CN114515880A - Circuit board repairing method with movable induction heating - Google Patents
Circuit board repairing method with movable induction heating Download PDFInfo
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- CN114515880A CN114515880A CN202210174878.1A CN202210174878A CN114515880A CN 114515880 A CN114515880 A CN 114515880A CN 202210174878 A CN202210174878 A CN 202210174878A CN 114515880 A CN114515880 A CN 114515880A
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- circuit board
- induction heating
- bonding pad
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/002—Soldering by means of induction heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
- B23K3/0475—Heating appliances electric using induction effects, e.g. Kelvin or skin effects
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
The invention discloses a movably heated circuit board repairing method, which comprises the following steps of S1: data acquisition, S2: induction heating desoldering, and S3: compared with the prior art, the movably-heated circuit board repair method has the advantages of flexible processing, high repair efficiency, high repair success rate, wide processing coverage, strong adaptability, sufficient heat, strong heat source controllability, capability of meeting the requirements of desoldering or welding of elements in a wide size range, capability of well achieving an expected heating effect, accurate positioning, stable work and the like.
Description
Technical Field
The invention belongs to the technical field of precision machining, and particularly relates to a circuit board repair machine.
Background
The circuit board is usually composed of a substrate, solder and electronic components, after the circuit is designed, a circuit part in the circuit is printed on the substrate, a pad is reserved on the substrate for the position where the electronic components are laid out in the circuit design, during manufacturing, a specified component is moved to the corresponding position, metal pads of the specified component are one-to-one, the pad on the substrate is welded, after the solder is applied to the pad, the solder is heated by a specified heat source to be melted, the melted solder is used for bonding the electronic components with the pad, and the electronic components are connected and conducted with the substrate, so that the welding processing of the circuit board is completed.
Along with the development of electronic technology and the progress of packaging technology, the circuit scale is larger and larger, the circuit layout is more and more compact, the volume of a single electronic component is smaller and smaller, the electronic components required to be welded on a single substrate are more and more, the space between adjacent electronic components is smaller and smaller, the processing precision of the circuit board manufacturing process is higher and higher, and just for the same reason, after the single circuit board is formed at one time, the probability that the components are damaged, shifted, neglected to mount or fall off in the processed circuit board is multiplied due to the self fault or processing error of the individual electronic component in a local area, but in the prior art, the repair equipment for the circuit board formed at one time is lacked, no effective compensation measure is provided for defective products in the production process, so that once one or more electronic components are failed, namely, the whole circuit board is completely scrapped, therefore, it is an urgent technical problem to be solved by those skilled in the art to design a method for repairing a circuit board so that the method can perform a corresponding repairing operation on the circuit board having a local failure and requiring repairing of individual electronic components, thereby remedying and repairing defective products in the manufacturing process.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide a method for repairing a circuit board, in which a plurality of devices are movably matched, a flexible device is used for scheduling, and after a failed device is removed from a circuit board having a local failure based on an induction heating principle, the device is replaced with a new device, so that the circuit boards with various appearance sizes can be efficiently, quickly and flexibly repaired, and the method can be conveniently applied to a wider circuit board repairing scene.
In order to realize the purpose, the technical scheme of the invention is as follows:
a movably heated circuit board repairing method comprises the following steps:
s1: data acquisition: detecting the circuit board, and acquiring actual coordinate parameters of the circuit board and the required repair part in the processing process;
s2: induction heating and desoldering: according to actual coordinate parameters of the circuit board and the required repair part, an induction heating source is scheduled to move to the required repair position, the original electronic component at the position is desoldered, the original electronic component is removed, and the original bonding pad at the position is exposed;
s3: re-welding new elements: and grabbing a new element with the same function as the model of the original electronic component, conveying the new element to a position needing to be repaired, scheduling the induction heating source to move to the position to perform secondary heating on the new element, and welding the new element and the original bonding pad.
Further, S1 specifically includes:
s11: performing AOI detection on the circuit board to obtain the contour dimension parameters of the circuit board, the position coordinates of a fault device in the circuit board, the fault type, the model of the fault device and the pose of the fault device on the circuit board as ideal parameters;
s12: arranging a feeding platform with Y-axis direction freedom degree, placing the circuit board to be repaired on the feeding platform, and transmitting ideal parameters of the circuit board and the part to be repaired to the feeding platform;
s13: a scheduling camera shoots a circuit board from the upper part of the feeding platform, analyzes the shot circuit board image, and identifies and positions mark points on the circuit board;
s14: and analyzing and acquiring the actual placing posture of the current circuit board according to the mark points on the circuit board, and superposing the ideal parameters on the current circuit board to obtain the actual coordinate parameters of the fault devices in the circuit board under the actual placing posture of the current circuit board.
Further, S2 specifically includes:
s21: the induction heating source is arranged in the X-axis direction and the Z-axis direction and has freedom degrees, and the projection point of the induction heating head in the XY plane in the induction heating source is marked as a movable heating working position point;
s22: according to actual coordinate parameters of a fault device in the circuit board, a feeding platform and an induction heating source are scheduled to move close to each other at the same time, and the point position required to be repaired by the circuit board is superposed with the movable heating station position;
S23: detecting the thickness of a substrate of the current circuit board and the size and height data of elements at the required repair positions;
s24: adjusting the height of an induction heating head in the induction heating source along the Z-axis direction according to the thickness of a substrate of the current circuit board and the size and height of an element at the position required to be repaired, controlling an alternating magnetic field generated by the induction heating head to cover the position required to be repaired, and melting the solder;
s25: recovering and removing the loosened original element to finish the desoldering;
s26: and dispatching the bonding pad on the induction heating source circuit board and the residual tin layer on the bonding pad for continuous heating, and leveling the bonding pad.
Further, S2 further includes:
S27A: arranging a tin pick-up head with the freedom degree in the X-axis direction and the freedom degree in the Z-axis direction, and taking a projection point of a real-time tin outlet of the tin pick-up head in an XY plane as a movable tin pick-up work point;
S28A: scheduling the feeding platform and the tin pick-up head to move simultaneously according to the actual coordinate parameters of the fault device, and superposing the point position required to be repaired by the circuit board and the movable tin pick-up station;
S29A: and allowing the solder dipping head to descend along the Z-axis direction, and reapplying the solder on the exposed pad after the solder stripping is completed on the circuit board.
Further, S2 further includes:
S27B: setting a soldering flux head with X-axis direction freedom degree and Z-axis direction freedom degree, and taking a projection point of a real-time soldering flux outlet position of the soldering flux head in an XY plane as a soldering flux working site;
S28B: scheduling the feeding platform and the soldering flux head to move simultaneously according to the actual coordinate parameters of the fault device, and superposing the required repair point positions of the circuit board and the soldering flux working points;
S29B: the flux head is allowed to descend in the Z-axis direction to reapply solder to the pads on the circuit board.
Further, S3 specifically includes:
s31: classifying and storing new components which have complete functions and correspond to original components on the circuit board in advance;
s32: while applying the solder or the soldering flux, scheduling a camera to shoot the classified and stored new components, positioning each new component according to the shot image, acquiring specific coordinates of the new component required in the current repair work, and selecting and grabbing out the new component with the function model consistent with that of the original component removed by unsoldering;
s33: the method comprises the steps that a scheduling camera shoots a grabbed new element from the lower part in an upward mode, images of the shot new element are analyzed, and the position and the posture of a bonding pad of the current grabbed new element are identified;
s34: and comparing the position and the attitude of the bonding pad of the current grabbed new element with the actual coordinate parameters of the circuit board and the part needing to be repaired, analyzing whether the position and the attitude of the bonding pad of the current grabbed new element are consistent with the original position and attitude of the part needing to be repaired, and if the position and the attitude of the bonding pad are deviated, adjusting the grabbing position and attitude until the positions and the attitudes of the bonding pad are consistent.
Further, S3 further includes:
s35: controlling a loading platform carrying the circuit board and a manipulator grabbing the element to mutually approach according to actual coordinate parameters of the circuit board and the required repair part, and placing the grabbed new element on the circuit board to which the solder and/or the soldering flux are reapplied;
s36: overlapping the induction heating head and the coordinates of the welding disc on which the solder or the soldering flux is reapplied on the circuit board according to the actual coordinate parameters of the circuit board and the required repair part;
s37: and allowing the induction heating head in the induction heating source to descend along the Z-axis direction, controlling the alternating magnetic field generated by the induction heating head again, and performing induction heating on the bonding pad, the bonding pad of the new element and the reapplied solder by using the alternating magnetic field to weld the new element and the circuit board.
Compared with the prior art, the repair method provided by the invention has the following beneficial effects:
flexible processing, high repair efficiency and high repair success rate: the method provided by the invention endows the feeding platform with the freedom degree in the Y-axis direction, allows the current circuit board to be overhauled to flexibly transfer along the Y-axis direction, and cooperates with the circuit board transfer, the processes of induction heating desoldering, grabbing elements, re-welding new elements and the like are mutually cooperated with other devices and flexibly move, the part of the circuit board needing to be repaired does not need to be specially moved to a fixed position for a certain processing process, and the repairing efficiency of the whole circuit board is higher.
Wide processing coverage and strong adaptability: the repair method provided by the invention endows all devices for actually processing the circuit board with freedom degrees in the X-axis direction and the Z-axis direction, endows the freedom degrees in the Y-axis direction with the feeding platform, and the feeding platform is matched with other parts, so that the region as large as possible can be processed, the circuit board in various size ranges can be dealt with, and the accurate repair can be conveniently carried out on each required repair point position at different positions.
The heat is sufficient, the heat source controllability is strong, the desoldering or welding requirements of elements with wide size range can be met, and the expected heating effect can be well achieved: in the repair method provided by the application, the induction heating source is selected as the heat source for welding or desoldering, and as the induction heating technology is developed, compared with a resistance heat source or a laser heat source, the induction heating source can generate enough high temperature, and meanwhile, key parameters such as the generated heat quantity, the generated position of the heat quantity and the like can be calculated in detail according to parameters such as the current size of alternating current, the alternating frequency, the shape of the induction heating source, the distance between the induction heating source and a circuit board and the like, so that the controllability of the final welding result is better.
The location is accurate, job stabilization: for each component requiring rework on each circuit board, the rework method provided herein undergoes a triple positioning: the method comprises the steps that ideal coordinate parameters of a circuit board and a part needing to be repaired are obtained through AOI detection and serve as first repositioning measures, and after the first repositioning measures are carried out, parameters such as specific and digital appearance parameters of the circuit board, specific positions of various elements on the circuit board, specific position coordinates of a fault element needing to be repaired on the circuit board, and element installation postures of the fault element can be obtained; secondly, after the circuit board is placed on a feeding platform, a dispatching camera captures mark points to obtain actual coordinate parameters of the circuit board and the part needing to be repaired as a second repositioning measure, and after the second repositioning measure, an ideal coordinate system originally established after AOI detection can be superposed with the actual circuit board, so that the actual coordinate of the part needing to be repaired and the pose of the part needing to be repaired are guided for the subsequent processing process; and finally, after the new element is captured, the pose of the captured new element is captured and analyzed through a camera, the actual pose of the new element is adjusted to be superposed with the actual circuit board, accurate alignment of each processing part and a required position is guaranteed, accurate alignment of the new element and the circuit board can be guaranteed while a fault position can be accurately processed, and a bonding pad of the new element can be accurately welded with an original bonding pad.
Drawings
Fig. 1 is an apparatus for performing a method of repairing a circuit board by active induction heating according to an embodiment, in which a is a loading platform mainly used for performing a transfer work of the circuit board in S2-S3; b is an X-axis beam for providing a basis of movement in the X-axis direction to other components having freedom in the X-axis direction in the steps S2-S3; c is a movable induction heating source for providing a heat source for desoldering or re-soldering a new component in steps S2 and S3; d is a solder head for performing the fluxing operation described in steps S27A-S29A; and E is a component taking manipulator, which is mainly used for executing the work of grabbing the new component in the step S3.
Fig. 2 is a flow chart of a method for reworking a circuit board with active induction heating provided in an embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In order to achieve the purpose, the technical scheme of the invention is as follows:
please refer to fig. 1-2.
In the present embodiment, a method for repairing a movably heated circuit board is provided, where the method is applied to a Mini LED or Micro LED display, and when a local failure occurs in a display circuit board, a failed single R, G, B light emitting element needs to be removed, and then a new R, G, B light emitting element having the same function as the original R, G, B light emitting element is soldered again.
The repair method comprises the following steps:
s1: data acquisition: detecting the circuit board, and acquiring actual coordinate parameters of the circuit board and the required repair part in the processing process;
s2: induction heating and desoldering: according to actual coordinate parameters of the circuit board and the required repair part, an induction heating source is scheduled to move to the required repair position, the original electronic component at the position is desoldered, the original electronic component is removed, and the original bonding pad at the position is exposed;
s3: re-soldering a new R, G, B light emitting element: and grabbing a new R, G, B light-emitting element with the same function as the original electronic component model, conveying the light-emitting element to a position needing to be repaired, scheduling the induction heating source to move to the position to carry out secondary heating on the light-emitting element, and welding the new R, G, B light-emitting element with the original bonding pad.
Further, in this embodiment, S1 is specifically:
s11: performing AOI detection on the circuit board to obtain the contour dimension parameters of the circuit board, the position coordinates of a fault device in the circuit board, the fault type, the model of the fault device and the pose of the fault device on the circuit board as ideal parameters;
s12: arranging a feeding platform with Y-axis direction freedom degree, placing the circuit board to be repaired on the feeding platform, and transmitting ideal parameters of the circuit board and the part to be repaired to the feeding platform;
s13: a scheduling camera shoots a circuit board from the upper part of the feeding platform, analyzes the shot circuit board image, and identifies and positions mark points on the circuit board;
s14: and analyzing and acquiring the actual placing posture of the current circuit board according to the mark points on the circuit board, and superposing the ideal parameters on the current circuit board to obtain the actual coordinate parameters of the fault devices in the circuit board under the actual placing posture of the current circuit board.
Further, in this embodiment, S2 is specifically:
s21: the induction heating source is arranged in the X-axis direction and the Z-axis direction and has freedom degrees, and the projection point of the induction heating head in the XY plane in the induction heating source is marked as a movable heating working position point;
S22: according to actual coordinate parameters of a fault device in the circuit board, a feeding platform and an induction heating source are scheduled to move close to each other at the same time, and the point position required to be repaired by the circuit board is superposed with the movable heating station position;
s23: detecting the thickness of a substrate of the current circuit board and the size and height data of an original R, G, B light-emitting element at a required repairing position;
s24: according to the thickness of a substrate of the current circuit board and the size and height of an original R, G, B light-emitting element at a required repair position, the height of an induction heating head in an induction heating source is adjusted along the Z-axis direction, an alternating magnetic field generated by the induction heating head is controlled to cover the required repair position, and solder is melted;
s25: recovering and removing the loosened original R, G, B light-emitting element to complete desoldering;
s26: and dispatching the bonding pad on the induction heating source circuit board and the residual tin layer on the bonding pad for continuous heating, and leveling the bonding pad.
Further, in this embodiment, S2 further includes:
S27A: arranging a tin pick-up head with the freedom degree in the X-axis direction and the freedom degree in the Z-axis direction, and taking a projection point of a real-time tin outlet of the tin pick-up head in an XY plane as a movable tin pick-up work point;
S28A: scheduling the feeding platform and the tin pick-up head to move simultaneously according to the actual coordinate parameters of the fault device, and superposing the point position required to be repaired by the circuit board and the movable tin pick-up station;
S29A: allowing the solder dipping head to descend along the Z-axis direction, and reapplying solder on the exposed pad after the solder stripping is completed on the circuit board;
further, in this embodiment, S2 further includes:
S27B: setting a soldering flux head with X-axis direction freedom degree and Z-axis direction freedom degree, and taking a projection point of a real-time soldering flux outlet position of the soldering flux head in an XY plane as a soldering flux working site;
S28B: scheduling the feeding platform and the soldering flux head to move simultaneously according to the actual coordinate parameters of the fault device, and superposing the required repair point positions of the circuit board and the soldering flux working points;
S29B: the flux head is allowed to descend in the Z-axis direction to reapply solder to the pads on the circuit board.
Further, in this embodiment, S3 is specifically:
s31: classifying and storing new R, G, B light-emitting elements which have complete functions and correspond to the original R, G, B light-emitting elements on the circuit board in advance;
s32: when the solder or the soldering flux is applied, a camera is scheduled to shoot new R, G, B light-emitting elements which are stored in a classified mode, each new R, G, B light-emitting element is located according to a shot image, specific coordinates of a new R, G, B light-emitting element required in the current repair work are obtained, and a new R, G, B light-emitting element which is identical to the original R, G, B light-emitting element which is removed by unsoldering in function model is selected and grabbed;
S33: the scheduling camera takes a grabbed new R, G, B light-emitting element from below, analyzes the shot image of the new R, G, B light-emitting element, and identifies the pad pose of the currently grabbed new R, G, B light-emitting element;
s34: and comparing the solder pad pose of the currently grabbed new R, G, B light-emitting element with the actual coordinate parameters of the circuit board and the required repair part, analyzing whether the solder pad pose of the currently grabbed new R, G, B light-emitting element is consistent with the original solder pad pose of the required repair part, and if the solder pad pose is deviated from the original solder pad pose, adjusting the grabbing pose until the solder pad pose is consistent with the original solder pad pose of the required repair part.
Further, in this embodiment, S3 further includes:
s35: controlling a loading platform carrying the circuit board and a R, G, B luminous element manipulator grabbing R, G, B luminous elements to mutually approach according to actual coordinate parameters of the circuit board and the required repair part, and placing the grabbed new R, G, B luminous elements on the circuit board to which the solder and/or the soldering flux are reapplied;
s36: overlapping the induction heating source and the coordinates of the welding disc reapplied with the welding flux on the circuit board according to the actual coordinate parameters of the circuit board and the required repair part;
S37: and allowing the induction heating head in the induction heating source to descend along the Z-axis direction, controlling the alternating magnetic field generated by the induction heating head again, and performing induction heating on the bonding pad, the bonding pad of the new R, G, B light-emitting element and the reapplied solder by the alternating magnetic field to weld the new R, G, B light-emitting element with the circuit board.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A movably heated circuit board repairing method is characterized by comprising the following steps:
s1: data acquisition: detecting the circuit board, and acquiring actual coordinate parameters of the circuit board and the required repair part in the processing process;
s2: induction heating and desoldering: according to actual coordinate parameters of the circuit board and the required repair part, an induction heating source is scheduled to move to the required repair position, the original electronic component at the position is desoldered, the original electronic component is removed, and the original bonding pad at the position is exposed;
s3: re-welding new elements: and grabbing a new element with the same function as the model of the original electronic component, conveying the new element to a position needing to be repaired, scheduling the induction heating source to move to the position to perform secondary heating on the new element, and welding the new element and the original bonding pad.
2. The method for reworking an actively heated circuit board according to claim 1, wherein said S1 is embodied as:
s11: performing AOI detection on the circuit board to obtain the contour dimension parameters of the circuit board, the position coordinates of a fault device in the circuit board, the fault type, the model of the fault device and the pose of the fault device on the circuit board as ideal parameters;
s12: arranging a feeding platform with Y-axis direction freedom degree, placing the circuit board to be repaired on the feeding platform, and transmitting ideal parameters of the circuit board and the part to be repaired to the feeding platform;
s13: a scheduling camera shoots a circuit board from the upper part of the feeding platform, analyzes the shot circuit board image, and identifies and positions mark points on the circuit board;
s14: and analyzing and acquiring the actual placing posture of the current circuit board according to the mark points on the circuit board, and superposing the ideal parameters on the current circuit board to obtain the actual coordinate parameters of the fault devices in the circuit board under the actual placing posture of the current circuit board.
3. The method for reworking an actively heated circuit board according to claim 2, wherein said S2 is embodied as:
s21: the induction heating source is arranged in the X-axis direction and the Z-axis direction and has freedom degrees, and the vertical projection point of the induction heating head in the XY plane in the induction heating source is marked as a movable heating working position point;
S22: according to actual coordinate parameters of a fault device in the circuit board, the loading platform and the induction heating source are scheduled to move close to each other at the same time, and the point position required to be repaired by the circuit board is superposed with the movable heating station position;
s23: detecting the thickness of a substrate of the current circuit board and the size and height data of elements at the required repair positions;
s24: adjusting the height of an induction heating head in the induction heating source along the Z-axis direction according to the thickness of a substrate of the current circuit board and the size and height of an element at the position required to be repaired, controlling an alternating magnetic field generated by the induction heating head to cover the position required to be repaired, and melting the solder;
s25: recovering and removing the loosened original element to finish the desoldering;
s26: and dispatching the bonding pad on the induction heating source circuit board and the residual tin layer on the bonding pad for continuous heating, and leveling the bonding pad.
4. The method of claim 3, wherein said S2 further comprises:
S27A: arranging a tin dipping head with X-axis direction freedom degree and Z-axis direction freedom degree, and taking a projection point of a real-time tin outlet of the tin dipping head in an XY plane as a movable tin dipping work point;
S28A: scheduling the feeding platform and the tin pick-up head to move simultaneously according to the actual coordinate parameters of the fault device bonding pad, and superposing the point position required to be repaired by the circuit board and the movable tin pick-up working point;
S29A: and allowing the solder dipping head to descend along the Z-axis direction, and reapplying solder on the exposed bonding pad after the circuit board is subjected to desoldering.
5. The method for reworking an actively heated circuit board as recited in claim 3, wherein said step S2 further comprises:
S27B: setting a soldering flux head with X-axis direction freedom degree and Z-axis direction freedom degree, and taking a projection point of a real-time soldering flux outlet position of the soldering flux head in an XY plane as a soldering flux working site;
S28B: scheduling the feeding platform and the soldering flux head to move simultaneously according to the actual coordinate parameters of the fault device, and superposing the required repair point positions of the circuit board and the soldering flux working points;
S29B: the flux head is allowed to descend in the Z-axis direction to reapply solder to the pads on the circuit board.
6. The spot heating circuit board rework method according to any one of claims 3-5, wherein said S3 is specifically:
s31: classifying and storing new components which have complete functions and correspond to original components on the circuit board in advance;
s32: selecting and grabbing out a new element with the same functional model as the original element which is removed by unsoldering while applying solder or soldering flux;
s33: the scheduling camera shoots the grabbed new element from the lower part in an upward mode, analyzes the shot image of the new element and identifies a bonding pad of the current grabbed new element;
S34: and comparing the position and the attitude of the bonding pad of the current grabbed new element with the actual coordinate parameters of the circuit board and the part needing to be repaired, analyzing whether the position and the attitude of the bonding pad of the current grabbed new element are consistent with the original position and attitude of the part needing to be repaired, and if the position and the attitude of the bonding pad are deviated, adjusting the grabbing position and attitude until the positions and the attitudes of the bonding pad are consistent.
7. The method of claim 6, wherein said S3 further comprises:
s35: controlling the loading platform carrying circuit board to approach to a new element according to actual coordinate parameters of the circuit board and the required repair part, and placing the grabbed new element on the circuit board to which the solder and/or the soldering flux are/is reapplied;
s36: moving an induction heating head in an induction heating source to be above a bonding pad to which solder and/or soldering flux are/is applied according to actual coordinate parameters of the circuit board and the required repair part;
s37: and allowing the induction heating head in the induction heating source to descend along the Z-axis direction, controlling the alternating magnetic field generated by the induction heating head again, and performing induction heating on the bonding pad, the bonding pad of the new element and the reapplied solder by using the alternating magnetic field to weld the new element and the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210174878.1A CN114515880A (en) | 2022-02-25 | 2022-02-25 | Circuit board repairing method with movable induction heating |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210174878.1A CN114515880A (en) | 2022-02-25 | 2022-02-25 | Circuit board repairing method with movable induction heating |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115295691A (en) * | 2022-10-10 | 2022-11-04 | 深圳市艾贝特电子科技有限公司 | Mini-LED chip electromagnetic repair equipment and method |
| TWI828171B (en) * | 2022-06-01 | 2024-01-01 | 創新服務股份有限公司 | Maintenance device and method of electronic components |
-
2022
- 2022-02-25 CN CN202210174878.1A patent/CN114515880A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI828171B (en) * | 2022-06-01 | 2024-01-01 | 創新服務股份有限公司 | Maintenance device and method of electronic components |
| CN115295691A (en) * | 2022-10-10 | 2022-11-04 | 深圳市艾贝特电子科技有限公司 | Mini-LED chip electromagnetic repair equipment and method |
| CN115295691B (en) * | 2022-10-10 | 2022-12-23 | 深圳市艾贝特电子科技有限公司 | Mini-LED chip electromagnetic repair equipment and method |
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