CN106270899A - The welding material laser soldering device of various material composition and welding method - Google Patents

The welding material laser soldering device of various material composition and welding method Download PDF

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Publication number
CN106270899A
CN106270899A CN201610864961.6A CN201610864961A CN106270899A CN 106270899 A CN106270899 A CN 106270899A CN 201610864961 A CN201610864961 A CN 201610864961A CN 106270899 A CN106270899 A CN 106270899A
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China
Prior art keywords
welding
laser
temperature
pad
composition
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CN201610864961.6A
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Chinese (zh)
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CN106270899B (en
Inventor
檀正东
王海英
周旋
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SHENZHEN ANEWBEST ELECTRONIC TECHNOLOGY Co Ltd
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SHENZHEN ANEWBEST ELECTRONIC TECHNOLOGY Co Ltd
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Priority to CN201610864961.6A priority Critical patent/CN106270899B/en
Publication of CN106270899A publication Critical patent/CN106270899A/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/063—Solder feeding devices for wire feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laser Beam Processing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The present invention discloses the welding material laser soldering device of one kind of multiple materials composition, including laser instrument, controller and temperature sensor, the wherein preheating temperature of each pad of temperature sensor Real-time Collection, controller controls laser instrument and preheats each pad, sets up temperature field data model according to preheating temperature and controls the laser of output and temperature field data model characteristic matching.First being preheated by laser instrument elder generation butt welding point, gather pre-warmed weld point temperature simultaneously, the laser that described controller controls pad according to the temperature field data model that pre-warmed weld point temperature is set up irradiates.Owing to gathering weld point temperature in advance, and establish thermo parameters method data, weld according to the temperature field set up during welding, avoid the error that the theoretical field of welding temperature set up according only to the characteristic such as material conducts heat, heat capacity ratio occurs, cause occurring during actual welding that pcb board burns, punctures, damages electronics unit device or welding quality exists the phenomenons such as flaw, improve the reliability of laser welding.

Description

The welding material laser soldering device of various material composition and welding method
Technical field
The present invention relates to laser welding technology field, particularly relate to the welding material laser welding of one kind of multiple materials composition Device and welding method.
Background technology
During existing laser welding electronic devices and components, in order to ensure welding quality, first pass through various different materials heat conduction The characteristic such as performance, heat capacity ratio, sets up the analogue model of a field of welding temperature, and the model data further according to simulation controls source, laser apparatus Put and carry out weld job.The analog temperature field model set up by material behavior in theory is welded, and can preferably realize Automatic welding to different components, it is to avoid occur that laser irradiation time long causing burns, puncture pcb board or damage electronics unit device Part such as IC.But due to unlike material the weldment constituted in welding time, the characteristic such as actual heat conductivility, thermal capacitance with pass through mould Planning to build vertical models for temperature field and there is bigger error, the analog temperature field model set up according to material behavior controls laser instrument and enters Row welding is also easier occur that pcb board burns, punctures or damage electronics unit device phenomenon, or welding temperature does not reaches and wants Asking, occur that welding exists flaw, welding quality does not reaches requirement.
Summary of the invention
The technical problem that present invention mainly solves is to provide the welding material laser soldering device of one kind of multiple materials composition And welding method, the welding material laser soldering device of this various material composition can be avoided according to material conducts heat performance, thermal capacitance There is ground error in the analogue model of the field of welding temperature that the characteristics such as ratio are set up, causes occurring pcb board easily occur during actual welding Burn, puncture, damage electronics unit device or welding quality exists the phenomenons such as flaw, improve the reliability of laser welding quality.
In order to solve above-mentioned technical problem, the present invention provides the welding material Laser Welding tipping that one kind of multiple materials form Putting, the welding material laser soldering device of this various material composition includes laser instrument, also includes controller, controls laser instrument to often Individual pad preheats, and the welding device temperature at weld field model set up according to preheating temperature controls laser instrument output and temperature The laser of degree field model characteristic matching；
Temperature sampler, the preheating temperature of each pad of Real-time Collection.
Saying further, described Temperature sampler includes temperature sensor.
Saying further, described temperature sensor includes infrared temperature sensor.
Saying further, described laser soldering device also includes position, temperature sensor collection point and laser irradiating position Carry out the position adjusting mechanism of synchronization control.
Saying further, described position adjusting mechanism includes fixing seat and the base being rotationally connected with this fixing seat, solid Being provided with between reservation and base is controlled by the controller makes to fix the driver part that seat rotates, and described fixing seat is provided with laser instrument even The laser head connect and the temperature sensor bracket being provided with temperature sensor.
Saying further, described position adjusting mechanism also includes being located at fixing seat synchronization-moving Song Xi mechanism, and this send stannum Mechanism includes driving the stannum silk driver part of each conveying capacity of stannum silk and sending stannum head.
Saying further, described driver part includes motor.
Saying further, described Song Xi mechanism also includes that the position detected the stannum silk position sending welder here passes Sensor.
The present invention also provides for the welding material method for laser welding of one kind of multiple materials composition, this method for laser welding bag Include,
Pad preheats, and launches laser to each pad of device to be welded in advance, and butt welding contact preheats；
Set up the temperature field data model of pad, the preheating temperature of each pad of Real-time Collection, set up by each weldering The welding assembly temperature field data model of contact preheating temperature composition；
Laser welding, launches laser according to the characteristic of temperature field data model to each pad and welds, and according to The welding temperature of Real-time Collection controls laser.
Saying further, described preheating temperature and welding temperature are gathered by Temperature sampler.
Saying further, described Temperature sampler collection includes temperature sensor.
Saying further, described temperature sensor includes infrared temperature sensor.
Saying further, the pulse frequency of described welding laser, pulse width are mated with the temperature characterisitic produced during preheating.
Saying further, described method for laser welding also includes the welding temperature collection step of Real-time Collection temperature at weld Suddenly.
Saying further, described temperature sensor collection point is co-located with laser solder joint.
The welding material laser soldering device of various material of the present invention composition, including laser instrument, controller and temperature sensing Device, wherein, controller is used for controlling laser instrument and preheats each pad, the welding device weldering set up according to preheating temperature Contact temperature field model controls the laser of laser instrument output and models for temperature field characteristic matching；Temperature sampler, Real-time Collection is every The preheating temperature of individual pad.Before laser welding, laser instrument first the solder joint of each welding component is preheated, and by The temperature of solder joint when temperature sensor Real-time Collection preheats.Described controller is built according to each weld point temperature that preheats gathered Vertical temperature field data module controls laser instrument and welds irradiation time, the frequency etc. of laser instrument to each pad.Due in advance The thermo parameters method data acquiring the temperature of bond pad locations and set up, the temperature number of fields set up according to gathering in advance during welding According to welding, it is to avoid the theoretical welding temperature field model set up according only to characteristics such as material conducts heat performance, heat capacity ratios exists ground Error, occurs when causing actual welding easily occurring that pcb board burns, punctures, damages electronics unit device or welding quality exists flaw Etc. phenomenon, improve the reliability of laser welding quality.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing In having technology to describe, the required accompanying drawing used is briefly described, it should be apparent that, and the accompanying drawing in describing is the one of the present invention A little embodiments, to those skilled in the art, on the premise of not paying creative work, it is also possible to according to these Accompanying drawing obtains other accompanying drawings.
Fig. 1 is laser soldering device embodiment electrical principle block diagram.
Fig. 2 is position adjusting mechanism example structure schematic diagram.
Fig. 3 is the welding material method for laser welding schematic flow sheet of various material composition.
Below in conjunction with embodiment, and referring to the drawings, realization, functional characteristics and the advantage of the object of the invention is made furtherly Bright.
Detailed description of the invention
In order to make the purpose of invention, technical scheme and advantage clearer, attached below in conjunction with in the embodiment of the present invention Figure, is clearly and completely described the technical scheme in the embodiment of the present invention, it is clear that described embodiment is invention one Section Example rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not doing The every other embodiment obtained on the premise of going out creative work, broadly falls into the scope of protection of the invention.
As it is shown in figure 1, the present invention provides the welding material laser soldering device embodiment that one kind of multiple materials form.
The welding material laser soldering device of this various material composition includes: laser instrument 1, controller 3 and Temperature sampler 2, wherein said laser instrument 1 is used for producing welding laser and pre-thermal laser, and described Temperature sampler 2 is for Real-time Collection laser instrument The real time temperature that 1 welding laser and pre-thermal laser produce when irradiating solder joint, described controller 3 is for according to gathering each solder joint Temperature during preheating sets up welding device temperature at weld field data model, when welding, according to this temperature field data model control Laser instrument processed exports the laser mated with temperature field data model.
Specifically, described Temperature sampler 2 includes temperature sensor, and this temperature sensor temperature acquisition point is pre-with laser Focus is positioned at same point, it may be determined that the temperature accuracy of collection.This temperature sensor can include infrared temperature sensor, The infrared characteristic i.e. produced by the solder joint of preheating determines that its temperature, concrete components and parts can select existing product or technology.
Described controller 3 controls, according to the temperature field data model set up, the pulse that laser instrument 1 refers to send laser instrument Frequency, pulse width etc. are controlled, and are allowed to solder joint and can produce and mate with this temperature field data model.
Before laser welding, laser instrument first the solder joint of each welding component is preheated, and by temperature sensing The temperature of solder joint when device Real-time Collection preheats.Described controller is according to each temperature preheating weld point temperature foundation gathered Field data module controls laser instrument and welds irradiation time, the frequency etc. of laser instrument to each pad.Owing to acquiring weldering in advance The point temperature of position and the thermo parameters method data set up, the temperature field data set up according to gathering in advance during welding are welded Connect, it is to avoid the theoretical welding temperature field model set up according only to characteristics such as material conducts heat performance, heat capacity ratios exists ground error, causes Occur easily occurring that pcb board burns, punctures, damages electronics unit device or welding quality exists the phenomenons such as flaw during actual welding, carry The reliability of high laser welding quality.
In the present embodiment, during in order to ensure each solder joint is preheated and welded, temperature sensor 2 with preheat Point and pad are always positioned at same position, and this laser soldering device also includes position, temperature sensor 2 collection point and laser Irradiation position carries out the position adjusting mechanism of synchronization control, as shown in Figure 2.Described position adjusting mechanism includes: fixing seat 42 He The base 41 being rotationally connected with this fixing seat 42, being provided with between fixing seat 41 and base 42 is controlled by the controller makes fixing seat turn Dynamic driver part 40, this driver part includes motor, and it can be connected with base 42 directly or by drive disk assembly or mechanism, Making it rotate under the control of the controller, described fixing seat 41 is provided with the laser head 44 being connected with laser instrument and is provided with temperature acquisition The temperature sensor bracket of device.
In order to ensure that stannum silk can deliver to pad exactly when welding, described position adjusting mechanism also includes being located at fixing The synchronization-moving Song Xi mechanism 43 of seat, this Song Xi mechanism 43 includes the stannum silk driver part (accompanying drawing driving each conveying capacity of stannum silk Do not indicate) and send stannum head 45.In order to avoid in the case of there is Wuxi silk, butt welding contact welds, described Song Xi mechanism also wraps Include the position sensor (accompanying drawing does not indicates) that the stannum silk position sending welder here is detected, when position sensor does not detects During to stannum silk, controller controls laser instrument and quits work.
As it is shown on figure 3, the present invention also provides for the welding material method for laser welding of one kind of multiple materials composition, this Laser Welding The method of connecing includes,
S10 step, i.e. pad preheating, launch laser to each pad of device to be welded in advance, butt welding contact enters Row preheats；
S11 step, i.e. sets up the temperature field data model of pad, the preheating temperature of each pad of Real-time Collection, builds The vertical welding assembly temperature field data model being made up of each pad preheating temperature；
S12 step, i.e. laser welding, launch laser according to the characteristic of temperature field data model to each pad and weld Connect, and control laser according to the welding temperature of Real-time Collection.
Specifically, above-described embodiment structure, i.e. laser soldering device is used to include: laser instrument 1, controller 3 and temperature Harvester 2, wherein said laser instrument 1 is used for producing welding laser and pre-thermal laser, and described Temperature sampler 2 is for Real-time Collection The real time temperature that laser instrument 1 produces when welding laser and pre-thermal laser irradiation solder joint, described controller 3 is for each according to gathering The temperature during preheating of solder joint sets up welding device temperature at weld field data model, when welding, according to these temperature field data Model cootrol laser instrument exports the laser mated with temperature field data model.
Specifically, described Temperature sampler 2 includes temperature sensor, and this temperature sensor temperature acquisition point is pre-with laser Focus is positioned at same point, it may be determined that the temperature accuracy of collection.This temperature sensor can include infrared temperature sensor, The infrared characteristic i.e. produced by the solder joint of preheating determines that its temperature, concrete components and parts can select existing product or technology.
Described controller 3 controls, according to the temperature field data model set up, the pulse that laser instrument 1 refers to send laser instrument Frequency, pulse width etc. are controlled, and are allowed to solder joint and can produce and mate with this temperature field data model.
Before welding, first controlled laser instrument 1 by controller 3 to send laser to pad and preheat, simultaneously by temperature Harvester 2 this pad of Real-time Collection preheating temperature；Use same method that each solder joint needing welding is preheated, and Gathering preheating temperature, controller sets up temperature field data model during welding according to each weld point temperature gathered, and is welding When connecing, controller control the data such as the pulse frequency of laser instrument, pulse width according to the temperature field data model set up, make to swash The parameter of light device output is welded with setting up temperature field data model coupling laser.Owing to acquiring the temperature of bond pad locations in advance The thermo parameters method data spent and set up, the temperature field data set up according to gathering in advance during welding are welded, it is to avoid only There is ground error according to the theoretical welding temperature field model that the characteristics such as material conducts heat performance, heat capacity ratio are set up, cause actual welding Time occur easily occurring that pcb board burns, punctures, damages electronics unit device or welding quality exists the phenomenons such as flaw, raising Laser Welding Connect the reliability of quality.
In the present embodiment, during in order to ensure each solder joint is preheated and welded, temperature sensor 2 with preheat Point and pad are always positioned at same position, and this laser soldering device also includes position, temperature sensor 2 collection point and laser Irradiation position carries out the position adjusting mechanism of synchronization control, as shown in Figure 2.Described position adjusting mechanism includes: fixing seat 42 He The base 41 being rotationally connected with this fixing seat 42, being provided with between fixing seat 41 and base 42 is controlled by the controller makes fixing seat turn Dynamic driver part 40, this driver part includes motor, and it can be connected with base 42 directly or by drive disk assembly or mechanism, Making it rotate under the control of the controller, described fixing seat 41 is provided with the laser head 44 being connected with laser instrument and is provided with temperature acquisition The temperature sensor bracket of device.
In order to ensure that stannum silk can deliver to pad exactly when welding, described position adjusting mechanism also includes being located at fixing The synchronization-moving Song Xi mechanism 43 of seat, this Song Xi mechanism 43 includes the stannum silk driver part (accompanying drawing driving each conveying capacity of stannum silk Do not indicate) and send stannum head 45.In order to avoid in the case of there is Wuxi silk, butt welding contact welds, described Song Xi mechanism also wraps Include the position sensor (accompanying drawing does not indicates) that the stannum silk position sending welder here is detected, when position sensor does not detects During to stannum silk, controller controls laser instrument and quits work.
In the present embodiment, described method for laser welding also includes the welding temperature collection step of Real-time Collection temperature at weld Suddenly, i.e. gather the temperature of solder joint in welding, it is to avoid welding temperature is too high burns out PCB simultaneously.
Above example only in order to technical scheme to be described, is not intended to limit；Although with reference to previous embodiment The present invention is described in detail, it will be understood by those within the art that: it still can be to aforementioned each enforcement Technical scheme described in example is modified, or wherein portion of techniques feature carries out equivalent, and these are revised or replace Change, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.

Claims (10)

1. the welding material laser soldering device of various material composition, including laser instrument, it is characterised in that also include,
Controller, controls laser instrument and preheats each pad, the welding device pad temperature set up according to preheating temperature Degree field data model cootrol laser instrument output and the laser of models for temperature field characteristic matching；
Temperature sampler, the preheating temperature of each pad of Real-time Collection.
The welding material laser soldering device of various material the most according to claim 1 composition, it is characterised in that: described temperature Degree harvester includes infrared temperature sensor.
The welding material laser soldering device of various material the most according to claim 1 and 2 composition, it is characterised in that: institute State laser soldering device and also include position, temperature sensor collection point and laser irradiating position are carried out the position tune of synchronization control Complete machine structure.
The welding material laser soldering device of various material the most according to claim 3 composition, it is characterised in that: institute's rheme Put guiding mechanism and include fixing seat and the base being rotationally connected with this fixing seat, between fixing seat and base, be provided with controlled device Controlling the driver part making fixing seat rotate, described fixing seat is provided with the laser head being connected with laser instrument and is provided with temperature sensor Temperature sensor bracket.
The welding material laser soldering device of various material the most according to claim 4 composition, it is characterised in that: institute's rheme Putting guiding mechanism and also include being located at fixing seat synchronization-moving Song Xi mechanism, this Song Xi mechanism includes driving each conveying capacity of stannum silk Stannum silk driver part and send stannum head.
The welding material laser soldering device of various material the most according to claim 4 composition, it is characterised in that drive described in: Dynamic component includes motor.
The welding material laser soldering device of various material the most according to claim 5 composition, it is characterised in that send described in: Stannum mechanism also includes the position sensor that the stannum silk position sending welder here is detected.
8. the welding material method for laser welding of various material composition, this method for laser welding includes,
Pad preheats, and launches laser to each pad of device to be welded in advance, and butt welding contact preheats；
Set up the temperature field data model of pad, the preheating temperature of each pad of Real-time Collection, set up by each pad The welding assembly temperature field data model of preheating temperature composition；
Laser welding, launches laser according to the characteristic of temperature field data model to each pad and welds, and according in real time The temperature at weld gathered controls laser.
The welding material method for laser welding of various material the most according to claim 8 composition, it is characterised in that: described sharp Photocoagulation method also includes the welding temperature acquisition step of Real-time Collection temperature at weld.
The welding material method for laser welding of various material the most according to claim 9 composition, it is characterised in that: described Temperature sensor collection point is co-located with laser solder joint.
CN201610864961.6A 2016-09-28 2016-09-28 The welding material laser soldering device and welding method of various material composition Active CN106270899B (en)

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Cited By (6)

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Publication number Priority date Publication date Assignee Title
CN108873985A (en) * 2018-08-06 2018-11-23 武汉博联特科技有限公司 A kind of temprature control method and system of laser soldering
CN111570963A (en) * 2020-04-14 2020-08-25 深圳欣旺达智能科技有限公司 Hot-press welding method and device, computer equipment and storage medium
CN112710490A (en) * 2020-12-21 2021-04-27 歌尔光学科技有限公司 Performance detection method for laser spraying welding machine
CN114453745A (en) * 2022-02-15 2022-05-10 佛山金洽智能装备有限公司 Preheating laser with double-ring structure
CN114850667A (en) * 2021-02-05 2022-08-05 东莞市中麒光电技术有限公司 Laser welding method and LED display module
WO2023138060A1 (en) * 2022-01-20 2023-07-27 成都熊谷加世电器有限公司 Double-track welding system

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CN104942431A (en) * 2015-06-17 2015-09-30 王金 Laser processing device and process for laser hot melt adhesive quick adhesion thereof
CN105758820A (en) * 2016-02-29 2016-07-13 陕西理工学院 Test device and test method for material laser absorptivity
CN206662459U (en) * 2016-09-28 2017-11-24 深圳市艾贝特电子科技有限公司 The welding material laser soldering device of various material composition

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CN102352509A (en) * 2011-11-17 2012-02-15 铜陵学院 Method for preparing nano-thick ceramic coating by laser multilayer cladding
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108873985A (en) * 2018-08-06 2018-11-23 武汉博联特科技有限公司 A kind of temprature control method and system of laser soldering
CN111570963A (en) * 2020-04-14 2020-08-25 深圳欣旺达智能科技有限公司 Hot-press welding method and device, computer equipment and storage medium
CN112710490A (en) * 2020-12-21 2021-04-27 歌尔光学科技有限公司 Performance detection method for laser spraying welding machine
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CN114850667A (en) * 2021-02-05 2022-08-05 东莞市中麒光电技术有限公司 Laser welding method and LED display module
WO2023138060A1 (en) * 2022-01-20 2023-07-27 成都熊谷加世电器有限公司 Double-track welding system
CN114453745A (en) * 2022-02-15 2022-05-10 佛山金洽智能装备有限公司 Preheating laser with double-ring structure
CN114453745B (en) * 2022-02-15 2024-01-26 佛山金洽智能装备有限公司 Preheating laser with double-ring structure

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