JP3896017B2 - Semiconductor mounting body manufacturing method and semiconductor mounting body manufacturing apparatus - Google Patents

Semiconductor mounting body manufacturing method and semiconductor mounting body manufacturing apparatus Download PDF

Info

Publication number
JP3896017B2
JP3896017B2 JP2002086616A JP2002086616A JP3896017B2 JP 3896017 B2 JP3896017 B2 JP 3896017B2 JP 2002086616 A JP2002086616 A JP 2002086616A JP 2002086616 A JP2002086616 A JP 2002086616A JP 3896017 B2 JP3896017 B2 JP 3896017B2
Authority
JP
Japan
Prior art keywords
semiconductor element
sheet
semiconductor
circuit board
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002086616A
Other languages
Japanese (ja)
Other versions
JP2003115510A (en
Inventor
義隆 砂川
祥剛 林
雅義 小山
善広 戸村
俊之 小島
修 柴田
龍一 斎藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2002086616A priority Critical patent/JP3896017B2/en
Publication of JP2003115510A publication Critical patent/JP2003115510A/en
Application granted granted Critical
Publication of JP3896017B2 publication Critical patent/JP3896017B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/751—Means for controlling the bonding environment, e.g. valves, vacuum pumps
    • H01L2224/75101—Chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75317—Removable auxiliary member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Description

【０００１】
【発明の属する技術分野】
本発明は、回路基板上に半導体素子を実装して半導体実装体を製造するための、半導体実装体の製造方法、および半導体実装体の製造装置である。
【０００２】
【従来の技術】
半導体プロセスの微細化技術の進歩に伴い半導体パッケージの形態もＱＦＰからμＢＧＡ、ＣＳＰ（チップサイズパッケージ）さらには、半導体ベアーチップを直接回路基板上に接続するフリップチップ実装へと進化している。
【０００３】
中でもフリップチップ実装は、半導体素子と回路基板とが直接実装されているため、高速信号処理を必要とする機器への応用展開が今後より一層加速するものと思われる。前述の実装技術を実現するためには、実装プロセス技術が必要不可欠であり、半導体素子と回路基板との接合を短時間でかつ確実な信頼性が確保できるように行う製造設備およびプロセス技術が特に重要である。
【０００４】
以下、前記フリップチップ実装技術を用いて実装を行った場合の一例について図面を参照して説明する。図１０は、従来の半導体実装体の製造装置を用いて、半導体素子を回路基板上にフリップチップ実装した構造体の構成とその製造手順を説明するための図面であり、図１１は、熱源と半導体素子が当接する位置に弾性体を配置し、フリップチップ実装を行う場合の模式図である。尚、図１０〜図１１において、同一部分には同一符号を付している。
【０００５】
図１０に示すように、半導体素子２の電極パッド１５上にＡｕ線を溶融して２段突起形状を有するバンプ１６を形成した後、バンプ１６の２段突起部に導電性接着剤１７を転写する。次に、半導体素子２をフェースダウンし、回路基板１にパターン形成した端子電極１８と接合し、前記導電性接着剤１７を硬化する。
【０００６】
次に、前記半導体素子２と回路基板１との隙間に液状のエポキシ系封止樹脂１１を充填した後、図１１に示すように、熱源７と半導体素子２が当接される位置に弾性体２２を配置し、その弾性体２２で半導体素子２の裏面を押圧しながら、前記封止樹脂１１を硬化する。
【０００７】
尚、ベース台２１は、回路基板１を取り付けるためのものである。このように、封止樹脂１１の加熱時の熱膨張による半導体素子２の突き上げ力より、大きな荷重で半導体素子２を押圧させながら硬化することで、接続抵抗値の増大や接合状態の不具合を最小限に防ぐことができる。
【０００８】
【発明が解決しようとする課題】
しかしながら、図１０で示した従来の構成の様に、回路基板１自体が、厚みがあり比較的剛性が高く、半導体素子２に近い熱膨張係数を有しかつ、少数の半導体素子２をフリップチップ実装する場合に関しては特に問題はないと思われるが、図１１に示すように、厚みおよび形状が異なった半導体素子２を回路基板１にフリップチップ実装する場合、必然的に厚い半導体素子２から順に低い方へと押圧が加わるため、一番高い半導体素子２に応力が集中し、大きなダメージを与える。
【０００９】
なお、このダメージを抑制させるための手段として、熱源７と半導体素子２が当接する位置に弾性体２２Ａ、２２Ｂ、２２Ｃなどの緩衝材を用いて、各半導体素子２の高さバラツキを吸収する方法を用いても、各半導体素子２の厚みバラツキが大きい程、弾性体２２Ｂに応力集中が作用するため、他の弾性体２２Ａおよび２２Ｃに均一な押圧を与えることは困難である。
【００１０】
また、弾性体２２Ｂの弾性変形体により、半導体素子２に位置ズレが生じる危険性がある。
【００１１】
また、回路基板１に異なった厚みおよび形状を有する多数個の半導体素子２が存在する場合は、前述の弾性体も全ての半導体素子２と相対した位置形状となるように取り付ける必要性がある。したがって製造装置的には、必然的に一品種だけに限定された専用機となるため多品種の場合においては、品種別に都度弾性体を設ける必要が生じるため、汎用性に問題を有する。
【００１２】
このように、異なった厚みおよび形状を有する多数個の半導体素子をフリップチップ実装するためには、従来の製造方法では困難を要する。
【００１３】
本発明は、上記の従来の問題点を考慮し、異なった厚みおよび形状を有する複数の半導体素子を回路基板上に実装する際、それら複数の半導体素子を実質上均一に加圧し半導体実装体を製造することができる半導体実装体の製造方法、および半導体実装体の製造装置を提供することを目的とするものである。
【００１８】
【課題を解決するための手段】
第一の本発明（請求項１に対応）は、回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造方法であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置工程と、
その配置工程の後に、前記シートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧工程と、
前記シートを加圧する少なくとも直前に、前記半導体素子に配置された前記シートの周辺を固定する固定工程とを備えた半導体実装体の製造方法である。
【００１９】
第二の本発明（請求項２に対応）は、前記シートを加圧する前に、前記シートの弛みをとる第一の本発明の半導体実装体の製造方法である。
【００２０】
第三の本発明（請求項３に対応）は、前記シートの弛みをとるとは、前記シートの外側から内側の順に前記シートの周辺を固定することである第二の本発明の半導体実装体の製造方法である。
【００２１】
第四の本発明（請求項４に対応）は、回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造方法であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置工程と、
その配置工程の後に、前記シートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧工程と、
前記シートを加圧する際、前記半導体素子が存在しない側から前記シートをヒータで加熱する加熱工程とを備えた半導体実装体の製造方法である。
【００２２】
第五の本発明（請求項５に対応）は、前記配置されたシートと前記ヒータとの間の距離を調節する第四の本発明の半導体実装体の製造方法である。
【００２３】
第六の本発明（請求項６に対応）は、回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造方法であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置工程と、
その配置工程の後に、前記シートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧工程とを備え、
前記シートは、シリコン又はブナーＳで形成され、０．０１ｍｍ〜３ｍｍの厚みを有するゴムシートである半導体実装体の製造方法である。
【００２４】
第七の本発明（請求項７に対応）は、回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造方法であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置工程と、
その配置工程の後に、前記シートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧工程とを備え、
前記シートは、ポリイミド、フッ素樹脂、ポリフェニレンサルファイド、ポリプロピレン、ポリエーテル、ポリカーボネート、若しくはクロルスルホン化ポリエチレン、又はそれらの複合体で形成され、０．０１ｍｍ〜１ｍｍの厚みを有する樹脂シートである半導体実装体の製造方法である。
【００２５】
第八の本発明（請求項８に対応）は、回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造方法であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置工程と、
その配置工程の後に、前記シートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧工程とを備え、
前記シートは、アルミニウム、銅、又はステンレスで形成され、０．０１ｍｍ〜０．５ｍｍの厚みを有する金属シートである半導体実装体の製造方法である。
【００２６】
第九の本発明（請求項９に対応）は、回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造方法であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置工程と、
その配置工程の後に、前記シートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧工程とを備え、
前記シートの前記半導体素子と接する側の面には、離型処理が施されている半導体実装体の製造方法である。
【００２７】
第十の本発明（請求項１０に対応）は、回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造方法であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置工程と、
その配置工程の後に、前記シートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧工程とを備え、
前記シートの前記半導体素子と接しない方の面には、熱吸収を高めるための着色処理が施されている半導体実装体の製造方法である。
【００２８】
第十一の本発明（請求項１１に対応）は、回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造方法であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置工程と、
その配置工程の後に、前記シートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧工程とを備え、
前記シートには、熱吸収を高めるための着色添加物が含まれている半導体実装体の製造方法である。
【００２９】
第十二の本発明（請求項１２に対応）は、回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造方法であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置工程と、
その配置工程の後に、前記シートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧工程と、
前記シートを配置する前に、前記半導体素子の近傍に前記シートを支持するための支持枠を配置する支持枠配置工程とを備えた半導体実装体の製造方法である。
【００３４】
第十三の本発明（請求項１３に対応）は、回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造装置であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置手段と、
前記配置されたシートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧手段と、
前記シートが加圧される少なくとも直前に、前記半導体素子に配置された前記シートの周辺を固定する固定手段とを備えた半導体実装体の製造装置である。
【００３５】
第十四の本発明（請求項１４に対応）は、前記シートを加圧する前に、前記シートの弛みをとる弛み除去手段を備えた第十三の本発明の半導体実装体の製造装置である。
【００３６】
第十五の本発明（請求項１５に対応）は、前記シートの弛みをとるとは、前記シートの外側から内側の順に前記シートの周辺を固定することである第十四の本発明の半導体実装体の製造装置である。
【００３７】
第十六の本発明（請求項１６に対応）は、回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造装置であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置手段と、
前記配置されたシートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧手段と、
前記シートが加圧される際、前記半導体素子が存在しない側から前記シートを加熱する加熱手段とを備えた半導体実装体の製造装置である。
【００３８】
第十七の本発明（請求項１７に対応）は、前記配置されたシートと前記加熱手段との間の距離を調節する距離調節手段を備えた第十六の本発明の半導体実装体の製造装置である。
【００３９】
第十八の本発明（請求項１８に対応）は、回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造装置であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置手段と、
前記配置されたシートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧手段とを備え、
前記シートは、シリコン又はブナーＳで形成され、０．０１ｍｍ〜３ｍｍの厚みを有するゴムシートである半導体実装体の製造装置である。
【００４０】
第十九の本発明（請求項１９に対応）は、回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造装置であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置手段と、
前記配置されたシートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧手段とを備え、
前記シートは、ポリイミド、フッ素樹脂、ポリフェニレンサルファイド、ポリプロピレン、ポリエーテル、ポリカーボネート、若しくはクロルスルホン化ポリエチレン、又はそれらの複合体で形成され、０．０１ｍｍ〜１ｍｍの厚みを有する樹脂シートである半導体実装体の製造装置である。
【００４１】
第二十の本発明（請求項２０に対応）は、回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造装置であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置手段と、
前記配置されたシートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧手段とを備え、
前記シートは、アルミニウム、銅、又はステンレスで形成され、０．０１ｍｍ〜０．５ｍｍの厚みを有する金属シートである半導体実装体の製造装置である。
【００４２】
第二十一の本発明（請求項２１に対応）は、回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造装置であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置手段と、
前記配置されたシートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧手段とを備え、
前記シートの前記半導体素子と接する側の面には、離型処理が施されている半導体実装体の製造装置である。
【００４３】
第二十二の本発明（請求項２２に対応）は、回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造装置であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置手段と、
前記配置されたシートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧手段とを備え、
前記シートの前記半導体素子と接しない方の面には、熱吸収を高めるための着色処理が施されている半導体実装体の製造装置である。
【００４４】
第二十三の本発明（請求項２３に対応）は、回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造装置であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置手段と、
前記配置されたシートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧手段とを備え、
前記シートには、熱吸収を高めるための着色添加物が含まれている半導体実装体の製造装置である。
【００４５】
第二十四の本発明（請求項２４に対応）は、回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造装置であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置手段と、
前記配置されたシートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧手段と、
前記シートが配置される前に、前記半導体素子の近傍に前記シートを支持するために配置されるべき支持枠とを備えた半導体実装体の製造装置である。
【００４６】
【発明の実施の形態】
以下に、本発明の実施の形態を図面を参照して説明する。
【００４７】
（第１の実施の形態）
まず、本発明の第１の実施の形態を図面を参照して説明する。
【００４８】
図１は、本発明の第１の実施の形態における半導体実装体の製造装置の構成を示すとともに、半導体素子を回路基板上にフリップチップ実装した実装体の全体構成と製造手順を説明するための図であり、図２は、その詳細図である。
【００４９】
以下に、図１及び図２を用いて、本第１の実施の形態における半導体実装体の製造方法及び製造装置を説明する。
【００５０】
図１および図２に示すように、回路基板１上にフリップチップ実装にて搭載された複数個の半導体素子２の上面に配置した、フレキシブルに変形するシート材３の下面には、枠状のフレームに凹形状の溝加工が施された吸着機構４と、シート材３を半導体素子２の裏面近傍まで移動させる昇降機構５が設けられている。その昇降機構５は例えばバネ等の弾性体で構成されている。シート材３の上方には、上チャンバー６に熱源７が内蔵された一体構造体Ｓが配置され、かつ上チャンバー６の一部に加圧口８が構成されている。なお、図１および図２において、回路基板１と各半導体素子２との隙間には封止樹脂１１が配置されているものとする。その封止樹脂１１は、ペースト状のものであってもよいし、シート状のものであってもよい。
【００５１】
このように構成された半導体実装体の製造装置において、一体構造体Ｓをシート材３の方へ下降させ上チャンバー６を吸着機構４に載せると、上チャンバー６の重さにより昇降機構５によって吸着機構４が下降し、シート材３の周辺が固定されるとともに、シート材３が各半導体素子２の上面に配置される。次に、加圧口８から、空気もしくは圧縮ガスを上チャンバー６内に供給することで、図２に示すように、空気圧はシート材３に伝達され、半導体素子２は均一な圧力で押圧される。
【００５２】
そして熱源７をシート材３に近づけることにより、熱源７の輻射熱がシート材３を介して、封止樹脂１１に伝達されるため、厚みおよび形状が異なった多数個の半導体素子２を実質上均一に加圧することができる。その結果、短時間に一括で加圧加熱処理を実現することができる。
【００５３】
なお、図１３に示すように、シート材３に空気圧を供給した際、シート材３の硬度が極めて低くその厚みも極薄形状である場合、必然的に引張り弾性係数も低くなる。すると、半導体素子２の裏面に充填された封止樹脂１１は、シート材３で密閉された状態となり、その内部応力の影響でａ部に示すように封止樹脂１１が半導体素子２の上面に這い上がる現象が生じ、半導体素子２の外観を損ない品質が低下する。そして、マザー基板にＣＳＰ（チップサイズパッケージ）実装を行う際、半導体素子２の表面に封止樹脂１１が付着していると、実装機の吸着エラーが発生し、実装を行う上で大きな問題となる。
【００５４】
また、図１４に示すように、隣接した半導体素子２の距離Ｌが長いと、さらにシート材３が回路基板１の面に密着される。このため、上述と同様の現象が生じてしまう。
【００５５】
そこで、このような現象の発生を抑制するため、図１５に示すように、シート材３が回路基板１の面と接しないような硬度と厚みと引張弾性係数とを有し、かつ半導体素子２間の距離Ｌがあまり大きくならないようにする。すると、シート材３と回路基板１との間に発生したギャップｄの影響によりＡおよびＢ方向にリークパスができて、シート材３はその一部が回路基板１に接しなくなる。このため、半導体素子２の表面に付着した封止樹脂１１の影響を最小限に抑制することができ、品質向上を図ることができる。
【００５６】
もちろん、シート材３は、図１６に示されているように、一部が回路基板１に接していても、一部（もちろん、半導体素子２に触れない部分の内の一部）が回路基板１に接していなければよい。
【００５７】
なお、空気圧を供給するタイミングを調節して、加圧が行われる少なくとも直前には、シート材３が半導体素子２および／または封止樹脂１１に接しないようにすることもできる。
【００５８】
また、下チャンバー９に構成された熱源１０は回路基板１の予備加熱と封止樹脂１１の注入性を高めるための加熱を行うものであり、排気口Ａはシート材３を吸着させるものであり、排気口Ｂはシート材３の上方と下方に差圧を生じさせるためのものであり、シール用弾性体１２はシート材３の上方と下方とでのリークを防ぐシール材である。断熱板１３は熱遮蔽するため断熱材であり、高さ規制用ネジ１４は熱源７と半導体素子２との高さを調整するものである。
【００５９】
また、シート材３は、例えば、０．０１ｍｍ〜３ｍｍの厚みで構成されるシリコン、ブナーＳなどのゴムシート材や、０．０１ｍｍ〜１ｍｍの厚みで構成されるポリイミド、フッ素樹脂、ポリフェニレンサルファイド、ポリプロピレン、ポリエーテル、ポリカーボネート、クロルスルホン化ポリエチレンなどの樹脂シート材や、０．０１ｍｍ〜０．５ｍｍの厚みで構成される、アルミニウム、銅、ステンレスなどの金属シート材である。また、そのシート材３は輻射熱の吸収性の良い材料を用いてもよい。
【００６０】
また、シート材３は、上述したシリコン、ブナーＳなどのゴムシート材や、ポリイミド、フッ素樹脂、ポリフェニレンサルファイド、ポリプロピレン、ポリエーテル、ポリカーボネート、クロルスルホン化ポリエチレンなどの樹脂シート材や、アルミニウム、銅、ステンレスなどの金属シート材の複合材で構成されたシートであってもよい。
【００６１】
また、シート材３の半導体素子２と接する側の面に離型処理を施すことにより、封止樹脂１１の付着が抑制でき、たとえ封止樹脂１１が付着してもその洗浄が簡略化されるため、作業効率が改善される。
【００６２】
また、シート材３の半導体素子２と接しない側に熱吸収を高めるための着色処理を施すことにより、早い熱吸収性が得られ、封止樹脂１１の短時間熱硬化ができる。
【００６３】
また、シート材３に着色添加物を加えておくことにより、上述と同様の効果が得られる。
【００６４】
また、ゴムシート材、樹脂シート材、金属シート材等で構成された複合体（例えば、シリコンゴムシート材と金属シート材の組み合わせ）に上述した離型処理と着色処理を施すことにより、弾性体のシリコンゴムでシート材３の半導体素子２との接触によるダメージの抑制と封止樹脂１１のシート材３への付着防止を行い、熱伝達に優れた金属シート材でシート材３の熱吸収性を向上させることができる。
【００６５】
また、複数個の凹形状の溝を構成した吸着機構を用いて、シート材３の外側から順次シート材３を半導体素子２に吸着させることにより、シート材３のたるみが矯正され、安定した架張を得ることができる。
【００６６】
より具体的には、図１７に示されているように、（１）はじめに吸着機構４′における外側に形成された溝４ａを利用してシート材３を吸着し、（２）つぎに吸着機構４′における内側に形成された溝４ｂを利用してシート材３を吸着することで、シート材３の外側から内側の順にシート材３の周辺を固定するとともに、張力を発生させてシート材３の弛みをとってもよい。なお、溝４ａ〜４ｂの四隅が角丸に形成されていることにより、シート材３の吸着が不要な皺の発生をともなうことなく行われる。
【００６７】
さらに、前述のシート材３の架張は、真空吸着以外の手法で行ってもよい。例えば、シート材３を矢印Ｘの方向に供給する供給リール３ａとそれを巻き取る巻き取りリール３ｂとをモーター駆動し、ある一定の架張で制御しても構わない。さらに、供給リール３ａ側と巻き取りリール３ｂ側の周辺にテンションゲージなどを設け、その出力値を読み取り制御することにより、シート材３に対して安定した架張を与えることも可能である。
【００６８】
また、排気口Ｂを介して下チャンバー９を減圧状態にすることにより、下チャンバー９の上面に配置したシート材３が吸着される。この時、回路基板１に搭載された半導体素子２の裏面もシート材３の吸着効果により押圧が作用するため、前述の空気圧による加圧方式に対して負圧方式でも同じように加圧加熱硬化することができる。
【００６９】
また、シート材３を基準に例えば、シート材３の上面側に１気圧の空気圧を、下面側に減圧によるマイナス１気圧の負圧を供給させることにより、半導体素子２の裏面はプラス１気圧とマイナス１気圧でトータル２気圧の相乗効果を得ることができるため、半導体素子２への押圧力が、空気圧だけでは不足する場合に有効な手段である。
【００７０】
なお、上述した実施の形態では、本発明の半導体実装体の製造装置の、配置手段の一例として吸着機構４、昇降機構５及び上チャンバー６を、加圧手段の一例として加圧口８（気体供給手段の一例）及び排気口Ｂ（気体排除手段の一例）を、固定手段の一例として吸着機構４及び上チャンバー６を、加熱手段の一例として熱源７を、それぞれ用いた。
【００７１】
また、弛み除去手段の一例として吸着機構４（吸着機構４′）を用いた。
【００７２】
また、上述した実施の形態における熱源７としては、カートリッジヒーター、セラミックヒーター、シーズヒーター、ハロゲンランプ、赤外線若しくは高周波を用いたヒーターの何れを用いることもできる。
【００７３】
（第２の実施の形態）
次に、本第２の実施の形態における半導体実装体の製造装置の構成について図面を参照して説明する。なお、第２の実施の形態と第１の実施の形態の半導体実装体の製造装置は共通点が多いので、第２の実施の形態では、相違点のみを説明する。
【００７４】
図３は、シート材３を半導体素子２の上面に配置する前に、半導体素子２の近傍に配置される支持枠Ａの全体構成を示す斜視図であって、その支持枠Ａはシート材３を支持するためのものである。図４は、支持枠Ａが半導体素子２の近傍に配置された後に各半導体素子２の上面にシート材３を配置し、そのシート材３で各半導体素子２を加圧する状態を示す図である。
【００７５】
図３および図４に示すように、回路基板１に配置された支持枠Ａの各開口部は、対応する各半導体素子２より大きく、かつ半導体素子２の高さと実質上同等となるように、支持枠Ａの厚み調整が施されている。
【００７６】
このように形成された支持枠Ａを、その支持枠Ａの各開口部が対応する半導体素子２を囲むように回路基板１上に配置した上で、シート材３をかぶせて加圧すると、例えば、支持枠Ａが存在しない場合は、図４の点線部ａに示すように、シート材３は半導体素子２を押さえ込もうとする力が作用するため、無理なテンションが半導体素子２に伝わりダメージを与えたり、シート材３を破損する危険性があるが、これに対して、支持枠Ａを取り付けた場合は、半導体素子２に集中した応力が作用するため、より安定した加圧加熱が維持され半導体素子２の接続信頼性を向上することが可能となる。
【００７７】
また、図１２に示すような、実装された多数個の半導体素子２の全体領域より、大きな開口部を有する支持枠Ｂを、図５に示すように、その開口部が全部の半導体素子２を囲むように回路基板１上に配置した場合においても、シート材３のテンションは、支持枠Ｂで緩衝されるため、半導体素子２へのダメージを最小限に抑えた状態で加圧加熱することができる。
【００７８】
（第３の実施の形態）
次に、本第３の実施の形態における半導体実装体の製造装置の加熱構成とその動作について図面を参照して説明する。なお、第３の実施の形態と第１の実施の形態の半導体実装体の製造装置は共通点が多いので、第３の実施の形態では、相違点のみを説明する。
【００７９】
図６は、熱源７の設定温度と封止樹脂１１の昇温速度の相対関係を示した温度プロファイルである。
【００８０】
本加熱硬化方式は、輻射熱を用いているため、熱源７自体の設定温度と昇温速度は必然的に相対関係を有している。例えば、図６に示すように、横軸に封止樹脂１１の昇温速度の時間を、縦軸に封止樹脂１１の温度を表すと、熱源７の設定温度が１７０度である場合、所望の目標到達温度（１５０度〜１６０度）に到達するまでの所要時間は約１２０秒である。なお、熱源７とシート材３との距離を１．０ｍｍとした。
【００８１】
これに対して、熱源７の設定温度が２６０度である場合は、所望の目標到達温度（１５０度〜１６０度）に約２０秒程度で到達する。尚、条件としては、半導体素子２と熱源７との距離は一定でシート材３を介した封止樹脂１１の温度測定である。
【００８２】
このことから、熱源７自体の設定温度を高温（例えば２６０度）に設定してシート材３に近接させ、封止樹脂１１が所望の目標到達温度（１５０度〜１６０度）に到達した後、熱源７の設定温度を保ったままシート材３と熱源７との空間距離を広げ、封止樹脂１１が所望の設定温度を維持するような温度プロファイル制御をすることにより、短時間で封止樹脂１１を昇温させることができるとともに、短時間で封止樹脂１１を硬化させることができ、熱硬化時間を大幅に短縮することができる。
【００８３】
本実施の形態では、熱源７に昇降自在なエアーシリンダー（図示せず）が設けられており、そのシャフトの先端には、ある一定量の傾斜を付けたカムが設けられていて、エアーシリンダーの流量切り換えにより、任意の位置に簡単にカムを動作させることができ、それによりシート材３に対する熱源７の高さを容易に変更することができる構成になっている。
【００８４】
また、上述の熱源７を昇降させるために、電気的制御を有するステッピングモーターやパルスモーターなどを用いても構わない。
【００８５】
なお、上記の熱源７を昇降するための手段は、本発明の半導体実装体の製造装置の距離調節手段に該当し、その距離調節手段の一例として図２に示す高さ規制用ネジ１４も該当する。
【００８６】
（第４の実施の形態）
次に、本第４の実施の形態における半導体実装体の製造方法について図面を参照して説明する。尚、本第４の実施の形態は第１の実施の形態に用いた図面を参考に説明する。
【００８７】
図１は、半導体実装体の製造方法の全体構成を説明するための断面図であり、図２は、その詳細図である。
【００８８】
図１および図２に示すように、回路基板１上にフリップチップ実装にて搭載された複数個の半導体素子２を有する実装体を熱源１０上に配置し、回路基板１と半導体素子２との隙間に封止樹脂１１を配置しておく。そして、図１および図２に示すように、枠状のフレームに凹形状の溝加工が施された吸着機構４にフレキシブルに変形するシート材３を載置した後、排気口Ａを真空に引くことにより、シート材３が半導体素子２に吸着し一定圧に架張を維持することができる。さらに吸着機構４には、複数個の凹形状の溝が設けられているため、シート材３を外側から順次吸着させることにより、シート材３のたるみが矯正され、より安定した架張を得ることができる。
【００８９】
さらに、吸着機構４の下側には、半導体素子２全体より離れた位置にシート材３が架張されるように圧縮バネを内蔵した昇降自在な機能を有する昇降機構５が設けられているため、作業者がシート材３を取り付ける際における、封止樹脂１１の付着やなんらかの半導体素子２に対する不具合を解消することができる。
【００９０】
次に、熱源７を内蔵し一体構造を有した上チャンバー６を下降すると上チャンバー６の自重により、昇降機構５にも追従した動作が伝わるため、吸着機構４に吸着したシート材３は半導体素子２の裏面近傍まで移動される。
【００９１】
この後、上チャンバー６の一部に設けられた加圧口８から、空気もしくは圧縮ガスを上チャンバー６内に供給し、圧力をシート材３に加えることにより、図２に示すように、空気圧はシート材３を介して、半導体素子２に伝達されるため、異なった厚みや形状を有する多数個の半導体素子２を均一な圧力で押圧することができる。
【００９２】
次に、チャンバー６に内蔵された熱源７をシート材３に近づけると、熱源７の輻射熱は、前述と同様にシート材３を介して、半導体素子２に介在させた封止樹脂１１にも伝達されるため、封止樹脂１１を加熱硬化することができる。
【００９３】
このように、半導体素子２に均一な押圧を維持させた状態で、かつ熱源７とシート材３とを非接触にして輻射熱で封止樹脂１１の加圧加熱硬化工程を一括に処理することが実現できるため、生産性および接続信頼性を大幅に向上させることが可能となる。
【００９４】
また、熱源７と半導体素子２の隙間は、輻射熱との温度依存性に左右されるため、熱源７に設けた高さ規制用ネジ１４の微調整により、輻射熱の空間ギャップ調整を簡単に得ることができる。
【００９５】
また、半導体素子２に一定の加圧を与えた状態で封止樹脂１１を加熱硬化させるために用いるシート材３は、例えば、０．０１ｍｍ〜３ｍｍの厚みで構成されるシリコン、ブナーＳなどのゴムシート材や、０．０１ｍｍ〜１ｍｍの厚みで構成されるポリイミド、フッ素樹脂、ポリフェニレンサルファイド、ポリプロピレン、ポリエーテル、ポリカーボネート、クロルスルホン化ポリエチレンなどの樹脂シート材や、０．０１ｍｍ〜０．５ｍｍの厚みで構成される、アルミニウム、銅、ステンレスなどの金属シート材を有するシートである。
【００９６】
また、シート材３の半導体素子２と接する側の面に離型処理を施しておくことにより、封止樹脂１１の付着が抑制でき、たとえ封止樹脂１１が付着してもその洗浄が簡略化されるため、作業効率が改善される。
【００９７】
また、シート材３の半導体素子２と接しない側の面に熱吸収を高めるための着色処理を施すことにより、早い熱吸収性が得られ、封止樹脂１１の短時間熱硬化ができる。
【００９８】
また、シート材３に着色添加物を加え場合においても、上述と同様の効果が得られる。
【００９９】
また、シート材３は、ゴムシート材、樹脂シート材、金属シート材等の複合体に上述した離型処理と着色処理を施すことにより後述のような効果が得られる。例えば、シリコンゴムシート材と金属シート材を組み合わせることにより、弾性体のシリコンゴムで半導体素子２と接触する際のダメージが抑制され、かつ封止樹脂１１の付着防止を行うことができる。さらに、弾性体の半導体素子２と接しない側の面に高剛性で熱伝達に優れた金属シート材を形成しておくと、早く熱を吸収することができる。さらに、金属シート材に押圧を加えた場合、半導体素子２の形状が球状であれば特に問題はないが、正方形もしくは長方形を有しているとコーナーのエッジ部の応力によって、シート材に痕跡が生じるが、シート材３を金属シート材とシリコンゴムの複合体で構成しておくと、シリコンゴムによって痕跡が吸収されるため、シート自体のリサイクルが可能となり、材料コストを大幅に削減することができる。
【０１００】
また、図４に示すように、回路基板１に搭載された複数個の各半導体素子２に対応する複数個の開口部を有し、かつ半導体素子２の高さと実質上同等の厚み調整が施された支持枠Ａを、その支持枠Ａの各開口部が対応する半導体素子２を囲むように配置すると、シート材３を押さえ込もうとする応力が減少し、無理なテンションが半導体素子２に作用しないため、安定した接続信頼性を得ることができる。
【０１０１】
また、図１２に示すような、実装された多数個の半導体素子２の全体領域より、大きな開口部を有する支持枠Ｂを、図５に示すように、その開口部が全部の半導体素子２を囲むように回路基板１上に配置した場合においても、シート材３のテンションは、支持枠Ｂで緩衝されるため、半導体素子２へのダメージを最小限に抑えることができる。
【０１０２】
また、回路基板１に搭載された複数個の半導体素子２は、少なくとも２種類以上の形状または厚みを有するマルチチップモジュールであっても、等圧の押圧を与えた状態で封止樹脂１１を一括で加圧加熱硬化させることが可能である。
【０１０３】
また、回路基板１上に半導体素子２以外の電子部品が混載している場合においても、上述と同じ効果を得ることができる。
【０１０４】
（第５の実施の形態）
次に、本第５の実施の形態における半導体実装体の製造方法について図面を参照して説明する。
【０１０５】
図７は、半導体実装体の製造方法がＳＢＢ方式（スタッドバンプボンディング）である場合における工程を示す断面図であり、図８は、ペースト状もしくはシート状の封止材を用いて半導体実装体を製造する製造工程を示す断面図であり、図９は、電極パッドにハンダもしくは金メッキのバンプが形成された半導体素子を用いた半導体実装体の製造方法を示す断面図である。
【０１０６】
図７に示すように、半導体素子２の電極パッド１５にバンプ１６を形成する工程と、バンプ１６に導電性接着剤１７を転写する工程と、半導体素子２を回路基板１の端子電極１８にフリップチップ実装する工程と、導電性接着剤１７を乾燥する工程と、半導体素子２と回路基板１との隙間に封止樹脂１１を充填する工程を有するＳＢＢ実装方式に対しても、上述したように半導体素子２の上面に、フレキシブルに変形するシート材３を配置し、半導体素子２の裏面を加圧しながら封止樹脂１１を一括に加熱硬化処理することが可能である。
【０１０７】
また、シート材３を介した加圧効果により、バンプ１６と端子電極１８は確実に接合されるため、２段突起形状を有するバンプ１６全体に導電接着剤１７を均一に管理された量を転写する必要性が解消され、転写量の工程管理が省略できるとともに、導電性接着剤１７の量を抑制することができ、隣接したバンプ１６への導電性接着剤１７の付着が抑えられるため、８０μｍ以下を有する狭ピッチな半導体素子２に対しても、第１の実施の形態等で説明した半導体実装体の製造方法を有効に用いることができる。
【０１０８】
また、図８に示すように、電極パッド１５にバンプを形成する工程と、回路基板１上にペースト状１９の封止材を塗布するかもしくはシート状の封止材を貼り付ける工程を有する半導体実装体の製造方法に対しても、半導体素子２を実装時に封止材を加圧加熱状態で仮硬化させた後、フレキシブルに変形するシート材３で複数数個の半導体素子２の裏面を加圧させながら、封止材を一括で加熱本硬化処理することができるため、実装時間が短縮でき、生産性を向上することができる。
【０１０９】
また、図９に示すように、半導体素子２の電極パッド１５にハンダバンプ２０を形成した工程の後に、シート材３を用いて半導体素子２の裏面を加圧し、ハンダバンプ２０を溶融させることにより、前述と同様の一括処理が可能である。
【０１１０】
また、半導体素子２の電極パッド１５に金メッキバンプを形成した工程の後に、シート材３を用いて半導体素子２の裏面を加圧し、前記バンプを熱圧着することにより、前述と同様の効果を得ることができる。
【０１１１】
【発明の効果】
以上説明したところから明らかなように、本発明は、異なった厚みおよび形状を有する複数の半導体素子を回路基板上に実装する際、それら複数の半導体素子を実質上均一に加圧し半導体実装体を製造することができる半導体実装体の製造方法及び製造装置を提供することができる。
【図面の簡単な説明】
【図１】本発明の第１及び第４の実施の形態の半導体実装体の製造装置の断面図
【図２】本発明の第１及び第４の実施の形態の半導体実装体の製造方法を説明するための図
【図３】本発明の第２及び第４の実施の形態の支持枠の斜視図
【図４】本発明の第２及び第４の実施の形態の半導体実装体の製造方法を説明するための図
【図５】本発明の第２及び第４の実施の形態の半導体実装体の製造方法を説明するための図
【図６】本発明の第３の実施の形態の半導体実装体の製造装置の熱源の設定温度と昇温速度の相対関係を示した温度プロファイルを示す図
【図７】本発明の第５の実施の形態の、ＳＢＢ方式における半導体実装体の製造方法を説明するための図
【図８】本発明の第５の実施の形態の、ペースト状もしくはシート状の封止材を用いた場合における半導体実装体の製造方法を説明するための図
【図９】本発明の第５の実施の形態の、半導体素子の電極パッドにハンダもしくは金メッキのバンプを形成した場合における半導体実装体の製造方法を説明するための図
【図１０】従来の半導体実装体の製造装置を用いて、半導体素子を回路基板上にフリップチップ実装した構造体の構成とその製造手順を説明するための図
【図１１】従来の半導体実装体の製造装置で半導体実装体を製造する際、弾性体を用いて半導体素子を回路基板上にフリップチップ実装する状態を示す図
【図１２】本発明の第２及び第４の実施の形態の支持枠の斜視図
【図１３】本発明の第１の実施の形態の封止樹脂１１の這い上がり現象の説明図（その１）
【図１４】本発明の第１の実施の形態の封止樹脂１１の這い上がり現象の説明図（その２）
【図１５】本発明の第１の実施の形態のシート材３が回路基板１に接しない状態の説明図（その１）
【図１６】本発明の第１の実施の形態のシート材３が回路基板１に接しない状態の説明図（その２）
【図１７】本発明の第１の実施の形態の溝４ａ〜４ｂを有する吸着機構４′の説明図
【図１８】本発明の第１の実施の形態の供給リール３ａ、巻き取りリール３ｂの説明図
【符号の説明】
１ 回路基板
２ 半導体素子
３ シート材
４ 吸着機構
５ 昇降機構
６ 上チャンバー
７、１０ 熱源
８ 加圧口
９ 下チャンバー
１１ 封止樹脂
１２ シール用弾性体
１３ 断熱板[0001]
BACKGROUND OF THE INVENTION
The present invention is a method for manufacturing a semiconductor package and a semiconductor package manufacturing apparatus for manufacturing a semiconductor package by mounting a semiconductor element on a circuit board.
[0002]
[Prior art]
With the advancement of semiconductor process miniaturization technology, the form of a semiconductor package has evolved from QFP to μBGA, CSP (chip size package), and further to flip chip mounting in which a semiconductor bare chip is directly connected to a circuit board.
[0003]
In particular, in flip chip mounting, since the semiconductor element and the circuit board are directly mounted, it is considered that application development to equipment requiring high-speed signal processing will further accelerate in the future. In order to realize the above-mentioned mounting technology, mounting process technology is indispensable, and manufacturing equipment and process technology that can ensure reliable reliability in a short period of time between bonding of a semiconductor element and a circuit board are particularly important. is important.
[0004]
Hereinafter, an example of mounting using the flip chip mounting technique will be described with reference to the drawings. FIG. 10 is a diagram for explaining the configuration of a structure in which a semiconductor element is flip-chip mounted on a circuit board and the manufacturing procedure thereof using a conventional semiconductor package manufacturing apparatus, and FIG. It is a schematic diagram in the case where an elastic body is arranged at a position where a semiconductor element abuts and flip chip mounting is performed. 10 to 11, the same parts are denoted by the same reference numerals.
[0005]
As shown in FIG. 10, after the Au wire is melted on the electrode pad 15 of the semiconductor element 2 to form a bump 16 having a two-step protrusion shape, the conductive adhesive 17 is transferred to the two-step protrusion portion of the bump 16. To do. Next, the semiconductor element 2 is faced down, joined to the terminal electrode 18 patterned on the circuit board 1, and the conductive adhesive 17 is cured.
[0006]
Next, after filling the gap between the semiconductor element 2 and the circuit board 1 with a liquid epoxy-based sealing resin 11, as shown in FIG. 11, the elastic body is placed at a position where the heat source 7 and the semiconductor element 2 are in contact with each other. The sealing resin 11 is cured while pressing the back surface of the semiconductor element 2 with the elastic body 22.
[0007]
The base table 21 is for mounting the circuit board 1. In this way, by hardening the semiconductor element 2 while pressing the semiconductor element 2 with a larger load than the push-up force of the semiconductor element 2 due to thermal expansion at the time of heating the sealing resin 11, an increase in connection resistance value and a defect in the joining state are minimized. Can be prevented as much as possible.
[0008]
[Problems to be solved by the invention]
However, as in the conventional configuration shown in FIG. 10, the circuit board 1 itself is thick and relatively rigid, has a thermal expansion coefficient close to that of the semiconductor element 2, and a small number of semiconductor elements 2 are flip-chiped. Although it seems that there is no particular problem with respect to the mounting, as shown in FIG. 11, when the semiconductor element 2 having a different thickness and shape is flip-chip mounted on the circuit board 1, it is inevitably from the thick semiconductor element 2 in order. Since the pressure is applied to the lower side, stress concentrates on the highest semiconductor element 2 and causes a great damage.
[0009]
As a means for suppressing this damage, a method of absorbing the height variation of each semiconductor element 2 by using a buffer material such as elastic bodies 22A, 22B, 22C at the position where the heat source 7 and the semiconductor element 2 abut. However, since the stress concentration acts on the elastic body 22B as the thickness variation of each semiconductor element 2 increases, it is difficult to apply a uniform pressure to the other elastic bodies 22A and 22C.
[0010]
Further, there is a risk that the semiconductor element 2 is displaced due to the elastic deformation body of the elastic body 22B.
[0011]
Further, when there are a large number of semiconductor elements 2 having different thicknesses and shapes on the circuit board 1, it is necessary to attach the above-described elastic body so as to have a position shape opposed to all the semiconductor elements 2. Therefore, since the manufacturing apparatus is inevitably limited to only one product type, in the case of many product types, it is necessary to provide an elastic body for each product type.
[0012]
Thus, in order to flip-chip mount a large number of semiconductor elements having different thicknesses and shapes, it is difficult to use conventional manufacturing methods.
[0013]
In the present invention, in consideration of the above-described conventional problems, when mounting a plurality of semiconductor elements having different thicknesses and shapes on a circuit board, the plurality of semiconductor elements are substantially uniformly pressed to form a semiconductor mounting body. An object of the present invention is to provide a method for manufacturing a semiconductor package and a manufacturing apparatus for the semiconductor package that can be manufactured.
[0018]
[Means for Solving the Problems]
  FirstoneThe present invention (claims)1Corresponds to)One or a plurality of semiconductor elements are mounted on a circuit board, and a manufacturing method of a semiconductor mounting body in which a sealing resin is disposed in a gap between the circuit board and the semiconductor element,
An arrangement step of arranging a sheet whose shape is flexibly deformed on a surface of the semiconductor element that does not face the circuit board;
After the arrangement step, the side where the semiconductor element does not exist and the semiconductor element so that the air pressure on the side where the semiconductor element does not exist is higher than the pressure on the side where the semiconductor element exists based on the sheet A pressure step for providing a pressure difference to the side on which the semiconductor element exists and pressurizing the semiconductor element with the sheet;
At least immediately before pressurizing the sheet, the periphery of the sheet disposed on the semiconductor element is fixed.FixedProcessWhenWithHalfIt is a manufacturing method of a conductor mounting body.
[0019]
  FirsttwoThe present invention (claims)2Correspond to the above) to remove the slack of the sheet before pressurizing the sheet.oneIt is the manufacturing method of the semiconductor mounting body of this invention.
[0020]
  FirstthreeThe present invention (claims)3) Is that the loosening of the sheet is to fix the periphery of the sheet in order from the outside to the inside of the sheet.twoIt is the manufacturing method of the semiconductor mounting body of this invention.
[0021]
  FirstFourThe present invention (claims)4Corresponds to)One or a plurality of semiconductor elements are mounted on a circuit board, and a manufacturing method of a semiconductor mounting body in which a sealing resin is disposed in a gap between the circuit board and the semiconductor element,
An arrangement step of arranging a sheet whose shape is flexibly deformed on a surface of the semiconductor element that does not face the circuit board;
After the arrangement step, the side where the semiconductor element does not exist and the semiconductor element so that the air pressure on the side where the semiconductor element does not exist is higher than the pressure on the side where the semiconductor element exists based on the sheet A pressure step for providing a pressure difference to the side on which the semiconductor element exists and pressurizing the semiconductor element with the sheet;
When pressurizing the sheet, the sheet is heated by a heater from the side where the semiconductor element does not exist.heatingProcessWhenWithHalfIt is a manufacturing method of a conductor mounting body.
[0022]
  FirstFiveThe present invention (claims)5Corresponding to the second) adjusts the distance between the arranged seat and the heater.FourIt is the manufacturing method of the semiconductor mounting body of this invention.
[0023]
  FirstSixThe present invention (claims)6Corresponds to)One or a plurality of semiconductor elements are mounted on a circuit board, and a manufacturing method of a semiconductor mounting body in which a sealing resin is disposed in a gap between the circuit board and the semiconductor element,
An arrangement step of arranging a sheet whose shape is flexibly deformed on a surface of the semiconductor element that does not face the circuit board;
After the arrangement step, the side where the semiconductor element does not exist and the semiconductor element so that the air pressure on the side where the semiconductor element does not exist is higher than the pressure on the side where the semiconductor element exists based on the sheet Providing a pressure difference to the side on which is present, and pressurizing the semiconductor element with the sheet,
The sheet is a rubber sheet formed of silicon or Buna S and having a thickness of 0.01 mm to 3 mm.HalfIt is a manufacturing method of a conductor mounting body.
[0024]
  FirstSevenThe present invention (claims)7Corresponds to)One or a plurality of semiconductor elements are mounted on a circuit board, and a manufacturing method of a semiconductor mounting body in which a sealing resin is disposed in a gap between the circuit board and the semiconductor element,
An arrangement step of arranging a sheet whose shape is flexibly deformed on a surface of the semiconductor element that does not face the circuit board;
After the arrangement step, the side where the semiconductor element does not exist and the semiconductor element so that the air pressure on the side where the semiconductor element does not exist is higher than the pressure on the side where the semiconductor element exists based on the sheet Providing a pressure difference to the side on which is present, and pressurizing the semiconductor element with the sheet,
The sheet is a resin sheet formed of polyimide, fluororesin, polyphenylene sulfide, polypropylene, polyether, polycarbonate, chlorosulfonated polyethylene, or a composite thereof, and having a thickness of 0.01 mm to 1 mm.HalfIt is a manufacturing method of a conductor mounting body.
[0025]
  FirstEightThe present invention (claims)8Corresponds to)One or a plurality of semiconductor elements are mounted on a circuit board, and a manufacturing method of a semiconductor mounting body in which a sealing resin is disposed in a gap between the circuit board and the semiconductor element,
An arrangement step of arranging a sheet whose shape is flexibly deformed on a surface of the semiconductor element that does not face the circuit board;
After the arrangement step, the side where the semiconductor element does not exist and the semiconductor element so that the air pressure on the side where the semiconductor element does not exist is higher than the pressure on the side where the semiconductor element exists based on the sheet Providing a pressure difference to the side on which is present, and pressurizing the semiconductor element with the sheet,
The sheet is a metal sheet formed of aluminum, copper, or stainless steel and having a thickness of 0.01 mm to 0.5 mm.HalfIt is a manufacturing method of a conductor mounting body.
[0026]
  FirstNineThe present invention (claims)9Corresponds to)One or a plurality of semiconductor elements are mounted on a circuit board, and a manufacturing method of a semiconductor mounting body in which a sealing resin is disposed in a gap between the circuit board and the semiconductor element,
An arrangement step of arranging a sheet whose shape is flexibly deformed on a surface of the semiconductor element that does not face the circuit board;
After the arrangement step, the side where the semiconductor element does not exist and the semiconductor element so that the air pressure on the side where the semiconductor element does not exist is higher than the pressure on the side where the semiconductor element exists based on the sheet Providing a pressure difference to the side on which is present, and pressurizing the semiconductor element with the sheet,
A release treatment is applied to the surface of the sheet that contacts the semiconductor element.HalfIt is a manufacturing method of a conductor mounting body.
[0027]
  FirstTenThe present invention (claims)10Corresponds to)One or a plurality of semiconductor elements are mounted on a circuit board, and a manufacturing method of a semiconductor mounting body in which a sealing resin is disposed in a gap between the circuit board and the semiconductor element,
An arrangement step of arranging a sheet whose shape is flexibly deformed on a surface of the semiconductor element that does not face the circuit board;
After the arrangement step, the side where the semiconductor element does not exist and the semiconductor element so that the air pressure on the side where the semiconductor element does not exist is higher than the pressure on the side where the semiconductor element exists based on the sheet Providing a pressure difference to the side on which is present, and pressurizing the semiconductor element with the sheet,
The surface of the sheet that is not in contact with the semiconductor element is subjected to a coloring treatment for increasing heat absorption.HalfIt is a manufacturing method of a conductor mounting body.
[0028]
  FirstelevenThe present invention (claims)11Corresponds to)One or a plurality of semiconductor elements are mounted on a circuit board, and a manufacturing method of a semiconductor mounting body in which a sealing resin is disposed in a gap between the circuit board and the semiconductor element,
An arrangement step of arranging a sheet whose shape is flexibly deformed on a surface of the semiconductor element that does not face the circuit board;
After the arrangement step, the side where the semiconductor element does not exist and the semiconductor element so that the air pressure on the side where the semiconductor element does not exist is higher than the pressure on the side where the semiconductor element exists based on the sheet Providing a pressure difference to the side on which is present, and pressurizing the semiconductor element with the sheet,
The sheet contains a coloring additive for enhancing heat absorption.HalfIt is a manufacturing method of a conductor mounting body.
[0029]
  FirsttwelveThe present invention (claims)12Corresponds to)One or a plurality of semiconductor elements are mounted on a circuit board, and a manufacturing method of a semiconductor mounting body in which a sealing resin is disposed in a gap between the circuit board and the semiconductor element,
An arrangement step of arranging a sheet whose shape is flexibly deformed on a surface of the semiconductor element that does not face the circuit board;
After the arrangement step, the side where the semiconductor element does not exist and the semiconductor element so that the air pressure on the side where the semiconductor element does not exist is higher than the pressure on the side where the semiconductor element exists based on the sheet A pressure step for providing a pressure difference to the side on which the semiconductor element exists and pressurizing the semiconductor element with the sheet;
Before disposing the sheet, a support frame for supporting the sheet is disposed in the vicinity of the semiconductor element.Support frame arrangementProcessWhenWithHalfIt is a manufacturing method of a conductor mounting body.
[0034]
  FirstThirteenThe present invention (claims)13Corresponds to)One or a plurality of semiconductor elements are mounted on a circuit board, and a semiconductor mounting body manufacturing apparatus in which a sealing resin is disposed in a gap between the circuit board and the semiconductor elements,
Arranging means for arranging a sheet whose shape is flexibly deformed on the surface of the semiconductor element that does not face the circuit board;
The semiconductor element is not present and the semiconductor element is present so that the air pressure on the side where the semiconductor element is not present is higher than the pressure on the side where the semiconductor element is present, based on the arranged sheet. A pressure means for providing a pressure difference to the side and pressurizing the semiconductor element with the sheet;
Fixing means for fixing the periphery of the sheet disposed in the semiconductor element at least immediately before the sheet is pressedWhenWithHalfIt is a manufacturing apparatus of a conductor mounting body.
[0035]
  FirstfourteenThe present invention (claims)14Corresponds to a slack removing means for removing the slack of the sheet before pressurizing the sheet.ThirteenIt is the manufacturing apparatus of the semiconductor mounting body of this invention.
[0036]
  FirstFifteenThe present invention (claims)15) Is that the loosening of the sheet is to fix the periphery of the sheet in order from the outside to the inside of the sheet.fourteenIt is the manufacturing apparatus of the semiconductor mounting body of this invention.
[0037]
  FirstSixteenThe present invention (claims)16Corresponds to)One or a plurality of semiconductor elements are mounted on a circuit board, and a semiconductor mounting body manufacturing apparatus in which a sealing resin is disposed in a gap between the circuit board and the semiconductor elements,
Arranging means for arranging a sheet whose shape is flexibly deformed on the surface of the semiconductor element that does not face the circuit board;
The semiconductor element is not present and the semiconductor element is present so that the air pressure on the side where the semiconductor element is not present is higher than the pressure on the side where the semiconductor element is present, based on the arranged sheet. A pressure means for providing a pressure difference to the side and pressurizing the semiconductor element with the sheet;
A heating means for heating the sheet from the side where the semiconductor element does not exist when the sheet is pressed.WhenWithHalfIt is a manufacturing apparatus of a conductor mounting body.
[0038]
  FirstSeventeenThe present invention (claims)17Corresponds to a second adjusting means for adjusting the distance between the arranged sheet and the heating means.SixteenIt is the manufacturing apparatus of the semiconductor mounting body of this invention.
[0039]
  FirstXVIIIThe present invention (claims)18Corresponds to)One or a plurality of semiconductor elements are mounted on a circuit board, and a semiconductor mounting body manufacturing apparatus in which a sealing resin is disposed in a gap between the circuit board and the semiconductor elements,
Arranging means for arranging a sheet whose shape is flexibly deformed on the surface of the semiconductor element that does not face the circuit board;
The semiconductor element is not present and the semiconductor element is present so that the air pressure on the side where the semiconductor element is not present is higher than the pressure on the side where the semiconductor element is present, based on the arranged sheet. Providing a pressure difference on the side, and a pressurizing means for pressurizing the semiconductor element with the sheet,
The sheet is a rubber sheet formed of silicon or Buna S and having a thickness of 0.01 mm to 3 mm.HalfIt is a manufacturing apparatus of a conductor mounting body.
[0040]
  FirstNineteenThe present invention (claims)19Corresponds to)One or a plurality of semiconductor elements are mounted on a circuit board, and a semiconductor mounting body manufacturing apparatus in which a sealing resin is disposed in a gap between the circuit board and the semiconductor elements,
Arranging means for arranging a sheet whose shape is flexibly deformed on the surface of the semiconductor element that does not face the circuit board;
The semiconductor element is not present and the semiconductor element is present so that the air pressure on the side where the semiconductor element is not present is higher than the pressure on the side where the semiconductor element is present, based on the arranged sheet. Providing a pressure difference on the side, and a pressurizing means for pressurizing the semiconductor element with the sheet,
The sheet is a resin sheet formed of polyimide, fluororesin, polyphenylene sulfide, polypropylene, polyether, polycarbonate, chlorosulfonated polyethylene, or a composite thereof, and having a thickness of 0.01 mm to 1 mm.HalfIt is a manufacturing apparatus of a conductor mounting body.
[0041]
  FirsttwentyThe present invention (claims)20Corresponds to)One or a plurality of semiconductor elements are mounted on a circuit board, and a semiconductor mounting body manufacturing apparatus in which a sealing resin is disposed in a gap between the circuit board and the semiconductor elements,
Arranging means for arranging a sheet whose shape is flexibly deformed on the surface of the semiconductor element that does not face the circuit board;
The semiconductor element is not present and the semiconductor element is present so that the air pressure on the side where the semiconductor element is not present is higher than the pressure on the side where the semiconductor element is present, based on the arranged sheet. Providing a pressure difference on the side, and a pressurizing means for pressurizing the semiconductor element with the sheet,
The sheet is a metal sheet formed of aluminum, copper, or stainless steel and having a thickness of 0.01 mm to 0.5 mm.HalfIt is a manufacturing apparatus of a conductor mounting body.
[0042]
  FirstTwenty oneThe present invention (claims)21Corresponds to)One or a plurality of semiconductor elements are mounted on a circuit board, and a semiconductor mounting body manufacturing apparatus in which a sealing resin is disposed in a gap between the circuit board and the semiconductor elements,
Arranging means for arranging a sheet whose shape is flexibly deformed on the surface of the semiconductor element that does not face the circuit board;
The semiconductor element is not present and the semiconductor element is present so that the air pressure on the side where the semiconductor element is not present is higher than the pressure on the side where the semiconductor element is present, based on the arranged sheet. Providing a pressure difference on the side, and a pressurizing means for pressurizing the semiconductor element with the sheet,
A release treatment is applied to the surface of the sheet that contacts the semiconductor element.HalfIt is a manufacturing apparatus of a conductor mounting body.
[0043]
  Firsttwenty-twoThe present invention (claims)22Corresponds to)One or a plurality of semiconductor elements are mounted on a circuit board, and a semiconductor mounting body manufacturing apparatus in which a sealing resin is disposed in a gap between the circuit board and the semiconductor elements,
Arranging means for arranging a sheet whose shape is flexibly deformed on the surface of the semiconductor element that does not face the circuit board;
The semiconductor element is not present and the semiconductor element is present so that the air pressure on the side where the semiconductor element is not present is higher than the pressure on the side where the semiconductor element is present, based on the arranged sheet. Providing a pressure difference on the side, and a pressurizing means for pressurizing the semiconductor element with the sheet,
The surface of the sheet that is not in contact with the semiconductor element is subjected to a coloring treatment for increasing heat absorption.HalfIt is a manufacturing apparatus of a conductor mounting body.
[0044]
  Firsttwenty threeThe present invention (claims)23Corresponds to)One or a plurality of semiconductor elements are mounted on a circuit board, and a semiconductor mounting body manufacturing apparatus in which a sealing resin is disposed in a gap between the circuit board and the semiconductor elements,
Arranging means for arranging a sheet whose shape is flexibly deformed on the surface of the semiconductor element that does not face the circuit board;
The semiconductor element is not present and the semiconductor element is present so that the air pressure on the side where the semiconductor element is not present is higher than the pressure on the side where the semiconductor element is present, based on the arranged sheet. Providing a pressure difference on the side, and a pressurizing means for pressurizing the semiconductor element with the sheet,
The sheet contains a coloring additive for enhancing heat absorption.HalfIt is a manufacturing apparatus of a conductor mounting body.
[0045]
  FirstTwenty-fourThe present invention (claims)24Corresponds to)One or a plurality of semiconductor elements are mounted on a circuit board, and a semiconductor mounting body manufacturing apparatus in which a sealing resin is disposed in a gap between the circuit board and the semiconductor elements,
Arranging means for arranging a sheet whose shape is flexibly deformed on the surface of the semiconductor element that does not face the circuit board;
The semiconductor element is not present and the semiconductor element is present so that the air pressure on the side where the semiconductor element is not present is higher than the pressure on the side where the semiconductor element is present, based on the arranged sheet. A pressure means for providing a pressure difference to the side and pressurizing the semiconductor element with the sheet;
A support frame to be arranged to support the sheet in the vicinity of the semiconductor element before the sheet is arrangedWhenWithHalfIt is a manufacturing apparatus of a conductor mounting body.
[0046]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0047]
(First embodiment)
First, a first embodiment of the present invention will be described with reference to the drawings.
[0048]
FIG. 1 shows the configuration of a semiconductor mounting body manufacturing apparatus according to a first embodiment of the present invention, and illustrates the overall configuration and manufacturing procedure of a mounting body in which a semiconductor element is flip-chip mounted on a circuit board. FIG. 2 is a detailed view thereof.
[0049]
A method and apparatus for manufacturing a semiconductor package according to the first embodiment will be described below with reference to FIGS. 1 and 2.
[0050]
As shown in FIGS. 1 and 2, the lower surface of the sheet material 3 that is flexibly deformed and disposed on the upper surface of a plurality of semiconductor elements 2 mounted on the circuit board 1 by flip chip mounting has a frame-like shape. An adsorption mechanism 4 in which a concave groove is formed in the frame and an elevating mechanism 5 for moving the sheet material 3 to the vicinity of the back surface of the semiconductor element 2 are provided. The elevating mechanism 5 is composed of an elastic body such as a spring. Above the sheet material 3, an integrated structure S in which a heat source 7 is built in the upper chamber 6 is disposed, and a pressurizing port 8 is formed in a part of the upper chamber 6. 1 and 2, it is assumed that a sealing resin 11 is disposed in the gap between the circuit board 1 and each semiconductor element 2. The sealing resin 11 may be a paste or a sheet.
[0051]
In the semiconductor package manufacturing apparatus configured as described above, when the integrated structure S is lowered toward the sheet material 3 and the upper chamber 6 is placed on the suction mechanism 4, the weight is raised by the lifting mechanism 5 due to the weight of the upper chamber 6. The mechanism 4 is lowered, the periphery of the sheet material 3 is fixed, and the sheet material 3 is disposed on the upper surface of each semiconductor element 2. Next, by supplying air or compressed gas into the upper chamber 6 from the pressurizing port 8, the air pressure is transmitted to the sheet material 3 as shown in FIG. 2, and the semiconductor element 2 is pressed with a uniform pressure. The
[0052]
Then, by bringing the heat source 7 close to the sheet material 3, the radiant heat of the heat source 7 is transmitted to the sealing resin 11 through the sheet material 3, so that a large number of semiconductor elements 2 having different thicknesses and shapes are substantially uniform. Can be pressurized. As a result, the pressurizing and heating process can be realized collectively in a short time.
[0053]
As shown in FIG. 13, when the air pressure is supplied to the sheet material 3, if the sheet material 3 has a very low hardness and an extremely thin thickness, the tensile elastic modulus is inevitably low. Then, the sealing resin 11 filled on the back surface of the semiconductor element 2 is in a state of being sealed with the sheet material 3, and the sealing resin 11 is formed on the upper surface of the semiconductor element 2 as shown in part a due to the influence of the internal stress. A creeping phenomenon occurs, the appearance of the semiconductor element 2 is impaired, and the quality is degraded. When the CSP (chip size package) is mounted on the mother board, if the sealing resin 11 is attached to the surface of the semiconductor element 2, a suction error of the mounting machine occurs, which is a big problem in mounting. Become.
[0054]
As shown in FIG. 14, when the distance L between adjacent semiconductor elements 2 is long, the sheet material 3 is further brought into close contact with the surface of the circuit board 1. For this reason, the same phenomenon as described above occurs.
[0055]
Therefore, in order to suppress the occurrence of such a phenomenon, as shown in FIG. The distance L between them should not be so large. Then, a leak path is formed in the A and B directions due to the influence of the gap d generated between the sheet material 3 and the circuit board 1, and a part of the sheet material 3 does not contact the circuit board 1. For this reason, the influence of the sealing resin 11 adhering to the surface of the semiconductor element 2 can be suppressed to the minimum, and the quality can be improved.
[0056]
Of course, as shown in FIG. 16, even if a part of the sheet material 3 is in contact with the circuit board 1, a part (of course, a part of the part not touching the semiconductor element 2) is a circuit board. If it is not in contact with 1,
[0057]
Note that it is also possible to adjust the timing of supplying air pressure so that the sheet material 3 does not contact the semiconductor element 2 and / or the sealing resin 11 at least immediately before the pressurization is performed.
[0058]
Further, the heat source 10 configured in the lower chamber 9 performs preheating of the circuit board 1 and heating for enhancing the injection property of the sealing resin 11, and the exhaust port A adsorbs the sheet material 3. The exhaust port B is for generating a differential pressure above and below the sheet material 3, and the sealing elastic body 12 is a sealing material for preventing leakage between the upper and lower sides of the sheet material 3. The heat insulating plate 13 is a heat insulating material for heat shielding, and the height regulating screw 14 adjusts the height of the heat source 7 and the semiconductor element 2.
[0059]
The sheet material 3 is, for example, a silicon sheet having a thickness of 0.01 mm to 3 mm, a rubber sheet material such as Buna S, a polyimide having a thickness of 0.01 mm to 1 mm, a fluororesin, polyphenylene sulfide, It is a resin sheet material such as polypropylene, polyether, polycarbonate, chlorosulfonated polyethylene or the like, or a metal sheet material such as aluminum, copper or stainless steel having a thickness of 0.01 mm to 0.5 mm. Further, the sheet material 3 may be made of a material having a good absorbability of radiant heat.
[0060]
Further, the sheet material 3 includes the above-described rubber sheet materials such as silicon and Buna S, resin sheet materials such as polyimide, fluororesin, polyphenylene sulfide, polypropylene, polyether, polycarbonate, and chlorosulfonated polyethylene, aluminum, copper, The sheet | seat comprised with the composite material of metal sheet materials, such as stainless steel, may be sufficient.
[0061]
Further, by applying a release treatment to the surface of the sheet material 3 on the side in contact with the semiconductor element 2, the adhesion of the sealing resin 11 can be suppressed, and the cleaning is simplified even if the sealing resin 11 is adhered. Therefore, work efficiency is improved.
[0062]
In addition, by applying a color treatment for increasing heat absorption to the side of the sheet material 3 that does not contact the semiconductor element 2, quick heat absorption can be obtained, and the sealing resin 11 can be thermally cured for a short time.
[0063]
Moreover, the effect similar to the above is acquired by adding the coloring additive to the sheet | seat material 3. FIG.
[0064]
Further, an elastic body is obtained by subjecting a composite body (for example, a combination of a silicon rubber sheet material and a metal sheet material) composed of a rubber sheet material, a resin sheet material, a metal sheet material, and the like to the release treatment and the coloring treatment described above. The silicon rubber of the sheet material 3 suppresses damage due to contact of the sheet material 3 with the semiconductor element 2 and prevents the sealing resin 11 from adhering to the sheet material 3. The metal sheet material excellent in heat transfer absorbs the heat of the sheet material 3. Can be improved.
[0065]
Further, by using a suction mechanism configured with a plurality of concave grooves, the sheet material 3 is sequentially attracted to the semiconductor element 2 from the outside of the sheet material 3, so that the sag of the sheet material 3 is corrected and a stable bridge is formed. Can get a tension.
[0066]
More specifically, as shown in FIG. 17, (1) the sheet material 3 is first sucked using the grooves 4a formed on the outer side of the suction mechanism 4 ', and (2) the suction mechanism is next. By adsorbing the sheet material 3 using the grooves 4b formed inside 4 ', the periphery of the sheet material 3 is fixed in order from the outside to the inside of the sheet material 3, and a tension is generated to generate the sheet material 3 You may take the slack. In addition, since the four corners of the grooves 4a to 4b are formed into rounded corners, the sheet material 3 can be adsorbed without generating unnecessary wrinkles.
[0067]
Furthermore, the above-described stretching of the sheet material 3 may be performed by a technique other than vacuum suction. For example, the supply reel 3a for supplying the sheet material 3 in the direction of the arrow X and the take-up reel 3b for winding the sheet material 3 may be motor-driven and controlled by a certain tension. Furthermore, a tension gauge or the like is provided around the supply reel 3a side and the take-up reel 3b side, and the output value is read and controlled, so that stable stretching can be applied to the sheet material 3.
[0068]
Further, by lowering the lower chamber 9 through the exhaust port B, the sheet material 3 disposed on the upper surface of the lower chamber 9 is adsorbed. At this time, since the back surface of the semiconductor element 2 mounted on the circuit board 1 is also pressed by the adsorption effect of the sheet material 3, the pressure heating and curing are similarly performed in the negative pressure method as compared with the pressure method using the air pressure described above. can do.
[0069]
Further, for example, by supplying an air pressure of 1 atm on the upper surface side of the sheet material 3 and a negative pressure of -1 atm by depressurization on the lower surface side with respect to the sheet material 3, the back surface of the semiconductor element 2 becomes 1 atm. Since a synergistic effect of a total of 2 atmospheres can be obtained at minus 1 atmosphere, this is an effective means when the pressing force on the semiconductor element 2 is insufficient with only the air pressure.
[0070]
In the above-described embodiment, the suction mechanism 4, the lifting mechanism 5 and the upper chamber 6 are used as an example of the arrangement means of the semiconductor package manufacturing apparatus of the present invention, and the pressure port 8 (gas is used as an example of the pressure means. An example of a supply unit) and an exhaust port B (an example of a gas exclusion unit), an adsorption mechanism 4 and an upper chamber 6 as an example of a fixing unit, and a heat source 7 as an example of a heating unit, respectively.
[0071]
Further, the suction mechanism 4 (suction mechanism 4 ') is used as an example of the slack removing means.
[0072]
Further, as the heat source 7 in the above-described embodiment, any of a cartridge heater, a ceramic heater, a sheathed heater, a halogen lamp, an infrared ray or a high frequency heater can be used.
[0073]
(Second Embodiment)
Next, the configuration of the semiconductor package manufacturing apparatus in the second embodiment will be described with reference to the drawings. In addition, since there are many common points in the manufacturing apparatus of the semiconductor mounting body of 2nd Embodiment and 1st Embodiment, only difference is demonstrated in 2nd Embodiment.
[0074]
FIG. 3 is a perspective view showing the entire configuration of the support frame A arranged in the vicinity of the semiconductor element 2 before the sheet material 3 is arranged on the upper surface of the semiconductor element 2, and the support frame A is the sheet material 3. It is for supporting. FIG. 4 is a view showing a state in which the sheet material 3 is arranged on the upper surface of each semiconductor element 2 after the support frame A is arranged in the vicinity of the semiconductor element 2, and each semiconductor element 2 is pressed by the sheet material 3. .
[0075]
As shown in FIGS. 3 and 4, each opening of the support frame A disposed on the circuit board 1 is larger than each corresponding semiconductor element 2 and substantially equal to the height of the semiconductor element 2. The thickness of the support frame A is adjusted.
[0076]
When the support frame A formed in this way is arranged on the circuit board 1 so that each opening of the support frame A surrounds the corresponding semiconductor element 2, and then the sheet material 3 is covered and pressed, for example, When the support frame A is not present, as shown by the dotted line portion a in FIG. 4, the sheet material 3 is subjected to a force to press down the semiconductor element 2, so that excessive tension is transmitted to the semiconductor element 2 and damaged. In contrast, when the support frame A is attached, stress concentrated on the semiconductor element 2 acts, so that more stable pressure heating is maintained. As a result, the connection reliability of the semiconductor element 2 can be improved.
[0077]
Further, as shown in FIG. 12, a support frame B having an opening larger than the entire area of the mounted many semiconductor elements 2 is formed, and as shown in FIG. Even when arranged on the circuit board 1 so as to surround, the tension of the sheet material 3 is buffered by the support frame B, so that it can be heated under pressure while minimizing damage to the semiconductor element 2. it can.
[0078]
(Third embodiment)
Next, the heating configuration and the operation of the semiconductor packaging body manufacturing apparatus in the third embodiment will be described with reference to the drawings. Since the semiconductor packaging body manufacturing apparatus of the third embodiment and that of the first embodiment have many common points, only the differences will be described in the third embodiment.
[0079]
FIG. 6 is a temperature profile showing the relative relationship between the set temperature of the heat source 7 and the temperature increase rate of the sealing resin 11.
[0080]
Since the present heat curing method uses radiant heat, the set temperature of the heat source 7 itself and the rate of temperature increase inevitably have a relative relationship. For example, as shown in FIG. 6, when the temperature rise rate of the sealing resin 11 is represented on the horizontal axis and the temperature of the sealing resin 11 is represented on the vertical axis, the desired temperature is set to 170 degrees when the set temperature of the heat source 7 is 170 degrees. The time required to reach the target temperature (150 ° C. to 160 ° C.) is about 120 seconds. The distance between the heat source 7 and the sheet material 3 was 1.0 mm.
[0081]
On the other hand, when the set temperature of the heat source 7 is 260 degrees, the desired target temperature (150 degrees to 160 degrees) is reached in about 20 seconds. As a condition, the distance between the semiconductor element 2 and the heat source 7 is constant, and the temperature of the sealing resin 11 is measured via the sheet material 3.
[0082]
From this, the set temperature of the heat source 7 itself is set to a high temperature (for example, 260 degrees) and brought close to the sheet material 3, and after the sealing resin 11 reaches the desired target temperature (150 degrees to 160 degrees), By enlarging the spatial distance between the sheet material 3 and the heat source 7 while maintaining the set temperature of the heat source 7, and performing temperature profile control so that the sealing resin 11 maintains a desired set temperature, the sealing resin can be obtained in a short time. 11 can be raised in temperature, and the sealing resin 11 can be cured in a short time, and the thermosetting time can be greatly shortened.
[0083]
In the present embodiment, the heat source 7 is provided with an air cylinder (not shown) that can be moved up and down, and a cam with a certain amount of inclination is provided at the tip of the shaft. By switching the flow rate, the cam can be easily operated at an arbitrary position, whereby the height of the heat source 7 relative to the sheet material 3 can be easily changed.
[0084]
Moreover, in order to raise and lower the heat source 7 described above, a stepping motor or a pulse motor having electrical control may be used.
[0085]
The means for raising and lowering the heat source 7 corresponds to the distance adjusting means of the semiconductor package manufacturing apparatus of the present invention, and the height adjusting screw 14 shown in FIG. 2 is also applicable as an example of the distance adjusting means. To do.
[0086]
(Fourth embodiment)
Next, a method for manufacturing a semiconductor package in the fourth embodiment will be described with reference to the drawings. The fourth embodiment will be described with reference to the drawings used in the first embodiment.
[0087]
FIG. 1 is a cross-sectional view for explaining an overall configuration of a method for manufacturing a semiconductor package, and FIG. 2 is a detailed view thereof.
[0088]
As shown in FIGS. 1 and 2, a mounting body having a plurality of semiconductor elements 2 mounted on a circuit board 1 by flip chip mounting is disposed on a heat source 10, and the circuit board 1 and the semiconductor elements 2 are A sealing resin 11 is placed in the gap. Then, as shown in FIGS. 1 and 2, after the sheet material 3 that is flexibly deformed is placed on the suction mechanism 4 in which a concave groove is formed on a frame-like frame, the exhaust port A is evacuated. Thus, the sheet material 3 is adsorbed to the semiconductor element 2 and can be maintained at a constant pressure. Further, since the suction mechanism 4 is provided with a plurality of concave grooves, the slack of the sheet material 3 is corrected by sequentially adsorbing the sheet material 3 from the outside, thereby obtaining a more stable stretch. Can do.
[0089]
Furthermore, an elevating mechanism 5 having a function capable of ascending and descending with a built-in compression spring is provided below the adsorption mechanism 4 so that the sheet material 3 is stretched at a position away from the entire semiconductor element 2. When the operator attaches the sheet material 3, the adhesion of the sealing resin 11 and any problems with the semiconductor element 2 can be solved.
[0090]
Next, when the upper chamber 6 including the heat source 7 and having an integral structure is lowered, an operation following the lifting mechanism 5 is transmitted by the weight of the upper chamber 6, so that the sheet material 3 adsorbed to the adsorption mechanism 4 is a semiconductor element. 2 is moved to the vicinity of the back surface.
[0091]
Thereafter, air or compressed gas is supplied into the upper chamber 6 from a pressurizing port 8 provided in a part of the upper chamber 6, and pressure is applied to the sheet material 3, as shown in FIG. Is transmitted to the semiconductor element 2 through the sheet material 3, so that a large number of semiconductor elements 2 having different thicknesses and shapes can be pressed with a uniform pressure.
[0092]
Next, when the heat source 7 built in the chamber 6 is brought close to the sheet material 3, the radiant heat of the heat source 7 is transmitted to the sealing resin 11 interposed in the semiconductor element 2 through the sheet material 3 as described above. Therefore, the sealing resin 11 can be heated and cured.
[0093]
As described above, the pressure heating and curing step of the sealing resin 11 can be collectively performed with the radiant heat in a state where the semiconductor element 2 is kept in a uniform pressure and the heat source 7 and the sheet material 3 are not in contact with each other. Since this can be realized, productivity and connection reliability can be greatly improved.
[0094]
Further, since the gap between the heat source 7 and the semiconductor element 2 depends on the temperature dependency of the radiant heat, the spatial gap adjustment of the radiant heat can be easily obtained by fine adjustment of the height regulating screw 14 provided in the heat source 7. Can do.
[0095]
Moreover, the sheet material 3 used for heat-curing the sealing resin 11 in a state where a certain pressure is applied to the semiconductor element 2 is, for example, silicon or Buna S having a thickness of 0.01 mm to 3 mm. Rubber sheet material, resin sheet material such as polyimide, fluororesin, polyphenylene sulfide, polypropylene, polyether, polycarbonate, chlorosulfonated polyethylene, etc. with a thickness of 0.01 mm to 1 mm, 0.01 mm to 0.5 mm It is a sheet | seat which has metal sheet materials, such as aluminum, copper, and stainless steel comprised by thickness.
[0096]
Further, by applying a release treatment to the surface of the sheet material 3 on the side in contact with the semiconductor element 2, the adhesion of the sealing resin 11 can be suppressed, and the cleaning is simplified even if the sealing resin 11 is adhered. Therefore, work efficiency is improved.
[0097]
In addition, by applying a coloring treatment for increasing heat absorption to the surface of the sheet material 3 on the side not in contact with the semiconductor element 2, quick heat absorption can be obtained, and the sealing resin 11 can be thermally cured for a short time.
[0098]
Further, when a coloring additive is added to the sheet material 3, the same effect as described above can be obtained.
[0099]
In addition, the sheet material 3 can obtain the following effects by subjecting the composite such as a rubber sheet material, a resin sheet material, and a metal sheet material to the above-described release treatment and coloring treatment. For example, by combining a silicon rubber sheet material and a metal sheet material, damage when contacting the semiconductor element 2 with elastic silicon rubber can be suppressed, and adhesion of the sealing resin 11 can be prevented. Furthermore, if a metal sheet material having high rigidity and excellent heat transfer is formed on the surface of the elastic body that does not contact the semiconductor element 2, heat can be absorbed quickly. Furthermore, when pressing is applied to the metal sheet material, there is no particular problem if the shape of the semiconductor element 2 is spherical. However, if the semiconductor element 2 has a square shape or a rectangular shape, traces may be formed on the sheet material due to the stress at the edge of the corner. However, if the sheet material 3 is composed of a composite of a metal sheet material and silicon rubber, traces are absorbed by the silicon rubber, so that the sheet itself can be recycled and the material cost can be greatly reduced. it can.
[0100]
In addition, as shown in FIG. 4, a plurality of openings corresponding to the plurality of semiconductor elements 2 mounted on the circuit board 1 are provided, and the thickness is adjusted to be substantially equal to the height of the semiconductor elements 2. When the support frame A is arranged so that each opening of the support frame A surrounds the corresponding semiconductor element 2, the stress to press down the sheet material 3 is reduced, and excessive tension is applied to the semiconductor element 2. Since it does not act, stable connection reliability can be obtained.
[0101]
Further, as shown in FIG. 12, a support frame B having an opening larger than the entire area of the mounted many semiconductor elements 2 is formed, and as shown in FIG. Even when arranged on the circuit board 1 so as to surround, the tension of the sheet material 3 is buffered by the support frame B, so that damage to the semiconductor element 2 can be minimized.
[0102]
Further, even if the plurality of semiconductor elements 2 mounted on the circuit board 1 are multichip modules having at least two types of shapes or thicknesses, the sealing resin 11 is collectively applied in a state where an equal pressure is applied. And can be cured by heating under pressure.
[0103]
Further, even when electronic components other than the semiconductor element 2 are mixedly mounted on the circuit board 1, the same effect as described above can be obtained.
[0104]
(Fifth embodiment)
Next, a method for manufacturing a semiconductor package in the fifth embodiment will be described with reference to the drawings.
[0105]
FIG. 7 is a cross-sectional view showing a process when the manufacturing method of the semiconductor package is the SBB method (stud bump bonding), and FIG. 8 shows the semiconductor package using a paste-like or sheet-like sealing material. FIG. 9 is a cross-sectional view showing a manufacturing process for manufacturing, and FIG. 9 is a cross-sectional view showing a method for manufacturing a semiconductor package using a semiconductor element in which solder or gold-plated bumps are formed on electrode pads.
[0106]
As shown in FIG. 7, the step of forming bumps 16 on the electrode pads 15 of the semiconductor element 2, the step of transferring the conductive adhesive 17 to the bumps 16, and the flipping of the semiconductor elements 2 to the terminal electrodes 18 of the circuit board 1. As described above, the SBB mounting method includes the step of chip mounting, the step of drying the conductive adhesive 17, and the step of filling the gap between the semiconductor element 2 and the circuit board 1 with the sealing resin 11. The sheet material 3 that is flexibly deformed is disposed on the upper surface of the semiconductor element 2, and the sealing resin 11 can be collectively heat-cured while pressurizing the back surface of the semiconductor element 2.
[0107]
In addition, since the bumps 16 and the terminal electrodes 18 are reliably bonded by the pressurizing effect through the sheet material 3, a uniformly controlled amount of the conductive adhesive 17 is transferred to the entire bumps 16 having a two-step projection shape. This eliminates the need to perform the process control of the transfer amount, reduces the amount of the conductive adhesive 17, and suppresses the adhesion of the conductive adhesive 17 to the adjacent bumps 16. The method for manufacturing a semiconductor package described in the first embodiment and the like can be used effectively for a narrow-pitch semiconductor element 2 having the following.
[0108]
Further, as shown in FIG. 8, a semiconductor including a step of forming bumps on the electrode pad 15 and a step of applying a paste-like 19 sealing material or affixing a sheet-like sealing material on the circuit board 1. Also for the method of manufacturing the mounting body, after the semiconductor element 2 is mounted, the sealing material is temporarily cured in a pressurized and heated state, and then the back surface of a plurality of semiconductor elements 2 is added with a sheet material 3 that is flexibly deformed. Since the encapsulant can be heated and fully cured while being pressed, the mounting time can be shortened and the productivity can be improved.
[0109]
Further, as shown in FIG. 9, after the step of forming the solder bump 20 on the electrode pad 15 of the semiconductor element 2, the back surface of the semiconductor element 2 is pressed using the sheet material 3 to melt the solder bump 20. The same batch processing is possible.
[0110]
Further, after the step of forming the gold plating bump on the electrode pad 15 of the semiconductor element 2, the same effect as described above is obtained by pressurizing the back surface of the semiconductor element 2 using the sheet material 3 and thermocompression bonding the bump. be able to.
[0111]
【The invention's effect】
As is apparent from the above description, when mounting a plurality of semiconductor elements having different thicknesses and shapes on a circuit board, the present invention applies pressure to the plurality of semiconductor elements substantially uniformly to form a semiconductor package. A method and apparatus for manufacturing a semiconductor package that can be manufactured can be provided.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a semiconductor package manufacturing apparatus according to first and fourth embodiments of the present invention.
FIG. 2 is a view for explaining a method of manufacturing a semiconductor package according to the first and fourth embodiments of the present invention;
FIG. 3 is a perspective view of a support frame according to second and fourth embodiments of the present invention.
FIG. 4 is a view for explaining a method for manufacturing a semiconductor package according to the second and fourth embodiments of the present invention;
FIG. 5 is a view for explaining a method of manufacturing a semiconductor package according to the second and fourth embodiments of the present invention;
FIG. 6 is a diagram showing a temperature profile showing a relative relationship between a set temperature of a heat source and a temperature increase rate of a semiconductor package manufacturing apparatus according to a third embodiment of the present invention
FIG. 7 is a view for explaining a method of manufacturing a semiconductor package in the SBB mode according to the fifth embodiment of the present invention;
FIG. 8 is a diagram for explaining a method for manufacturing a semiconductor package when a paste-like or sheet-like sealing material is used according to the fifth embodiment of the present invention;
FIG. 9 is a view for explaining a method for manufacturing a semiconductor package when solder or gold-plated bumps are formed on electrode pads of a semiconductor element according to a fifth embodiment of the present invention;
FIG. 10 is a view for explaining the structure of a structure in which a semiconductor element is flip-chip mounted on a circuit board and a manufacturing procedure thereof using a conventional semiconductor package manufacturing apparatus;
FIG. 11 is a diagram showing a state in which a semiconductor element is flip-chip mounted on a circuit board using an elastic body when a semiconductor mounting body is manufactured by a conventional semiconductor mounting body manufacturing apparatus;
FIG. 12 is a perspective view of a support frame according to second and fourth embodiments of the present invention.
FIG. 13 is an explanatory diagram of a creeping phenomenon of the sealing resin 11 according to the first embodiment of the present invention (part 1);
FIG. 14 is an explanatory diagram of a creeping phenomenon of the sealing resin 11 according to the first embodiment of the present invention (part 2);
FIG. 15 is an explanatory diagram of a state in which the sheet material 3 according to the first embodiment of the present invention is not in contact with the circuit board 1 (part 1);
FIG. 16 is an explanatory diagram of a state in which the sheet material 3 according to the first embodiment of the present invention is not in contact with the circuit board 1 (part 2).
FIG. 17 is an explanatory diagram of a suction mechanism 4 ′ having grooves 4a to 4b according to the first embodiment of the present invention.
FIG. 18 is an explanatory diagram of a supply reel 3a and a take-up reel 3b according to the first embodiment of this invention.
[Explanation of symbols]
1 Circuit board
2 Semiconductor elements
3 Sheet material
4 Adsorption mechanism
5 Lifting mechanism
6 Upper chamber
7, 10 Heat source
8 Pressure port
9 Lower chamber
11 Sealing resin
12 Elastic body for seal
13 Insulation plate

Claims (24)

回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造方法であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置工程と、
その配置工程の後に、前記シートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧工程と、
前記シートを加圧する少なくとも直前に、前記半導体素子に配置された前記シートの周辺を固定する固定工程とを備えた半導体実装体の製造方法。 One or a plurality of semiconductor elements are mounted on a circuit board, and a manufacturing method of a semiconductor mounting body in which a sealing resin is disposed in a gap between the circuit board and the semiconductor element,
An arrangement step of arranging a sheet whose shape is flexibly deformed on a surface of the semiconductor element that does not face the circuit board;
After the arrangement step, the side where the semiconductor element does not exist and the semiconductor element so that the air pressure on the side where the semiconductor element does not exist is higher than the pressure on the side where the semiconductor element exists based on the sheet A pressure step for providing a pressure difference to the side on which the semiconductor element exists and pressurizing the semiconductor element with the sheet;
At least immediately before pressurizing the sheet, a manufacturing method of a semi-conductor mounting body and a fixing step of fixing the periphery of the sheet disposed on the semiconductor element. 前記シートを加圧する前に、前記シートの弛みをとる請求項１に記載の半導体実装体の製造方法。Before pressurizing the sheet, a manufacturing method of a semiconductor mounting body according to claim 1 taking the slack of the sheet. 前記シートの弛みをとるとは、前記シートの外側から内側の順に前記シートの周辺を固定することである請求項２に記載の半導体実装体の製造方法。The method for manufacturing a semiconductor package according to claim 2 , wherein the loosening of the sheet is fixing the periphery of the sheet in order from the outside to the inside of the sheet. 回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造方法であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置工程と、
その配置工程の後に、前記シートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧工程と、
前記シートを加圧する際、前記半導体素子が存在しない側から前記シートをヒータで加熱する加熱工程とを備えた半導体実装体の製造方法。 One or a plurality of semiconductor elements are mounted on a circuit board, and a manufacturing method of a semiconductor mounting body in which a sealing resin is disposed in a gap between the circuit board and the semiconductor element,
An arrangement step of arranging a sheet whose shape is flexibly deformed on a surface of the semiconductor element that does not face the circuit board;
After the arrangement step, the side where the semiconductor element does not exist and the semiconductor element so that the air pressure on the side where the semiconductor element does not exist is higher than the pressure on the side where the semiconductor element exists based on the sheet A pressure step for providing a pressure difference to the side on which the semiconductor element exists and pressurizing the semiconductor element with the sheet;
Wherein when the sheet is pressurized, the heating step in the method of manufacturing the semi-conductor mounting body provided with a semiconductor element is to be heated by a heater to the sheet from the side that does not exist. 前記配置されたシートと前記ヒータとの間の距離を調節する請求項４に記載の半導体実装体の製造方法。The method for manufacturing a semiconductor package according to claim 4 , wherein a distance between the arranged sheet and the heater is adjusted. 回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造方法であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置工程と、
その配置工程の後に、前記シートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧工程とを備え、
前記シートは、シリコン又はブナーＳで形成され、０．０１ｍｍ〜３ｍｍの厚みを有するゴムシートである半導体実装体の製造方法。 One or a plurality of semiconductor elements are mounted on a circuit board, and a manufacturing method of a semiconductor mounting body in which a sealing resin is disposed in a gap between the circuit board and the semiconductor element,
An arrangement step of arranging a sheet whose shape is flexibly deformed on a surface of the semiconductor element that does not face the circuit board;
After the arrangement step, the side where the semiconductor element does not exist and the semiconductor element so that the air pressure on the side where the semiconductor element does not exist is higher than the pressure on the side where the semiconductor element exists based on the sheet Providing a pressure difference to the side on which is present, and pressurizing the semiconductor element with the sheet,
The sheet is formed of silicon or Buna S, a manufacturing method of a semi-conductor mounting body is a rubber sheet having a thickness of 0.01Mm～3mm. 回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造方法であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置工程と、
その配置工程の後に、前記シートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧工程とを備え、
前記シートは、ポリイミド、フッ素樹脂、ポリフェニレンサルファイド、ポリプロピレン、ポリエーテル、ポリカーボネート、若しくはクロルスルホン化ポリエチレン、又はそれらの複合体で形成され、０．０１ｍｍ〜１ｍｍの厚みを有する樹脂シートである半導体実装体の製造方法。 One or a plurality of semiconductor elements are mounted on a circuit board, and a manufacturing method of a semiconductor mounting body in which a sealing resin is disposed in a gap between the circuit board and the semiconductor element,
An arrangement step of arranging a sheet whose shape is flexibly deformed on a surface of the semiconductor element that does not face the circuit board;
After the arrangement step, the side where the semiconductor element does not exist and the semiconductor element so that the air pressure on the side where the semiconductor element does not exist is higher than the pressure on the side where the semiconductor element exists based on the sheet Providing a pressure difference to the side on which is present, and pressurizing the semiconductor element with the sheet,
The sheet, polyimide, fluororesin, polyphenylene sulfide, polypropylene, polyether, formed of polycarbonate, or chlorosulfonated polyethylene, or complexes thereof, semiconductors implementation is a resin sheet having a thickness of 0.01mm~1mm Body manufacturing method. 回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と 前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造方法であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置工程と、
その配置工程の後に、前記シートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧工程とを備え、
前記シートは、アルミニウム、銅、又はステンレスで形成され、０．０１ｍｍ〜０．５ｍｍの厚みを有する金属シートである半導体実装体の製造方法。 One or a plurality of semiconductor elements are mounted on a circuit board, and a manufacturing method of a semiconductor mounting body in which a sealing resin is disposed in a gap between the circuit board and the semiconductor element,
An arrangement step of arranging a sheet whose shape is flexibly deformed on a surface of the semiconductor element that does not face the circuit board;
After the arrangement step, the side where the semiconductor element does not exist and the semiconductor element so that the air pressure on the side where the semiconductor element does not exist is higher than the pressure on the side where the semiconductor element exists based on the sheet Providing a pressure difference to the side on which is present, and pressurizing the semiconductor element with the sheet,
Said sheet is of aluminum, copper, or formed of stainless method of semi-conductor mounting body is a metal sheet having a thickness of 0.01Mm～0.5Mm. 回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造方法であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置工程と、
その配置工程の後に、前記シートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧工程とを備え、
前記シートの前記半導体素子と接する側の面には、離型処理が施されている半導体実装体の製造方法。 One or a plurality of semiconductor elements are mounted on a circuit board, and a manufacturing method of a semiconductor mounting body in which a sealing resin is disposed in a gap between the circuit board and the semiconductor element,
An arrangement step of arranging a sheet whose shape is flexibly deformed on a surface of the semiconductor element that does not face the circuit board;
After the arrangement step, the side where the semiconductor element does not exist and the semiconductor element so that the air pressure on the side where the semiconductor element does not exist is higher than the pressure on the side where the semiconductor element exists based on the sheet Providing a pressure difference to the side on which is present, and pressurizing the semiconductor element with the sheet,
Wherein the said surface on the side in contact with the semiconductor device of the sheet, a manufacturing method of a semi-conductor mounting body releasing treatment is applied. 回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造方法であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置工程と、
その配置工程の後に、前記シートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧工程とを備え、
前記シートの前記半導体素子と接しない方の面には、熱吸収を高めるための着色処理が施されている半導体実装体の製造方法。 One or a plurality of semiconductor elements are mounted on a circuit board, and a manufacturing method of a semiconductor mounting body in which a sealing resin is disposed in a gap between the circuit board and the semiconductor element,
An arrangement step of arranging a sheet whose shape is flexibly deformed on a surface of the semiconductor element that does not face the circuit board;
After the arrangement step, the side where the semiconductor element does not exist and the semiconductor element so that the air pressure on the side where the semiconductor element does not exist is higher than the pressure on the side where the semiconductor element exists based on the sheet Providing a pressure difference to the side on which is present, and pressurizing the semiconductor element with the sheet,
Wherein the surface of the person who is not in contact with the semiconductor device manufacturing method of the semi-conductor mounting body coloring process for increasing the heat absorption is applied to the sheet. 回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造方法であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置工程と、
その配置工程の後に、前記シートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧工程とを備え、
前記シートには、熱吸収を高めるための着色添加物が含まれている半導体実装体の製造方法。 One or a plurality of semiconductor elements are mounted on a circuit board, and a manufacturing method of a semiconductor mounting body in which a sealing resin is disposed in a gap between the circuit board and the semiconductor element,
An arrangement step of arranging a sheet whose shape is flexibly deformed on a surface of the semiconductor element that does not face the circuit board;
After the arrangement step, the side where the semiconductor element does not exist and the semiconductor element so that the air pressure on the side where the semiconductor element does not exist is higher than the pressure on the side where the semiconductor element exists based on the sheet Providing a pressure difference to the side on which is present, and pressurizing the semiconductor element with the sheet,
Wherein the sheet manufacturing method of a semi-conductor mount assembly that contains the color additives for enhancing heat absorption. 回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造方法であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置工程と、
その配置工程の後に、前記シートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧工程と、
前記シートを配置する前に、前記半導体素子の近傍に前記シートを支持するための支持枠を配置する支持枠配置工程とを備えた半導体実装体の製造方法。 One or a plurality of semiconductor elements are mounted on a circuit board, and a manufacturing method of a semiconductor mounting body in which a sealing resin is disposed in a gap between the circuit board and the semiconductor element,
An arrangement step of arranging a sheet whose shape is flexibly deformed on a surface of the semiconductor element that does not face the circuit board;
After the arrangement step, the side where the semiconductor element does not exist and the semiconductor element so that the air pressure on the side where the semiconductor element does not exist is higher than the pressure on the side where the semiconductor element exists based on the sheet A pressure step for providing a pressure difference to the side on which the semiconductor element exists and pressurizing the semiconductor element with the sheet;
Prior to placing the sheet, the support frame arrangement step in the method of manufacturing the semi-conductor mounting body provided with a placing a support frame for supporting the sheet in the vicinity of the semiconductor element. 回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板 と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造装置であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置手段と、
前記配置されたシートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧手段と、
前記シートが加圧される少なくとも直前に、前記半導体素子に配置された前記シートの周辺を固定する固定手段とを備えた半導体実装体の製造装置。 One or a plurality of semiconductor elements are mounted on a circuit board, and a semiconductor mounting body manufacturing apparatus in which a sealing resin is disposed in a gap between the circuit board and the semiconductor elements,
Arranging means for arranging a sheet whose shape is flexibly deformed on the surface of the semiconductor element that does not face the circuit board;
The semiconductor element is not present and the semiconductor element is present so that the air pressure on the side where the semiconductor element is not present is higher than the pressure on the side where the semiconductor element is present, based on the arranged sheet. A pressure means for providing a pressure difference to the side and pressurizing the semiconductor element with the sheet;
At least immediately before the sheet is pressurized, semiconductors mounted body manufacturing apparatus and a fixing means for fixing the periphery of the sheet disposed on the semiconductor element. 前記シートを加圧する前に、前記シートの弛みをとる弛み除去手段を備えた請求項１３に記載の半導体実装体の製造装置。The apparatus for manufacturing a semiconductor package according to claim 13 , further comprising a slack removing means for removing slack of the sheet before pressurizing the sheet. 前記シートの弛みをとるとは、前記シートの外側から内側の順に前記シートの周辺を固定することである請求項１４に記載の半導体実装体の製造装置。15. The apparatus for manufacturing a semiconductor package according to claim 14 , wherein the loosening of the sheet is fixing the periphery of the sheet in order from the outside to the inside of the sheet. 回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造装置であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置手段と、
前記配置されたシートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧手段と、
前記シートが加圧される際、前記半導体素子が存在しない側から前記シートを加熱する加熱手段とを備えた半導体実装体の製造装置。 One or a plurality of semiconductor elements are mounted on a circuit board, and a semiconductor mounting body manufacturing apparatus in which a sealing resin is disposed in a gap between the circuit board and the semiconductor elements,
Arranging means for arranging a sheet whose shape is flexibly deformed on the surface of the semiconductor element that does not face the circuit board;
The semiconductor element is not present and the semiconductor element is present so that the air pressure on the side where the semiconductor element is not present is higher than the pressure on the side where the semiconductor element is present, based on the arranged sheet. A pressure means for providing a pressure difference to the side and pressurizing the semiconductor element with the sheet;
It said sheet when pressurized, semiconductors mounted body manufacturing apparatus provided with a heating means for heating the sheet from the side where the semiconductor element is not present. 前記配置されたシートと前記加熱手段との間の距離を調節する距離調節手段を備えた請求項１６に記載の半導体実装体の製造装置。The apparatus for manufacturing a semiconductor package according to claim 16 , further comprising distance adjusting means for adjusting a distance between the arranged sheet and the heating means. 回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造装置であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置手段と、
前記配置されたシートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧手段とを備え、
前記シートは、シリコン又はブナーＳで形成され、０．０１ｍｍ〜３ｍｍの厚みを有するゴムシートである半導体実装体の製造装置。 One or a plurality of semiconductor elements are mounted on a circuit board, and a semiconductor mounting body manufacturing apparatus in which a sealing resin is disposed in a gap between the circuit board and the semiconductor elements,
Arranging means for arranging a sheet whose shape is flexibly deformed on the surface of the semiconductor element that does not face the circuit board;
The semiconductor element is not present and the semiconductor element is present so that the air pressure on the side where the semiconductor element is not present is higher than the pressure on the side where the semiconductor element is present, based on the arranged sheet. Providing a pressure difference on the side, and a pressurizing means for pressurizing the semiconductor element with the sheet,
The sheet is formed of silicon or Buna S, a semi-conductor mount assembly manufacturing apparatus is a rubber sheet having a thickness of 0.01Mm～3mm. 回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造装置であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置手段と、
前記配置されたシートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧手段とを備え、
前記シートは、ポリイミド、フッ素樹脂、ポリフェニレンサルファイド、ポリプロピレン、ポリエーテル、ポリカーボネート、若しくはクロルスルホン化ポリエチレン、又はそれらの複合体で形成され、０．０１ｍｍ〜１ｍｍの厚みを有する樹脂シートである半導体実装体の製造装置。 One or a plurality of semiconductor elements are mounted on a circuit board, and a semiconductor mounting body manufacturing apparatus in which a sealing resin is disposed in a gap between the circuit board and the semiconductor elements,
Arranging means for arranging a sheet whose shape is flexibly deformed on the surface of the semiconductor element that does not face the circuit board;
The semiconductor element is not present and the semiconductor element is present so that the air pressure on the side where the semiconductor element is not present is higher than the pressure on the side where the semiconductor element is present, based on the arranged sheet. Providing a pressure difference on the side, and a pressurizing means for pressurizing the semiconductor element with the sheet,
The sheet, polyimide, fluororesin, polyphenylene sulfide, polypropylene, polyether, formed of polycarbonate, or chlorosulfonated polyethylene, or complexes thereof, semiconductors implementation is a resin sheet having a thickness of 0.01mm~1mm Body manufacturing equipment. 回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造装置であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形する シートを配置する配置手段と、
前記配置されたシートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧手段とを備え、
前記シートは、アルミニウム、銅、又はステンレスで形成され、０．０１ｍｍ〜０．５ｍｍの厚みを有する金属シートである半導体実装体の製造装置。 One or a plurality of semiconductor elements are mounted on a circuit board, and a semiconductor mounting body manufacturing apparatus in which a sealing resin is disposed in a gap between the circuit board and the semiconductor elements,
Arranging means for arranging a sheet whose shape is flexibly deformed on the surface of the semiconductor element that does not face the circuit board ;
The semiconductor element is not present and the semiconductor element is present so that the air pressure on the side where the semiconductor element is not present is higher than the pressure on the side where the semiconductor element is present, based on the arranged sheet. Providing a pressure difference on the side, and a pressurizing means for pressurizing the semiconductor element with the sheet,
Said sheet is of aluminum, copper, or stainless steel in the form, semi-conductor mount assembly manufacturing apparatus is a metal sheet having a thickness of 0.01Mm～0.5Mm. 回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造装置であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置手段と、
前記配置されたシートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧手段とを備え、
前記シートの前記半導体素子と接する側の面には、離型処理が施されている半導体実装体の製造装置。 One or a plurality of semiconductor elements are mounted on a circuit board, and a semiconductor mounting body manufacturing apparatus in which a sealing resin is disposed in a gap between the circuit board and the semiconductor elements,
Arranging means for arranging a sheet whose shape is flexibly deformed on the surface of the semiconductor element that does not face the circuit board;
The semiconductor element is not present and the semiconductor element is present so that the air pressure on the side where the semiconductor element is not present is higher than the pressure on the side where the semiconductor element is present, based on the arranged sheet. Providing a pressure difference on the side, and a pressurizing means for pressurizing the semiconductor element with the sheet,
Wherein the said surface on the side in contact with the semiconductor device of the sheet, release treatment apparatus for producing a semi-conductor mounting body has been subjected. 回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造装置であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置手段と、
前記配置されたシートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧手段とを備え、
前記シートの前記半導体素子と接しない方の面には、熱吸収を高めるための着色処理が施されている半導体実装体の製造装置。 One or a plurality of semiconductor elements are mounted on a circuit board, and a semiconductor mounting body manufacturing apparatus in which a sealing resin is disposed in a gap between the circuit board and the semiconductor elements,
Arranging means for arranging a sheet whose shape is flexibly deformed on the surface of the semiconductor element that does not face the circuit board;
The semiconductor element is not present and the semiconductor element is present so that the air pressure on the side where the semiconductor element is not present is higher than the pressure on the side where the semiconductor element is present, based on the arranged sheet. Providing a pressure difference on the side, and a pressurizing means for pressurizing the semiconductor element with the sheet,
Wherein the surface of the person who is not in contact with the semiconductor device of the sheet, the coloring process apparatus for producing a semi-conductor mounting body being subjected to increase heat absorption. 回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造装置であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置手段と、
前記配置されたシートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧手段とを備え、
前記シートには、熱吸収を高めるための着色添加物が含まれている半導体実装体の製造装置。 One or a plurality of semiconductor elements are mounted on a circuit board, and a semiconductor mounting body manufacturing apparatus in which a sealing resin is disposed in a gap between the circuit board and the semiconductor elements,
Arranging means for arranging a sheet whose shape is flexibly deformed on the surface of the semiconductor element that does not face the circuit board;
The semiconductor element is not present and the semiconductor element is present so that the air pressure on the side where the semiconductor element is not present is higher than the pressure on the side where the semiconductor element is present, based on the arranged sheet. Providing a pressure difference on the side, and a pressurizing means for pressurizing the semiconductor element with the sheet,
Wherein the seat, semiconductors mounted body manufacturing apparatus color additives are included to enhance the heat absorption. 回路基板上に１個又は複数個の半導体素子が実装され、前記回路基板と前記半導体素子との隙間に封止樹脂が配置された半導体実装体の製造装置であって、
前記半導体素子の前記回路基板と対向しない方の面に、形状がフレキシブルに変形するシートを配置する配置手段と、
前記配置されたシートを基準にして、前記半導体素子が存在しない側の気圧が、前記半導体素子が存在する側の気圧より高くなるように、前記半導体素子が存在しない側と前記半導体素子が存在する側とに気圧差を設け、前記シートで前記半導体素子を加圧する加圧手段と、
前記シートが配置される前に、前記半導体素子の近傍に前記シートを支持するために配置されるべき支持枠とを備えた半導体実装体の製造装置。 One or a plurality of semiconductor elements are mounted on a circuit board, and a semiconductor mounting body manufacturing apparatus in which a sealing resin is disposed in a gap between the circuit board and the semiconductor elements,
Arranging means for arranging a sheet whose shape is flexibly deformed on the surface of the semiconductor element that does not face the circuit board;
The semiconductor element is not present and the semiconductor element is present so that the air pressure on the side where the semiconductor element is not present is higher than the pressure on the side where the semiconductor element is present, based on the arranged sheet. A pressure means for providing a pressure difference to the side and pressurizing the semiconductor element with the sheet;
Before the sheet is positioned, semi-conductor mount assembly manufacturing apparatus comprising a support frame and to be arranged to support the sheet in the vicinity of the semiconductor element.
JP2002086616A 2001-08-03 2002-03-26 Semiconductor mounting body manufacturing method and semiconductor mounting body manufacturing apparatus Expired - Fee Related JP3896017B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002086616A JP3896017B2 (en) 2001-08-03 2002-03-26 Semiconductor mounting body manufacturing method and semiconductor mounting body manufacturing apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001236828 2001-08-03
JP2001-236828 2001-08-03
JP2002086616A JP3896017B2 (en) 2001-08-03 2002-03-26 Semiconductor mounting body manufacturing method and semiconductor mounting body manufacturing apparatus

Publications (2)

Publication Number Publication Date
JP2003115510A JP2003115510A (en) 2003-04-18
JP3896017B2 true JP3896017B2 (en) 2007-03-22

Family

ID=26619950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002086616A Expired - Fee Related JP3896017B2 (en) 2001-08-03 2002-03-26 Semiconductor mounting body manufacturing method and semiconductor mounting body manufacturing apparatus

Country Status (1)

Country Link
JP (1) JP3896017B2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1280196A1 (en) * 2001-07-18 2003-01-29 Abb Research Ltd. Process for bonding electronic devices to substrates
JP4371071B2 (en) * 2005-03-23 2009-11-25 富士電機デバイステクノロジー株式会社 Insulating film forming jig and insulating film forming method
JP4872291B2 (en) * 2005-09-27 2012-02-08 住友電気工業株式会社 Electrode connection method, electrode connection device, and method for manufacturing wiring board assembly
JP5113627B2 (en) * 2007-06-12 2013-01-09 日本電波工業株式会社 Electronic component and manufacturing method thereof
JP5349189B2 (en) * 2009-07-28 2013-11-20 新光電気工業株式会社 Electronic component device manufacturing method and jig
JP2011228620A (en) * 2010-03-31 2011-11-10 Sumitomo Bakelite Co Ltd Method of manufacturing electronic device and manufacturing apparatus of the same
WO2014003107A1 (en) * 2012-06-29 2014-01-03 東レエンジニアリング株式会社 Crimping device and crimping method
KR102459563B1 (en) * 2015-01-09 2022-10-26 도쿄엘렉트론가부시키가이샤 Bonding apparatus, bonding system, bonding method and computer storage medium
JP2016129197A (en) * 2015-01-09 2016-07-14 東京エレクトロン株式会社 Bonding device, bonding system, bonding method, program and computer storage medium
JP6415328B2 (en) * 2015-01-09 2018-10-31 東京エレクトロン株式会社 Joining method, program, computer storage medium, joining apparatus and joining system
JP2016129196A (en) * 2015-01-09 2016-07-14 東京エレクトロン株式会社 Bonding device, bonding system, bonding method, program and computer storage medium
TWI636843B (en) * 2015-01-09 2018-10-01 東京威力科創股份有限公司 Joining apparatus, joining system, joining method, and computer storage
JP6453081B2 (en) * 2015-01-09 2019-01-16 東京エレクトロン株式会社 Joining apparatus, joining system, joining method, program, and computer storage medium
JP6508344B2 (en) * 2015-08-28 2019-05-08 日立化成株式会社 Composition for buffer sheet and buffer sheet

Also Published As

Publication number Publication date
JP2003115510A (en) 2003-04-18

Similar Documents

Publication Publication Date Title
JP3896017B2 (en) Semiconductor mounting body manufacturing method and semiconductor mounting body manufacturing apparatus
JP4708401B2 (en) Method for forming a compliant interface of a semiconductor chip
EP1445995B1 (en) Method of mounting an electronic component on a circuit board and system for carrying out the method
CN109103117B (en) Apparatus for bonding semiconductor chips and method of bonding semiconductor chips
JP2005093838A (en) Manufacturing method of semiconductor integrated circuit device
KR102117726B1 (en) Crimping device and crimping method
US6613180B2 (en) Method for fabricating semiconductor-mounting body and apparatus for fabricating semiconductor-mounting body
JPH07240435A (en) Manufacture of semiconductor package, mounting of semiconductor, and semiconductor mounting equipment
JP3791501B2 (en) Circuit board, semiconductor device, semiconductor manufacturing apparatus, circuit board manufacturing method, and semiconductor device manufacturing method
JP2002110744A (en) Apparatus and method for mounting semiconductor
JP5122192B2 (en) Semiconductor device mounting equipment
JP4001341B2 (en) Bonding method and apparatus
KR20200051608A (en) Crimping head and mounting device
JP4619209B2 (en) Semiconductor element mounting method and semiconductor element mounting apparatus
KR20210052774A (en) System for flip chip bonding and method for flip chip bonding using the same
US20060057780A1 (en) Manufacturing apparatus of semiconductor devices, and method of manufacturing semiconductor devices
JP4036116B2 (en) Circuit board, semiconductor device, semiconductor manufacturing apparatus, circuit board manufacturing method, and semiconductor device manufacturing method
JP2001015534A (en) Manufacturing apparatus for semiconductor device and method of manufacturing the same
JPH10173007A (en) Bare chip-mounting apparatus
US20050274708A1 (en) Heating apparatus and method for semiconductor devices
JP2008288622A (en) Method for manufacturing semiconductor integrated circuit device
JP2011187699A (en) Semiconductor device and method of manufacturing the same
JP3723761B2 (en) Electronic component mounting equipment
JP2009004462A (en) Method of mounting semiconductor device
JP2001308510A (en) Method and device for manufacturing bump parts mounting body

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050112

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20051110

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20051115

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20051226

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20061205

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20061215

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees