KR20130079148A - Laser soldering system - Google Patents

Abstract

PURPOSE: A laser soldering system is provided to divide laser beam by using a wedge substrate, thereby suppressing that the manufacturing cost of laser soldering system is suddenly soared. CONSTITUTION: A laser soldering system includes a wedge substrate (42), a wedge substrate driving control unit (82), and an intensity acquiring unit (50). The wedge substrate divides laser beam into a plurality of division laser beams. The wedge substrate driving control unit controls the incident amount of the laser beam for the wedge substrate by moving the wedge substrate in response to the laser beam. The intensity acquiring unit acquires the intensity of each division laser beam. The wedge substrate driving control unit moves the wedge substrate according to the intensity of each laser beam that is acquired from the intensity acquiring unit. [Reference numerals] (70) Memory unit; (72) Intensity ratio calculation unit; (74) Intensity ratio determination unit; (76) Temperature ratio calculation unit; (78) Temperature ratio determination unit; (80) Image determination unit; (82) Wedge substrate driving control unit; (84) Shutter control unit; (86) Camera unit controller; (88) Solder supply control unit

Description

Laser Soldering System {LASER SOLDERING SYSTEM}

The present invention relates to a laser soldering system which performs soldering by irradiating a laser beam oscillated from a laser oscillator to a work.

Background Art Conventionally, soldering in a flow method or a reflow method has been widely used as a method of mounting an electronic component on a printed wiring board. By the way, when mounting an electronic component (for example, an electronic component having low heat resistance, an electronic component having a relatively high terminal heat capacity, etc.) that is difficult to solder in this type of method on a printed wiring board, or assembling a mounted board, etc. In the post-process, it is necessary to perform soldering partly.

Partial soldering work in such a post process is often performed by soldering iron by human hand, and the occurrence of non-uniformity in joining quality, increase in defect rate of joining, long production time, increase in production cost, etc. It may be a problem. Therefore, in recent years, the development of the apparatus which can automatically solder at high speed is advanced.

As the automatic soldering apparatus, a robot soldering apparatus by a robot using a soldering iron and a laser soldering apparatus using a laser beam are known.

The robot soldering apparatus joins a pair of workpieces by heating each workpiece to be joined with a soldering iron while supplying the actual solder to the heated portion. In this case, in order to use the soldering iron, it is not easy to mount small electronic parts or the like. In addition, a part of the molten solder may adhere to the soldering iron, and the amount of solder required for the soldered portion may not be supplied. In addition, when lead-free solder is used due to environmental considerations, since the melting point of the lead-free solder is higher than that of the conventional solder containing lead, the soldering iron is easily oxidized, and the life of the soldering iron is short. I lose it.

On the other hand, since the laser soldering apparatus can easily adjust the light condensing degree of a laser beam, it can respond to the mounting of electronic components etc. with a small dimension.

In such a laser soldering apparatus, for example, if only one of a pair of workpieces to which a laser beam is bonded is irradiated, a large temperature difference will occur in each workpiece, and the molten solder will flow to the workpiece having a high temperature. It becomes easy to be. Moreover, when heat capacity differs in each process object, obtaining a favorable joining quality will become more difficult.

As a laser soldering apparatus corresponding to such a problem, a laser beam is split into reflected light and transmitted light by a beam splitter, the laser beam reflected by the beam splitter is irradiated to the soldered portion, and the laser beam transmitted through the beam splitter is applied. It is known to irradiate the process object with high heat capacity (for example, refer patent document 1). However, in this case, since the intensity ratio of each laser beam (each divided laser beam) divided by the beam splitter cannot be easily changed, the use is limited.

As a laser soldering apparatus which can change the intensity ratio of split laser beam, it is possible to change the intensity ratio of split laser beam using two bonded prisms (for example, refer patent document 2), or to the incident position of a laser beam. It is proposed to change the intensity ratio of the split laser light by using the splitting member configured to have different reflectance (transmittance) (see Patent Document 3, for example).

JPH07-211424 A JP 2007-289980 A JP 2011-56520 A

However, in the above-described prior art, as the dividing means for dividing the laser light, a dividing member configured to have different reflectances (transmittances) is used depending on the two prisms and the incident positions of the laser light, so that the structure of the dividing means At the same time, it becomes a commodity. Therefore, there exists a possibility that the manufacturing cost of a laser soldering apparatus may rise.

Moreover, since the said prior art is moving a splitting member (prism) so that the intensity ratio of split laser beam may become a preset intensity ratio, it cannot manage the intensity ratio of an actual split laser beam.

The present invention has been made in view of the above problems, and it is possible to suppress an increase in the manufacturing cost of a laser soldering system by dividing a laser beam using a wedge substrate, and also by managing the intensity ratio of the split laser beam. It is an object of the present invention to provide a laser soldering system capable of improving quality.

[1] A laser soldering system according to the present invention is a laser soldering system which irradiates a laser beam oscillated from a laser oscillator to a processing object and performs soldering, comprising: a wedge substrate for dividing the laser beam into a plurality of divided laser beams; And a wedge plate driving control unit for driving the wedge substrate forward and backward with respect to the laser beam to control the incident amount of the laser beam on the wedge substrate, and an intensity acquiring means for acquiring the intensity of each of the divided laser beams. The substrate drive control section drives the wedge substrate to advance and retreat on the basis of the intensity of each of the divided laser beams obtained by the intensity acquisition means.

According to the laser soldering system which concerns on this invention, since the incident amount of the laser beam in a wedge substrate is controlled, the intensity ratio of the some split laser beam divided | segmented in the said wedge substrate can be changed easily. Thereby, since it is not necessary to use the complicated division | segmentation means of the complicated commodity like the prior art, the rise of the manufacturing cost of a laser soldering system can be suppressed. Further, the wedge plate drive control unit drives the wedge substrate forward and backward based on the intensity of each split laser light acquired by the intensity acquiring means to control the incident amount of the laser light on the wedge substrate, thereby reducing the intensity ratio of the actual split laser light. It can be managed reliably. As a result, the managed split laser light can be irradiated to the object to be processed and soldered, whereby the bonding quality can be improved.

[2] In the laser soldering system, the wedge substrate driving control unit may drive the wedge substrate forward and backward so that the intensity ratio of the plurality of divided laser beams acquired by the intensity obtaining means becomes a predetermined intensity ratio.

According to such a system, since the intensity ratio of split laser light can be made into a predetermined intensity ratio, further improvement of the bonding quality can be aimed at.

[3] The laser soldering system, wherein the processing object includes a first processing object and a second processing object to be soldered, and the laser beam is applied to each of the first processing object and the second processing object. You may further include the irradiation optical system to irradiate.

According to such a system, since the divided laser beam managed to irradiate each of a 1st process object and a 2nd process object by an irradiation optical system, for example, the heat capacity of a 1st process object is more than the heat capacity of a 2nd process object. Even if large, the temperature difference of the said 1st process object and the said 2nd process object can be made extremely small. In other words, the temperature of the said 1st process object and the temperature of the said 2nd process object can be made substantially the same. As a result, it is possible to appropriately prevent unnecessary solder from flowing into regions other than the joining portions of the first and second processing objects, so that the first and second processing objects can be reliably joined.

[4] In the laser soldering system, first temperature acquiring means for acquiring a temperature of the first object to which the split laser light is irradiated, and a temperature of the second object to which the split laser light is irradiated. And a second temperature acquiring means, wherein the wedge substrate driving control part may drive the wedge substrate forward and backward based on the temperature acquired by the first temperature acquiring means and the temperature acquired by the second temperature acquiring means. .

According to such a system, since the temperature of the first object and the second object to which the split laser light is irradiated is acquired and the wedge substrate is driven forward and backward based on those temperatures, the temperature management of the first object and the second object is controlled. Can be done. Thereby, joining with favorable managed reproducibility becomes possible.

[5] The laser soldering system may further include photographing means for photographing a state of solder being soldered, wherein the wedge plate driving control unit may drive the wedge substrate forward and backward based on the information photographed by the photographing means. .

According to this system, the state of the solder being soldered is photographed by the photographing means, and the wedge substrate is driven forward and backward based on the photographed information, so that the state of the solder being soldered can be managed. Thereby, joining with favorable managed reproducibility is attained.

[6] The laser soldering system, wherein the first processing object is disposed around the second processing object, a plurality of wedge substrates are provided, and the irradiation optical system is divided into the second processing object. The plurality of divided laser beams may be irradiated to the first object to be spaced at equal intervals along the optical axis circumference of the laser beam.

According to such a system, a plurality of divided laser beams are disposed at equal intervals along the optical axis circumference of a split laser beam irradiated to the second processed object, and the first processed object is disposed around the second processed object. Since the object is irradiated, the first processed object can be heated up almost evenly. Thereby, for example, even when soldering over the entire circumference of the second object, solder can be uniformly supplied to the entire circumference of the second object. Therefore, the 1st processing object and the 2nd processing object can be reliably joined.

[7] In the laser soldering system, the plurality of wedge substrates may be spaced apart at equal intervals along the optical axis of the laser beam.

According to such a system, since the plurality of wedge substrates are arranged at equal intervals along the optical axis of the laser beam, the plurality of split laser beams are arranged so as to be spaced at equal intervals along the optical axis circumference of the divided laser beam irradiated to the second processing object. 1 The object to be processed can be easily irradiated.

[8] In the laser soldering system, the object to be processed has a plurality of parts to be joined, and the laser soldering system further includes an irradiation optical system for irradiating the respective split laser beams to each of the plurality of parts to be joined. do.

According to such a system, since each split laser beam is irradiated to each of a some to-be-joined part, a some to-be-joined part can be heated up simultaneously. Thereby, since it becomes possible to solder efficiently to several to-be-joined part, the number of processes of a soldering process can be reduced significantly.

[9] The laser soldering system may further include spot shape deforming means for making the spot shape of the laser light into an almost elliptical shape or a quadrangular shape.

According to such a system, since the spot shape of a laser beam is made into substantially elliptical shape or square shape, the spot shape with respect to the process target of the division laser beam divided | segmented by the wedge board | substrate can also be made into substantially elliptical shape or square shape. Thereby, even if the to-be-welded part of a process target is formed in rectangular shape by planar view, the said to-be-welded part can be raised appropriately, for example.

[10] In the laser soldering system, the spot-shaped deformation means may be a square core fiber having a core having a rectangular cross section.

By the way, in general, when soldering an electronic component to a printed wiring board using a laser beam having a Gaussian distribution of intensity, the peak intensity of the center portion (optical axis portion) of the laser beam is high. The amount of heat input may become excessive. Doing so may damage the printed wiring board and cause the electronic component to come off from the printed wiring board.

According to the said laser soldering system, the spot shape of a laser beam can be easily made square shape by using square core fiber. In addition, the intensity distribution of the laser beam can be made into the top hat shape intensity distribution. As a result, even when the electronic component is soldered to the resin printed wiring board using the laser beam, the printed wiring board is not damaged, so that the electronic component is peeled off from the printed wiring board. It can prevent appropriately.

As described above, since the laser beam is divided into a plurality of divided laser beams by the wedge substrate, it is possible to suppress an increase in the manufacturing cost of the laser soldering system. Further, the wedge plate driving control unit drives the wedge substrate forward and backward based on the intensity of each split laser light to control the incident amount of the laser light on the wedge substrate. As a result, the joining quality can be improved.

1 is a schematic diagram showing a laser soldering system according to a first embodiment of the present invention;
2 is a schematic diagram showing a configuration of an emission unit constituting the laser soldering system and a configuration of a control unit body;
3 is a flowchart for explaining a soldering procedure using the laser soldering system;
4A is an explanatory diagram for explaining a state in which part of the laser light LB is incident on the wedge substrate, and FIG. 4B is a state in which the incident amount of the laser light LB is increased from the state of FIG. 4A to the wedge substrate. Explanatory drawing for explaining;
5 is an explanatory diagram for explaining a state in which the split laser light LB1 is irradiated to the cable terminal and the split laser light LB2 is irradiated to the conductive member;
6 is a flowchart for explaining a first modification of the soldering procedure using the laser soldering system.
7 is a flowchart for illustrating a second modification of the soldering procedure using the laser soldering system.
8 is a flowchart for explaining a third modification of the soldering procedure using the laser soldering system;
9 is a flowchart for explaining a fourth modification of the soldering procedure using the laser soldering system.
10 is a flowchart for explaining a fifth modification of the soldering procedure using the laser soldering system;
11 is a schematic diagram showing a laser soldering system according to a second embodiment of the present invention;
12 is an explanatory diagram for explaining a processing object shown in FIG. 11;
13 is a schematic diagram showing a laser soldering system according to a third embodiment of the present invention;
14 is an explanatory diagram for explaining an arrangement relationship of three wedge substrates constituting the laser soldering system shown in FIG. 13;
15 is an explanatory diagram for explaining the object to be processed shown in FIG. 13;
16 is a schematic diagram showing a laser soldering system according to a fourth embodiment of the present invention;
17A is an explanatory diagram for explaining the object to be processed shown in FIG. 16, and FIG. 17B is a view showing a state in which the split laser light is irradiated to the object to be shown in FIG. 17A.

EMBODIMENT OF THE INVENTION Hereinafter, the laser soldering system which concerns on this invention is demonstrated, referring an appropriate embodiment, and referring an accompanying drawing.

(First Embodiment)

The laser soldering system 10A according to the first embodiment is for performing soldering by raising the temperature of the object W by using the laser beam LB. From the LD power supply 12 and the LD power supply 12, A laser oscillator 14 for oscillating the laser beam LB based on the supplied driving current, a transmission unit 16 for transmitting the laser beam LB oscillated from the laser oscillator 14, and a transmission unit 16; Supply unit 18 for irradiating the laser beam LB transmitted by the processing object W to the processing object W, the stage 20 for mounting the processing object W, and solder (a real solder) S are supplied. The solder supply part 22 and the control part 24 are included.

The object to be processed W is formed in a flat plate shape or a thin film shape on the conductive connection portion (first processing object) 300 of the electrical wiring 302 and the wiring board 304 electrically connected to the electrical wiring 302. It has a terminal (second object) 305 (see Fig. 5). In the present embodiment, the conductive connecting portion 300 of the electric wiring 302 and the terminal 305 of the wiring board 304 are joined by soldering.

The laser oscillator 14 is made of, for example, FC-LD (Fiber Coupling-Laser Diode), and is configured by integrally combining the LD unit 26 and the extraction optical fiber 28. The LD unit 26 has one or more LD arrays and supplies (injects) the LD driving current required than the LD power supply 12, so that, for example, the high output LD light of 1 W to 200 W is laser light ( Oscillation output as LB). The acquisition optical fiber 28 is, for example, an SI type optical fiber, extends to the transmission unit 16, and emits a laser beam LB from its exit end face.

The transmission unit 16 includes an incident part 30 and a transmission optical fiber 32. The incident part 30 collimates the collimating lens 34 collimating the laser beam LB emitted at a predetermined enlargement angle with respect to the extraction optical fiber 28 as parallel light, and the collimating lens 34 in parallel. The condensing lens 36 which tightens the laser beam LB of light and injects into the incident end surface of the optical fiber 32 for transmission is included.

The optical fiber 32 for transmission may have arbitrary length, and the fiber core wire which consists of SI type optical fiber passed through the protective tube which consists of SUS spiral tubes. The fiber core is composed of, for example, a core made of pure quartz glass, a clad made of, for example, fluorine-doped quartz glass covering the core coaxially, and a cladding made of polyamide, for example, covering the clad coaxially. It is. The optical fiber 32 for transmission is terminated in the emission unit 18.

As shown in FIG. 2, the emission unit 18 includes a fixing portion 38 for fixing the exit side end portion of the transmission optical fiber 32 and a laser beam emitted from the transmission optical fiber 32 at a predetermined magnification angle. The collimated lens 40 collimating the LB with parallel light and the laser beam LB parallelized by the collimated lens 40 are divided into two divided laser beams LB1 and LB2. A wedge substrate 42, an actuator (drive section) 44 for driving the wedge substrate 42, an irradiation optical system 46 for guiding the split laser light LB1, LB2 to the workpiece W; And a shutter 48 provided on the optical paths of the divided laser beams LB1 and LB2, and a laser intensity measuring unit (intensity acquisition means) 50 for measuring the intensity of each of the divided laser lights LB1 and LB2. ) And a camera unit (photographing means) 52 for photographing the state of the solder S being soldered.

The wedge substrate 42 can change the optical path of the transmitted light. That is, by transmitting a portion of the laser beam LB through the wedge substrate 42, the transmitted light (the split laser beam LB1) that transmits the laser beam LB through the wedge substrate 42, and the wedge substrate It is possible to divide the light into 42 that does not transmit (split laser light LB2).

In addition, the wedge substrate 42 has a predetermined wedge angle, and as the wedge angle becomes larger, between the optical axis of the split laser light LB1 irradiated to the processing object W and the optical axis of the split laser light LB2. Distance (the distance between the optical axes L) becomes large (see FIG. 5). In the present embodiment, the wedge substrate 42 having a wedge angle to determine the predetermined distance between the optical axes L from the dimensions, the shape, and the like of the conductive connecting portion 300 and the terminal 305 and to have the determined distance between the optical axes L. ) Is selected and used.

The actuator 44 advances the wedge substrate 42 with respect to the laser light LB. That is, the actuator 44 advances the wedge substrate 42 along the direction orthogonal to the optical axis of the laser beam LB. As a result, the incident amount of the laser beam LB onto the wedge substrate 42 can be increased or decreased.

The irradiation optical system 46 reflects each of the divided laser beams LB1 and LB2 toward the processing target object W and transmits a part of the respective divided laser beams LB1 and LB2. 54 and a condenser lens 56 for condensing the split laser lights LB1 and LB2 reflected by the mirror 54 onto the object to be processed. As a result, the split laser light LB1 can be irradiated to the conductive connecting portion 300 and the split laser light LB2 can be irradiated to the end face of the terminal 305.

In the laser soldering system 10A according to the present embodiment, in the conductive connecting portion 300 (the first soldered portion of the conductive connecting portion 300 and the conductive connecting portion 300) heated up by irradiation of the split laser light LB1. The first temperature measuring part 58 which measures the temperature of the irradiation part of the split laser beam LB1, and the terminal 305 (2nd of the terminal 305) heated up by irradiation of the split laser light LB2 And a second temperature measuring part 60 which measures the temperature of the to-be-welded part and the irradiation site of split laser beam LB2 in the terminal 305). The 1st temperature measuring part 58 and the 2nd temperature measuring part 60 are comprised as a non-contact thermometer, such as a radiation thermometer, for example.

The shutter 48 is configured to switch between an open state allowing passage of the divided laser lights LB1 and LB2 and a closed state blocking the passage of the divided laser lights LB1 and LB2. have.

The laser intensity measuring unit 50 includes a condenser lens 62 for condensing the transmitted light of the mirror 54 and a beam profiler 64 for measuring the intensity of the transmitted light condensed by the condenser lens 62. do. The detection signal of the beam profiler 64 is output to the control unit 24.

The camera unit 52 is configured to photograph an area including the first soldered portion of the conductive connecting portion 300 and the second soldered portion of the terminal 305. Information (image information, moving picture information) captured by the camera unit 52 is output to the control unit 24.

The solder supply part 22 is comprised so that the solder S can be supplied to the electrically conductive connection part 300 (terminal 305) by a predetermined sending speed.

The control part 24 is equipped with the power supply control part 66 which drive-controls the LD power supply 12, and the control part main body 68 (refer FIG. 1). As shown in FIG. 2, the control unit body 68 includes a storage unit 70, an intensity ratio calculation unit 72, an intensity ratio determination unit 74, a temperature ratio calculation unit 76, and a temperature determination unit 78. And an image determining unit 80, a wedge plate driving control unit 82, a shutter control unit 84, a solder supply control unit 88, and a camera unit control unit 86.

The storage unit 70 stores a set intensity ratio, a set temperature ratio, a set temperature range, a reference image, and the like. The set intensity ratio is a ratio of the intensity of the split laser light LB1 irradiated to the conductive connection part 300 and the intensity of the split laser light LB2 irradiated to the terminal 305, for example, the conductive connection part 300. And the material, dimensions, and shape of the terminal 305.

The set temperature ratio is a ratio of the temperature of the first soldered portion of the conductive connecting portion 300 to the temperature of the second soldered portion of the terminal 305, for example, to the soldering of the conductive connecting portion 300 and the terminal 305. It is set to a suitable temperature ratio. Specifically, the set temperature ratio is set to a ratio such that, for example, the temperature of the first soldered portion of the conductive connecting portion 300 and the temperature of the second soldered portion of the terminal 305 become the same temperature.

The set temperature range is set to an appropriate temperature range, for example, to the extent that the solder S is meltable. As the reference image, for example, an image showing the state (the shape of the solder) of the solder S during soldering when the soldering is performed under optimum soldering conditions is used.

The intensity ratio calculation unit 72 calculates the intensity ratios of the two split laser beams LB1 and LB2 irradiated to the object W based on the detection signal of the beam profiler 64. The intensity ratio determination unit 74 determines whether or not the calculated intensity ratio and the set intensity ratio coincide.

The temperature ratio calculator 76 is formed of the temperature of the first soldered portion of the conductive connecting portion 300 measured by the first temperature measuring unit 58 and the terminal of the terminal 305 measured by the second temperature measuring unit 60. The ratio of the temperatures of the two soldered portions is calculated. The temperature determination unit 78 determines whether or not the calculated temperature ratio and the set temperature ratio coincide. In addition, the temperature determination unit 78 determines whether or not the temperatures of the conductive connection unit 300 and the terminal 305 are within a set temperature range.

The image determining unit 80 determines whether or not the degree of agreement between the image photographed by the camera unit 52 and the reference image is within a predetermined range.

The wedge plate drive control unit 82 sends a control signal to the actuator 44 to drive control the wedge substrate 42. The shutter controller 84 opens and closes the shutter 48. The camera unit controller 86 controls to drive the camera unit 52. The solder supply control unit 88 drives the solder supply unit 22 to supply the solder S at a predetermined position.

The procedure for soldering the conductive connection portion 300 and the terminal 305 using the laser soldering system 10A configured as described above will be described with reference to FIGS. 3 to 5.

First, the conductive connection part 300 of the electrical wiring 302 and the terminal 305 of the wiring board 304 are positioned in the stage 20, and the shutter control part 84 keeps the shutter 48 closed.

Next, the power supply control unit 66 drives the LD power supply 12 to supply the drive current to the LD unit 26 to cause the laser beam LB to oscillate (step S1 in FIG. 3). The laser light LB oscillated from the LD unit 26 is emitted from the optical fiber 28 for acquisition and parallelized by the collimating lens 34, and then the optical fiber 32 for transmission by the condenser lens 36. It enters into and is transmitted to the emission unit 18. The laser beam LB emitted from the optical fiber 32 for transmission is parallelized by the collimating lens 40, then reflected by the mirror 54, and irradiated to the shutter 48.

Subsequently, the wedge plate drive control unit 82 sends a control signal to the actuator 44 to advance the wedge substrate 42 by a predetermined amount with respect to the laser beam LB (step S2). As a result, part of the laser beam LB enters the wedge substrate 42 (see FIG. 4A). As a result, the laser light LB is divided into the transmitted light (the split laser light LB1) of the wedge substrate 42 and the light (the split laser light LB2) that does not pass through the wedge substrate 42.

Thereafter, the intensity ratio of the split laser light LB1 and the split laser light LB2 is calculated (step S3). Specifically, each transmitted light of the mirror 54 when the divided laser beams LB1 and LB2 is irradiated to the mirror 54 is measured by the beam profiler 64, and the intensity of each measured transmitted light is measured. Based on this, the intensity ratio calculation unit 72 calculates the intensity ratio of the split laser light LB1 and the split laser light LB2.

Then, the intensity ratio determination unit 74 determines whether or not the calculated intensity ratio and the set intensity ratio match (step S4). The set intensity ratio is obtained with reference to the storage unit 70.

When the calculated intensity ratio and the set intensity ratio do not coincide (step S4: NO), the wedge plate drive control unit 82 sends a control signal to the actuator 44 to transmit the wedge substrate 42 to the laser beam LB. Drive forward and backward (step S5). As a result, for example, when the wedge substrate 42 is further advanced, the incident amount of the laser light LB to the wedge substrate 42 can be increased (see FIG. 4B), and the wedge substrate 42 ), The incident amount of the laser beam LB on the wedge substrate 42 can be reduced. Thereafter, the processing after Step S3 is performed.

When the calculated intensity ratio coincides with the set intensity ratio (step S4: YES), the shutter control unit 84 opens the shutter 48 (step S6). When the shutter 48 is opened, the split laser light LB1 is irradiated to the first soldered portion of the conductive connecting portion 300 while the split laser light LB1 is collected by the condenser lens 56, and the split laser light LB2 is focused. In the state condensed by the lens 56, the second soldered portion of the terminal 305 is irradiated (step S7).

Subsequently, the temperature ratio calculator 76 is based on the temperature of the first soldered portion measured by the first temperature measuring unit 58 and the temperature of the second soldered portion measured by the second temperature measuring unit 60. The temperature ratio of the first soldered part to the second soldered part is calculated (step S8).

Then, the temperature determining unit 78 determines whether or not the calculated temperature ratio and the set temperature ratio match (step S9). The set temperature ratio is obtained with reference to the storage unit 70.

When the calculated temperature ratio does not coincide with the set temperature ratio (step S9: NO), the wedge plate drive control unit 82 sends a control signal to the actuator 44 to send the wedge substrate 42 to the laser beam LB. Drive forward and backward (step S10). This makes it possible to change the temperature ratio of the first soldered part and the second soldered part (close to the set temperature ratio). Thereafter, the processing after step S8 is performed.

When the calculated temperature ratio and the set temperature ratio coincide (step S9: YES), the temperature determining unit 78 determines whether or not the temperature of the first soldered portion and the temperature of the second soldered portion are within a set range (step). S11). The set temperature range is acquired with reference to the storage unit 70.

If the temperature of the first soldered portion and the temperature of the second soldered portion are not within the set temperature range (step S11: NO), the processing after step S8 is performed. This is because the temperature of the first soldered portion and the second soldered portion does not reach a temperature at which the solder S can be melted.

When the temperature of the first soldered part and the temperature of the second soldered part are within a set temperature range (step S11: YES), the solder supply control unit 88 controls the solder supply unit 22 to control the first soldered part and the first soldered part. 2 Solder S is supplied to the soldered portion (step S12).

And the camera unit control part 86 controls the camera unit 52, and image | photographs the state of the solder S which is being soldered (step S13). Next, the image determining unit 80 determines whether or not the degree of agreement between the picked-up image and the reference image is within a predetermined range (step S14). On the other hand, the reference image is obtained with reference to the storage unit 70.

When the degree of agreement between the photographed image and the reference image is not within the predetermined range (step S14: NO), the wedge plate drive control unit 82 sends a control signal to the actuator 44 to drive the wedge substrate 42 forward and backward. (Step S15). This makes it possible to adjust the temperature of the first soldered portion of the conductive connecting portion 300 and the temperature of the second soldered portion of the terminal 305 during soldering, so that the state of the solder S can be changed. . Therefore, it becomes possible to make the degree of correspondence between the picked-up image and the reference image corresponding to the state of the solder S when soldering is completed within a predetermined range. After that, the process after step S13 is performed.

When the degree of coincidence between the picked-up image and the reference image is within a predetermined range (step S14: YES), the solder supply control unit 88 controls the solder supply unit 22 to stop the supply of the solder S and the power supply control unit 66 Stops the driving of the LD power supply 12 to stop the oscillation of the laser light LB from the LD unit 26 (step S16). Thereafter, soldering is finished (step S17). In this step, the soldering procedure using the laser soldering system 10A according to the present embodiment is finished.

According to this embodiment, since the incident amount of the laser beam LB on the wedge substrate 42 is controlled, the intensity of the two split laser beams LB1 and LB2 divided by the wedge substrate 42 is controlled. The rain can be easily changed. Thereby, since it is not necessary to use the division | segmentation means of the exclusive article complicated by the prior art, the rise of the manufacturing cost of 10 A of laser soldering systems can be suppressed.

In this embodiment, since the wedge substrate 42 is driven forward and backward so that the calculated intensity ratio and the set intensity ratio coincide with each other, the intensity ratio of the actual split laser light LB1 and the split laser light LB2 is controlled. Can be managed reliably. Thereby, since the electrically conductive connection part 300 and the terminal 305 can be heated up (preheated) by each managed laser beam LB1 and LB2, joining quality can be improved.

In the present embodiment, the split laser light LB1 is irradiated to the conductive connecting portion 300 by the irradiating optical system 46, and the split laser light LB2 is irradiated to the terminal 305 by the irradiating optical system 46. . Therefore, even if the heat capacity of the terminal 305 is larger than the heat capacity of the conductive connecting portion 300, for example, the temperature difference between the terminal 305 and the conductive connecting portion 300 can be made as small as possible.

In other words, the temperature of the first soldered portion of the conductive connecting portion 300 and the temperature of the second soldered portion of the terminal 305 can be made substantially the same. Thereby, since the molten solder S can be prevented from flowing much in the electrically conductive connection part 300 suitably, the said electrically conductive connection part 300 and the terminal 305 can be reliably joined.

According to the present embodiment, the first soldered part is based on the temperature of the first soldered part measured by the first temperature measuring part 58 and the temperature of the second soldered part measured by the second temperature measuring part 60. And the temperature ratio of the second soldered portion are calculated, and the wedge substrate 42 is driven back and forth so that the calculated temperature ratio becomes the set temperature ratio, so that the temperature management of the first soldered portion and the second soldered portion is ensured. I can do it. Thereby, joining with favorable managed reproducibility is attained.

In addition, since the state of the solder S being soldered is photographed by the camera unit 52, the wedge substrate 42 is driven forward and backward so that the degree of correspondence between the photographed image and the reference image is within a predetermined range. The state of the solder S in progress can be managed. Thereby, joining with favorable managed reproducibility is attained.

(First Modification)

Next, a first modification of the soldering procedure using the laser soldering system 10A according to the first embodiment will be described with reference to FIG. 6. In this modification, the detailed description is abbreviate | omitted about the step which has the process content similar to the process content of the flowchart shown in FIG. The same applies to the second to fifth modified examples described later.

In the laser soldering procedure according to this modification, the processes from step S21 to step S26 are the same as the processes from step S1 to step S6 in FIG. 3. That is, the power supply control section 66 drives the LD power supply 12 to oscillate the laser beam LB from the LD unit 26 (step S21), and the wedge plate drive control section 82 sends a control signal to the actuator 44. Is sent to advance the wedge substrate 42 (step S22). Then, the laser beam LB is divided into the divided laser beam LB1 and the divided laser beam LB2 by the wedge substrate 42, and each of the divided laser beams LB1, LB2 is a shutter 48. Is investigated.

Then, the intensity ratios of the divided laser beams LB1 and LB2 are calculated (step S23), and it is determined whether or not the calculated intensity ratio and the set intensity ratio match (step S24). The wedge substrate 42 is driven forward and backward (step S25) to perform the process after step S23.

On the other hand, when the calculated intensity ratio and the set intensity ratio coincide, the shutter controller 84 opens the shutter 48 (step S26), and the solder supply control unit 88 controls the solder supply unit 22 so that the solder S ) Is supplied (step S27). When the shutter 48 is opened, the split laser light LB1 is irradiated to the first soldered portion, and the split laser light LB2 is irradiated to the second soldered portion (step S28). Then, the solder S is supplied to the first soldered part and the second soldered part heated up by the divided laser beams LB1 and LB2, whereby soldering is performed.

Subsequently, the solder supply control unit 88 controls the solder supply unit 22 to stop the supply of the solder S, and the power supply control unit 66 stops driving the LD power supply 12 from the LD unit 26. Oscillation of the laser beam LB is stopped (step S29). After that, the soldering is finished (step S30). In this step, the laser soldering procedure according to the present modification is completed.

According to this modification, the control of laser soldering can be simplified as much as the whole number of steps is reduced compared with the procedure of FIG. Moreover, even in this case, since the wedge substrate 42 is driven forward and backward so that the calculated intensity ratio and the set intensity ratio coincide with each other, the intensity of the actual split laser light LB1 and split laser light LB2 is controlled. You can manage the rain reliably. Thereby, since the electrically conductive connection part 300 and the terminal 305 can be heated up by each managed laser beam LB1 and LB2, joining quality can be improved.

(Second modification)

Next, a second modification of the soldering procedure using the laser soldering system 10A according to the first embodiment will be described with reference to FIG. 7. In the present modification, in the initial state, the wedge substrate 42 is disposed at a position where a part of the laser beam LB can enter.

As shown in FIG. 7, in the laser soldering procedure which concerns on this modification, the power supply control part 66 drives the LD power supply 12, and oscillates the laser beam LB from the LD unit 26 (step S41). Then, the laser beam LB is divided into the divided laser beam LB1 and the divided laser beam LB2 by the wedge substrate 42, and each of the divided laser beams LB1, LB2 is applied to the shutter 48. Is investigated.

Subsequently, the shutter control unit 84 opens the shutter 48 (step S42), and the solder supply control unit 88 controls the solder supply unit 22 to supply the solder S (step S43). When the shutter 48 is opened, the split laser light LB1 is irradiated to the first soldered portion and the split laser light LB2 is irradiated to the second soldered portion (step S44). In this case, the first soldered portion is heated up by the split laser light LB1 and the second soldered portion is heated up by the split laser light LB2 to melt the solder S. FIG.

And the temperature ratio calculation part 76 is based on the temperature of the 1st soldered part measured by the 1st temperature measuring part 58, and the temperature of the 2nd soldered part measured by the 2nd temperature measuring part 60, The temperature ratio of the first soldered part to the second soldered part is calculated (step S45).

Thereafter, the temperature determination unit 78 determines whether or not the calculated temperature ratio and the set temperature ratio match (step S46). If the temperature determination unit 78 does not match, the temperature determination unit 78 causes the wedge substrate 42 to move forward and backward (step S47). The process after step S45 is performed.

On the other hand, when the calculated temperature ratio and the set temperature ratio coincide, the solder supply control unit 88 stops the supply of the solder S (step S48).

Next, the power supply control unit 66 stops the driving of the LD power supply 12 to stop the oscillation of the laser light LB from the LD unit 26 (step S49). After that, the soldering is finished (step S50). In this step, the laser soldering procedure according to the present modification is completed.

According to this modification, the control of laser soldering can be simplified as much as the whole number of steps is reduced compared with the procedure of FIG. Further, even in this case, the temperature ratio of the first soldered portion and the second soldered portion is calculated, and the wedge substrate 42 is driven back and forth so that the calculated temperature ratio becomes the set temperature ratio. Temperature management of the one soldered portion and the second soldered portion can be reliably performed. Thereby, joining with favorable managed reproducibility is attained.

By the way, when the 1st temperature measuring part 58 and the 2nd temperature measuring part 60 are comprised by non-contact thermometers, such as a radiation thermometer, for example, in step S45, the surface area temperature of a 1st soldered part. And the temperature ratio is calculated based on the surface temperature of the second soldered portion. In such a case, there may be a case where the amount of heat input to the first soldered portion and the second soldered portion is not actually sufficient.

Therefore, in this modification, in step S49, the oscillation of the laser beam LB is not stopped immediately after the supply of the solder S is stopped (the output temperature ratio and the set temperature ratio coincide). It is preferable to stop the laser beam LB by lowering the power (output) of the laser beam LB in steps. By doing in this way, sufficient heat input can be performed in a 1st soldered part and a 2nd soldered part. In other words, heat input to the first soldered part and the second soldered part is not insufficient.

Further, in step S49, the temperature threshold slightly higher than the above-described set temperature range is set in advance, and the oscillation of the laser beam LB when the temperature of the first soldered portion and the second soldered portion coincides with the temperature threshold. May be stopped. Also in this case, sufficient heat input can be performed on the first soldered portion and the second soldered portion.

The temperature threshold may be set to a value such that the amount of heat input to the first soldered portion and the second soldered portion does not become excessive.

(Third Modification)

Next, a third modification of the soldering procedure using the laser soldering system 10A according to the first embodiment will be described with reference to FIG. 8. In the present modification, in the initial state, the wedge substrate 42 is disposed at a position where a part of the laser beam LB can enter.

As shown in FIG. 8, in the laser soldering procedure according to the present modification, the processing from step S61 to step S64 is completely the same as the processing from step S41 to step S44 of the second modification, and thus description thereof is omitted.

And after step S64, the camera unit control part 86 controls the camera unit 52, and image | photographs the state of the solder S which is being soldered (step S65). Next, the image determining unit 80 determines whether or not the degree of matching between the picked-up image and the reference image is within a predetermined range (step S66). When the degree of matching is not within the predetermined range, the wedge substrate 42 Is moved forward and backward (step S67), and the process after step S65 is performed.

On the other hand, when the matching degree is within a predetermined range, the solder supply control unit 88 controls the solder supply unit 22 to stop the supply of the solder S, and the power supply control unit 66 drives the LD power supply 12. By stopping the oscillation, the laser beam LB from the LD unit 26 is stopped (step S68). After that, the soldering is finished (step S69). In this step, the soldering procedure using the laser soldering system 10A according to the present modification is completed.

According to this modification, the control of laser soldering can be simplified as much as the whole step number is reduced compared with the aspect of FIG. Further, even in this simplified case, the state of the solder S being soldered is photographed by the camera unit 52, and the state of the solder S being soldered so that the degree of correspondence between the photographed image and the reference image is within a predetermined range. Can manage. Thereby, joining with favorable managed reproducibility is attained.

(Fourth modification)

Next, a fourth modification of the soldering procedure using the laser soldering system 10A according to the first embodiment will be described with reference to FIG. 9.

As shown in FIG. 9, the laser soldering procedure which concerns on this modification is an order which combined the procedure of the 1st modification shown in FIG. 6, and the procedure of the 2nd modification shown in FIG.

Specifically, after performing the process of step S21-step S28 of FIG. 6, the process of step S45-step S50 of FIG. 7 is performed. Since the specific content of each step was demonstrated by the 1st and 2nd modification, the description is abbreviate | omitted.

According to this modification, the intensity ratio between the split laser light LB1 and the split laser light LB2 can be reliably managed, and the temperature management of the first and second solder parts can be reliably performed. It is possible to achieve satisfactory managed reproducibility while improving quality.

(The fifth modification)

Next, a fifth modification of the soldering procedure using the laser soldering system 10A according to the first embodiment will be described with reference to FIG. 10.

As shown in FIG. 10, the laser soldering procedure which concerns on this modification is a form which combined the procedure of the 1st modification shown in FIG. 6, and the procedure of the 3rd modification shown in FIG.

Specifically, after performing the processing of step S21 to step S28 of FIG. 6, the processing of step S65 to step S69 of FIG. 8 is performed. Since the specific content of each step was demonstrated by the 1st and 3rd modification, the description is abbreviate | omitted.

According to this modification, it is possible to reliably manage the intensity ratio of the split laser light LB1 and the split laser light LB2 and to manage the state of the solder S being soldered, thereby improving the joining quality. It is possible to join with good managed reproducibility.

The laser soldering system 10A which concerns on 1st Embodiment is not limited to the said structure-procedure. For example, it is good also as a structure which performs control (step S45-S47 of FIG. 9) and image control (step S65-step S67 of FIG. 10) simultaneously by calculation of a temperature ratio. In this case, the state can be managed by the match of either the temperature ratio or the image.

In addition, the power supply control unit 66 supplies the LD power supply 12 based on the intensity of the split laser light LB1 and the split laser light LB2 or the ratio of the intensity of the split laser lights LB1 and LB2. The output of the laser beam LB (each divided laser beam LB1, LB2) oscillated from the LD unit 26 may be changed by increasing or decreasing the drive current value.

By doing so, not only the intensity ratio of the split laser light LB1 and the split laser light LB2, but also the amount of energy of the laser light LB (total amount of energy of the split laser light LB1 and the split laser light LB2). It can be easily changed. This makes it possible to easily adjust the intensities of the divided laser lights LB1 and LB2 to the set intensity values. Therefore, further improvement of joining quality can be aimed at.

In this case, the power supply control unit 66 may be, for example, a temperature of the first soldered part (temperature measured by the first temperature measuring unit 58) and a temperature of the second soldered part (second temperature measuring unit 60). ) Or the output of the laser beam LB may be changed based on the temperature ratio measured by the ") or the temperature ratio of the first soldered portion and the second soldered portion, based on the photographed image of the camera unit 52. You may change the output of the laser beam LB.

(Second Embodiment)

Next, a laser soldering system 10B according to a second embodiment of the present invention will be described with reference to FIGS. 11 and 12. In the laser soldering system 10B according to the second embodiment, elements having the same or similar functions and effects as those of the laser soldering system 10A according to the first embodiment are denoted by the same reference numerals, and detailed descriptions thereof will be given. Omit. In addition, it is the same also in 3rd and 4th embodiment mentioned later.

As shown to FIG. 11 and FIG. 12, the process object W of this embodiment is carried out to the copper pattern (1st process object) 308 printed on the printed wiring board 306, and this copper pattern 308. FIG. An electronic component (second processing object) 310 to be mounted is provided. The electronic component 310 is, for example, configured as a rectangular parallelepiped chip capacitor, and includes a capacitor body 312 constituting its center portion and terminal electrodes 314 constituting each end portion. In this embodiment, the copper pattern 308 and the terminal electrode 314 are joined by soldering.

In the laser soldering system 10B which concerns on this embodiment, the spot shape of the said laser beam LB is substantially elliptical on the optical path of the laser beam LB between the collimate lens 40 and the wedge substrate 42. A collimating lens 92 for parallelizing a lens (spot-shaped deformation means) 90 and a laser beam LB transmitted through the lens 90 is provided.

According to the laser soldering system 10B comprised in this way, since the spot shape of the laser beam LB is made into substantially elliptical shape with the lens 90, also about the spot shape of each division laser beam LB1, LB2. It can be almost elliptical shape (refer FIG. 12). As a result, the terminal electrode 314 and the copper pattern 308 are appropriately heated up even when the terminal capacitor 314 is planarly soldered to the copper pattern 308 as in the case of a chip capacitor. You can.

(Third Embodiment)

Next, a laser soldering system 10C according to a third embodiment of the present invention will be described with reference to FIGS. 13 to 15.

As shown to FIG. 13 and FIG. 15, the process target object W of this embodiment is carried out to the copper pattern (1st process target object) 308 printed on the printed wiring board 306, and this copper pattern 308. FIG. An electronic component (second processing object) 316 to be mounted (through hole mounting) is provided. In the printed wiring board 306, a through hole 318 is formed, and an annular copper pattern 308 is disposed around the through hole 318.

The electronic component 316 is configured as, for example, an electrolytic capacitor, and protrudes from the circumferential capacitor body 320 and the end of the capacitor body 320 so as to penetrate the through hole 318 of the printed wiring board 306. It includes a terminal 322 inserted into the.

As shown in FIG. 13 and FIG. 14, in the laser soldering system 10C of the present embodiment, a plurality of (three) wedge substrates 100a to 100c are used instead of the wedge substrate 42 of the first embodiment. It is installed. These wedge substrates 100a to 100c are arranged to be spaced at equal intervals along the periphery of the optical axis in a state where the position in the direction along the optical axis of the laser beam LB is matched. That is, these wedge substrates 100a to 100c are out of phase with each other by 120 ° around the optical axis of the laser beam LB. The wedge substrates 100a to 100c may be offset from each other along the optical axis of the laser beam LB.

The wedge substrates 100a to 100c are provided with actuators 102a to 102c for advancing the wedge substrates 100a to 100c with respect to the laser beam LB. And the wedge board drive control part 82 sends a control signal to each actuator 102a-102c, and drives these wedge boards 100a-100c forward and backward with respect to the laser beam LB.

In the laser soldering system 10C configured as described above, the laser beam LB is transmitted light (split laser beams LB1 to LB3) of each of the wedge substrates 100a to 100c, and these wedge substrates ( The light is divided into light (divided laser light LB4) that does not transmit through 100a) to 100c. That is, the laser beam LB is divided into four divided laser beams LB1 to LB4.

The split laser light LB4 is irradiated onto the end face of the terminal 322, and the split laser lights LB1 to LB3 are spaced apart at regular intervals along the optical axis of the split laser light LB4. 308 is irradiated.

Thereby, the toric copper pattern 308 can be heated up at substantially uniform temperature. Therefore, even when soldering over the entire circumference of the terminal 322, the solder S can be uniformly supplied to the entire circumference of the terminal 322. Therefore, the terminal 322 and the copper pattern 308 can be bonded reliably.

According to the present embodiment, since the wedge substrates 100a to 100c are arranged to be spaced at equal intervals along the optical axis circumference of the laser light LB, the optical axis of the split laser light LB4 irradiated to the terminal 322 is arranged. The plurality of split laser lights LB1 to LB3 can be easily irradiated to the copper pattern 308 so as to be spaced at equal intervals along the circumference.

(Fourth Embodiment)

Next, a laser soldering system 10D according to a fourth embodiment of the present invention will be described with reference to FIGS. 16 and 17.

As shown in FIG. 16 and FIG. 17, the object to be processed W of the present embodiment includes a plurality of (for example, three) copper patterns 308a to 308c printed on the printed wiring board 306. And the electronic component 324 mounted (through hole mounting) on the copper patterns 308a to 308c. Three through holes 318a to 318c are formed in the printed wiring board 306, and the annular copper patterns 308a to 308c are formed around the through holes 318a to 318c. It is arranged.

The electronic component 324 is configured as, for example, a transistor, and protrudes from the rectangular parallelepiped transistor main body 326 and the transistor main body 326 to each through hole 318a to 318c of the printed wiring board 306. ) And three terminals 328a to 328c inserted through.

That is, the object to be processed W according to the present embodiment includes a to-be-joined portion 330a composed of the terminal 328a and a copper pattern 308a, and a portion to be joined composed of the terminal 328b and the copper pattern 308b ( 330b, and the to-be-joined part 330c comprised from the terminal 328c and the copper pattern 308c.

The laser soldering system 10D according to the present embodiment further includes a wedge substrate 110, an actuator 112 for driving the wedge substrate 110, and two solder supplies 114 and 116. .

The wedge substrate 110 is disposed between the collimated lens 40 and the wedge substrate 42 with a 180 ° phase shifted with respect to the wedge substrate 42 along the optical axis circumference of the laser beam LB. On the other hand, the wedge substrate 110 may match the position of the direction along the optical axis of the laser beam LB to the wedge substrate 42.

The wedge plate drive control unit 82 sends a control signal to the actuator 112, and drives the wedge substrate 110 forward and backward with respect to the laser beam LB.

In the laser soldering system 10D configured in this way, the laser light LB is transmitted light (split laser light LB1, LB2) of each of the wedge substrates 42 and 110, and these wedge substrates ( 42), and is divided into light that does not transmit 110 (split laser light LB3). That is, the laser beam LB is divided into three divided laser beams LB1 to LB3.

The divided laser beams LB1 to LB3 are irradiated to the portions to be joined 330a to 330c. Therefore, the three to-be-joined parts 330a-330c can be heated up efficiently (at the same time), and soldering is possible. Therefore, it becomes possible to significantly reduce the number of steps in the soldering step.

This invention is not limited to embodiment mentioned above, It is naturally possible that various structures can be employ | adopted without deviating from the summary of this invention. For example, the processing object W is not limited to the above-mentioned structure, and can be changed arbitrarily.

In addition, the cross-sectional shape of the core of the optical fiber 32 for transmission may be formed in square shape (rectangle shape or square shape). That is, the optical fiber 32 for transmission may be comprised as square core fiber (spot shape deformation means).

By doing so, it is possible to obtain a laser beam LB having a low peak intensity and a planar intensity distribution (top hat shape intensity distribution). That is, the intensity distribution of each of the divided laser lights LB1 to LB4 can be a top hat-shaped intensity distribution.

By the way, in general, when soldering an electronic component (terminal) to a resin printed wiring board using a laser beam having a intensity distribution in the form of a Gaussian distribution, since the peak intensity of the central portion (optical axis portion) of the laser beam is high, The amount of heat input at the center portion of the laser spot may be excessive. In this case, the printed wiring board may be damaged, and the electronic component may be peeled off from the printed wiring board.

However, when the rectangular core fiber as described above is used as a transmission optical fiber, the intensity distribution of each of the divided laser lights LB1 and LB2 becomes a top hat shape, so that the printed wiring board is not damaged. Since it loses, the peeling of an electronic component from the said printed wiring board can be prevented suitably.

In addition, when the core constituting the square core fibers is formed in a rectangular cross section, the cross section can also be rectangular in the laser spot shape. As a result, for example, as shown in FIG. 12, even when the copper pattern 308 and the terminal electrode 314 of the electronic component (chip capacitor) 310 are soldered, the spot of the split laser light LB1 is used. Since the shape matches the shape of the copper pattern 308 and the spot shape of the split laser light LB2 can match the shape of the terminal electrode 314, the copper pattern 308 and the terminal electrode ( 314) can be properly raised.

In this case, the ratio of the long side to the short side of the laser spot is limited to the long side: short side = 2: 1. When the ratio of the long side of the laser spot is to be made larger (to obtain a laser spot shape having an elongated shape), for example, an emission unit 18 having an elliptical optical system (lens 90) is provided. It can be easily realized by combining the square core fibers with the above.

In the laser soldering systems 10A to 10D according to the present invention, a plurality of LD units 26 may be provided, and the acquisition optical fiber 28 extending from each LD unit 26 may be configured as bundled fibers.

By doing in this way, the laser beam LB oscillated from each LD unit 26 can be combined with the said bundle fiber. Thereby, the laser beam LB of a higher output can be used for a process (soldering). Specifically, for example, by providing seven LD units 26 having a maximum output of 25 W, a high output laser light LB of 175 W can be obtained.

In addition, in the laser soldering systems 10A to 10D according to the present invention, the acquisition optical fiber 28 may be directly connected to the emission unit 18. By doing in this way, since the structure of the incident part 30 and the transmission optical fiber 32 can be abbreviate | omitted, the structure of the laser soldering systems 10A-10D can be simplified.

10A to 10D: Laser Soldering System 14: Laser Oscillator
42, 100a to 100c, 110: wedge substrate
46: irradiation optical system
50: laser intensity measuring unit (intensity acquisition means)
52: camera unit (shooting means) 58: first temperature measuring unit
60: second temperature measuring unit 82: wedge plate driving control unit
90: lens (spot shape deforming means) LB: laser light
LB1 to LB4: Split laser light W: Processed object

Claims (10)

In the laser soldering system which irradiates the laser beam oscillated from the laser oscillator to a process object, and performs soldering,
A wedge substrate for dividing the laser light into a plurality of divided laser lights;
A wedge substrate driving control unit for driving the wedge substrate forward and backward with respect to the laser beam to control an incident amount of the laser beam on the wedge substrate; And
And intensity acquisition means for acquiring the intensity of each of the divided laser beams,
And the wedge plate driving control unit drives the wedge substrate to advance and retreat based on the intensity of each of the divided laser beams obtained by the intensity acquisition means. The laser soldering system according to claim 1, wherein the wedge plate driving control unit drives the wedge substrate to advance and return so that an intensity ratio of the plurality of split laser beams acquired by the intensity obtaining means becomes a predetermined intensity ratio. The said object to be processed includes a 1st object to be processed and a 2nd object to be processed, The process object of Claim 1 or 2,
And an irradiation optical system for irradiating each of the laser beams onto the first and second processing objects. The method of claim 3,
First temperature acquiring means for acquiring a temperature of the first object to be irradiated with the split laser light;
A second temperature acquiring means for acquiring a temperature of the second object to which the split laser light is irradiated;
And the wedge plate driving control unit drives the wedge substrate to advance and retreat on the basis of the temperature acquired by the first temperature acquisition means and the temperature acquired by the second temperature acquisition means. The method according to claim 3 or 4, further comprising photographing means for photographing the state of the solder being soldered,
And the wedge plate driving control unit drives the wedge substrate to advance and retreat on the basis of the information photographed by the photographing means. The said 1st process object is arrange | positioned around the said 2nd process object, The said 1st process object,
The wedge substrate is provided in plurality,
And said irradiating optical system irradiates said first processing object with a plurality of said split laser beams so as to be spaced at equal intervals along the optical axis circumference of the split laser light irradiated to said second processing object. The laser soldering system according to claim 6, wherein the plurality of wedge substrates are arranged at equal intervals along the optical axis of the laser beam. The method of claim 1, wherein the object to be processed has a plurality of parts to be joined,
And an irradiation optical system for irradiating the divided laser beams onto each of the plurality of joined portions. The laser soldering system according to any one of claims 1 to 8, further comprising spot-shaped deformation means for making the spot shape of the laser light into an elliptical shape or a quadrangular shape. The laser soldering system according to claim 9, wherein the spot-shaped deformation means is a square core fiber having a core having a square cross section.

Images