CN101774090A - High-power semiconductor laser constant-temperature welding device - Google Patents
High-power semiconductor laser constant-temperature welding device Download PDFInfo
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- CN101774090A CN101774090A CN 200910273394 CN200910273394A CN101774090A CN 101774090 A CN101774090 A CN 101774090A CN 200910273394 CN200910273394 CN 200910273394 CN 200910273394 A CN200910273394 A CN 200910273394A CN 101774090 A CN101774090 A CN 101774090A
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Abstract
The invention relates to a high-power semiconductor laser constant-temperature welding device which comprises a laser power supply, a programmable logic controller, a laser module, an optical fiber, a laser focus head, an infrared high-temperature detector, a charge coupling apparatus, a display and a bottom plate. The welding device is characterized in that the programmable logic controller is connected with the laser power supply, the high-temperature detector and a touch screen respectively; the optical fiber is connected with the laser module and the laser focus head; the charge coupling apparatus is connected with the display; a part of apparatus are fixed on the bottom plate; and the high-temperature detector, the charge coupling apparatus and the laser focus head are assembled. The device has the advantages of compact structure, accurate temperature, convenient installation, good control performance, easy industrial batch production and the like, and can be widely applied to the fields of laser material processing, laser printed circuit board welding and the like.
Description
Technical field
The present invention relates to a kind of thermostatically-controlled equipment, particularly a kind of high-power semiconductor laser constant-temperature welding device belongs to the Materialbearbeitung mit Laserlicht technology and is applied to welding technology field.
Background technology
Laser weld is one of importance of Materialbearbeitung mit Laserlicht technology application.Be mainly used in the welding of welding thin-walled material and low speed the seventies in 20 century, welding process belongs to heat-conduction-type, it is laser emission heated parts surface, the surface heat conducts to diffusion inside by heat, parameters such as width, energy, peak power and repetition rate by the control laser pulse, make the workpiece fusing, form specific molten bath.Because its unique advantage, be successfully applied in the precision welding of little, miniature parts.Laser is applied to workpiece and is welded with following characteristics: Optical Fiber Transmission laser, and the non-contact type welding, laser life is long, and is low in energy consumption, and the heat-affected zone is little, and is air-cooled.
It is that Laser Power Devices (1) are driven semiconductor laser module (2) that general conventional method is put in the high power laser welding tipping, and optical fiber (3) carries out optical coupled by connector (SM905) and laser module.The other end of optical fiber connects focus head (4), and the condenser lens of focus head (4) converges to laser on the soldered workpiece (5).Change laser power, laser pulse shape, soldered some actual temperature adjusting of laser pulse width realization by regulating Laser Power Devices.
The said method structure is single, open loop control simple, but can not the working control weld point temperature during actual welding occurs phenomenons such as failure welding, solder joint burn easily.And adjusting laser power, impulse waveform, pulse width all depend on operator's experience and experiment causes parameter to regulate complexity, inefficiency thus.
Summary of the invention
The objective of the invention is in order to solve the defective that prior art exists, cover the shortage, provide a kind of and control the solder joint actual temperature, can satisfy the actual requirement of laser weld, compact conformation, simple to operate, debug high-power semiconductor laser constant-temperature welding device easily.
To achieve these goals, the technical scheme of high-power semiconductor laser constant-temperature welding device involved in the present invention is achieved in that it forms (11), infrared high temperature detector (12), charge-coupled image sensor (English name: Charge Coupl ed Device by Laser Driven power supply (6), programmable logic controller (PLC) (7), semiconductor laser module (8), optical fiber (9), laser focusing head (10), touch-screen.Be called for short: CCD) (13), display (14) are formed (as shown in Figure 2).Wherein infrared high temperature detector (12), charge-coupled image sensor (13) and laser focusing head (10) all make up and integrate, and divide coaxial and non-coaxial two kinds of patterns, (as shown in Figure 3 and Figure 4).Have PID in the programmable logic controller (PLC) (7) and regulate (PID control), proportional integral is regulated (PI control), proportion differential is regulated the temperature control program of (PD control) function, programmable logic controller (PLC) (7) compares temperature and the measurement temperature of setting automatically, calculate, the output corresponding control signal is controlled Laser Driven power supply (6) in real time, thus control semiconductor laser module (8) output laser power.It is characterized in that: an end of programmable logic controller (PLC) (7) is connected to the control end of power supply (6), and a termination is received the signal that infrared high temperature detector (12) detects, and an end and touch-screen (11) carry out communication.One end of optical fiber (9) is connected to semiconductor laser module (8), and the other end links to each other with laser focusing head (10).The output of Laser Driven power supply (6) is connected to semiconductor laser module (8), and charge-coupled image sensor (13) links to each other with display (14).As shown in Figure 2, the part in above-mentioned is fixed on the base plate (15).Charge-coupled image sensor (13) is gathered the image of solder joint, and utilizes display (14) to show.Survey weld point temperature by infrared high temperature detector (12), programmable logic controller (PLC) (7) receives behind the temperature signal that infrared high temperature detector (12) sends through internal temperature control (PID, PI, PD control) programme-control Laser Driven power supply (6), make semiconductor laser module (8) emission laser, by the control laser output power, (decide) to improve or reduce weld point temperature within a certain period of time according to different materials, the temperature that makes weld point temperature be tending towards setting, be controlled in the error range (± 3 ℃), thus the temperature constant of assurance solder joint; Because of the material difference of welding, (PID, PI, the PD control) program of can controlling by internal temperature realizes that each time interval is stabilized to different temperature.
The alleged Laser Driven power supply (6) of the present invention is a kind of special direct current, constant current, pressure limiting power supply, enough satisfies semiconductor laser needs, compact conformation, pollution-free, well behaved semiconductor laser drive electric power unit.It has that volume is little, power is big, program control pressure regulation, can in parallel, the complete characteristics of defencive function.Select the Laser Driven power supply of different capacity can adapt to the needs of different bonding powers according to real output.
The alleged programmable logic controller (PLC) (7) of the present invention is a member in the computer family, for Industry Control Application manufactures and designs.Early stage Programmable Logic Controller is called programmable logic controller (PLC) (English name: Programmable Logic Controller, be called for short: PLC) programmable logic controller (PLC) (7) is a kind of electronic system of digital operation operation, aims in industrial environment to use and design.It adopts a class programmable memory, is used for its internally stored program, the actuating logic computing, and sequential control, regularly, counting and user oriented instruction such as arithmetical operation, and control various types of machineries or production process by numeral or analog I/O.Programmable logic controller (PLC) (7) and relevant external equipment thereof all are easy to be unified into an integral body with industrial control system, are easy to expand its function.Make its function with temperature control (PID, PI, PD control) by writing corresponding program, this program compares temperature and the measurement temperature of setting, calculate, output corresponding control signals Laser Driven power supply (6) automatically.Programmable logic controller (PLC) (7) receives behind the temperature signal that infrared high temperature detector (12) sends through internal temperature control (PID, PI, PD control) programme-control Laser Driven power supply (6), makes semiconductor laser module (8) emission laser.
The alleged infrared high temperature detector (12) of the present invention is a kind of temperature measuring equipment.It is focused on the infrared ray that receives from measured object on the wave detector through wave filter by lens.The integration of wave detector by the measured object radiation density produces one and the proportional curtage signal of temperature, in the electric component that after this is connected, and this temperature signal linearisation, the correction in emissivity zone, and convert the output signal of a standard to.
The alleged semiconductor laser module (8) of the present invention is a kind of solid-state laser light source.It has the characteristics that volume is little, the life-span is long, cost is low, efficient is high and is widely used in fields such as industry, medical treatment, scientific research.
The alleged optical fiber (9) of the present invention is fibre-optic abbreviation, be a kind of utilize light in the fiber that glass or plastics are made total reflection principle and the light conduction instrument reached.One end of optical fiber connects semiconductor laser module (8), and the other end connects laser focusing head (10).
The alleged laser focusing head (10) of the present invention is a kind of optical lens system and infrared high temperature detector (12), charge-coupled image sensor (English name: Charge Coupled Device.Be called for short: CCD) (13) are formed together, and its pattern has two kinds.The one: coaxial pattern, promptly charge-coupled image sensor (13) is gathered on light path, infrared high temperature detector (12) detecting temperature signal and the same axis of laser of solder joint image.The 2nd: non-coaxial pattern, promptly charge-coupled image sensor (13) is gathered light path, infrared light detecting temperature signal and the laser of solder joint image not on same axis.Its effect has 3 points: 1. the divergencing laser with optical fiber output focuses on pad.2. the infrared signal that solder joint is sent passes to infrared high temperature detector (12) and measures.3. charge-coupled image sensor (13) is gathered the image of solder joint, and shows by display (14).
The alleged touch-screen (11) of the present invention is a kind of people and the mutual interface equipment of machine.Its effect is that the information with necessity is presented at the work order of simultaneously people being sent on the touch-screen and passes to system.Touch-screen is connected with programmable logic controller (PLC) by cable.
The high-power semiconductor laser constant-temperature welding device that the present invention is alleged, have novel, compact conformation, temperature control is accurate, volume is small and exquisite, easy for installation, control performance good, be easy to advantages such as industrialized mass production; It can be widely used in occasions such as Materialbearbeitung mit Laserlicht and the welding of laser printing circuit board.
Description of drawings
Fig. 1: conventional laser welder schematic diagram;
Fig. 2: high-power semiconductor laser constant-temperature welding device figure;
Fig. 3: the coaxial pattern diagram that laser focusing head, infrared high temperature detector, charge-coupled image sensor combination integrate;
Fig. 4: the non-coaxial pattern diagram that laser focusing head, infrared high temperature detector, charge-coupled image sensor combination integrate.
The specific embodiment
The concrete enforcement example of the high-power semiconductor laser constant-temperature welding device that the present invention is alleged is described below in conjunction with Fig. 2 to Fig. 4:
One end control Laser Driven power supply, 6, one terminations of the programmable logic controller (PLC) 7 of this device are received the signal that infrared high temperature detector 12 detects, and an end and touch-screen 11 carry out communication.One end of optical fiber 9 is connected to semiconductor laser module 8, and the other end is connected on laser focusing head 10.The output of Laser Driven power supply 6 is connected to semiconductor laser module 8, and charge-coupled image sensor 13 links to each other with display 14.As shown in Figure 2, wherein Laser Driven power supply 6, programmable logic controller (PLC) 7, semiconductor laser module 8 and touch-screen 11 are fixed on the base plate 15.Wherein infrared high temperature detector 12, charge-coupled image sensor (English name: Charge Coupled Device.Be called for short: CCD) 13 and laser focusing head 10 all make up and integrate, divide coaxial pattern (as Fig. 3) and non-coaxial pattern (as Fig. 4).This device adopts coaxial pattern (as Fig. 3), needs about laser power 20W during for printed circuit board (PCB) 16 welding.Therefore select 30W semiconductor laser module 8 and supporting Laser Driven power supply 6 for use.Programmable logic controller (PLC) 7 is selected for use Mitsubishi's FX-2N series to add analog module to form, and infrared high temperature detector 12 is selected CT09.M type infrared pyrometer for use and by being loaded on after the technological transformation in the laser focusing head 10.Optical fiber 9 is selected 400uM core diameter, the long homemade optical fiber of 3M for use.
Programmable logic controller (PLC) 7 corresponding control programs of packing into is set welding temperature on touch-screen 11, get final product after regulating the height of laser focusing head 10 and solder joint.Survey weld point temperature by infrared high temperature detector 12, behind the temperature signal that the infrared high temperature detector 12 of programmable logic controller (PLC) 7 receptions sends, through internal temperature control (PID, PI, PD control) programme-control Laser Driven power supply 6, make semiconductor laser module 8 emission laser, by the control laser output power, improve or reduce weld point temperature, the temperature that makes weld point temperature be tending towards setting within a certain period of time, be stabilized in the error range (＜± 3 ℃), thus the temperature constant of assurance solder joint; Because of material (as printed circuit board (PCB), the plastics etc.) difference of welding, (PID, PI, the PD control) program of can controlling by internal temperature realizes that each time interval is stabilized to different temperature.
Claims (2)
1. high-power semiconductor laser constant-temperature welding device, it is formed (11), infrared high temperature detector (12), charge-coupled image sensor (13), display (14) and base plate (15) by Laser Driven power supply (6), programmable logic controller (PLC) (7), semiconductor laser module (8), optical fiber (9), laser focusing head (10), touch-screen and forms, it is characterized in that: the end control Laser Driven power supply (6) of programmable logic controller (PLC) (7), one termination is received the signal that infrared high temperature detector (12) detects, and an end and touch-screen (11) carry out communication; One end of optical fiber (9) is connected to semiconductor laser module (8), and the other end is connected on laser focusing head (10); The output of Laser Driven power supply (6) is connected to semiconductor laser module (8), charge-coupled image sensor (13) links to each other with display (14), wherein a part of components and parts are fixed on the base plate (15), wherein infrared high temperature detector (12), charge-coupled image sensor (13), laser focusing head (10) all make up and integrate; There is one to have the ratio adjusting in the programmable logic controller (PLC) (7), integration is regulated, the temperature control program of differential regulatory function, programmable logic controller (PLC) (7) compares temperature and the measurement temperature of setting, calculate automatically, the output corresponding control signal is controlled Laser Driven power supply (6), control semiconductor laser module (8) laser output power in real time; Charge-coupled image sensor (13) is gathered the image of solder joint, and utilize display (14) to show, survey weld point temperature by infrared high temperature detector (12), after programmable logic controller (PLC) (7) receives the temperature signal that infrared high temperature detector (12) sends, through internal temperature control program control Laser Driven power supply (6), make semiconductor laser module (8) emission laser, by the control laser output power, improve or reduce weld point temperature within a certain period of time, the temperature that makes weld point temperature be tending towards setting, thereby the temperature constant of assurance solder joint.
2. high-power semiconductor laser constant-temperature welding device according to claim 1, it is characterized in that, infrared high temperature detector (12), laser focusing head (10), charge-coupled image sensor (13) combination integrates, divide coaxial and non-coaxial two kinds of patterns, promptly three's light path on the same axis with three's light path not on same axis.
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| CN 200910273394 CN101774090A (en) | 2009-12-25 | 2009-12-25 | High-power semiconductor laser constant-temperature welding device |
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| CN 200910273394 CN101774090A (en) | 2009-12-25 | 2009-12-25 | High-power semiconductor laser constant-temperature welding device |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102023614A (en) * | 2010-10-08 | 2011-04-20 | 深圳市大族激光科技股份有限公司 | Laser welding device |
| CN102122143A (en) * | 2010-09-15 | 2011-07-13 | 苏州凌创电子系统有限公司 | Laser welding control system for cardiac pulse aid |
| CN102151975A (en) * | 2011-05-10 | 2011-08-17 | 上海工具厂有限公司 | High-frequency induction welding machine control system for PCD (Polycrystalline Diamond) cutter and control method thereof |
| CN103182605A (en) * | 2013-03-21 | 2013-07-03 | 常州镭赛科技有限公司 | Laser welding machine |
| CN104625309A (en) * | 2013-11-12 | 2015-05-20 | 珠海格力电器股份有限公司 | Flame welding constant temperature control system, control method and heat exchanger welding equipment |
| CN105414757A (en) * | 2015-12-09 | 2016-03-23 | 蒙阴金华机械有限公司 | Equipment and machining method for welding metal plates onto inner surface and outer surface of workpiece |
| CN107026385A (en) * | 2015-11-20 | 2017-08-08 | 恩耐公司 | Programmable waveform simulator |
| CN108284274A (en) * | 2018-04-26 | 2018-07-17 | 深圳市大鹏激光科技有限公司 | A kind of welding temperature closed-loop control type laser tin soldering machine |
| CN110018668A (en) * | 2019-04-11 | 2019-07-16 | 湖北三江航天红峰控制有限公司 | A kind of laser power follow-up control method |
| CN110736545A (en) * | 2018-07-20 | 2020-01-31 | 大族激光科技产业集团股份有限公司 | laser head temperature monitoring device and method |
| CN111443748A (en) * | 2020-03-10 | 2020-07-24 | 江苏理工学院 | Stability control system of molten pool state in material increase repair process |
| CN113523552A (en) * | 2021-08-03 | 2021-10-22 | 电子科技大学 | Laser welding equipment suitable for long-line welding and laser energy control method |
| CN113664369A (en) * | 2021-07-22 | 2021-11-19 | 深圳泰德激光科技有限公司 | Laser welding system, method, controller, and computer-readable storage medium |
| TWI764199B (en) * | 2020-07-13 | 2022-05-11 | 台達電子工業股份有限公司 | Laser soldering device and laser soldering method |
| CN114918537A (en) * | 2022-05-20 | 2022-08-19 | 泰德激光惠州有限公司 | Welding method of vapor chamber and middle frame, laser processing equipment and heat dissipation structure |
| US11465234B2 (en) | 2020-07-13 | 2022-10-11 | Delta Electronics, Inc. | Laser soldering device and laser soldering method |
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2009
- 2009-12-25 CN CN 200910273394 patent/CN101774090A/en active Pending
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102122143A (en) * | 2010-09-15 | 2011-07-13 | 苏州凌创电子系统有限公司 | Laser welding control system for cardiac pulse aid |
| CN102023614A (en) * | 2010-10-08 | 2011-04-20 | 深圳市大族激光科技股份有限公司 | Laser welding device |
| CN102151975A (en) * | 2011-05-10 | 2011-08-17 | 上海工具厂有限公司 | High-frequency induction welding machine control system for PCD (Polycrystalline Diamond) cutter and control method thereof |
| CN103182605A (en) * | 2013-03-21 | 2013-07-03 | 常州镭赛科技有限公司 | Laser welding machine |
| CN104625309A (en) * | 2013-11-12 | 2015-05-20 | 珠海格力电器股份有限公司 | Flame welding constant temperature control system, control method and heat exchanger welding equipment |
| CN107026385B (en) * | 2015-11-20 | 2021-02-26 | 恩耐公司 | Programmable waveform simulator |
| CN107026385A (en) * | 2015-11-20 | 2017-08-08 | 恩耐公司 | Programmable waveform simulator |
| US10838603B2 (en) | 2015-11-20 | 2020-11-17 | Nlight, Inc. | Programmable waveform simulator |
| CN105414757A (en) * | 2015-12-09 | 2016-03-23 | 蒙阴金华机械有限公司 | Equipment and machining method for welding metal plates onto inner surface and outer surface of workpiece |
| CN108284274A (en) * | 2018-04-26 | 2018-07-17 | 深圳市大鹏激光科技有限公司 | A kind of welding temperature closed-loop control type laser tin soldering machine |
| CN110736545A (en) * | 2018-07-20 | 2020-01-31 | 大族激光科技产业集团股份有限公司 | laser head temperature monitoring device and method |
| CN110018668A (en) * | 2019-04-11 | 2019-07-16 | 湖北三江航天红峰控制有限公司 | A kind of laser power follow-up control method |
| CN111443748A (en) * | 2020-03-10 | 2020-07-24 | 江苏理工学院 | Stability control system of molten pool state in material increase repair process |
| TWI764199B (en) * | 2020-07-13 | 2022-05-11 | 台達電子工業股份有限公司 | Laser soldering device and laser soldering method |
| US11465234B2 (en) | 2020-07-13 | 2022-10-11 | Delta Electronics, Inc. | Laser soldering device and laser soldering method |
| CN113664369A (en) * | 2021-07-22 | 2021-11-19 | 深圳泰德激光科技有限公司 | Laser welding system, method, controller, and computer-readable storage medium |
| CN113523552A (en) * | 2021-08-03 | 2021-10-22 | 电子科技大学 | Laser welding equipment suitable for long-line welding and laser energy control method |
| CN114918537A (en) * | 2022-05-20 | 2022-08-19 | 泰德激光惠州有限公司 | Welding method of vapor chamber and middle frame, laser processing equipment and heat dissipation structure |
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Application publication date: 20100714 |