JP5473129B2 - Scribing apparatus and scribing method - Google Patents

Description

  The present invention relates to a scribing apparatus used for scribing a panel substrate made of a brittle material such as a panel substrate used in an FPD (flat panel display) typified by a liquid crystal display, and a scribing method using the scribing apparatus. About.

  A panel substrate used for an FPD such as a liquid crystal display is usually formed by simultaneously scribing and dividing a large mother substrate to form a plurality of individual display substrates. A scribing device used for scribing a panel substrate is disclosed in, for example, Japanese Patent Application Laid-Open No. 2002-20133.

  A scribing device disclosed in this publication is shown in FIG. The scriber shown in FIG. 7 is provided with a table 81 for holding a panel substrate 70 on which a scribe line is formed after being placed in a horizontal state and a scribing wheel for scribing the panel substrate 70 held on the table 81. A plurality of scribe heads 82 and a bridge 83 provided with a guide rail 83a to which each scribe head 82 is slidably attached independently.

  The table 81 that holds the panel substrate 70 in a horizontal state can rotate in the forward and reverse directions around the vertical axis, that is, in the θ direction shown in FIG. 7 with the panel substrate 70 held in a horizontal state. The bridge 83 is constructed so as to straddle the table 81, and the guide rail 83 a is arranged in a horizontal state above the table 81. Each scribe head 82 attached to the guide rail 83a is slidable in the X direction along the longitudinal direction of the guide rail 83a by a linear motor mechanism. Further, the table 81 is slidable in the Y direction that is orthogonal to the guide rail 83a.

  A scribing wheel (cutter wheel chip) 82 a that can be moved up and down is provided below each scribe head 82. Each scribing wheel 82 a is pressed against the panel substrate 70 held on the table 81 and moves relative to the panel substrate 70 to scribe a predetermined portion of the panel substrate 70. Thereby, a scribe line is formed on the panel substrate 70.

  7 is provided with a pair of cameras 84 that capture the alignment marks provided on the panel substrate 70, an image display device 85 that displays an image captured by each camera 84, and the like.

  In the scribing apparatus having such a configuration, when the panel substrate 70 is held on the table 81, the table 81 is rotated in the θ direction based on the alignment marks picked up by the pair of cameras 84, so that the table 81 Relative positioning of the panel substrate 70 held by the guide rail 83a and the guide rail 83a of the bridge 83 is performed. Thereafter, each scribe head 82 is slid in the X direction so that the scribing wheel 82 a of each scribe head 82 faces a predetermined Y-direction scribe start position on the panel substrate 70. When the scribe wheel 82 a of each scribe head 82 is opposed to the Y-direction scribe start position on the panel substrate 70, each scribe wheel 82 a is lowered and pressed against the Y-direction scribe start position on the panel substrate 70.

  In such a state, the entire bridge 83 is moved in the Y direction, whereby the scribing wheel 82a of each scribe head 82 simultaneously forms a plurality of scribe lines along the Y direction.

  As described above, by providing the plurality of scribe heads 82, for example, a plurality of parallel scribe lines can be simultaneously formed along the Y direction. Therefore, it is possible to efficiently perform scribing for dividing a plurality of panel substrates from the mother panel substrate.

  On the other hand, FPD manufacturing factories tend to employ larger-sized panel substrates as mother substrates, and it is required to increase the size of the mounting table of the scribe device in order to cope with this. However, when the size of the mounting table is increased, it becomes more difficult to maintain the scribe position accuracy at both ends of the mother substrate by rotating the table. That is, since a mechanism for rotating the table around the rotation axis by a motor is employed, there is a certain mechanism limit for increasing the resolution of the rotation angle. Further, as the size of the mounting table increases, the table itself becomes heavier, and a large rotating mechanism is required. For this reason, no device design incorporating a rotation mechanism is employed for the mounting table of the scribing device for a large-sized mother board.

  When the mounting table of the scribe device does not rotate, the scribe device of FIG. 7 simply mounts a single scribe head when the mother substrate is tilted even slightly and is placed on the mounting table and scribed. Even if you just have the following problems. That is, when the scribe line is formed in the Y direction from the predetermined X position after the scribe head is moved in the X direction, the scribe line is also inclined to the extent that the mother substrate to be formed is inclined.

  In order to solve such a problem, a method using linear interpolation disclosed in Patent Document 2 (Japanese Patent Publication No. 6-2597) or the like is used.

  In the case of the scribing device of FIG. 7 in which a single scribing head is mounted, the relative positional relationship between the panel substrate 70 held on the table 81 and the guide rail 83 a of the bridge 83 is imaged by a pair of cameras 84. Since the image is processed in advance based on the alignment mark, the scribing wheel 82a attached immediately below the scribe head 82 is scribed in the Y direction on the panel substrate 70 based on the calculation result. Linear interpolation is performed so as to move along the planned line. This linear interpolation is performed by moving each scribing wheel 82a by a predetermined minute distance in the X direction every time the entire bridge 83 moves by a predetermined minute distance in the Y direction.

In addition, an upper and lower cutting device that simultaneously scribes and separates the upper and lower surfaces of the mother panel substrate for FPD has been developed. However, in such a device, the mother substrate is scribed while the substrate is being transported. The linear interpolation method is adopted.
JP 2002-20133 A Japanese Patent Publication No. 6-2597

  In the scribing apparatus shown in FIG. 7, a plurality of scribing heads 82 are mounted. Therefore, at the start of scribing, it is necessary to arrange the scribing start position of the scribing wheel 82a attached to each head in a state where the scribing wheel 82a is accurately positioned in the same straight line. However, since all the scribing heads 82 are attached to the bridge 83, once the panel substrate 70 is placed at an angle with respect to the direction of the panel substrate 70 not coincident with the linear direction of the bridge 83, the scribing is no longer performed. It is impossible to align the start positions.

  The present invention solves such a problem, and an object of the present invention is to accurately position each scribe means of a plurality of scribe heads at a predetermined scribe start position on a brittle material substrate such as a panel substrate. A scribing apparatus and a scribing method are provided. Another object of the present invention is to provide a scribing apparatus and a scribing method capable of linearly interpolating each scribing means of a plurality of scribing heads quickly and with high accuracy.

  The scribing apparatus of the present invention includes a substrate holding means for holding a brittle material substrate in a horizontal state, a plurality of scribe heads each having a scribing means for scribing the brittle material substrate held by the substrate holding means, Each of the scribing heads is slidably held along the X direction which is a longitudinal direction, and the brittle material substrate held by the substrate holding means and the guide rail are the X It is possible to move relatively along the Y direction orthogonal to the direction, and each scribe head has slide means for sliding the scribe means provided in each direction along the Y direction. Features.

  Preferably, the substrate holding means can transport the held brittle material substrate in the Y direction.

  Preferably, the guide rail is provided above the brittle material substrate held by the substrate holding means.

  Preferably, the brittle material substrate is a single panel substrate.

  Preferably, the guide rail is provided above and below the brittle material substrate held by the substrate holding means, and the plurality of scribe heads are provided on each of the guide rails. .

  Preferably, the brittle material substrate is a bonded panel substrate in which a pair of panel substrates are bonded together.

  Preferably, one of the scribe heads provided on the guide rail above the brittle material substrate is provided with a roller that presses against the upper surface of the bonded panel substrate.

  Preferably, the scribing means is a scribing wheel.

  Preferably, each scribe head further includes means for pressing the scribing wheel against the brittle material substrate.

  Further, the present invention is a method of scribing the brittle material substrate by the scribing device, the step of positioning the guide rail with respect to the brittle material substrate held by the substrate holding means, The scribing heads are moved in the X direction along the guide rails, and the scribing means of the scribing heads are moved in the Y direction so that each of the scribing means is moved to a scribing start position on the brittle material substrate. And a step of facing each other.

  Preferably, each of the scribe heads opposed to each of the scribe start positions is in pressure contact with each of the scribe start positions, and the brittle material substrate held by the substrate holding means, and the guide rail, The method further includes a step of relatively moving along the Y direction.

  Preferably, the scribe heads respectively facing the scribe start positions are brought into pressure contact with the scribe start positions, and the scribe heads are moved along the X direction along the guide rails. The method further includes a step.

  Preferably, linear interpolation is performed by moving the scribe means in the Y direction while moving each of the scribe heads in the X direction along the guide rail.

  In the scribing apparatus and scribing method of the present invention, the scribe planned line of the brittle material substrate is inclined with respect to the longitudinal direction of the guide rail that holds the plurality of scribing heads arranged in the longitudinal direction so as to be slidable in the longitudinal direction. Even when arranged in a direction other than the parallel or vertical direction, each of the plurality of scribe heads is provided with slide means for independently moving the scribe means in the Y direction. The means can be precisely aligned to the respective scribe start position on the brittle material substrate. That is, when a plurality of scribe lines along the Y direction are simultaneously formed on the brittle material substrate by a plurality of scribe means, the scribe start position by each scribe means is in the X direction (direction perpendicular to the scribe planned line). Can be aligned. Further, when a single scribe line along the X direction is divided with respect to the brittle material substrate (or a plurality of scribe lines arranged on one line in the X direction) are simultaneously formed by a plurality of scribe means. The scribing start position by each scribing means can be aligned in the X direction (on the planned scribing line). Therefore, the time required for cutting out a rectangular divided substrate from a brittle material substrate (mother substrate) can be shortened.

It is a perspective view which shows schematic structure of the scribing apparatus of this invention. It is a perspective view which expands and shows schematic structure of the principal part of the scribing apparatus of this invention. It is a perspective view of the slide head part used for the scribing apparatus of this invention. It is a front view of the slide head part used for the scribing apparatus of this invention. It is a perspective view of the cutter head part used for the scribing apparatus of this invention. (A) And (b) is a top view of the bonding panel board | substrate for operation | movement description of the scribing apparatus of this invention, respectively. It is a perspective view which shows schematic structure of the conventional scribing apparatus.

Explanation of symbols

10 Transport support mechanism (substrate support mechanism)
30 scribe unit 31 upper guide rail 32 lower guide rail 33 upper scribe head 34 upper slide head 34m servo motor 34n timing pulley 34p timing pulley 34q timing belt 35 upper cutter head 35a servo motor 35m cutter member 35n holder member 35p scribing wheel 36 Roller head part 37 Camera head part 38 Lower slide head part 39 Lower cutter head part 40 Lower scribe head

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view showing a schematic configuration of a scribing apparatus of the present invention, and FIG. 2 is an enlarged perspective view showing a main part thereof. This scribing device is used, for example, for dividing a bonded panel substrate 90 used for a liquid crystal display panel into a predetermined size. In the bonded panel substrate 90, a pair of panel substrates are bonded to each other with a predetermined gap therebetween and filled with liquid crystal. As shown in FIG. 1, the scribing apparatus of the present invention includes a pair of substrate support mechanisms 10 on which a bonded panel substrate 90 to be divided is placed in a horizontal state, and a scribe unit disposed between both substrate support mechanisms. 30.

  Each substrate support mechanism 10 is configured to transport a panel substrate 90 placed in a horizontal state in a horizontal state, and the scribe unit 30 is held in a horizontal state by both substrate support mechanisms. The bonded panel substrate 90 is divided.

  The pair of substrate support mechanisms 10 are a plurality of belts that convey the bonded panel substrate 90 placed in a horizontal state in a predetermined direction (a direction perpendicular to the longitudinal direction of the scribe unit 30) while maintaining the horizontal state. Each of them is constituted by a conveyor 11.

  1, the direction in which the panel substrate 90 is conveyed by the substrate support mechanism 10 is the Y direction, and the horizontal direction (longitudinal direction of the scribe unit 30) perpendicular to the Y direction is the X direction, the Y direction, and the X direction. The vertical direction perpendicular to the Z direction is taken as the Z direction.

  As shown in FIG. 2, the scribe unit 30 disposed between the pair of substrate support mechanisms 10 is horizontal along a direction (X direction) orthogonal to the transport direction of the bonded panel substrate 90 by the substrate support mechanism 10. It has the upper guide rail 31 and the lower guide rail 32 which were each arrange | positioned in the state. The upper guide rail 31 and the lower guide rail 32 are integrated with an appropriate interval in the vertical direction. The bonded panel substrate 90 transported in the + Y direction by the substrate support mechanism 10 passes through the gap between the upper guide rail 31 and the lower guide rail 32.

  The upper guide rail 31 is provided with a pair of upper scribe heads 33 slidably attached along the upper guide rail 31. Each upper scribe head 33 has an upper slide head portion 34 that slides in the X direction along the longitudinal direction of the upper guide rail 31. Each upper slide head portion 34 is configured to slide in the X direction by a linear motor mechanism, and on the upper guide rail 31, a slider 31a of the linear motor mechanism that is slidable along the upper guide rail 31. Are provided. A connecting plate 31b is attached to each slider 31a in a vertical state, and an upper slide head portion 34 is attached to the connecting plate 31b. According to the pair of upper scribe heads 33, a pair of parallel scribe lines in the Y direction that are spaced apart from each other in the X direction can be simultaneously formed on the upper surface of the bonded panel substrate 90. Further, a plurality of scribe lines on one line in the X direction can be formed simultaneously (or by dividing one scribe line into two).

  In addition, a camera head portion 37 that slides along the upper guide rail 31 integrally with each upper slide head portion 34 is attached to each connecting plate 31b. Each camera head unit 37 is provided with a camera for imaging an alignment mark provided on the bonded panel substrate 90, and the bonded panel substrate 90 is conveyed between the upper guide rail 31 and the lower guide rail 32. Then, the respective alignment marks provided on the bonded panel substrate 90 are imaged by the respective cameras.

  Further, an upper cutter head part 35 and a roller head part 36 are attached to each upper slide head part 34. The roller head portion 36 has the same structure as the cutter head portion except that a roller having a shape that does not form a scribe line even when pressed against the substrate is attached instead of the scribing wheel in the cutter head portion.

  The lower guide rail 32 is provided with a pair of lower scribe heads 40 slidable in the X direction along the lower guide rail 32, and each lower scribe head 40 has a lower slide head portion 38. Is provided. Each lower slide head section 38 is attached to a slider (not shown) of a linear motor mechanism that is slidable along the longitudinal direction of the lower guide rail 32. A lower cutter head 39 is attached to each lower slide head 38.

  According to the pair of lower scribe heads 40, a pair of parallel scribe lines in the Y direction that are spaced apart from each other in the X direction can be simultaneously formed on the lower surface of the bonded panel substrate 90. Further, a plurality of scribe lines on one line in the X direction can be formed simultaneously (or by dividing one scribe line into two).

  Further, according to the upper scribe head 33 and the lower scribe head 40, scribe lines can be simultaneously formed on the upper surface and the lower surface of the bonded panel substrate 90. In this case, the upper cutter head portion 35 attached to the upper scribe head 33 and the lower cutter head portion 39 attached to the lower scribe head 40 face each other through the bonded panel substrate 90.

  When the scribe line is formed only on the lower surface of the bonded panel substrate 90, the roller head unit 36 attached to the upper scribe head 33 is connected to the lower cutter head 39 via the bonded panel substrate 90 as necessary. It is used in a state where the upper surface of the bonded panel substrate is pressed so as to be opposed. For example, when the scribe line is formed only on the lower surface of the bonded panel substrate 90, the bonded panel substrate is caused by the pressing force from the lower cutter head 39 unless the roller head portion 36 attached to the upper scribe head 33 is used. Depending on characteristics such as the size, thickness, and rigidity of the 90, the substrate 90 may bend, and formation of an appropriate scribe line may be hindered. By using the roller head portion 36, the upper cutter head portion 35 and the lower cutter head 39 are opposed to each other via the bonded panel substrate 90, and a scribe line is simultaneously formed on the upper surface and the lower surface of the bonded panel substrate 90. A scribe line can be formed only on the lower surface under the same situation as the case.

  3 shows an upper slide head portion 34 (arranged on the −X direction side opposite to the + X direction shown in FIG. 1) of one upper scribe head 33 provided on the upper guide rail 31. A perspective view and FIG. 4 are front views of the upper slide head portion 34. The upper slide head portion 34 has an upper block portion 34a and a lower block portion 34b that are arranged at appropriate intervals in the vertical direction, and the upper block portion 34a and the lower block portion 34b are linearly arranged. It is attached to a connecting plate 31b attached to a slider 31a of the motor mechanism. Slide guides 34c extending horizontally along the Y direction are provided on both sides of the upper block portion 34a in the X direction, which is the slide direction, and the upper guide blocks 34d are slidably provided on the respective slide guides 34c. It has been. Slide guides 34e extending horizontally along the Y direction are provided on both sides in the X direction, which is the sliding direction of the lower block portion 34b, and the lower guide block 34f can slide on each slide guide 34e. Is provided.

  A mounting plate 34g is vertically attached to the upper guide block 34d and the lower guide block 34f provided on both sides of the upper slide head portion 34, respectively. Further, an upper cutter head 35 (see FIG. 2) is attached to a mounting plate 34g disposed on the side of the upper slide head 34 facing the other slide head 34 (+ X direction side in FIG. 2). The roller head portion 36 (see FIG. 2) is attached to the mounting plate 34g disposed on the far side of the other slide head portion 34 (the -X direction side opposite to the + X direction side in FIG. 2). ing.

  Between the upper block portion 34a and the lower block portion 34b, a ball screw 34h is disposed in a horizontal state along the Y direction, and a slide block 34i integrated with each mounting plate 34g is screwed to the ball screw 34h. Are connected. The slide block 34i integrally attached to each mounting plate 34g slides along the Y direction by forward and reverse rotation of the ball screw 34h, and follows each slide along the Y direction of the slide block 34i. 34g slides. Thereby, the upper cutter head part 35 and the roller head part 36 attached to each attachment plate 34g are integrally slid along the Y direction.

  A servo motor 34m is provided above the upper block portion 34a. The rotation shaft of the servo motor 34m extends in a horizontal state in the direction (−Y direction) opposite to the + Y direction shown in FIG. 2, and a timing pulley 34n is integrally attached to the tip portion thereof. Below the timing pulley 34n, a driven timing pulley 34p attached to the tip of the ball screw 34h is disposed. A timing belt 34q is wound around both timing pulleys 34n and 34p so as to be capable of circular movement.

  The servo motor 34m can be rotated forward and backward. The rotation of the servo motor 34m is transmitted from the upper timing pulley 34n to the lower timing pulley 34p by the timing belt 34q, and is transmitted to the lower timing pulley 34p. The ball screw 34h attached integrally rotates. When the ball screw 34h is rotated, the slide block 34i slides along the Y direction, and each mounting plate 34g attached to the slide block 34i slides along the Y direction. Thereby, the upper cutter head part 35 and the roller head part 36 provided in each attachment plate 34g slide along the Y direction.

  FIG. 5 is a perspective view of the upper cutter head portion 35. In the upper cutter head part 35, a servo motor 35a is attached to the upper part of one attachment plate 34g provided in the slide head part 34. The servo motor 35a is attached to the attachment plate 34g in an inverted state in which the rotation shaft extends vertically downward. A cylindrical cam 35b is attached to the rotation shaft of the servo motor 35a so as to rotate integrally with the rotation shaft. The lower surface of the cylindrical cam 35b is a cam surface 35c that is inclined with respect to the horizontal state.

  The upper cutter head portion 35 has a linear bearing 35k provided at the lower portion of the mounting plate 34g, and a holder member 35n is held by the linear bearing 35k so as to be slidable in the vertical direction. A cutter member 35m for forming a scribe line on the bonded panel substrate 90 is held at the lower end of the holder member 35n. A scribing wheel 35p is provided at the lower end of the cutter member 35m. 35 n of holder members hold | maintain the cutter member 35m with which the scribing wheel 35p was provided in the lower end part so that rotation around a vertical axis is possible. Between the holder member 35n and the attachment plate 34g, a coil spring 35s is provided as an elastic body that urges the holder member 35n upward with respect to the attachment plate 34g.

  Note that the cutter member 35m provided with the scribing wheel 35p at the lower end is configured to be detachable from a holder member (hereinafter also referred to as a cutter holding member) 35n, and is disclosed in, for example, WO2007 / 063979. As described above, the cutter member 35m may be configured to be easily attached to and detached from the cutter holding member 35n by a magnet. Further, as the scribing wheel 35p, a cutter wheel disclosed in Japanese Patent No. 3074143, a scribing wheel disclosed in WO 2007/063979, or the like may be used.

  A cam follower 35d that is in contact with the cam surface 35c of the cylindrical cam 35b is provided integrally with the cutter holding member 35n on the cutter holding member 35n. The cam follower 35d has a rotatable roller shape, and is pressed against the cam surface 35c of the cylindrical cam 35b by urging the cutter holding member 35n upward by a coil spring 35s.

  As shown in FIG. 2, a roller head portion 36 is provided on the other mounting plate 34g of the upper slide head portion 34. This roller head portion 36 is an upper portion where the holder member 35n holds the cutter member 35m. The configuration of the cutter head unit 35 is different from the configuration of the cutter member 35 only in that the holder member holds the roller member, and the other configuration is the same as the configuration of the upper cutter head unit 35. For example, when the scribe line is formed only on the lower surface of the panel substrate, the roller member applies pressure to the upper surface of the panel substrate so as to face the lower cutter head portion 39 via the panel substrate.

  As shown in FIG. 2, each lower scribe head 40 slidable along the lower guide rail 32 is provided with a lower slide head portion 38. Each of the lower slide head portions 38 has the same configuration as that of the upper slide head portion 34 except that the upper slide head portion 34 is configured to be opposite in the vertical direction.

  Further, only the lower cutter head portion 39 is attached to each lower slide head portion 38 on the outer side (distant side with respect to the other lower slide head portion 38). Each lower cutter head part 39 has the same configuration as the upper cutter head part 35 except that the upper cutter head part 35 is opposite in the vertical direction.

  Slide of each upper slide head 34 and each lower slide head 40 by a linear motor mechanism, drive of servo motor 34m and each lower slide head 38 in each upper slide head 34, servo motor 35a in each upper cutter head 35, Controls such as driving of the servo motor and driving of the substrate holding mechanism in each roller head 36 and each lower slide head 39 are performed by an arithmetic control unit (not shown).

  An operation of scribing the bonded panel substrate 90 by the scribing apparatus of the present invention having such a configuration will be described. Hereinafter, as shown in FIGS. 6A and 6B, a scribing method in the case where eight divided bonded panel substrates 91 are divided from one bonded panel substrate 90 by the scribing apparatus of the present invention. explain. As shown in FIG. 6 (a), from the large bonded panel substrate 90, four along the longitudinal direction (Y direction) of the bonded panel substrate 90 and two along the width direction (X direction). The divided bonded panel substrate 91 is divided. In this case, the upper panel substrate and the lower panel substrate in the bonded panel substrate 90 are, as shown in FIG. 6A, four Y-direction scribe lines 90a, 90b, 90c, 90d along the longitudinal direction. It is divided along. The four scribe lines are a first scribe scheduled line 90a, a second scribe scheduled line 90b, a third scribe scheduled line 90c, and a fourth scribe scheduled line 90d in order from the −X direction side.

  In the bonded panel substrate 90, the positions of the first scribe planned line 90a and the third scribe planned line 90c of the upper panel substrate, and the positions of the first scribe planned line 90a and the third scribe planned line 90c of the lower panel substrate Are slightly different. The position of the first scribe line 90a on the lower panel substrate is on the inner side (+ X direction side) of the first scribe line 90a on the upper panel substrate, and the third scribe line on the lower panel substrate. The position 90c is on the inner side (+ X direction side) than the third scribe line 90c on the upper panel substrate. This is because it is necessary to provide a terminal of the electrode line provided on the upper panel substrate on one side edge portion of the upper panel substrate in the divided bonded panel substrate 91, so that the area of the upper panel substrate is increased. is there. 6 (a) and 6 (b), for the sake of convenience, the scribe lines on the upper panel substrate and the lower panel substrate are shown to match.

  In addition, each scribe plan line along the width direction (X direction) in the bonded panel substrate 90 is the scribe plan line located closest to the + Y direction, and the fifth scribe plan line 90e and the sixth scribe plan from the −X direction side. A scheduled line 90f is set, and scribe scheduled lines adjacent to the fifth and sixth scribe scheduled lines 90e and 90f on the −Y direction side are respectively set as a seventh scribe scheduled line 90g and an eighth scribe scheduled line 90h. .

  In the scribing apparatus of the present invention, the scribing wheel (cutter wheel chip) 35p of each upper cutter head portion 35 in the pair of upper scribe heads 34 is along the first scribe planned line 90a and the third scribe planned line 90c on the upper panel substrate. The lower panel that simultaneously forms the scribe line and faces the first scribe planned line 90a and the third scribe planned line 90c on the upper panel substrate by each scribing wheel of each lower cutter head portion 39 in the pair of lower scribe heads 40. A scribe line is simultaneously formed along two lines (not shown) on the lower surface of the substrate. At this time, the position of the scribe line formed on the lower surface of the lower panel substrate is shifted to the outside (the −X direction side) from the first scribe planned line 90a and the third scribe planned line 90c on the lower panel substrate. Become. As described above, an electrode line terminal or the like is provided on one side edge of the upper panel substrate, and the position of the first scribe line planned line 90a and the third scribe planned line 90c on the upper panel substrate. This is because the positions are shifted outward (−X direction side) from the positions of the first scribe planned line 90a and the third scribe planned line 90c on the lower panel substrate.

  Next, scribe lines are simultaneously formed along the first scribe line 90a and the third scribe line 90c on the lower panel substrate by the scribing wheels 35p of the lower cutter head portions 39 in the pair of lower scribe heads 40. At this time, each roller of each roller head portion 36 is rolled so as to press from the upper surface side of the upper panel substrate so as to face each scribing wheel 35p of each lower cutter head portion 39 through the bonded panel substrate.

  Thereafter, scribe lines are simultaneously formed along the second scribe line 90b and the fourth scribe line 90d on the upper panel substrate by the scribing wheels 35p of the pair of upper cutter head parts 35, and the pair of lower cutter head parts 39 These scribing wheels simultaneously form scribe lines along the second scribe planned line 90b and the fourth scribe planned line 90d on the lower panel substrate. Thereafter, scribe lines are simultaneously formed along the fifth scribe line 90e and the sixth scribe line 90f on the upper panel substrate by the scribing wheels 35p of the pair of upper cutter head portions 35, and a pair of lower cutter heads. The scribing wheels of the part 39 simultaneously form scribe lines along the fifth scribe planned line 90e and the sixth scribe planned line 90f on the lower panel substrate. Thereafter, scribe lines are formed along the seventh scribe planned line 90g and the seventh scribe planned line 90h along the X direction adjacent to the −Y direction with respect to the fifth scribe planned line 90e and the sixth scribe planned line 90f. Hereinafter, the scribe lines are formed in order along each scheduled scribe line along the X direction adjacent to the −Y direction with respect to the formed scribe line.

  Such a scribing method will be described in more detail. First, when the bonded panel substrate 90 is placed on one of the substrate support mechanisms 10 located in the −Y direction, the substrate support mechanism 10 holds the bonded panel substrate 90 in a horizontal state. In this case, the substrate support mechanism 10 does not accurately position the bonded panel substrate 90 with respect to the X direction and the Y direction so that the longitudinal direction of the bonded panel substrate 90 is substantially along the Y direction. Hold on. Thereafter, the substrate support mechanism 10 conveys the held bonded panel substrate 90 in the + Y direction, and inserts an end portion on the + Y direction side between the upper guide rail 31 and the lower guide rail 32.

  In such a state, each scribe provided on the upper guide rail 31 is used to image the alignment mark provided at a predetermined position on the bonded panel substrate 90 with a camera provided on each camera head unit 37. The head 33 is slid along the longitudinal direction of the upper guide rail 31. In this case, the bonded panel substrate 90 is moved in the Y direction by the substrate support mechanism 10 as necessary so that the alignment mark provided on the bonded panel substrate 90 is imaged.

  Thereafter, when the alignment marks provided on the bonded panel substrate 90 are imaged by the cameras provided in the camera head portions 37 of the scribe heads 33, the scribing unit 30 is based on the imaged alignment marks. On the other hand, the bonded panel substrate 90 is moved by the substrate support mechanism 10 so that the bonded panel substrate 90 is in a predetermined position. When the bonded panel substrate 90 reaches a predetermined position with respect to the scribe unit 30, the movement of the bonded panel substrate 90 is stopped.

  In such a state, the calculation control unit calculates the inclination angle between the width direction of the bonded panel substrate 90 and the X direction which is the longitudinal direction of the upper guide rail 31 and the lower guide rail 32, and the bonding is performed. Scribe start positions S1 and S2 on the upper panel substrate and the lower panel substrate of the panel substrate 90 (the positions of the ends in the + Y direction on the first scribe planned line 90a and the first scribe planned line 90c, see FIG. 6A). ) Is calculated. Then, based on the calculation result, the X direction and Y direction of each upper scribe head 33 necessary for positioning the scribing wheel 35p of each upper cutter head portion 35 above the scribe start positions S1 and S2 of the upper panel substrate, respectively. The movement distance along each direction is calculated, and each lower scribe head 40 required to position the scribing wheel of each lower cutter head portion 39 below the scribe start positions S1 and S2 of the lower panel substrate is provided. The movement distances along the X direction and the Y direction are respectively calculated.

  Thereafter, based on the respective calculation results, each upper scribe head 33 is moved in the X direction by the calculated moving distance along the upper guide rail 31 by the linear motor mechanism, and each upper slide head unit is also moved. Servo motors 34m provided on the upper slide head portions 34 are rotationally driven so that the respective upper cutter head portions 35 attached to the 34 are moved by the calculated movement distance along the Y direction. The rotation of the servo motor 34m is transmitted to the ball screw 34h by the pair of timing pulleys 34n and 34p, whereby the ball screw 34h is rotated. Thereby, each upper cutter head part 35 attached to each upper slide head part 34 moves in the Y direction.

  In this manner, each upper scribe head 33 is moved in the X direction by the linear motor mechanism, and the upper cutter head portion 35 of each upper scribe head 33 is moved in the Y direction, whereby the upper cutter head portion. Thirty-five scribing wheels 35p are accurately opposed above the scribe start positions S1 and S2 on the upper panel substrate.

  Similarly, each lower scribe head 40 is moved along the lower guide rail 32 by the linear motor mechanism, and the lower cutter head portion 39 of each lower scribe head 40 is moved along the Y direction. The scribing wheel of the lower cutter head portion 39 is accurately opposed to the lower side of the scribe start positions S1 and S2 on the lower panel substrate.

  In such a state, the servo motor 35a of each upper cutter head portion 35 is rotated, whereby the cylindrical cam 35b is rotated, and the cam follower 35d pressed against the cam surface 35c of the cylindrical cam 35b is lowered. As a result, the holder member 35n is moved downward against the urging force of the coil spring 35s. Then, when the holder member 35n is lowered by a predetermined amount, each scribing wheel 35p is pressed against the scribing start positions S1 and S2 of the upper panel substrate in the bonded panel substrate 90 with a predetermined pressure.

  Similarly, in each lower cutter head portion 38, the holder member is moved upward by rotating the servo motor, and each scribing wheel starts scribing the lower panel substrate in the bonded panel substrate 90. The positions S1 and S2 are pressed against each other with a predetermined pressure.

  In such a state, the bonded panel substrate 90 is moved in the + Y direction by the substrate supporting mechanism, and the first scribe line on the upper panel substrate of the bonded panel substrate 90 is moved by the scribing wheel 35p of each upper cutter head portion 35. A scribe line is formed along the 90a and the third scribe line 90c. Similarly, the scribing wheel of each lower cutter head portion 39 is not shown on the lower surface of the lower panel substrate facing the first scribe planned line 90a and the third scribe planned line 90c in the upper panel substrate of the bonded panel substrate 90. A scribe line is formed along the two lines. At this time, the position of the scribe line formed on the lower surface of the lower panel substrate is shifted to the outside (the −X direction side) from the first scribe planned line 90a and the third scribe planned line 90c on the lower panel substrate. Become. As described above, since the terminal of the electrode line or the like is provided on one side edge of the upper panel substrate, the position of the first scribe line planned line 90a and the third scribe scheduled on the upper panel substrate. This is because the position of the line 90c is shifted outward (−X direction side) from the position of the first scribe planned line 90a and the position of the third scribe planned line 90c on the lower panel substrate.

  In this case, since the calculation control unit calculates in advance an inclination angle between the width direction of the bonded panel substrate 90 and the X direction which is the longitudinal direction of the upper guide rail 31 and the lower guide rail 32, the calculation is performed. Based on the inclination angle, the inclination angle of the first scribe planned line 90a and the third scribe planned line 90c with respect to the Y direction is calculated, and each upper cutter along the first scribe planned line 90a and the third scribe planned line 90c is calculated. Each time the bonded panel substrate 90 is transported by a predetermined distance in the + Y direction so that the scribing wheel 35p of the head part 35 moves, each upper scribe head 33 is moved by a predetermined distance in the X direction. Thus, while the bonded panel substrate 90 is conveyed in the Y direction by the substrate support mechanism 10, the scribing wheel 35 p of each upper cutter head unit 35 extends along the first scribe planned line 90 a and the third scribe planned line 90 c. Are linearly interpolated to move. As a result, the scribing wheel 35p of each upper cutter head portion 35 can accurately form a scribe line along the first scribe planned line 90a and the third scribe planned line 90c of the upper panel substrate.

  Similarly, the scribing wheel of each lower cutter head unit 39 is also moved in the X direction by the linear motor mechanism while the bonded panel substrate 90 is conveyed in the Y direction by the substrate support mechanism 10, thereby Linear interpolation is performed so as to move along two lines (not shown) on the lower surface of the lower panel substrate facing the first scribe planned line 90a and the third scribe planned line 90c. Thereby, the scribing wheel of each lower cutter head part 39 can also accurately form a scribe line along the two lines of the lower panel substrate.

  Next, while the scribing wheel of each lower cutter head portion 39 is scribing along the first scribe line 90a of the lower panel substrate, the upper surface of the upper panel substrate facing the first scribe line 90a. The roller of the roller head portion 36 is pressed against the position. In this case, each upper scribe head 33 is moved by a predetermined distance along the X direction and the Y direction, so that the roller head portion 36 of each upper scribe head 33 also has a predetermined distance along the X direction and the Y direction. Only moved respectively. Thereby, the roller of each roller head part 36 will be in the state which opposed the scribing wheel of each lower cutter head part 39 via an upper panel board | substrate and a lower panel board | substrate. Thus, when the scribing wheel 35p of the lower cutter head portion 35 is pressed against the + Y direction side end portion of the first scribe planned line 90a on the lower surface of the lower panel substrate, the roller head portion 36 also rotates the servo motor. As a result, the holder member is moved downward, and the roller held by the holder member is pressed against the upper surface of the bonded panel substrate 90. In this case, the rollers are pressed against the upper surface of the upper panel substrate facing the scribe start position of the lower panel substrate with a predetermined pressure.

  In this way, when the scribe lines are formed along the first scribe planned line 90a and the third scribe planned line 90c along the longitudinal direction in the upper panel substrate and the lower panel substrate, each upper cutter head portion 35 is formed. Each of the scribing wheels 35p is moved upward and away from the upper surface of the upper panel substrate. Similarly, the scribing wheel of each lower cutter head portion 39 is also moved downward to be separated from the lower surface of the lower panel substrate. Thereafter, the scribing wheel 35p of each upper cutter head part 35 and the scribing wheel of each lower cutter head part 39 are moved to the scribe start position S3 of the second scribe planned line 90b and the fourth scribe planned line 90d on the bonded panel substrate 90, respectively. The bonded panel substrate 90 is conveyed in the Y direction by the substrate support mechanism 10 so as to face S4, and each upper scribe head 33 and each lower scribe head 40 are moved in the X direction.

  And the scribing wheel 35p of each upper cutter head part 35 and the scribing wheel of each lower cutter head part 39 are scribe start positions S3 of the second scribe planned line 90b and the fourth scribe planned line 90d on the bonded panel substrate 90, respectively. When opposed to S4, the scribing wheel 35p of each upper cutter head portion 35 and the scribing wheel of each lower cutter head portion 39 are connected to the second panel substrate and the second panel substrate in the same manner as in the scribing operation described above. By moving (rolling) in the press contact state along the scribe planned line 90b and the fourth scribe planned line 90d, each of the second scribe scheduled line 90b and the fourth scribe scheduled line 90d Clive line is formed at the same time.

  Thus, when the formation of all the scribe lines along the longitudinal direction in the bonded panel substrate 90 is completed, the scribing wheel 35p of each upper cutter head portion 35 is moved to the fifth scribe planned line 90e of the bonded panel substrate 90. The scribing wheel of each lower cutter head portion 39 is similarly positioned at the scribe start positions S1 and S2, respectively, so as to face the scribe start position S1 and the scribe start position S2 of the sixth scribe planned line 90f. The bonded panel substrate 90 is conveyed so as to face each other, and each upper scribe head 33 and each lower scribe head 40 are moved in the X direction. Furthermore, each upper cutter head portion 35 and lower cutter head portion 39 are In the Y direction It is dynamic.

  Thereafter, the scribing wheel 35p of each upper cutter head part 35 and the scribing wheel of each lower cutter head part 39 are pressed against the scribe start positions S1 and S2, respectively, and the fifth scribe scheduled line 90e and the sixth scribe scheduled Each is moved along the line 90f. In this case, conveyance of the bonded panel substrate 90 by the substrate support mechanism 10, linear interpolation in the X direction of the scribing wheel 35 p of each upper cutter head portion 35 and the scribing wheel of each lower cutter head portion 39 is performed by each upper scribe head 33 and Each time each lower scribe head 40 moves by a predetermined distance in the X direction, the bonded panel substrate 90 is transported by a predetermined distance in the Y direction by the substrate support mechanism 10, or each upper scribe head 33 and each lower scribe head 40 Each upper cutter head part 35 and lower cutter head part 39 provided in the scribe head 40 is moved by a predetermined distance in the Y direction. Thereby, the scribing wheel 35p of each upper cutter head part 35 and the scribing wheel of each lower cutter head part 39 are linearly interpolated, and the scribe lines along the fifth scribe planned line 90e and the sixth scribe planned line 90f are accurately determined. Can be formed.

  When the scribe lines are formed along the scribe lines 90e and 90f on the upper panel substrate and the lower panel substrate, the scribe wheel 35p of each upper cutter head portion 35 and the scribe wheel of each lower cutter head portion 39 are attached. Transport of the bonded panel substrate 90 and the upper scribe heads 33 so as to face the scribe start positions S5 and S6 of the seventh scribe planned line 90g and the eighth scribe planned line 90h along the width direction of the aligned panel substrate 90, respectively. The movement of each lower scribe head 40 in the X direction and the movement of each upper cutter head part 35 and lower cutter head part 39 in the Y direction are controlled.

  Thereafter, the scribing wheel 35p of each upper cutter head part 35 and the scribing wheel of each lower cutter head part 39 are pressed against the scribe start positions S5 and S6, respectively, and the seventh scribe scheduled line 90g and the eighth scribe scheduled Each is moved along the line 90h. The scribe operation in this case is the same as the scribe operation along the fifth scribe planned line 90e and the sixth scribe planned line 90f.

  Thereafter, by repeating the same operation, the scribe operation along each scribe line extending in the width direction in the bonded panel substrate 90 is performed. And a scribe process is completed by forming a scribe line along all the scribe planned lines extended in the width direction in the bonding panel board | substrate 90. FIG.

  In this way, when the scribe lines are formed along all the scribe lines in the bonded panel substrate 90, the bonded panel substrate 90 is conveyed to a predetermined dividing step, and each divided bonded panel substrate 91. Divided every time.

  In this case, the scribe lines formed along the first scribe planned line 90a and the third scribe planned line 90c in the lower panel substrate are along the first scribe planned line 90a and the third scribe planned line 90d in the upper panel substrate. Since it is formed inside (+ X direction) with respect to the scribe line formed in this way, for example, by holding it from the upper panel substrate upper surface side of each divided panel substrate and lifting it upward, the unnecessary portion is It can remain on the holding means 10 and can be easily removed.

  As described above, in the scribing apparatus of the present invention, the pair of upper scribe heads 33 and the pair of lower scribe heads 40 are provided, so that the upper panel substrate and the lower panel substrate in the bonded panel substrate 90 are respectively provided. Since the pair of scribe lines can be formed at the same time, the work efficiency in the scribe can be remarkably improved.

  In addition, each of the pair of upper scribe head 33 and lower scribe head 40 is provided with means for moving each upper cutter head portion 35 and each lower cutter head portion 39 in the Y direction. A pair of lower scribe heads 40 arranged in the longitudinal direction (X direction) and the longitudinal direction (X direction) of the guide rail that holds the pair of upper scribe heads 33 slidable in the X direction in the X direction. Even when the bonded panel substrate is inclined with respect to the longitudinal direction (X direction) of the guide rail that is slidably held, the cutter head is connected to each upper cutter head portion 35 and each lower cutter head portion 39. The scribe start position on the bonded panel substrate 90 can be accurately opposed. Accordingly, it is possible to accurately form a scribe line along each scheduled scribe line. Furthermore, in linear interpolation when each upper cutter head part 35 and each lower cutter head part 39 is moved in the X direction to form a scribe line, only each upper cutter head part 35 and each lower cutter head part 39 is Y By moving the upper guide rail 31 and the lower guide rail 32 in the Y direction or moving the bonded panel substrate, the linear interpolation along the X direction can be performed quickly and with high accuracy. This can be performed, and appropriate linear interpolation means can be selected according to the situation.

  In the above-described embodiment, the upper guide rail 31 and the lower guide rail 32 are each provided with a pair of the upper scribe head 33 and the lower scribe head 40, but each of the upper guide rail 31 and the lower guide rail 32 has 3 Two or more scribe heads may be provided. In addition, two or more scribe heads may be provided only on the upper guide rail 31 to form a scribe line for dividing a plurality of divided panel substrates from one large mother panel substrate.

  Alternatively, only the upper guide rail 31 or the lower guide rail 32 may be provided, and a plurality of upper scribe heads 33 may be provided on the upper guide rail 31 or the lower guide rail 32.

  In addition, the brittle material substrate for forming the scribe line is not limited to the bonded panel substrate, and may be a single panel substrate or may not be a panel substrate.

  As mentioned above, although this invention has been illustrated using preferable embodiment of this invention, this invention should not be limited and limited to this embodiment. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range based on the description of the present invention and the common general technical knowledge from the description of specific preferred embodiments of the present invention. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  The present invention relates to a scribing apparatus and a scribing method used for scribing a brittle material substrate such as a panel substrate used for a liquid crystal panel or the like. The scribing means of a plurality of scribing heads can be easily placed at predetermined scribing start positions. Can be aligned.

Claims (13)

A substrate holding means for holding the brittle material substrate in a horizontal state;
A plurality of scribing heads each having scribing means for scribing the brittle material substrate held by the substrate holding means;
A guide rail that slidably holds each of the plurality of scribe heads along the X direction, which is the longitudinal direction,
The brittle material substrate held by the substrate holding means and the guide rail are relatively movable along a Y direction orthogonal to the X direction;
Each of the scribe heads has a slide member provided so as to be slidable along the Y direction. By attaching the scribe means to the slide member, movement of the scribe means in the Y direction can be performed . A scribing apparatus characterized in that each of the plurality of scribing heads held on a rail can be controlled independently.   The scribing apparatus according to claim 1, wherein the substrate holding unit is capable of transporting the held brittle material substrate in the Y direction.   The scribing apparatus according to claim 1, wherein the guide rail is provided above the brittle material substrate held by the substrate holding means.   The scribing apparatus according to claim 3, wherein the brittle material substrate is a single panel substrate.   The guide rail is respectively provided above and below the brittle material substrate held by the substrate holding means, and each of the guide rails is provided with the plurality of scribe heads. The scribing device according to 1.   The scribing apparatus according to claim 5, wherein the brittle material substrate is a bonded panel substrate in which a pair of panel substrates are bonded together.   The scribing apparatus according to claim 6, wherein a roller that presses the upper surface of the bonded panel substrate is provided on any of the scribing heads provided on the guide rail above the brittle material substrate.   The scribing apparatus according to claim 1, wherein the scribing means includes a scribing wheel.   9. The scribing apparatus according to claim 8, wherein each of the scribing heads further includes means for pressing the scribing wheel against the brittle material substrate. A method for scribing the brittle material substrate with the scribing apparatus according to claim 1,
Positioning the guide rail with respect to the brittle material substrate held by the substrate holding means;
Next, the scribing heads are moved in the X direction along the guide rails, and the scribing means of the scribing heads are moved in the Y direction so that each of the scribing means is placed on the brittle material substrate. A process of facing each scribe start position;
A scribe method involving.   The brittle material substrate held by the substrate holding means and the guide rail are pressed against the scribe start positions, respectively, with the scribe heads respectively facing the scribe start positions, and the guide rail. The scribing method according to claim 10, further comprising a step of relatively moving along the line.   A step of pressing each of the scribe heads facing each of the scribe start positions to each of the scribe start positions and moving each of the scribe heads along the guide rail along the X direction; The scribing method according to claim 10, which includes the scribing method. The scribing method according to claim 12, wherein linear interpolation is performed by moving the scribing means in the Y direction while moving each of the scribing heads in the X direction along the guide rail.