CN110280862A - A kind of welding system and its method of device pin - Google Patents
A kind of welding system and its method of device pin Download PDFInfo
- Publication number
- CN110280862A CN110280862A CN201910677947.9A CN201910677947A CN110280862A CN 110280862 A CN110280862 A CN 110280862A CN 201910677947 A CN201910677947 A CN 201910677947A CN 110280862 A CN110280862 A CN 110280862A
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- pin
- welding
- temperature
- welding system
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Abstract
The present invention relates to optical communication fields, and in particular to a kind of welding system and its method of device pin.The welding system includes laser beam emitting device, for generating laser；Temperature detecting module, for detecting the temperature of each pin region；Lens module, the lens module are equipped with multiple and lens arrangement corresponding with a pin respectively；Main control module is connect with laser beam emitting device and temperature detecting module respectively, is provided with the temperature preset value of the pin region；Wherein, the main control module obtains the temperature data of temperature detecting module detection, it is compared with temperature preset value, and according to comparison result, the laser energy of control adjustment laser beam emitting device, laser expose to pad corresponding to each pin through lens module and are welded.The present invention is able to achieve the accurate contraposition of the device with small spacing pin, rapid welding, temperature-controllable, guarantees device welding quality, and occupy little space, can volume production, improve production efficiency.
Description
Technical field
The present invention relates to optical communication fields, and in particular to a kind of welding system and its method of device pin.
Background technique
The butterfly device in opto-electronic industry has row pattern to draw/pin at present, and these row patterns draw/and pin needs and pcb board
Surface corresponds to metal pad by Welding, forms stable and firm electrical connection.
With the promotion at full speed of traffic rate, the signal bandwidth for needing to carry and transmit in same physical space is increasingly
Greatly, the miniaturization and low power consumption of optical device have become industry inexorable trend, and require increasingly harsher, miniaturization
Constantly challenging traditional welding procedure simultaneously.After device miniaturization, pin is more and more thinner, and spacing is smaller and smaller and adjacent
Device and electronic component it is also increasingly closer, need do not influencing adjacent electronic elements device, and device main body is not subject to height
Under the premise of temperature, the reliable welding of pin is realized.
In existing, row pattern is drawn using HOTBAR (thermal compression welding) technique and manual welding method/pin welds.It adopts
With traditional HOTBAR technique row pattern is drawn/pin weld when, need to weld device and integrally heat；And manual welding
Method limits necessarily certain operating space due to solder horn physical size.
All there are lead pin pitch technological limits in above two method, the case where being less than the spacing limit can not be solved, to small
Away from pin welding poor welding quality, can not volume production, production efficiency is low, and be easy because of the excessively high damage device of temperature.
Summary of the invention
The technical problem to be solved in the present invention is that in view of the above drawbacks of the prior art, a kind of device pin is provided
Welding system and its method overcome existing welding small-pitch devices pin poor welding quality, can not volume production, production efficiency is low, and
The problem of being easy damage device excessively high because of temperature.
The technical solution adopted by the present invention to solve the technical problems is: providing a kind of welding system of device pin, device
Part includes multiple pins of row pattern setting, and the welding system includes:
Laser beam emitting device, for generating laser；
Temperature detecting module, for detecting the temperature of each pin region；
Lens module, the lens module are equipped with multiple and lens arrangement corresponding with a pin respectively；
Main control module is connect with laser beam emitting device and temperature detecting module respectively, is provided with the pin region
Temperature preset value；
Wherein, the main control module obtains the temperature data of temperature detecting module detection, it is carried out with temperature preset value
Compare, and according to comparison result, control adjusts the laser energy of laser beam emitting device, and laser exposes to each institute through lens module
Pad corresponding to pin is stated to be welded.
Still more preferably scheme of the invention is: the temperature detecting module includes multiple and corresponding with a pin respectively
Setting obtains the infrared measurement of temperature unit of corresponding pin region temperature.
Still more preferably scheme of the invention is: the welding system further includes for providing the confession of gas cooling device
Device of air.
Still more preferably scheme of the invention is: the welding system further includes the air extractor for extracting gas,
The air extractor and feeder integrated setting.
Still more preferably scheme of the invention is: the welding system further include respectively with main control module and lens module
The infrared launcher of connection, the main control module control infrared launcher generation infrared light expose to each through lens module
The pin determines welding position to observe spot size position.
Still more preferably scheme of the invention is: the welding system further includes connecting to catch for shooting with main control module
Obtain the CCD device of pin region image.
The technical solution adopted by the present invention to solve the technical problems is: providing a kind of welding method of device pin, device
Part includes multiple pins of row pattern setting, and the welding method is applied to welding system described above and welds to device pin
Connect, the welding method comprising steps of
The corresponding pad of each to device pin carries out pre- upper tin operation；
Detection obtains the temperature of each pin region；
The temperature data that will acquire is compared with preset temperature preset value；
Laser energy is adjusted according to comparison result；
Scolding tin on pad is melted to the corresponding pad of each pin, completes the welding of pin by laser irradiation.
Still more preferably scheme of the invention is: the welding method further comprises the steps of:
Before pre- upper tin operation, according to the default welding temperature curve changed over time of the attribute of device.
Still more preferably scheme of the invention is: the welding method further comprises the steps of:
After the welding for completing pin, nitrogen is provided, device is cooled down.
Still more preferably scheme of the invention is: the welding method is further comprised the steps of: to be mentioned in scolding tin melting process
For the nitrogen of micrometeor.
The beneficial effects of the present invention are compared with prior art, by being arranged laser beam emitting device, temperature detection mould
Block, the lens module being connect with laser beam emitting device, and the master being connect respectively with laser beam emitting device and temperature detecting module
Module is controlled, main control module obtains the temperature data of each pin region of temperature detecting module detection, by itself and pipe
The temperature preset value of foot region is compared, and according to comparison result, control adjusts the laser energy of laser beam emitting device,
Laser exposes on corresponding pad through corresponding to the lens arrangement of each pin in lens module, completes the weldering of pin and pad
It connects, the accurate contraposition of the device with small spacing pin, fast welding is able to achieve using welding system and welding method of the invention
It connects, guarantees the welding quality of device, and occupy little space, it can be achieved that volume production, is greatly improved production efficiency, and utilize PID temperature
Degree feedback, realizes the controllable of welding temperature.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples, in attached drawing:
Fig. 1 is the structural schematic diagram of the welding system of device pin of the invention；
Fig. 2 is the flow diagram of the welding method of device pin of the invention；
Fig. 3 is the idiographic flow block diagram of the welding method of device pin of the invention.
Specific embodiment
Now in conjunction with attached drawing, elaborate to presently preferred embodiments of the present invention.
As shown in Figure 1, the present invention provides a kind of preferred embodiment of the welding system of device pin.
Device A includes multiple pin a of row pattern setting.The welding system includes:
Laser beam emitting device 10, for generating laser；
Temperature detecting module 20, for detecting the temperature of each pin region；
Lens module 30, the lens module 30 are equipped with multiple and lens arrangement 31 corresponding with a pin a respectively；
Main control module 40 is connect with laser beam emitting device 10 and temperature detecting module 20 respectively, is provided with the pin institute
Temperature preset value in region；
Wherein, the main control module 40 obtains the temperature data that temperature detecting module 20 detects, by itself and temperature preset value
It is compared, and according to comparison result, control adjusts the laser energy of laser beam emitting device 10, and laser is irradiated through lens module 30
It is welded to pad B corresponding to each pin a.
By setting laser beam emitting device 10, temperature detecting module 20, lens module 30, and filled respectively with Laser emission
The main control module 40 of 10 and the connection of temperature detecting module 20 is set, main control module 40 obtains each institute that temperature detecting module 20 detects
It is compared by the temperature data for stating pin region with temperature preset value, and according to comparison result, control adjustment laser
The laser energy of emitter 10, laser corresponded in lens module 30 lens arrangement 31 of each pin a expose to it is corresponding
On pad B, the welding of pin a and pad B, the corresponding pin a of each lens arrangement 31 of lens module 30, using this hair are completed
Bright welder is able to achieve the accurate contraposition of the device A with small spacing pin a, and rapid welding guarantees the welding matter of device A
Amount, and occupy little space, it can be achieved that volume production, is greatly improved production efficiency, and fed back using PID temperature, realizes welding temperature
It is controllable.
Wherein, the temperature of pin region is laser irradiation on pin a, and laser facula is beaten on pin a, hot spot week
Enclose the temperature in region.
Wherein, multiple lens arrangements 31 are arranged side by side and are connected with each other, and lens module 30 are formed, to laser beam emitting device 10
The laser beam of transmitting carries out shaping, and is adjusted by size of the lens module 30 to hot spot, each lens arrangement 31
A pin a of respective devices A, the laser that laser beam emitting device 10 generates expose to each pin through the correspondence of lens module 30
A, laser energy hot spot is uniform, accurate positioning, carries out rapid welding to corresponding pin a, tin consistency is good on pin a, upper tin
Amount is uniform.
Wherein, lens arrangement 31 can be by single lens, or be made of two or more lens.
In the present embodiment, the temperature detecting module 20 includes multiple and is correspondingly arranged respectively with a pin a, obtains and corresponds to
The infrared measurement of temperature unit of pin region temperature.
It is correspondingly arranged an infrared measurement of temperature unit by each pin a, the temperature of corresponding pin region is detected, to pin
A ambient temperature is monitored, feeds back, and the temperature data that will test acquisition is transmitted to main control module 40, and the judgement of main control module 40 obtains
Whether the temperature data taken is more than temperature preset value, when being more than temperature preset value, adjusts laser energy, reduces laser processing function
Rate, or stop laser beam emitting device 10 and generate laser, to reduce the temperature of pin region, form closed loop feedback control
System avoids the excessively high damage pin a of temperature, protects device A, and do not influence adjacent device.
Further, the welding system further includes for providing the feeder 50 of gas cooling device A.Specifically,
Laser irradiation melts scolding tin on pad B in pin a and corresponding pad B, and after completing pin a welding, feeder 50 is provided
A large amount of nitrogen cools down device A rapidly.And in carrying out laser beam welding, feeder 50 can provide micro-
The nitrogen of flow, prevents scolding tin to be oxidized, and keeps scolding tin appearance bright, further increases welding quality.
Further, the welding system further includes the air extractor 60 for extracting gas, 60 He of air extractor
50 integrated setting of feeder.Air extractor 60 is set, the toxic and harmful gas generated in welding process can be extracted, improves life
Produce the quality of environment.60 integrated setting of feeder 50 and air extractor can be completed to be evacuated and be supplied using a device
Function saves the occupied space of integral solder system.
Further, the welding system further includes the infrared emission connecting respectively with main control module 40 and lens module 30
Device 70, the main control module 40 control the generation infrared light of infrared launcher 70 and expose to each pipe through lens module 30
Foot a determines welding position to observe spot size position.Before welding, operator can control infrared hair by main control module 40
Injection device 70 emits infrared light, and infrared light is visible light, and the size of debugging hot spot can be observed by the infrared light of transmitting, keeps it suitable
The size of welding pin a required for answering.
Further, the welding system further includes being connect with main control module 40 for shooting capture pin region figure
The CCD device 80 of picture.Main control module 40 controls the work shooting capture pin region image of CCD device 80, to device pin
Welding monitored in real time.And before welding, whether laser spot can focus the pin with required welding when monitoring is debugged
a。
In the present embodiment, the welding system may also include mobile platform 90, and device A and the pcb board with pad B are placed
In on mobile platform 90, in spot size debugging and position adjustment, device A and PCB can be driven by mobile platform 90
Plate is in X, Y, moves in Z-direction, device A is made to be in suitable welding position, easy to operate.
Welder of the invention is welded using laser array, in conjunction with tooling the Automation Design and process parameter test knot
Fruit is compared with SMT (surface mounting technology), and device A main body can be effectively protected and do not have to bear too high-temperature and manual welding
It compares, narrow operating spaces can be overcome to limit；Pin a welding consistency is good, and upper tin amount is uniform, it is easy to accomplish automation, it can
Produce in enormous quantities, production efficiency is greatly improved.
And the present invention provides laser light source, the adjustment spot size of lens module 30 by laser beam emitting device 10, it is mobile
The positioning of 90 additional device A of platform, air extractor 60, the work compound of 50 cooling device A of feeder etc. realize device pin
Welding on a predetermined position is rapidly achieved set temperature for the tin layers fusing on prefabricated pad B and is filled into pin a and pin a
Between corresponding pad B and then surrounding, formation package or the partly secured solder joint of package are quickly cooled down completion welding, protect welding
Device A and adjacent electronic component.
As shown in Figures 2 and 3, the present invention also provides a kind of preferred embodiments of the welding method of device pin.
Device A includes multiple pin a of row pattern setting.The welding method is applied to welding system described above to device
Part pin is welded, the welding method comprising steps of
S20, the corresponding pad B of the pin a each to device A carry out pre- upper tin operation；
S30, detection obtain the temperature of each pin region；
S40, the temperature data that will acquire are compared with preset temperature preset value；
S50, laser energy is adjusted according to comparison result；
S60, laser irradiation to the corresponding pad B of each pin a, the scolding tin on pad B is melted, pin a is completed
Welding.
It is pre- with it according to the temperature data of acquisition by the temperature of the corresponding each pin region acquisition device A
If the comparison result of temperature value adjusts laser energy, each pin a is corresponded into the melting of the scolding tin on pad B, completes pin a
Welding, realize with small spacing pin a device A accurate contraposition, rapid welding, temperature-controllable, guarantee device A welding
Quality, and occupy little space, it can be achieved that volume production, is greatly improved production efficiency.
Wherein, above-mentioned pre- upper tin operation can be by tin plating mode, or by way of putting tin cream online
Carry out pre- upper tin.
Further, before step S20, the welding method is further comprised the steps of:
S10, before pre- upper tin operation, according to the default welding temperature curve changed over time of the attribute of device A.
Wherein, the attribute of device A refers to the type of device A, the material of device A, the subsequent processing technology demand of device A
Deng welding temperature needed for these all can influence device A.Its welding temperature curve is preset according to the attribute of device A, at some
In period, adjustment laser energy, which carries out processing, is in the temperature of pin region in a certain range, the welding to pin a
Temperature is controlled, and the excessively high damage device A of temperature is avoided, and improves the welding quality of small spacing pin a welding.And welding temperature
The temperature value changed over time in line of writing music corresponds to temperature preset value described above.
Further, after step S60, the welding method is further comprised the steps of:
S70, complete pin a welding after, nitrogen is provided, device A is cooled down.
Specifically, by providing the nitrogen of big flow, device A is cooled down rapidly after pin a welding, to device A
It shields, and does not influence adjacent electronic elements.
In the present embodiment, in step S60, the welding method is further comprised the steps of:
The nitrogen of micrometeor is provided in scolding tin melting process.
In laser irradiation to pad B, the scolding tin on pad B is melted, by providing the nitrogen of micrometeor, prevents scolding tin oxygen
Change, keeps scolding tin appearance bright.
It should be understood that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations, to ability
It for field technique personnel, can modify to technical solution illustrated in the above embodiments, or special to part of technology
Sign is equivalently replaced；And all such modifications and replacement, it should all belong to the protection domain of appended claims of the present invention.
Claims (10)
1. a kind of welding system of device pin, device includes multiple pins of row pattern setting, which is characterized in that the welding system
System includes:
Laser beam emitting device, for generating laser；
Temperature detecting module, for detecting the temperature of each pin region；
Lens module, the lens module are equipped with multiple and lens arrangement corresponding with a pin respectively；
Main control module is connect with laser beam emitting device and temperature detecting module respectively, is provided with the temperature of the pin region
Spend preset value；
Wherein, the main control module obtains the temperature data of temperature detecting module detection, it is compared with temperature preset value,
And according to comparison result, control adjusts the laser energy of laser beam emitting device, and laser exposes to each pipe through lens module
Pad corresponding to foot is welded.
2. welding system according to claim 1, which is characterized in that the temperature detecting module include it is multiple and respectively with
One pin is correspondingly arranged, and obtains the infrared measurement of temperature unit of corresponding pin region temperature.
3. welding system according to claim 1, which is characterized in that the welding system further includes cold for providing gas
But the feeder of device.
4. welding system according to claim 3, which is characterized in that the welding system further includes for extracting gas
Air extractor, the air extractor and feeder integrated setting.
5. welding system according to claim 1, which is characterized in that the welding system further include respectively with main control module
The infrared launcher connected with lens module, the main control module control infrared launcher generate infrared light through lens module
It exposes to each pin and determines welding position to observe spot size position.
6. welding system according to claim 1, which is characterized in that the welding system further includes connecting with main control module
For shooting the CCD device of capture pin region image.
7. a kind of welding method of device pin, device includes multiple pins of row pattern setting, which is characterized in that the welding side
Method is applied to any welding system of claim 1-6 and welds to device pin, the welding method comprising steps of
The corresponding pad of each to device pin carries out pre- upper tin operation；
Detection obtains the temperature of each pin region；
The temperature data that will acquire is compared with preset temperature preset value；
Laser energy is adjusted according to comparison result；
Scolding tin on pad is melted to the corresponding pad of each pin, completes the welding of pin by laser irradiation.
8. welding method according to claim 7, which is characterized in that the welding method is further comprised the steps of: in pre- upper tin
Before operation, according to the default welding temperature curve changed over time of the attribute of device.
9. welding method according to claim 7, which is characterized in that the welding method, which further comprises the steps of:, to be completed to manage
After the welding of foot, nitrogen is provided, device is cooled down.
10. welding method according to claim 7, which is characterized in that the welding method further comprises the steps of: molten in scolding tin
The nitrogen of micrometeor is provided during melting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910677947.9A CN110280862A (en) | 2019-07-25 | 2019-07-25 | A kind of welding system and its method of device pin |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910677947.9A CN110280862A (en) | 2019-07-25 | 2019-07-25 | A kind of welding system and its method of device pin |
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| CN110280862A true CN110280862A (en) | 2019-09-27 |
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| CN201910677947.9A Pending CN110280862A (en) | 2019-07-25 | 2019-07-25 | A kind of welding system and its method of device pin |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111390314A (en) * | 2020-04-21 | 2020-07-10 | 中国电子科技集团公司第二十九研究所 | Improvement method of FMC device assembling process |
| CN111570963A (en) * | 2020-04-14 | 2020-08-25 | 深圳欣旺达智能科技有限公司 | Hot-press welding method and device, computer equipment and storage medium |
| CN111715999A (en) * | 2020-05-28 | 2020-09-29 | 南昌欧菲显示科技有限公司 | Semiconductor device soldering apparatus and semiconductor device soldering method |
| CN112658423A (en) * | 2019-10-15 | 2021-04-16 | 大族激光科技产业集团股份有限公司 | Multipoint synchronous soldering method and multipoint synchronous soldering device |
-
2019
- 2019-07-25 CN CN201910677947.9A patent/CN110280862A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112658423A (en) * | 2019-10-15 | 2021-04-16 | 大族激光科技产业集团股份有限公司 | Multipoint synchronous soldering method and multipoint synchronous soldering device |
| CN111570963A (en) * | 2020-04-14 | 2020-08-25 | 深圳欣旺达智能科技有限公司 | Hot-press welding method and device, computer equipment and storage medium |
| CN111390314A (en) * | 2020-04-21 | 2020-07-10 | 中国电子科技集团公司第二十九研究所 | Improvement method of FMC device assembling process |
| CN111715999A (en) * | 2020-05-28 | 2020-09-29 | 南昌欧菲显示科技有限公司 | Semiconductor device soldering apparatus and semiconductor device soldering method |
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Address after: No.35 Cuijing Road, Pingshan District, Shenzhen City, Guangdong Province Applicant after: Ona Technology (Shenzhen) Group Co.,Ltd. Address before: No.35 Cuijing Road, Pingshan District, Shenzhen City, Guangdong Province Applicant before: O-NET COMMUNICATIONS (SHENZHEN) Ltd. |