CN212936552U - BGA chip repairing device based on laser beam shaping - Google Patents
BGA chip repairing device based on laser beam shaping Download PDFInfo
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- CN212936552U CN212936552U CN202021838040.0U CN202021838040U CN212936552U CN 212936552 U CN212936552 U CN 212936552U CN 202021838040 U CN202021838040 U CN 202021838040U CN 212936552 U CN212936552 U CN 212936552U
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Abstract
The utility model discloses a device is reprocessed to BGA chip based on laser beam plastic belongs to the printed circuit board field, including light beam plastic system, paraxial image system, infrared radiation thermometer, two-dimensional workstation, autoloading frock etc, the laser beam of laser instrument output converts the collimation facula the same with the BGA chip size of waiting to reprocess through light beam plastic system, realizes the facula and waits to reprocess the alignment action of chip under the motion of two-dimensional workstation, and paraxial image system accomplishes the facula and waits to reprocess the alignment process of chip through the coordinate conversion simultaneously. The infrared thermometer realizes real-time monitoring of the surface temperature of the chip in the laser heating process. The automatic feeding system conveys the jig to a fixed position below the light beam through the conveyor belt, and the blanking is automatically completed after the repair is finished. Not only reduced the BGA chip and reprocessed the in-process to the influence of its other components and parts on every side, still shortened the time of adjusting well of reprocess in-process BGA chip, promoted the reprocess efficiency of BGA chip, reduced the application cost of BGA chip.
Description
Technical Field
The utility model belongs to printed circuit board makes the field, concretely relates to BGA chip reprocesses device based on laser beam plastic.
Background
With the continuous development of electronic technology, electronic products tend to be more miniaturized, portable and intelligent, the traditional circuit connection form is also changed greatly, the application of printed circuit boards (also called printed circuit boards, PCB for short) is more and more extensive, correspondingly, various chips arranged corresponding to the PCB are also rapidly developed, and the printed circuit boards are widely applied to various electronic products.
With the increasing integration of chips, the number of I/O leads is also increasing, and on the basis of ensuring the miniaturization of chips, the pin pitch of the chips is becoming smaller and smaller, which is particularly evident in BGA chips (Ball Grid Array, Ball Grid Array Package) and CSP chips (Chip Scale Package), and the development and development of BGA chips and CSP chips greatly promote the miniaturization and intellectualization of electronic products.
In the existing BGA chip repair field, an infrared heating based BGA repair table is generally adopted, for example, a BGA intelligent repair table disclosed in patent document CN 201520222667.6, which includes an operation table, an infrared heating device, a control device and a display device, the infrared heating device is connected to the operation table, the control device is connected to the display device through a diode circuit, in the scheme, the infrared heating device is used to heat and unsolder the BGA chip, although the BGA chip can be repaired and positioned more accurately; however, the BGA chip rework stations of the above type also have significant limitations, such as: 1. the thermal influence range of the infrared heating device is large, so that the thermal influence range is easy to influence components around the BGA chip, and the cold soldering or the desoldering of the components around the BGA chip can be caused in serious cases; 2. present heating device based on infrared ray is longer with the counterpoint time of BGA chip, and the counterpoint precision is relatively poor, the efficiency of reprocessing of BGA chip has greatly been reduced, though it has set up CCD image system to realize optics counterpoint with promotion heating device and BGA chip to adjust the precision well on the BGA reprocesses the bench, but after the PCB board change size, the optics counterpoint that needs artifical position of adjusting the PCB board many times to realize BGA chip and image system, the efficiency of reprocessing of BGA chip has greatly been reduced. Therefore, the existence of the defects greatly affects the repair accuracy and efficiency of the conventional BGA chip, which causes great adverse effects on the application and development of the BGA chip, indirectly affects the miniaturization and intelligent development of electronic products, and improves the application and maintenance cost of the BGA chip.
SUMMERY OF THE UTILITY MODEL
The utility model provides a device is reprocessed to BGA chip based on laser beam plastic utilizes the laser beam plastic system to produce with the collimation facula of device with the size to heat the BGA chip so that it breaks away from the PCB board, has not only promoted the efficiency of reprocessing of BGA chip greatly, has still avoided other electronic components of BGA chip side installation to receive adverse effect as far as possible, has greatly promoted the progress of BGA chip reprocessing technology.
In order to achieve the above object, the utility model adopts the following technical scheme:
a BGA chip repairing device based on laser beam shaping comprises a laser beam shaping system, a PCB board and a chip fixing device, wherein the laser beam shaping system is used for heating a BGA chip by using a collimated light spot which is generated by the laser beam shaping system and has the same size with the chip so as to separate the BGA chip from the PCB board;
the laser beam shaping system comprises a light beam two-dimensional adjusting mechanism, a light beam collimating mirror, an electric diaphragm and a light beam zooming system; the light beam collimating mirror is used for converting a laser beam transmitted by an optical fiber into round parallel light, the electric diaphragm is used for shaping the parallel light beam into a rectangular light beam with the same proportion as the appearance of the BGA chip, the light beam zooming system is used for converting the rectangular light beam into a light beam with the same appearance as the BGA chip, so that the light beam can completely cover the upper surface of the BGA chip to be maintained, and the light beam two-dimensional adjusting mechanism is used for enabling the center of the light beam to move in two dimensions, thereby changing the energy distribution of the rectangular light beam.
Preferably, the BGA chip package further comprises a paraxial imaging system, which is arranged on one side of the laser beam shaping system and is used for assisting the alignment of the light beam and the BGA chip.
Preferably, the BGA chip temperature monitoring device further comprises an infrared thermometer which is arranged on a shell of the laser beam shaping system and used for monitoring the surface temperature of the BGA chip in real time.
Preferably, the laser beam shaping device further comprises a system control cabinet which is arranged below the laser beam shaping system, and the bottom end of the system control cabinet is provided with universal wheels and adjusting support legs.
Preferably, the laser beam shaping system further comprises a two-dimensional workbench, the two-dimensional workbench is mounted on the table top of the system control cabinet through a support column, an X-axis sliding table and a Y-axis sliding table are arranged on the two-dimensional workbench, and the laser beam shaping system is slidably mounted on the Y-axis sliding table of the two-dimensional workbench and can move along the X-axis direction and the Y-axis direction relative to the two-dimensional workbench.
As the optimization of the scheme, the automatic feeding device further comprises an automatic feeding tool which is arranged between the two support columns and used for conveying materials to the fixed position of the working area.
Due to the structure, the beneficial effects of the utility model reside in that:
1. according to the BGA chip repair device based on laser beam shaping, the collimated light spots which are generated by the laser beam shaping system and have the same size as the devices are used for heating the BGA chip to enable the BGA chip to be separated from a PCB, so that the influence on other surrounding components in the BGA chip repair process is reduced, and the adverse effect on other normally working components on the PCB due to the repair of the BGA chip is effectively avoided;
2. the precise matching of the heating area and the surface of the BGA chip is realized through a laser beam shaping system, and meanwhile, the energy distribution of the light beam is adjusted by utilizing a light beam two-dimensional adjusting mechanism, so that the temperature distribution of the surface of the chip can be controlled more precisely, and the repair yield is obviously improved;
3. the alignment of the laser heating area and the BGA chip to be repaired is realized through the coordinate conversion of the paraxial image system and the two-dimensional workbench, the time consumed by adjusting the horizontal position of the BGA chip to align the laser beam is shortened, the repair efficiency of the BGA chip is effectively improved, the position of the BGA chip does not need to be adjusted, and a complex tool clamp is avoided;
4. through the arrangement of the automatic feeding tool and the system control cabinet, the automation of the repairing of the BGA chip can be realized, the manual operation steps are reduced, and the labor cost is reduced;
5. the structure and the principle are simple, the realization is easy, the yield of repairing the BGA chip can be effectively improved, the overhaul and maintenance cost of the BGA chip is reduced, the development and the popularization of the BGA chip are indirectly promoted, and the application cost of the BGA chip is reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below.
Fig. 1 is a schematic structural view of the present invention;
reference numerals: the system comprises a 1-automatic feeding tool, a 2-infrared thermometer, a 3-laser beam shaping system, a 301-light beam two-dimensional adjusting mechanism, a 302-light beam collimating lens, a 303-electric diaphragm, a 304-light beam zooming system, a 4-paraxial image system, a 5-two-dimensional workbench, a 501-Y axis sliding table, a 502-X axis sliding table, a 6-supporting column and a 7-system control cabinet.
Detailed Description
The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
As shown in fig. 1, the present embodiment provides a BGA chip repairing device based on laser beam shaping, which includes a laser beam shaping system 3, configured to heat a BGA chip to be detached from a PCB board by using a collimated light spot, which is generated by the laser beam shaping system 3 and has the same size as the chip;
the beam shaping system comprises a beam collimating mirror 302 for realizing laser beam collimation, an electric diaphragm 303 for changing the cross section shape of the collimated beam, a beam zooming system 304 for shaping the size of a light spot and a beam two-dimensional adjusting mechanism 301 for adjusting the energy distribution of the beam;
the variable electric diaphragm 303 adjusts an incident circular light spot into a maximum inscribed rectangular light spot in the same proportion as the chip shape according to the length-width ratio of the chip to be repaired, and the light beam zooming system 304 adjusts the rectangular light spot into a light spot in the same size as the chip according to the specific size of the chip to be repaired;
the beam two-dimensional adjusting mechanism 301 can move the center position of a light spot in the laser heating process, so that the energy distribution of the laser beam passing through the electric diaphragm 303 is changed, the temperature distribution of the surface of the chip is changed, and the temperature control of the surface of the chip is facilitated.
The laser beam shaping system further comprises a paraxial image system 4 which is arranged on one side of the laser beam shaping system 3 and used for assisting alignment of the light beam and the BGA chip, and using convenience is improved. The paraxial imaging system 4 not only facilitates the operator to select the object to be repaired, but also allows the operator to observe the "collapse" process occurring after the weld spot is melted during the repair process.
The laser power control system also comprises an infrared thermometer 2 which is arranged on the shell of the laser beam shaping system 3 and used for measuring and displaying the surface temperature of the BGA chip in real time in the maintenance process, and feeding back the temperature to the laser power control system in real time by taking the temperature as a basis, so that the phenomenon that the chip is damaged by overhigh temperature or a welding spot cannot be completely melted due to overlow temperature is avoided.
The laser beam shaping device further comprises a system control cabinet 7 which is arranged below the laser beam shaping system 3, and universal wheels and adjusting support legs are arranged at the bottom end of the system control cabinet 7.
Still include two-dimensional workstation 5, install on the mesa of system control cabinet 7 through support column 6, be equipped with X axle slip table 502 and Y axle slip table 501 on two- dimensional workstation 5, 3 slidable mounting of laser beam shaping system are on two-dimensional workstation 5's Y axle slip table 501 to can follow X axle and Y axle direction motion for two-dimensional workstation 5, realize the removal of light beam on the two-dimensional plane through the motion of two-dimensional workstation.
The automatic feeding device further comprises an automatic feeding tool 1 which is arranged between the two support columns 6 and used for conveying materials to the fixed position of the working area. The automatic feeding tool 1 is installed on the system control cabinet 7, and the feeding end and the discharging end protrude out of the system control cabinet 7, so that feeding and discharging are facilitated.
In this embodiment, the automatic feeding tool 1 includes three stations, i.e., a feeding station, a processing station, and a discharging station, and each station is equipped with a photoelectric sensor. In an initial state, a material is put in at a loading position, the first photoelectric switch is set high, the conveyor belt starts to run, and the pneumatic stop block is triggered to bounce; the materials are conveyed to a processing station, the second photoelectric switch is arranged at a high position, the motor is decelerated and stopped, the pneumatic stop block is used for limiting, and laser processing is triggered; after laser processing is finished, triggering the pneumatic stop block to move down, and starting the motor; the material is conveyed to the material discharging position, the photoelectric switch is set to be high, the motor is decelerated and stopped, and the material is taken down by an operator or flows into the next procedure.
The automatic feeding tool 1 conveys materials through a conveyor belt, when the materials are conveyed to a working area, a sensor detects that the materials reach an appointed position, the materials are clamped by a pneumatic clamping mechanism firstly, then an operator is prompted to select a corresponding repairing program according to the type of a BGA chip to be repaired, and repairing is started.
The working step principle of the structure is as follows:
s1, fixing the PCB to be repaired on a special jig, conveying the PCB to a fixed position in a working area through the automatic feeding tool 1, and feeding back information to a control system after a sensor in the working area detects that the jig reaches the position;
s2, at the moment, an operator can observe clear PCB images collected by the paraxial image system 4 in a system software interface, select a BGA chip to be maintained along a period boundary frame by using a mouse, and confirm the BGA chip;
s3, the system automatically calculates the coordinate value in the working space according to the selected BGA chip coordinate in the image system through coordinate conversion, and drives the two-dimensional workbench 5 to move, so that the optical axis of the beam shaping system is aligned with the center position of the BGA chip, and meanwhile, the electric diaphragm 303 adjusts the beam section to the same shape and size according to the geometric size information of the BGA chip;
s4, an operator selects a maintenance program corresponding to the type of the BGA chip to be maintained, the system starts laser to heat the surface of the chip, heat is conducted to the bottom through the surface of the chip, and the temperature between the chip and the bonding pad gradually reaches a melting point until a welding spot is completely melted;
s5, before the execution of the maintenance program is finished, the adsorption device moves to the surface of the chip quickly, the chip is separated from the bonding pad through adsorption, meanwhile, the laser stops heating, the automatic feeding tool 1 is started, and the PCB which finishes the chip disassembly is conveyed to the next procedure.
The BGA chip repair device based on laser beam shaping of this embodiment utilizes the collimation facula that laser beam shaping system produced and device is with the size to heat the BGA chip so that it breaks away from the PCB board, has reduced the influence of BGA chip repair in-process to other components and parts around it, has effectively avoided repairing because of the BGA chip to the adverse effect of other normal work components and parts on the PCB board.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a BGA chip reprocesses device based on laser beam plastic which characterized in that: the BGA chip heat treatment device comprises a laser beam shaping system, a heat treatment system and a control system, wherein the laser beam shaping system is used for heating the BGA chip by using a collimation facula which is generated by the laser beam shaping system and has the same size with the chip so as to separate the BGA chip from a PCB;
the laser beam shaping system comprises a light beam two-dimensional adjusting mechanism, a light beam collimating mirror, an electric diaphragm and a light beam zooming system; the light beam collimating mirror is used for converting a laser beam transmitted by an optical fiber into round parallel light, the electric diaphragm is used for shaping the parallel light beam into a rectangular light beam with the same proportion as the appearance of the BGA chip, the light beam zooming system is used for converting the rectangular light beam into a light beam with the same appearance as the BGA chip, so that the light beam can completely cover the upper surface of the BGA chip to be maintained, and the light beam two-dimensional adjusting mechanism is used for enabling the center of the light beam to move in two dimensions, thereby changing the energy distribution of the rectangular light beam.
2. The laser beam shaping-based BGA chip repair device of claim 1, wherein: and the paraxial imaging system is arranged on one side of the laser beam shaping system and is used for assisting the alignment of the light beam and the BGA chip.
3. The laser beam shaping-based BGA chip repair device of claim 1, wherein: the device also comprises an infrared thermometer which is arranged on the shell of the laser beam shaping system and used for monitoring the surface temperature of the BGA chip in real time.
4. The laser beam shaping-based BGA chip repair device of claim 1, wherein: the laser beam shaping device further comprises a system control cabinet which is arranged below the laser beam shaping system, and universal wheels and adjusting support legs are arranged at the bottom end of the system control cabinet.
5. The laser beam shaping-based BGA chip repair device of claim 4, wherein: the laser beam shaping system is arranged on the Y-axis sliding table of the two-dimensional workbench in a sliding manner and can move along the X axis and the Y axis relative to the two-dimensional workbench.
6. The laser beam shaping-based BGA chip repair device of claim 5, wherein: the automatic feeding tool is arranged between the two support columns and used for conveying materials to the fixed position of the working area.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021838040.0U CN212936552U (en) | 2020-08-28 | 2020-08-28 | BGA chip repairing device based on laser beam shaping |
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| CN202021838040.0U CN212936552U (en) | 2020-08-28 | 2020-08-28 | BGA chip repairing device based on laser beam shaping |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113664314A (en) * | 2021-08-24 | 2021-11-19 | 苏州科韵激光科技有限公司 | Miniature LED laser repair device and method |
| CN114839785A (en) * | 2022-04-25 | 2022-08-02 | 燕山大学 | Diaphragm-based electronic control light spot shaping and power adjusting device, system and method |
-
2020
- 2020-08-28 CN CN202021838040.0U patent/CN212936552U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113664314A (en) * | 2021-08-24 | 2021-11-19 | 苏州科韵激光科技有限公司 | Miniature LED laser repair device and method |
| CN114839785A (en) * | 2022-04-25 | 2022-08-02 | 燕山大学 | Diaphragm-based electronic control light spot shaping and power adjusting device, system and method |
| CN114839785B (en) * | 2022-04-25 | 2023-04-07 | 燕山大学 | Diaphragm-based electronic control light spot shaping and power adjusting device, system and method |
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