KR20210039159A - Clamping apparatus - Google Patents

Abstract

An embodiment of the present invention provides a clamping apparatus used in bonding and debonding processes of electronic devices. The clamping apparatus includes a stage; a pallet loaded on the stage and to place a substrate having a pad for mounting an electronic device to be bonded or debonded; and a window clamp positioned above the stage, exposing the pad of the substrate to emit a beam during a bonding or debonding process, and covering the periphery of the pad. It is possible to prevent damage to other electronic components.

Description

Clamping device {CLAMPING APPARATUS}

The present invention relates to a clamping device, and more particularly, to a clamping device that prevents damage during bonding and debonding of an electronic device.

In general, electronic devices including semiconductor packages, integrated circuit chips (ICs), passive devices, and the like may be mounted on a printed circuit board by a surface mounting process (SMT). For example, an electronic device is bonded to a printed circuit board in a soldering method through a reflow process. When a defect is found in the bonded electronic device, the defective electronic device may be removed through a rework process and then replaced with a normal electronic device.

Usually, a solder pad may be provided on a printed circuit board for reflow and rework, and a solder ball corresponding to the solder pad may be provided on an electronic component.

Conventionally, as shown in FIG. 1, a method of heating a solder ball provided in an electronic component to a melting point using a heating means, for example, an infrared heater, is used for the reflow process and the rework process. I did. That is, the infrared heater heats the solder ball and bonds a device such as a semiconductor package to the printed circuit board or separates the bonded device.

However, according to this prior art, there are the following problems.

First, the hot air supplied in the process of performing a rework or reflow process for a specific electronic component is inevitably supplied to other electronic components adjacent to this specific component. For this reason, there is a problem of unintended adverse effects on electronic components other than the target of the rework or reflow process, that is, the bonding or debonding process.

This will be described in detail as follows. As disclosed in FIG. 1, according to the prior art, when the target of the rework is the electronic component A, the hot air for melting the solder balls provided in the electronic component A is not only the electronic component A, but also other electronic components adjacent to the electronic component A. Since they are also supplied to B and C, there is a problem in that the solder balls provided in the normal electronic components B and C are melted, causing an unintended adverse effect on the electronic components B and C.

Second, according to the prior art using only hot air, since the time required to supply hot air to reach the melting point of the solder ball during the rework or reflow process is long, there is a problem in that the overall process time increases and the product yield decreases.

For example, the mass reflow process, which is mainly used in the reflow process, is not economical because it takes about 10 to 30 minutes for the infrared heater to heat the solder ball to bond the semiconductor device to the substrate. There is this.

In order to solve this problem, a technology that reduces the time required to reach the melting point of the electrical connection pattern of the electronic device by irradiating a laser to the electrical connection pattern such as a solder ball of an electronic device or a pad formed on a printed circuit board is heated. It is disclosed. It is a technology to minimize the influence on other electronic devices by shortening the overall bonding and debonding process time by this technology.

However, even if a beam such as a laser is irradiated, other electronic devices that are not subject to the bonding or debonding process due to the vibration transmitted to the device, errors in the beam irradiation due to errors in alignment, and the influence of heat when using the heating means, etc. There is still a problem with the possibility of adverse effects. In particular, in the case of a flexible printed circuit board (FPCB), fine warping of the flexible substrate is likely to occur, and thus, the accuracy of laser irradiation may be problematic.

Accordingly, the electronic device and the printed circuit board need to be precisely and accurately aligned and their positions fixed during the bonding or debonding process.

An object of the present invention is to provide a clamping device that prevents other electronic devices from being damaged by heat and beams during a bonding or debonding process.

The technical problem to be achieved by the invention is not limited to the technical problem mentioned above, and other technical problems that are not mentioned can be clearly understood by those of ordinary skill in the technical field to which the present invention belongs from the following description. will be.

In order to achieve the above technical problem, an embodiment of the present invention provides a clamping device used in a bonding and debonding process of an electronic device. The clamping device includes a stage; A pallet loaded on the stage and on which a pad on which an electronic device to be bonded or debonded is mounted is placed; And a window clamp positioned above the stage, exposing the pad of the substrate to be irradiated with a beam during a bonding or debonding process, and covering a peripheral portion of the pad.

In an embodiment of the present invention, the clamping device may further include a pallet clamp clamping the edge of the pallet loaded on the stage.

In an embodiment of the present invention, the clamping device clamps the substrate placed on the pallet loaded onto the stage to be fixed on the stage, and a material clamp having an opening exposing the plurality of pads formed on the substrate. (material clamp); may be further included.

In an exemplary embodiment of the present invention, the window clamp includes: a cover portion having a hole formed to expose the pad of the substrate, and having both ends of the cover portions respectively positioned on upper surfaces of opposite edges of the opening of the material clamp; And spring portions respectively coupled to both ends of the cover portion, wherein the cover portion descends to clamp the peripheral portion of the pad during a bonding or debonding process, and when the process is completed, the cover portion rises by a restoring force of the spring portion May include;

In an embodiment of the present invention, the spring portion is coupled to the material clamp, and the clamping device may further include an arm unit for pressing or releasing the cover portion from the upper side of the cover portion.

In an embodiment of the present invention, the window clamp is detachably coupled to the material clamp, and the window clamp may be selected according to the substrate and the pad.

In an embodiment of the present invention, an arm unit having a body to which the spring portion is coupled, and a rod that is coupled to the body, and a clamping device presses the cover portion during a bonding or debonding process to clamp the peripheral portion of the pad ( arm unit); may further include.

In an embodiment of the present invention, the material clamp is disposed on both sides of the stage, respectively, the transfer unit for transferring the pallet onto the stage; Pallet clamps respectively positioned on the transfer portions on both sides of the pallet to clamp the edges of the pallets loaded on the stage; And a side frame having a side surface covering the transfer part and an upper surface on which the pallet clamp is installed.

In an embodiment of the present invention, the opening formed in the material clamp has a shape elongated in the conveying direction of the pallet by the conveying unit, and the two openings are formed side by side, and each opening has a plurality of the A window clamp may be positioned to correspond to each of the plurality of pads of the substrate.

In an embodiment of the present invention, the clamping device is installed on the side frame, the first driving unit for operating the pallet clamp; And a second driving unit installed on the side frame and configured to operate the material clamp.

According to an embodiment of the present invention, it is possible to provide a clamping device that prevents other electronic devices from being damaged by heat and beams during a bonding or debonding process by using a window clamp as a type of a mask on a pad of a substrate. have.

The effects of the present invention are not limited to the above effects, and should be understood to include all effects that can be inferred from the configuration of the invention described in the detailed description or claims of the present invention.

1 is a view for explaining an example of a reflow and rework method using a conventional hot air.
2 is a view showing a clamping device according to an embodiment of the present invention.
3 is a diagram for describing a clamping device in which a pallet is loaded.
4 is a diagram illustrating an example of a transfer unit.
5 is a view for explaining an example of a pallet clamp of a clamping device according to an embodiment of the present invention.
6 and 7 are views for explaining a window clamp of a clamping device according to an embodiment of the present invention.
8 is a diagram illustrating an example of a clamping device applied in a bonding and debonding process of an electronic device.

Hereinafter, the present invention will be described with reference to the accompanying drawings. However, the present invention may be implemented in various different forms, and therefore is not limited to the embodiments described herein. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and similar reference numerals are attached to similar parts throughout the specification.

Throughout the specification, when a part is said to be "connected (connected, contacted, bonded)" with another part, it is not only "directly connected", but also "indirectly connected" with another member in the middle. "Including the case. In addition, when a part "includes" a certain component, this means that other components may be further provided, not excluding other components, unless specifically stated to the contrary.

The terms used in the present specification are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present specification, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, but one or more other features. It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof does not preclude in advance.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a view showing a clamping device according to an embodiment of the present invention, FIG. 3 is a view for explaining a clamping device loaded with a pallet 100, and FIG. 4 is a view showing an example of a transfer unit 200.

The clamping device according to the present invention can be used in bonding and debonding processes of electronic devices. These clamping devices include the stage 1, the pallet 100, the conveying part 200, the pallet clamp 300, the material clamp 400, and the window clamp 500. ) Can be included.

The pallet 100 may be loaded on the stage 1. For example, the pallet 100 may be loaded in the direction of the arrow shown in FIG. 3 while the substrate is seated.

A pad 1120 (refer to FIG. 6) on which an electronic device to be bonded or debonded is mounted may be formed on the substrate. Such a substrate may be a printed circuit board, and in this embodiment, a description will be made focusing on a case where the substrate is a flexible printed circuit board (FPCB 1100).

The FPCB 1100 may be loaded onto the upper surface of the stage 1 as shown in FIG. 3 while being seated on the pallet 100.

Meanwhile, as shown in FIG. 4, the transfer unit 200 is positioned on both sides of the stage 1, and may include a roller 230 and a belt 210. As the lower edge of the pallet 100 is loaded on the belt 210, the pallet 100 may be transferred onto the upper surface of the stage 1 by rotation of the roller 230.

Referring back to FIG. 2, a material clamp 400 and a window clamp 500 to be described later may be positioned on the stage 1. As shown in FIG. 2, the material clamp 400 and the window clamp 500 may be located on an upper side spaced apart from the upper surface of the stage 1. In this case, as described above, the pallet 100 on which the FPCB 1100 is placed by the transfer unit 200 may be loaded between the upper surface of the stage 1 and the material clamp 400.

The clamping device may further include a side frame 600, a first driving unit 700 and a second driving unit 800.

The side frame 600 is installed to cover the transfer parts 200 on both sides of the stage 1, respectively, and protects the transfer parts 200. The conveying part 200 is covered through the side of the side frame 600, and the pallet clamp 300 may be mounted on the upper surface of the side frame 600.

The first driving unit 700 may be installed on the outer surface of the side frame 600. The first driving unit 700 may include a motor, and the pallet clamp 300 may be driven by this motor. Specifically, the first driving unit 700 may lift or lower the pallet clamp 300 to clamp the edge of the pallet 100 loaded by the transfer unit 200 or release the clamping.

The second driving unit 800 may be installed on the side of the side frame 600. The second driving unit 800 may raise and lower the material clamp 400 to be described later.

Referring to FIG. 3, the pallet 100 loaded on the stage 1 may be arranged to come to a predetermined position on the stage 1. In this case, the pallet 100 may be aligned based on an alignment mark formed on the FPCB 1100 or an alignment mark or hole formed on the pallet 100.

5 is a view for explaining an example of the pallet clamp 300 of the clamping device according to an embodiment of the present invention.

As illustrated in FIGS. 4 and 5, the pallet clamp 300 is operated to press the edge of the pallet 100 to clamp it. The pallet clamp 300 may be installed on the transfer part 200 on both sides, that is, on the top or side surfaces of the side frames 600 on both sides, respectively.

The pallet clamp 300 may include a support part 310 and an elastic pad 330 formed on a lower surface of the support part 310. When the support part 310 is lowered by the driving of the first driving part 700, the elastic pad 330 may press the edge of the pallet 100 and clamp it.

Thereafter, in order to fix the position of the FPCB 1100 on the pallet 100, the material clamp 400 may descend and press the FPCB 1100 with an appropriate pressure to fix the position on the pallet 100.

Referring back to FIGS. 3 and 5, the material clamp 400 may have a plate shape corresponding to the pallet 100, and the material clamp 400 partially exposes the FPCB 1100 on the pallet 100. An opening 410 may be formed. For example, the opening 410 formed in the material clamp 400 has a shape extending long in the conveying direction of the pallet 100, and two openings 410 may be formed side by side.

The second driving unit 800 may clamp the FPCB 1100 by raising and lowering the material clamp 400. In this embodiment, each window clamp 500 may be positioned at a position corresponding to the plurality of pads 1120 of the FPCB 1100 exposed through each opening 410.

6 and 7 are views for explaining a window clamp 500 of a clamping device according to an embodiment of the present invention.

The window clamp 500 is positioned above the stage 1 and may be coupled to the material clamp 400. The window clamp 500 exposes the pad 1120 of the substrate placed on the pallet 100 so that a beam is irradiated during the bonding or debonding process, and at the same time covers the periphery of the pad 1120 to prevent other electronic devices. Can be protected.

The window clamp 500 may include a cover part 510 and a spring part 530.

A hole 512 exposing the pad 1120 of the substrate may be formed in the cover part 510. That is, a beam area may be secured through the hole 512 of the cover part 510. That is, the cover part 510 may function as a mask in bonding and debonding processes.

Both ends of the cover part 510 may be positioned on upper surfaces of edges facing each other of the opening 410 of the material clamp 400. That is, the cover part 510 may span the opening 410 of the material clamp 400 in a direction orthogonal to the length direction of the opening 410 of the material clamp 400.

The spring portion 530 may be coupled to both ends of the cover portion 510, respectively. For example, the spring portion 530 is coupled to the coil spring 534, the pillar portion 532 penetrating the coil spring 534, the cover portion 510 and the pillar portion 532, respectively, and the cover portion ( It may include a connecting piece (not shown) for extending and compressing the coil spring 534 when the 510 is raised or lowered.

During the bonding or debonding process, the cover part 510 may descend due to an external force, and in this case, the coil spring 534 of the spring part 530 may be extended or compressed according to a connection method. That is, the cover part 510 may descend by an external force while receiving a restoring force by the spring part 530.

In this case, the hole 512 formed in the cover part 510 may correspond to the pad 1120 of the FPCB 1100. Accordingly, the peripheral portion of the FPCB 1100 may be covered by the cover portion 510. Here, as well as the cover part 510 in contact with the FPCB 1100, it is also possible to cover the cover part 510 without contacting the FPCB 1100.

When the bonding or debonding process is completed, the external force pressing the cover part 510 is removed, and accordingly, the cover part 510 may rise due to the restoring force of the spring part 530.

In this embodiment, the spring portion 530 may be detachably coupled to the material clamp 400. That is, the window clamp 500 may be detachably coupled to the material clamp 400. For example, a thread is formed around the surface of the lower end of the pillar portion 532 of the spring portion 530, and a nut groove to which the lower end of the pillar portion 532 is fastened may be formed in the material clamp 400.

The clamping device may further include an arm unit 900 for lifting and lowering the window clamp 500 (see FIG. 7 ). The arm unit 900 may include a body portion 910 and a rod portion 930 that is coupled to the body portion 910 and presses or releases the cover portion 510 from the upper side of the cover portion 510. have.

The rod part 930 performs a piston motion and may press the upper surfaces of both ends of the cover part 510. Accordingly, as the coil spring 534 of the spring part 530 is extended, the cover part 510 may be lowered. When the load is released after the process is completed, the cover part 510 may be raised by the restoring force of the coil spring 534.

Unlike that described in FIG. 7, the window clamp 500 may be coupled to the arm unit 900. For example, the arm unit 900 covers the body portion 910 to which the spring portion 530 is coupled, and is coupled to the body portion 910 and presses the cover portion 510 during the bonding or debonding process. It may also include a rod unit 930 for elevating and lowering the unit 510.

8 is a diagram illustrating an example of a clamping device applied to a bonding and debonding process of an electronic device.

The bonding and debonding apparatus of the electronic device may include a clamping device, a heating unit 6, a beam irradiation unit 3, and a control unit. Here, the clamping device may be the clamping device described in FIGS. 2 to 7.

The heating unit 6 heats a certain area including an electrical connection pattern (eg, a solder ball) of an electronic device to be bonded or debonded, or a pad 1120 for connection with an electrical device formed in the FPCB 1100. I can.

The beam irradiation unit 3 may be heated by irradiating a beam such as a laser onto an electrical connection pattern of an electronic device to be bonded or debonded or a pad 1120 of a substrate. The heating time can be shortened by the beam irradiation unit 3. The heating unit 6 and the beam irradiation unit 3 may be used selectively or may be used simultaneously.

To describe the operation process in detail, first, the FPCB 1100 is positioned on the pallet 100, the pallet 100 is clamped by the pallet clamp 300, and the FPCB 1100 is clamped by the material clamp 400. Can be. Thereafter, the cover part 510 of the window clamp 500 is lowered so that the pad 1120 of the FPCB 1100 may be exposed to correspond to the hole 512 of the cover part 510. A portion of the FPCB 1100 at the periphery of the pad 1120 may be covered by the cover part 510.

Accordingly, the cover part 510 may block heat from the heating part 6, for example, infrared rays. In addition, when an error occurs in which the beam irradiated to the pad 1120 of the substrate is irradiated to the peripheral portion for various reasons, the cover portion 510 may block the beam.

After the bonding or debonding process is completed, the window clamp 500 may be detached from the material clamp 400.

In this way, in the process of irradiating heat or beam, the case in which heat or beam is applied to an electronic device other than the target of the bonding or debonding process of the FPCB 1100 may significantly reduce the occurrence of damage.

The above description of the present invention is for illustrative purposes only, and those of ordinary skill in the art to which the present invention pertains will be able to understand that other specific forms can be easily modified without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are illustrative in all respects and are not limiting. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as being distributed may also be implemented in a combined form.

The scope of the present invention is indicated by the claims to be described later, and all changes or modified forms derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the scope of the present invention.

1: stage
100: pallet
200: transfer unit
210: belt
230: roller
300: pallet clamp
310: support
330: elastic pad
400: material clamp
410: opening
500: window clamp
510: cover part
512: hall
530: spring part
532: pillar
534: coil spring
700: first drive unit
800: second drive unit
900: arm unit
910: body part
930: rod part
1100: FPCB
1120: pad

Claims (10)

As a clamping device used in bonding and debonding processes of electronic devices,
stage;
A pallet loaded on the stage and on which a pad on which an electronic device to be bonded or debonded is mounted is placed; And
And a window clamp positioned above the stage, exposing the pad of the substrate to be irradiated with a beam during a bonding or debonding process, and covering a periphery of the pad; Clamping device.
The method of claim 1,
A clamping device further comprising a pallet clamp clamping an edge of the pallet loaded on the stage.
The method of claim 1,
And a material clamp that clamps the substrate placed on the pallet loaded onto the stage so as to be fixedly positioned on the stage, and has an opening exposing the plurality of pads formed on the substrate; Clamping device.
The method of claim 3,
The window clamp,
A cover portion formed with a hole exposing the pad of the substrate, and both ends of the cover portions respectively positioned on upper surfaces of opposite edges of the opening of the material clamp; And
Spring portions respectively coupled to both ends of the cover portion, wherein the cover portion descends to clamp the peripheral portion of the pad during a bonding or debonding process, and the cover portion rises by a restoring force of the spring portion when the process is completed; Clamping device comprising a.
The method of claim 4,
The spring part is coupled to the material clamp,
The clamping device further comprising: an arm unit for pressing or releasing the cover from the upper side of the cover.
The method of claim 5,
The window clamp is detachably coupled to the material clamp,
The clamping device, characterized in that the window clamp is selected according to the substrate and the pad.
The method of claim 4,
And an arm unit having a body to which the spring portion is coupled, and a rod coupled to the body and clamping a peripheral portion of the pad by pressing the cover portion during a bonding or debonding process; Clamping device.
The method of claim 4,
A transfer unit positioned on both sides of the stage with the material clamp interposed therebetween, and transferring the pallet onto the stage;
Pallet clamps respectively positioned on the conveying portions on both sides to clamp the edges of the pallets loaded on the stage; And
And a side frame having a side surface covering the transfer part and an upper surface on which the pallet clamp is installed.
The method of claim 8,
The opening formed in the material clamp has a shape elongated in the conveying direction of the pallet by the conveying part,
The clamping device, wherein the two openings are formed side by side, and in each opening, a plurality of the window clamps are positioned to correspond to the plurality of pads of the substrate, respectively.
The method of claim 8,
A first driving unit installed on the side frame and operating the pallet clamp; And
And a second driving unit installed on the side frame and configured to operate the material clamp.

Images