CN202555932U - Laser soft soldering device - Google Patents
Laser soft soldering device Download PDFInfo
- Publication number
- CN202555932U CN202555932U CN2012200628318U CN201220062831U CN202555932U CN 202555932 U CN202555932 U CN 202555932U CN 2012200628318 U CN2012200628318 U CN 2012200628318U CN 201220062831 U CN201220062831 U CN 201220062831U CN 202555932 U CN202555932 U CN 202555932U
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- soldering
- rectilinear motion
- motion module
- tin
- laser
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Abstract
The utility model discloses a laser soft soldering device characterized in that: a base arranged at a bottom and a soldering platform are adopted, a combination linear motion module is arranged on the soldering platform, a square bearing plate is in bolt joint on the combination linear motion module, an oscillating device for placing a soldering circuit board is arranged on the bearing plate; the soldering platform is also provided with a support, an installing plate is vertically arranged on the support, a laser focusing mirror and a tin export device used for performing laser soldering for the soldering circuit board, a tin delivering and breaking device and a positioning device are respectively installed on the installing plate; and a manual lifting device used for controlling the installing plate to move up and down is arranged at an upper end of the support. The laser soft soldering device of the utility model can be well suitable for use in occasions in which a space is limited or a reflow soldering or a wave soldering can not be performed due to thermosensitive elements, thereby raising soldering quality, in addition, the laser soft soldering device automatically controls soldering to the soldering circuit board through a control system, thereby greatly raising soldering efficiency.
Description
Technical field
The utility model relates to the laser soldering field, in particular a kind of laser soldering device that is used for welding automatically soldered circuit board.
Background technology
Along with development of electronic technology; People are also increasingly high to the requirement of solder technology; Owing to the microminiaturization of electronic element, particularly can't weld or the reason temperature-sensitive element can't Reflow Soldering or the occasion of wave-soldering because of limited space; Traditional hand welding meeting causes certain heat affecting to the components and parts body, and is therefore more and more inapplicable.
Simultaneously, along with the development of semiconductor laser, the laser soldering technology is arisen at the historic moment, but the automatic control technology of present laser soldering is also not overripened, and can not control in real time welding.
Therefore, prior art awaits to improve and development.
The utility model content
Deficiency in view of above-mentioned prior art; The purpose of the utility model is to provide a kind of laser soldering device that is used for welding automatically soldered circuit board, can't weld or lure heat-sensitive element with the welding of solution traditional-handwork because of limited space and can't use the problem of Reflow Soldering or wave-soldering.
The technical scheme of the utility model is following:
A kind of laser soldering device; As shown in Figure 1, comprise a base (10), go up the jig (11) that is provided with at said base (10); It is characterized in that; Said jig (11) is provided with a combination rectilinear motion module, on said combination rectilinear motion module, is bolted with a square bearing plate (14), and the oscillation device (15) of a placement soldered circuit board is installed on said loading plate (14); On said jig (11), also be provided with a support (20); On said support (20), be vertically installed with an installing plate (30); On said installing plate (30), be separately installed with the laser condensing lens (31) that is used for the laser weld soldered circuit board and go out tin device (32), and send broken tin device (34) of tin and positioner (33); Be equipped with one in the upper end of said support (20) and be used to control the manual hoisting device (21) that installing plate moves up and down.
Described laser soldering device; Wherein, Said combination rectilinear motion module comprises setting up and down and orthogonal rectilinear motion module (13) and the following rectilinear motion module (12) gone up; Said rectilinear motion module (12) down is fixed on the said jig (11), and the said rectilinear motion module (13) of going up is connected with said rectilinear motion module (12) chute down.
Described laser soldering device wherein, is evenly distributed with the screwed hole of several said oscillation devices that are used to be spirally connected on the said loading plate.
Described laser soldering device, wherein, said loading plate is connected with the said rectilinear motion module screw of going up.
Described laser soldering device, wherein, said go up the rectilinear motion module at the rectilinear motion of the rectilinear motion on the said rectilinear motion module down and said loading plate rectilinear motion module on said by motor-driven.
Described laser soldering device wherein, is provided with the electromagnetic viscosimeter structure in the said oscillation device.
Described laser soldering device, wherein, said manual hoisting device is equipped with the runner of the band handle that is used for hand rotation, and on said support, is carved with scale.
Described laser soldering device; Wherein, The said top of the broken tin device of tin of sending is equipped with the fixed axis that is used to place scolding tin; And be provided with through motor rotating band trend is said at the said side that gives the broken tin device of tin and go out a circular saw teeth cutter blade and the rolling friction wheel that the tin device is carried solder stick, the spacing of said circular saw teeth cutter blade and said rolling friction wheel is less than the diameter of solder stick.
Described laser soldering device, wherein, said positioner is provided with camera, through said camera soldered circuit board is carried out position correction.
Described laser soldering device, wherein, four bottom of said base are respectively arranged with a rolling castor and level adjuster cup.
Described laser soldering device, wherein, said device is controlled by the control system automatically.
The laser soldering device that the utility model provided; Owing to adopted the base and the jig that are arranged on the bottom; Said jig is provided with a combination rectilinear motion module; On said combination rectilinear motion module, be bolted with a square bearing plate, the oscillation device of a placement soldered circuit board is installed on said loading plate; On said jig, also be provided with a support; On said support, be vertically installed with an installing plate; On said installing plate, be separately installed with the laser condensing lens that is used for the laser weld soldered circuit board and go out the tin device, and send broken tin device of tin and camera positioner; Be equipped with one in the upper end of said support and be used to control the manual hoisting device that installing plate moves up and down; This laser soldering device can be good at being useful in limited space or because of there being the heat-sensitive element can't Reflow Soldering or the occasion of wave-soldering; Improved welding quality; And, improved welding efficiency greatly through the welding of the automatic control of control system to soldered circuit board.
Description of drawings
Fig. 1 is the structural representation of the laser soldering device that provides of the utility model embodiment during not with safety guard.
Fig. 2 be the utility model embodiment provide laser soldering device band safety guard the time structural representation.
The specific embodiment
The utility model provides a kind of laser soldering device, for purpose, technical scheme and the effect that makes the utility model is clearer, clear and definite, below with reference to accompanying drawing and give an actual example to the utility model further explain.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
A kind of laser soldering device of the utility model; As shown in Figure 1, this laser soldering device comprises the plinth 10 that is arranged on the bottom, the jig 11 that on said base 10, is provided with; Wherein, Said jig 11 is provided with a combination rectilinear motion module, on said combination rectilinear motion module, is bolted with a square bearing plate 14, and the oscillation device 15 of a placement soldered circuit board is installed on said loading plate 14; On said jig 11, also be provided with a cylindrical stent 20; On said support 20, be vertically installed with an installing plate 30; On said installing plate 30, be separately installed with the laser condensing lens 31 that is used for the laser weld soldered circuit board and go out tin device 32, and send broken tin device 34 of tin and positioner 33; Be equipped with one in the upper end of said support 20 and be used to control the manual hoisting device 21 that installing plate 30 moves up and down.
Further; Said combination rectilinear motion module comprises setting up and down and orthogonal rectilinear motion module 13 and the following rectilinear motion module 12 gone up; Following rectilinear motion module 12 is fixed on the said jig 11, and last rectilinear motion module 13 is connected with said rectilinear motion module 12 chutes down
In the present embodiment device, be evenly distributed with the screwed hole of several said oscillation devices 15 that are used to be spirally connected on the said loading plate 14.Said loading plate 14 is connected with said rectilinear motion module 13 screws of going up; Its connected mode with last rectilinear motion module 13 and following rectilinear motion module 12 is identical, and go up rectilinear motion module 13 the motion on the said following rectilinear motion module 12 and said loading plate 14 on said motion on the rectilinear motion module 13 by motor-driven.
Further; In order when welding soldered circuit board, to improve scolding tin infiltration and wetting extended capability downwards, improve the welding quality of product, the mode of this oscillation device employing electromagnetic viscosimeter; Through electromagnet and iron core are set in oscillation device 15; The energising back produces electromagnetic viscosimeter, makes constantly slightly vibration of soldered circuit board, improves welding quality.
Owing to adopt laser weld; The laser that laser condensing lens sends during welding has certain focal length, and the excessive laser energy that causes easily of focal length is not enough, and welding quality descends; And the too small laser spots that causes easily of focal length is excessive; Laser energy is too high, soldered circuit board or components and parts beyond the soldered circuit board pad is caused burn, so the distance of the relative soldered circuit board of laser condensing lens must be adjustable; Therefore the runner of the band handle that is used for hand rotation is installed on manual hoisting device 21, and on said support 20, is carved with the scale (not shown).Through the hand rotation runner, installing plate 30 is moved up and down, and then drive laser condensing lens 31 and move up and down, make laser spot size moderate.Simultaneously, can also be according to the scale on the support 20, note laser spot size installing plate 30 position on scale when moderate, regulate after convenient.
Further; On the said top of the broken tin device 34 of tin of sending the fixed axis 341 that is used to place scolding tin is installed; And be provided with at the said side that send the broken tin device 34 of tin and rotate a circular saw teeth cutter blade 343 that drives through motor and take turns 343 with a rolling friction; Be used for going out tin device 32 and carrying solder sticks to said, the spacing of circular saw teeth cutter blade 343 and rolling friction wheel 342 is less than the diameter of solder stick.And owing to the reason of circular saw teeth cutter blade; Can output little pin hole one by one on the solder stick; Push away the residual air in the solder stick, after sending the broken tin device of tin to provide tin device conveying solder stick, solder stick is met the problem that heat is difficult for producing quick-fried tin and tin sweat(ing).
Preferably, said positioner 33 is provided with the shooting head, through said camera each bond pad locations of soldered circuit board is gathered contrast and correction.When revising; At first on soldered circuit board, choose at least two reference points; Camera through camera positioning system obtains this two reference points; And then through control system's control combination rectilinear motion module and loading plate the welding circuit Board position is finely tuned, each pad and each weld locations in the control system on the soldered circuit board are complementary.
Preferably, for the ease of moving of this laser soldering device, be respectively arranged with a rolling castor 40 and level adjuster cup 41 in four bottom of said base 10.Simultaneously; This laser soldering device is controlled by the control system automatically, comprises laser condensing lens 31 and the welding that goes out tin device 32, makes up moving of rectilinear motion module and loading plate 14; Send the tin of the broken tin device 34 of tin, and the correction of 33 pairs of welding circuit Board positions of camera positioning system or the like.
Further,, a fixed cover 30 is installed also on the installing plate of present embodiment for to being installed in the laser condensing lens 31 and the safety that goes out tin device welding 32 on the installing plate 30, as shown in Figure 2.
The control system that the utility model uses is that special software is realized; This software carries out programme-control according to each position component relation and the welding step of this laser soldering device; System controls welding process in real time through control; Can effectively practice thrift human cost, be convenient to commercial Application.
The concrete operation principle of the machine-operated soft soldering apparatus that the utility model provided is: at first circuit board to be welded is fixed on the oscillation device, starting drive also imports the electronic chart of the pad of soldered circuit board in the control system, regulates manual hoisting device; The focus of laser head is just dropped on the soldered circuit board, and the control system locatees soldered circuit board through the camera positioner and revises, and the hot spot that makes laser is over against pad; Send the broken tin device of tin to carry solder stick for going out the tin device, the laser action that laser head sends is to the pad of circuit board pad, and solder stick is met heat and melted; Be welded on the pad; Motor-driven combination rectilinear motion module moves soldered circuit board afterwards, with the laser head hot spot over against next pad; And the like, accomplish welding to whole soldered circuit board.
The laser soldering device that the utility model provided; Owing to adopted the base and the jig that are arranged on the bottom; Said jig is provided with a combination rectilinear motion module; On said combination rectilinear motion module, be bolted with a square bearing plate, the oscillation device of a placement soldered circuit board is installed on said loading plate; On said jig, also be provided with a support; On said support, be vertically installed with an installing plate; On said installing plate, be separately installed with the laser condensing lens that is used for the laser weld soldered circuit board and go out the tin device, and send broken tin device of tin and camera positioner; Be equipped with one in the upper end of said support and be used to control the manual hoisting device that installing plate moves up and down; This laser soldering device can be good at being useful in limited space or because of there being the heat-sensitive element can't Reflow Soldering or the occasion of wave-soldering; Improved welding quality; And, improved welding efficiency greatly through the welding of the automatic control of control system to soldered circuit board.
Should be understood that; The application of the utility model is not limited to above-mentioned giving an example; Concerning those of ordinary skills, can improve or conversion according to above-mentioned explanation, all these improvement and conversion all should belong to the protection domain of the utility model accompanying claims.
Claims (10)
1. laser soldering device; Comprise a base (10); Go up the jig (11) that is provided with at said base (10), it is characterized in that, said jig (11) is provided with a combination rectilinear motion module; On said combination rectilinear motion module, be bolted with a square bearing plate (14), the oscillation device (15) of a placement soldered circuit board is installed on said loading plate (14); On said jig (11), also be provided with a support (20); On said support (20), be vertically installed with an installing plate (30); On said installing plate (30), be separately installed with the laser condensing lens (31) that is used for the laser weld soldered circuit board and go out tin device (32), and send broken tin device (34) of tin and positioner (33); Be equipped with one in the upper end of said support (20) and be used to control the manual hoisting device (21) that installing plate moves up and down.
2. laser soldering device according to claim 1; It is characterized in that; Said combination rectilinear motion module comprises setting up and down and orthogonal rectilinear motion module (13) and the following rectilinear motion module (12) gone up; Said rectilinear motion module (12) down is fixed on the said jig (11), and the said rectilinear motion module (13) of going up is connected with said rectilinear motion module (12) chute down.
3. laser soldering device according to claim 1 is characterized in that, is evenly distributed with the screwed hole of several said oscillation devices that are used to be spirally connected on the said loading plate.
4. laser soldering device according to claim 3 is characterized in that, said loading plate is connected with the said rectilinear motion module screw of going up.
5. laser soldering device according to claim 1 is characterized in that, said go up the rectilinear motion module at the rectilinear motion of the rectilinear motion on the said rectilinear motion module down and said loading plate rectilinear motion module on said by motor-driven.
6. laser soldering device according to claim 1 is characterized in that, is provided with the electromagnetic viscosimeter structure in the said oscillation device.
7. laser soldering device according to claim 1 is characterized in that, said manual hoisting device is equipped with the runner of the band handle that is used for hand rotation, and on said support, is carved with scale.
8. laser soldering device according to claim 1; It is characterized in that; The said top of the broken tin device of tin of sending is equipped with the fixed axis that is used to place scolding tin; And be provided with through motor rotating band trend is said at the said side that gives the broken tin device of tin and go out a circular saw teeth cutter blade and the rolling friction wheel that the tin device is carried solder stick, the spacing of said circular saw teeth cutter blade and said rolling friction wheel is less than the diameter of solder stick.
9. laser soldering device according to claim 1 is characterized in that said positioner is provided with camera, through said camera soldered circuit board is carried out position correction.
10. laser soldering device according to claim 1 is characterized in that, four bottom of said base are respectively arranged with a rolling castor and level adjuster cup.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200628318U CN202555932U (en) | 2012-02-24 | 2012-02-24 | Laser soft soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200628318U CN202555932U (en) | 2012-02-24 | 2012-02-24 | Laser soft soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202555932U true CN202555932U (en) | 2012-11-28 |
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ID=47205632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200628318U Expired - Fee Related CN202555932U (en) | 2012-02-24 | 2012-02-24 | Laser soft soldering device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202555932U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103008817A (en) * | 2012-12-03 | 2013-04-03 | 深圳深蓝精机有限公司 | Automatic soldering machine |
| WO2014194475A1 (en) * | 2013-06-04 | 2014-12-11 | Luo Yi | Solder-piercing feed wheel |
| CN108237282A (en) * | 2018-01-30 | 2018-07-03 | 深圳市牧激科技有限公司 | Laser sealing-off all-in-one machine and its processing method |
| CN108581110A (en) * | 2018-05-09 | 2018-09-28 | 上海航天设备制造总厂有限公司 | Prepare the circuit assembly welding method of high pressure welding point |
| CN112828462A (en) * | 2019-11-22 | 2021-05-25 | 中国电子科技集团公司第四十八研究所 | Laser welding equipment for packaging electronic device |
| CN114589366A (en) * | 2022-03-04 | 2022-06-07 | 左超 | Automatic laser welding equipment |
| CN114786361A (en) * | 2022-05-10 | 2022-07-22 | 东莞市德镌精密设备有限公司 | Reflow soldering device |
-
2012
- 2012-02-24 CN CN2012200628318U patent/CN202555932U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103008817A (en) * | 2012-12-03 | 2013-04-03 | 深圳深蓝精机有限公司 | Automatic soldering machine |
| CN103008817B (en) * | 2012-12-03 | 2015-06-10 | 深圳深蓝精机有限公司 | Automatic soldering machine |
| WO2014194475A1 (en) * | 2013-06-04 | 2014-12-11 | Luo Yi | Solder-piercing feed wheel |
| CN108237282A (en) * | 2018-01-30 | 2018-07-03 | 深圳市牧激科技有限公司 | Laser sealing-off all-in-one machine and its processing method |
| CN108581110A (en) * | 2018-05-09 | 2018-09-28 | 上海航天设备制造总厂有限公司 | Prepare the circuit assembly welding method of high pressure welding point |
| CN112828462A (en) * | 2019-11-22 | 2021-05-25 | 中国电子科技集团公司第四十八研究所 | Laser welding equipment for packaging electronic device |
| CN114589366A (en) * | 2022-03-04 | 2022-06-07 | 左超 | Automatic laser welding equipment |
| CN114786361A (en) * | 2022-05-10 | 2022-07-22 | 东莞市德镌精密设备有限公司 | Reflow soldering device |
| CN114786361B (en) * | 2022-05-10 | 2023-03-24 | 东莞市德镌精密设备有限公司 | Reflow soldering device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121128 Termination date: 20160224 |
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| CF01 | Termination of patent right due to non-payment of annual fee |