CN106270899B - The welding material laser soldering device and welding method of various material composition - Google Patents
The welding material laser soldering device and welding method of various material composition Download PDFInfo
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- CN106270899B CN106270899B CN201610864961.6A CN201610864961A CN106270899B CN 106270899 B CN106270899 B CN 106270899B CN 201610864961 A CN201610864961 A CN 201610864961A CN 106270899 B CN106270899 B CN 106270899B
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- laser
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- preheating
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/063—Solder feeding devices for wire feeding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
The present invention discloses the welding material laser soldering device of one kind of multiple material compositions, including laser, controller and temperature sensor, wherein temperature sensor acquires the preheating temperature of each pad in real time, controller control laser preheats each pad, and the laser of temperature field data model control output and temperature field data model characteristic matching is established according to preheating temperature.It is first preheated by laser elder generation butt welding point, while acquiring preheating weld point temperature, the laser irradiation for the temperature field data model control pad that the controller is established according to preheating weld point temperature.Due to acquiring weld point temperature in advance, and establish thermo parameters method data, it is welded when welding according to the temperature field of foundation, the error for avoiding the theoretical field of welding temperature established according only to characteristics such as material conducts heat, heat capacity ratios from occurring, lead to occur when actual welding phenomena such as pcb board burns, punctures, damaging electronics member device or welding quality there are flaws, improves the reliability of laser welding.
Description
Technical field
The present invention relates to the welding material laser weldings that technical field of laser welding more particularly to one kind of multiple materials form
Device and welding method.
Background technique
When existing laser welding electronic component, in order to guarantee welding quality, first pass through thermally conductive to various different materials
The characteristics such as performance, heat capacity ratio establish the simulation model of a field of welding temperature, control source, laser apparatus further according to the model data of simulation
Set carry out weld job.It is theoretically welded, can preferably be realized by the analog temperature field model that material property is established
To the automatic welding of different components, avoid the occurrence of that laser irradiation time is too long to be caused to burn, puncture pcb board or damage electronics member device
Part such as IC.But due to unlike material composition weldment in welding, the characteristics such as actual heating conduction, thermal capacitance and pass through mould
Proposed vertical models for temperature field there are biggish error, according to the analog temperature field model that material property is established control laser into
Row welding is also easier to occur that pcb board burns, punctures or damage electronics member device phenomenon or welding temperature is not achieved and wants
It asks, welding occurs there are flaw, welding quality does not reach requirement.
Summary of the invention
The invention mainly solves the technical problem of providing the welding material laser soldering devices of one kind of multiple materials composition
And welding method, the welding material laser soldering device of various material composition can be to avoid according to thermal conductivity of material, thermal capacitance
Than etc. characteristics establish field of welding temperature simulation model there are ground error, cause to occur being easy to appear pcb board when actual welding
Phenomena such as burning, puncture, damaging electronics member device or welding quality there are flaws, improves the reliability of laser welding quality.
In order to solve the above technical problem, the present invention provides the welding material Laser Welding tippings of one kind of multiple materials composition
It sets, it further includes controller that the welding material laser soldering device of various material composition, which includes laser, controls laser to every
A pad is preheated, the control laser output of welding device temperature at weld field model and temperature established according to preheating temperature
Spend the laser of field model characteristic matching；
Temperature sampler acquires the preheating temperature of each pad in real time.
It further says, the temperature sampler includes temperature sensor.
It further says, the temperature sensor includes infrared temperature sensor.
It further says, the laser soldering device further includes to temperature sensor collection point position and laser irradiating position
Synchronize the position adjusting mechanism of adjustment.
It further says, the position adjusting mechanism includes fixing seat and the pedestal with fixing seat rotation connection, solid
The driving part for being controlled by the controller and rotating fixing seat is equipped between reservation and pedestal, the fixing seat is equipped with to be connected with laser
The laser head connect and the temperature sensor bracket equipped with temperature sensor.
It further says, the position adjusting mechanism further includes the Song Xi mechanism set on fixing seat synchronizing moving, this send tin
Mechanism includes driving the tin silk driving part of each conveying capacity of tin silk and sending tin head.
It further says, the driving part includes motor.
It further says, the Song Xi mechanism further includes the position biography that the tin silk position sent to welder is detected
Sensor.
The present invention also provides the welding material method for laser welding of one kind of multiple materials composition, for forming to various material
Welding device is welded, which includes,
Pad preheating, emits laser to each pad of device to be welded in advance, and butt welding contact is preheated；
The temperature field data model for establishing pad, acquires the preheating temperature of each pad, according to preheating temperature in real time
Establish the welding device temperature field data model being made of each pad preheating temperature；
Laser welding, the laser to be matched with temperature field data model according to the output of temperature field data model is to each welding
Point transmitting laser is welded, and controls laser according to the temperature at weld acquired in real time.
It further says, the preheating temperature and welding temperature are acquired by temperature sampler.
It further says, the temperature sampler acquisition includes temperature sensor.
It further says, the temperature sensor includes infrared temperature sensor.
It further says, pulse frequency, the pulse width of the welding laser are matched with the temperature characterisitic generated when preheating.
It further says, the method for laser welding further includes the welding temperature acquisition step of real-time acquisition temperature at weld
Suddenly.
It further says, the temperature sensor collection point and Laser Welding point are co-located.
The welding material laser soldering device of various material composition of the present invention, including laser, controller and temperature sensing
Device, wherein controller preheats each pad for controlling laser, is welded according to the welding device that preheating temperature is established
Contact temperature field model controls the laser of laser output and models for temperature field characteristic matching；Temperature sampler, acquisition is every in real time
The preheating temperature of a pad.Before laser welding, first the solder joint of each welding component is preheated by laser, and by
The temperature of solder joint when temperature sensor acquires preheating in real time.The controller is built according to each preheating weld point temperature of acquisition
Vertical temperature field data module controls laser to each welding spot welding irradiation time, frequency of laser etc..Due to preparatory
The thermo parameters method data for acquiring the temperature of bond pad locations and establishing, the temperature number of fields established according to preparatory acquire when welding
According to being welded, the theoretical welding temperature field model established according only to characteristics such as thermal conductivity of material, heat capacity ratios is avoided to there is ground
Error, leads to occur being easy to appear when actual welding that pcb board burns, punctures, damaging electronics member device or welding quality, there are flaws
Phenomena such as, improve the reliability of laser welding quality.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, and the attached drawing in describing is of the invention one
A little embodiments to those skilled in the art without creative efforts, can also be according to these
Attached drawing obtains other accompanying drawings.
Fig. 1 is laser soldering device embodiment electrical principle block diagram.
Fig. 2 is position adjusting mechanism example structure schematic diagram.
Fig. 3 is the welding material method for laser welding flow diagram of various material composition.
Below with reference to embodiment, and referring to attached drawing, the realization, the function and the advantages of the object of the present invention are made furtherly
It is bright.
Specific embodiment
In order to keep the purposes, technical schemes and advantages of invention clearer, below in conjunction with attached in the embodiment of the present invention
Figure, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is invention one
Section Example, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall within the protection scope of the present invention.
As shown in Figure 1, the present invention provides the welding material laser soldering device embodiment of one kind of multiple material compositions.
The welding material laser soldering device of various material composition includes: laser 1, controller 3 and temperature sampler
2, wherein the laser 1 is for generating welding laser and pre- thermal laser, the temperature sampler 2 for acquiring laser in real time
The real time temperature generated when 1 welding laser and preheating laser irradiation solder joint, the controller 3 are used for according to each solder joint of acquisition
Temperature when preheating establishes welding device temperature at weld field data model, in welding, according to the temperature field data model control
Laser output processed and the matched laser of temperature field data model.
Specifically, the temperature sampler 2 includes temperature sensor, the temperature sensor temperature acquisition point and laser are pre-
Hot spot is located at the same point, can determine the temperature accuracy of acquisition.The temperature sensor may include infrared temperature sensor,
Its temperature is determined by the infrared characteristic that the solder joint preheated generates, specific component can select existing product or technology.
The controller 3 controls laser 1 according to the temperature field data model of foundation and refers to the pulse issued to laser
Frequency, pulse width etc. are controlled, and are allowed to solder joint and can produce match with the temperature field data model.
Before laser welding, first the solder joint of each welding component is preheated by laser, and by temperature sensing
The temperature of solder joint when device acquires preheating in real time.The temperature that the controller is established according to each preheating weld point temperature of acquisition
Field data module controls laser to each welding spot welding irradiation time, frequency of laser etc..Due to acquiring weldering in advance
The temperature of point position and the thermo parameters method data established, when welding according to acquisition in advance and the temperature field data of foundation is welded
It connects, avoiding the theoretical welding temperature field model established according only to characteristics such as thermal conductivity of material, heat capacity ratios, there are ground errors, cause
Occur being easy to appear phenomena such as pcb board burns, punctures, damaging electronics member device or welding quality there are flaws when actual welding, mentions
The reliability of high laser welding quality.
When in the present embodiment, in order to guarantee that each solder joint is preheated and welded, temperature sensor 2 and preheating
Point and pad are always positioned at same position, which further includes to 2 collection point position of temperature sensor and laser
Irradiation position synchronizes the position adjusting mechanism of adjustment, as shown in Figure 2.The position adjusting mechanism includes: 42 He of fixing seat
With the pedestal 41 of the fixing seat 42 rotation connection, being equipped with to be controlled by the controller between fixing seat 41 and pedestal 42 turns fixing seat
Dynamic driving part 40, the driving part include motor, can be connect directly or by transmission parts or mechanism with pedestal 42,
Rotate it under the control of the controller, the fixing seat 41 is equipped with the laser head 44 connecting with laser and is equipped with temperature acquisition
The temperature sensor bracket of device.
In order to guarantee that tin silk can accurately be sent to pad in welding, the position adjusting mechanism further includes being set to fix
The Song Xi mechanism 43 of seat synchronizing moving, the Song Xi mechanism 43 include the tin silk driving part (attached drawing of the driving each conveying capacity of tin silk
Do not indicate) and send tin head 45.Butt welding contact is welded in the case where in order to avoid Wuxi silk occur, and the Song Xi mechanism is also wrapped
The position sensor (attached drawing does not indicate) detected to the tin silk position that welder is sent is included, when position sensor does not detect
When to tin silk, controller control laser stops working.
As shown in figure 3, the present invention also provides the welding material method for laser welding of one kind of multiple materials composition, the Laser Welding
The method of connecing includes,
S10 step, i.e. pad preheating, in advance to each pad of device to be welded emit laser, butt welding contact into
Row preheating；
S11 step establishes the temperature field data model of pad, acquires the preheating temperature of each pad in real time, build
The vertical welding assembly temperature field data model being made of each pad preheating temperature；
S12 step, i.e. laser welding are welded according to the characteristic of temperature field data model to each pad transmitting laser
It connects, and laser is controlled according to the welding temperature acquired in real time.
Specifically, that is, laser soldering device includes: laser 1, controller 3 and temperature using above-described embodiment structure
Collector 2, wherein the laser 1 is for generating welding laser and pre- thermal laser, the temperature sampler 2 for acquiring in real time
The real time temperature that laser 1 welds laser and generates when preheating laser irradiation solder joint, the controller 3 are used for each according to acquisition
The temperature when preheating of solder joint establishes welding device temperature at weld field data model, in welding, according to the temperature field data
The output of model cootrol laser and the matched laser of temperature field data model.
Specifically, the temperature sampler 2 includes temperature sensor, the temperature sensor temperature acquisition point and laser are pre-
Hot spot is located at the same point, can determine the temperature accuracy of acquisition.The temperature sensor may include infrared temperature sensor,
Its temperature is determined by the infrared characteristic that the solder joint preheated generates, specific component can select existing product or technology.
The controller 3 controls laser 1 according to the temperature field data model of foundation and refers to the pulse issued to laser
Frequency, pulse width etc. are controlled, and are allowed to solder joint and can produce match with the temperature field data model.
Before welding, it first controls laser 1 from controller 3 to be preheated to pad sending laser, while by temperature
Collector 2 acquires the pad preheating temperature in real time；The solder joint welded is needed to preheat to each using same method, and
Preheating temperature is acquired, controller is established temperature field data model when welding according to each weld point temperature of acquisition, welded
When connecing, by controller according to data such as pulse frequency, the pulse widths of the temperature field data model of foundation control laser, make to swash
The parameter of light device output is welded with establishing temperature field data model and match laser.Due to acquiring the temperature of bond pad locations in advance
Degree and the thermo parameters method data established, when welding according to acquisition in advance and the temperature field data of foundation is welded, avoid only
According to the theoretical welding temperature field model that the characteristics such as thermal conductivity of material, heat capacity ratio are established, there are ground errors, lead to actual welding
When there is being easy to appear phenomena such as pcb board burns, punctures, damaging electronics member device or welding quality there are flaws, improve Laser Welding
Connect the reliability of quality.
When in the present embodiment, in order to guarantee that each solder joint is preheated and welded, temperature sensor 2 and preheating
Point and pad are always positioned at same position, which further includes to 2 collection point position of temperature sensor and laser
Irradiation position synchronizes the position adjusting mechanism of adjustment, as shown in Figure 2.The position adjusting mechanism includes: 42 He of fixing seat
With the pedestal 41 of the fixing seat 42 rotation connection, being equipped with to be controlled by the controller between fixing seat 41 and pedestal 42 turns fixing seat
Dynamic driving part 40, the driving part include motor, can be connect directly or by transmission parts or mechanism with pedestal 42,
Rotate it under the control of the controller, the fixing seat 41 is equipped with the laser head 44 connecting with laser and is equipped with temperature acquisition
The temperature sensor bracket of device.
In order to guarantee that tin silk can accurately be sent to pad in welding, the position adjusting mechanism further includes being set to fix
The Song Xi mechanism 43 of seat synchronizing moving, the Song Xi mechanism 43 include the tin silk driving part (attached drawing of the driving each conveying capacity of tin silk
Do not indicate) and send tin head 45.Butt welding contact is welded in the case where in order to avoid Wuxi silk occur, and the Song Xi mechanism is also wrapped
The position sensor (attached drawing does not indicate) detected to the tin silk position that welder is sent is included, when position sensor does not detect
When to tin silk, controller control laser stops working.
In the present embodiment, the method for laser welding further includes the welding temperature acquisition step of real-time acquisition temperature at weld
Suddenly, i.e., avoid welding temperature is excessively high from burning out PCB in the temperature for welding while acquiring solder joint.
The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to the foregoing embodiments
Invention is explained in detail, those skilled in the art should understand that: it still can be to aforementioned each implementation
Technical solution documented by example is modified or equivalent replacement of some of the technical features, and these are modified or replace
It changes, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (9)
1. the welding material method for laser welding of various material composition is welded for forming welding device to various material,
The method for laser welding includes,
Pad preheating, emits laser to each pad of device to be welded in advance, and butt welding contact is preheated；
The temperature field data model for establishing pad, acquires the preheating temperature of each pad in real time, is established according to preheating temperature
The welding device temperature field data model being made of each pad preheating temperature；
Laser welding is sent out with the laser that temperature field data model matches to each pad according to the output of temperature field data model
It penetrates laser to be welded, and laser is controlled according to the temperature at weld acquired in real time.
2. the welding material method for laser welding of various material composition according to claim 1, it is characterised in that: described to swash
Photocoagulation method further includes the welding temperature acquisition step of real-time acquisition temperature at weld.
3. the welding material method for laser welding of various material composition according to claim 2, it is characterised in that: the temperature
It spends sensor collection point and Laser Welding point is co-located.
4. the Laser Welding of the welding material method for laser welding of various material composition according to claim 1 to 3
Connection device, the laser soldering device include laser, which is characterized in that further include,
Controller, control laser preheat each pad, the welding device pad temperature established according to preheating temperature
Spend the laser of field data model cootrol laser output and models for temperature field characteristic matching；
Temperature sampler, acquires the preheating temperature of each pad in real time, and the laser soldering device further includes to temperature sensing
Device collection point position and laser irradiating position synchronize the position adjusting mechanism of adjustment.
5. laser soldering device according to claim 4, it is characterised in that: the temperature sampler includes infrared temperature sensing
Device.
6. laser soldering device according to claim 4, it is characterised in that: the position adjusting mechanism include fixing seat and with
The pedestal of fixing seat rotation connection, is equipped with the driving portion for being controlled by the controller and rotating fixing seat between fixing seat and pedestal
Part, the fixing seat are equipped with the laser head connecting with laser and the temperature sensor bracket equipped with temperature sensor.
7. laser soldering device according to claim 6, it is characterised in that: the position adjusting mechanism further includes being set to admittedly
The Song Xi mechanism of reservation synchronizing moving, the Song Xi mechanism include driving the tin silk driving part of each conveying capacity of tin silk and sending tin
Head.
8. laser soldering device according to claim 7, it is characterised in that: the driving part includes motor.
9. laser soldering device according to claim 7, it is characterised in that: the Song Xi mechanism further includes to welder
The position sensor that the tin silk position sent is detected.
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| CN201610864961.6A CN106270899B (en) | 2016-09-28 | 2016-09-28 | The welding material laser soldering device and welding method of various material composition |
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| CN201610864961.6A CN106270899B (en) | 2016-09-28 | 2016-09-28 | The welding material laser soldering device and welding method of various material composition |
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| CN106270899B true CN106270899B (en) | 2019-05-10 |
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| CN108873985A (en) * | 2018-08-06 | 2018-11-23 | 武汉博联特科技有限公司 | A kind of temprature control method and system of laser soldering |
| CN111570963B (en) * | 2020-04-14 | 2022-09-02 | 深圳欣旺达智能科技有限公司 | Hot-press welding method and device, computer equipment and storage medium |
| CN112710490B (en) * | 2020-12-21 | 2022-11-11 | 歌尔光学科技有限公司 | Performance detection method for laser spraying welding machine |
| CN114850667A (en) * | 2021-02-05 | 2022-08-05 | 东莞市中麒光电技术有限公司 | Laser welding method and LED display module |
| CN114273762B (en) * | 2022-01-20 | 2023-11-14 | 成都熊谷加世电器有限公司 | Double-track welding system |
| CN114453745B (en) * | 2022-02-15 | 2024-01-26 | 佛山金洽智能装备有限公司 | Preheating laser with double-ring structure |
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| JP3147845B2 (en) * | 1998-02-13 | 2001-03-19 | 日本電気株式会社 | Chip part bonding apparatus and method |
| WO1999063588A1 (en) * | 1998-06-02 | 1999-12-09 | Siemens S.A. | Method for remelting solder layers |
| CN102352509B (en) * | 2011-11-17 | 2013-06-26 | 铜陵学院 | Method for preparing nano-thick ceramic coating by laser multilayer cladding |
| CN204373785U (en) * | 2015-01-14 | 2015-06-03 | 湖南科技大学 | Welding process temperature field of molten pool pick-up unit |
| CN104942431A (en) * | 2015-06-17 | 2015-09-30 | 王金 | Laser processing device and process for laser hot melt adhesive quick adhesion thereof |
| CN105758820B (en) * | 2016-02-29 | 2019-04-12 | 陕西理工学院 | A kind of test device and test method of material laser absorptivity |
| CN206662459U (en) * | 2016-09-28 | 2017-11-24 | 深圳市艾贝特电子科技有限公司 | The welding material laser soldering device of various material composition |
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