JP2020163403A - Thermal compression bonding apparatus and manufacturing method for electronic component - Google Patents

Abstract

To be able to detect whether or not a temperature of a tip part of a heater chip is in a proper temperature range.SOLUTION: A thermal compression bonding apparatus comprises: a heater chip that has a tip part that thermocompression-bonds a member to be compression-bonded and generates heat in response to supplied electric currents; a first temperature measuring instrument of a non-contact type that measures a temperature of the tip part of the heater chip; a second temperature measuring instrument of a contact-type that measures temperatures of parts other than the tip part of the heater chip; a temperature control part that controls the temperature of the tip part of the heater chip on the basis of the temperature measured by the first temperature measuring instrument or the temperatures measured by the second temperature measuring instrument; and a temperature determining part that determines whether or not temperature differences between the temperature measured by the temperature measuring instrument not used for controlling the temperature of the tip part by the temperature control part, of the first temperature measuring instrument and the second temperature measuring instrument or the temperature measured by the first temperature measuring instrument and the temperatures measured by the second temperature measuring instrument are in prescribed temperature ranges thereof.SELECTED DRAWING: Figure 5

Description

The present invention relates to a thermocompression bonding device and a method for manufacturing an electronic component.

A thermocompression bonding device that performs thermocompression bonding on a member to be bonded is known. For example, when thermocompression bonding is performed on a wire of a coil component, the amount of heat when joining by thermocompression bonding is large because the wire is thickened as the resistance of the coil component is lowered. In the thermocompression bonding device, the temperature of the heater chip is controlled to be the target temperature. For example, it is known that the temperature of a non-oxidizing heat-resistant seal attached to the surface of a heater chip is measured with an infrared radiation thermometer, and the temperature of the heater chip is feedback-controlled based on the result (for example, patent). Document 1). It is also known that the temperature of the heater chip is detected by a thermocouple. In this case, a method of suppressing the temperature of the heater chip from becoming high due to a defect of the thermocouple or the like is known (for example, Patent Documents 2 and 3).

Japanese Patent Application Laid-Open No. 8-13831 Japanese Patent Application Laid-Open No. 9-64118 JP-A-11-12146

When the temperature of the heater chip is feedback-controlled using a contact-type temperature measuring instrument, it is difficult to attach the contact-type temperature measuring instrument to the tip of the heater chip, which is a portion where thermocompression bonding is performed on the member to be crimped. Therefore, it is not possible to directly measure the temperature of the tip of the heater tip, and if an abnormality such as a crack occurs in the heater tip, it is checked whether the temperature of the tip of the heater tip is within the appropriate temperature range. Difficult to detect. For example, when thermocompression bonding is performed on a thick wire of a coil component, the heater tip tends to become hot due to the large amount of heat required, and if the temperature of the tip of the heater tip deviates from the appropriate temperature range, It may adversely affect the life of the heater tip and other parts.

By using a non-contact type temperature measuring instrument, the temperature of the tip of the heater chip can be directly measured. However, when the surface of the heater chip is oxidized, it is difficult to accurately measure the temperature of the tip of the heater chip, and it is necessary to detect whether the temperature of the tip of the heater chip is within an appropriate temperature range. Is difficult.

The present invention has been made in view of the above problems, and an object of the present invention is to enable detection of whether or not the temperature of the tip of the heater chip is within an appropriate temperature range.

The present invention includes a heater tip that has a tip that heat-bonds the member to be crimped and generates heat in response to a supply current, and a non-contact type first temperature measuring device that measures the temperature of the tip of the heater tip. Based on the contact-type second temperature measuring device that measures the temperature of a portion other than the tip of the heater chip, the temperature measured by the first temperature measuring device, or the temperature measured by the second temperature measuring device. A temperature control unit that controls the temperature of the tip of the heater chip, and one of the first temperature measuring instrument and the second temperature measuring instrument that is not used for temperature control of the tip by the temperature control unit. A temperature determination unit that determines whether or not the temperature difference between the temperature measured by the temperature measuring instrument or the temperature measured by the first temperature measuring instrument and the temperature measured by the second temperature measuring instrument is within the respective predetermined temperature ranges. It is a thermal pressure bonding device including.

In the above configuration, the temperature measured by the temperature measuring device of the first temperature measuring device and the second temperature measuring device, which is not used for temperature control of the tip portion by the temperature control unit. Alternatively, it is provided with an abnormality detection unit that detects as an abnormality when it is determined that the temperature difference between the temperature measured by the first temperature measuring instrument and the temperature measured by the second temperature measuring instrument is not within the respective predetermined temperature ranges. It can be configured.

In the above configuration, the abnormality detection unit may be configured to stop the operation of the thermocompression bonding device when an abnormality is detected.

In the above configuration, when the thermocompression bonding member is not thermocompression bonded, the temperature control unit controls the temperature of the tip portion of the heater chip based on the temperature measured by the second temperature measuring instrument. When thermocompression bonding is performed on the member to be pressure-bonded, the temperature of the tip portion of the heater chip can be controlled based on the temperature measured by the first temperature measuring instrument.

In the above configuration, the temperature control unit provides information on the current supplied to the heater chip during the past thermocompression bonding when the temperature control unit switches from when the thermocompression bonding member is not thermocompression bonded to when the thermocompression bonding is performed. It is possible to control the temperature of the tip portion of the heater chip based on the above.

In the above configuration, the temperature control unit controls the temperature measured by the second temperature measuring instrument to be the set temperature when the thermocompression bonding member is not thermocompression bonded, and sets the set temperature in the past. The temperature can be changed to the temperature measured by the second temperature measuring instrument when the thermocompression bonding is performed.

In the above configuration, the second temperature measuring instrument may be configured to measure the temperature of a portion where the temperature is lower than the tip portion of the heater chip.

The present invention is a method for manufacturing an electronic component, which comprises a step of thermocompression bonding the electronic component at the tip of the heater chip using the thermocompression bonding device described above.

According to the present invention, it is possible to detect whether or not the temperature of the tip of the heater tip is within an appropriate temperature range.

FIG. 1 is a diagram showing a thermocompression bonding apparatus according to Comparative Example 1. 2 (a) and 2 (b) are diagrams for explaining the problems that occur in the thermocompression bonding apparatus according to Comparative Example 1. FIG. 3 is a diagram showing a thermocompression bonding apparatus according to Comparative Example 2. 4 (a) and 4 (b) are diagrams for explaining the problems that occur in the thermocompression bonding apparatus according to Comparative Example 2. FIG. 5 is a diagram showing an example of a thermocompression bonding device according to the present invention. 6 (a) and 6 (b) are diagrams illustrating the effects of the present invention. FIG. 7 is a diagram showing a thermocompression bonding device according to the first embodiment of the present invention. 8 (a) and 8 (b) are diagrams showing a method of manufacturing an electronic component using the thermocompression bonding apparatus according to the first embodiment. FIG. 9 is a flowchart showing an example of control of the thermocompression bonding apparatus according to the first embodiment. FIG. 10 is a diagram illustrating temperature control in the first embodiment. FIG. 11 is a diagram showing a thermocompression bonding apparatus according to Comparative Example 3. FIG. 12 is a diagram showing temperature control in Comparative Example 3. FIG. 13 is a diagram showing a thermocompression bonding device according to a second embodiment of the present invention. FIG. 14 is a flowchart showing an example of control of the thermocompression bonding apparatus according to the second embodiment. FIG. 15 is a diagram illustrating temperature control in the second embodiment.

First, the problem that occurs when the temperature of the heater chip is measured by a contact type thermometer (hereinafter referred to as a contact type thermometer) and the temperature of the heater chip is feedback-controlled based on the measured temperature will be described. FIG. 1 is a diagram showing a thermocompression bonding device 100 according to Comparative Example 1. As shown in FIG. 1, the thermocompression bonding device 100 includes a heater tip 110, a contact thermometer 130, and a control unit 140. The heater tip 110 has a tip portion 112 that crimps the member to be crimped, and generates heat according to the supplied current. The contact type thermometer 130 is attached to a portion other than the tip portion 112 of the heater tip 110, and measures the temperature at a location other than the tip portion 112. The reason why the contact type thermometer 130 is not attached to the tip portion 112 of the heater tip 110 is that it is difficult to secure a space for attaching the contact type thermometer 130 to the tip portion 112. The control unit 140 feedback-controls the temperature of the heater tip 110 based on the temperature measured by the contact thermometer 130.

2 (a) and 2 (b) are diagrams for explaining the problems that occur in the thermocompression bonding device 100 according to Comparative Example 1. When the temperature of the heater tip 110 is feedback-controlled based on the temperature measured by the contact thermometer 130 as shown in FIG. 2A, the temperature measured by the contact thermometer 130 becomes substantially constant. However, as shown in FIG. 2B, cracks 114 may occur in the heater chip 110 due to repeated thermocompression bonding. In addition, the contact type thermometer 130 may break down. In such a case, as shown in FIG. 2A, even if the temperature measured by the contact thermometer 130 is kept constant, the temperature of the tip 112 of the heater tip 110 may change. Since the temperature measured by the contact thermometer 130 is maintained constant, it is difficult to detect whether or not the temperature of the tip 112 of the heater tip 110 deviates from the target temperature. If the temperature of the tip 112 of the heater tip 110 deviates from the target temperature, thermocompression bonding to the member to be bonded cannot be performed satisfactorily.

Next, the problem that occurs when the temperature of the heater chip is measured by a non-contact type thermometer (hereinafter referred to as a non-contact type thermometer) and the temperature of the heater chip is feedback-controlled based on this measured temperature will be explained. To do. FIG. 3 is a diagram showing a thermocompression bonding device 200 according to Comparative Example 2. As shown in FIG. 3, in the thermocompression bonding device 200, the contact type thermometer is not attached to the heater tip 110. Instead, a non-contact thermometer 120 that directly measures the temperature of the tip 112 of the heater tip 110 is provided. The control unit 140 feedback-controls the temperature of the heater tip 110 based on the temperature measured by the non-contact thermometer 120.

4 (a) and 4 (b) are diagrams for explaining the problems that occur in the thermocompression bonding apparatus 200 according to Comparative Example 2. When the temperature of the heater tip 110 is feedback-controlled based on the temperature measured by the non-contact thermometer 120 as shown in FIG. 4A, the temperature measured by the non-contact thermometer 120 becomes substantially constant. Since the non-contact thermometer 120 directly measures the temperature of the tip 112 of the heater tip 110, the temperature measured by the non-contact thermometer 120 and the temperature of the tip 112 of the heater tip 110 are substantially the same. .. However, as shown in FIG. 4B, since the heater tip 110 has a high temperature, an oxide film 116 is likely to be formed on the surface. When the oxide film 116 is formed on the surface of the tip 112 of the heater tip 110, the measured temperature of the non-contact thermometer 120 may be lower than the actual temperature of the tip 112. Therefore, as shown in FIG. 4A, even if the temperature measured by the non-contact thermometer 120 is kept constant, the temperature of the tip portion 112 of the heater tip 110 may become high. Since the temperature measured by the non-contact thermometer 120 is maintained constant, it is difficult to detect whether or not the temperature of the tip 112 of the heater tip 110 deviates from the target temperature. If the temperature of the tip 112 of the heater tip 110 deviates from the target temperature, thermocompression bonding to the member to be bonded cannot be performed satisfactorily.

FIG. 5 is a diagram showing an example of a thermocompression bonding device 1 according to the present invention. As shown in FIG. 1, the thermocompression bonding device 1 includes a heater tip 10, a non-contact thermometer 20, a contact thermometer 30, and a control unit 40. The heater tip 10 has a tip portion 12 that thermocompression-bonds the member to be crimped, and generates heat according to the supplied current. The non-contact thermometer 20 directly measures the temperature of the tip portion 12 of the heater chip 10. The contact type thermometer 30 is attached to a location other than the tip portion 12 of the heater tip 10 and measures the temperature at a location other than the tip portion 12. The reason why the contact type thermometer 30 is not attached to the tip portion 12 of the heater tip 10 is that it is difficult to secure a space for attaching the contact type thermometer 30 to the tip portion 12. The control unit 40 includes a signal regarding the temperature of the tip 12 of the heater chip 10 measured by the non-contact thermometer 20 and a signal regarding the temperature of a portion other than the tip 12 of the heater chip 10 measured by the contact thermometer 30. , Is entered. The control unit 40 functions as a temperature control unit 42 and a temperature determination unit 44.

The temperature control unit 42 controls the temperature of the tip portion 12 of the heater chip 10 based on the temperature measured by the non-contact thermometer 20 or the temperature measured by the contact thermometer 30. The temperature determination unit 44 determines the temperature measured by the temperature control unit 42 of the non-contact type thermometer 20 and the contact type thermometer 30 that is not used for temperature control of the tip portion 12 of the heater chip 10. It is determined whether or not the temperature is within the temperature range of, or whether or not the temperature difference between the temperature measured by the non-contact type thermometer 20 and the temperature measured by the contact type thermometer 30 is within the predetermined temperature range. ..

6 (a) and 6 (b) are diagrams illustrating the effects of the present invention. FIG. 6A shows feedback control of the temperature of the heater chip 10 based on the temperature measured by the contact thermometer 30, and FIG. 6B shows the temperature measured by the non-contact thermometer 20. This is a case where the temperature of the heater chip 10 is feedback-controlled.

When the temperature of the heater chip 10 is feedback-controlled based on the temperature measured by the contact thermometer 30 as shown in FIG. 6A, the temperature measured by the contact thermometer 30 is maintained substantially constant. When cracks occur in the heater tip 10 due to repeated thermocompression bonding, the temperature of the tip 12 of the heater tip 10 changes even if the temperature measured by the contact thermometer 30 is constant. However, in this case, the temperature measured by the non-contact thermometer 20 changes. Therefore, it is possible to detect whether or not the temperature of the tip portion 12 of the heater tip 10 is within an appropriate temperature range based on the measured temperature of the non-contact thermometer 20.

When the temperature of the heater tip 10 is feedback-controlled based on the temperature measured by the non-contact thermometer 20 as shown in FIG. 6B, the temperature measured by the non-contact thermometer 20 is maintained substantially constant. To. When an oxide film is formed on the surface of the heater chip 10, the temperature of the tip 12 of the heater chip 10 may change even if the temperature measured by the non-contact thermometer 20 is constant. However, in this case, the temperature measured by the contact thermometer 30 changes. Therefore, it is possible to detect whether or not the temperature of the tip portion 12 of the heater tip 10 is within an appropriate temperature range based on the measured temperature of the contact type thermometer 30.

Therefore, in the thermocompression bonding device 1 of the present invention, the temperature of the tip portion 12 of the heater chip 10 is controlled based on the temperature measured by the non-contact thermometer 20 or the temperature measured by the contact thermometer 30. Then, the temperature measured by the non-contact type thermometer 20 and the contact type thermometer 30, whichever of the contact type thermometer 30 is not used for temperature control of the tip portion 12 of the heater chip 10, or the non-contact type thermometer 20 It is determined whether or not the temperature difference between the measured temperature and the temperature measured by the contact thermometer 30 is within the respective predetermined temperature ranges. Thereby, it is possible to detect whether or not the temperature of the tip portion 12 of the heater chip 10 is within an appropriate temperature range. Therefore, thermocompression bonding to the member to be bonded can be performed satisfactorily.

Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. Components common to a plurality of drawings are designated by the same reference numerals throughout the plurality of drawings. It should be noted that each drawing is not always drawn to the correct scale for convenience of explanation.

[First Embodiment]
FIG. 7 is a diagram showing a thermocompression bonding device 2 according to the first embodiment of the present invention. As shown in FIG. 7, the thermocompression bonding device 2 includes a heater chip 10, a non-contact thermometer 20, a contact thermometer 30, a control unit 40, and a power supply 60. The heater tip 10 has a tip portion 12 that thermocompression-bonds the member to be crimped, and generates heat according to the current I supplied by the power supply 60. The heater tip 10 is made of, for example, molybdenum, titanium, stainless steel, or the like.

The non-contact thermometer 20 directly measures the temperature of the tip portion 12 of the heater chip 10. The non-contact thermometer 20 is, for example, a radiation thermometer and, for example, an infrared radiation thermometer, but other cases may be used. The contact type thermometer 30 is attached to a portion other than the tip portion 12 of the heater tip 10 and measures the temperature of the portion other than the tip portion 12. The reason why the contact type thermometer 30 is not attached to the tip portion 12 of the heater tip 10 is that it is difficult to secure a space for attaching the contact type thermometer 30 to the tip portion 12. The contact type thermometer 30 is, for example, a thermocouple, but other cases may be used.

The control unit 40 includes a signal regarding the temperature of the tip 12 of the heater chip 10 measured by the non-contact thermometer 20 and a signal regarding the temperature of a portion other than the tip 12 of the heater chip 10 measured by the contact thermometer 30. , Is entered. The control unit 40 functions as a temperature control unit 42, a temperature determination unit 44, and an abnormality detection unit 46 when a processor such as a CPU (Central Processing Unit) cooperates with the program. The control unit 40 may be a circuit specially designed. Further, the temperature control unit 42, the temperature determination unit 44, and the abnormality detection unit 46 may be realized by one circuit or may be realized by separate circuits.

When the thermocompression bonding member is not thermocompression bonded, the temperature control unit 42 feedback-controls the temperature of the tip portion 12 of the heater tip 10 based on the temperature measured by the contact thermometer 30. When thermocompression bonding is performed on the member to be pressure-bonded, the temperature of the tip portion 12 of the heater tip 10 is feedback-controlled based on the temperature measured by the non-contact thermometer 20. The temperature control unit 42 controls the temperature of the tip portion 12 of the heater chip 10 by controlling the power supply 60 to control the magnitude of the current supplied to the heater chip 10.

The temperature determination unit 44 is the temperature measured by the temperature control unit 42 of the non-contact type thermometer 20 and the contact type thermometer 30 that is not used for temperature control of the tip portion 12 of the heater chip 10. , It is determined whether or not the temperature difference between the temperature measured by the non-contact type thermometer 20 and the temperature measured by the contact type thermometer 30 is within each predetermined temperature range.

When the temperature determination unit 44 determines that the measured temperature or the temperature difference is not within the predetermined temperature range, the abnormality detection unit 46 detects that a temperature abnormality has occurred. When the abnormality detection unit 46 detects a temperature abnormality, the operation of the thermocompression bonding device 2 may be stopped and / or the worker may be notified by an alarm sound or the like that a temperature abnormality has occurred. ..

8 (a) and 8 (b) are diagrams showing a method of manufacturing an electronic component using the thermocompression bonding device 2 according to the first embodiment. As shown in FIG. 8A, when the thermocompression bonding member, for example, an electronic component such as a coil component, is not thermocompression bonded, the heater tip 10 is in an elevated position to support the electronic component. It is far from the table 80. In this case, since the tip 12 of the heater chip 10 is not in a position that can be measured by the non-contact thermometer 20, the temperature control unit 42 has the tip of the heater chip 10 based on the temperature measured by the contact thermometer 30. The temperature of the unit 12 is controlled.

As shown in FIG. 8B, when thermocompression bonding is performed on the electronic component 82, the electronic component 82 is placed on the support base 80, the heater chip 10 descends toward the support base 80, and the heater chip 10 Thermocompression bonding is performed on the electronic component 82 at the tip portion 12 of the above. In this case, since the tip 12 of the heater chip 10 is in a position where it can be measured by the non-contact thermometer 20, the temperature control unit 42 of the heater chip 10 is based on the temperature measured by the non-contact thermometer 20. The temperature of the tip portion 12 is controlled.

FIG. 9 is a flowchart showing an example of control of the thermocompression bonding device 2 according to the first embodiment. FIG. 10 is a diagram illustrating temperature control in the first embodiment. As shown in FIG. 9, when the thermocompression bonding device 2 is started, the thermocompression bonding is not performed until the temperature of the tip portion 12 of the heater chip 10 stabilizes. Therefore, the heater chip 10 is based on the temperature measured by the contact thermometer 30. The temperature of the tip portion 12 is controlled (step S10). As shown in FIG. 10, when the thermocompression bonding device 2 is started, the control unit 40 is supplied to the heater chip 10 by the power supply 60 so that the temperature measured by the contact thermometer 30 becomes a set temperature (for example, 400 ° C.). Control the current. Since the correlation between the temperature measured by the contact type thermometer 30 and the temperature of the tip portion 12 of the heater chip 10 is obtained in advance, the temperature measured by the contact type thermometer 30 can be controlled to the set temperature. The temperature of the tip portion 12 of the heater chip 10 can be controlled to a target temperature (for example, 700 ° C.).

Next, the control unit 40 determines whether or not thermocompression bonding has been started (step S12). Whether or not the thermocompression bonding has been started can be determined by, for example, whether or not the heater chip 10 has been lowered to a position where the thermocompression bonding is performed on the electronic component 82.

When the control unit 40 determines that thermocompression bonding has not been started (step S12: No), the control unit 40 returns to step S10. On the other hand, when the control unit 40 determines that thermocompression bonding has started (step S12: Yes), the control unit 40 controls the temperature of the tip portion 12 of the heater chip 10 based on the temperature measured by the non-contact thermometer 20 (step S12: Yes). S14). As shown in FIG. 10, the control unit 40 receives a current supplied from the power supply 60 to the heater chip 10 so that the temperature measured by the non-contact thermometer 20 becomes a set temperature (for example, 700 ° C.) when thermocompression bonding is executed. To control. Since the non-contact thermometer 20 directly measures the temperature of the tip 12 of the heater tip 10, the temperature measured by the non-contact thermometer 20 corresponds to the temperature of the tip 12 of the heater tip 10. Therefore, by controlling the temperature measured by the non-contact thermometer 20 to the set temperature (for example, 700 ° C.), the temperature of the tip portion 12 of the heater chip 10 can be controlled to the target temperature (for example, 700 ° C.). .. At the start of thermocompression bonding, the temperature of the tip 12 may drop when the tip 12 of the heater chip 10 touches the electronic component 82. In this case, the control unit 40 raises the current value supplied to the heater chip 10 by the power supply 60 so that the temperature measured by the non-contact thermometer 20 becomes the set temperature.

Next, in the control unit 40, the temperature measured by the contact type thermometer 30 or the temperature difference between the temperature measured by the non-contact type thermometer 20 and the temperature measured by the contact type thermometer 30 is different. It is determined whether or not the temperature is within the predetermined temperature range (step S16). In FIG. 10, the control unit 40 uses the peak value of the temperature measured by the contact type thermometer 30 and the peak value of the temperature measured by the non-contact type thermometer 20 to keep the temperature or the temperature difference within a predetermined temperature range. It is possible to judge whether or not it is in. As an example, the control unit 40 determines whether or not the peak value of the temperature measured by the contact type thermometer 30 is within the range of ± 20 ° C. of the set temperature, or the temperature measured by the non-contact type thermometer 20. It is determined whether or not the temperature difference between the peak value of the above temperature and the peak value of the temperature measured by the contact thermometer 30 is within ± 20 ° C. of the difference between the set temperatures.

In the control unit 40, the temperature measured by the contact type thermometer 30 or the temperature difference between the temperature measured by the non-contact type thermometer 20 and the temperature measured by the contact type thermometer 30 is the respective predetermined temperature. If it is determined that the temperature is not within the range (step S16: No), it is detected as a temperature abnormality (step S18). When the control unit 40 detects a temperature abnormality, for example, the operation of the thermocompression bonding device 2 is urgently stopped (step S20). At this time, the control unit 40 may notify the worker that a temperature abnormality has occurred by generating an alarm sound or the like.

On the other hand, in the control unit 40, the temperature measured by the contact type thermometer 30 or the temperature difference between the temperature measured by the non-contact type thermometer 20 and the temperature measured by the contact type thermometer 30 is different. When it is determined that the temperature is within the predetermined temperature range (step S16: Yes), it is determined whether or not the thermal crimping is completed (step S22). Whether or not the thermocompression bonding is completed can be determined by, for example, whether or not the heater tip 10 has risen to the initial position.

When the control unit 40 determines that the thermocompression bonding has not been completed (step S22: No), the control unit 40 returns to step S14. On the other hand, when the control unit 40 determines that the thermocompression bonding is completed (step S22: Yes), the control unit 40 determines whether or not the operator has instructed to stop the operation of the thermocompression bonding device 2 (step S24). If there is no instruction to stop the operation (step S24: No), the control unit 40 returns to step S10. As shown in FIG. 10, the temperature of the tip portion 12 may rise when the thermocompression bonding is completed and the tip portion 12 of the heater chip 10 is separated from the electronic component 82. In this case, in step S10, the control unit 40 reduces the current supplied to the heater chip 10 by the power supply 60 so that the temperature measured by the contact thermometer 30 becomes the set temperature (for example, 400 ° C.). On the other hand, when the operation stop instruction is given (step S24: Yes), the control unit 40 ends the process.

In the thermal crimping device 2, as shown in step S16 of FIG. 9, the temperature measured by the contact type thermometer 30 which is not used for temperature control of the tip portion 12 of the heater chip 10 or the temperature measured by the non-contact type thermometer 20 is measured. It is determined whether or not the temperature difference between the temperature measured and the temperature measured by the contact thermometer 30 is within the respective predetermined temperature ranges. Thereby, it is possible to detect whether or not the temperature of the tip portion 12 of the heater chip 10 is within an appropriate temperature range. Therefore, thermocompression bonding to the member to be bonded can be performed satisfactorily.

As shown in step S18 of FIG. 9, the temperature measured by the non-contact type thermometer 20 and the non-contact type thermometer 30, whichever of the contact type thermometer 30 is not used for temperature control of the tip portion 12 of the heater chip 10, is or non-contact. When the temperature difference between the temperature measured by the tactile thermometer 20 and the temperature measured by the contact thermometer 30 is not within the respective predetermined temperature ranges, it is preferable to detect it as an abnormality. When an abnormality is detected, it is preferable to stop the operation of the thermocompression bonding device 2 and / or notify the operator that the abnormality has occurred by an alarm sound or the like. As a result, it is possible to prevent the production of defective products in which thermocompression bonding to the member to be bonded is not performed well.

The contact type thermometer 30 preferably measures the temperature at a position lower than the tip portion 12 of the heater chip 10. As a result, the contact type thermometer 30 is prevented from becoming hot, and the life of the contact type thermometer 30 can be extended.

FIG. 11 is a diagram showing a thermocompression bonding device 300 according to Comparative Example 3. As shown in FIG. 11, the thermocompression bonding device 300 is not provided with a non-contact thermometer that measures the temperature of the tip portion 112 of the heater tip 110. The temperature control unit 142 is the tip portion of the heater tip 110 based on the temperature measured by the contact thermometer 130 regardless of whether the thermocompression bonding member is thermocompression bonded or thermocompression bonded. The temperature of 112 is feedback controlled. The temperature control unit 142 controls the temperature of the tip portion 112 of the heater chip 110 by controlling the current supplied to the heater chip 110 by the power supply 160.

FIG. 12 is a diagram showing temperature control in Comparative Example 3. As shown in FIG. 12, the temperature of the tip 112 of the heater tip 110 may drop at the start of thermocompression bonding. The control unit 140 controls the temperature of the tip portion 112 of the heater tip 110 based on the temperature measured by the contact thermometer 130 regardless of whether the thermocompression bonding is performed or not. Since the contact type thermometer 130 measures the temperature at a location other than the tip 112 of the heater chip 110, it cannot detect that the temperature of the tip 112 of the heater chip 110 has dropped. Therefore, the thermocompression bonding is performed in a state where the temperature of the tip portion 112 of the heater chip 110 is lower than the target temperature (for example, 700 ° C.), and the thermocompression bonding may not be performed well.

On the other hand, in the thermocompression bonding device 2, when the electronic component 82 is not thermocompression bonded as in step S10 of FIG. 9, the temperature of the heater chip 10 is adjusted based on the temperature measured by the contact thermometer 30. Control. When thermocompression bonding is performed on the electronic component 82 as in step S14 of FIG. 9, the temperature of the heater chip 10 is controlled based on the temperature measured by the non-contact thermometer 20. As a result, the temperature of the tip portion 12 of the heater tip 10 at the time of thermocompression bonding can be kept within an appropriate temperature range, and thermocompression bonding can be performed satisfactorily.

In the first embodiment, the magnitude of the current may be controlled with respect to the power supply 60 so that the temperature measured by the non-contact thermometer 20 and the contact thermometer 30 becomes the set temperature. , The magnitude of the voltage may be controlled, or the current supply time may be controlled.

[Second Embodiment]
FIG. 13 is a diagram showing a thermocompression bonding device 3 according to a second embodiment of the present invention. As shown in FIG. 13, the thermocompression bonding device 3 further includes a storage unit 70 as compared with the thermocompression bonding device 2 of the first embodiment. The storage unit 70 is a non-volatile memory such as an HDD (Hard Disk Drive) or a flash memory. The storage unit 70 stores information (for example, current value, voltage value, current supply time, etc.) regarding the current supplied to the heater chip 10 during thermocompression bonding. For example, when the control unit 40 outputs information about the current supplied to the heater chip 10 to the power supply 60, it is also output to the storage unit 70, so that the storage unit 70 outputs the current supplied to the heater chip 10 during thermocompression bonding. Memorize information about. The information regarding the current supplied to the heater chip 10 stored in the storage unit 70 is updated at any time, and as a result, the storage unit 70 stores information regarding the current supplied to the heater chip 10 during the latest thermocompression bonding. That is, the storage unit 70 stores information regarding the current supplied to the heater chip 10 at the time of the previous thermocompression bonding.

Further, the storage unit 70 stores the temperature measured by the contact thermometer 30 at the time of performing thermocompression bonding. For example, the control unit 40 outputs the temperature measured by the contact thermometer 30 during thermocompression bonding to the storage unit 70, so that the storage unit 70 stores the temperature measured by the contact thermometer 30 during thermocompression bonding. The temperature measured by the contact thermometer 30 stored in the storage unit 70 is updated at any time, and as a result, the temperature measured by the contact thermometer 30 at the time of the latest thermocompression bonding is stored in the storage unit 70. That is, the storage unit 70 stores the temperature measured by the contact thermometer 30 at the time of the previous thermocompression bonding.

The control unit 40 functions as a temperature change unit 48 in addition to the temperature control unit 42, the temperature determination unit 44, and the abnormality detection unit 46. The temperature control unit 42, the temperature determination unit 44, the abnormality detection unit 46, and the temperature change unit 48 may be realized by one circuit or may be realized by separate circuits. The temperature control unit 42 performs the following control in addition to feedback-controlling the temperature of the tip portion 12 of the heater chip 10 described in the first embodiment. The temperature control unit 42 supplied the heater chip 10 stored in the storage unit 70 during the past thermocompression bonding when switching from the time when the thermocompression bonding was not performed to the time when the thermocompression bonding was performed. The temperature of the tip portion 12 of the heater chip 10 is controlled based on the information regarding the current. The temperature control unit 42 controls so that the temperature measured by the contact thermometer 30 becomes the set temperature when thermal crimping is not performed, and the temperature change unit 48 stores this set temperature in the storage unit 70. The temperature is changed to the temperature measured by the contact thermometer 30 during the past thermal crimping. Since the other configurations of the thermocompression bonding device 3 are the same as those of the thermocompression bonding device 2, the description thereof will be omitted.

FIG. 14 is a flowchart showing an example of control of the thermocompression bonding device 3 according to the second embodiment. FIG. 15 is a diagram illustrating temperature control in the second embodiment. As shown in FIG. 14, first, the control unit 40 executes steps S30 and S32. Since steps S30 and S32 are the same as steps S10 and S12 of FIG. 9 described in the first embodiment, the description thereof will be omitted.

Next, when the control unit 40 determines that the thermocompression bonding is started in step S32 (step S32: Yes), the information regarding the current supplied to the heater chip 10 during the past thermocompression bonding execution stored in the storage unit 70 is added. Based on this, the temperature of the tip portion 12 of the heater tip 10 is controlled (step S34). When the thermocompression bonding is started, the temperature of the tip portion 12 drops because the tip portion 12 of the heater chip 10 comes into contact with the electronic component 82. However, by executing step S34, the heater chip 10 is as shown in FIG. The temperature of the tip portion 12 of the above can be brought close to the target temperature (for example, 700 ° C.) at an early stage.

Next, the control unit 40 executes steps S36 to S46. Since steps S36 to S46 are the same as steps S14 to S24 of FIG. 9 of the first embodiment, the description thereof will be omitted. When the control unit 40 determines in step S46 that there is no instruction to stop the operation (step S46: No), the control unit 40 stores in the storage unit 70 the set temperature of the temperature measured by the contact thermometer 30 when the thermocompression bonding is not executed. The temperature is changed to the temperature measured by the contact thermometer 30 during the past thermocompression bonding (step S48). That is, as shown in FIG. 15, the set temperature of the temperature measured by the contact thermometer 30 when the thermocompression bonding is not executed is changed from the set temperature 1 to the set temperature 2. As a result, the temperature of the tip portion 12 of the heater chip 10 can be brought closer to the target temperature while suppressing the fluctuation range of the current value supplied by the heater chip 10 at the next thermocompression bonding execution. The control unit 40 returns to step S10 after step S48.

According to the thermocompression bonding apparatus 3, information on the current supplied to the heater chip 10 during the past thermocompression bonding when switching from the time when the thermocompression bonding is not performed to the time when the thermocompression bonding is performed as shown in step S34 of FIG. The temperature of the tip portion 12 of the heater chip 10 is controlled based on the above. As a result, as shown in FIG. 15, the temperature of the tip portion 12 of the heater chip 10 can be brought close to the target temperature at an early stage. The information on the current supplied to the heater chip 10 during the past thermocompression bonding in order to bring the temperature of the tip 12 of the heater chip 10 to the target temperature at an early stage is related to the current supplied to the heater chip 10 during the previous thermocompression bonding. It is preferably information.

Further, according to the thermocompression bonding apparatus 3, as shown in step S48 of FIG. 14, the set temperature of the temperature measured by the contact thermometer 30 is set to the temperature measured by the contact thermometer 30 during the past thermocompression bonding. change. As a result, as shown in FIG. 15, it is possible to suppress fluctuations in parameters related to the current supplied to the heater chip 10 when switching between the time when thermocompression bonding is not executed and the time when thermocompression bonding is executed. In order to suppress fluctuations in parameters related to the current supplied to the heater chip 10, the temperature measured by the contact thermometer 30 during the past thermocompression bonding is the temperature measured by the contact thermometer 30 during the previous thermocompression bonding. Is preferable.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and modifications are made within the scope of the gist of the present invention described in the claims. It can be changed.

1, 2, 3 Thermal crimping device 10 Heater chip 12 Tip part 20 Non-contact type thermometer 30 Contact type thermometer 40 Control unit 42 Temperature control unit 44 Temperature judgment unit 46 Abnormality detection unit 48 Temperature change unit 60 Power supply 70 Storage unit 80 Support base 82 Electronic parts 100, 200, 300 Thermal crimping device 110 Heater chip 112 Tip part 114 Crack 116 Oxide film 120 Non-contact type thermometer 130 Contact type thermometer 140 Control unit 142 Temperature control unit 160 Power supply

Claims (8)

A heater tip that has a tip that thermocompression-bonds the member to be crimped and generates heat according to the supply current.
A non-contact type first temperature measuring instrument that measures the temperature of the tip of the heater tip,
A contact-type second temperature measuring instrument that measures the temperature of a portion other than the tip of the heater chip, and
A temperature control unit that controls the temperature of the tip of the heater chip based on the temperature measured by the first temperature measuring instrument or the temperature measured by the second temperature measuring instrument.
The temperature measured by the temperature measuring device of the first temperature measuring device and the second temperature measuring device, which is not used for temperature control of the tip portion by the temperature control unit, or measured by the first temperature measuring device. A thermal crimping device including a temperature determining unit for determining whether or not the temperature difference between the temperature measured and the temperature measured by the second temperature measuring device is within the respective predetermined temperature ranges. The temperature measured by the temperature measuring device of the first temperature measuring device and the second temperature measuring device, whichever is not used for temperature control of the tip portion by the temperature controlling unit, or the first temperature measuring device. Claim 1 is provided with an abnormality detection unit that detects an abnormality when it is determined that the temperature difference between the temperature measured by the temperature measuring instrument and the temperature measured by the second temperature measuring instrument is not within the respective predetermined temperature ranges. The thermal crimping device described. The thermocompression bonding device according to claim 2, wherein the abnormality detection unit stops the operation of the thermocompression bonding device when an abnormality is detected. When the thermocompression bonding member is not thermocompression bonded, the temperature control unit controls the temperature of the tip portion of the heater chip based on the temperature measured by the second temperature measuring instrument, and the pressure bonding member The thermocompression bonding according to any one of claims 1 to 3, wherein the temperature of the tip portion of the heater chip is controlled based on the temperature measured by the first temperature measuring instrument when the thermocompression bonding is performed. apparatus. The temperature control unit switches from the time when the thermocompression bonding member is not thermocompression bonded to the time when the thermocompression bonding is performed, and the heater is based on information on the current supplied to the heater chip during the past thermocompression bonding. The thermocompression bonding apparatus according to claim 4, wherein the temperature of the tip portion of the chip is controlled. The temperature control unit controls so that the temperature measured by the second temperature measuring instrument becomes the set temperature when the thermocompression bonding member is not thermocompression bonded.
The thermocompression bonding apparatus according to claim 4 or 5, further comprising a temperature changing unit that changes the set temperature to the temperature measured by the second temperature measuring instrument when the thermocompression bonding is performed in the past. The thermocompression bonding device according to any one of claims 1 to 6, wherein the second temperature measuring instrument measures the temperature of a portion of the heater chip whose temperature is lower than that of the tip portion. A method for manufacturing an electronic component, which comprises a step of thermocompression bonding the electronic component at the tip of the heater chip using the thermocompression bonding device according to any one of claims 1 to 7.

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