CN111526670A - BGA laser repairing system based on galvanometer - Google Patents
BGA laser repairing system based on galvanometer Download PDFInfo
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- CN111526670A CN111526670A CN202010293995.0A CN202010293995A CN111526670A CN 111526670 A CN111526670 A CN 111526670A CN 202010293995 A CN202010293995 A CN 202010293995A CN 111526670 A CN111526670 A CN 111526670A
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- bga
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a Ball Grid Array (BGA) laser repair system based on a galvanometer, which comprises a microprocessor, a working platform, a laser scanning system, a data processing module, a laser heating system, a storage module and a power supply module, wherein the microprocessor and the working platform are connected in a bidirectional mode. This BGA laser system of reprocessing based on mirror shakes, realize two-way connection through work platform and laser scanning system, laser scanning system's output and data processing module realize two-way connection, data processing module's output is connected with microprocessor's input, adopt semiconductor laser, combine coaxial temperature measurement and CCD system, and utilize the mirror that shakes to splice into required various shape route when BGA reprocesses with the facula of laser, utilize the concentrated characteristics of semiconductor laser energy distribution, heat treatment is carried out to BGA in the short time, thereby can not influence the back of the body and paste or face the device, reach reliable BGA repair efficiency and device solder joint yield.
Description
Technical Field
The invention relates to the technical field of BGA laser repair systems, in particular to a BGA laser repair system based on a galvanometer.
Background
Along with the higher integration level of the chip, the I/O lead number is increased, on the basis of ensuring the miniaturization of the chip, the pin pitch of the chip is smaller and smaller, which is particularly obvious in BGA chips and CSP chips, the coming out and development of the BGA chips, the CSP chips and other chips greatly promote the miniaturization and the intellectualization of electronic products, however, the pin pitch of the BGA chips is very small, and other electronic components are usually installed on a PCB board provided with the BGA chips at high density, so the repair difficulty of the BGA chips is higher, and the repair needs to be completed by means of a special BGA repair workstation according to a certain repair process.
The current BGA welding system adopts a hot air heating system regardless of automatic welding or manual welding, but along with the increasing miniaturization of the design on the single-path mainboard, the density of components is increased, especially in the mobile phone mainboard industry, various back-pasted and pasted BGA design scenes are adopted, the background pasting or hot melt adhesive under the pasted device is easily heated and expanded when the traditional hot air is utilized for repairing, so that the welding point of the device is poor, and the problems are difficult to solve due to the characteristics of slow heating and easy diffusion of the hot air.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a BGA laser repair system based on a galvanometer, which solves the problem that a hot air heating system adopted by the prior BGA welding technology is easy to cause the hot melt adhesive adhered to the back or attached to the lower surface of a device to be heated and expanded when the traditional hot air is used for repair, so that the welding spot of the device is poor.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a BGA laser repair system based on a galvanometer comprises a microprocessor, a working platform, a laser scanning system, a data processing module, a laser heating system, a storage module and a power module, wherein the microprocessor is in bidirectional connection with the working platform, the working platform is in bidirectional connection with the laser scanning system, the output end of the laser scanning system is in bidirectional connection with the data processing module, the output end of the data processing module is connected with the input end of the microprocessor, the output end of the microprocessor is connected with the input end of the laser heating system, the output end of the laser heating system is connected with the input end of the working platform, the microprocessor is in bidirectional connection with the storage module, the output end of the power module is respectively connected with the input ends of the working platform, the laser scanning system and the laser heating system, the working platform comprises an automatic adjusting platform and an infrared temperature measuring module, the laser scanning system comprises a computer controller, an electronic driving amplifier, a CCD image sensor and a reflector group module, the data processing module comprises a data receiving module, an analog-to-digital conversion module and a data sending module, and the laser heating system comprises a laser controller, a semiconductor laser, a laser transmission module and a laser heating module.
Preferably, the automatic adjusting platform is connected with the laser scanning system in a bidirectional mode, and the input end of the automatic adjusting platform is connected with the output end of the laser heating system.
Preferably, the automatic adjusting platform is in bidirectional connection with the infrared temperature measuring module, and the infrared temperature measuring module is in bidirectional connection with the microprocessor.
Preferably, the output end of the computer controller is connected with the input end of the electronic driving amplifier, and the output end of the electronic driving amplifier is connected with the input end of the CCD image sensor.
Preferably, the output end of the CCD image sensor is connected with the input end of the data processing module, and the CCD image sensor is respectively in bidirectional connection with the reflector module and the working platform.
Preferably, the output end of the data receiving module is connected with the input end of the analog-to-digital conversion module, the output end of the analog-to-digital conversion module is connected with the input end of the data sending module, and the output end of the data sending module is connected with the input end of the microprocessor.
Preferably, the input end of the laser controller is connected with the output end of the microprocessor, the output end of the laser controller is connected with the input end of the semiconductor laser, and the output end of the semiconductor laser is connected with the input end of the laser transmission module.
Preferably, the output end of the laser transmission module is connected with the input end of the laser heating module, and the output end of the laser heating module is connected with the input end of the working platform.
(III) advantageous effects
The invention provides a Ball Grid Array (BGA) laser repair system based on a galvanometer. Compared with the prior art, the method has the following beneficial effects:
(1) the BGA laser repair system based on the galvanometer realizes bidirectional connection with a laser scanning system through a working platform, the output end of the laser scanning system is in bidirectional connection with a data processing module, the output end of the data processing module is connected with the input end of a microprocessor, the output end of the microprocessor is connected with the input end of a laser heating system, the output end of the laser heating system is connected with the input end of the working platform, the microprocessor is in bidirectional connection with a storage module, the output end of a power supply module is respectively connected with the input ends of the working platform, the laser scanning system and the laser heating system, the working platform comprises an automatic adjusting platform and an infrared temperature measuring module, the laser scanning system comprises a computer controller, an electronic driving amplifier, a CCD image sensor and a reflecting mirror group, the data processing module comprises a data receiving module, an analog-to-digital conversion module and a data sending, the laser heating system comprises a laser controller, a semiconductor laser, a laser transmission module and a laser heating module, the semiconductor laser is adopted, coaxial temperature measurement and a CCD system are combined, a laser spot is spliced into various required shape paths when the BGA is repaired by using a vibrating mirror, the BGA is heated in a short time by using the characteristic that the energy distribution of the semiconductor laser is concentrated, so that the back of the body can not be affected or a device is adjacent, and the reliable BGA repairing efficiency and the welding spot yield of the device are achieved.
(2) The BGA laser repair system based on the galvanometer realizes bidirectional connection with a laser scanning system through an automatic adjusting platform, the input end of the automatic adjusting platform is connected with the output end of a laser heating system, the automatic adjusting platform realizes bidirectional connection with an infrared temperature measuring module, the infrared temperature measuring module realizes bidirectional connection with a microprocessor, the output end of a computer controller is connected with the input end of an electronic driving amplifier, the output end of the electronic driving amplifier is connected with the input end of a CCD image sensor, the output end of the CCD image sensor is connected with the input end of a data processing module, the CCD image sensor respectively realizes bidirectional connection with a reflector group module and a working platform, the output end of a data receiving module is connected with the input end of an analog-to-digital conversion module, and the output end of the analog-to-digital conversion module is connected with the input end of a data, the output of data sending module is connected with microprocessor's input, utilizes infrared temperature measurement module to carry out real-time supervision to the heating temperature of BGA rework in-process, avoids the high temperature to cause the hot melt adhesive below the card device to be heated the inflation, improves the quality of reprocessing, uses CCD image sensor to various welding shape routes on the BGA chip in addition, reduces the difficulty of reprocessing to the BGA chip effectively.
(3) This BGA laser system of reprocessing based on mirror shakes, input through laser controller is connected with microprocessor's output, and laser controller's output is connected with semiconductor laser's input, semiconductor laser's output is connected with laser transmission module's input, laser transmission module's output is connected with laser heating module's input, and laser heating module's output is connected with work platform's input, after utilizing CCD image sensor to the route image acquisition on the BGA chip, the semiconductor laser that utilizes semiconductor laser to produce reprocesses BGA chip surface, reprocess efficiently, it is better to reprocess the quality.
Drawings
FIG. 1 is a schematic block diagram of the BGA laser repair system of the present invention;
FIG. 2 is a schematic block diagram of the construction of the work platform of the present invention;
FIG. 3 is a schematic block diagram of the laser scanning system of the present invention;
FIG. 4 is a schematic block diagram of the structure of a data processing module according to the present invention;
fig. 5 is a schematic block diagram of the structure of the laser heating system of the present invention.
In the figure, 1-a microprocessor, 2-a working platform, 21-an automatic adjusting platform, 22-an infrared temperature measuring module, 3-a laser scanning system, 31-a computer controller, 32-an electronic driving amplifier, 33-a CCD image sensor, 34-a reflector group module, 4-a data processing module, 41-a data receiving module, 42-an analog-digital conversion module, 43-a data sending module, 5-a laser heating system, 51-a laser controller, 52-a semiconductor laser, 53-a laser transmission module, 54-a laser heating module, 6-a storage module and 7-a power supply module.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, an embodiment of the present invention provides a technical solution: a BGA laser repair system based on galvanometer comprises a microprocessor 1, a working platform 2, a laser scanning system 3, a data processing module 4, a laser heating system 5, a storage module 6 and a power supply module 7, wherein the microprocessor 1 and the working platform 2 are in bidirectional connection, the model of the microprocessor 1 is ARM1500, the working platform 2 and the laser scanning system 3 are in bidirectional connection, the output end of the laser scanning system 3 is in bidirectional connection with the data processing module 4, the output end of the data processing module 4 is connected with the input end of the microprocessor 1, the output end of the microprocessor 1 is connected with the input end of the laser heating system 5, the output end of the laser heating system 5 is connected with the input end of the working platform 2, the microprocessor 1 and the storage module 6 are in bidirectional connection, the output end of the power supply module 7 is respectively connected with the working platform 2, the laser scanning system 3, the output, The input end of the laser heating system 5 is connected, the working platform 2 comprises an automatic adjusting platform 21 and an infrared temperature measuring module 22, the infrared temperature measuring module 22 adopts an infrared temperature sensor, the model of the infrared temperature sensor adopts DOB30-L1200CA, the heat sensor utilizes radiant heat effect to enable a detecting device to receive radiant energy and then cause temperature rise, further enable the performance of one column in the sensor and the temperature to change, and detect the change of certain performance, the radiation can be detected, the automatic adjusting platform 21 is bidirectionally connected with the laser scanning system 3, the input end of the automatic adjusting platform 21 is connected with the output end of the laser heating system 5, the automatic adjusting platform 21 is bidirectionally connected with the infrared temperature measuring module 22, the infrared temperature measuring module 22 is bidirectionally connected with the microprocessor 1, the laser scanning system 3 comprises a computer controller 31, an electronic driving amplifier 32, a temperature sensor, the infrared temperature measuring module 22 adopts a temperature sensor, the temperature, A CCD image sensor 33 and a reflector group module 34, the CCD image sensor 33 is an array composed of many single photosensitive diodes, the whole is square, then the photosensitive diodes are built into an array like bricks to compose a CCD sensor which can output images with certain resolution, the output end of the computer controller 31 is connected with the input end of the electronic driving amplifier 32, the output end of the electronic driving amplifier 32 is connected with the input end of the CCD image sensor 33, the output end of the CCD image sensor 33 is connected with the input end of the data processing module 4, the CCD image sensor 33 is respectively connected with the reflector group module 34 and the working platform 2 in two directions, the data processing module 4 comprises a data receiving module 41, an analog-to-digital conversion module 42 and a data sending module 43, the output end of the data receiving module 41 is connected with the input end of the analog-to-digital conversion module 42, the output end of the analog-to-digital conversion module 42 is connected with the input end of the data sending module 43, the output end of the data sending module 43 is connected with the input end of the microprocessor 1, the laser heating system 5 comprises a laser controller 51, a semiconductor laser 52, a laser transmission module 53 and a laser heating module 54, the semiconductor laser 52 is also called a laser diode, which is a laser using semiconductor material as working substance, the specific process of generating laser of different types is special due to the difference of substance structure, the common working substance comprises gallium arsenide, cadmium sulfide, indium phosphide, zinc sulfide and the like, the excitation mode comprises three forms of electric injection, electron beam excitation and optical pumping, the semiconductor laser device can be divided into several forms of homojunction, single heterojunction, double heterojunction and the like, the homojunction laser and the single heterojunction laser are mostly pulse devices at room temperature, while the double heterojunction laser can realize continuous work at room temperature, the semiconductor diode laser is the most practical and important laser, it is small, long-lived, and can adopt the pumping of the simple way of injecting the current, its operating voltage and current are compatible with integrated circuit, therefore can integrate with it monolithically, and can also use the frequency up to GHz to carry on the current modulation directly in order to obtain the laser output of high-speed modulation, because of these advantages, the semiconductor diode laser has been used extensively in laser communication, optical storage, optical gyro, laser printing, range finding and radar, etc., the input end of the laser controller 51 is connected with output end of the microprocessor 1, and the output end of the laser controller 51 is connected with input end of the semiconductor laser 52, the output end of the semiconductor laser 52 is connected with input end of the laser transmission module 53, the output end of the laser transmission module 53 is connected with input end of the laser heating module 54, the output end of the laser heating module 54 is connected with the input end of the working platform 2, the laser galvanometer consists of an X-Y optical scanning head, an electronic driving amplifier 32 and an optical reflection lens, a signal provided by the computer controller 31 drives the optical scanning head through a driving amplification circuit so as to control the deflection of a laser beam on an X-Y plane, in a laser demonstration system, the waveform of optical scanning is vector scanning, the scanning speed of the system determines the stability of a laser pattern, and the content which is not described in detail in the specification belongs to the prior art which is known by a person skilled in the art.
When the device works, an operator places a BGA chip to be repaired in an automatic adjusting platform 21 on a working platform 2, the BGA chip is adjusted to be coaxial with a CCD image sensor 33 by the automatic adjusting platform 21, a computer controller 31 in a laser scanning system 3 is started, the CCD image sensor 33 is driven by a signal provided by the computer controller 31 through an electronic driving amplifier 32 to carry out image scanning on various paths on the BGA chip, wherein a reflector group module 34 plays an auxiliary role on the CCD image sensor 33, path images scanned by the CCD image sensor 33 are sent to a data processing module 4, a data receiving module 41 in the data processing module 4 receives image data, then the image data are converted into digital signals by an analog-to-digital conversion module 42, the digital signals are sent to a microprocessor 1 through a data sending module 43, the microprocessor 1 sends the digital signals to a laser controller 51, the semiconductor laser 52 is controlled by the laser controller 51, the semiconductor laser 52 emits semiconductor laser according to the digital signal, the semiconductor laser acts on the surface of the BGA chip through the laser transmission module 53 and the laser heating module 54, and the infrared temperature measuring module 22 detects the heating temperature of the BGA chip in real time and sends the detected data to the microprocessor 1.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a BGA laser system of reprocessing based on mirror that shakes, includes microprocessor (1), work platform (2), laser scanning system (3), data processing module (4), laser heating system (5), storage module (6) and power module (7), microprocessor (1) realizes two way connection, its characterized in that with work platform (2): work platform (2) and laser scanning system (3) realize two way connection to the output and the data processing module (4) of laser scanning system (3) realize two way connection, the output of data processing module (4) is connected with microprocessor (1)'s input, microprocessor (1)'s output and laser heating system's (5) input are connected, and laser heating system's (5) output is connected with work platform (2)'s input, microprocessor (1) and storage module (6) realize two way connection, power module (7)'s output is connected with work platform (2), laser scanning system (3), laser heating system's (5) input respectively, work platform (2) are including automatically regulated platform (21) and infrared temperature measurement module (22), laser scanning system (3) include computer control ware (31), The laser heating system comprises an electronic driving amplifier (32), a CCD image sensor (33) and a reflector group module (34), wherein the data processing module (4) comprises a data receiving module (41), an analog-to-digital conversion module (42) and a data sending module (43), and the laser heating system (5) comprises a laser controller (51), a semiconductor laser (52), a laser transmission module (53) and a laser heating module (54).
2. The galvanometer-based BGA laser rework system of claim 1, wherein: the automatic adjusting platform (21) is connected with the laser scanning system (3) in a bidirectional mode, and the input end of the automatic adjusting platform (21) is connected with the output end of the laser heating system (5).
3. The galvanometer-based BGA laser rework system of claim 1, wherein: the automatic adjusting platform (21) is in bidirectional connection with the infrared temperature measuring module (22), and the infrared temperature measuring module (22) is in bidirectional connection with the microprocessor (1).
4. The galvanometer-based BGA laser rework system of claim 1, wherein: the output end of the computer controller (31) is connected with the input end of the electronic driving amplifier (32), and the output end of the electronic driving amplifier (32) is connected with the input end of the CCD image sensor (33).
5. The galvanometer-based BGA laser rework system of claim 1, wherein: the output end of the CCD image sensor (33) is connected with the input end of the data processing module (4), and the CCD image sensor (33) is respectively in bidirectional connection with the reflector module (34) and the working platform (2).
6. The galvanometer-based BGA laser rework system of claim 1, wherein: the output end of the data receiving module (41) is connected with the input end of the analog-to-digital conversion module (42), the output end of the analog-to-digital conversion module (42) is connected with the input end of the data sending module (43), and the output end of the data sending module (43) is connected with the input end of the microprocessor (1).
7. The galvanometer-based BGA laser rework system of claim 1, wherein: the input end of the laser controller (51) is connected with the output end of the microprocessor (1), the output end of the laser controller (51) is connected with the input end of the semiconductor laser (52), and the output end of the semiconductor laser (52) is connected with the input end of the laser transmission module (53).
8. The galvanometer-based BGA laser rework system of claim 1, wherein: the output end of the laser transmission module (53) is connected with the input end of the laser heating module (54), and the output end of the laser heating module (54) is connected with the input end of the working platform (2).
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| CN202010293995.0A CN111526670A (en) | 2020-04-15 | 2020-04-15 | BGA laser repairing system based on galvanometer |
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| CN202010293995.0A CN111526670A (en) | 2020-04-15 | 2020-04-15 | BGA laser repairing system based on galvanometer |
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| JP2012519390A (en) * | 2009-03-02 | 2012-08-23 | オルボテック リミテッド | Method and system for repairing electrical circuits |
| JP2015006674A (en) * | 2013-06-24 | 2015-01-15 | 新光電気工業株式会社 | Laser processing apparatus, laser irradiation point correction method, drilling processing method, and wiring substrate manufacturing method |
| CN205266036U (en) * | 2015-12-25 | 2016-05-25 | 重庆长青球墨铸铁制造有限责任公司 | BGA chip even heating dismouting device |
| CN107359134A (en) * | 2017-07-28 | 2017-11-17 | 湖北三江航天红峰控制有限公司 | A kind of method and apparatus for realizing that bga chip reprocesses using laser |
| CN109834355A (en) * | 2019-03-21 | 2019-06-04 | 湖北三江航天红峰控制有限公司 | Bga device laser soldering solution soldering method |
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2020
- 2020-04-15 CN CN202010293995.0A patent/CN111526670A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101763054A (en) * | 2008-12-25 | 2010-06-30 | 佛山市顺德区顺达电脑厂有限公司 | Heater monitoring device |
| JP2012519390A (en) * | 2009-03-02 | 2012-08-23 | オルボテック リミテッド | Method and system for repairing electrical circuits |
| JP2015006674A (en) * | 2013-06-24 | 2015-01-15 | 新光電気工業株式会社 | Laser processing apparatus, laser irradiation point correction method, drilling processing method, and wiring substrate manufacturing method |
| CN205266036U (en) * | 2015-12-25 | 2016-05-25 | 重庆长青球墨铸铁制造有限责任公司 | BGA chip even heating dismouting device |
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Application publication date: 20200811 |