CN118315497A - Mini LED product finished product repairing equipment and method - Google Patents

Abstract

The invention relates to a Mini LED product finished product repairing device and a method, comprising a bracket, wherein a linear motion module is fixedly arranged on the bracket; the repairing platform is used for placing products to be repaired and comprises a repairing platform, an X-axis linear module and a Y-axis linear module, wherein the X-axis linear module and the Y-axis linear module are arranged below the repairing platform and used for driving the repairing platform to move along the X-axis direction and the Y-axis direction respectively; the positioning module comprises a height measurement module for measuring the glue height on the bad point and a bad point identification module for identifying the bad point; the glue removing module is used for removing glue on the bad point positions; the bonding pad cleaning module is used for removing bad chips on the bonding pad and cleaning the bonding pad after the bad chips are removed; the tin spot module is used for tin supplementing of the cleaned point positions on the bonding pads; the chip taking and mounting module is used for mounting the chip on the bad point after the tin is dispensed; and the welding module is used for welding after the chip is attached to the bad point location. The Mini LED product manufactured into a finished product can be repaired by the repair equipment and the repair method, so that the yield is improved.

Description

Mini LED product finished product repairing equipment and method

Technical Field

The invention relates to the technical field of repair of MiniLED lamp bead chips and MiniIC, in particular to repair equipment and method for Mini LED product finished products.

Background

In the current electronic manufacturing industry, mini LED products are favored for their high efficiency, high brightness and other advantages. However, in the production process, after the product is subjected to a plurality of links such as high-temperature treatment of a reflow oven, film pressing packaging, gluing, pressing and curing, the finished product of the product can have vanishing points or other bad states. This is mainly due to the high temperature and high pressure environment, the product performance, and the low yield caused by the complex process.

The traditional repairing mode mainly depends on manual operation, and the manual repairing is low in efficiency and high in manpower expenditure. Secondly, because the product is completely packaged after passing through a plurality of process sections, the solder paste is solidified, so that the repair difficulty is increased, and the product can be scrapped without paying attention. In addition, the consistency of the product after the manual repair is lower, and even if the repair is successful, the effect of the product is likely to be reduced due to the difference of manual operation, and the reject ratio is high.

Therefore, it is now highly desirable to provide a device and method for repairing the finished Mini LED product, so as to solve the above problems.

Disclosure of Invention

The invention aims to overcome the defects and the defects of the prior art, and provides Mini LED product finished product repairing equipment and a Mini LED product repairing method, which can repair Mini LED products manufactured into finished products and improve the yield.

The aim of the invention is realized by the following technical scheme:

a Mini LED product finished product rework apparatus for reworking Mini LED products that have been manufactured into finished products, comprising:

the support is fixedly provided with a linear motion module;

the repairing platform is arranged at the front side of the bracket and used for placing products to be repaired, and comprises a repairing platform, an X-axis linear module and a Y-axis linear module, wherein the X-axis linear module and the Y-axis linear module are arranged below the repairing platform and used for driving the repairing platform to move along the X-axis direction and the Y-axis direction respectively;

the positioning module is arranged on the linear motion module and comprises a height measurement module for measuring the glue height on the bad point location and a bad point identification module for identifying the bad point location;

The glue removing module is positioned at one side of the repairing platform and is used for removing glue on the bad point positions;

The bonding pad cleaning module is arranged on the linear motion module and is used for removing bad chips on the bonding pad and cleaning the bonding pad after the bad chips are removed;

The tin spot module is arranged on the linear motion module and is used for supplementing tin to the cleaned point positions on the bonding pads;

the chip taking and mounting module comprises a chip taking module and a chip mounting module, wherein the chip taking module and the chip mounting module are arranged on one side of the bracket and used for taking and mounting chips respectively at bad points after tin aligning is finished;

and the welding module is arranged on the linear motion module and used for welding after the chip is attached to the bad point.

As a preferable technical scheme of the invention, the linear motion module comprises a first linear motion module and a second linear motion module, wherein a first fixing plate is arranged on the first linear motion module, a second fixing plate is arranged on the second linear motion module, the positioning module and the welding module are both fixed on the first fixing plate, and the bonding pad cleaning module and the tin plating module are both fixedly arranged on the second fixing plate.

As a preferable technical scheme of the invention, the bad point identification module comprises a Mark point positioning assembly positioned on the repair table, a bad point identification camera arranged on the first fixed plate, and a Z-axis lifting module for driving the bad point identification camera and the welding module to move along the Z-axis direction, and the height measurement module comprises a measuring piece and a measuring lifting module for driving the measuring piece to move along the Z-axis direction.

As a preferable technical scheme of the invention, the glue removing module comprises a glue removing head and a glue removing head lifting module, wherein the glue removing head lifting module is used for driving the glue removing head to move along the Z-axis direction to be close to or far from a repairing table;

and one side of the glue removal module is also provided with an air blowing assembly for removing residues on the repaired product after glue removal.

As a preferable technical scheme of the invention, the bonding pad cleaning module comprises a removing head and a removing head lifting module for driving the removing head to lift, and the tin-plating module comprises a tin-plating head and a tin-plating lifting module for driving the tin-plating head to lift.

As a preferable technical scheme of the invention, the chip taking module comprises a taking assembly arranged on a second linear motion module, a chip identification camera fixedly arranged on a bracket, a wafer platform discharging device arranged right below the chip identification camera and a thimble module arranged below the wafer platform discharging device, wherein a wafer platform rotating motor, a wafer platform X-axis linear module and a wafer platform Y-axis linear module are arranged below the wafer platform discharging device, the wafer platform X-axis linear module is arranged on the wafer platform Y-axis linear module, and a plurality of discharging grooves are arranged on the wafer platform discharging device.

As a preferable technical scheme of the invention, the thimble module comprises a thimble assembly and a thimble lifting module for driving the thimble assembly to lift up or down.

As a preferable technical scheme of the invention, the chip mounting module comprises a mounting component arranged on a second linear motion module, a chip detection camera fixedly arranged on a bracket, a transfer table arranged right below the chip detection camera and a chip angle correction camera arranged on one side of the transfer table, wherein a transfer table rotating motor, a sliding table and a transfer table XY adjusting component are arranged below the transfer table, the sliding table is arranged below the transfer table rotating motor and fixedly connected with the transfer table rotating motor, and the transfer table XY adjusting component is connected with the sliding table.

As a preferable technical scheme of the invention, the welding module comprises a welding head, the welding head is fixed on the first fixing plate, and the Z-axis lifting module is used for driving the welding head to lift.

The invention also provides a MiniLED finished product repairing method, which comprises the following steps:

s1, carrying out height measurement photographing on a defective point, and confirming the position of the defective point and the defective type of the defective point;

S2, removing the packaging medium on the bad point positions;

s3, removing bad chips at bad points, and cleaning residues on the bonding pads;

S4, filling a connecting medium on the cleaned bonding pad;

S5, mounting chips on the bad points, and welding after mounting;

S6, shooting and confirming the repaired bad point positions.

Compared with the prior art, the invention has the following beneficial effects:

the repairing method is applied to the Mini LED product finished product repairing equipment. The repair platform is used for bearing products to be repaired, and the repair platform is operated to the positioning module, the glue removing module, the bonding pad cleaning module, the tin spot module, the chip taking and mounting module and the welding module to carry out bad spot recognition, glue removing, bonding pad cleaning, tin spot, chip mounting, welding and other repair operations on Mini LED products manufactured into finished products, and the whole process is automatically completed through equipment without manual participation, so that the consistency and stability of the products are ensured, meanwhile, the production cost is reduced, and the production efficiency and the yield are improved.

Drawings

Fig. 1 is a schematic structural diagram of a Mini LED product finished product repairing apparatus according to the present invention.

Fig. 2 is a top view of a Mini LED product finished product repair apparatus according to the present invention.

Fig. 3 is a schematic structural diagram of a glue removing module of a Mini LED product finished product repairing device provided by the present invention.

Fig. 4 is an enlarged view of the structure at a in fig. 3.

Fig. 5 is an enlarged view of the structure at B in fig. 3.

Fig. 6 is a side view of a glue removing module of a Mini LED product finished product repair device according to the present invention.

Fig. 7 is an enlarged view of the structure at C in fig. 6.

Fig. 8 is an enlarged view of the structure at D in fig. 6.

Fig. 9 is a schematic diagram of a front view of a Mini LED product finished product repair device according to the present invention.

Fig. 10 is an enlarged view of the structure at E in fig. 9.

FIG. 11 is a flowchart of a method for repairing a Mini LED product finished product according to the present invention

Wherein the above figures include the following reference numerals:

100. The device comprises a bracket, 101, a first linear motion module, 102, a second linear motion module, 103, a first fixed plate, 104, a second fixed plate, 1, a repairing platform, 11, a repairing platform, 12, an X-axis linear module, 13, a Y-axis linear module, 2, a positioning module, 21, a Mark point positioning module, 22, a bad point identification camera, 23, a Z-axis lifting module, 24, a measuring piece, 25, a measuring lifting module, 3, a gumming module, 31, a gumming head, 32, a gumming head lifting module, 33, a blowing module, 4, a bonding pad cleaning module, 41, a gumming head, 42, a gumming head lifting module, 5, a tin-plating module, 51, a tin-plating head, 52 and a tin-plating lifting module, 6, a chip taking and mounting module, 61, a chip taking module, 611, a chip identification camera, 612, a wafer platform discharging device, 613, a wafer platform rotating motor, 614, a wafer platform X-axis linear module, 615, a wafer platform Y-axis linear module, 616, a discharging groove, 62, a chip mounting module, 621, a chip detection camera, 622, a transfer table, 623, a transfer table rotating motor, 624, a sliding table, 625, a transfer table XY adjustment assembly, 626, a chip angle correction camera, 63, a taking assembly, 64, a mounting assembly, 7, a welding module, 71, a welding head, 8, a thimble module, 81, a thimble assembly, 82 and a thimble lifting module.

Detailed Description

The present invention will be described in further detail with reference to examples and drawings, but embodiments of the present invention are not limited thereto.

The specific implementation process of the invention is as follows:

Referring to fig. 1 to 10, a Mini LED product finished product repair apparatus for repairing Mini LED products which have been manufactured into finished products, includes:

the support 100, the support 100 has set up the linear motion module;

the repairing platform 1 is arranged on the front side of the bracket 100 and used for placing products to be repaired, the repairing platform 1 comprises a repairing platform 11, and an X-axis linear module 12 and a Y-axis linear module 13 which are arranged below the repairing platform 11 and used for driving the repairing platform 11 to move along the X-axis direction and the Y-axis direction respectively, and the X-axis linear module 12 is arranged on the Y-axis linear module 13;

The positioning module 2 is arranged on the linear motion module, and the positioning module 2 comprises a height measurement module for measuring the glue height on the bad point location and a bad point identification module for identifying the bad point location;

the glue removing module 3 is positioned at one side of the repairing platform 1 and is used for removing glue on the bad point positions;

The bonding pad cleaning module 4 is arranged on the linear motion module and is used for removing bad chips on the bonding pad and cleaning the bonding pad after the bad chips are removed;

The tin spot module 5 is arranged on the linear motion module and is used for supplementing tin to the cleaned point positions on the bonding pads;

The chip taking and mounting module 6 comprises a chip taking module 61 and a chip mounting module 62 which are arranged on one side of the bracket 100 and used for taking and mounting chips respectively at bad points after tin aligning is completed;

And the welding module 7 is arranged on the linear motion module and is used for welding after the chip is attached to the bad point.

Specifically, the product to be repaired can be placed on the repairing table 11 through the feeding device or manually, and the Y-axis linear module 13 moves the repairing table 11 to the position below the height measuring module to measure the glue height at the bad point. After the measurement, the X-axis linear module 12 moves the repair platform 1 to the defective point identification module to identify the defective point of the product to be repaired. After the identification is finished, the Y-axis linear module 13 moves the repairing table 11 to the position below the gumming module 3 to remove the gumming on the bad point. After the glue is removed, the Y-axis linear module 13 moves the repairing table 11 to the lower part of the positioning module 2 to confirm whether the glue is completely removed. After confirming complete cleaning, the pad cleaning module 4 moves to above the repair platform 1 along the linear motion module to remove bad chips or other foreign matters on the pad. And the tin spot filling module 5 fills tin into the cleaned spot positions on the bonding pads. Meanwhile, the chip taking module 61 clamps and identifies the chip, the chip is placed on the chip mounting module 62, the chip mounting module 62 confirms the OK/NG of the chip, the angle is adjusted, after the tin of the reworked product on the reworked platform 1 is finished, the qualified chip is mounted on the bad point position of the reworked product by the chip mounting module 62, after the mounting is finished, the reworked platform 1 moves to the lower part of the welding module 7, the bad point position after the chip mounting is subjected to laser welding, and finally the reworked platform 11 is driven by the Y-axis linear module 13 to return to the original starting point position for blanking.

In the embodiment of the invention, the linear motion module comprises a first linear motion module 101 and a second linear motion module 102, wherein the first linear motion module 101 is provided with a first fixing plate 103, and the second linear motion module 102 is provided with a second fixing plate 104. The positioning module 2 and the welding module 7 are both fixed on the first fixing plate 103 and can perform linear motion along the second linear motion module 102. The pad cleaning module 4 and the tin spot module 5 are both fixedly arranged on the second fixing plate 104, and can perform linear motion along the second linear motion module 102 so as to move to the upper part of the repairing table 11.

In the embodiment of the present invention, as shown in fig. 3 to 4, the defect point identifying module includes a Mark point positioning assembly 21 located on the repair table 11, a defect point identifying camera 22 disposed on the first fixing plate 103, and a Z-axis lifting module 23 for driving the defect point identifying camera 22 and the welding module 7 to move along the Z-axis direction, and the height measuring module includes a measuring member 24 and a measuring lifting module 25 for driving the measuring member 24 to move along the Z-axis direction. Specifically, the product to be repaired is placed on the repair table 11, and moves to the lower side of the positioning module 2 through the Y-axis linear module 13, and the measuring lifting module 25 drives the measuring piece 24 to move along the Z-axis direction, so that the measuring piece 24 is close to the product to be repaired, the glue height on the defective point of the product to be repaired is accurately measured, and the repair quality of the product to be repaired is ensured in order to avoid the warping condition of the product to be repaired caused by the reflow oven. And providing the acquired glue height information for the glue removing module 3, the bonding pad cleaning module 4, the chip taking and mounting module 6 and the tin spot module 5 so as to carry out subsequent height adjustment. After measurement, the product to be repaired is positioned through the Mark point positioning assembly 21, the Z-axis lifting module 23 drives the defective point identification camera 22 to move along the Z-axis direction, so that the defective point identification camera 22 is close to or far away from the repair table 11, the product to be repaired is shot, and the Mark point positioning assembly 21 is combined with the defective point identification camera 22 to acquire the accurate position of the defective point on the product to be repaired.

In the embodiment of the present invention, as shown in fig. 7, the glue removing module 3 includes a glue removing head 31 and a glue removing head lifting module 32 for driving the glue removing head 31 to move toward or away from the repair table 11 along the Z-axis direction, so as to accurately position and remove the glue on the defective point. The glue removing module 3 removes glue on bad points through laser glue removing, and other removing modes can be adopted according to the characteristics of products or process requirements. The glue removing module 3 combines the glue height information obtained in the previous procedure, adds the data after height measurement to the preset height, and ensures that each glue removing is within the same focal length. One side of the gumming module 3 is also provided with an air blowing component 33 for removing residues on the reworked product after gumming. Specifically, during or after the removal of the glue, the reworked product is attached with glue scraps or other residues, and the residues are blown away by the blowing component 33, so that the residues are prevented from being remained or accumulated on the reworked product to affect the subsequent reworking process and reworking quality.

In the embodiment of the invention, as shown in fig. 5, the pad cleaning module 4 includes a removing head 41 and a removing head lifting module 42 for driving the removing head 41 to lift, where the removing head 41 is used for removing bad chips on a product to be repaired, and various technological methods such as scraping, removing, and shoveling can be adopted according to actual conditions of the product. If solder paste, flux and other foreign matters remain on the bonding pad, the solder paste, flux and other foreign matters are removed at the same time from the module. The spot tin module 5 includes a spot tin head 51 and a spot tin lifting module 52 for driving the spot tin head 51 to lift. After the pad cleaning, the spot tin lifting module 52 drives the spot tin head 51 to perform tin filling on the defective spot.

In the embodiment of the present invention, as shown in fig. 8 to 10, the chip taking module 61 includes a taking component 63 disposed on the second linear motion module 102, a chip recognition camera 611 fixed on the support 100, a wafer platform discharging device 612 disposed directly under the chip recognition camera 611, and a thimble module 8 disposed under the wafer platform discharging device 612, a wafer platform rotating motor 613, a wafer platform X-axis linear module 614, and a wafer platform Y-axis linear module 615 are further disposed under the wafer platform discharging device 612, and the wafer platform X-axis linear module 614 is disposed on the wafer platform Y-axis linear module 615. wafer platform rotating electrical machines 613 are used for driving wafer platform blowing device 612 to rotate, wafer platform X axle linear module 614 is used for driving wafer platform blowing device 612 to remove along the X axis direction, and wafer platform Y axle linear module 615 is used for driving wafer platform blowing device 612 to remove along the Y axis direction. A plurality of discharging grooves 613 are arranged on the wafer platform discharging device 612 and are used for placing chips to be identified. The thimble module 8 comprises a thimble assembly 81 and a thimble lifting module 82 for driving the thimble assembly 81 to lift up or down. Specifically, the material taking component 63 is a material taking suction nozzle, the material taking component 63 sucks the chip and places the chip on the wafer platform discharging device 612, the wafer platform discharging device 612 is used for placing chips of MiniLED lamp beads of different types, the wafer platform rotating motor 613 drives the wafer platform discharging device 612 to rotate, so that different material discharging grooves 613 are located below the chip identification camera 611, the chip is identified through the chip identification camera 611, and the position and the direction of the chip are confirmed; the ejector pin assembly 81 is ejected up through the ejector pin lifting module 82, so that the chip is ejected up from the wafer platform discharging device 612, the chip is sucked by the material taking assembly 63, and the chip is sucked and placed on the chip mounting module 62.

In the embodiment of the invention, the chip mounting module 62 comprises a mounting component 64 arranged on the second linear motion module 102, a chip detection camera 621 fixedly arranged on the bracket 100, a middle rotary table 622 positioned right below the chip detection camera 621, and a chip angle correction camera 626 positioned at one side of the middle rotary table 622, wherein a middle rotary table rotating motor 623, a sliding table 624 and a middle rotary table XY adjusting component 625 are also arranged below the middle rotary table 622, the sliding table 624 is arranged below the middle rotary table rotating motor 623 and is fixedly connected with the middle rotary table rotating motor 623, and the middle rotary table XY adjusting component 625 is connected with the sliding table 624. Specifically, the mounting component 64 is a mounting nozzle, and the mounting component 64 can perform linear motion along the second linear motion module 102, and mount the chip with the well-corrected angle on a defective point. The transfer table rotating motor 623 is for driving the transfer table 622 to rotate, and the transfer table XY adjustment assembly 625 is for adjusting the direction in which the slide table 624 moves in the X-axis and the Y-axis by a small margin, thereby adjusting the moving distance of the transfer table 622 in the X-axis and the Y-axis. Firstly, the chip detecting camera 621 detects the chip placed on the transferring table 622 to determine whether the chip is qualified (OK/NG), if the chip is unqualified, the material taking component 63 clips the waste material placing frame; if the chip is qualified, the chip angle correction camera 626 identifies the chip electrode, corrects the chip angle, and provides angle correction data to the turntable rotating motor 623 and the turntable XY adjustment assembly 625 to be rotationally adjusted to a correct angle, so that the chip can be accurately attached to the defective point. The chip taking and mounting module 6 can be operated simultaneously with the pad cleaning module 4 and the tin spot module 5, so as to improve the repairing efficiency.

In the embodiment of the invention, the welding module 7 includes a welding head 71, the welding head 71 is fixed on the first fixing plate 103, and the Z-axis lifting module 23 is used for driving the welding head 71 to lift, so that the welding head 71 is close to or far from a defective point, and laser welding is performed on the defective point after the chip is mounted. After the welding is finished, the repair platform 1 moves to the position below the defective spot recognition camera 22 again to confirm whether the repair is successful. The two sides of the repairing platform 1 can be provided with a feeding table and a discharging table so that the products which are successfully repaired can be discharged through the discharging table.

In an embodiment of the present invention, there is also provided a method for repairing MiniLED finished products, as shown with reference to fig. 11, including the steps of:

S1, performing height measurement photographing on the defective points, and confirming positions of the defective points and defective types of the defective points. Specifically, before the lighting test, the data of the bad points obtained by preliminary detection and analysis of the reworked products in the upstream equipment are firstly led, and the data comprise the coordinate data of the bad points and the data of the bad types. In order to avoid unnecessary repair of qualified products caused by misjudgment or data missing and other conditions in preliminary detection in upstream equipment, each product to be repaired needs to be subjected to a lighting test, and is electrified to be lightened by MiniLED so as to observe the working state and performance of the product, and the positions and the types of the bad points are determined, wherein the bad types comprise the fact that LED lamp beads are not lightened, are dark and bright, flash, short circuit and foreign matters are attached.

S2, removing the packaging medium on the defective point. Specifically, the packaging medium comprises glue or other packaging protective materials, and in the removal process, the defective points are cleaned for the first time.

S3, removing the bad chips at the bad points, and cleaning residues on the bonding pads. Specifically, after removing the surface-encapsulated material in step S2, the defective chip on the defective site is removed in this step. The removing mode can select the modes of scraping, rejecting, shoveling, laser, heating and the like according to the characteristics or actual conditions of the product. In the step, after the bad chip is removed, the bad point positions are cleaned again, residues on the bonding pads are cleaned, and the situation that foreign matters exist on the bad point positions and the repair is unsuccessful is avoided.

S4, filling the connection medium on the cleaned bonding pad. Specifically, spot tin treatment is carried out on the blank bonding pad which is removed of bad spots and cleaned, so that solder paste is filled, and the quality of subsequent welding is ensured.

S5, mounting chips on the bad points, and welding after mounting. Specifically, the chip is clamped and identified by the chip material taking module 61, then the qualified chip is attached to the soldering pad after tin soldering by the chip attaching module 62, and then laser soldering treatment is performed by the soldering module 7.

S6, shooting and confirming the repaired bad point positions. Specifically, after the welding is completed in step S5, the repair platform 1 is moved to the position below the defective spot recognition camera 22 again to confirm whether the repair is successful. And then moving to the lower part of the glue removing module, photographing, confirming whether glue supplementing is needed, and discharging after the steps are finished. And finally detecting MiniLED after repairing, and lighting the whole LED board by electrifying to judge whether the LED is lightened or not and whether other potential problems exist, such as abnormal lighting, dark lighting, light flickering and the like. If the whole board is abnormal or bad after being lightened, marking is carried out, and the board is ready for repairing again. If the lighting can be performed normally without any abnormality, it is checked whether there is any defect in the area around the defective spot. And after the test is normal, the related data is fed back to the system for archiving so as to facilitate subsequent tracing and analysis.

The Mini LED product finished product repairing equipment and method can repair the Mini LED product manufactured into the finished product. In the film press packaging process of the Mini LED product after passing through the reflow oven, vanishing points or other adverse conditions occur in the finished product due to the influence of high temperature and high pressure. In addition, even if the inspection is normal after passing through the reflow oven, defects may occur in the subsequent film pasting or film pressing packaging protection process. For defective products after the process steps, the repairing equipment and the method provided by the invention can be used for repairing, so that the yield of the whole product line can be effectively improved.

The foregoing examples merely illustrate embodiments of the invention and are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims (10)

1. A Mini LED product finished product repair apparatus for repairing Mini LED products that have been manufactured into finished products, comprising:

the support is fixedly provided with a linear motion module;

the repairing platform is arranged at the front side of the bracket and used for placing products to be repaired, and comprises a repairing platform, an X-axis linear module and a Y-axis linear module, wherein the X-axis linear module and the Y-axis linear module are arranged below the repairing platform and used for driving the repairing platform to move along the X-axis direction and the Y-axis direction respectively;

the positioning module is arranged on the linear motion module and comprises a height measurement module for measuring the glue height on the bad point location and a bad point identification module for identifying the bad point location;

The glue removing module is positioned at one side of the repairing platform and is used for removing glue on the bad point positions;

The bonding pad cleaning module is arranged on the linear motion module and is used for removing bad chips on the bonding pad and cleaning the bonding pad after the bad chips are removed;

The tin spot module is arranged on the linear motion module and is used for supplementing tin to the cleaned point positions on the bonding pads;

the chip taking and mounting module comprises a chip taking module and a chip mounting module, wherein the chip taking module and the chip mounting module are arranged on one side of the bracket and used for taking and mounting chips respectively at bad points after tin aligning is finished;

and the welding module is arranged on the linear motion module and used for welding after the chip is attached to the bad point.

2. The Mini LED product finished product repairing device according to claim 1, wherein the linear motion module comprises a first linear motion module and a second linear motion module, a first fixing plate is arranged on the first linear motion module, a second fixing plate is arranged on the second linear motion module, the positioning module and the welding module are both fixed on the first fixing plate, and the bonding pad cleaning module and the tin spot module are both fixed on the second fixing plate.

3. The Mini LED product finished product repairing device according to claim 2, wherein the defective spot identification module comprises a Mark spot positioning assembly located on the repairing table, a defective spot identification camera arranged on the first fixing plate, and a Z-axis lifting module for driving the defective spot identification camera and the welding module to move along the Z-axis direction, and the height measurement module comprises a measuring member and a measuring lifting module for driving the measuring member to move along the Z-axis direction.

4. The Mini LED product finished product repairing device according to claim 3, wherein the glue removing module comprises a glue removing head and a glue removing head lifting module for driving the glue removing head to move along the Z-axis direction to be close to or far from a repairing table;

and one side of the glue removal module is also provided with an air blowing assembly for removing residues on the repaired product after glue removal.

5. The Mini LED product finished product repairing device according to claim 4, wherein the bonding pad cleaning module comprises a removing head and a removing head lifting module for driving the removing head to lift, and the tin-plating module comprises a tin-plating head and a tin-plating lifting module for driving the tin-plating head to lift.

6. The Mini LED product finished product repairing device according to claim 5, wherein the chip taking module comprises a taking assembly arranged on the second linear motion module, a chip identification camera fixedly arranged on the support, a wafer platform discharging device arranged right below the chip identification camera and a thimble module arranged below the wafer platform discharging device, a wafer platform rotating motor, a wafer platform X-axis linear module and a wafer platform Y-axis linear module are arranged below the wafer platform discharging device, and the wafer platform X-axis linear module is arranged on the wafer platform Y-axis linear module and is provided with a plurality of discharging grooves.

7. The Mini LED product finished product repair device of claim 6, wherein the ejector pin module comprises an ejector pin assembly and an ejector pin lifting module for driving the ejector pin assembly to lift up or down.

8. The Mini LED product finished product repairing device according to claim 7, wherein the chip mounting module comprises a mounting assembly arranged on the second linear motion module, a chip detection camera fixedly arranged on the support, a transfer table arranged right below the chip detection camera and a chip angle correction camera arranged on one side of the transfer table, a transfer table rotating motor, a sliding table and a transfer table XY adjusting assembly are arranged below the transfer table, the sliding table is arranged below the transfer table rotating motor and fixedly connected with the transfer table rotating motor, and the transfer table XY adjusting assembly is connected with the sliding table.

9. The Mini LED product finished product repair device of claim 8, wherein the welding module comprises a welding head, the welding head is fixed on the first fixing plate, and the Z-axis lifting module is used for driving the welding head to lift.

10. A MiniLED finished product rework method comprising:

s1, carrying out height measurement photographing on a defective point, and confirming the position of the defective point and the defective type of the defective point;

S2, removing the packaging medium on the bad point positions;

s3, removing bad chips at bad points, and cleaning residues on the bonding pads;

S4, filling a connecting medium on the cleaned bonding pad;

S5, mounting chips on the bad points, and welding after mounting;

S6, shooting and confirming the repaired bad point positions.