CN111570963A - Hot-press welding method and device, computer equipment and storage medium - Google Patents
Hot-press welding method and device, computer equipment and storage medium Download PDFInfo
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- CN111570963A CN111570963A CN202010290794.5A CN202010290794A CN111570963A CN 111570963 A CN111570963 A CN 111570963A CN 202010290794 A CN202010290794 A CN 202010290794A CN 111570963 A CN111570963 A CN 111570963A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
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- Mechanical Engineering (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the technical field of production and manufacturing, in particular to a hot-press welding method and device, computer equipment and a storage medium. The method comprises the following steps: in the welding process, detecting the temperature inside a hot-press welding head component to obtain the temperature of a welding head; detecting the temperature of each welding point on the welding position to obtain a plurality of welding point temperatures; according to a preset heat dissipation estimation algorithm, estimating the heat dissipation speed of each welding point according to the temperatures of the plurality of welding points to obtain the heat dissipation speed of each welding point; and adjusting the contact area of the hot-press welding head part and each welding point according to the welding head temperature and the heat dissipation speed of each welding point. The automatic welding device has the advantages that the purpose of automatic welding is achieved, production efficiency is improved, and the problems that hot-press welding is basically performed manually, different welding parts are replaced by different projects, and accordingly time is consumed and efficiency is low are solved.
Description
Technical Field
The invention relates to the technical field of production and manufacturing, in particular to a hot-press welding method and device, computer equipment and a storage medium.
Background
The hot-press welding is a welding process for connecting a flexible circuit board and a rigid circuit board, is a new manufacturing process and an important component in the technical field of microelectronic surface assembly, and is an important link for ensuring good quality of products undoubtedly in a stable and efficient hot-press welding process. At present, the conventional thermocompression bonding is basically operated manually, and different bonding parts are replaced according to different items, resulting in long time and low efficiency.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a hot-press welding method, a hot-press welding device, computer equipment and a storage medium, and aims to solve the problems that hot-press welding is basically performed manually, different welding parts are replaced by different projects, and accordingly time is consumed and efficiency is low.
The technical scheme provided by the invention is as follows:
a method of thermocompression bonding, the method comprising:
in the welding process, detecting the temperature inside a hot-press welding head component to obtain the temperature of a welding head;
detecting the temperature of each welding point on the welding position to obtain a plurality of welding point temperatures;
according to a preset heat dissipation estimation algorithm, estimating the heat dissipation speed of each welding point according to the temperatures of the plurality of welding points to obtain the heat dissipation speed of each welding point;
and adjusting the contact area of the hot-press welding head part and each welding point according to the welding head temperature and the heat dissipation speed of each welding point.
Further, after the step of adjusting the contact area between the thermal head component and each welding point according to the welding head temperature and the heat dissipation speed of each welding point, the method includes:
detecting the current temperature of each welding point;
selecting the lowest temperature from the current temperatures of all the welding points to obtain a first temperature;
judging whether the first temperature is higher than a first preset temperature or not;
and if so, stopping heating the thermal compression head part, and moving the thermal compression head part away from the welding position to finish the welding task.
Further, before the step of detecting the temperature inside the hot-press head component during the welding process to obtain the temperature of the welding head, the method comprises the following steps:
receiving a welding task input by a user;
responding to the welding task, moving the thermal compression welding head part to a welding position and heating;
and controlling the hot-press welding head component to weld each welding point of a welding disc on the printed circuit board.
Further, after the step of moving the thermal head assembly to the bonding position and heating in response to the bonding task, before the step of controlling the thermal head assembly to bond the bonding points of the pads on the printed circuit board, the method includes:
detecting the temperature inside the hot-press welding head component to obtain a second temperature;
judging whether the second temperature is higher than a second preset temperature or not;
if yes, triggering and controlling the hot-press welding head component to weld each welding point of a welding disc on the printed circuit board;
and if not, triggering and detecting the temperature inside the thermal pressure welding head component to obtain a second temperature.
Further, in the step of adjusting the contact area between the thermal head component and each welding point according to the welding head temperature and the heat dissipation speed of each welding point, the method includes:
calculating the target contact area of the hot-press welding head part and each welding point according to the welding head temperature and the heat dissipation speed of each welding point;
acquiring the current contact area between the thermal compression welding head part and each welding point;
and adjusting the contact area of the thermal compression welding head part and each welding point to reach the corresponding target contact area according to each current contact area.
The present invention also provides a hot press welding apparatus, the apparatus comprising:
the first detection module is used for detecting the temperature inside the hot-press welding head component in the welding process to obtain the temperature of the welding head;
the second detection module is used for detecting the temperature of each welding point on the welding position to obtain a plurality of welding point temperatures;
the estimation module is used for estimating the heat dissipation speed of each welding point according to the temperature of the plurality of welding points according to a preset heat dissipation estimation algorithm to obtain the heat dissipation speed of each welding point;
and the first adjusting module is used for adjusting the contact area between the hot-press welding head part and each welding point according to the welding head temperature and the heat dissipation speed of each welding point.
Further, the apparatus comprises:
the third detection module is used for detecting the current temperature of each welding point;
the selecting module is used for selecting the lowest temperature from the current temperatures of all the welding points to obtain a first temperature;
the first judging module is used for judging whether the first temperature is higher than a first preset temperature or not;
and the processing module is used for stopping heating the thermal compression head part and moving the thermal compression head part away from the welding position when the first temperature is higher than a first preset temperature.
Further, the apparatus comprises:
the receiving module is used for receiving a welding task input by a user;
the execution module is used for responding to the welding task, moving the thermal compression head component to a welding position and heating;
and the second control module is used for controlling the hot-press welding head component to weld all welding points of a welding pad on the printed circuit board.
The invention also provides a computer device comprising a memory storing a computer program and a processor implementing the steps of any of the above methods when the processor executes the computer program.
The invention also provides a computer-readable storage medium, on which a computer program is stored, which computer program, when being executed by a processor, carries out the steps of the method of any of the above. According to the technical scheme, the invention has the beneficial effects that: according to the temperature of the welding head and the heat dissipation speed of each welding point, the contact area of the hot-press welding head component and each welding point is adjusted to achieve the purpose of automatic welding, the production efficiency is improved, and the problems that the hot-press welding is basically manually operated, different welding components are replaced by different projects, the time is long, and the efficiency is low are solved.
Drawings
FIG. 1 is a flow chart of a thermal compression bonding method provided by an embodiment of the invention;
FIG. 2 is a functional block diagram of a thermal compression bonding apparatus provided by an embodiment of the present invention;
fig. 3 is a block diagram schematically illustrating a structure of a computer device provided by an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1, an embodiment of the present invention provides a thermal compression bonding method, including the following steps:
step S101, in the welding process, the temperature inside the hot-press welding head component is detected to obtain the temperature of the welding head.
The hot-press welding head component is internally provided with a first temperature detection device, and the temperature inside the hot-press welding head component is detected through the first temperature detection device.
And S102, detecting the temperature of each welding point on the welding position to obtain a plurality of welding point temperatures.
The printed circuit board to be welded is placed on the bearing table, a second temperature detection device is arranged on the bearing table, and the second temperature detection device is located in the area below the position of the bonding pad on the printed circuit board. The temperature of each welding point is detected through the second temperature detection device, and different temperatures can exist in the temperature of each welding point.
And S103, estimating the heat dissipation speed of each welding point according to the plurality of welding point temperatures according to a preset heat dissipation estimation algorithm to obtain the heat dissipation speed of each welding point.
The algorithm for estimating the heat dissipation is preset by a user, the heat dissipation speed of each welding point estimated by the temperature of each welding point is estimated one by one according to the preset algorithm for estimating the heat dissipation, and the estimation result is output, so that the heat dissipation speed of each welding point is obtained. In the same medium, the higher the temperature is, the faster the heat dissipation speed is, in this embodiment, a plurality of different temperature regions are set, and each temperature region corresponds to one heat dissipation speed, and therefore, it is determined that the temperature of the welding point belongs to a certain temperature region, and if the temperature of the welding point belongs to the first temperature region, the heat dissipation speed corresponding to the first temperature region is found out, and the heat dissipation speed of the temperature of the welding point can be estimated.
And step S104, adjusting the contact area of the thermal compression welding head part and each welding point according to the welding head temperature and the heat dissipation speed of each welding point.
The user presets a contact area scheme, matches the preset contact area scheme according to the temperature of the welding head and the heat dissipation speed of the welding point, outputs a matching result, identifies the contact area from the matching result, and then adjusts the contact area of the hot-press welding head component and the welding point according to the identified contact area. And adjusting the contact area of the thermal compression welding head component and each welding point to ensure that the thermal transmission efficiency of the thermal compression welding head component and each welding point is the same. In this embodiment, the thermocompression bonding head part includes a plurality of liftable soldered joints, and the area of contact with the welding point is adjusted through the mode of lifting the welding point, for example, the area of contact of soldered joint and welding point will be reduced to the rising soldered joint, and the area of contact of soldered joint and welding point will be reduced to the reduction soldered joint.
According to the temperature of the welding head and the heat dissipation speed of each welding point, the contact area of the hot-press welding head component and each welding point is adjusted to achieve the purpose of automatic welding, the production efficiency is improved, and the problems that the hot-press welding is basically manually operated, different welding components are replaced by different projects, the time is long, and the efficiency is low are solved.
In the present embodiment, after step S104, the method includes:
detecting the current temperature of each welding point;
selecting the lowest temperature from the current temperatures of all the welding points to obtain a first temperature;
judging whether the first temperature is higher than a first preset temperature or not;
and if so, stopping heating the thermal compression head part, and moving the thermal compression head part away from the welding position to finish the welding task.
After the contact area is adjusted, the temperature of each welding point is detected, so that the current temperature of each welding point is obtained, the current temperature of each welding point is different, the current temperature of each welding point is sequenced from high to low, and then the last temperature is selected to obtain the first temperature. The first temperature is the lowest of the current temperatures of the individual welds. And the first preset temperature is the temperature required by welding, the first temperature is compared with the first preset temperature for judgment, and if the first temperature is higher than the first preset temperature, the heating of the hot-press welding head component is stopped, the hot-press welding head component is moved away from the welding position, and the welding task is completed. And if the first temperature is not higher than the first preset temperature, maintaining the current welding state.
In this embodiment, before step S101, the method includes:
receiving a welding task input by a user;
responding to the welding task, moving the thermal compression welding head part to a welding position and heating;
and controlling the hot-press welding head component to weld each welding point of a welding disc on the printed circuit board.
The user actively triggers the welding task, for example, the user presses a designated key, or the user triggers by voice. And receiving and responding to a welding task input by a user, moving the hot-press welding head component to a welding position, starting heating the hot-press welding head component, and then entering a welding process to control the hot-press welding head component to weld each welding point of a welding pad on the printed circuit board. The thermal head part can weld a plurality of welding points simultaneously.
In this embodiment, after the step of moving and heating the thermal head assembly to the bonding position in response to the bonding task, before the step of controlling the thermal head assembly to bond the pads on the printed circuit board, the method includes:
detecting the temperature inside the hot-press welding head component to obtain a second temperature;
judging whether the second temperature is higher than a second preset temperature or not;
if yes, triggering and controlling the hot-press welding head component to weld each welding point of a welding disc on the printed circuit board;
and if not, triggering and detecting the temperature inside the thermal pressure welding head component to obtain a second temperature.
Before the hot-press welding head component welds each welding point, the temperature inside the hot-press welding head component is detected to obtain a second temperature, the second preset temperature is preset by a user, the second temperature is compared and judged with the second preset temperature, and if the second temperature is higher than the second preset temperature, the step of controlling the hot-press welding head component to weld each welding point of a welding pad on the printed circuit board is triggered. And if the second temperature is not higher than the second preset temperature, not triggering the step of controlling the hot-press welding head component to weld all welding points of a welding pad on the printed circuit board, but triggering and detecting the temperature inside the hot-press welding head component to obtain the second temperature. Thus, before the thermal compression head part welds each welding point, the thermal compression head part reaches at least a second preset temperature.
In some embodiments, in step S104, the method includes:
calculating the target contact area of the hot-press welding head part and each welding point according to the welding head temperature and the heat dissipation speed of each welding point;
acquiring the current contact area between the thermal compression welding head part and each welding point;
and adjusting the contact area of the thermal compression welding head part and each welding point to reach the corresponding target contact area according to each current contact area.
And calculating the target contact area of the hot-press welding head part and each welding point according to the temperature of the welding head and the heat dissipation speed of each welding point by presetting a scheme for calculating the contact area. And adjusting the contact area of the hot-press welding head part and the welding points according to the difference value between the target contact area and the current contact area, so that the contact area of the hot-press welding head part and each welding point reaches the corresponding target contact area.
As shown in fig. 2, an embodiment of the invention provides a thermal compression bonding apparatus 1, where the apparatus 1 includes a first detection module 11, a second detection module 12, an estimation module 13, and a first adjustment module 14.
The first detection module 11 is configured to detect a temperature inside a thermal compression head component during a welding process, so as to obtain a temperature of the welding head.
The hot-press welding head component is internally provided with a first temperature detection device, and the temperature inside the hot-press welding head component is detected through the first temperature detection device.
And the second detection module 12 is configured to detect the temperature of each welding point at the welding position, so as to obtain a plurality of welding point temperatures.
The printed circuit board to be welded is placed on the bearing table, a second temperature detection device is arranged on the bearing table, and the second temperature detection device is located in the area below the position of the bonding pad on the printed circuit board. The temperature of each welding point is detected through the second temperature detection device, and different temperatures can exist in the temperature of each welding point.
And the estimation module 13 is configured to estimate the heat dissipation speed of each welding point according to the plurality of welding point temperatures according to a preset heat dissipation estimation algorithm, so as to obtain the heat dissipation speed of each welding point.
The algorithm for estimating the heat dissipation is preset by a user, the heat dissipation speed of each welding point estimated by the temperature of each welding point is estimated one by one according to the preset algorithm for estimating the heat dissipation, and the estimation result is output, so that the heat dissipation speed of each welding point is obtained. In the same medium, the higher the temperature is, the faster the heat dissipation speed is, in this embodiment, a plurality of different temperature regions are set, and each temperature region corresponds to one heat dissipation speed, and therefore, it is determined that the temperature of the welding point belongs to a certain temperature region, and if the temperature of the welding point belongs to the first temperature region, the heat dissipation speed corresponding to the first temperature region is found out, and the heat dissipation speed of the temperature of the welding point can be estimated.
And the first adjusting module 14 is configured to adjust a contact area between the thermocompression bonding head component and each welding point according to the temperature of the bonding head and the heat dissipation speed of each welding point.
The user presets a contact area scheme, matches the preset contact area scheme according to the temperature of the welding head and the heat dissipation speed of the welding point, outputs a matching result, identifies the contact area from the matching result, and then adjusts the contact area of the hot-press welding head component and the welding point according to the identified contact area. And adjusting the contact area of the thermal compression welding head component and each welding point to ensure that the thermal transmission efficiency of the thermal compression welding head component and each welding point is the same. In this embodiment, the thermocompression bonding head part includes a plurality of liftable soldered joints, and the area of contact with the welding point is adjusted through the mode of lifting the welding point, for example, the area of contact of soldered joint and welding point will be reduced to the rising soldered joint, and the area of contact of soldered joint and welding point will be reduced to the reduction soldered joint.
According to the temperature of the welding head and the heat dissipation speed of each welding point, the contact area of the hot-press welding head component and each welding point is adjusted to achieve the purpose of automatic welding, the production efficiency is improved, and the problems that the hot-press welding is basically manually operated, different welding components are replaced by different projects, the time is long, and the efficiency is low are solved.
In the present embodiment, the apparatus 1 comprises:
the third detection module is used for detecting the current temperature of each welding point;
the selecting module is used for selecting the lowest temperature from the current temperatures of all the welding points to obtain a first temperature;
the first judging module is used for judging whether the first temperature is higher than a first preset temperature or not;
and the processing module is used for stopping heating the thermal compression head part and moving the thermal compression head part away from the welding position when the first temperature is higher than a first preset temperature.
After the contact area is adjusted, the temperature of each welding point is detected, so that the current temperature of each welding point is obtained, the current temperature of each welding point is different, the current temperature of each welding point is sequenced from high to low, and then the last temperature is selected to obtain the first temperature. The first temperature is the lowest of the current temperatures of the individual welds. And the first preset temperature is the temperature required by welding, the first temperature is compared with the first preset temperature for judgment, and if the first temperature is higher than the first preset temperature, the heating of the hot-press welding head component is stopped, the hot-press welding head component is moved away from the welding position, and the welding task is completed. And if the first temperature is not higher than the first preset temperature, maintaining the current welding state.
In the present embodiment, the apparatus 1 comprises:
the receiving module is used for receiving a welding task input by a user;
the execution module is used for responding to the welding task, moving the thermal compression head component to a welding position and heating;
and the second control module is used for controlling the hot-press welding head component to weld all welding points of a welding pad on the printed circuit board.
The user actively triggers the welding task, for example, the user presses a designated key, or the user triggers by voice. And receiving and responding to a welding task input by a user, moving the hot-press welding head component to a welding position, starting heating the hot-press welding head component, and then entering a welding process to control the hot-press welding head component to weld each welding point of a welding pad on the printed circuit board. The thermal head part can weld a plurality of welding points simultaneously.
In the present embodiment, the apparatus 1 comprises:
the fourth detection module is used for detecting the temperature inside the hot-press welding head component to obtain a second temperature;
the second judgment module is used for judging whether the second temperature is higher than a second preset temperature or not;
the first triggering module is used for triggering the second control module if the first triggering module is used for triggering the second control module;
and the second triggering module is used for triggering the fourth detection module if the second detection module does not trigger the fourth detection module.
Before the hot-press welding head component welds each welding point, the temperature inside the hot-press welding head component is detected to obtain a second temperature, the second preset temperature is preset by a user, the second temperature is compared and judged with the second preset temperature, and if the second temperature is higher than the second preset temperature, the step of controlling the hot-press welding head component to weld each welding point of a welding pad on the printed circuit board is triggered. And if the second temperature is not higher than the second preset temperature, not triggering the step of controlling the hot-press welding head component to weld all welding points of a welding pad on the printed circuit board, but triggering and detecting the temperature inside the hot-press welding head component to obtain the second temperature. Thus, before the thermal compression head part welds each welding point, the thermal compression head part reaches at least a second preset temperature.
In some embodiments, the first adjustment module 14 includes:
the calculation module is used for calculating the target contact area of the hot-press welding head part and each welding point according to the welding head temperature and the heat dissipation speed of each welding point;
the acquisition module is used for acquiring the current contact area between the thermal compression welding head part and each welding point;
and the second adjusting module is used for adjusting the contact area of the hot-press welding head part and each welding point to reach the corresponding target contact area according to each current contact area.
And calculating the target contact area of the hot-press welding head part and each welding point according to the temperature of the welding head and the heat dissipation speed of each welding point by presetting a scheme for calculating the contact area. And adjusting the contact area of the hot-press welding head part and the welding points according to the difference value between the target contact area and the current contact area, so that the contact area of the hot-press welding head part and each welding point reaches the corresponding target contact area.
As shown in fig. 3, an embodiment of the present invention further provides a computer device, where the computer device may be a server, and an internal structure of the computer device may be as shown in fig. 3. The computer device includes a processor, a memory, a network interface, and a database connected by a system bus. Wherein the computer designed processor is used to provide computational and control capabilities. The memory of the computer device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used for storing data such as models of the hot-press welding method. The network interface of the computer device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to implement a method of thermocompression bonding.
An embodiment of the present invention also provides a computer-readable storage medium having a computer program stored thereon, the computer program, when executed by a processor, implementing a method of thermocompression bonding.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, databases, or other media provided herein or used in embodiments of the present invention may include non-volatile and/or volatile memory. Non-volatile memory can include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), double-rate SDRAM (SSRSDRAM), Enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), Rambus Direct RAM (RDRAM), direct bus dynamic RAM (DRDRAM), and bus dynamic RAM (RDRAM).
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A method of thermocompression bonding, the method comprising:
in the welding process, detecting the temperature inside a hot-press welding head component to obtain the temperature of a welding head;
detecting the temperature of each welding point on the welding position to obtain a plurality of welding point temperatures;
according to a preset heat dissipation estimation algorithm, estimating the heat dissipation speed of each welding point according to the temperatures of the plurality of welding points to obtain the heat dissipation speed of each welding point;
and adjusting the contact area of the hot-press welding head part and each welding point according to the welding head temperature and the heat dissipation speed of each welding point.
2. The thermocompression bonding method of claim 1, wherein after said step of adjusting the contact area of said thermocompression head member with said each bonding point according to said bonding head temperature and the heat dissipation rate of said each bonding point, comprising:
detecting the current temperature of each welding point;
selecting the lowest temperature from the current temperatures of all the welding points to obtain a first temperature;
judging whether the first temperature is higher than a first preset temperature or not;
and if so, stopping heating the thermal compression head part, and moving the thermal compression head part away from the welding position to finish the welding task.
3. The thermocompression bonding method of claim 1, wherein the step of detecting the temperature inside the thermocompression bonding head part during the bonding process to obtain the bonding head temperature is preceded by:
receiving a welding task input by a user;
responding to the welding task, moving the thermal compression welding head part to a welding position and heating;
and controlling the hot-press welding head component to weld each welding point of a welding disc on the printed circuit board.
4. The thermocompression bonding method of claim 3 wherein after said step of moving a thermocompression head assembly to a bonding position and heating in response to said bonding task, before said step of controlling said thermocompression head assembly to bond pads on a printed circuit board to respective pads, comprising:
detecting the temperature inside the hot-press welding head component to obtain a second temperature;
judging whether the second temperature is higher than a second preset temperature or not;
if yes, triggering and controlling the hot-press welding head component to weld each welding point of a welding disc on the printed circuit board;
and if not, triggering and detecting the temperature inside the thermal pressure welding head component to obtain a second temperature.
5. The thermocompression bonding method of claim 1, wherein said step of adjusting the contact area between said thermocompression head member and said each bonding point according to said bonding head temperature and the heat dissipation rate of said each bonding point comprises:
calculating the target contact area of the hot-press welding head part and each welding point according to the welding head temperature and the heat dissipation speed of each welding point;
acquiring the current contact area between the thermal compression welding head part and each welding point;
and adjusting the contact area of the thermal compression welding head part and each welding point to reach the corresponding target contact area according to each current contact area.
6. A thermocompression bonding apparatus, the apparatus comprising:
the first detection module is used for detecting the temperature inside the hot-press welding head component in the welding process to obtain the temperature of the welding head;
the second detection module is used for detecting the temperature of each welding point on the welding position to obtain a plurality of welding point temperatures;
the estimation module is used for estimating the heat dissipation speed of each welding point according to the temperature of the plurality of welding points according to a preset heat dissipation estimation algorithm to obtain the heat dissipation speed of each welding point;
and the first adjusting module is used for adjusting the contact area between the hot-press welding head part and each welding point according to the welding head temperature and the heat dissipation speed of each welding point.
7. A thermocompression bonding apparatus as recited in claim 6, wherein the apparatus comprises:
the third detection module is used for detecting the current temperature of each welding point;
the selecting module is used for selecting the lowest temperature from the current temperatures of all the welding points to obtain a first temperature;
the first judging module is used for judging whether the first temperature is higher than a first preset temperature or not;
and the processing module is used for stopping heating the thermal compression head part and moving the thermal compression head part away from the welding position when the first temperature is higher than a first preset temperature.
8. A thermocompression bonding apparatus as recited in claim 6, wherein the apparatus comprises:
the receiving module is used for receiving a welding task input by a user;
the execution module is used for responding to the welding task, moving the thermal compression head component to a welding position and heating;
and the second control module is used for controlling the hot-press welding head component to weld all welding points of a welding pad on the printed circuit board.
9. A computer device comprising a memory and a processor, the memory storing a computer program, characterized in that the processor, when executing the computer program, implements the steps of the method of any of claims 1 to 5.
10. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method of any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| JP2000167686A (en) * | 1998-12-07 | 2000-06-20 | Mitsubishi Electric Corp | Weld quality judging device, and welding machine provided with the device |
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| CN107457497A (en) * | 2017-09-08 | 2017-12-12 | 宁波大红鹰学院 | A kind of multi-functional hot welding press welding method |
| CN110280862A (en) * | 2019-07-25 | 2019-09-27 | 昂纳信息技术（深圳）有限公司 | A kind of welding system and its method of device pin |
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| JPS57156880A (en) * | 1981-03-24 | 1982-09-28 | Sumitomo Metal Ind Ltd | Heat input controlling method of electric welded tube |
| JPS58151961A (en) * | 1982-03-05 | 1983-09-09 | Toyota Motor Corp | Controller of arc spot welding machine |
| EP0402830A1 (en) * | 1989-06-15 | 1990-12-19 | Siemens Nixdorf Informationssysteme Aktiengesellschaft | Method for controlling temperature course at soldering points during laser soldering |
| JP2000167686A (en) * | 1998-12-07 | 2000-06-20 | Mitsubishi Electric Corp | Weld quality judging device, and welding machine provided with the device |
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| CN111570963B (en) | 2022-09-02 |
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