CN102023614B - Laser welding device - Google Patents
Laser welding device Download PDFInfo
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- CN102023614B CN102023614B CN201010507637A CN201010507637A CN102023614B CN 102023614 B CN102023614 B CN 102023614B CN 201010507637 A CN201010507637 A CN 201010507637A CN 201010507637 A CN201010507637 A CN 201010507637A CN 102023614 B CN102023614 B CN 102023614B
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Abstract
The invention relates to a laser welding device which comprises a laser generating module and a control module, wherein the control module is electrically connected with the laser generating module; the device also comprises a laser guide collimating module which can be optically connected with the laser generating module, a CCD (Charge Coupled Device) image acquiring module which can capture an image of a welding point, an infrared temperature detecting module which can capture the temperature of a welding point and an optical module which is optically connected with the three modules; and a focal point of output laser formed after passing through the laser guide collimating module and the optical module, a minimal point of the welding position, which is captured by an infrared thermometer detecting module through the optical module and a viewing field central point of the welding position, which is captured by the CCD image acquiring module through the optical module coincide. The accurate control on the temperature of a welding target can be realized in the laser high-speed welding process.
Description
Technical field
The present invention relates to welder, relate in particular to and adopt the welder of laser as heating source.
Background technology
In welding, the molten application of applying, can adopt laser to handle the welding of the temperature-sensing element (device) of electron trade, particularly in this application of circuit board laser soldering, because too high temperature causes the damage of circuit board easily as the heating source of soldered.Therefore, often requirement can realize monitoring in real time to the temperature of soldering process.
Summary of the invention
The technical matters that the present invention will solve is to overcome the deficiency of above-mentioned prior art, and proposes a kind of laser soldering device that can realize real-time monitoring to the temperature of soldering process.
The present invention solves the problems of the technologies described above the technological means that is adopted and comprises; Proposition comprises a laser generating module, the control module with this laser generating module electrical connection, the laser importing collimating module that can be connected with laser generating module light, the ccd image acquisition module that can catch the pad image, can catch an infrared temperature detecting module and an optical module of pad temperature; This optical module and laser import collimating module, ccd image acquisition module and infrared temperature detecting module light and are connected and are combined into an independent structures part; This optical module comprises five eyeglasses; Wherein, First eyeglass is convex lens, plays collimating effect, is arranged on the side towards the laser generating module of this optical module; Second eyeglass is 45 ° of catoptrons, is arranged in the input path of emitting light path and this ccd image acquisition module of laser; Prismatic glasses is convex lens, plays focussing force, is arranged in the input path of emitting light path and this ccd image acquisition module of laser; The 4th eyeglass is 45 ° of catoptrons, is arranged in the input path of input path and this infrared temperature detecting module of emitting light path, this ccd image acquisition module of laser; The 5th eyeglass is a catoptron, is arranged in the input path of this infrared temperature detecting module, and this first eyeglass is coated with the anti-reflection film identical with optical maser wavelength; This second eyeglass is coated with the identical high-reflecting film of optical wavelength of identical anti-reflection film of optical maser wavelength and CCD lighting source; This prismatic glasses is coated with the identical anti-reflection film of optical maser wavelength; The 4th eyeglass is coated with the identical high-reflecting film of optical wavelength of identical anti-reflection film of optical maser wavelength and CCD lighting source; The 5th eyeglass is coated with the identical high-reflecting film of optical maser wavelength, thereby the visual field central point three of the weld that the smallest point of the weld that the focus, this infrared thermometer detecting module that import the output laser that forms behind collimating module and the optical module via this laser capture through this optical module and this ccd image acquisition module capture through this optical module overlaps.
Wherein, this ccd image acquisition module and this infrared temperature detecting module all are electrically connected with this control module, and the pad temperature that this control module can provide according to this infrared temperature detecting module is controlled the output power of this laser generating module.
This control module is according to the PID strategy output power of this laser generating module to be controlled in real time.
Described Wavelength of Laser is 980nm or 1064nm.
The optical wavelength of described CCD lighting source is 473nm.
The focal length of this first eyeglass is 100mm.
The focal length of this prismatic glasses is 120mm.
This optical module also can comprise the 6th eyeglass, and the 6th eyeglass is a thin glass sheet, is arranged on the side towards pad of this optical module, shields.
Compared with prior art, laser soldering device of the present invention can be realized the accurate control to the welding target temperature in the laser high-speed welding process.
Description of drawings
Fig. 1 is the block diagram of laser soldering device embodiment of the present invention.
Fig. 2 is the process flow diagram of PID closed loop thermal control of the present invention.
Fig. 3 is the combination assumption diagram that the laser in the laser soldering device of the present invention imports collimating module, ccd image acquisition module, infrared temperature detecting module and optical module.
Fig. 4 be in the laser soldering device of the present invention with the corresponding optical schematic diagram of Fig. 3.
Embodiment
In order to further specify principle of the present invention and structure, combine accompanying drawing to a preferred embodiment of the present invention will be described in detail at present.
As shown in Figure 1; Laser soldering device 1 of the present invention comprises: a laser generating module 11 and a control module 12 that is electrically connected with this laser generating module 11; One laser that can be connected with laser generating module 11 light imports collimating module 13; Can catch a ccd image acquisition module 14 of the pad image of article 2 to be welded, can catch article 2 to be welded the pad temperature infrared temperature detecting module 15 and import the optical module 16 that collimating module 13, ccd image acquisition module 14 and 15 3 module light of infrared temperature detecting module are connected with laser.
As shown in Figure 2, the flow process of PID closed loop thermal control of the present invention comprises:
Step 101: the temperature curve of setting the process of article 2 to be welded;
Step 102: regulate laser output power through pid algorithm;
Step 103: is voltage signal through temperature probe with the temperature transition at article to be welded 2 places;
Step 104: through temperature sampling voltage signal is converted into temperature signal and feeds back to control module, regulate laser output power to realize pid algorithm.
Through this flow process, infrared temperature detecting module 15 is gathered the temperature of article 2 to be welded in real time, with the design temperature curve ratio, can make the actual temperature change curve of article 2 to be welded and design temperature curve reach perfect match.
Through above closed loop flow process, when the temperature of article 2 to be welded is lower than design temperature, improve output power of laser, further improve the temperature of article 2 to be welded; But when the temperature of heater block is higher than design temperature, then reduce output power of laser, make article 2 to be welded be cooled to design temperature, thereby realize treating welding articles 2 real-time temperature detection and control.
As shown in Figure 3, the laser in the laser soldering device 1 of the present invention imports collimating module 13, ccd image acquisition module 14, infrared temperature detecting module 15 and optical module 16 4 can be combined into an independent structures part.
Fig. 4 be in the laser soldering device of the present invention with the corresponding optical schematic diagram of Fig. 3.
This optical module 16 is formed the laser that it can connect 1064nm or 980nm by six eyeglasses, is that example is introduced its plated film system with the semiconductor laser generating module 11 that connects 980nm below:
The first eyeglass M1 is the convex lens of focal distance f=100mm, plays collimating effect, the anti-reflection film of plating 980nm;
The second eyeglass M2 is 45 ° of catoptrons, the anti-reflection film of plating 980nm, and the high-reflecting film of 473nm;
Prismatic glasses M3 is the convex lens of focal distance f=120mm, plays focussing force, the anti-reflection film of plating 980nm;
The 4th eyeglass M4 is 45 ° of catoptrons, the high-reflecting film of plating 980nm and 473nm;
The 5th eyeglass M5 is the high-reflecting film of plating 980nm;
The 6th eyeglass M6 is a thin glass sheet, its protective effect.
Film system design through above can realize following three functions.
(1) filters out the laser of 1064nm or 980nm, make infrared temperature detecting module 15 survey the infrared radiation of article 2 to be welded uninterruptedly.
(2) second eyeglass, two 45 degree of the 4th eyeglass mirror are plated the film that is all-trans of the optical wavelength of CCD lighting source, making such as wavelength is the illumination luminous energy entering CCD of 473nm, illuminates the visual field.
(3) to the anti-reflection film of second eyeglass, two 45 degree of the 4th eyeglass mirror plating 1064nm or 980nm, reduce the loss of laser propagation process, make full use of laser energy.
The process that adopts laser soldering device of the present invention to weld roughly comprises:
Referring to shown in Figure 3, laser will import collimating module 13 via laser by the side and import, be positioned at the left side, soldered joint top be CCD imaging acquisition module 14, the right be infrared measurement of temperature module 15.
The principle of work of this laser soldering device is that at first, through laser output, focus finds a job.Then, through regulating the height and the reclining angle of infrared measurement of temperature module 14,14 two infrared indications of infrared measurement of temperature module are overlapped on the focus of laser.At this moment, infrared measurement of temperature module 14 is measured is the temperature of laser spot operation material to temperature.At last, regulate CCD imaging acquisition module 14, the central point of the crosshair of CCD imaging acquisition module 14 is overlapped with the focus of laser.Through above three steps, just can realize laser, infrared measurement of temperature module 15, CCD imaging acquisition module 14 three road optics are coaxial, realize accurate monitoring and control.
Compared with prior art; Laser soldering device of the present invention, four technology heights of coaxial detection and closed-loop temperature feedback power control are integrated through laser beam shaping focusing, contactless coaxial temperature survey, CCD are formed images, and gather the temperature signal of pad in real time; Through the PID regulation technology; Laser power is realized control in real time, thereby can realize the laser high-speed welding process, to the accurate control of welding target temperature and help robotization control.
The above is merely preferred embodiment of the present invention, not in order to restriction the present invention.All any modifications of within spirit of the present invention and principle, being done, be equal to replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. laser soldering device; A control module, the laser importing collimating module that can be connected, the ccd image acquisition module that can catch the pad image that comprises a laser generating module, is electrically connected with this laser generating module, an infrared temperature detecting module and the optical module that can catch the pad temperature with laser generating module light; It is characterized in that; This optical module and laser import collimating module, ccd image acquisition module and infrared temperature detecting module light and are connected and are combined into an independent structures part; This optical module comprises five eyeglasses, and wherein, first eyeglass is convex lens; Play collimating effect, be arranged on the side towards the laser generating module of this optical module; Second eyeglass is 45 ° of catoptrons, is arranged in the input path of emitting light path and this ccd image acquisition module of laser; Prismatic glasses is convex lens, plays focussing force, is arranged in the input path of emitting light path and this ccd image acquisition module of laser; The 4th eyeglass is 45 ° of catoptrons, is arranged in the input path of input path and this infrared temperature detecting module of emitting light path, this ccd image acquisition module of laser; The 5th eyeglass is a catoptron, is arranged in the input path of this infrared temperature detecting module, and this first eyeglass is coated with the anti-reflection film identical with optical maser wavelength; This second eyeglass is coated with anti-reflection film identical with optical maser wavelength and the high-reflecting film identical with the optical wavelength of CCD lighting source; This prismatic glasses is coated with the anti-reflection film identical with optical maser wavelength; The 4th eyeglass is coated with the identical high-reflecting film of optical wavelength of anti-reflection film identical with optical maser wavelength and CCD lighting source; The 5th eyeglass is coated with the high-reflecting film identical with optical maser wavelength, thereby the visual field central point three of the weld that the smallest point of the weld that the focus, this infrared temperature detecting module that import the output laser that forms behind collimating module and the optical module via this laser capture through this optical module and this ccd image acquisition module capture through this optical module overlaps; This ccd image acquisition module and this infrared temperature detecting module all are electrically connected with this control module, and the pad temperature that this control module can provide according to this infrared temperature detecting module is controlled the output power of this laser generating module.
2. according to the described laser soldering device of claim 1, it is characterized in that this control module is according to the PID strategy output power of this laser generating module to be controlled in real time.
3. according to the described laser soldering device of claim 1, it is characterized in that described Wavelength of Laser is 980nm or 1064nm.
4. according to the described laser soldering device of claim 1, it is characterized in that the optical wavelength of described CCD lighting source is 473nm.
5. according to the described laser soldering device of claim 1, it is characterized in that the focal length of this first eyeglass is 100mm.
6. according to the described laser soldering device of claim 1, it is characterized in that the focal length of this prismatic glasses is 120mm.
7. according to the described laser soldering device of claim 1, it is characterized in that this optical module also comprises the 6th eyeglass, the 6th eyeglass is a thin glass sheet, is arranged on the side towards pad of this optical module, shields.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010507637A CN102023614B (en) | 2010-10-08 | 2010-10-08 | Laser welding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010507637A CN102023614B (en) | 2010-10-08 | 2010-10-08 | Laser welding device |
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| CN102023614A CN102023614A (en) | 2011-04-20 |
| CN102023614B true CN102023614B (en) | 2012-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201010507637A Expired - Fee Related CN102023614B (en) | 2010-10-08 | 2010-10-08 | Laser welding device |
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Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102825385B (en) * | 2012-09-18 | 2015-04-29 | 张俊敏 | Non-contact temperature monitoring device for laser welding |
| CN102967374B (en) * | 2012-11-16 | 2015-08-26 | 中国航空工业集团公司北京航空制造工程研究所 | A kind of measuring method of laser beam welding temperature field |
| CN103182605A (en) * | 2013-03-21 | 2013-07-03 | 常州镭赛科技有限公司 | Laser welding machine |
| CN103553312A (en) * | 2013-10-18 | 2014-02-05 | 昆山思拓机器有限公司 | Temperature control device and method for laser welding OLED (organic light-emitting diode) glass |
| CN104002044B (en) * | 2014-06-03 | 2015-10-28 | 湖南大学 | A kind of non-penetration laser welding equipment carries out the method for welding |
| CN106454048B (en) * | 2016-07-29 | 2019-12-24 | 大族激光科技产业集团股份有限公司 | Pseudo-coaxial CCD shooting system and laser processing device adopting same |
| CN106424998A (en) * | 2016-08-31 | 2017-02-22 | 深圳市艾尔摩迪精密科技有限公司 | Automatic laser soldering system based on welding spot recognition |
| CN108127206B (en) * | 2017-12-21 | 2020-07-07 | 武汉比天科技有限责任公司 | Laser brazing process transplanting method and laser brazing device capable of transplanting data |
| CN108213629A (en) * | 2018-01-22 | 2018-06-29 | 深圳市迈威测控技术有限公司 | Intelligent Laser tin soldering equipment |
| CN108284274A (en) * | 2018-04-26 | 2018-07-17 | 深圳市大鹏激光科技有限公司 | A kind of welding temperature closed-loop control type laser tin soldering machine |
| CN108908403A (en) * | 2018-07-25 | 2018-11-30 | 武汉瑞博奥科技有限公司 | The unmanned intelligent optic electron system of precision based on infrared vision and intelligent optimization algorithm |
| CN110018668A (en) * | 2019-04-11 | 2019-07-16 | 湖北三江航天红峰控制有限公司 | A kind of laser power follow-up control method |
| CN111822849B (en) * | 2019-04-22 | 2022-07-19 | 大族激光科技产业集团股份有限公司 | Laser processing system and processing method |
| CN110842367A (en) * | 2019-10-09 | 2020-02-28 | 大族激光科技产业集团股份有限公司 | Device and method for repairing micro LED by laser |
| CN112658423A (en) * | 2019-10-15 | 2021-04-16 | 大族激光科技产业集团股份有限公司 | Multipoint synchronous soldering method and multipoint synchronous soldering device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2260402A (en) * | 1991-08-24 | 1993-04-14 | Univ Liverpool | Monitoring laser material processing |
| CN101239418B (en) * | 2008-02-19 | 2011-07-06 | 江苏大学 | Flying plate driving type laser micro-welding method and device |
| JP5294916B2 (en) * | 2009-02-17 | 2013-09-18 | パナソニック株式会社 | Laser soldering equipment |
| CN101774090A (en) * | 2009-12-25 | 2010-07-14 | 武汉凌云光电科技有限责任公司 | High-power semiconductor laser constant-temperature welding device |
| CN101774089A (en) * | 2009-12-25 | 2010-07-14 | 武汉凌云光电科技有限责任公司 | Laser focusing system realizing coaxial temperature measuring and imaging |
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- 2010-10-08 CN CN201010507637A patent/CN102023614B/en not_active Expired - Fee Related
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| CN102023614A (en) | 2011-04-20 |
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Owner name: HAN'S LASER TECHNOLOGY INDUSTRY GROUP CO., LTD. Free format text: FORMER NAME: DAZU LASER SCI. + TECH. CO., LTD., SHENZHEN |
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Address after: No. 9988 Nanshan District Shennan Road Shenzhen city Guangdong province 518000 Patentee after: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. Address before: 518020 No. 9 West West Road, Nanshan District hi tech park, Shenzhen, Guangdong Patentee before: HAN'S LASER TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20220726 Address after: 518000 101, building 6, Wanyan Industrial Zone, Qiaotou community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Han's Semiconductor Equipment Technology Co.,Ltd. Address before: 518000 No. 9988 Shennan Road, Nanshan District, Shenzhen, Guangdong Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |
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