view of the alignment apparatus of this invention. It is a fragmentary sectional view of the alignment apparatus of this invention. It is a schematic diagram which shows the motion of the alignment mechanism concerning the alignment apparatus of this invention. It is the schematic which shows the flow of the alignment of this invention. It is a perspective view which shows a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Alignment apparatus 2 Stage 3 Suction table 4 Movement control unit 4a Base plate 4b Guide rail 4c Slider 4d Alignment pin 4e Actuator 4f Spring support 4g Rod 4h Spring 5 Movement support unit 5a Base plate 5b Guide rail 5c Slider 5d Pusher pin 5f Spring Support body 5h Spring 6 Movement control unit 6a Base plate 6b Guide rail 6c Slider 6d Alignment pin 6e Actuator 6f Spring support body 6g Rod 6h Spring 7 Movement support unit 7a Base plate 7b Guide rail 7c Slider 7d Pusher pin 7f Spring support body 7h 8 Movement control unit 8a Base plate 8b Guide rail 8c Ida 8d alignment pins 8e actuator 8f spring support 8g rod 8h spring 9 moves the support unit 9a base plate 9b guide rail 9c slider 9d pusher pin 9f spring support 9h spring 10 camera 11 target substrate 12 alignment marks 13 the upper surface 14 upper end

Claims (8)

An alignment method for aligning substrates to be processed placed on each of a plurality of tables arranged on a stage at regular positions,
(1) placing a substrate to be processed on which an alignment mark is formed on each of a plurality of tables disposed on a stage;
(2) Based on a difference between position data obtained from an image obtained by imaging an alignment mark formed on the substrate to be processed with an alignment mark imaging camera and position data set in advance so as to correspond to a normal position. Adjusting the position of the substrate to be processed by controlling the alignment mechanism to reduce the difference in the position data;
(3) repeating the step (2) until the difference between the position data is within a preset range;
(4) An alignment method comprising the steps (2) and (3) for all the substrates to be processed placed on the table.   2. The alignment method according to claim 1, wherein in the step (1), the table is provided with a plurality of suction holes, and the substrate to be processed is movably mounted on the table. .   The substrate to be processed placed on the table is sucked and fixed on the table by sucking air from the suction holes after completion of the step (3) for each of the substrates to be processed. The alignment method according to claim 2.   The stage is linearly movable in a direction in which the plurality of tables are mounted, and is transported by movement of the stage to a position where each of the substrates to be processed is aligned. Item 4. An alignment method according to items 1 to 3. An alignment apparatus that aligns the substrates to be processed placed on each of a plurality of tables disposed on the stage at regular positions, respectively.
A stage that can move linearly;
A plurality of tables arranged in the moving direction of the stage on the stage, each for placing a substrate to be processed;
An alignment mechanism which is disposed at an opposing position of each table and moves the substrate to be processed in the X, Y, and θ directions;
A pair of alignment mark imaging cameras for imaging a pair of alignment marks formed on the substrate to be processed, disposed above the table;
With respect to the substrates to be processed placed on the respective tables, each of the pair of alignment marks formed on the substrate to be processed was imaged by each of the pair of alignment mark imaging cameras, and obtained from the captured images. The position of the substrate to be processed is adjusted by controlling the alignment mechanism based on the difference between the position data and the position data set in advance so as to correspond to the normal position, and the difference in the position data is reduced. Alignment is completed by repeating the reduction of the position data until the difference between the position data reaches a preset range.   The alignment apparatus according to claim 5, wherein the table is provided with a plurality of suction holes, and the substrate to be processed is movably mounted on the table.   7. The substrate to be processed placed on the table is sucked and fixed on the table by sucking air from the suction holes after alignment of each of the substrates to be processed is completed. The alignment apparatus described.   The alignment apparatus according to claim 5, wherein each of the tables is transported by movement of the stage to a position where the substrate to be processed placed on the table is aligned.

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