CN108873985A - A kind of temprature control method and system of laser soldering - Google Patents
A kind of temprature control method and system of laser soldering Download PDFInfo
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- CN108873985A CN108873985A CN201810884994.6A CN201810884994A CN108873985A CN 108873985 A CN108873985 A CN 108873985A CN 201810884994 A CN201810884994 A CN 201810884994A CN 108873985 A CN108873985 A CN 108873985A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/30—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
- G05D23/32—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature with provision for adjustment of the effect of the auxiliary heating device, e.g. a function of time
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
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- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of temprature control method of laser soldering and systems, system includes welding platform, it include the controller of the sensing device for measuring solder joint welding temperature and the mathematical model for storing welding temperature and control amount in the welding platform, wherein, welding temperature is sent to controller by sensing device, and controller calculates control amount according to received welding temperature, and the control amount is sent into executing agency, act on controlled device；The present invention is on the basis of traditional PID control, introduce fuzzy control method, and the mathematical model of the solder joint welding temperature and laser power based on foundation has carried out feedforward compensation, the error between solder joint welding temperature and target temperature can quickly be eliminated, improve solder joint welding temperature control precision, the quality of welding product is improved, is suitble to be widely used in laser soldering welding process.
Description
Technical field
The present invention relates to laser soldering control field, the temprature control method of specifically a kind of laser soldering and
System.
Background technique
Laser soldering is to heat the soldering tech that solder melts by heat source of laser.Laser soldering is mainly characterized by utilizing
The high-energy density of laser realizes that part or tiny area are quickly heated and completes brazing process.Integrated electricity is heated using laser emission
Pass line transmits heat to substrate by brazing flux or preseting solder.When temperature reaches brazing temperature, brazing flux and solder melt,
Substrate and lead soak to form connection.Laser beam converges on solder, and solder temperature excessively high may lead to melt too fast, and base material
Temperature deficiency prevents solder from soaking base material very well, influences filling effect, seam appearance is deteriorated；Laser beam converges on base material,
Solder temperature is possible to too low, and solder fluidity or activity is caused to reduce, and base material may overheat thawing, cause solder directly into
Enter molten bath and form fusion welding, the brittlement phase of formation also influences brazed seam performance；Can solder joint welding temperature effectively track target temperature
Degree butt welding practice midwifery quality influence it is most important.Therefore, when in welding process there are when welding temperature deviation, need to be using control
Method reduces or eliminates this deviation, i.e. error between welding temperature and target temperature.In view of welding temperature error butt welding
The influence for quality of practicing midwifery, the control method for quickly reducing or eliminating welding temperature error become particularly important.
The control of laser welding temperature is a sufficiently complex technical problem, and traditional laser welding temprature control method is
Simple closed loop PID control, but due to laser energy density height, the scope limitation of infrared thermometer can not be detected from environment temperature
Spend the temperature rising to 100 DEG C；The influence heated when evaporating of solder flux flux is so that from 100 DEG C to melt temperature (about 220 DEG C)
Measurement inaccuracy, therefore this control mode will appear the violent oscillation of temperature control and cause to dissipate, and cannot reach ideal control
Effect, so that welding product is second-rate.The key of laser soldering is reasonably to control laser power distribution.
Based on this, for the problems in above-mentioned status, swashing for temperature control precision can be improved the invention proposes a kind of
The temprature control method and system of light solder.
Summary of the invention
In order to solve the problems, such as that existing laser welding control technology temperature control precision is poor, the present invention provides a kind of laser
The temprature control method and system of solder, improve the temperature control precision in laser welding technology.
The technical solution adopted in the present invention is as follows：
A kind of temprature control method of laser soldering, includes the following steps：
S1, welding material is put into place to be welded, by laser beam focus in solder joint, inputs welding parameter and target temperature,
Carry out the welding of laser soldering soldering paste；
When S2, welding, butt welding point carries out temperature measurement and temperature measurement signal is transmitted to fuzzy control unit, Fuzzy Control
Unit processed obtains fuzzy control quantity according to error between solder joint welding temperature and target temperature, and feedforward control unit is according to target temperature
Feedforward control amount is calculated in degree, and fuzzy control quantity is added to obtain complex controll amount with feedforward control amount, which is sent
Enter executing agency, act on controlled device, eliminates temperature error；
S3, step S2 is repeated, until welding process terminates.
The present invention further improvement lies in that, further include adjustment laser before solder joint by laser beam focus in the step S1
Light source position focuses on semiconductor laser beam on solder joint, adjusts laser facula size.
The present invention further improvement lies in that, in the step S2, using infrared thermometer butt welding point carry out temperature measurement.
The present invention further improvement lies in that, in step S2, the mathematical model of solder joint welding temperature and laser power is：
Qinput=Qcd+Qcv+Qheat,
Wherein, the energy Q that weldering device absorbs is heldinput=∫ WKlaserDt, the energy Q of heat conduction lossescd=∫
KnnKshapeSTdt, the energy Q of cross-ventilation heat transfercv=hf(T-TB) S, the energy that pad and soldering paste rise
W is laser power, KlaserFor the laser power proportion of goods damageds, KnnFor the soldering paste coefficient of heat conduction, KshapeFor soldering paste heat transfer
Geometrical factor, S are bonding pad area, and T is welding temperature, hfFor advection heat coefficient, TBFor environment temperature, m (i) is the matter of material i
Amount, C (i) are the specific heat capacity of material i, and N is material number.
Another object of the present invention, a kind of temperature control system of laser soldering, including welding platform, the welding are flat
It include the sensing device for measuring solder joint welding temperature and the mathematical model for storing welding temperature and control amount on platform
Controller, wherein welding temperature is sent to controller by sensing device, and controller is calculated according to received welding temperature
Control amount, and the control amount is sent into executing agency, act on controlled device.
The present invention further improvement lies in that, the control amount be laser power.
The present invention further improvement lies in that, the sensing device be infrared thermometer.
The present invention further improvement lies in that, the mathematical model in the controller is：
Qinput=Qcd+Qcv+Qheat,
Wherein, the energy Q that weldering device absorbs is heldinput=∫ WKlaserDt, the energy Q of heat conduction lossescd=∫
KnnKshapeSTdt, the energy Q of cross-ventilation heat transfercv=hf(T-TB) S, the energy that pad and soldering paste rise
W is laser power, KlaserFor the laser power proportion of goods damageds, KnnFor the soldering paste coefficient of heat conduction, KshapeFor soldering paste heat transfer
Geometrical factor, S are bonding pad area, and T is welding temperature, hfFor advection heat coefficient, TBFor environment temperature, m (i) is the matter of material i
Amount, C (i) are the specific heat capacity of material i, and N is material number.
Compared with prior art, what the present invention obtained has the beneficial effect that：
The present invention introduces fuzzy control method on the basis of traditional PID control, and the welding of the solder joint based on foundation
The mathematical model of temperature and laser power has carried out feedforward compensation, can quickly eliminate between solder joint welding temperature and target temperature
Error improves solder joint welding temperature control precision, improves the quality of welding product, be suitble in laser soldering welding process
In be widely used.
Detailed description of the invention
Fig. 1 is the flow chart of temprature control method in the present invention；
Fig. 2 is the system flow block diagram of laser welding Temperature Fuzzy Control method in the present invention；
Fig. 3 is that temperature, the filtering of measurement temperature and model output temperature are measured under three stage power of open loop in the embodiment of the present invention
Spend curve comparison figure；
Fig. 4 is that temperature, the filtering of measurement temperature and model output temperature are measured under open loop two stages power in the embodiment of the present invention
Spend curve comparison figure；
Fig. 5 is temperature error curve under fuzzy-adaptation PID control closed-loop simulation in the embodiment of the present invention；
Fig. 6 is in the embodiment of the present invention, and soldering paste mass change is on temperature error influence pair under fuzzy-adaptation PID control closed-loop simulation
Than figure；
Fig. 7 is in the embodiment of the present invention, and the variation of soldering paste heat transfer geometrical factor is to temperature under fuzzy-adaptation PID control closed-loop simulation
Error influences comparison diagram；
Fig. 8 is in the embodiment of the present invention, and the variation of the laser power proportion of goods damageds is to temperature error under fuzzy-adaptation PID control closed-loop simulation
Influence comparison diagram；
Fig. 9 is in the embodiment of the present invention, and the laser power proportion of goods damageds and soldering paste heat transfer are several under fuzzy-adaptation PID control closed-loop simulation
What coefficient changes jointly influences comparison diagram to temperature error.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
As shown in Figures 1 to 9, a kind of temprature control method of laser soldering, includes the following steps：
S1, welding material is put into place to be welded, by laser beam focus in solder joint, inputs welding parameter and target temperature,
Carry out the welding of laser soldering soldering paste；
When S2, welding, butt welding point carries out temperature measurement and temperature measurement signal is transmitted to fuzzy control unit, Fuzzy Control
Unit processed obtains fuzzy control quantity according to error between solder joint welding temperature and target temperature, and feedforward control unit is according to target temperature
Feedforward control amount is calculated in degree, and fuzzy control quantity is added to obtain complex controll amount with feedforward control amount, which is sent
Enter executing agency, act on controlled device, eliminates temperature error；
S3, step S2 is repeated, until welding process terminates.
When it is implemented, further include adjustment laser light source position before solder joint by laser beam focus in the step S1, it will
Semiconductor laser beam focuses on solder joint, adjusts laser facula size.
When it is implemented, carrying out temperature measurement using infrared thermometer butt welding point in the step S2.
When it is implemented, in step S2, the mathematical model of solder joint welding temperature and laser power is：
Qinput=Qcd+Qcv+Qheat,
Wherein, the energy Q that weldering device absorbs is heldinput=∫ WKlaserDt, the energy Q of heat conduction lossescd=∫
KnnKshapeSTdt, the energy Q of cross-ventilation heat transfercv=hf(T-TB) S, the energy that pad and soldering paste rise
W is laser power, KlaserFor the laser power proportion of goods damageds, KnnFor the soldering paste coefficient of heat conduction, KshapeFor soldering paste heat transfer
Geometrical factor, S are bonding pad area, and T is welding temperature, hfFor advection heat coefficient, TBFor environment temperature, m (i) is the matter of material i
Amount, C (i) are the specific heat capacity of material i, and N is material number.
Another object of the present invention, a kind of temperature control system of laser soldering, including welding platform, the welding are flat
It include the sensing device for measuring solder joint welding temperature and the mathematical model for storing welding temperature and control amount on platform
Controller, wherein welding temperature is sent to controller by sensing device, and controller is calculated according to received welding temperature
Control amount, and the control amount is sent into executing agency, act on controlled device.
When it is implemented, the control amount is laser power.
When it is implemented, the sensing device is infrared thermometer.
When it is implemented, the mathematical model in the controller is：
Qinput=Qcd+Qcv+Qheat,
Wherein, the energy Q that weldering device absorbs is heldinput=∫ WKlaserDt, the energy Q of heat conduction lossescd=∫
KnnKshapeSTdt, the energy Q of cross-ventilation heat transfercv=hf(T-TB) S, the energy that pad and soldering paste rise
W is laser power, KlaserFor the laser power proportion of goods damageds, KnnFor the soldering paste coefficient of heat conduction, KshapeFor soldering paste heat transfer
Geometrical factor, S are bonding pad area, and T is welding temperature, hfFor advection heat coefficient, TBFor environment temperature, m (i) is the matter of material i
Amount, C (i) are the specific heat capacity of material i, and N is material number.
Solder joint welding temperature control method of the invention according to thermodynamical equilibrium equation and law of conservation of energy obtain control amount with
The mathematical model of relationship between the mathematical model of solder joint welding temperature, i.e. laser power and solder joint welding temperature, and pass through mathematics
Model adjusts laser power to change the error of the solder joint welding temperature in laser beam welding.The mathematical modulo described below
The derivation process of type：
In thermodynamical model, it is assumed that output and input the dynamic process of description system.Input is the controllable of laser generation
Energy, and exporting is heat consumed by weld, this portion of energy include energy and heat transfer needed for temperature at weld changes,
The energy losses such as thermal convection and heat radiation.
Fourier law：In conduction process, by giving the heat conduction amount of uniform section in the unit time, it is proportional to perpendicular to this
Rate of temperature change and area of section in cross-wise direction, and the direction of heat transfer is then raised contrary with temperature.
According to Fourier law, in infinitesimal time dt, medium generates heat dQ by infinitesimal section dScd
With the normal direction derivative of medium temperatureIt is directly proportional, therefore：
Wherein, k (x, y, z) is the medium heat conduction coefficient of point (x, y, z), and negative sign indicates that heat passes to low temperature from high-temperature area
Region.
For any closed surface f, in medium D, it is denoted as Ω by the region on boundary of f, then this period from t1 to t2
The heat of interior transmitting is：
Further deriving can obtain：
It is assumed that pad is uniform, and width is x and length y, can be approximately by partial differential equation and its geometry
Relevant factor is as follows：
Wherein, KnnFor the coefficient of heat conduction, KshapeFor heat transfer geometrical factor, S is bonding pad area.
When soldering paste is heated, by the shape of formation rule, the geometrical property of soldering paste change in the welding process less, because
This can be assumed KshapeFor constant.
When a large amount of flowings of fluid (gas or liquid) carry heat together with fluid, it may occur that thermal convection.To flowing through
Journey transmits heat also by diffusion part：
Qcv=hf(T-TB) S,
Wherein, hfFor advection heat coefficient, TBFor environment temperature.
Heat radiation is generated by vacuum or any transparent medium (solid or liquid), the energy transmission of photon in electromagnetic wave：
Wherein, QraFor heat flow rate, ε is black body radiation, σ=5.67 × 10-8W/(m2K4) it is that Shi Difen-Boltzmann is normal
Number, A1For the area of radiating surface 1, F12The form factor on surface 2, T are arrived for radiating surface 11And T2It is the absolute of radiating surface 1 and surface 2
Temperature (T1=473K, T2=273K), therefore
Because of Qra<<1, thus it is negligible.
Heat (including thermal energy) is mobile by the physical transfer of hot object or cold object from one place to another
And generate.Specific heat is unit mass heat needed for temperature is improved 1 degree Celsius.The variation of heat and temperature can usually indicate
For：
Qheat=Cm Δ T,
Wherein, C is specific heat capacity, and m is the quality of substance, the thus variation of process temperature.Phase transformation is negligible, because
The heat for adding or removing in phase transition process will not change temperature.These relationships are applied in laser welding system, temperature
It can be expressed as with the relationship of power：
Wherein W is laser power, KlaserFor the laser power proportion of goods damageds, KnnFor the soldering paste coefficient of heat conduction, KshapeFor soldering paste heat
Geometrical factor is conducted, S is bonding pad area, and T is welding temperature, hfFor advection heat coefficient, TBFor environment temperature, m (i) is material i's
Quality, C (i) are the specific heat capacity of material i, and N is material number.
Actual welding process can be divided into 3 stages, preheating section, welding section, soaking zone；
1, preheating section, (T when soldering paste is unfused<Tmelt), laser irradiation rises soldering paste and pin temperature at this time, energy
Conservation equation is as follows：
∫WKlaserDt=∫ KnnKshapeSTdt+hf(T-TB)S+mpadCpad(T-TB)+mpasteC1(T-TB),
Differential is carried out to above formula to obtain：
Wherein, mpadFor pad quality, CpadFor pad specific heat capacity, mpasteFor soldering paste quality, C1For soldering paste preheating section specific heat
Hold；
2, welding section, after solder paste melts, and (T when welding temperature is not up near peak temperaturemelt<T<Ttop), swash at this time
Light irradiates so that soldering paste changes with pin temperature, formation alloy, and energy conservation equation is as follows：
∫WKlaserDt=∫ KnnKshapeSTdt+hf(T-Tmelt)S+mpadCpad(T-Tmelt)+mpasteC2(T-Tmelt),
Differential is carried out to above formula to obtain：
Wherein, mpadFor pad quality, CpadFor pad specific heat capacity, mpasteFor soldering paste quality, C2For soldering paste welding section specific heat
Hold；
3, soaking zone, welding temperature reach near peak value, and laser irradiation makes soldering paste change with pin temperature at this time,
Energy conservation equation is as follows：
∫WKlaserDt=∫ KnnKshapeSTdt+hf(T-Ttop)S+mpadCpad(T-Ttop)+mpasteC3(T-Ttop),
Differential is carried out to above formula to obtain：
Wherein, mpadFor pad quality, CpadFor pad specific heat capacity, mpasteFor soldering paste quality, C3For soldering paste welding section specific heat
Hold.
Temprature control method in laser soldering welding process of the invention draws on the basis of traditional PID control
Enter fuzzy control method, and the mathematical model of solder joint welding temperature and laser power based on foundation has carried out feedforward compensation, energy
The error between solder joint welding temperature and target temperature is quickly eliminated, solder joint welding temperature control precision is improved, improves weldering
It practices midwifery the quality of product, is suitble to be widely used in laser soldering welding process.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (8)
1. a kind of temprature control method of laser soldering, which is characterized in that include the following steps：
S1, welding material is put into place to be welded, by laser beam focus in solder joint, inputs welding parameter and target temperature, carries out
The welding of laser soldering soldering paste；
When S2, welding, butt welding point carries out temperature measurement and temperature measurement signal is transmitted to fuzzy control unit, fuzzy control list
Member obtains fuzzy control quantity according to error between solder joint welding temperature and target temperature, and feedforward control unit is according to target temperature meter
Calculation obtains feedforward control amount, and fuzzy control quantity is added to obtain complex controll amount with feedforward control amount, and control amount feeding is held
Row mechanism acts on controlled device, eliminates temperature error；
S3, step S2 is repeated, until welding process terminates.
2. a kind of temprature control method of laser soldering according to claim 1, it is characterised in that：The step S1
In, further include adjustment laser light source position before solder joint by laser beam focus, semiconductor laser beam is focused on solder joint, is adjusted
Laser facula size.
3. a kind of temprature control method of laser soldering according to claim 1, it is characterised in that：The step S2
In, temperature measurement is carried out using infrared thermometer butt welding point.
4. a kind of temprature control method of laser soldering according to claim 1, it is characterised in that：In step S2, weldering
The mathematical model of spot welding jointing temp and laser power is：
Qinput=Qcd+Qcv+Qheat,
Wherein, the energy Q that weldering device absorbs is heldinput=∫ WKlaserDt, the energy Q of heat conduction lossescd=∫ KnnKshapeSTdt, it is empty
The energy Q of gas convective heat transfercv=hf(T-TB) S, the energy that pad and soldering paste rise
W is laser power, KlaserFor the laser power proportion of goods damageds, KnnFor the soldering paste coefficient of heat conduction, KshapeFor soldering paste heat transfer geometry
Coefficient, S are bonding pad area, and T is welding temperature, hfFor advection heat coefficient, TBFor environment temperature, m (i) is the quality of material i, C
(i) specific heat capacity for being material i, N are material number.
5. a kind of temperature control system of laser soldering, which is characterized in that including welding platform, include in the welding platform
For measuring the sensing device of solder joint welding temperature and the controller of the mathematical model for storing welding temperature and control amount,
In, welding temperature is sent to controller by sensing device, and controller calculates control amount according to received welding temperature, and
The control amount is sent into executing agency, acts on controlled device.
6. a kind of temperature control system of laser soldering according to claim 5, it is characterised in that：The control amount is
Laser power.
7. a kind of temperature control system of laser soldering according to claim 5, it is characterised in that：The sensing device
For infrared thermometer.
8. a kind of temperature control system of laser soldering according to claim 5, which is characterized in that in the controller
Mathematical model be：
Qinput=Qcd+Qcv+Qheat,
Wherein, the energy Q that weldering device absorbs is heldinput=∫ WKlaserDt, the energy Q of heat conduction lossescd=∫ KnnKshapeSTdt, it is empty
The energy Q of gas convective heat transfercv=hf(T-TB) S, the energy that pad and soldering paste rise
W is laser power, KlaserFor the laser power proportion of goods damageds, KnnFor the soldering paste coefficient of heat conduction, KshapeFor soldering paste heat transfer geometry
Coefficient, S are bonding pad area, and T is welding temperature, hfFor advection heat coefficient, TBFor environment temperature, m (i) is the quality of material i, C
(i) specific heat capacity for being material i, N are material number.
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