CN108941894A - A kind of laser processing device and method - Google Patents
A kind of laser processing device and method Download PDFInfo
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- CN108941894A CN108941894A CN201810801547.XA CN201810801547A CN108941894A CN 108941894 A CN108941894 A CN 108941894A CN 201810801547 A CN201810801547 A CN 201810801547A CN 108941894 A CN108941894 A CN 108941894A
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- machine table
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- control system
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides laser processing devices, including machine table, control system, laser transmitting system for emitting laser beams, the vision system for the automatic loading and unloading system of loading and unloading and for obtaining Work position information, the information control laser transmitting system that control system is fed back according to vision system works；Additionally provide laser processing: automatic loading and unloading system feeding to machine table；Vision system identifies the position of workpiece to be added and feeds back to control system；Location information of the control system according to the workpiece to be added received, control laser transmitting system transmitting laser processing workpiece to be added；Automatic loading and unloading system blanking.Control system controls automatic loading and unloading system loading and unloading, control system is transmitted to after the location information that vision system obtains workpiece, after control system receives information, control laser transmitting system issues laser beam and is processed, entire processing unit (plant), which is all controlled by control system, to be completed, entire processing method is simple and efficient, therefore improves the degree of automation.
Description
Technical field
The invention belongs to technical field of laser processing, are to be related to a kind of laser processing device and method more specifically.
Background technique
The good attribute of material is indispensable for many products, such as glass is used to make the aobvious of smart phone
Display screen, display screen have the shell of tempering；Ceramics are hard, and chemical property is stablized, and can be used to make electronic component and circuit base
Plate and electrical insulators；Sapphire is extremely hard, damage resistant, is suitable for semiconductor and LED technology.Just because of this, glass
Glass, sapphire and ceramics are widely used in the fields such as consumer electronics product, mobile intelligent terminal and wearable product.It is above-mentioned
The common ground of material is processing difficulties, since they are frangible and are all adamantine materials, thus challenge milling, brill and mill etc.
The limit of conventional fabrication processes, when traditional handicraft processes these materials, not only tool wear is fast, also needs multiple processing link ability
Obtain processing quality good enough.
And laser processing is contactless with workpiece, there is no the abrasions of tool.In addition, hot spot is small after laser focuses, energy is close
Degree is high, and cutting speed is fast, and machining accuracy is high, processes part of different shapes, and no replacement is required " cutter ", need to only change laser
Output parameter can realize the cutting etc. of numerous complicated part, be widely used to the cutting processing of above-mentioned material.
However, the mainstream laser pulsewidth of industrial application mostly in microsecond, nanosecond, make by the laser of this pulsewidth magnitude at present
The problems such as when for material, that there are heat affected areas is larger, the easy chipping of workpiece, crackle.In addition, nanosecond laser to sapphire glass,
The transparent materials processing efficiency such as strengthened glass is relatively low, and machining accuracy and quality are not able to satisfy product requirement.
However, when conventional laser carry out material processing when because pulsewidth is short enough, when on the material for be thermally conducted to periphery it
Before, the material of area to be machined has vaporized, and does not have time enough to generate temperature between the electronics and lattice in material at this time
Balance, can be realized " cold " processing of material truly, processing effect and precision can all be substantially improved, it can be achieved that glass,
The high quality of sapphire and ceramics, high-precision laser processing.And it is effectively that infrared picosecond laser, which processes such material, but mesh
The problems such as preceding infrared generally existing the degree of automation of picosecond laser process equipment is low, operation difficulty is larger, so that picosecond laser exists
Scale is subject to certain restrictions in industrial production.
Summary of the invention
One of the objects of the present invention is to provide a kind of laser processing devices, to solve automation existing in the prior art
The low technical problem of degree.
To achieve the above object, the technical solution adopted by the present invention is that: provide a kind of laser processing device, including processing
Platform, control system and laser transmitting system, automatic loading and unloading system and the vision system communicated to connect respectively with the control system
It unites, for emitting laser beams to the machine table, the automatic loading and unloading system is used to add to be described the laser transmitting system
Work platform loading and unloading, the vision system are used to obtain the location information for the workpiece being placed in the machine table, the control system
The laser transmitting system work is controlled according to the location information of vision system feedback.
It further, further include focusing system, the focusing system is used for the laser for emitting the laser transmitting system
Beam focuses on the Working position of the machine table, and the focusing system and the control system communicate to connect.
Further, the focusing system includes galvanometer, galvanometer setting the laser transmitting system and it is described plus
Between work platform.
Further, the focusing system further includes field lens, field lens setting the galvanometer and the machine table it
Between.
It further, further include outside optical system, what the outside optical system was used to emit the laser transmitting system
Laser beam is oriented to the machine table.
Further, the outside optical system includes beam expanding lens and reflecting mirror, and the beam expanding lens setting is sent out in the laser
It penetrates between system and the galvanometer, the reflecting mirror is arranged between the beam expanding lens and the galvanometer.
It further, further include cooling system, the cooling system is for cooling down the laser transmitting system.
It further, further include for driving the machine table to move upwards in vertical direction, front-rear direction and right and left
The first driving mechanism, first driving mechanism and the control system communicate to connect.
Further, the automatic loading and unloading system further includes sensing device, and the sensing device is for monitoring the work
The size of the power of the position and crawl workpiece of part.
The beneficial effect of laser processing device provided by the invention is: compared with prior art, control system can control
Automatic loading and unloading system automatic charging and blanking, then vision system obtains the location information of workpiece, and is transferred to control system,
After control system receives the information of vision system, control laser transmitting system issues laser beam, to be processed in machine table
Part is processed, and whole process is all controlled by control system and completed, and is reduced manually-operated link, is improved automation
Degree.
The second object of the present invention is to provide a kind of laser processing, to solve automation existing in the prior art
The low technical problem of degree.
To achieve the above object, the technical solution adopted by the present invention is that: a kind of laser processing is provided, including is walked as follows
It is rapid:
Automatic loading and unloading system is by workpiece feeding to be added to machine table；
Vision system identifies the position of the workpiece to be added and feeds back to control system；
The control system is called in laser processing parameter library according to the location information of the workpiece to be added received
The machined parameters of associated workpiece simultaneously control the laser transmitting system transmitting laser processing workpiece to be added；
The automatic loading and unloading system blanking.
The beneficial effect of laser processing provided by the invention is: first by workpiece feeding to be added to machine table, obtaining
It after the location information of workpiece to be added, then is focused to machined part, the data in laser processing parameter library is called when processing, are added
Direct blanking, whole process are simple and efficient after the completion of work, are controlled each procedure of processing by control system, are improved automation
Degree.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only of the invention some
Embodiment for those of ordinary skill in the art without any creative labor, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 is the structural schematic diagram of laser processing device provided in an embodiment of the present invention；
Fig. 2 is the flow chart of laser processing provided in an embodiment of the present invention.
Wherein, each appended drawing reference in figure:
10, laser transmitting system；11, laser beam；20, outside optical system；21, beam expanding lens；22, reflecting mirror；30, system is focused
System；31, galvanometer；32, field lens；40, vision system；50, machine table；60, automatic loading and unloading system；61, material box；62, blanking
Box.
Specific embodiment
In order to which technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Accompanying drawings and embodiments are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or indirectly on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", "upper", "lower", "front", "rear", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "top", "bottom" "inner", "outside" is that orientation based on the figure or position are closed
System, is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must have
Specific orientation is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
Referring to Fig. 1, existing be illustrated laser processing device provided by the invention.Laser processing device, including processing
Platform 50, control system and laser transmitting system 10, automatic loading and unloading system 60 and the vision communicated to connect respectively with control system
System 40, for emitting laser beams 11 to machine table 50, automatic loading and unloading system 60 is used to be machine table laser transmitting system 10
50 loading and unloading, vision system 40 are used to obtain the location information for the workpiece being placed in machine table 50, and control system is according to vision system
The location information control laser transmitting system 10 of 40 feedback of system works.
Laser processing device provided by the invention, compared with prior art, control system can control automatic loading and unloading system
60 automatic chargings and blanking, then vision system 40 obtains the location information of workpiece, and is transferred to control system, and control system connects
After the information for receiving vision system 40, control laser transmitting system 10 issues laser beam 11, to the workpiece to be added in machine table 50
It is processed, whole process is all controlled by control system and completed, and is reduced manually-operated link, is improved automation journey
Degree.
Specifically, laser transmitting system 10 includes infrared picosecond laser, and infrared picosecond laser has picosecond ultrashort
Pulsewidth, repetition rate can reconcile pulse energy it is high the features such as, therefore when carrying out material processing, in the material for being thermally conducted to periphery
Before upper, the material of area to be machined has been vaporized, and does not have time enough generation between the electronics and lattice in material at this time
Equalized temperature, can be realized " cold " processing truly to material, processing effect and precision can all be substantially improved, it can be achieved that
Glass, the high quality of sapphire and ceramics, high-precision laser processing.
Preferably, infrared picosecond laser can select 30 watts of infrared picosecond lasers of 1064nm, which has super
The unique and practical functions such as high single pulse energy, foreign frequency are automatically controlled and pulse energy controls.
Preferably, vision system 40 can select CCD vision system, which has sealing and dustproof, small in size, just
In installation, low in energy consumption and high reliability, the position of workpiece can be positioned and be focused, structure is simple, it can be achieved that high
Precision grabs target.
Specifically, control system can be the equipment that industrial personal computer, tablet computer etc. are able to achieve human-computer interaction, and control system can
To call the data in laser processing parameter library.
Specifically, automatic loading and unloading system 60 has three lines to be connected to control system, including two signal wires, and one is used for
Processing commencing signal is input to control system, another single line receives machine and completes the process signal, is linked into control system, controls
The signal wire of system need to meet GND, and control system can specifically pass through universal integrated circuit by PLC programming Control, PLC control module
To realize.
Further, referring to Fig. 1, a kind of specific embodiment as laser processing device provided by the invention, also
Including focusing system 30, focusing system 30 is used to focus on the laser beam 11 that laser transmitting system 10 emits adding for machine table 50
Station is set, and focusing system 30 and control system communicate to connect.Focusing system 30 can be adjusted the focus of laser beam 11, allow
Laser beam 11 focuses on workpiece to be added, is processed to machined part, and machining accuracy is improved.
Further, referring to Fig. 1, a kind of specific embodiment as laser processing device provided by the invention, gathers
Burnt system 30 includes galvanometer 31, and galvanometer 31 is arranged between laser transmitting system 10 and machine table 50.Galvanometer 31 can flexible positioning
Laser beam 11 is finely adjusted the deflection of laser beam 11, meets the process requirements of various shape profile.
Specifically, galvanometer 31 includes X-Y optical scanning head, electric drive amplifier and optical reflecting lens.Control system
The signal of sending is by drive amplification circuit drives optical scanning head, to control the deflection of laser beam 11 in the x, y direction.
Further, referring to Fig. 1, a kind of specific embodiment as laser processing device provided by the invention, gathers
Burnt system 30 further includes field lens 32, and field lens 32 is arranged between galvanometer 31 and machine table 50.Image quality can be improved in field lens 32,
The astigmatism of effective corrective lens and distortion, reduce the influence of senior aberration, improve machining accuracy.
Specifically, field lens 32 can select f- θ telecentric lens, can effectively improve machining accuracy, meet processing request.
Further, referring to Fig. 1, a kind of specific reality as full-automatic infrared laser processing device provided by the invention
Mode is applied, further includes outside optical system 20, outside optical system 20 is for the laser beam 11 that laser transmitting system 10 emits to be oriented to
Machine table 50.Laser beam 11 can be oriented to machine table 50 by outside optical system 20, to the laser beam emitted from laser transmitting system 10
The preliminary processing of the works such as 11 diameter, the angle of divergence allows laser beam 11 that can safely and smoothly reach machine table 50, rises to laser beam 11
Guiding function.
Further, referring to Fig. 1, a kind of specific embodiment as laser processing device provided by the invention, outside
Light path system 20 includes beam expanding lens 21 and reflecting mirror 22, and beam expanding lens 21 is arranged between laser transmitting system 10 and galvanometer 31, instead
Mirror 22 is penetrated to be arranged between beam expanding lens 21 and galvanometer 31.Beam expanding lens 21 can change the diameter and the angle of divergence of laser beam 11；Reflecting mirror
22 energy reflection laser beams 11, change the path of laser beam 11, so that the installation site of laser transmitting system 10 is more flexible；By
The diameter of laser beam 11 needs to be exaggerated corresponding multiple according to processing after beam expanding lens 21, and reflecting mirror 22 will pass through beam expanding lens 21
Laser beam 11 is guided to machine table 50 afterwards.
Specifically, a beam expanding lens 21 can be selected, beam expanding lens 21 is that can be changed to expand 1-8 times, can be according to actual processing need
It asks, selection expands multiple accordingly.
Specifically, reflecting mirror 22 can select four, and laser transmitting system 10 can be transversely and horizontally set at this time, transmitting
To the first face reflecting mirror, oblique 45 ° of the first face reflecting mirror are arranged 11 horizontal irradiation of laser beam, so that it may reflex to laser beam 11
Vertical position, angle of reflection is 45 °, at this point, being needed due to the positional relationship of machine table 50 and vertical position laser beam 11 by laser
Beam 11 is guided to another vertical position, therefore same principle of reflection can be used by the guidance of laser beam 11 to corresponding vertical position
It sets, is processed.Can according to actual needs, select the reflecting mirror 22 and corresponding angle of reflection of respective numbers, simply, conveniently,
It is practical.
It further, further include cooling system as a kind of specific embodiment of laser processing device provided by the invention
System, cooling system is for cooling down laser transmitting system 10.Cooling system can cool down laser transmitting system 10, increase laser
The service life of emission system 10.
Specifically, the preferred water cooling plant of cooling system cools down laser, and the good cooling results of water cooling, cooling efficiency
It is high.
It further, further include for driving as a kind of specific embodiment of laser processing device provided by the invention
The first driving mechanism that dynamic machine table 50 is moved upwards in vertical direction, front-rear direction and right and left, the first driving mechanism and control
System communication connection processed.First driving mechanism driving machine table 50 is moved upwards in vertical direction, front-rear direction and right and left, energy
Adjust the position of the workpiece to be added in machine table 50, convenient focusing and processing to machined part.
Specifically, automatic loading and unloading system 60 further includes the second driving mechanism, third driving mechanism and rotating arm, and second drives
Motivation structure can drive rotating arm to move up and down, and third driving mechanism can drive rotating arm pivoted arm.Second driving mechanism and third are driven
Motivation structure can drive the workpiece of the different location of rotating arm crawl automatic loading and unloading system 60 to carry out loading and unloading, above and below artificial
Material, improves the degree of automation.
Specifically, the first driving mechanism, the second driving mechanism and third driving mechanism can select motor or gas
Cylinder.
Specifically, vacuum chuck can also be set on rotating arm, vacuum chuck can using under vacuum environment with ambient atmosphere
The pull of vacuum that the pressure difference of pressure generates carrys out grabbing workpiece, and rotating arm causes to damage to workpiece during being avoided that grabbing workpiece
Wound.
Specifically, automatic loading and unloading system 60 further includes sensing device, and sensing device is used for the position of monitoring workpiece and grabs
The size of the power of workpiece is taken, and control system can be transmitted this information to, control system can do corresponding processing, guarantee processing
The smooth and accurate progress of process improves processing efficiency, machining accuracy and processing quality.
Specifically, monitoring device can adjust sensor for fibre optical sensor or/and electron pressure, and fibre optical sensor can supervise
It surveys in material box 61 and whether needs workpiece, if corresponding data are transferred to control system by fibre optical sensor without workpiece to be added
System, control system will control alarm equipment alarm, if material box 61 needs workpiece, the normal work of automatic loading and unloading system 60
Make, workpiece to be added is grabbed into machine table 50；Electron pressure, which adjusts sensor, can monitor the absorption work of the vacuum chuck on rotating arm
The power of part prevents adsorption capacity excessive and disfiguring workpiece or too small and not clamping workpiece.
Specifically, automatic loading and unloading system 60 further include for drive material box 61 go up and down the 4th driving mechanism, the 4th
Driving mechanism can drive the automatic lifting on automatic loading and unloading system 60 of material box 61, and rotating arm is facilitated to grab workpiece to be added.
Specifically, automatic loading and unloading system 60 may also include photoelectric limit switch, and photoelectric limit switch can limit material box
61 adjustable height prevents dangerous generation.
Referring to Fig. 2, existing be illustrated laser processing provided by the invention.Laser processing, including it is as follows
Step:
S1: automatic loading and unloading system 60 is by workpiece feeding to be added to machine table 50；
S2: vision system 40 identifies the position of workpiece to be added and feeds back to control system；
S3；Control system is called corresponding in laser processing parameter library according to the location information of the workpiece to be added received
The machined parameters of workpiece simultaneously control the transmitting laser processing of laser transmitting system 10 workpiece to be added；
S4: 60 blanking of automatic loading and unloading system.
The laser processing is suitable for the laser processing device that aforementioned any embodiment is addressed.
Laser processing provided by the invention compared with prior art first obtains workpiece feeding to be added to machine table 50
It after the location information for taking workpiece to be added, then is focused to machined part, the data in laser processing parameter library is called when processing,
Direct blanking, whole process are simple and efficient after processing is completed, control each procedure of processing by control system, are improved automatic
Change degree.
When first time a kind of product is carried out processing or process in error it is larger when, step S1 and step S2 it
Between the following steps that carry out:
S5: the first driving mechanism driving machine table 50 is mobile under control of the control system.
It ensure that workpiece to be added can be processed to machined part in Working position.
The preferred embodiment of laser processing of the present invention is illustrated below:
The data that control system can be inputted according to the data and sensor in laser processing parameter library, coordinated control laser processing
The normal work of device.Fibre optical sensor can transfer data to control system when monitoring material box 61 without workpiece to be added
System, control system are issued to alarm device and are instructed, and alarm device just will start alarm；When material box 61 needs workpiece, optical fiber is passed
Sensor transfers data to control system, and control system can issue instructions to the driving mechanism of material box 61, and material box 61 is mentioned
Height arrives the crawl position of rotating arm, and the hoisting depth of material box 61 is controlled by photoelectric limit switch, prevents material box 61 from being promoted
High and cause danger, when material box 61 is thus lifted to the crawl position of rotating arm, control system gives the first driving mechanism again
It issues and instructs with the second driving mechanism, driving rotating arm grabs workpiece to be added, and vacuum chuck grabs the power of workpiece to be added by electronics
Pressure adjusts sensor to detect, and prevents the excessive disfiguring workpiece of the adsorption capacity of vacuum chuck or too small without firmly grasping workpiece,
When workpiece to be added is put into machine table 50 by rotating arm, vision system 40 focuses positioning process part, and transfers data to control
System, control system control the mobile machine table 50 of the first driving mechanism to 32 lower section of field lens, are aligned workpiece and field lens 32 to be added,
And after adjusting corresponding data, control system give laser transmitting system 10 issue instruction, issue laser beam 11, to machined part into
Row processing, after processing is completed, rotating arm again by workpiece grabbing to blanking box 62, complete by a process.Whole process,
It is all by control system coordinated control, high degree of automation improves production efficiency, reduces processing cost.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. laser processing device, it is characterised in that: including machine table, control system and respectively with the control system communicate to connect
Laser transmitting system, automatic loading and unloading system and vision system, the laser transmitting system is for emitting laser beams to described
Machine table, the automatic loading and unloading system are used to be the machine table loading and unloading, and the vision system is placed in described for acquisition
The location information of workpiece in machine table, the location information control that the control system is fed back according to the vision system is described to swash
Light emission system work.
2. laser processing device according to claim 1, it is characterised in that: it further include focusing system, the focusing system
Laser beam focus for emitting the laser transmitting system to the machine table Working position, the focusing system with
The control system communication connection.
3. laser processing device according to claim 2, it is characterised in that: the focusing system includes galvanometer, the vibration
Mirror is arranged between the laser transmitting system and the machine table.
4. laser processing device according to claim 3, it is characterised in that: the focusing system further includes field lens, described
Field lens is arranged between the galvanometer and the machine table.
5. laser processing device according to claim 4, it is characterised in that: it further include outside optical system, the outer optical path
The laser beam that system is used to emit the laser transmitting system is oriented to the machine table.
6. laser processing device according to claim 5, it is characterised in that: the outside optical system includes beam expanding lens and anti-
Mirror is penetrated, the beam expanding lens is arranged between the laser transmitting system and the galvanometer, and the reflecting mirror setting is expanded described
Between mirror and the galvanometer.
7. laser processing device according to claim 1, it is characterised in that: it further include cooling system, the cooling system
For cooling down the laser transmitting system.
8. laser processing device according to claim 1, it is characterised in that: further include for driving the machine table perpendicular
The first driving mechanism that histogram is moved upwards to, front-rear direction and right and left, first driving mechanism and the control system
Communication connection.
9. laser processing, characterized by the following steps:
Automatic loading and unloading system is by workpiece feeding to be added to machine table；
Vision system identifies the position of the workpiece to be added and feeds back to control system；
The control system is called corresponding in laser processing parameter library according to the location information of the workpiece to be added received
The machined parameters of workpiece simultaneously control the laser transmitting system transmitting laser processing workpiece to be added；
The automatic loading and unloading system blanking.
10. laser processing according to claim 9, it is characterised in that: identified in the vision system described to be added
The following steps carried out before the position step of workpiece:
The first driving mechanism drives the machine table mobile under the control of the control system, until in the machine table to
Workpiece is moved to default Working position with the machine table.
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| CN201810801547.XA CN108941894A (en) | 2018-07-20 | 2018-07-20 | A kind of laser processing device and method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109570779A (en) * | 2018-12-29 | 2019-04-05 | 大族激光科技产业集团股份有限公司 | A kind of laser processing and laser-processing system |
| CN111390394A (en) * | 2020-04-22 | 2020-07-10 | 旭科新能源股份有限公司 | Laser processing equipment |
| CN111940926A (en) * | 2020-08-18 | 2020-11-17 | 深圳中科光子科技有限公司 | Glass cover plate cutting equipment and cutting method thereof |
| CN113359539A (en) * | 2021-01-11 | 2021-09-07 | 宣城睿晖宣晟企业管理中心合伙企业(有限合伙) | Method and device for monitoring workpiece in closed non-transparent chamber and coating equipment |
| CN114515795A (en) * | 2022-01-28 | 2022-05-20 | 香港生产力促进局 | Laser auxiliary correction method and device based on visual error compensation |
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Application publication date: 20181207 |